Heat dissipation structure and manufacturing method

Abstract

The invention discloses a heat dissipation structure and a manufacturing method. The heat dissipation structure comprises a base and a plurality of heat pipes. An injection port and a plurality of receiving grooves are respectively arranged on the upper and lower sides of the base. The injection port is arranged across the upper part of the receiving grooves to intersect and communicate with the receiving grooves. A solder layer is arranged between the heat pipe and the receiving groove and connected to the two. When manufacturing, the heat pipe is placed in the receiving groove of the base, and a mechanical processing is first performed to make one side of the heat pipe be pressed (rolled) flat and flush with the lower side of the base. Then, the solder is injected through the injection port so that the solder completely fills the gap between the heat pipe and the receiving groove. Then, the heat pipe and the base are placed together in the heating furnace for heating. After being taken out and cooled, the solder forms a solder layer that combines and fixes the base and the heat pipe and fills the gap between the two, thereby ensuring that the base and the heat pipe can be tightly fitted to avoid the occurrence of thermal resistance.

Description

Technical Field

[0001] The present invention relates to the field of radiators, and in particular to a heat dissipation structure and a manufacturing method. Background Art

[0002] In the field of heat dissipation, the current heat dissipation module is mostly composed of a base, heat pipes and fins. The combination of the base and the heat pipes should be coordinated with Figures 1A to 1D The base 91 has a top surface 911 and a bottom surface 912, and a plurality of parallel and juxtaposed receiving grooves 92 in the form of semi-circular arc surfaces for accommodating the heat pipes are arranged on the bottom surface, and the arc surface of the outer surface of the heat pipe 93 is in contact with the receiving groove 92, and a side of the heat pipe 93 is made flush with the bottom surface 912 of the base through a rolling process, so as to directly contact the heat source; and the conventional method of assembling the heat dissipation module (the base 91 and the heat pipe 93) is as follows: first, the bottom surface 912 of the base 91 with the receiving groove faces upward, and solder 94 (liquid solder paste) is sequentially applied in a segmented manner on the bottom (or recessed part) of the arc surface 921 of each receiving groove 92, and then each circular heat pipe 93 is placed in each receiving groove 92, and a rolling process is performed through a rolling device 96, and finally the aforementioned semi-processed objects (i.e., the base and the heat pipe) are placed as a whole in a heating furnace for heating and welding operations to fix the two together.

[0003] However, the conventional method of combining the heat dissipation module (the base 91 and the heat pipe 93) is a loose combination, so when the heat pipe 93 is assembled into the receiving groove 92, there is a gap 95 between the two, and the gap 95 will cause thermal resistance. In order to solve the thermal resistance problem caused by the gap 95 and ensure that the heat pipe 93 and the base 91 can be tightly combined, generally speaking, the industry sets solder paste on the inner surface of the receiving groove 92 by coating or dotting, and then places the heat pipe 93 in the receiving groove 92, and then pressurizes the heat pipe 93 by rolling, so that the heat pipe 93 is deformed by external force and the part of the structure is pressed into the receiving groove 92, and the flattened side of the heat pipe 93 is flush with the bottom surface 912 of the base, and finally, it is placed in a heating furnace for heating, so that the solder paste hardens after heating to bond the heat pipe 93 to the base 91.

[0004] However, the current structure and approach have many inconveniences and deficiencies, as follows:

[0005] 1. On the one hand, the main components of solder (liquid solder paste) are tin powder and flux, which are easy to dry and harden at normal temperature. The current practice is to add solder first and then roll the heat pipe, then assemble other parts, and finally perform the welding process together. However, this process takes a long time, and the solder often dries and hardens. When the solder dries, its fluidity is reduced and it cannot fill the gap between the heat pipe and the accommodating groove, which will lead to the occurrence of empty welding during subsequent welding, reducing the efficiency of heat conduction, such as Figure 1C and Figure 1D shown.

[0006] 2. On the other hand, with the current technological level, the size of the receiving groove and the circumference of the heat pipe are precisely matched first, so as to reduce the gap between the receiving groove and the heat pipe and reduce the amount of solder used. However, the solder mentioned above is fluid. After adding solder to the receiving groove and then placing the heat pipe into the receiving groove, the heat pipe will squeeze the solder to produce diffusion flow. However, this method cannot control the flow direction of the solder. Therefore, there will be a problem of uneven distribution of solder between the heat pipe and the receiving groove before welding, which will lead to empty soldering problems during subsequent welding.

[0007] 3. Furthermore, because the steps of first adding solder to the receiving groove and then placing the heat pipe for rolling are adopted, it often happens that the solder has dried and hardened before the heat pipe is rolled and combined. After the solder has dried and hardened, when the heat pipe is rolled and combined, the hardened solder will cause the outer wall of the heat pipe to deform, causing the outer wall of the heat pipe to collapse into the inside of the heat pipe, resulting in a reduction in the gas space inside the heat pipe or even squeezing the outer wall of the heat pipe to cause damage to the heat pipe, so that the overall heat transfer efficiency of the heat pipe is reduced or even disabled.

[0008] Therefore, how to solve the above problems and make improvements is the direction that the inventor of this case and related manufacturers engaged in this industry are eager to study and improve. Summary of the invention

[0009] To improve the above problems, the present invention provides a heat dissipation structure that can improve the defects of conventional heat pipes and bases, such as the inability of solder to completely fill the gap between the heat pipe and the base, or the solder drying and hardening, or uneven soldering resulting in empty soldering, which can cause thermal resistance.

[0010] In one embodiment of the heat dissipation structure of the present invention, the heat dissipation structure has a base and a plurality of heat pipes, the base has a bottom surface and a top surface, the bottom surface is provided with at least one receiving groove, the top surface has at least one injection port, the injection port is arranged across the top of each receiving groove and is connected thereto; a plurality of heat pipes are arranged in the receiving grooves of the base; and a solder layer is formed between the heat pipe and the receiving groove.

[0011] In a further embodiment of the heat dissipation structure of the present invention, one side of the base has a first direction, and the other side of the base has a second direction, and the first direction and the second direction are intersecting or perpendicular to each other.

[0012] In a further embodiment of the heat dissipation structure of the present invention, the accommodating groove is opened along a first direction of the base, and the injection port is opened along a second direction of the base.

[0013] In a further embodiment of the heat dissipation structure of the present invention, both ends of the plurality of heat pipes have an evaporation section and a condensation section, and the evaporation section of the heat pipe is disposed in the receiving groove of the base.

[0014] In a further embodiment of the heat dissipation structure of the present invention, the condensation sections of the plurality of heat pipes are combined with a fin group.

[0015] In a further embodiment of the heat dissipation structure of the present invention, a gap is provided between the heat pipe and the containing groove, and the solder layer is disposed in the gap to connect the two.

[0016] To achieve the above object, the present invention further provides a method for manufacturing a heat dissipation structure, comprising the following steps:

[0017] S01: a material preparation step, preparing a base and a plurality of heat pipes, wherein the top surface and the bottom surface of the base are respectively provided with at least one injection port and a plurality of receiving grooves that are connected to each other;

[0018] S02: Combining steps, placing a plurality of heat pipes into the receiving grooves of the base, and completely pressing the heat pipes into the receiving grooves through mechanical processing, and making the pressed side surface of the heat pipes flush with the bottom surface of the base;

[0019] S03: Injection step, by injecting solder into the injection port, and then placing the heat pipe and the base into a heating furnace for heating and welding.

[0020] In a further embodiment of the method of the present invention, the mechanical processing is a rolling process, a stamping process or a forging process.

[0021] By designing that the injection port on the top surface of the base is connected to the receiving groove, the heat pipe can be first rolled in the receiving groove and then the solder can be injected from the injection port. The solder receiving groove injection port uses gravity and the capillary force generated by the gap to evenly fill the gap between the heat pipe and the receiving groove with the solder. At the same time, the well-known defect of the heat pipe being rolled and the influence of the solidified solder causing the pipe wall to deform or the solder to be squeezed out of the gap is avoided, so that the solder can truly and completely fill the gap, thereby reducing the occurrence of empty soldering and maintaining the integrity of the heat pipe characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1A The figure is a schematic diagram of the structure of the current radiator base combined with the heat pipe;

[0023] Figure 1B It is a schematic diagram of the structure of rolling the current radiator base combined with the heat pipe;

[0024] Figure 1C It is a cross-sectional schematic diagram of the current radiator base combined with the heat pipe;

[0025] Figure 1D for Figure 1C Schematic diagram of solder solidification in the CC section line;

[0026] Figure 2A is a three-dimensional schematic diagram of the base of the present invention (I);

[0027] Figure 2B is a three-dimensional schematic diagram of the base of the present invention (II);

[0028] Figure 2C It is a three-dimensional schematic diagram of a base combined with a heat pipe of the present invention;

[0029] Figure 2D This is a schematic diagram of the present invention before solder is injected between the base and the heat pipe;

[0030] Figure 2E This is a schematic diagram of the present invention after solder is injected between the base and the heat pipe;

[0031] Figure 2F for Figure 2D Schematic diagram of solder injection at the AA section line;

[0032] Figure 2G for Figure 2E Schematic diagram of solder solidification in the middle BB section line;

[0033] Figure 3 The figure is a schematic flow chart of the production method of the present invention.

[0034] Description of Figure Numbers:

[0035] 1-base; 11-top surface; 12-bottom surface; 13-accommodating groove; 14-injection port; 2-heat pipe; 21-evaporation section; 22-condensation section; 4-solder; 5-gap; 6-solder layer; D1-first direction; D2-second direction. DETAILED DESCRIPTION

[0036] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0037] See also Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E , Figure 2F and Figure 2G , which are three-dimensional schematic diagrams of the base of the present invention (I), (II), a three-dimensional schematic diagram of the base combined with the heat pipe, a schematic diagram before and after the solder is injected between the base and the heat pipe, Figure 2D Schematic diagram of solder injection at the AA section line and Figure 2EThe main feature of the present invention is that the base 1 is innovatively improved in structure, thereby changing the manufacturing method and step sequence of the overall heat dissipation module structure. The overall structure of the base 1 is first described in detail below.

[0038] The base 1 has a top surface 11 and a bottom surface 12 . The top surface 11 is provided with a plurality of receiving grooves 13 . The bottom surface 12 is provided with at least one injection port 14 . The injection port 14 passes through the base 1 and is communicated with the plurality of receiving grooves 13 .

[0039] In this embodiment, the base 1 is a rectangular cube and has a first direction D1 and a second direction D2. The first direction D1 and the second direction D2 intersect or are perpendicular to each other.

[0040] The receiving groove 13 is recessed from the bottom surface 12 toward the top surface 11 and extends along the first direction D1. The injection port 14 is opened from the top surface 11 toward the bottom surface 12 and extends along the second direction D2. Since the first direction D1 and the second direction D2 intersect or are perpendicular to each other, the injection port 14 crosses (spans) the top of each receiving groove 13, and the two are connected.

[0041] The plurality of heat pipes 2 have an evaporation section 21 and a condensation section 22 . The evaporation section 21 of the heat pipe 2 is disposed in the receiving groove 13 of the base 1 , and the condensation section 22 of the heat pipe 2 is combined with a fin assembly.

[0042] Please also refer to Figure 2D , Figure 2E , Figure 2F and Figure 2G The base 1 and the heat pipe 2 are loosely matched. The combined portion of the two is subjected to mechanical processing (rolling processing) to apply pressure to the heat pipe 2, which is originally circular in cross section, to force the heat pipe 2 into the receiving groove 13 of the base 1, and to make the side of the heat pipe 2 under pressure to be flat and flush with the bottom surface 12 of the base 1, and there is a gap 5 (such as Figure 2D , Figure 2F As shown in the figure, after the solder 4 (liquid solder paste) is injected through the injection port 14 of the base 1, the solder 4 will quickly and evenly diffuse in the gap 5 and fill the gap 5 due to the capillary phenomenon generated by the gap 5. Finally, the base 1 and the heat pipe 2 are placed in a heating furnace (not shown) for heating, and after heating, they are taken out of the heating furnace for cooling. After cooling, the solder 4 forms a solder layer 6 in the gap 5 between the heat pipe 2 and the receiving groove 13 of the base 1. The solder layer 6 makes the heat pipe 2 and the base 1 more tightly combined and completely fills the gap 5 between the two, further avoiding the thermal resistance phenomenon generated in the gap 5.

[0043] See also Figure 3 , is a schematic diagram of the manufacturing method of the present invention, and is supplemented by reference to the above Figures 2A to 2G The structure and description are provided to facilitate understanding of the steps of combining and manufacturing the base 1 and the heat pipe 2 applied in the present invention.

[0044] S01: a material preparation step, preparing a base and a plurality of heat pipes, and the top surface and the bottom surface of the base are respectively provided with at least one injection port and a plurality of receiving grooves that are connected to each other.

[0045] The base used in this embodiment is the base 1 in the above-mentioned structural description embodiment, and the specific structural features of the base 1 can be found in Figures 2A to 2G And text description, will not be repeated here.

[0046] S02: Combining steps, placing a plurality of heat pipes into the receiving grooves of the base, and pressing the heat pipes into the receiving grooves by mechanical processing, and making the pressed side surface of the heat pipes flush with the bottom surface of the base.

[0047] The evaporation section 21 of the heat pipe 2 is pre-placed into the receiving groove 13, and then the heat pipe 2 is rolled by mechanical processing, so that the rolled parts of the evaporation sections 21 of the plurality of heat pipes 2 are pressed into the receiving groove 13, and the pressed side surface of the heat pipe 2 is flush with the bottom surface 12 of the base 1. The mechanical processing can be stamping or rolling, and of course, other methods can also be used, and are not limited to this.

[0048] S03: a material injection step, in which solder is injected into the injection port, and the heat pipe and the base after the solder injection are placed in a heating furnace for heating and welding.

[0049] This step is to inject the liquid solder 4 into the receiving groove through the injection port 14 on the top surface of the base, fill the gap 5 between the heat pipe 2 and the base 1 with the solder, and the capillary phenomenon generated by the gap 5 allows the liquid solder 4 to quickly and evenly diffuse and fill the gap 5, then put the heat pipe 2 and the base 1 into a heating furnace (not shown) for heating and welding, and finally take the base 1 and the heat pipe 2 out of the heating furnace (not shown) to cool, and after cooling, the solder forms the solder layer 6 in the gap 5. The heating furnace can be a tin furnace, a heat treatment furnace or other heating equipment, but is not limited thereto.

[0050] In addition, in step S03, the condensation section of the heat pipe can be preliminarily combined with a fin group by serial or through arrangement as needed, and solder is injected into the joint between the condensation section and the fin group. Then, the condensation section and the heat pipe 2 and the base 1 are placed in a heating furnace for heating. After the heating is completed, the condensation section is taken out of the heating furnace, and after cooling, the heat pipe 2 and the fin group are tightly combined.

[0051] The present invention changes the structure of the base 1 by designing the injection port on the top surface of the base in an innovative way, so that the heat pipe 2 can be first rolled and combined with the base 1, and then the solder 4 is injected into the gap 5 between the heat pipe 2 and the receiving groove 13 from the injection port 14 on one side of the base. In this way, it can be ensured that the heat pipe 2 can be more tightly combined with the receiving groove 13 after mechanical processing (rolling processing). In addition, the solder 4 can quickly and evenly fill the entire gap 5 through capillary action and gravity, thereby improving many well-known problems such as uneven solder distribution, empty soldering and heat pipe deformation.

[0052] In summary, the present invention has the following advantages:

[0053] 1. Simplify the radiator assembly process;

[0054] 2. Avoid empty soldering and reduce thermal resistance;

[0055] 3. Prevent the heat pipe from being deformed and damaged in the receiving groove due to rolling and hardening of solder.

[0056] The present invention has been described in detail above, and the above is only a preferred embodiment of the present invention, which should not limit the scope of the present invention. That is, all equivalent changes and modifications made according to the claims of the present invention should still fall within the scope of the patent of the present invention.

Claims

1. A heat dissipation structure, characterized in that: Include: A base having a bottom surface and a top surface, wherein the bottom surface is provided with at least one receiving groove, and the top surface is provided with at least one injection port, wherein the injection port is arranged across the top of each receiving groove and communicates with the receiving groove; A plurality of heat pipes are disposed in the receiving grooves of the base; and A solder layer is formed between the heat pipe and the accommodating groove.

2. The heat dissipation structure according to claim 1, characterized in that: One side of the base has a first direction, and the other side of the base has a second direction, and the first direction and the second direction are intersecting or perpendicular to each other.

3. The heat dissipation structure according to claim 2, characterized in that: The containing groove is opened along a first direction of the base, and the injection port is opened along a second direction of the base.

4. The heat dissipation structure according to claim 1, characterized in that: Both ends of the plurality of heat pipes are provided with an evaporation section and a condensation section, and the evaporation section of the heat pipe is arranged in the receiving groove of the base.

5. The heat dissipation structure according to claim 4, characterized in that: The condensing sections of the plurality of heat pipes are combined with a fin group.

6. The heat dissipation structure according to claim 1, characterized in that: A gap is formed between the heat pipe and the containing groove, and the solder layer is arranged in the gap to connect the two.

7. A method for manufacturing a heat dissipation structure according to claim 1, characterized in that: The following steps are involved: S01: a material preparation step, preparing a base and a plurality of heat pipes, wherein the top surface and the bottom surface of the base are respectively provided with at least one injection port and a plurality of receiving grooves that are connected to each other; S02: Combining steps, placing a plurality of heat pipes into the receiving grooves of the base, and pressing the heat pipes into the receiving grooves by mechanical processing, and making the pressed side surface of the heat pipes flush with the bottom surface of the base; S03: Injection step, by injecting solder into the injection port, and then placing the heat pipe and the base into a heating furnace for heating and welding.

8. The method for manufacturing the heat dissipation structure according to claim 7, characterized in that: The mechanical processing is rolling processing, stamping processing or forging processing.

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