Display module and display device

Abstract

The application discloses a display module and a display device, relates to the technical field of display, and can realize near field communication and light weight design. The display module comprises a display panel, a display area, a bending area and a binding area, the bending area is arranged between the display area and the binding area, and the bending area is used for bending the display panel of the binding area to one side away from the display side of the display panel of the display area; a buffer layer is arranged on the side of the display panel of the display area away from the display side; and a near field communication assembly is arranged between the buffer layer and the display panel of the binding area.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] Currently, with the development of display technology, smart display devices are widely used, such as smartphones and smartwatches. During the use of smart display devices, NFC (Near Field Communication) modules can be set up to achieve near-field communication. However, adding these functional modules increases the size and weight of the display device, potentially impacting the user experience. Summary of the Invention

[0003] This application provides a display module and display device that can increase near-field communication functionality and minimize the weight and size of the display device.

[0004] A first aspect of this application provides a display module, including:

[0005] The display panel includes a display area, a bending area, and a binding area. The bending area is disposed between the display area and the binding area, and the bending area is used to bend the display panel of the binding area to a side away from the display side of the display panel of the display area.

[0006] A buffer layer is disposed on the side of the display panel in the display area that is opposite to the display side;

[0007] A near-field communication component is disposed between the buffer layer and the display panel of the binding area.

[0008] In one feasible implementation, the display module further includes:

[0009] A flexible circuit board is disposed on the side of the display panel away from the display area of ​​the buffer layer, and the flexible circuit board is electrically connected to the near-field communication component;

[0010] One end of the flexible circuit board is bonded to the display panel in the bonding area, and the other end of the flexible circuit board is used for electrical connection to the control motherboard.

[0011] In one feasible implementation, the flexible circuit board and the orthographic projection of the near-field communication component on the display panel do not overlap.

[0012] In one possible implementation, the near-field communication component is disposed around the flexible circuit board.

[0013] In one feasible implementation, the flexible circuit board includes a trace layer with a first pin. The first pin is connected to the second pin of the near-field communication component by a stacked soldering method. The non-trace layer of the flexible circuit board has soldering holes in the area corresponding to the first pin. The soldering holes are used to solder the first pin and the second pin.

[0014] In one feasible implementation, the flexible circuit board includes an electrical connector, and the connection terminals of the near-field communication component are electrically connected to the electrical connector.

[0015] In one feasible implementation, the near-field communication component and the flexible circuit board are an integrated circuit board, and a preset through hole is provided between the area where the near-field communication component is located and the area where the flexible circuit board is located on the integrated circuit board. The end of the display panel in the bonding area away from the bending area passes through the preset through hole.

[0016] In one feasible implementation, the periphery of the preset through hole of the integrated circuit board includes a bonding pad and a fixing adhesive application point, the bonding pad and the fixing adhesive application point are located on both sides of the preset through hole, and the bonding pad and the fixing adhesive application point are located on the same side of the integrated circuit board.

[0017] The bonding pad is bonded to the bonding surface of the display panel, the fixing adhesive coating is fixedly bonded to the fixing surface of the display panel, and the bonding surface and the fixing surface are located on opposite sides of the display panel in the bonding area;

[0018] Bonding pads are used for electrical connection between the flexible circuit board and the display panel, while adhesive application points are used to securely connect the integrated circuit board and the display panel using adhesive.

[0019] In one feasible implementation, the area where the near-field communication component of the integrated circuit board is located at least partially surrounds the area where the flexible circuit board is located, and the preset through-hole is disposed in the surrounding connection area of ​​the near-field communication component and the flexible circuit board.

[0020] In one feasible implementation, the display module further includes:

[0021] A polarizer is disposed on the display side of the display panel in the display area;

[0022] A cover plate, which is connected to the polarizer by optical adhesive;

[0023] A driver chip, which is bonded to the bonding area, or the driver chip is bonded to the flexible circuit board.

[0024] In one feasible implementation, the driving chip is bonded to the side of the bonding area opposite to the display side, and the driving chip and the flexible circuit board do not overlap in the orthographic projection of the display panel.

[0025] A second aspect of this application provides a display device, comprising:

[0026] The display module as described in the first aspect.

[0027] This application provides a display module comprising a display panel, a near-field communication (NFC) layer, and a near-field communication (NFC) component. The bonding area of ​​the display panel is supplemented by the NFC component to fill the gap between the buffer layer and the bonding area, thereby matching the bending radius and eliminating the need for a bending interval component. The NFC component connects the buffer layer and the bonding area. Typically, to match the bending radius of the display module, the thickness of the tape or ferrite in the NFC component can be adjusted. If necessary, the thickness of the foam, copper, etc., in the buffer layer can also be adjusted. The display module proposed in this application, which uses an NFC component instead of a bending interval component, not only achieves near-field communication functionality but also reduces the number of bending interval components, lowers production costs, saves internal space between display components, and reduces the weight of the display module. Attached Figure Description

[0028] Figure 1 A schematic structural diagram of a display module provided in an embodiment of this application;

[0029] Figure 2 This application provides a schematic structural diagram of a display module in a related art.

[0030] Figure 3 A schematic structural diagram of another display module provided in the embodiments of this application;

[0031] Figure 4 A schematic structural diagram of a display module in another related technology provided in this application embodiment;

[0032] Figure 5 A schematic structural diagram corresponding to the front view of a near-field communication component provided in an embodiment of this application;

[0033] Figure 6 A schematic structural diagram corresponding to the left view of a near-field communication component provided in an embodiment of this application;

[0034] Figure 7 This application provides a schematic diagram of the internal structure of a near-field communication component according to an embodiment of the present application.

[0035] Figure 8 A schematic structural diagram illustrating the connection relationship between a near-field communication component and a flexible circuit board, provided in an embodiment of this application;

[0036] Figure 9 A schematic structural diagram illustrating the connection relationship between another near-field communication component and a flexible circuit board provided in an embodiment of this application;

[0037] Figure 10 A schematic structural diagram of an integrated circuit board provided in this application embodiment;

[0038] Figure 11 This is a schematic diagram illustrating the bonding process between a display panel and an integrated circuit board, provided in an embodiment of this application.

[0039] Figure 12 This application provides a schematic structural diagram of a display panel before it is bonded to an integrated circuit board.

[0040] Figure 13 This application provides a schematic structural diagram of a display panel bonded to an integrated circuit board.

[0041] Figure 14 A schematic structural diagram of another display module provided in the embodiments of this application;

[0042] Figure 15 A schematic structural diagram of another display module provided in the embodiments of this application;

[0043] Figure 16 A schematic structural diagram of a display device provided in an embodiment of this application;

[0044] Figures 1-16 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0045] 10 Display module; 101 Display panel; 1011 Display area; 1012 Bending area; 1013 Bonding area; 102 Buffer layer; 103 Near field communication component; 1031 Second pin; 1032 NFC cable structure; 1033 First adhesive layer; 1034 Second adhesive layer; 1035 Hollow area; 1036 NFC cable; 1037 NFC outer contour line; 1038 Jumper area; 104 Flexible circuit board; 1041 First pin; 1042 Soldering process hole; 1043 Electrical connector; 105 Preset through hole; 106 Second electrical connector; 107 Bonding pad; 108 Polarizing film; 109 Optical adhesive; 110 Cover plate; 111 Driver chip; 112 Bending interval component; 20 Suction cup. Detailed Implementation

[0046] To better understand the technical solutions provided in the embodiments of this specification, the technical solutions of the embodiments of this specification will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0047] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The term "two or more" includes two or more cases.

[0048] Currently, with the development of display technology, smart display devices are widely used, such as smartphones and smartwatches. In the use of smart display devices, NFC modules can be incorporated to enable near-field communication. However, adding these functional modules increases the size and weight of the display device, potentially impacting the user experience.

[0049] In view of this, the present application provides a display module 10 and a display device that can increase near-field communication functionality and minimize the weight and size of the display device.

[0050] The display panel 101 includes a display area 1011, a bending area 1012, and a binding area 1013. The bending area 1012 is disposed between the display area 1011 and the binding area 1013. The bending area 1012 is used to bend the display panel 101 in the binding area 1013 to the side of the display panel 101 away from the display side of the display area 1011.

[0051] A buffer layer 102 is disposed on the side of the display panel 101 in the display area 1011 that is away from the display side;

[0052] The near-field communication component 103 is disposed between the buffer layer 102 and the display panel 101 of the binding area 1013.

[0053] By way of example, a first aspect of the embodiments of this application provides a display module 10. Figure 1 A schematic structural diagram of a display module 10 provided in an embodiment of this application; Figure 2 This is a schematic structural diagram of a conventional display module 10 provided for an embodiment of this application.

[0054] like Figure 2 As shown, the existing display module 10 includes a display panel 101, a near-buffer layer 102, and a near-field communication component 103. The display panel 101 includes a display area 1011, a bending area 1012, and a bonding area 1013. The bending area 1012 is disposed between the display area 1011 and the bonding area 1013, and is used to bend the bonding area 1013 to the side opposite to the display side S of the display panel 101. Since the bending area 1012 is bent based on its flexibility, the display panel 101 can be a flexible display panel 101. Bonding pins can be provided in the bonding area 1013, allowing other electronic devices to be bonded to the display panel 101 through the bonding pins of the bonding area 1013. The bending area 1012 reduces the bezel of the display module 10. A buffer layer 102 is disposed on the side of the display panel 101 opposite to the display side S. The buffer layer 102 can act as a stress buffer, protecting the back side of the display panel 101 and the near-field communication component 103. When the display module 10 is subjected to external stress, the buffer layer 102 can buffer the external impact force. In the existing display module 10, the bonding area 1013 is supplemented by a bending spacing component 112 to fill the gap between the buffer layer 102 and the bonding area 1013, thereby matching the bending radius, and the buffer layer 102 and the bonding area 1013 are connected by the spacing component. The NFC (Near Field Communication) component is disposed on the same layer as the bending spacing component 112.

[0055] The implementation provided in this application is as follows: Figure 1As shown, the display module 10 also includes a display panel 101, a near-buffer layer 102, and a near-field communication (NFC) component 103. The binding area 1013 uses the NFC component to fill the gap between the buffer layer 102 and the binding area 1013, thereby matching the bending radius and eliminating the bending interval component 112. The buffer layer 102 and the binding area 1013 are connected via the NFC component. To match the bending radius of the display module 10, the thickness of the tape or ferrite in the NFC component can be adjusted. If necessary, the thickness of the foam, copper, etc., in the buffer layer 102 can also be adjusted. The display module 10 proposed in this application, which uses the NFC component instead of the bending interval component 112, not only achieves near-field communication functionality but also reduces the bending interval component 112, lowering production costs, saving internal space between display components, and reducing the weight of the display module 10.

[0056] In some examples, the above display module 10 also includes:

[0057] A flexible circuit board 104 is disposed on the side of the display panel 101 away from the display area 1011 of the buffer layer 102, and the flexible circuit board 104 is electrically connected to the near field communication component 103.

[0058] One end of the flexible circuit board 104 is bonded to the display panel 101 of the bonding area 1013, and the other end of the flexible circuit board 104 is used for electrical connection to the control motherboard.

[0059] For example, the display module 10 also includes a flexible circuit board 104, which is a bendable, foldable, and twistable circuit board composed of a flexible substrate and metal conductor lines. Figure 3 As shown, bonding pins can be provided within the bonding area 1013 of the display panel 101. One end of the flexible circuit board 104 is bonded to the display panel 101 via the bonding pins in the bonding area 1013. The bending of the bending area 1012 can cause the flexible circuit board 104 bonded to the bonding area 1013 to be positioned on the side opposite to the display side S of the display panel 101. The flexible circuit board 104 is positioned near the buffer layer 102 on the side away from the display panel 101. One end of the flexible circuit board 104 is bonded to the display panel 101, and the other end is used for electrical connection to the control motherboard. The flexible circuit board 104 is used to transmit drive signals. The control motherboard can store and run control programs, and transmit drive signals to the display panel 101 through the flexible circuit board 104 to make the display panel 101 display an image.

[0060] In some examples, the above-mentioned flexible circuit board 104 and the above-mentioned near-field communication component 103 do not overlap on the above-mentioned display panel 101.

[0061] For example, Figure 4 The structure of a display module 10 in the related art includes a display panel 101 comprising a display area 1011, a bending area 1012, and a bonding area 1013. The bending area 1012 is disposed between the display area 1011 and the bonding area 1013, and is used to bend the bonding area 1013 to the side opposite to the display side S of the display panel 101. A buffer layer 102 is disposed on the side of the display panel 101 opposite to the display side S. The bonding area 1013 is supplemented by a bending gap component 112 to fill the gap between the buffer layer 102 and the bonding area 1013, thereby matching the bending radius, and the buffer layer 102 and the bonding area 1013 are connected by the gap component. The NFC component is disposed on the same layer as the bending gap component 112. The near-field communication component 103 is disposed on the side of the NFC component opposite to the display side S. The flexible circuit board 104 is disposed on the side of the near-field communication component 103 opposite to the display side S.

[0062] The display module 10 proposed in this application, such as Figure 3 As shown, the binding area 1013 fills the gap between the buffer layer 102 and the binding area 1013 through the NFC component. The flexible circuit board 104 can be set on the same layer as the near-field communication component 103, and the two are set to avoid each other in the same layer. That is, the orthographic projection of the flexible circuit board 104 and the near-field communication component 103 on the display panel 101 does not overlap, thereby reducing the thickness of the display module 10 and realizing the miniaturization of the display device.

[0063] It should be noted that the non-overlapping projection of the near-field communication component 103 on the aforementioned display panel 101 does not include the non-overlapping of their soldering pins, but rather refers to the fact that their main structures have been designed to avoid overlap so that they can be set on the same layer, reducing the thickness of the display module 10. When using soldering pins to achieve electrical connection, the soldering pins of the two components can overlap and achieve electrical connection through soldering pins.

[0064] In some examples, the aforementioned near-field communication component 103 is disposed around the aforementioned flexible circuit board 104.

[0065] For example, Figure 5 This is a front view of the near-field communication component 103 in one direction. Figure 6 For near-field communication component 103 Figure 5This is the left view of the main view. The near-field communication component 103 includes a second pin 1031, an NFC ribbon cable structure 1032, a first adhesive layer 1033, a second adhesive layer 1034, and a cutout area 1035. The cutout area 1035 is used to place the flexible circuit board 104, and the communication component is arranged around the periphery of the flexible circuit board 104. The second pin 1031 can be connected to the flexible circuit board 104 at a point. The first adhesive layer 1033 is used to bind the binding area 1013 of the display panel 101. The shape of the first adhesive layer 1033 is contoured to the binding area 1013 to fit the Pad end of the binding area 1013. The second adhesive layer 1034 is designed to conform to the NFC ribbon cable structure 1032 to realize the connection between the near-field communication component 103 and the buffer layer.

[0066] By using a wraparound configuration, a larger area of ​​the NFC ribbon cable coil can be set, thereby providing better signal reception and transmission performance.

[0067] It should be noted that, Figure 5 The display device is circular, but this is only for illustration. It can also be rectangular, square, or other shapes. This application does not specifically limit the shapes.

[0068] In some examples, the flexible circuit board 104 includes a trace layer with a first pin 1041. The first pin 1041 is connected to the second pin 1031 of the near-field communication component 103 by a stacked soldering method. The non-trace layer of the flexible circuit board 104 has soldering process holes 1042 in the area corresponding to the first pin 1041. The soldering process holes 1042 are used to solder the first pin 1041 and the second pin 1042.

[0069] For example, such as Figure 7 The diagram shows a cross-sectional view of the near-field communication (NFC) component 103, including: a second pin 1031, an NFC cable 1036, an NFC outer contour line 1037, and a jumper area 1038. The NFC buffer layer 102 requires a double-layer configuration. When soldering to achieve electrical connection, the second pin 1031 is to be soldered onto the flexible circuit board 104. First, the buffer layer 102 is attached to the NFC component 103, followed by pad bending. To achieve electrical connection of the NFC pin, all non-routing layers of the flexible circuit board 104 need to be exposed (i.e., soldering process holes 1042 are provided) to expose the first pin 1041 and the second pin 1031. Because the NFC component 103 has two traces, only one layer of routing is needed on the flexible circuit board 104. The reason for opening windows on the remaining non-routing layers is for soldering. Figure 8The diagram shown is a schematic structural diagram of the connection between the flexible circuit board 104 and the near-field communication component 103 provided in this embodiment using a soldering process. The first pin 1041 and the second pin 1031 overlap. The first pin 1041 is away from the display side S. The non-trace layers of the flexible circuit board 104 all need to start the soldering process through the hole 1042 to expose the first pin 1041. The first pin 1041 and the second pin 1031 are connected by a soldering method.

[0070] In some examples, the flexible circuit board 104 includes an electrical connector 1043, and the connection terminals of the near-field communication component 103 are electrically connected to the electrical connector 1043.

[0071] For example, electrical connector 1043 typically consists of two or more metal joints that can be inserted into or connected to a plug or socket of a wire or electrical device. Figure 9 The diagram shown is a schematic structural diagram of the flexible circuit board 104 and the near-field communication component 103 provided in this embodiment, connected by an electrical connector 1043. The flexible circuit board 104 is connected to the second pin 1031 of the near-field communication component 103 via the electrical connector 1043.

[0072] In some examples, the near-field communication component 103 and the flexible circuit board 104 are an integrated circuit board. A preset through hole 105 is provided between the area where the near-field communication component 103 is located and the area where the flexible circuit board 104 is located. The end of the display panel 101 of the bonding area 1013 away from the bending area 1012 passes through the preset through hole 105.

[0073] For example, such as Figure 10The diagram illustrates an integrated circuit board according to an embodiment of this application. The main body of the wiring area of ​​the flexible circuit board 104 is a two-layer board. For example, the flexible circuit board 104 can be a four-layer board consisting of a 1-layer overlay, 2 wiring layers, and 1 overlay. Alternatively, the flexible circuit board 104 can be a six-layer board with a structure of 1+1+2 (wiring layers)+1+1 or 2+2 (wiring layers)+2. The wiring area of ​​the near-field communication component 103 requires two layers. Therefore, the near-field communication component 103 can be connected to the connector via wiring on the two-layer main body of the flexible circuit board 104. The connection point between the flexible circuit board 104 and the near-field communication component 103 is designed according to the wiring layout. It should be noted that because the near-field communication component 103 and the flexible circuit board 104 are an integrated circuit board, the flexible circuit board 104 cannot be configured with a neck-out soldered connector to ensure NFC surround setup. In addition, when the flexible circuit board 104 has two or more layers, the back of the connector does not need to be reinforced. If there is enough space for the wiring, the flexible circuit board 104 can be set as a two-layer board. The back of the connector corresponding to the flexible circuit board 104 needs to be reinforced to enhance strength and flatness.

[0074] Figure 11 A schematic diagram illustrating the process of bonding a display panel 101 to an integrated circuit board according to an embodiment of this application; Figure 12 This is a schematic structural diagram of a display panel 101 before it is bonded to an integrated circuit board, as provided in an embodiment of this application. Figure 13 This is a schematic structural diagram showing the bonding of a display panel 101 with an integrated circuit board, as provided in an embodiment of this application. Figure 11 As shown, in a bonding process between a display panel 101 and an integrated circuit board: Step 1: A suction cup 20 is used to hold the bonding area 1013 of the integrated circuit board and the display panel 101 respectively, and the suction cup 20 presses the bonding area 1013 and the first adhesive layer 1033 firmly together; Step 2: The suction cup 20 continues to press the bonding area 1013, so that it is inserted into the corresponding area of ​​the flexible circuit board 104 of the integrated circuit board through the preset through hole 105; Step 3: The suction cup 20 presses the area of ​​the flexible circuit board 104 of the integrated circuit board and performs a bonding process, so that the surface of the bonding area 1013 away from the display side is bonded to the second adhesive layer 1034. The integrated circuit board used in this embodiment is supplied as a single unit, which can save production costs.

[0075] In some examples, the periphery of the aforementioned preset through hole 105 of the integrated circuit board includes a bonding pad 107 and a fixing adhesive application point, wherein the bonding pad 107 and the fixing adhesive application point are located on both sides of the aforementioned preset through hole 105, and the bonding pad 107 and the fixing adhesive application point are located on the same side of the aforementioned integrated circuit board.

[0076] The aforementioned bonding pad 107 is bonded to the bonding surface of the aforementioned display panel 101, the aforementioned adhesive application points are fixedly connected to the fixing surface of the aforementioned display panel 101, and the aforementioned bonding surface and the aforementioned fixing surface are located on opposite sides of the aforementioned display panel 101 in the aforementioned bonding area 1013.

[0077] The bonding pad 107 is used for electrical connection between the flexible circuit board 104 and the display panel 101, and the adhesive application points are used to fix the integrated circuit board and the display panel 101 together with adhesive.

[0078] For example, such as Figure 14 The diagram shown is a schematic structural diagram of another display module 10 provided in this application embodiment. A bonding pad 107 and a fixing adhesive application point are provided around the pre-set through hole 105. This fixing adhesive application point is... Figure 10 The first adhesive layer 1033 is used to fix the bonding area 1013 near the display side S and the near-field communication component 103 in the integrated circuit board. The bonding pad 107 is electrically connected to the bonding area 1013 of the flexible circuit board 104 and the display panel 101 in the direction away from the display side S. The bonding pad 107 and the fixing coating point are located on both sides of the preset through hole 105. The bonding pad 107 is bonded to the bonding surface of the display panel 101, and the fixing adhesive coating point is fixedly connected to the fixing surface of the display panel 101. The bonding surface and the fixing surface are located on opposite sides of the display panel 101 in the bonding area 1013. The bonding end of the bonding area 1013 passes through the preset through hole 105. That is, the bonding pad 107 and the fixing coating point are located on both sides of the bonding area 1013, and the bonding surface is away from the display side S relative to the fixing surface. The bonding pad 107 and the fixing coating point are both located on the side of the integrated circuit board near the display side S.

[0079] In some examples, the near-field communication component 103 is disposed around the flexible circuit board 104, and the pre-set through hole 105 is disposed in the surrounding connection area of ​​the near-field communication component 103 and the flexible circuit board 104.

[0080] For example, such as Figure 10 As shown, in the integrated circuit board, the near-field communication component 103 is arranged around the flexible circuit board 104. A pre-set through-hole 105 is located in the surrounding connection area between the near-field communication component 103 and the flexible circuit board 104. This surrounding arrangement allows for a larger area of ​​the NFC ribbon cable coil, thereby providing better signal reception and transmission performance. The integrated circuit board also has a second electrical connector 106 for electrical connection with other modules.

[0081] In some examples, the above display module 10 also includes:

[0082] A polarizer 108 is disposed on the display side of the display panel 101 in the display area 1011;

[0083] Cover plate 110, which is connected to polarizer 108 by optical adhesive 109;

[0084] The driver chip 111 is bonded to the bonding area 1013, or the driver chip 111 is bonded to the flexible circuit board 104.

[0085] For example, such as Figure 15 The diagram shown is a schematic structural diagram of another display module 10 provided in this application embodiment. The polarizer 108 is an optical material that filters light from specific directions, allowing only light from those specific directions to pass through. In the display module 10, the polarizer 108 adjusts the direction of light propagation, ensuring that the deflection angle of the liquid crystal molecules is the same as the direction of the polarizer 108, thereby achieving image changes. The cover plate 110 is a transparent material, typically made of materials such as plexiglass or plastic, used to protect the display screen from impacts and scratches from external objects. The cover plate 110 prevents scratches or damage to the display screen surface and can also withstand a certain degree of impact and pressure. The polarizer 108 and the cover plate 110 are often adhered to the surface of the display panel 101 using optical adhesive 109, serving to protect the screen and improve the display effect.

[0086] By using a polarizer 108 and a cover plate 110, the polarizer 108 filters the direction of light to achieve changes in the liquid crystal display effect, while the cover plate 110 protects the screen surface from impacts and scratches from external objects. When used together, they provide dual protection for the display panel 101.

[0087] The display module 10 also includes a driver chip IC, which is bonded to a bonding area 1013. The driver chip IC can be electrically connected to the flexible circuit board 104 via signal lines on the bonding area 1013. The driver chip 111 typically consists of functional modules such as digital circuits, analog circuits, and power amplifiers. By integrating and optimizing these modules, efficient control and driving of various components can be achieved. The main function of the driver chip 111 is to convert input signals into output signals, thereby controlling the operating state and performance of the components.

[0088] In some examples, the aforementioned driver chip 111 is bonded to the side of the bonding area 1013 opposite to the display side, and the aforementioned driver chip 111 and the aforementioned flexible circuit board 104 do not overlap in the orthographic projection of the aforementioned display panel 101.

[0089] For example, such as Figure 15 As shown, the driver chip 111 can be disposed on the side of the bonding area 1013 away from the display side S, and the driver chip 111 and the above-mentioned flexible circuit board 104 do not overlap in the orthographic projection of the above-mentioned display panel 101, thereby further reducing the thickness of the display module 10.

[0090] A second aspect of this application provides a display device. Figure 16 This is a schematic structural diagram of a display device provided in an embodiment of this application. Figure 16 As shown, the display device includes a display module 10 as described in the first aspect.

[0091] It should be noted that, Figure 16 The display device shown is circular, but it is only schematic. It can also be rectangular, square, or other shapes. This application does not limit the specific shapes.

[0092] It should be noted that the display devices provided in the embodiments of this application may include smartphones, tablets, laptops, televisions, smartwatches, etc., and will not be listed one by one.

[0093] It should be noted that the descriptions of each embodiment in the above embodiments have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0094] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

[0095] Although preferred embodiments have been described in this specification, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this specification.

[0096] Obviously, those skilled in the art can make various modifications and variations to this specification without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims and their equivalents, this specification is also intended to include such modifications and variations.

Claims

1. A display module, characterized by The display panel comprises a display area, a bending area and a binding area, the bending area is arranged between the display area and the binding area, and the bending area is used for bending the display panel of the binding area to one side away from the display side of the display panel of the display area. A buffer layer is arranged on the side of the display panel of the display area away from the display side. A near field communication component is arranged between the buffer layer and the display panel of the binding area. A flexible circuit board is arranged on the side of the display panel of the display area away from the display area, and the flexible circuit board is electrically connected with the near field communication component. One end of the flexible circuit board is bound to the display panel of the binding area, and the other end of the flexible circuit board is used for electrically connecting a control mainboard. The near field communication component and the flexible circuit board are an integrated circuit board, a preset through hole is arranged between the area where the near field communication component of the integrated circuit board is located and the area where the flexible circuit board is located, and one end of the display panel of the binding area away from the bending area is arranged in the preset through hole. The near field communication component is arranged around the flexible circuit board.

2. The display module of claim 1, wherein, The flexible circuit board comprises a wiring layer, the wiring layer is provided with a first pin, the first pin is connected with a second pin of the near field communication component in a laminated welding manner, and a welding process hole is arranged in the area corresponding to the first pin of the non-wiring layer of the flexible circuit board, and the welding process hole is used for welding the first pin and the second pin.

3. The display module of claim 2, wherein, The flexible circuit board comprises an electrical connector, and a connection terminal of the near field communication component is electrically connected with the electrical connector.

4. The display module of claim 1, wherein, The preset through hole of the integrated circuit board comprises a binding pad and a fixing glue coating point, the binding pad and the fixing glue coating point are located on both sides of the preset through hole, and the binding pad and the fixing glue coating point are located on the same side of the integrated circuit board.

5. The display module of claim 1, wherein, The binding pad is bound to a binding surface of the display panel, the fixing glue coating point is fixedly connected with a fixing surface of the display panel, and the binding surface and the fixing surface are located on opposite sides of the display panel of the binding area.

6. The display module of claim 1, wherein, The binding pad is used for electrically connecting the flexible circuit board and the display panel, and the fixing glue coating point is used for fixedly connecting the integrated circuit board and the display panel through fixing glue. The area where the near field communication component of the integrated circuit board is located at least partially surrounds the area where the flexible circuit board is located, and the preset through hole is arranged in the surrounding connection area of the near field communication component and the flexible circuit board. Further comprising:

7. The display module of claim 6, wherein, A polarizer is arranged on the display side of the display panel of the display area.

8. The display module of any of claims 1-7, wherein, A cover plate is connected with the polarizer through optical glue. A driving chip is bound to the binding area, or the driving chip is bound to the flexible circuit board. The display module comprises any one of claims 1-8. The display module comprises any one of claims 1-8.

9. A display device comprising: ​ ​

Images