Submerged cooling device

Abstract

The present application relates to the technical field of electronic equipment cooling, and discloses an immersion cooling device, which comprises a case, a cooling mechanism and a bubble generating mechanism, the case is suitable for containing cooling liquid for cooling electronic equipment, the cooling liquid is suitable for cooling electronic equipment, the cooling mechanism is arranged in the case and is suitable for cooling the cooling liquid, and the bubble generating mechanism is connected with the case and is suitable for inputting bubbles into the cooling liquid, the electronic equipment is continuously cooled by the cooling liquid to avoid damage caused by high temperature of the electronic equipment, the bubble generating mechanism can input bubbles into the cooling liquid to disturb the cooling liquid, so that the cooling liquid generates oscillation waves, the oscillation waves can strengthen the cooling effect of the cooling liquid on the electronic equipment and heat exchange between the cooling liquid and the cooling mechanism, and the water pump structure is cancelled, so that a series of defects caused by the use of the water pump are avoided.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, and more specifically to an immersion cooling device. Background Technology

[0002] Immersion cooling devices are mainly used to directly immerse all the hardware and electronic equipment inside the server in fluorinated liquid. The flowing fluorinated liquid absorbs the heat generated by the server, thereby cooling down the electronic equipment.

[0003] In a single-phase immersion cooling device, the fluorinated liquid remains in a liquid state throughout the heat dissipation process without undergoing a phase change. The low-temperature fluorinated liquid directly contacts the heat-generating electronic equipment for heat exchange. After the temperature rises, the fluorinated liquid is pumped into a plate heat exchanger by a water pump. After being cooled by the outdoor side plate heat exchanger, the fluorinated liquid is re-introduced into the server to cool the electronic equipment. There is no evaporation or loss of fluorinated liquid during the entire heat dissipation process, and the control is simple.

[0004] As mentioned above, the water pump mainly provides the circulating flow power for the fluorinated liquid, enabling the fluorinated liquid to circulate and cool. At the same time, the water pump can also enhance the disturbance of the fluorinated liquid in the server and improve the cooling effect. However, it has the following drawbacks: using a water pump to drive the flow of fluorinated liquid consumes a lot of energy, and the sealing structure of the water pump is generally sealed with rubber gaskets, which has poor sealing performance for organic liquids such as fluorinated liquid, and leakage of fluorinated liquid often occurs. Summary of the Invention

[0005] In view of this, the present invention provides an immersion cooling device to solve a series of problems in the existing electronic device cooling system, such as energy consumption, poor sealing, and leakage of fluorinated liquid, which use water pumps as the power source for circulating fluorinated liquid.

[0006] In a first aspect, the present invention provides an immersion cooling device, comprising a chassis, a cooling mechanism, and a bubble generating mechanism. The chassis is adapted to hold a coolant for immersing an electronic device, the coolant being adapted to cool the electronic device. The cooling mechanism is disposed within the chassis and is adapted to cool the coolant. The bubble generating mechanism is connected to the chassis and is adapted to introduce bubbles into the coolant.

[0007] The above configuration allows the coolant to cool the electronic equipment, and the cooling mechanism is adapted to cool the coolant. During use, the electronic equipment exchanges heat with the coolant, causing the coolant temperature to rise and density to decrease at the electronic equipment location, where the coolant tends to move upwards. Meanwhile, the cooling mechanism cools the coolant, causing the coolant temperature to drop and density to decrease at the cooling mechanism location, where the coolant tends to move downwards. This creates a dynamic upward and downward circulation of the coolant within the chassis due to density differences, thus achieving continuous cooling of the electronic equipment and preventing damage caused by overheating. Simultaneously, the bubble generating mechanism introduces bubbles into the coolant, which agitate the coolant and generate oscillation waves. These oscillation waves enhance the cooling effect of the coolant on the electronic equipment and the heat exchange between the coolant and the cooling mechanism. Therefore, this invention eliminates the need for a water pump, utilizing the cooling mechanism to cool the coolant inside the chassis. The coolant's circulation is driven by density differences and the bubbles generated by the bubble generating mechanism, thus avoiding a series of drawbacks associated with using a water pump.

[0008] In one optional embodiment, the bubble generating mechanism includes a pressure tank and an air pipeline. The air pipeline is connected to the pressure tank, is disposed inside the chassis and immersed in the coolant, and has an air outlet to output compressed air from the pressure tank through the air outlet to form the bubbles.

[0009] In this setup, compressed air from the pressure tank is delivered to the outlet via an air pipeline. The compressed air output from the outlet forms bubbles, which flow upwards in the coolant, thereby agitating the coolant and enhancing the cooling effect on electronic equipment.

[0010] In one optional embodiment, the air duct is located below the electronic device so that the formed bubbles flow upward from below the electronic device, disturbing the coolant as they flow through it. This causes the coolant to oscillate, thereby enhancing its cooling effect on the electronic device. At the same time, the flow path of the bubbles is extended as much as possible, prolonging the oscillation time of the coolant and further enhancing the cooling effect.

[0011] In one optional embodiment, multiple air ducts and electronic devices are spaced apart along the length of the chassis, with each air duct corresponding to one of the electronic devices. This one-to-one correspondence ensures that each electronic device has a dedicated air duct to generate air bubbles, thereby enhancing the cooling effect of the coolant on each device.

[0012] In one optional embodiment, the bubble generating mechanism further includes an air supply pipeline disposed outside the chassis, the air supply pipeline being connected to both the pressure tank and the air pipeline; the air supply pipeline is provided with a regulating valve, the regulating valve being configured to be linked to the power of the electronic device, so as to control the opening and closing of the regulating valve according to the power of the electronic device.

[0013] This setup enables long-distance transmission of compressed air through the air supply pipeline, transferring compressed air from the pressure tank to the air pipeline. The control valve installed on the air supply pipeline is linked to the power of the electronic equipment, allowing the valve to open and close according to the power of the electronic equipment. This controls the cycle or frequency of bubble generation, thus making the enhanced heat dissipation of the coolant through bubbles controlled, while consuming less air. This results in optimal heat exchange performance with less air consumption and achieves the best energy efficiency ratio.

[0014] In one alternative embodiment, the bubble generating mechanism further includes an air compressor connected to the pressure tank, the air compressor being configured to: operate to fill the pressure tank with compressed air if the internal pressure of the pressure tank is determined to be lower than a first preset value, and stop operating if the internal pressure of the pressure tank is determined to be higher than a second preset value.

[0015] The air compressor is configured to replenish the pressure tank with compressed air. The air compressor is set to operate when the internal pressure of the pressure tank is lower than a first set value to fill the pressure tank with compressed air, and to stop operating when the internal pressure of the pressure tank is higher than a second set value. Therefore, the pressure tank allows the air compressor to work intermittently to replenish the pressure tank with compressed air, which can avoid the air compressor from running for a long time, ensure the life of the air compressor, reduce energy consumption, and at the same time, when the air compressor is damaged and needs to be repaired, the pressure tank can also maintain the generation of bubbles for a period of time, giving the air compressor enough time for repair.

[0016] In one alternative embodiment, the immersion cooling device further includes a bubble agitation mechanism disposed within the housing, adapted to compress and deform the bubbles.

[0017] When bubbles flow in the coolant, the bubble agitation mechanism can squeeze and deform the bubbles. The deformation of the bubbles will cause the coolant around them to oscillate, forming oscillation waves. The oscillation waves propagate upwards, causing the coolant above to oscillate up and down on the surface of electronic equipment and circulating cooling pipes. This enhances the cooling effect of the coolant on electronic equipment and the heat exchange effect between the coolant and the circulating cooling pipes. At the same time, the oscillation waves also facilitate the circulation of the coolant.

[0018] In one optional embodiment, the bubble disturbance mechanism includes a plurality of spaced-apart columns, which are disposed below the electronic device. Each column is provided with a squeezing part, and a squeezing gap is formed between the squeezing parts on two adjacent columns to allow the bubble to pass through. The squeezing gap is corresponding to the air outlet.

[0019] With the above configuration, the bubbles flowing out of the vents flow upwards. Since the extrusion gap is set to correspond with the vents, the bubbles flow further into the extrusion gap. The extrusion parts on both sides extrude and deform the bubbles. As the bubbles deform, they cause the coolant to oscillate, generating oscillation waves. The oscillation waves spread upwards to the electronic equipment above, thereby enhancing the cooling and heat exchange effect of the coolant on the electronic equipment.

[0020] In one alternative embodiment, the extrusion section is inclined relative to the column so that the extrusion gap forms a conical gap that is smaller at the top and larger at the bottom, in order to guide and extrude the air bubble.

[0021] The above configuration, by tilting the extrusion section relative to the column, creates a conical space with a smaller top and a larger bottom in the extrusion gap. Based on the upward flow characteristics of bubbles, the bubbles first flow into the larger end of the conical gap, where they expand and then gradually flow upwards towards the smaller end. When the bubbles pass through the smaller end, they are squeezed, i.e., deformed, until they pass through. The extruded bubbles then expand and recover. Therefore, the conical gap with a smaller top and a larger bottom can guide and squeeze the bubbles. During the deformation and recovery of the bubbles, the coolant generates oscillating waves, enhancing the cooling of electronic equipment and the heat exchange effect with the circulating cooling pipes.

[0022] In one optional embodiment, the extrusion section is provided at intervals along the height direction of the column, thereby forming multiple extrusion gaps along the height direction of the column. The bubble can be extruded and deformed multiple times through the extrusion gaps, thereby generating multiple oscillating waves and enhancing the heat exchange and cooling effect.

[0023] In one optional embodiment, the electronic device includes a fixed housing, a heat sink, and electronic components. The fixed housing is fixed to the inner wall of the chassis, the heat sink is disposed inside the fixed housing, the electronic components are disposed inside the fixed housing, the heat sink is located above the electronic components, and the bubble agitation mechanism is located between the electronic components and the air duct.

[0024] In the above configuration, the bubbles flowing out of the air outlet on the air pipe flow upwards. The bubbles are squeezed and deformed multiple times by the bubble agitation mechanism, causing the coolant to generate multiple oscillating waves. The oscillating waves vibrate on the surface of the electronic device to enhance the cooling effect of the coolant on the electronic device. When the bubbles leave the bubble agitation mechanism, they continue to flow upwards through the electronic device to reach the heat sink. When the bubbles pass through the heat sink, the flow of the bubbles further drives the movement of the coolant remaining between the heat sinks, thereby further enhancing the heat exchange performance between the coolant and the heat sink. The bubbles finally overflow from the heat sink to the top of the electronic device.

[0025] In one optional embodiment, the heat sink includes a plurality of heat dissipation fins spaced apart along the length of the fixed housing, and the distance from the heat dissipation fins on both sides to the electronic device is L1, and the distance from the heat dissipation fins in the middle portion to the electronic device is L2, then L1 < L2.

[0026] By limiting the distance L1 between the heat sink fins on both sides and the electronic device to be less than the distance L2 between the heat sink fins in the middle and the electronic device, that is, the length of the heat sink fins on both sides is longer than the length of the heat sink fins in the middle, the shorter heat sink fins in the middle can provide clearance space for the flow of bubbles. Thus, when the bubbles flow past the electronic device and reach the heat sink, the clearance space is conducive to the accumulation of bubbles. When a large number of bubbles are generated, they can temporarily accumulate in the clearance space. The heat sink fins on both sides can block and limit the bubbles, reducing the leakage of bubbles from the heat sink fins on both sides. Then the bubbles gradually flow towards the heat sink fins, thereby ensuring that more bubbles can flow to the heat sink and enhance the heat dissipation effect of the heat sink.

[0027] In one optional embodiment, the line connecting the ends of the plurality of heat dissipation fins facing the electronic device is arc-shaped, so that the ends of the plurality of heat dissipation fins facing the electronic device form an arc-shaped clearance space, through which air bubbles flow evenly across the heat sink, thereby enhancing the heat dissipation of each heat dissipation fin.

[0028] In one optional embodiment, the cooling mechanism includes a circulating cooling pipe disposed within the chassis. The circulating cooling pipe is adapted to contain a cooling medium, which is adapted to exchange heat with the coolant. The cooling medium flows within the circulating cooling pipe, and the heat from the coolant is transferred to the cooling medium through the pipe wall, thereby achieving the purpose of cooling the coolant within the chassis.

[0029] In one optional embodiment, the cooling mechanism further includes a plurality of heat exchange fins, which are spaced apart along the length of the circulating cooling pipe.

[0030] During heat exchange, the coolant transfers heat to both the heat exchange fins and the walls of the circulating cooling pipes. The heat exchange between the cooling medium and the coolant is achieved simultaneously through the heat exchange fins and the circulating cooling pipes. Therefore, it can be seen that the heat exchange fins can increase the heat exchange area between the coolant and the cooling medium, thereby enhancing the heat exchange effect. Attached Figure Description

[0031] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the overall structure of the immersion cooling device according to an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the structure of the chassis and cooling mechanism in an embodiment of the present invention;

[0034] Figure 3 This is a partially enlarged structural schematic diagram of the cooling mechanism according to an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the bubble generating mechanism according to an embodiment of the present invention;

[0036] Figure 5 This is a cross-sectional view of an immersion cooling device according to an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of the bubble disturbance mechanism according to an embodiment of the present invention;

[0038] Figure 7 This is a partial cross-sectional view of an immersion cooling device according to an embodiment of the present invention.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1. Chassis; 2. Cooling mechanism; 21. Circulating cooling pipes; 22. Heat exchange fins; 3. Bubble generating mechanism; 31. Air compressor; 32. Air pipes; 321. Air outlet; 33. Air supply pipes; 331. Control valve; 34. Pressure tank; 4. Bubble agitation mechanism; 41. Column; 42. Extrusion section; 421. Extrusion gap; 100. Electronic equipment; 101. Fixed housing; 102. Radiator; 1021. Heat dissipation fins; 103. Electronic components; 200. Bubble. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] The following is combined with Figures 1-7 The following describes embodiments of the present invention.

[0043] like Figures 1 to 7 As shown, according to an embodiment of the present invention, an immersion cooling device is provided, including a housing 1, a cooling mechanism 2 and a bubble generating mechanism 3, wherein the housing 1 is adapted to hold a coolant for immersing an electronic device 100, the coolant is adapted to cool the electronic device 100, the cooling mechanism 2 is disposed inside the housing 1 and is adapted to cool the coolant, and the bubble generating mechanism 3 is connected to the housing 1 and is adapted to input bubbles 200 into the coolant.

[0044] In this embodiment of the immersion cooling device, the coolant can cool the electronic device 100, and the cooling mechanism 2 is adapted to cool the coolant. During use, the electronic device 100 exchanges heat with the coolant, causing the coolant temperature at the electronic device 100 to rise and its density to decrease, resulting in an upward tendency for the coolant to move upwards. Meanwhile, the cooling mechanism 2 cools the coolant, causing its temperature and density to decrease, resulting in a downward tendency for the coolant to move downwards. This creates a dynamic upward and downward circulation of the coolant within the chassis 1 due to the density difference, thereby achieving continuous cooling of the electronic device 100. However, to avoid damage caused by overheating of the electronic device 100, the bubble generating mechanism 3 can introduce bubbles 200 into the coolant. The bubbles 200 can disturb the coolant and generate oscillation waves. The oscillation waves can enhance the cooling effect of the coolant on the electronic device 100 and the heat exchange between the coolant and the cooling mechanism 2. Therefore, this embodiment eliminates the water pump structure and uses the cooling mechanism 2 to cool the coolant inside the chassis. The coolant generates circulation power due to density difference and the bubbles 200 generated by the bubble generating mechanism 3, thereby avoiding a series of defects caused by using a water pump.

[0045] It should be noted that in this embodiment, the coolant is a fluorinated liquid. Of course, the coolant can also be some non-conductive light oils, and is not limited to this embodiment.

[0046] The structure of the immersion cooling device will be described in detail below with reference to the accompanying drawings.

[0047] In this embodiment, the chassis 1 is a hollow rectangular shell, and the electronic device 100 is fixedly installed in the hollow. The hollow can also hold coolant, and the level of the coolant is higher than the height of the electronic device 100, thereby achieving complete immersion cooling of the electronic device 100.

[0048] In this embodiment, the cooling mechanism 2 includes a circulating cooling pipe 21 disposed within the chassis 1. The circulating cooling pipe 21 is adapted to contain a cooling medium, which is adapted to exchange heat with the coolant. The cooling medium flows within the circulating cooling pipe 21, and the heat of the coolant is transferred to the cooling medium through the pipe wall of the circulating cooling pipe 21, thereby achieving the purpose of cooling the coolant within the chassis 1.

[0049] It is understandable that the temperature of the coolant is increased when it exchanges heat with the electronic device 100, while the temperature of the cooling medium is much lower than that of the coolant. Therefore, when the coolant with a higher temperature comes into contact with the circulating cooling pipe 21 containing the cooling medium with a lower temperature, the temperature of the coolant can be reduced by the cooling medium, thereby achieving the effect of cooling the coolant.

[0050] It should be noted that the cooling medium can be low-temperature water or low-temperature air conditioning coolant, etc., and the specific choice is made according to the needs. This embodiment does not make any specific limitations.

[0051] In terms of placement, the circulating cooling pipes 21 can be installed on the inner walls of both sides of the chassis 1 so that the circulating cooling pipes 21 on both sides can cool the coolant in the chassis 1 and improve the cooling effect of the coolant.

[0052] In terms of size and quantity, in this embodiment, multiple circulating cooling pipes 21 are arranged at intervals along the inner wall of the chassis 1. The multiple circulating cooling pipes 21 are connected in sequence, and the length of each circulating cooling pipe 21 matches the length of the inner wall of the chassis 1, so as to maximize the contact heat exchange area between the circulating cooling pipes 21 and the coolant and enhance the cooling effect on the coolant.

[0053] In terms of specific materials, the circulating cooling pipes 21 can be made of metal to withstand high and low temperatures.

[0054] Furthermore, the cooling mechanism 2 also includes multiple heat exchange fins 22, which are spaced apart along the length of the circulating cooling pipe 21. During heat exchange, the coolant simultaneously transfers heat to both the heat exchange fins 22 and the pipe wall of the circulating cooling pipe 21. Heat exchange between the cooling medium and the coolant is achieved simultaneously through the heat exchange fins 22 and the circulating cooling pipe 21. Therefore, it can be seen that the heat exchange fins 22 can increase the heat exchange area between the coolant and the cooling medium, thereby enhancing the heat exchange effect.

[0055] Of course, the cooling mechanism 2 may also include an external cooling tower, which is suitable for cooling the cooling medium so that the cooling medium, after being cooled by the external cooling tower, flows back into the circulating cooling pipe 21 to cool the coolant in the chassis 1. Since the structure of the external cooling tower is existing technology, it will not be described in detail here.

[0056] In this embodiment, the bubble generating mechanism 3 includes a pressure tank 34 and an air pipe 32. The air pipe 32 is connected to the pressure tank 34 and is disposed inside the chassis 1 and immersed in the coolant. The air pipe 32 is provided with an air outlet 321 to output compressed air from the pressure tank 34 through the air outlet 321 to form bubbles 200. With this arrangement, the compressed air in the pressure tank 34 is transported to the air outlet through the air pipe 32, and the compressed air is output through the air outlet to form bubbles 200. The bubbles 200 flow upward in the coolant, thereby disturbing the coolant and enhancing the cooling effect on the electronic device 100.

[0057] The pressure tank 34 has a certain volume for storing a certain amount of compressed air. The specific volume and size of the pressure tank 34 can be set according to the requirements, and this embodiment does not impose any restrictions.

[0058] Preferably, the air duct 32 is located below the electronic device 100 so that the formed bubbles 200 flow upward from below the electronic device 100. When they flow through the electronic device 100, they disturb the coolant there. The coolant oscillates, thereby enhancing the cooling effect of the coolant on the electronic device 100. At the same time, it can also extend the flow path of the bubbles 200 as much as possible, prolong the oscillation time of the coolant, and thus enhance the cooling effect.

[0059] In terms of quantity, multiple air outlets 321 are provided at intervals on each air pipe 32 so that compressed air can be output through multiple air outlets 321 to form multiple bubbles 200. Multiple bubbles 200 entering the coolant at the same time can enhance the disturbance of the coolant, thereby enhancing the cooling and heat exchange effect of the coolant on the electronic equipment 100.

[0060] In one optional embodiment, multiple electronic devices 100 and air ducts 32 are spaced apart along the length of the chassis 1, with each air duct 32 corresponding to one of the multiple electronic devices 100. This one-to-one correspondence between the multiple air ducts 32 and the multiple electronic devices 100 ensures that each electronic device 100 has a corresponding air duct 32 to generate bubbles 200, thereby enhancing the cooling effect of the coolant on each electronic device 100.

[0061] The bubble generating mechanism 3 also includes an air supply line 33 located outside the housing 1. The air supply line 33 is connected to both the pressure tank 34 and the air line 32. The air supply line 33 can realize long-distance transmission of compressed air, thereby transmitting the compressed air from the pressure tank 34 to the air line 32.

[0062] In terms of specific materials and connection methods, the air pipe 32 and the air supply pipe 33 are welded together. Both the air pipe 32 and the air supply pipe 33 can be made of metals such as stainless steel, which can withstand the high pressure of compressed air and facilitate the processing of air outlets 321 with consistent specifications. Furthermore, the welded connection of metal materials is more reliable.

[0063] Furthermore, a regulating valve 331 is provided on the gas supply pipeline 33. The regulating valve 331 is configured to be linked to the power of the electronic device 100, so as to control the opening and closing of the regulating valve 331 according to the power of the electronic device 100. Since the regulating valve 331 on the gas supply pipeline 33 is linked to the power of the electronic device 100, it can control the opening and closing of the regulating valve 331 according to the power of the electronic device 100, thereby realizing the generation cycle or frequency of the bubbles 200. This makes the enhanced heat dissipation of the coolant by the bubbles 200 controlled, while the air consumption is reduced. The best performance of heat exchange enhancement can be obtained with less air consumption, and the best energy efficiency ratio can be obtained.

[0064] The opening and closing of the power control valve 331 of the electronic device 100 can specifically include the following: when the power of the electronic device 100 is greater than the preset power, the control valve 331 is opened, so that the compressed air in the pressure tank 34 flows through the control valve 331 through the air supply line 33 to multiple air lines 32, and then is output through multiple air outlets 321 on the multiple air lines 32 to form bubbles 200. The bubbles 200 disturb the coolant, thereby enhancing the cooling effect of the coolant on the electronic device 100. When the power of the electronic device 100 is less than the preset power, the control valve 331 is closed. At this time, the compressed air cannot flow out through the control valve 331, so no bubbles 200 are generated and air consumption is reduced.

[0065] It is understandable that when the power of electronic device 100 exceeds the preset power, it indicates that electronic device 100 is overheating significantly. Therefore, opening the regulating valve 331 to generate bubbles 200 enhances the cooling effect on electronic device 100, allowing it to cool down to a safe temperature more quickly. Conversely, when the power of electronic device 100 is less than the preset power, it indicates that electronic device 100 is overheating only slightly. In this case, the regulating valve 331 is closed, and the cooling of electronic device 100 is achieved solely through the flow of the coolant. It should be noted that the preset power can be designed based on the power consumption and heat generation of electronic device 100; this embodiment does not impose specific limitations.

[0066] In this embodiment, the bubble generating mechanism 3 further includes an air compressor 31, which is connected to a pressure tank 34. The air compressor 31 is configured to: operate to fill the pressure tank 34 with compressed air when the internal pressure of the pressure tank 34 is lower than a first set value, and stop operating when the internal pressure of the pressure tank 34 is higher than a second set value.

[0067] This configuration allows the air compressor 31 to replenish compressed air into the pressure tank 34. The air compressor 31 is configured to operate when the internal pressure of the pressure tank 34 is lower than a first set value to fill the pressure tank 34 with compressed air, and to stop operating when the internal pressure of the pressure tank 34 is higher than a second set value. Therefore, the configuration of the pressure tank 34 enables the air compressor 31 to work intermittently to replenish the pressure tank 34 with compressed air, which avoids the long-term operation of the air compressor 31, ensures the life of the air compressor 31, and reduces energy consumption. At the same time, when the air compressor 31 is damaged and needs repair, the pressure tank 34 can also maintain the generation of bubbles 200 for a period of time, giving the air compressor 31 sufficient time for repair.

[0068] It should be noted that the first and second settings can be set according to actual needs, and this embodiment does not impose specific restrictions.

[0069] Specifically, air compressor 31 is a device used to compress gas. Air compressors are similar in construction to water pumps, and most air compressors are reciprocating piston, rotary vane, or rotary screw types. Since air compressors are existing technology, they will not be described in detail here.

[0070] Preferably, the immersion cooling device further includes a bubble agitation mechanism 4, which is disposed inside the housing 1 and is adapted to compress and deform the bubbles 200. With this configuration, when the bubbles 200 flow in the coolant, the bubble agitation mechanism 4 can compress and deform the bubbles 200. The deformation of the bubbles 200 causes the surrounding coolant to oscillate, forming an oscillation wave. The oscillation wave propagates upwards, causing the coolant above to oscillate up and down on the surfaces of the electronic device 100 and the circulating cooling pipes 21, enhancing the cooling effect of the coolant on the electronic device 100 and the heat exchange effect between the coolant and the circulating cooling pipes 21. Simultaneously, the oscillation wave also facilitates the circulation of the coolant.

[0071] In terms of specific structure, in this embodiment, the bubble disturbance mechanism 4 includes multiple spaced-apart columns 41, which are positioned below the electronic device 100. Each column 41 has a squeezing section 42, and a squeezing gap 421 is formed between the squeezing sections 42 on adjacent columns 41 to allow the bubbles 200 to pass through. The squeezing gap 421 corresponds to the vent 321. With this arrangement, the bubbles 200 flowing out of the vent 321 flow upwards. Because the squeezing gap 421 corresponds to the vent 321, the bubbles 200 further flow into the squeezing gap 421. The squeezing sections 42 on both sides squeeze and deform the bubbles 200. As the bubbles 200 deform, they cause the coolant to oscillate, generating oscillation waves. These oscillation waves spread upwards to the electronic device 100 above, thereby enhancing the cooling and heat exchange effect of the coolant on the electronic device 100.

[0072] Furthermore, the extrusion section 42 is inclined relative to the column 41, so that the extrusion gap 421 forms a conical gap that is smaller at the top and larger at the bottom, in order to guide and extrude the bubble 200. With this arrangement, by inclining the extrusion section 42 relative to the column 41, the extrusion gap 421 forms a conical space that is smaller at the top and larger at the bottom. According to the upward flow characteristics of the bubble 200, the bubble 200 first flows into the larger end of the conical gap, where it expands. Then, it gradually flows upward from the larger end to the smaller end, where it is compressed, i.e., deformed, until it passes through. The compressed bubble 200 then expands and recovers. Therefore, the conical gap, smaller at the top and larger at the bottom, can guide and extrude the bubble 200. During the deformation and recovery of the bubble 200, the coolant generates oscillating waves, enhancing the cooling of the electronic device 100 and the heat exchange effect with the circulating cooling pipe 21.

[0073] Specifically, the compression parts 42 on two adjacent columns 41 form a figure-eight shape, and the gap between the figure-eight shapes is a conical gap that is smaller at the top and larger at the bottom.

[0074] In terms of quantity, multiple extrusion sections 42 are spaced apart along the height direction of the column 41, thereby forming multiple extrusion gaps 421 along the height direction of the column 41. The bubble 200 can be extruded and deformed multiple times through the extrusion gaps 421, thereby generating multiple oscillating waves and enhancing the heat exchange and cooling effect.

[0075] It should be noted that, in this embodiment, the electronic device 100 includes a fixed housing 101, a heat sink 102, and an electronic device 103. The fixed housing 101 is fixed to the inner wall of the chassis 1. The heat sink 102 and the electronic device 103 are both disposed inside the fixed housing 101. The heat sink 102 is located above the electronic device 103. The bubble disturbance mechanism 4 is located between the electronic device 103 and the air duct 32. In this configuration, the bubbles 200 flowing out of the air outlet 321 on the air pipe 32 flow upward. The bubbles 200 are squeezed and deformed multiple times by the bubble disturbance mechanism 4, causing the coolant to generate multiple oscillating waves. The oscillating waves oscillate on the surface of the electronic device 103 to enhance the cooling effect of the coolant on the electronic device 103. After the bubbles 200 leave the bubble disturbance mechanism 4, the bubbles 200 will continue to flow upward through the electronic device 103 to reach the heat sink 102. When the bubbles 200 pass through the heat sink 102, the flow of the bubbles 200 will further drive the movement of the coolant remaining in the heat sink 102, thereby further enhancing the heat exchange performance between the coolant and the heat sink 102. The bubbles 200 finally overflow from the heat sink 102 to the top of the electronic device 100.

[0076] In terms of specific installation, in this embodiment, the fixed housing 101 is a rectangular housing with an open bottom and top. The electronic device 103 and the heat sink 102 are both fixed on the inner wall of the rectangular housing. The bubble agitation mechanism 4 is also fixedly installed inside the fixed housing 101. The bubble 200 flows into the fixed housing 101 through the bottom opening and flows upward sequentially through the bubble agitation mechanism 4, the electronic device 103, and the heat sink 102, and finally flows upward through the top opening of the fixed housing 101.

[0077] Specifically, multiple columns 41 are fixed at equal intervals on the inner wall of the rectangular shell, and a compression gap 421 is formed between each two adjacent columns 41. Multiple columns 41 can form multiple compression gaps 421. The multiple compression gaps 421 are set one-to-one with the multiple air outlets 321 on the air pipe 32, so that air bubbles 200 flow into each compression gap 421, thereby compressing and deforming the air bubbles 200.

[0078] In one optional embodiment, the heat sink 102 includes a plurality of heat dissipation fins 1021 spaced apart along the length of the fixed housing 101, and the distance from the heat dissipation fins 1021 on both sides to the electronic device 103 is L1, and the distance from the heat dissipation fins 1021 in the middle part to the electronic device 103 is L2, so L1 < L2.

[0079] This configuration limits the distance L1 between the heat dissipation fins 1021 on both sides and the electronic device 103 to be less than the distance L2 between the heat dissipation fins 1021 in the middle and the electronic device 103. That is, the length of the heat dissipation fins 1021 on both sides is longer than the length of the heat dissipation fins 1021 in the middle. The shorter heat dissipation fins 1021 in the middle can provide clearance space for the flow of bubbles 200. When the bubbles 200 flow past the electronic device 103 and reach the heat sink 102, the clearance space facilitates the accumulation of bubbles 200. When a large number of bubbles 200 are generated, they can temporarily accumulate in the clearance space. The heat dissipation fins 1021 on both sides can block and limit the bubbles 200, reducing the leakage of bubbles 200 from the heat dissipation fins 1021 on both sides. Then the bubbles 200 gradually flow towards the heat dissipation fins 1021, thereby ensuring that more bubbles 200 can flow to the heat sink 102, enhancing the heat dissipation effect of the heat sink 102.

[0080] In this embodiment, the line connecting the ends of the multiple heat dissipation fins 1021 facing the electronic device 103 is arc-shaped, so that the ends of the multiple heat dissipation fins 1021 facing the electronic device 103 form an arc-shaped clearance space. The bubbles 200 flow evenly through the heat sink 102 through the arc-shaped clearance space to enhance the heat dissipation of each heat dissipation fin 1021.

[0081] Specifically, the distance L1 between the heat dissipation fins 1021 on both sides and the electronic device 103 is the smallest, while the distance between the heat dissipation fin 1021 in the middle and the electronic device 103 is the largest. The distance between the heat dissipation fin 1021 in the middle and the heat dissipation fins on both sides and the electronic device 103 increases sequentially from the outside to the inside, thus making the line connecting all the heat dissipation fins 1021 towards the electronic device 103 an arc shape. It should be noted that "from the outside to the inside" refers to the direction from the outermost heat dissipation fin 1021 to the middle heat dissipation fin 1021.

[0082] To facilitate understanding of the immersion cooling device in this embodiment, please refer to the accompanying manual. Figure 1 To be continued Figure 7 The usage process is described as follows:

[0083] The coolant inside the chassis 1 cools the electronic device 100, causing the coolant temperature to rise and the density to decrease at the electronic device 100, where the coolant tends to move upward. Meanwhile, the cooling medium in the circulating cooling pipe 21 cools the coolant around the circulating cooling pipe 21 and the heat exchange fins 22, causing the coolant temperature to drop and the density to decrease around the cooling mechanism 2, where the coolant tends to move downward. This creates a dynamic circulation of the coolant inside the chassis 1 due to the density difference, thereby achieving continuous cooling of the electronic device 100 and preventing damage caused by overheating.

[0084] The air compressor 31 replenishes the pressure tank 34 with compressed air. Specifically, when the internal pressure of the pressure tank 34 is determined to be lower than a first set value, the air compressor 31 operates to fill the pressure tank 34 with compressed air, and when the internal pressure of the pressure tank 34 is determined to be higher than a second set value, the air compressor 31 stops operating.

[0085] When the power of the electronic device 100 exceeds the preset power, the control valve 331 opens, allowing compressed air in the pressure tank 34 to flow through the control valve 331 and the air supply line 33 to multiple air lines 32. The compressed air then exits through multiple air outlets 321 on the multiple air lines 32, forming bubbles 200. The bubbles 200 flow upwards into the compression gap 421. Since the compression gap 421 is a conical gap (smaller at the top and larger at the bottom), the bubbles 200 first flow into the larger end of the conical gap, where they expand and then gradually flow upwards towards the smaller end. As the bubbles 200 flow through the smaller end, they are compressed. That is, the bubble 200 is squeezed and deformed. After being squeezed through the small end of the conical gap, the bubble 200 can expand and recover. This cycle continues. The bubble 200 flows through multiple squeezing gaps 421 and undergoes multiple squeezing deformations and recoverys, thereby generating multiple oscillation waves. The oscillation waves spread upward to the electronic device 103 above, thereby enhancing the cooling effect of the coolant on the electronic device 103. Then the bubble 200 flows through the electronic device 103 to the heat sink 102, which can enhance the heat dissipation of the heat sink 102. At the same time, the upward flowing bubble 200 can also increase the power of the internal circulation flow of the coolant, and improve the heat exchange effect between the coolant, the heat exchange fins 22 and the circulating cooling pipes 21.

[0086] When the power of the electronic device 100 is less than the preset power, the control valve 331 is closed. At this time, compressed air cannot flow out through the control valve 331, no bubbles 200 are generated, and the electronic device 100 is cooled only by the self-circulation of the coolant inside, which can reduce air consumption.

[0087] Therefore, during the entire heat exchange process, the driving force comes entirely from the density difference inside the coolant and the oscillation waves and disturbances caused by the bubbles 200, thereby improving the structure of the existing immersion cooling device and eliminating the water pump required for coolant circulation. Although the entire system introduces compressed air as a medium, the energy loss cost and reliability of compressed air are much higher than that of water pump-driven coolant. Furthermore, the downtime risk caused by mechanical failure of the air compressor 31 is also overcome by the introduction of the pressure tank 34.

[0088] In summary, the advantages of this invention are as follows:

[0089] (1) The heat exchange performance is greatly improved by using the oscillation wave generated by the bubble 200 and promoting the flow of coolant. This allows the system to eliminate the traditional water pump that drives the flow of coolant, reduce energy consumption, simplify the structure, and greatly improve reliability.

[0090] (2) The self-circulation of coolant and the directional setting of the position of bubble 200 (i.e., below the electronic device 100) provide directional enhancement to the electronic device 100, overcoming the problems of short-circuiting circulation and inability to provide directional enhancement in the original immersion liquid cooling method.

[0091] Of course, the above description is merely a preferred technical solution of this embodiment. Furthermore:

[0092] In some embodiments, the cooling mechanism 2 may also be disposed on the outer wall of the chassis 1, and the heat of the coolant is transferred to the cooling mechanism 2 through the chassis wall of the chassis 1, thereby achieving cooling of the coolant.

[0093] In some embodiments, the cooling mechanism 2 can also be configured as a cooling plate with a liquid cooling cavity, and the cooling plate is fixed on the inner wall of the chassis 1. The cooling medium in the liquid cooling cavity can also be used to cool and reduce the temperature of the coolant.

[0094] In some embodiments, the bubble disturbance mechanism 4 can also be configured as an extrusion mesh plate, which has a plurality of mesh holes of a certain size. The bubble 200 is extruded and deformed through the mesh holes on the extrusion mesh plate, which can also achieve the same technical effect as in this embodiment.

[0095] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. An immersion cooling device, characterized in that, include: A chassis (1) is adapted to hold a coolant for immersing an electronic device (100), the coolant being adapted to cool and reduce the temperature of the electronic device (100); A cooling mechanism (2) is installed inside the chassis (1) and is suitable for cooling the coolant. A bubble generating mechanism (3) is connected to the housing (1) and is adapted to input bubbles (200) into the coolant. The bubble generating mechanism (3) includes: Pressure tank (34); An air pipe (32) is connected to the pressure tank (34). The air pipe (32) is located inside the chassis (1) and immersed in the coolant. The air pipe (32) is provided with an air outlet (321) to output the compressed air in the pressure tank (34) through the air outlet (321) to form the bubbles (200). It also includes a bubble disturbance mechanism (4), which is disposed inside the housing (1) and is adapted to squeeze the bubble (200) to deform it; The bubble disturbance mechanism (4) includes a plurality of spaced columns (41), the columns (41) being disposed below the electronic device (100), the columns (41) being provided with extrusion parts (42), and extrusion gaps (421) for the bubbles (200) to pass through being formed between the extrusion parts (42) on two adjacent columns (41), and the extrusion gaps (421) being correspondingly disposed with respect to the air outlet (321); The extrusion section (42) is inclined relative to the column (41) so that the extrusion gap (421) forms a conical gap that is smaller at the top and larger at the bottom, so as to guide and extrude the bubble (200); The extrusion section (42) is provided in multiple intervals along the height direction of the column (41); The electronic device (100) includes: The outer casing (101) is fixed to the inner wall of the chassis (1); A radiator (102) is disposed inside the fixed housing (101); An electronic device (103) is disposed inside the fixed housing (101), a heat sink (102) is located above the electronic device (103), and a bubble disturbance mechanism (4) is located between the electronic device (103) and the air duct (32). The air bubble (200) is squeezed and deformed by the extrusion section (42) on both sides. As the air bubble (200) deforms, it drives the coolant to oscillate and generate oscillation waves.

2. The immersion cooling device according to claim 1, characterized in that, The air duct (32) is located below the electronic device (100).

3. The immersion cooling device according to claim 2, characterized in that, The electronic devices (100) and the air ducts (32) are arranged in multiple intervals along the length of the chassis (1), and the multiple air ducts (32) are arranged one-to-one with the multiple electronic devices (100).

4. The immersion cooling device according to claim 1, characterized in that, The bubble generating mechanism (3) also includes an air supply pipeline (33) located outside the housing (1), which is connected to both the pressure tank (34) and the air pipeline (32). The gas pipeline (33) is provided with a control valve (331), which is configured to be linked with the power of the electronic device (100) to control the opening and closing of the control valve (331) according to the power of the electronic device (100).

5. The immersion cooling device according to claim 4, characterized in that, The bubble generating mechanism (3) further includes an air compressor (31) connected to the pressure tank (34). The air compressor (31) is configured to: operate to fill the pressure tank (34) with compressed air when the internal pressure of the pressure tank (34) is lower than a first set value, and stop operating when the internal pressure of the pressure tank (34) is higher than a second set value.

6. The immersion cooling device according to claim 1, characterized in that, The heat sink (102) includes a plurality of heat dissipation fins (1021) spaced apart along the length of the fixed housing (101), and the distance from the heat dissipation fins (1021) on both sides to the electronic device (103) is L1, and the distance from the heat dissipation fins (1021) in the middle part to the electronic device (103) is L2, so L1 < L2.

7. The immersion cooling device according to claim 6, characterized in that, The line connecting the ends of the plurality of heat dissipation fins (1021) facing the electronic device (103) is arc-shaped.

8. The immersion cooling device according to any one of claims 1 to 7, characterized in that, The cooling mechanism (2) includes a circulating cooling pipe (21) disposed in the chassis (1), the circulating cooling pipe (21) being adapted to contain a cooling medium, the cooling medium being adapted to exchange heat with the coolant.

9. The immersion cooling device according to claim 8, characterized in that, The cooling mechanism (2) also includes a plurality of heat exchange fins (22), which are spaced apart along the length of the circulating cooling pipe (21).

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