Cpu module assembly method, detection method, and detection device

Abstract

The application discloses a CPU module assembling method, a detection method and a detection device, and relates to the technical field of CPU intelligent assembling, and comprises the following steps: placing a CPU in a positioning jig of a supporting platform; inserting a CPU support in a bent state into the positioning jig, so that a first buckle and a second buckle at the bottom of the CPU support are respectively clamped to the bottom of two sides of the CPU; removing the bottom cover of a heat radiator to expose a silicone layer; and aligning and pressing the silicone layer of the heat radiator to the CPU, so that the technical effects are as follows: (1) a CPU module assembling method is developed, the CPU support is inserted into the positioning jig in a bent state, the quick assembling of the CPU support and the CPU is realized, and the assembling efficiency is high; and (2) a CPU module assembling quality detection method is developed, whether the first gap and the second gap on two sides of the CPU module are within a threshold range is recognized through a CCD camera, and whether the assembling of the CPU module is qualified is accurately determined.

Description

Technical Field

[0001] This invention relates to the field of CPU intelligent assembly technology, and in particular to a CPU module assembly method, testing method and testing device. Background Technology

[0002] The assembly of servers, computers, and other equipment includes the assembly of memory modules, power supplies, CPUs, fiber optic modules, etc. Currently, assembly is mainly done manually, which has the drawbacks of low efficiency and high error rate.

[0003] To improve the efficiency of assembling servers, computers, and other equipment, and to reduce the assembly error rate, it is necessary to develop a set of intelligent CPU assembly equipment. How to efficiently assemble CPU modules and how to efficiently test the quality of CPU modules are technical challenges that need to be overcome. Summary of the Invention

[0004] To address the aforementioned technical problems, the present invention aims to disclose a CPU module assembly method, a testing method, and a testing device, thereby improving assembly efficiency and testing efficiency.

[0005] The first objective of this invention is to provide a method for assembling a CPU module.

[0006] The second objective of this invention is to provide a method for inspecting the assembly quality of CPU modules.

[0007] The third objective of this invention is to provide a CPU module assembly quality inspection device.

[0008] To achieve the first objective mentioned above, this invention provides a CPU module assembly method, comprising the following steps:

[0009] The CPU is placed inside the positioning fixture of the supporting platform;

[0010] The CPU bracket is inserted into the positioning fixture in a bent state, so that the first and second latches at the bottom of the CPU bracket respectively engage with the bottom of both sides of the CPU.

[0011] Remove the bottom cover of the heatsink to expose the thermal paste layer;

[0012] Align the thermal paste layer of the heatsink with the CPU and press it down.

[0013] To achieve the second objective mentioned above, this invention provides a method for inspecting the assembly quality of a CPU module, comprising the following steps:

[0014] The width of the first gap on the first side of the CPU module is identified by the CCD camera as L. If L > the threshold, the CPU module assembly is deemed unqualified. If L ≤ the threshold, the first side of the CPU module assembly is deemed qualified.

[0015] The width of the second gap on the second side of the CPU module is identified by the CCD camera as M. If M > the threshold, the CPU module assembly is deemed unqualified. If M ≤ the threshold, the assembly of the second side of the CPU module is deemed qualified.

[0016] To achieve the second objective mentioned above, the present invention also provides a method for inspecting the assembly quality of a CPU module, comprising the following steps:

[0017] The CCD camera identifies the widths of the two ends of the first gap on the first side of the CPU module as L1 and L2, respectively. If L1 > threshold or L2 > threshold, the CPU module assembly is deemed unqualified. If L1 ≤ threshold and L2 ≤ threshold, the first side of the CPU module assembly is deemed qualified.

[0018] The CCD camera identifies the widths of the two ends of the second gap on the second side of the CPU module as M1 and M2, respectively. If M1 > threshold or M2 > threshold, the CPU module assembly is deemed unqualified. If M1 ≤ threshold and M2 ≤ threshold, the second side of the CPU module assembly is deemed qualified.

[0019] Preferably, a first gap and a second gap are formed at the junction of the CPU bracket and the heatsink.

[0020] To achieve the third objective mentioned above, the present invention provides a CPU module assembly quality inspection device, including a positioning fixture, a CPU module quality inspection module, and a CCD camera;

[0021] The positioning fixture includes a CPU slot and a CPU bracket slot;

[0022] The CPU module quality inspection module includes a robotic arm and a CPU module gripper. The robotic arm is equipped with a swing mechanism and a rotation mechanism. The swing mechanism drives the rotation mechanism to swing, and the rotation mechanism drives the CPU module gripper to flip.

[0023] Preferably, the swing angle of the swing mechanism is ±90°.

[0024] Preferably, the CPU module gripper includes a first pneumatic gripper and a second pneumatic gripper, which clamp the CPU module close to each other.

[0025] Preferably, the first pneumatic gripper is provided with a first L-shaped step, and the second pneumatic gripper is provided with a second L-shaped step;

[0026] The first L-shaped step and the second L-shaped step respectively support the two sides of the bottom of the CPU module.

[0027] Preferably, the CPU module gripper further includes a fixing plate, with uprights provided at the four corners of the fixing plate;

[0028] The column is provided with steps, and a buffer spring is provided between the steps and the fixing plate.

[0029] Preferably, the four pillars abut against the four corners of the top of the CPU module.

[0030] Compared with the prior art, the technical effects of the present invention are as follows:

[0031] (1) A CPU module assembly method was developed, in which the CPU bracket is inserted into the positioning fixture in a bent state, thereby realizing the rapid assembly of the CPU bracket and the CPU with high assembly efficiency.

[0032] (2) A method for detecting the assembly quality of a CPU module was developed. The method uses a CCD camera to identify whether the first gap and the second gap on both sides of the CPU module are within the threshold range, thereby accurately determining whether the assembly of the CPU module is qualified.

[0033] (3) A CPU module assembly quality inspection device was developed. The CPU module clamp is driven to flip by a rotating mechanism, so that the CPU module is flipped. The flipping angle is ±180°. The device can identify whether the first gap and the second gap on both sides of the CPU module are within the threshold range by a CCD camera, and determine whether the assembly of the CPU module is qualified. Attached Figure Description

[0034] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0035] Figure 1 This is a flowchart of the assembly method of the present invention.

[0036] Figure 2 This is a three-dimensional structural diagram of the positioning fixture of the present invention.

[0037] Figure 3 This is the present invention. Figure 2 Schematic diagram of the magnified part of the mechanism.

[0038] Figure 4 This is a schematic diagram of the three-dimensional structure of the CPU bracket of the present invention.

[0039] Figure 5 This is a three-dimensional structural diagram of the heat sink of the present invention.

[0040] Figure 6 It is a side view schematic diagram of the CPU module of the present invention.

[0041] Figure 7 It is a flowchart of the detection method of the present invention.

[0042] Figure 8 It is a flowchart of the detection method of the present invention.

[0043] Figure 9 It is a three-dimensional structure schematic diagram of the detection device of the present invention.

[0044] Figure 10 It is a three-dimensional structure schematic diagram of the CPU module clamping hand of the present invention.

[0045] Among them, 1, positioning fixture; 11, CPU card slot; 12, CPU bracket card slot; 2, CPU bracket; 21, first buckle; 22, second buckle; 3, radiator; 31, bottom cover; 4, manipulator; 41, swing mechanism; 42, rotation mechanism; 5, CPU module clamping hand; 51, first pneumatic clamp; 52, second pneumatic clamp; 53, fixing plate; 54, column; 541, step; 55, buffer spring; 6, CPU module; 7, CCD camera. Specific embodiments

[0046] The present invention will be described in detail below with reference to the embodiments shown in the drawings. However, it should be noted that these embodiments are not limitations of the present invention, and equivalent transformations or substitutions in terms of functions, methods, or structures made by those of ordinary skill in the art based on these embodiments all fall within the protection scope of the present invention.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0048] Embodiment

[0049] Refer Figure 1 As shown, this embodiment discloses a specific implementation of a CPU module assembly method (hereinafter referred to as "assembly method").

[0050] The CPU module assembly method, refer Figure 1 As shown, includes the following steps:

[0051] Step S1: Place the CPU in the positioning fixture on the support platform; for the positioning fixture, refer to Figure 2 and Figure 3 , the positioning fixture 1 includes a CPU card slot 11 and a CPU bracket card slot 12. Step S1 is to place the CPU in the CPU card slot 11 to complete the positioning of the CPU.

[0052] Step S2: Insert the CPU bracket in a bent state into the positioning fixture so that the first buckle and the second buckle at the bottom of the CPU bracket respectively engage with the bottoms on both sides of the CPU; for the CPU bracket, refer to Figure 4 , the bottom of the CPU bracket 2 is provided with a first buckle 21 and a second buckle 22. When the CPU bracket 2 is in a bent state, the first buckle 21 and the second buckle 22 are in an open state. After the CPU bracket 2 in a bent state is inserted into the CPU bracket card slot 12 of the positioning fixture 1, the CPU bracket 2 returns to a flat state through its own elasticity, so that the first buckle 21 and the second buckle 22 respectively engage with the bottoms on both sides of the CPU, realizing the assembly between the CPU bracket 2 and the CPU.

[0053] Step S3: Remove the bottom cover of the radiator to expose the silicone grease layer; specifically, for the three-dimensional schematic diagram of the radiator, refer to Figure 5 , when the CPU bracket 2 and the CPU are assembled, it is necessary to further assemble the radiator. The bottom of the radiator 3 has a bottom cover 31. Before assembly, the bottom cover 31 is used to shield and protect the silicone grease layer. The purpose of Step S3 is to remove the bottom cover 31 to expose the silicone grease layer, providing preparation for the application on the surfaces of the radiator 3 and the CPU.

[0054] Step S4: Align the silicone grease layer of the radiator with the CPU and press. Specifically, the purpose of the silicone grease layer is to fill the narrow gap between the radiator 3 and the CPU to ensure the heat dissipation efficiency. After the CPU, the CPU bracket 2 and the radiator 3 are assembled, a CPU module is formed. For the schematic diagram of the CPU module, refer to Figure 6 .

[0055] Example 1 developed a method for assembling a CPU module. The CPU bracket 2 in a bent state is inserted into the CPU bracket card slot 12 of the positioning fixture 1, realizing the rapid assembly of the CPU bracket 2 and the CPU, with high assembly efficiency.

[0056] Example 2

[0057] Refer Figure 7 as shown, this example discloses a specific implementation manner of a method for detecting the assembly quality of a CPU module (hereinafter referred to as the "detection method").

[0058] The method for detecting the assembly quality of a CPU module, refer <​​

[0059] Step A1: Identify the width of the first gap on the first side of the CPU module as L through a CCD camera. If L > the threshold value, it is determined that the assembly of the CPU module is unqualified. If L ≤ the threshold value, it is determined that the assembly of the first side of the CPU module is qualified;

[0060] Step A2: Identify the width of the second gap on the second side of the CPU module as M through a CCD camera. If M > the threshold value, it is determined that the assembly of the CPU module is unqualified. If M ≤ the threshold value, it is determined that the assembly of the second side of the CPU module is qualified.

[0061] [[ID=*7]] Figure 9 is a schematic three-dimensional structure diagram of the CPU module quality detection module, including a manipulator 4 and a CPU module gripper 5. The manipulator 4 is provided with a swing mechanism 41 and a rotation mechanism 42. The swing mechanism 41 drives the rotation mechanism 42 to swing, and the rotation mechanism 42 drives the CPU module gripper 5 to flip; When forming a CPU module using the assembly method described in Embodiment 1, for the schematic diagram of the CPU module, see Figure 6 , a first gap 61 and a second gap 62 are formed at the joint of the CPU bracket 2 and the radiator 3; The detection process is as follows: First, drive the CPU module gripper 5 to hold the CPU module through the manipulator 4, and then swing the swing mechanism 41 by 90°, so that the first slit 61 of the CPU module 6 faces the CCD camera 7. Identify the width of the first slit 61 as L through the CCD camera 7. If L > the threshold value, it means that the assembly of the CPU, CPU bracket 2, and radiator 3 is not in place, and it is determined that the assembly of the CPU module is unqualified. If L ≤ the threshold value, it is determined that the assembly of the first side of the CPU module is qualified; After determining that the first slit 61 is qualified, drive the CPU module gripper 5 to flip 180° through the rotation mechanism 42, so that the second slit faces the CCD camera 7. Identify the width of the second gap 62 on the second side of the CPU module as M through the CCD camera 7. If M > the threshold value, it means that the assembly of the CPU, CPU bracket 2, and radiator 3 is not in place, and it is determined that the assembly of the CPU module is unqualified. If M ≤ the threshold value, it is determined that the assembly of the second side of the CPU module is qualified. Embodiment 2 determines whether the CPU module is assembled qualified by whether the widths of the first slit 61 and the second slit 62 on both sides of the CPU module are within the threshold range, with high detection efficiency and high accuracy.

[0062] Embodiment 3

[0063] Refer to Figure 8 As shown, this embodiment discloses a specific implementation of a CPU module assembly quality detection method (hereinafter referred to as "detection method").

[0064] The CPU module assembly quality detection method, refer to Figure 8 As shown, includes the following steps:

[0065] Step B1: Use a CCD camera to identify that the widths of both ends of the first gap on the first side of the CPU module are L1 and L2 respectively. If L1 > threshold or L2 > threshold, it is determined that the assembly of the CPU module is unqualified. If L1 ≤ threshold and L2 ≤ threshold, it is determined that the assembly of the first side of the CPU module is qualified;

[0066] Step B2: Use a CCD camera to identify that the widths of both ends of the second gap on the second side of the CPU module are M1 and M2 respectively. If M1 > threshold or M2 > threshold, it is determined that the assembly of the CPU module is unqualified. If M1 ≤ threshold and M2 ≤ threshold, it is determined that the assembly of the second side of the CPU module is qualified.

[0067] Based on Embodiment 2, in Embodiment 3, use a CCD camera to identify that the widths of both ends of the first gap 61 are L1 and L2 respectively. If L1 > threshold or L2 > threshold, it is determined that the assembly of the CPU module is unqualified. If L1 ≤ threshold and L2 ≤ threshold, it is determined that the assembly of the first side of the CPU module is qualified; There may be a situation where the two ends of the joint surface between the CPU bracket 2 and the radiator 3 are inconsistent, that is, the widths of both ends of the first slit 61 are inconsistent. This situation also needs to be determined as unqualified. Step B1 determines that the assembly of the first side of the CPU module is qualified only when L1 ≤ threshold and L2 ≤ threshold by identifying the widths L1 and L2 of both ends of the first gap 61; Similarly, when detecting the second slit 62, it is determined that the assembly of the second side of the CPU module is qualified when M1 ≤ threshold and M2 ≤ threshold.

[0068] For the technical solutions with the same parts in the method for detecting the assembly quality of a CPU module disclosed in this embodiment and Embodiment 2, please refer to what is described in Embodiment 2 and will not be elaborated here.

[0069] Embodiment 4

[0070] Refer Figure 9 and Figure 10 As shown, this embodiment discloses a specific implementation manner of a device for detecting the assembly quality of a CPU module (hereinafter referred to as the "detection device").

[0071] The device for detecting the assembly quality of a CPU module includes a positioning fixture 1, a CPU module quality detection module, and a CCD camera 7; The positioning fixture 1 includes a CPU card slot 11 and a CPU bracket card slot 12. The CPU card slot 11 is used to place and position the CPU, and the CPU bracket card slot 12 is used to place and position the CPU bracket 2; The CPU module quality detection module includes a manipulator 4 and a CPU module gripper 5. The manipulator 4 is provided with a swing mechanism 41 and a rotation mechanism 42. The swing mechanism 41 drives the rotation mechanism 42 to swing, and the rotation mechanism 42 drives the CPU module gripper to flip. The swing angle of the swing mechanism 41 is ±90°.

[0072] Specifically, the CPU module is assembled according to the assembly method described in Example 1. The detection method described in Example 2 or Example 3 is executed by the detection device of Example 4. The specific detection process is as follows: First, the CPU module is clamped by the CPU module gripper 5 driven by the robot arm 4. Then, the CPU module is swung 90° by the swing mechanism 41 so that the first slit 61 of the CPU module 6 faces the CCD camera 7. After the first slit 61 is detected, the CPU module 6 is rotated 180° by the rotation mechanism 42 so that the second slit 62 faces the CCD camera 7. The second slit 62 is then detected.

[0073] The purpose of CPU module clamp 5 is to clamp CPU module 6 and prevent displacement during the testing process. The structural principle of CPU module 6 is as follows: (See attached image) Figure 10 The CPU module gripper 5 includes a first pneumatic gripper 51 and a second pneumatic gripper 52, which clamp the CPU module 6 close to each other. To restrict the bottom of the CPU module 6, the first pneumatic gripper 51 is provided with a first L-shaped step 511, and the second pneumatic gripper 52 is provided with a second L-shaped step. The second L-shaped step is not shown due to obstruction, but its structure is the same as the first L-shaped step 511. The first L-shaped step 511 and the second L-shaped step respectively support the two sides of the bottom of the CPU module 6. To restrict the top of the CPU module 6, the CPU module gripper 5 also includes a fixing plate 53, with posts 54 respectively provided at the four corners of the fixing plate 53. The posts 54 are provided with steps 541, and a buffer spring 55 is provided between the steps 541 and the fixing plate 53. The four posts 54 abut against the four corners of the top of the CPU module 6, and the top of the CPU module 6 is restricted by the buffer spring 55. The CPU module 6 is restricted on both sides by the first pneumatic gripper 51 and the second pneumatic gripper 52, the top of the CPU module 6 is restricted by the column 54 and the buffer spring 55, and the bottom of the CPU module 6 is restricted by the first L-shaped step 511 and the second L-shaped step respectively, so that the CPU module 6 is restricted in all directions and there will be no shaking or displacement during the detection process.

Claims

1. A method for inspecting the assembly quality of a CPU module, characterized in that, Includes the following steps: The width of the first gap on the first side of the CPU module is identified by the CCD camera as L. If L > the threshold, the CPU module assembly is deemed unqualified. If L ≤ the threshold, the first side of the CPU module assembly is deemed qualified. The width of the second gap on the second side of the CPU module is identified by the CCD camera as M. If M > the threshold, the CPU module assembly is deemed unqualified. If M ≤ the threshold, the assembly of the second side of the CPU module is deemed qualified. The first gap and the second gap are formed at the junction of the CPU bracket and the heatsink; The CPU module is held by a gripper driven by a robotic arm, and then swung 90° by a swing mechanism so that the first slit of the CPU module faces the CCD camera. The width of the first slit is identified as L by the CCD camera. After determining the first slit grid, the CPU module gripper is rotated 180° by the rotating mechanism so that the second slit faces the CCD camera. The CCD camera identifies the width of the second slit on the second side of the CPU module as M. The robotic arm is equipped with a swing mechanism and a rotation mechanism. The swing mechanism drives the rotation mechanism to swing, and the rotation mechanism drives the CPU module to rotate the gripper. The CPU module gripper includes a first pneumatic gripper and a second pneumatic gripper, which clamp the CPU module close to each other. The first pneumatic gripper is provided with a first L-shaped step, and the second pneumatic gripper is provided with a second L-shaped step; The first L-shaped step and the second L-shaped step respectively support the two sides of the bottom of the CPU module; The CPU module gripper also includes a fixing plate, with uprights at each of the four corners of the fixing plate; The column is provided with steps, and a buffer spring is provided between the steps and the fixing plate; The top of the CPU module is secured by a column and a buffer spring.

2. A method for inspecting the assembly quality of a CPU module, characterized in that, Includes the following steps: The CCD camera identifies the widths of the two ends of the first gap on the first side of the CPU module as L1 and L2, respectively. If L1 > threshold or L2 > threshold, the CPU module assembly is deemed unqualified. If L1 ≤ threshold and L2 ≤ threshold, the first side of the CPU module assembly is deemed qualified. The CCD camera identifies the widths of the two ends of the second gap on the second side of the CPU module as M1 and M2, respectively. If M1 > threshold or M2 > threshold, the CPU module assembly is deemed unqualified. If M1 ≤ threshold and M2 ≤ threshold, the second side of the CPU module assembly is deemed qualified. The first gap and the second gap are formed at the junction of the CPU bracket and the heatsink; The CPU module is held by a gripper driven by a robotic arm, and then swung 90° by a swing mechanism so that the first slit of the CPU module faces the CCD camera. The CCD camera identifies the widths of the two ends of the first slit as L1 and L2, respectively. After determining the first slit grid, the CPU module gripper is rotated 180° by the rotating mechanism so that the second slit faces the CCD camera. The CCD camera identifies the widths of the two ends of the second slit on the second side of the CPU module as M1 and M2, respectively. The robotic arm is equipped with a swing mechanism and a rotation mechanism. The swing mechanism drives the rotation mechanism to swing, and the rotation mechanism drives the CPU module to rotate the gripper. The CPU module gripper includes a first pneumatic gripper and a second pneumatic gripper, which clamp the CPU module close to each other. The first pneumatic gripper is provided with a first L-shaped step, and the second pneumatic gripper is provided with a second L-shaped step; The first L-shaped step and the second L-shaped step respectively support the two sides of the bottom of the CPU module; The CPU module gripper also includes a fixing plate, with uprights at each of the four corners of the fixing plate; The column is provided with steps, and a buffer spring is provided between the steps and the fixing plate; The top of the CPU module is secured by a column and a buffer spring.

3. A CPU module assembly quality inspection device, characterized in that, The CPU module assembly quality inspection method according to claim 1 or claim 2 includes a positioning fixture, a CPU module quality inspection module, and a CCD camera; The positioning fixture includes a CPU slot and a CPU bracket slot; The CPU module quality inspection module includes a robotic arm and a CPU module gripper. The robotic arm is equipped with a swing mechanism and a rotation mechanism. The swing mechanism drives the rotation mechanism to swing, and the rotation mechanism drives the CPU module gripper to flip. The CPU module gripper includes a first pneumatic gripper and a second pneumatic gripper, which clamp the CPU module close to each other. The first pneumatic gripper is provided with a first L-shaped step, and the second pneumatic gripper is provided with a second L-shaped step; The first L-shaped step and the second L-shaped step respectively support the two sides of the bottom of the CPU module; The CPU module gripper also includes a fixing plate, with uprights at each of the four corners of the fixing plate; The column is provided with steps, and a buffer spring is provided between the steps and the fixing plate; The top of the CPU module is secured by a column and a buffer spring.

4. The CPU module assembly quality inspection device as described in claim 3, characterized in that, The swing angle of the swing mechanism is ±90°.

5. The CPU module assembly quality inspection device as described in claim 3, characterized in that, The four pillars support the four corners of the top of the CPU module.

Images