Display module and display device

Abstract

The embodiments of the present application provide a display module and a display device. The display module includes a display panel, a support, a flexible circuit board, and an adhesive tape. The support is located on one side of the display panel's backlight surface, and at least a portion of the flexible circuit board is located on a side of the support away from the display panel. The adhesive tape is located between the support and the flexible circuit board, and the adhesive tape is used to bond the flexible circuit board to the support. The adhesive tape includes a first adhesive tape and a second adhesive tape. The elastic modulus of the first adhesive tape is greater than the elastic modulus of the second adhesive tape, and along the thickness direction of the display module, the overlapping areas of the first adhesive tape and the second adhesive tape with the support are at least partially different. The embodiments of the present application divide the adhesive tape into at least two independent parts with different elastic moduli, which is beneficial for improving the adhesive tape's adaptability to uneven lamination pressure, allowing the first adhesive tape and the second adhesive tape to be pressed and infiltrated more fully, thereby improving the bonding reliability of the flexible circuit board to the support.

Description

Technical field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. [Background Technology]

[0002] In the manufacturing process of a display device, a flexible printed circuit (FPC) is generally fixed to a support member in the display device by means of adhesive tape.

[0003] However, in existing display devices, the adhesive tape used to fix the flexible circuit board cannot be fully pressed and soaked, which easily leads to poor adhesion, affecting the structural stability of the display device.

[0004] Application Contents

[0005] In view of this, embodiments of the present application provide a display module and a display device to solve the above problems.

[0006] In a first aspect, an embodiment of the present application provides a display module, comprising a display panel, a support, a flexible circuit board and an adhesive tape, wherein the support is located on one side of a backlight surface of the display panel, at least a portion of the flexible circuit board is located on a side of the support away from the display panel, the adhesive tape is located between the support and the flexible circuit board, and the adhesive tape is used to bond the flexible circuit board to the support; wherein the adhesive tape comprises a first adhesive tape and a second adhesive tape, the elastic modulus of the first adhesive tape is greater than the elastic modulus of the second adhesive tape, and along the thickness direction of the display module, the overlapping areas of the first adhesive tape and the second adhesive tape with the support are at least partially different.

[0007] In a second aspect, an embodiment of the present application provides a display device, comprising the display panel provided in the first aspect.

[0008] In an embodiment of the present application, the tape is provided to include a first tape and a second tape that can overlap with different areas of the support member, that is, the tape can be divided into at least two independent parts, and is no longer a whole. The flexible circuit board can be bonded to the support member through the first tape and the second tape respectively, which is conducive to the first tape and the second tape being pressed and soaked more fully respectively, reducing the areas of poor bonding in the first tape and the second tape, thereby reducing the problem of poor bonding areas easily causing the tape to fall off, and thereby improving the bonding reliability of the flexible circuit board and the support member.

[0009] In addition, by setting the elastic modulus of the first tape to be different from the elastic modulus of the second tape, the bonding position of the first tape and the second tape can be flexibly set according to the different bonding pressures borne by different areas of the flexible circuit board. For example, the area of ​​the flexible circuit board that is subjected to less bonding pressure is bonded to the support member through the second tape with a smaller elastic modulus, and the area of ​​the flexible circuit board that is subjected to greater bonding pressure is bonded to the support member through the first tape with a larger elastic modulus. This is conducive to further ensuring that both the first tape and the second tape can be fully pressed and infiltrated, thereby improving the bonding reliability between the flexible circuit board and the support member, and thereby improving the structural stability of the display module.

Brief Description of the Drawings

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 This is a structural diagram of a display module in the prior art;

[0012] Figure 2 for Figure 1 A schematic diagram of a tape fit;

[0013] Figure 3 A schematic structural diagram of a display module provided in an embodiment of the present application;

[0014] Figure 4 A schematic diagram of the bonding between an adhesive tape and a support member provided in an embodiment of the present application;

[0015] Figure 5 A schematic diagram of another embodiment of the present application showing the bonding of an adhesive tape and a support member;

[0016] Figure 6 A schematic diagram of another embodiment of the present application providing a bonding diagram of an adhesive tape and a support member;

[0017] Figure 7 A schematic diagram of a bonding process between a flexible circuit board and a support member provided in an embodiment of the present application;

[0018] Figure 8 A schematic diagram of another embodiment of the present application providing a bonding diagram of an adhesive tape and a support member;

[0019] Figure 9 A schematic diagram of another embodiment of the present application showing the bonding of an adhesive tape and a support member;

[0020] Figure 10A schematic diagram of another embodiment of the present application showing the bonding of an adhesive tape and a support member;

[0021] Figure 11 A schematic diagram of the bonding between a flexible circuit board and a support member provided in an embodiment of the present application;

[0022] Figure 12 A schematic diagram of another embodiment of the present application providing a bonding diagram of a flexible circuit board and a support member;

[0023] Figure 13 A schematic diagram of a display device provided in an embodiment of the present application. [Specific implementation method]

[0024] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0025] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0026] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0027] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0028] In the description of this specification, it is necessary to understand that the words "substantially", "approximately", "approximately", "about", "roughly", "generally" and the like described in the claims and embodiments of this application refer to what can be generally recognized within a reasonable process operation range or tolerance range, rather than an exact value.

[0029] It should be understood that although the terms "first," "second," and the like may be used in embodiments of the present application to describe adhesive tapes, adhesive blocks, grooves, portions, and the like, these adhesive tapes, adhesive blocks, grooves, portions, and the like should not be limited to these terms. These terms are merely used to distinguish adhesive tapes, adhesive blocks, grooves, portions, and the like from one another. For example, a first adhesive tape could also be referred to as a second adhesive tape, and similarly, a second adhesive tape could also be referred to as a first adhesive tape, without departing from the scope of the embodiments of the present application.

[0030] Figure 1 It is a structural diagram of a display module in the prior art. Figure 2 for Figure 1 A schematic diagram of the tape fitting.

[0031] In the existing display module 01 ', Figure 1 As shown, display module 01' includes a display panel 10', a support member 20', a flexible circuit board 30', and adhesive tape 40'. Display panel 10' comprises a first portion 11', a bent portion 12', and a second portion 13', which are sequentially connected. First portion 11' may include the display area of ​​display panel 10', and second portion 13' is located on the backlight side of first portion 11'.

[0032] That is, the second portion 13' of the display panel 10 can be bent to the backlight side of the first portion 11', thereby reducing the border width of the display panel 10', increasing the screen-to-body ratio of the display area, and thus achieving narrow-border display of the display panel 10'.

[0033] The support member 20 ′ is attached to the backlight side of the first portion 11 ′ to support the display panel 10 ′.

[0034] The flexible circuit board 30' is located on a side of the second portion 13' away from the first portion 11' and protrudes from the edge of the second portion 13'. The flexible circuit board 30' is adhered to the support 20' by an adhesive tape 40' to ensure the structural stability of the flexible circuit board 30'.

[0035] Combine Figure 2 As shown, the adhesive tape 40 ′ is integrally provided, with one side of the adhesive tape 40 ′ bonded to the support member 20 ′ and the other side of the adhesive tape 40 ′ bonded to the flexible circuit board 30 ′.

[0036] After research, the inventors of the present application discovered that in the existing display module 01', since the flexible circuit board 30' is provided with components such as resistors and capacitors, excessive pressure cannot be applied when the flexible circuit board 30' is bonded to the support member 20' via the tape 40'. In addition, the bonding pressure at different positions of the tape 40' is uneven. As a result, the tape 40' cannot be fully pressed and soaked, resulting in poor adhesion at some positions of the tape 40'.

[0037] In addition, the flexible circuit board 30' generates heat during operation, and the flexible circuit board 30' is usually arranged adjacent to the driver circuit board (driver IC). This causes the flexible circuit board 30' to be repeatedly heated and cooled, thereby further aggravating the poor adhesion of the tape 40'. The poorly adhered position in the tape 40' will cause the adjacent positions to have poor adhesion, which in turn easily causes the tape 40' to loosen and fall off, affecting the structural stability of the display module 01'.

[0038] The applicant in this case has provided a solution to the problems existing in the prior art through careful and in-depth research.

[0039] Figure 3 A schematic diagram of the structure of a display module provided in an embodiment of the present application is shown in FIG. Figure 4 A schematic diagram of the bonding between a fixing tape and a support member provided in an embodiment of the present application.

[0040] The embodiment of the present application provides a display module 01, such as Figure 3 As shown, the display module 01 includes a display panel 10, a support member 20, a flexible circuit board 30, and an adhesive tape 40. The display panel 10 may include a first portion 11, a bent portion 12, and a second portion 13, which are sequentially connected. The first portion 11 may include the display area of ​​the display panel 10. The second portion 13 is located on the backlight side of the first portion 11 and is connected to the flexible circuit board 30.

[0041] That is to say, the second part 13 of the display panel 10 can be bent to the backlight side of the first part 11, thereby reducing the border width of the display panel 10, increasing the screen-to-body ratio of the main display area, and thus realizing a narrow-border display of the display panel 10.

[0042] The support member 20 is located on one side of the backlight surface of the display panel 10 and is used to support the display panel 10. Specifically, the support member 20 can be attached to the backlight surface of the first portion 11.

[0043] Optionally, the support member 20 includes a metal material. Of course, the second portion 13 of the display panel 10 can also be fixed on the support member 20 to prevent the bent portion 12 of the display panel 10 from causing the second portion 13 to rebound.

[0044] The flexible circuit board 30 can be used to transmit display signals to the display panel 10 . At least a portion of the flexible circuit board 30 is located on a side of the support member 20 away from the display panel 10 .

[0045] Specifically, if Figure 3As shown, the flexible circuit board 30 can be located on a side of the support member 20 away from the first portion 11 of the display panel 10, that is, on a side of the support member 20 away from the light-emitting surface of the display panel 10. The flexible circuit board 30 can be bound to a side of the second portion 13 of the display panel 10 away from the first portion 11 and protrude from the second portion of the display panel 10.

[0046] The adhesive tape 40 is located between the support member 20 and the flexible circuit board 30 . The adhesive tape 40 is used to bond the flexible circuit board 30 to the support member 20 to stabilize the flexible circuit board 30 .

[0047] Among them, combined Figure 4 As shown, the adhesive tape 40 includes a first adhesive tape 41 and a second adhesive tape 42. The elastic modulus of the first adhesive tape 41 is greater than the elastic modulus of the second adhesive tape 42. Furthermore, along the thickness direction Z of the display module 01, the overlapping regions of the first adhesive tape 41 and the second adhesive tape 42 with the support member 20 are at least partially different. That is, along the thickness direction Z of the display module 01, the overlapping region of the first adhesive tape 41 and the support member 20 is at least partially different from the overlapping region of the second adhesive tape 42 with the support member 20.

[0048] Optionally, along the thickness direction Z of the display module 01 , the first tape 41 and the second tape 42 overlap with different areas of the support 20 , respectively, and the first tape 41 and the second tape 42 are adhered to different positions of the support 20 , respectively.

[0049] It can be understood that the smaller the elastic modulus of the tape, the smaller its hardness, so that the smaller the lamination pressure required for the tape to be fully wetted.

[0050] In the embodiment of the present application, the tape 40 is provided to include a first tape 41 and a second tape 42 that can overlap with different areas of the support member 20, that is, the tape 40 can be divided into at least two independent parts, and is no longer a whole. Then, the flexible circuit board 30 can be bonded to the support member 20 through the first tape 41 and the second tape 42 respectively, which is conducive to the first tape 41 and the second tape 42 being pressed and soaked more fully, reducing the areas of poor bonding in the first tape 41 and the second tape 42, thereby reducing the problem of the tape 40 easily falling off due to the poor bonding area, thereby improving the bonding reliability of the flexible circuit board 30 and the support member 20.

[0051] In addition, by setting the elastic modulus of the first tape 41 to be different from the elastic modulus of the second tape 42, the bonding position of the first tape 41 and the second tape 42 can be flexibly set according to the different bonding pressures borne by different areas of the flexible circuit board 30. For example, the area of ​​the flexible circuit board 30 that is subjected to less bonding pressure is bonded to the support member 20 through the second tape 42 with a smaller elastic modulus, and the area of ​​the flexible circuit board 30 that is subjected to greater bonding pressure is bonded to the support member 20 through the first tape 41 with a larger elastic modulus. This is conducive to further ensuring that both the first tape 41 and the second tape 42 can be fully pressed and infiltrated, thereby improving the bonding reliability of the flexible circuit board 30 and the support member 20, and further improving the structural stability of the display module 01.

[0052] Optionally, the viscosity of the first adhesive tape 41 is greater than that of the second adhesive tape 42. This helps to more firmly bond the area of ​​the flexible circuit board 30 that is subjected to greater bonding pressure to the support member 20 through the first adhesive tape 41, thereby further ensuring the bonding reliability of the flexible circuit board 30 and the support member 20.

[0053] Furthermore, if Figure 4 As shown, the first adhesive tape 41 surrounds at least a portion of the second adhesive tape 42 . The second adhesive tape 42 can be bonded to the middle area of ​​the flexible circuit board 30 , and the first adhesive tape 41 can be bonded to the edge area of ​​the flexible circuit board 30 .

[0054] Since the area of ​​the flexible circuit board 30 that is subjected to less bonding pressure (such as the component area) is usually located near the middle of the flexible circuit board 30, a second adhesive tape 42 with a smaller elastic modulus and easier compression is provided to be bonded to the middle area of ​​the flexible circuit board 30. This is beneficial for the second adhesive tape 42 bonded to the middle area of ​​the flexible circuit board 30 to be fully wetted, thereby enhancing the bonding effect of the middle area of ​​the flexible circuit board 30.

[0055] Moreover, the area close to the edge of the flexible circuit board 30 can usually withstand a greater bonding pressure. Setting a first adhesive tape 41 with a larger elastic modulus and greater viscosity to bond with the edge area of ​​the flexible circuit board 30 is beneficial for ensuring that the first adhesive tape 41 bonded to the edge area of ​​the flexible circuit board 30 can also be fully infiltrated, thereby enhancing the bonding effect of the edge area of ​​the flexible circuit board 30, and thereby improving the bonding reliability of the flexible circuit board 30 and the support member 20.

[0056] In the embodiment of the present application, the adhesive tape 40 may be a heat-conductive pressure-sensitive adhesive tape. Specifically, the adhesive tape 40 may include materials such as polyurethane, acrylate, and silicone.

[0057] Please continue to refer to Figure 3In one embodiment of the present application, the surface of the support member 20 facing the flexible circuit board 30 is the first surface 20A. The first surface 20A includes a first area 20A1 and a second area 20A2. The first area 20A1 is in contact with the adhesive tape 40, while the second area 20A2 is not in contact with the adhesive tape 40. That is, the area of ​​the first surface 20A in contact with the first adhesive tape 41 or the second adhesive tape 42 is the first area 20A1, and the area of ​​the first surface 20A not in contact with the first adhesive tape 41 or the second adhesive tape 42 is the second area 20A2.

[0058] The surface roughness of the first region 20A1 is greater than the surface roughness of the second region 20A2.

[0059] That is to say, the area of ​​the support member 20 for laminating the adhesive tape 40 can be set to a rough surface with relatively large roughness.

[0060] It will be appreciated that the greater the surface roughness, the less smooth the surface.

[0061] In an embodiment of the present application, the surface roughness of the first area 20A1 for attaching the tape 40 in the first surface 20A is set to be larger. When the tape 40 is bonded to the first area 20A1, the glue can be embedded in the surface with larger roughness, thereby increasing the bonding area between the tape 40 and the first area 20A1, which is beneficial to further increase the bonding reliability between the tape 40 and the first surface 20A, thereby helping to further increase the bonding reliability between the flexible circuit board 30 and the support member 20.

[0062] Optionally, the surface roughness of the first region 20A1 is R, 0 < R < 2 μm. Thus, setting the surface roughness of the first region 20A1 within a predetermined range can enhance the adhesion between the first region 20A1 and the tape 40 while preventing the surface roughness of the first region 20A1 from being too high, thereby preventing the tape 40 from adequately wetting the first region 20A1.

[0063] In one embodiment of this application, please continue to refer to Figure 3 The surface of the support member 20 facing the flexible circuit board 30 is the first surface 20A. The first surface 20A includes a first area 20A1 and a second area 20A2. The first area 20A1 is in contact with the adhesive tape 40, while the second area 20A2 is not in contact with the adhesive tape 40. Specifically, the area of ​​the first surface 20A in contact with the first and second adhesive tapes 41 and 42 is the first area 20A1, while the area of ​​the first surface 20A not in contact with the first and second adhesive tapes 41 and 42 is the second area 20A2.

[0064] The first area 20A1 is provided with a surface treatment agent, and the surface treatment agent is used to increase the bonding strength between the tape 40 and the first area 20A1.

[0065] Optionally, the surface treatment agent is a silane coupling agent. One group in the silane coupling agent can bind to the bonded skeleton material, and another group can bind to the adhesive, thereby forming a strong chemical bond at the bonding interface and further enhancing the bonding strength.

[0066] In the embodiment of the present application, the surface treatment agent can serve as a tackifier to increase the bonding strength between the tape 40 and the first area 20A1 , thereby increasing the bonding reliability between the tape 40 and the support member 20 .

[0067] Figure 5 A schematic diagram of the bonding of another tape and a support member provided in an embodiment of the present application.

[0068] In one embodiment of the present application, Figure 5 As shown, the support member 20 includes a plurality of groove structures 21 . The groove structures 21 are located on a side of the support member 20 facing the flexible circuit board 30 . The first adhesive tape 41 and the second adhesive tape 42 are both disposed in the groove structures 21 .

[0069] In the display module 01, the tape 40 is usually also subjected to tensile stress parallel to the plane where the support member 20 is located. In the embodiment of the present application, the first tape 41 and the second tape 42 are both arranged in the groove structure 21, which can reduce the risk of the above-mentioned tensile stress causing the first tape 41 and the second tape 42 to shift, thereby improving the bonding reliability of the first tape 41 and the second tape 42.

[0070] Optionally, the depth of the groove structure 21 in the thickness direction Z of the display module 01 is 10-50 μm. The depth of the first adhesive tape 41 filling the groove structure 21 can be 1 / 3 to 2 / 3 of the thickness of the first adhesive tape 41, and the depth of the second adhesive tape 42 filling the groove structure 21 can be 1 / 3 to 2 / 3 of the thickness of the second adhesive tape 42. This helps ensure that the tensile stress exerted on the first and second adhesive tapes 41, 42 does not cause displacement of the first and second adhesive tapes 41, 42, and helps maintain the bonding thickness of the first and second adhesive tapes 41, 42.

[0071] It should be noted that when the first adhesive tape 41 and the second adhesive tape 42 are disposed in the groove structure 21, the surface of the groove structure 21 in contact with the first adhesive tape 41 and the second adhesive tape 42 may be a rough, matte surface, or a surface treatment agent that can serve as a tackifier may be provided on the surface of the groove structure 21 in contact with the first adhesive tape 41 and the second adhesive tape 42. Of course, the surface of the groove structure 21 is the surface of the solid portion of the support member 20 in contact with the groove structure 21.

[0072] Figure 6 A schematic diagram of the bonding of another tape and a support member provided in an embodiment of the present application.

[0073] In one embodiment of the present application, Figure 6 As shown, the groove structure 21 includes a first groove 211 and a second groove 212. In the thickness direction Z of the display module 01, the depth of the first groove 211 is greater than the depth of the second groove 212. The first adhesive tape 41 is arranged in the first groove 211, and the second adhesive tape 42 is arranged in the second groove 212.

[0074] It can be understood that the deformation amount of the second adhesive tape 42 with a smaller elastic modulus when pressed and soaked is usually greater than the deformation amount of the first adhesive tape 41 with a larger elastic modulus when pressed and soaked.

[0075] In the embodiment of the present application, the first adhesive tape 41 with a larger elastic modulus is set in the first groove 211 with a larger depth, and the second adhesive tape 42 with a smaller elastic modulus is set in the second groove 212 with a smaller depth. When the first adhesive tape 41 and the second adhesive tape 42 are not compressed, it is beneficial to make the second adhesive tape 42 with a smaller elastic modulus closer to the flexible circuit board 30 relative to the first adhesive tape 41, so that when the flexible circuit board 30 is bonded to the adhesive tape 40, the flexible circuit board 30 will first compress the second adhesive tape 42 with a smaller elastic modulus, and then compress the first adhesive tape 41 with a larger elastic modulus, which is beneficial to ensure that the first adhesive tape 41 and the second adhesive tape 42 can be pressed and soaked more fully, thereby improving the bonding reliability of the flexible circuit board 30 and the support member 20.

[0076] Optionally, please continue to refer to Figure 6 The surface of the support member 20 facing the flexible circuit board 30 is the first surface 20A, and the height of the first adhesive tape 41 protruding from the first surface 20A is H1, where H1 refers to the height of the first adhesive tape 41 protruding from the first surface 20A, which is closest to the flexible circuit board 30; the height of the second adhesive tape 42 protruding from the first surface 20A is H2, where H2 refers to the height of the second adhesive tape 42 protruding from the first surface 20A, which is closest to the flexible circuit board 30; wherein 0<H2-H1<5μm.

[0077] In this way, the second tape 42 will not have a significant impact on the pressing of the flexible circuit board 30 and the first tape 41, which is conducive to ensuring that the second tape 42 is fully pressed and soaked while the first tape 41 can also be fully pressed and soaked, thereby helping to ensure the bonding effect between the first tape 41 and the second tape 42.

[0078] It should be noted that Figure 5 and Figure 6The first and second tapes 41, 42 are shown in an uncompressed state. Furthermore, the height of the first and second tapes 41, 42 protruding from the first surface 20A is less than 25 μm to prevent the flexible circuit board 30 from affecting the film layer on the light-emitting side of the support member 20 facing the display panel 10 when the flexible circuit board 30 is attached to the support member 20 via the first and second tapes 41, 42.

[0079] Figure 7 A schematic diagram of the bonding process of a flexible circuit board and a support member provided in an embodiment of the present application. Figure 7 The bonding process of the flexible circuit board 30 and the support member 20 will be described.

[0080] like Figure 7 As shown, the process of laminating the flexible circuit board 30 and the support member 20 includes:

[0081] Step S1: Provide a support 20, and place a first tape 41 and a second tape 42 on the support 20. Step S2: Align the flexible circuit board 30 with the support 20, with the first tape 41 and the second tape 42 corresponding to different areas of the flexible circuit board 30 respectively.

[0082] Step S3 : applying a bonding pressure to the flexible circuit board 30 so that the flexible circuit board 30 is bonded to the support member 20 through the first adhesive tape 41 and the second adhesive tape 42 .

[0083] In step S1, the first tape 41 and the second tape 42 are both located on the surface of the support member 20 facing the flexible circuit board 30. The first tape and the second tape 42 can be integrally formed with the support member 20 and supplied as a whole, or the first tape and the second tape 42 can be set on the surface of the support member 20 after the support member 20 is attached.

[0084] In step S2, the area of ​​the flexible circuit board 30 that is subjected to less bonding pressure can correspond to the second tape 42 with smaller hardness, and the area of ​​the flexible circuit board 30 that is subjected to greater bonding pressure can correspond to the first tape 41 with greater hardness, so as to ensure that after the flexible circuit board 30 is bonded to the support member 20, both the first tape 41 and the second tape 42 can be pressed and infiltrated relatively fully.

[0085] like Figure 7 As shown, in one embodiment of the present application, the second adhesive tape 42 is arranged in the groove structure 21. When the second adhesive tape 42 is not compressed, along the thickness direction Z of the display module 01, the projected area of ​​the groove structure 21 on the plane where the support member 20 is located is larger than the projected area of ​​the second adhesive tape 42 on the plane where the support member 20 is located, that is, when the second adhesive tape 42 is not compressed, there is still space in the groove structure 21 for the second adhesive tape 42 to extend.

[0086] When the second adhesive tape 42 is compressed, the volume of the second adhesive tape 42 filled in the groove structure 21 is greater than the volume of the second adhesive tape 42 filled in the groove structure 21 when the second adhesive tape 42 is not compressed.

[0087] Of course, if Figure 7 As shown, in the case where the first adhesive tape 41 is set in the groove structure 21, when the first adhesive tape 41 is not compressed, there is still space in the groove structure 21 for the first adhesive tape 41 to extend, and after the first adhesive tape 41 is compressed, the volume of the first adhesive tape 41 filled in the groove structure 21 is greater than the volume filled in the groove structure 21 when it is not compressed.

[0088] When the second adhesive tape 42 is compressed, the volume of the second adhesive tape 42 filled in the groove structure 21 is greater than the volume of the second adhesive tape 42 filled in the groove structure 21 when the second adhesive tape 42 is not compressed.

[0089] Optionally, along the thickness direction Z of the display module 01 , the projection shape of the groove structure 21 on the plane where the support member 20 is located is one of a circle, a square, and a cross.

[0090] In the embodiment of the present application, while ensuring that the second tape 42 fills a larger volume in the groove structure 21 , there is no need to increase the material of the second tape 42 , which is beneficial for improving the stability of the second tape 42 while reducing the cost of the display module 01 .

[0091] Figure 8 This is another schematic diagram of the bonding between the tape and the support member provided in an embodiment of the present application. Figure 9 This is another schematic diagram of the bonding between the tape and the support member provided in an embodiment of the present application. Figure 10 A schematic diagram of the bonding of another tape and a support member provided in an embodiment of the present application.

[0092] In one embodiment of the present application, respectively Figure 3 and Figures 8-10 As shown, the first adhesive tape 41 includes a plurality of first adhesive blocks 411, and along the thickness direction Z of the display module 01, at least some of the first adhesive blocks 411 have different overlapping areas with the support member 20, and / or, the second adhesive tape 42 includes a plurality of second adhesive blocks 421, and along the thickness direction Z of the display module 01, at least some of the second adhesive blocks 421 have different overlapping areas with the support member 20.

[0093] That is to say, in the display module 01, only the first adhesive tape 41 can be set to be composed of multiple independent first adhesive blocks 411, or only the second adhesive tape 42 can be set to be composed of multiple independent second adhesive blocks 421, or the first adhesive tape 41 can be set to be composed of multiple independent first adhesive blocks 411, and the second adhesive tape 42 can be set to be composed of multiple independent second adhesive blocks 421.

[0094] It should be noted that Figures 8-10 The example only illustrates that the first adhesive tape 41 includes a plurality of first adhesive blocks 411 , and the second adhesive tape 42 includes a plurality of second adhesive blocks 421 .

[0095] It is understandable that independent rubber blocks have better adaptability to fluctuating fitting pressure.

[0096] In the embodiment of the present application, the first adhesive tape 41 is provided to include a plurality of independent first adhesive blocks 411, and / or the second adhesive tape 42 includes a plurality of independent second adhesive blocks 421, which is equivalent to further dividing the adhesive tape 40 into a larger number of independent parts, which is beneficial to further improve the adaptability of the adhesive tape 40 to uneven bonding pressure, for example, further ensuring that the second adhesive tape 42 with a smaller elastic modulus can be bonded to the area of ​​the flexible circuit board 30 that is subjected to smaller bonding pressure, and / or, the first adhesive tape 41 with a larger elastic modulus can be bonded to the area of ​​the flexible circuit board 30 that is subjected to larger bonding pressure, thereby facilitating further reducing the poorly bonded area in the adhesive tape 40, and further facilitating further improving the bonding reliability between the flexible circuit board 30 and the support member 20.

[0097] Alternatively, as Figure 8 As shown, the first adhesive tape 41 includes a plurality of independent first adhesive blocks 411, and the second adhesive tape 42 includes a plurality of independent second adhesive blocks 421. The first adhesive blocks 411 surround at least a portion of the second adhesive blocks 421. This helps ensure that the middle portion of the flexible circuit board 30, which is subject to less lamination pressure, can also be bonded more tightly, thereby helping to ensure the reliability of the bonding between the flexible circuit board 30 and the support member 20.

[0098] Alternatively, as Figure 9 As shown, the first adhesive tape 41 includes a plurality of independent first adhesive blocks 411 , and the second adhesive tape 42 includes a plurality of independent second adhesive blocks 421 . In a direction N parallel to the plane of the support member 20 , the first adhesive blocks 411 and the second adhesive blocks 421 are alternately arranged.

[0099] Since the viscosity of the first adhesive tape 41 and the second adhesive tape 42 can be different, that is, the viscosity of the first adhesive block 411 and the second adhesive block 421 can be different, arranging the first adhesive block 411 and the second adhesive block 421 alternately can ensure that the viscosity of each position of the flexible circuit board 30 is equivalent, which is beneficial to ensuring the bonding effect at different positions of the flexible circuit board 30.

[0100] It should be noted that there can be multiple directions parallel to the plane where the support member 20 is located. Figure 9 The alternate arrangement of the first rubber blocks 411 and the second rubber blocks 421 in one direction N is merely illustrated.

[0101] In addition, if Figure 10As shown, the first adhesive block 411 and the second adhesive block 421 can also be arranged in a similar "rice" shape.

[0102] In some embodiments, the first adhesive block 411 and the second adhesive block 421 can be one of a square (regular square, rectangle) or a circle. The sizes of the first adhesive block 411 and the second adhesive block 421 can be adaptively set according to the size of the flexible circuit board 30.

[0103] Optionally, when the first adhesive block 411 and the second adhesive block 421 are square, the length of the first adhesive block 411 and the second adhesive block 421 is in the range of 10 - 50 mm, and the width is in the range of 1 - 10 mm. When the first adhesive block 411 and the second adhesive block 421 are circular, the diameter of the first adhesive block 411 and the second adhesive block 421 is in the range of 1 - 10 mm.

[0104] In some embodiments, there is a certain gap between two adjacent first adhesive blocks 411, between two adjacent second adhesive blocks 421, and between two adjacent first adhesive blocks 411 and second adhesive blocks 421. This gap can be 2 - 10 mm to ensure the independence of each first adhesive block 411 and second adhesive block 421.

[0105] In an embodiment of the present application, in the thickness direction Z of the display module 01, the orthographic projection area of the first tape 41 is S1, the orthographic projection area of the second tape 42 is S2, and the area where the flexible circuit board 30 can be adhered to the support member 20 is S3. Here, the area S3 where the flexible circuit board 30 can be adhered to the support member 20 refers to the area in the thickness direction Z of the display module 01 that can be directly adhered to the support member 20 in the overlapping part of the flexible circuit board 30 and the support member 20.

[0106] Among them, 0.5S3 < S1 + S2 < 0.8S3.

[0107] That is to say, the sum of the areas where the first tape 41 and the second tape 42 are adhered to the flexible circuit board 30 can account for 50% - 80% of the total adhesion area between the flexible circuit board 30 and the support member 20.

[0108] In the embodiments of the present application, while improving the adaptability of the first tape 41 and the second tape 42 to uneven adhesion pressure, setting the adhesion areas of the first tape 41 and the second tape 42 within a certain preset range can ensure that there is sufficient adhesion area between the flexible circuit board 30 and the support member 20, which is beneficial to further ensuring the adhesion stability between the flexible circuit board 30 and the support member 20.

[0109] Optionally, in the thickness direction Z of the display module 01 , the orthographic projection area of ​​the first adhesive tape 41 is S1, and the orthographic projection area of ​​the second adhesive tape 42 is S2, where S1>S2. That is, the bonding area between the first adhesive tape 41 and the flexible circuit board 30 is larger than the bonding area between the second adhesive tape 42 and the flexible circuit board 30.

[0110] From the above analysis, it can be seen that the viscosity of the first tape 41 can be greater than that of the second tape 42. Setting the first tape 41 with greater viscosity to have a larger bonding area with the flexible circuit board 30 is beneficial to further ensure the bonding effect between the flexible circuit board 30 and the support member 20.

[0111] Figure 11 A schematic diagram of the bonding of a flexible circuit board and a support member provided in an embodiment of the present application is shown. Figure 12 A schematic diagram of the bonding of another flexible circuit board and a support member provided in an embodiment of the present application.

[0112] In one embodiment of the present application, Figure 11 As shown, the flexible circuit board 30 includes a component area 31 , in which components 311 are arranged. Along the thickness direction Z of the display module 01 , the component area 31 at least partially overlaps with the second adhesive tape 42 .

[0113] That is, the component area 31 in the flexible circuit board 30 can be bonded to the support member 20 via the second adhesive tape 42 with a smaller elastic modulus.

[0114] It is understandable that, in order to avoid damage to components in the component area 31 , the bonding pressure that the component area 31 of the flexible circuit board 30 can withstand is generally relatively small.

[0115] In the embodiment of the present application, the bonding pressure required for the second adhesive tape 42 with a smaller elastic modulus to be fully pressed and soaked is smaller. Providing a component area 31 that is subjected to a smaller bonding pressure and is bonded to the second adhesive tape 42 with a smaller elastic modulus is beneficial for making the component area 31 in the flexible circuit board 30 also bonded more firmly, thereby further ensuring the bonding reliability of the flexible circuit board 30 and the support member 20.

[0116] In some other embodiments, such as Figure 12 As shown, the flexible circuit board 30 includes a component area 31. Along the thickness direction Z of the display module 01, the component area 31 does not overlap with either the first adhesive tape 41 or the second adhesive tape 42. This allows the pressing head to press the non-component area during the lamination process of the flexible circuit board 30, completing the lamination process. This ensures a reliable bond between the flexible circuit board 30 and the support member 20 while preventing damage to the components in the component area 31.

[0117] Figure 13A schematic diagram of a display device provided in an embodiment of the present application.

[0118] The embodiment of the present application provides a display device 02, such as Figure 13 As shown, the display device 02 includes the display module 01 provided in the above embodiment. The structure of the display module 01 and the arrangement of the adhesive tape 40 therein can be as follows: Figure 3-Figure 12 For example, the display device 02 provided in the embodiment of the present application can be an electronic device such as a mobile phone, a computer, a television, a car display, etc., and this application does not make any specific limitation.

[0119] In the display device 02, the tape 40 is provided to include a first tape 41 and a second tape 42 that can overlap with different areas of the support 20, that is, the tape 40 can be divided into at least two independent parts, and is no longer a whole. Then, the flexible circuit board 30 can be bonded to the support 20 through the first tape 41 and the second tape 42 respectively, which is conducive to the first tape 41 and the second tape 42 being pressed and soaked more fully, reducing the poorly bonded areas in the first tape 41 and the second tape 42, thereby reducing the problem that the poorly bonded areas easily cause the tape 40 to fall off, thereby improving the bonding reliability of the flexible circuit board 30 and the support 20.

[0120] In addition, by setting the elastic modulus of the first tape 41 to be different from the elastic modulus of the second tape 42, the bonding position of the first tape 41 and the second tape 42 can be flexibly set according to the different bonding pressures borne by different areas of the flexible circuit board 30. For example, the area of ​​the flexible circuit board 30 that is subjected to less bonding pressure is bonded to the support member 20 through the second tape 42 with a smaller elastic modulus, and the area of ​​the flexible circuit board 30 that is subjected to greater bonding pressure is bonded to the support member 20 through the first tape 41 with a larger elastic modulus. This is conducive to further ensuring that both the first tape 41 and the second tape 42 can be fully pressed and infiltrated, thereby improving the bonding reliability of the flexible circuit board 30 and the support member 20, and further improving the structural stability of the display module 01.

[0121] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display module, characterized in that: include: Display panel; A support member, located on one side of the backlight surface of the display panel; a flexible circuit board, at least a portion of which is located on a side of the support member away from the display panel; an adhesive tape, located between the support member and the flexible circuit board, and used to bond the flexible circuit board to the support member; The tape includes a first tape and a second tape, the elastic modulus of the first tape is greater than the elastic modulus of the second tape, and along the thickness direction of the display module, the overlapping areas of the first tape and the second tape with the support member are at least partially different.

2. The display module according to claim 1, wherein: The adhesiveness of the first adhesive tape is greater than that of the second adhesive tape.

3. The display module according to claim 1, wherein: The surface of the support member facing the flexible circuit board is a first surface, and the first surface includes a first area and a second area, the first area is in contact with the tape, and the second area is not in contact with the tape; The surface roughness of the first region is greater than the surface roughness of the second region.

4. The display module according to claim 3, wherein: The surface roughness of the first region is R, 0<R<2μm.

5. The display module according to claim 1, wherein: The surface of the support member facing the flexible circuit board is a first surface, and the first surface includes a first area and a second area, the first area is in contact with the tape, and the second area is not in contact with the tape; The first region is provided with a surface treatment agent, and the surface treatment agent is used to enhance the bonding strength between the adhesive tape and the first region.

6. The display module according to claim 1, wherein: The supporting member includes a plurality of groove structures, and the first adhesive tape and the second adhesive tape are both arranged in the groove structures.

7. The display module according to claim 6, wherein: The groove structure includes a first groove and a second groove. In the thickness direction of the display module, the depth of the first groove is greater than the depth of the second groove. The first adhesive tape is arranged in the first groove, and the second adhesive tape is arranged in the second groove.

8. The display module according to claim 7, wherein: The surface of the support member facing the flexible circuit board is a first surface. The height of the first tape protruding from the first surface is H1. The height of the second tape protruding from the first surface is H2. 0<H2-H1<5μm.

9. The display module according to claim 1, wherein: The first adhesive tape includes a plurality of first adhesive blocks, and along the thickness direction of the display module, at least some of the first adhesive blocks have different overlapping areas with the support member; and / or, the second adhesive tape includes a plurality of second adhesive blocks, and along the thickness direction of the display module, at least some of the second adhesive blocks have different overlapping areas with the support member.

10. The display module according to claim 9, wherein: In a direction parallel to the plane where the support member is located, the first rubber blocks and the second rubber blocks are arranged alternately.

11. The display module according to claim 1, wherein: In the thickness direction of the display module, the orthographic projection area of ​​the first adhesive tape is S1, the orthographic projection area of ​​the second adhesive tape is S2, and the bonding area between the flexible circuit board and the support member is S3; Among them, 0.5S3<S1+S2<0.8S3.

12. The display module according to claim 1, wherein: In the thickness direction of the display module, the orthographic projection area of ​​the first adhesive tape is S1, the orthographic projection area of ​​the second adhesive tape is S2, and S1>S2.

13. The display module according to claim 1, wherein: The flexible circuit board includes a component area, and along the thickness direction of the display module, the component area and the second adhesive tape at least partially overlap.

14. The display module according to claim 1, wherein: The flexible circuit board includes a component area, and along the thickness direction of the display module, the component area has no overlap with the first adhesive tape and the second adhesive tape.

15. The display module according to claim 1, wherein: The first tape surrounds at least a portion of the second tape.

16. A display device, characterized in that: The display device includes the display module according to any one of claims 1-15.

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