Placement device with transfer function
By designing a placement device with transfer function, the problem of insufficient precision of existing ink printing technology is solved, high-precision paint transfer and equipment resource sharing are achieved, and costs are reduced.
Patent Information
- Application Number
- CN202310648917.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-02
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2043-06-02
AI Technical Summary
Existing ink printing technology lacks precision and cannot meet the needs of miniaturization of electronic products. In addition, existing transfer equipment is expensive and has low production efficiency, and the cleaning device needs to be externally installed.
A placement device with transfer function is designed, which includes a conveying module, a carrier module, a feeding module, a rotating placement module and a transfer module. The control module coordinates the movement of each part to achieve precise transfer and cleaning of the paint.
The printing accuracy has been improved to ±20μm, reducing the purchase and maintenance costs of dedicated transfer equipment, and achieving resource sharing and improved production efficiency.
Smart Images
Figure CN116749638B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a component placement device, in particular to a component placement device with a transfer function. Background Art
[0002] One existing method for printing ink (conductive adhesive) involves applying a screen to the surface of a product's interconnecting board and then using a scraper to print the deposited ink (conductive adhesive) through the screen's openings onto the product's surface. However, this printing technique suffers from limited precision, typically exceeding ±100μm, making higher precision challenging. With the current trend toward miniaturization of electronic products, screen printing technology is facing increasing limitations, leading to the need for alternative technologies that can improve precision.
[0003] Another approach to ink printing technology involves using dedicated transfer equipment, dipping the transfer head into ink, and then placing the ink-soaked transfer head onto the target product according to coordinates, effectively transferring the ink. Furthermore, the transfer equipment can be equipped with an external tape cleaning device, which allows the transfer head to be attached to the tape after the transfer is complete, utilizing the tape's stickiness to clean the transfer head. However, this printing technology also presents the following technical issues: 1. Dedicated transfer equipment is required, resulting in equipment purchase and maintenance costs; 2. The production efficiency of existing transfer technology is low; 3. While the maximum positional accuracy of existing transfer technology is around 50μm, which is higher than that of printing technology, it still cannot achieve the 20μm accuracy of a placement machine; and 4. The cleaning device requires an external attachment.
[0004] Therefore, how to overcome the above-mentioned defects through improvement of structural design has become one of the important issues that the technical field wants to solve. Summary of the Invention
[0005] The technical problem to be solved by the present invention is to provide a placement device with a transfer function in view of the deficiencies in the prior art.
[0006] To address the aforementioned functional issues, one of the technical solutions employed by the present invention is to provide a placement device with transfer functionality, comprising a device body, at least one conveying module, at least one first carrier module, at least one first feeding module, at least one first rotating placement module, multiple first transfer modules, an image capture module, and a control module. The at least one conveying module is movably disposed within the device body and is used to carry and transport at least one substrate. The at least one first carrier module is detachably disposed within the device body and adjacent to the at least one conveying module. The at least one first feeding module is detachably disposed within the at least one first carrier module and is used to supply coating. At least one first rotating placement module is movably disposed within the device body and adjacent to the at least one conveying module or the at least one first carrier module. The at least one first rotating placement module has multiple first chucks. Each of the multiple first transfer modules is detachably disposed within one of the first chucks. An image capture module is disposed within the device body or the at least one first rotating placement module and is used to capture an image of the substrate surface. A control module is disposed within the apparatus body and is electrically connected to the at least one conveying module, the at least one first carrier module, the at least one first rotating module, and the image capture module. The at least one first rotating module is configured to drive the plurality of first transfer modules to move and contact the substrate or the coating.
[0007] Preferably, when the control module receives the material contact command, the control module drives the at least one first rotary placement module to perform a first movement action to drive the plurality of first transfer modules to approach the at least one first feeding module, and the control module drives the at least one first rotary placement module to perform a rotation action so that the at least one first rotary placement module drives the plurality of first transfer modules to contact the coating in sequence.
[0008] Preferably, when the control module receives a coating command, the control module drives the at least one first rotary placement module to perform a second displacement action to drive the plurality of first transfer modules to approach the substrate, and the control module drives the at least one first rotary placement module to perform the rotation action to make the plurality of first transfer modules contact the substrate in sequence, thereby transferring the coating to the substrate.
[0009] Preferably, the first feeding module includes a first feeder and a scraper. The first feeder is detachably mounted on the at least one first carrier module and includes a storage trough for storing the paint. The scraper is movably mounted on the first feeder and positioned within the storage trough. The scraper is configured to move back and forth within the storage trough to evenly coat the paint within the trough.
[0010] Preferably, the placement device with transfer function further comprises at least one second feeding module, which is detachably mounted on the at least one first carrier module, and is used to provide adhesive.
[0011] Preferably, when the control module receives a cleaning command, the control module drives the at least one first rotary placement module to perform a third displacement action to drive the plurality of first transfer modules to approach the at least one second feeding module, and the control module drives the at least one first rotary placement module to perform a rotation action so that the at least one first rotary placement module drives the plurality of first transfer modules to sequentially contact the adhesive.
[0012] Preferably, when the control module receives a reset command, the control module drives the at least one first rotary placement module to perform a fourth displacement action, so as to move the at least one first rotary placement module away from the at least one second feeding module.
[0013] Preferably, the at least one second feeding module includes a second loader and a glue carrier, the second loader can be detachably arranged on the at least one first carrier module, the glue carrier can be movably arranged on the second loader, and the glue carrier is used to carry and provide the adhesive.
[0014] Preferably, when the control module receives a scrolling command, the control module drives the second loader to roll the adhesive carrier, so that the plurality of first transfer modules can contact the adhesive at different positions on the surface of the adhesive carrier.
[0015] Preferably, the at least one first rotating placement module includes a first drive element and a first rotating element. The first drive element is movably disposed within the device body and adjacent to the at least one conveying module or the at least one first carrier module. The first rotating element is movably disposed within the first drive element and includes the plurality of first chuck sections. The first drive element is configured to drive the first rotating element to move, and the first rotating element is configured to drive the at least one first transfer module to contact the substrate or the coating.
[0016] One of the beneficial effects of the present invention is that the placement device with a transfer function provided by the present invention can achieve the function of transferring conductive adhesive through the technical solution of "the at least one first feeding module can be detachably arranged on the at least one first carrier module, and the at least one first feeding module is used to provide coating. The multiple first transfer modules can be detachably arranged on one of the first chuck parts respectively. The at least one first rotating placement module is used to drive the multiple first transfer modules to move, and drive the at least one first transfer module to contact the substrate or the coating", which embodies resource sharing with the placement device and reduces the cost of purchasing and maintaining special transfer equipment.
[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 FIG. 1 is a perspective schematic diagram of a placement device with a transfer function according to a first embodiment of the present invention.
[0019] Figure 2 FIG. 1 is a perspective schematic diagram of a conveying module of a placement device with a transfer function according to a first embodiment of the present invention.
[0020] Figure 3 It is a three-dimensional schematic diagram of a first carrier module and a first feeding module of a placement device with a transfer function according to a first embodiment of the present invention.
[0021] Figure 4 FIG. 1 is a perspective schematic diagram of a first rotating element of a placement device with a transfer function according to a first embodiment of the present invention.
[0022] Figure 5 FIG. 4 is a functional block diagram of a placement device with transfer function according to a first embodiment of the present invention.
[0023] Figure 6 Schematic diagram of the first feeding module and the first transfer module of the placement device with transfer function according to the first embodiment of the present invention in use.
[0024] Figure 7 Schematic diagram of the second feeding module and the first transfer module of the placement device with transfer function according to the first embodiment of the present invention in use.
[0025] Figure 8 It is a three-dimensional schematic diagram of a first carrier module and a second feeding module of a placement device with a transfer function according to a first embodiment of the present invention.
[0026] Figure 9 It is a perspective schematic diagram of a second carrier module and a third feeding module of a placement device with a transfer function according to a second embodiment of the present invention.
[0027] The reference numerals are as follows:
[0028] Z: a placement device with transfer function, 1: device body, 2: conveying module, 3A: first carrier module, 4A: first feeding module, 40A: first material loader, 400a: material storage trough, 400b: printing plate, 41A: scraper, 5A: first rotary placement module, 50A: first driving element, 51A: first rotating element, 510A: first chuck, 6: first transfer module, 7: image acquisition module, 8: control module, 3B: second carrier module, 4B: second feeding module, 40B: second material loader, 41B: adhesive carrier, 5B: second rotary placement module, 50B: second driving element, 51B: second rotating element, 510B: first chuck, 4C: third feeding module, C: coating, E: accessories, S: substrate, S1: processing block, T: adhesive. DETAILED DESCRIPTION
[0029] The following is an explanation of the implementation of the "mounting device with transfer function" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. Please note in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.
[0030] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, depending on the actual situation.
[0031] First embodiment
[0032] See also Figures 1 to 8, respectively, a perspective schematic diagram of a placement device with a transfer function according to a first embodiment of the present invention, a perspective schematic diagram of a conveying module, a perspective schematic diagram of a first carrier module and a first feeding module, a perspective schematic diagram of a first rotating element, a functional block diagram, a schematic diagram of the first feeding module and the first transfer module in use, a schematic diagram of the second feeding module and the first transfer module in use, and a perspective schematic diagram of the first carrier module and the second feeding module. As shown in the above figures, the first embodiment of the present invention provides a placement device Z with a transfer function, comprising a device body 1, at least one conveying module 2, at least one first carrier module 3A, at least one first feeding module 4A, at least one first rotating placement module 5A, multiple first transfer modules 6, an image capture module 7, and a control module 8.
[0033] Cooperate Figure 1 As shown, the device body 1 of the present invention can be the main structure of a mounting device using surface mount technology (SMT).
[0034] Next, cooperate Figure 1 and Figure 2 As shown, the conveyor module 2 can be movably disposed within the apparatus body 1. The conveyor module 2 is used to carry and transport at least one substrate S. For example, the conveyor module 2 can be an object transport device such as a conveyor belt or a conveyor track. The conveyor module 2 is disposed within the apparatus body 1. In this embodiment, the apparatus body 1 is provided with a single conveyor module 2, but this is not limiting.
[0035] Next, cooperate Figure 1 and Figure 3 As shown, the first carrier module 3A is detachably disposed on the device body 1 and adjacent to the at least one conveying module 2. For example, the first carrier module 3A may be a mechanical trolley, which may be used to carry and load the at least one first feeding module 4A.
[0036] Next, cooperate Figure 1 、 Figure 3 、 Figure 4 and Figure 5As shown, the first feeding module 4A can be detachably mounted on at least one first carrier module 3A, and the at least one first feeding module 4A is used to provide a coating C. For example, the first feeding module 4A can be a specially designed feeder. The first feeding module 4A can include a first feeder 40A and a scraper 41A. The first feeder 40A can be detachably mounted on at least one first carrier module 3A and adjacent to at least one conveying module 2. The first feeder 40A can have a storage trough 400a, and the storage trough 400a is used to store the coating C; wherein the coating C can be conductive glue or ink, but is not limited thereto. The scraper 41A can be movably mounted on the first feeder 40A and located in the storage trough 400a. The scraper 41A is used to perform a reciprocating movement in the storage trough 400a so that the coating C is evenly covered in the storage trough 400a. Among them, the scraper 41A can be electrically connected to the controller of the first carrier module 3A, the controller of the first loader 40A or the control module 8; and in this embodiment, a first feeding module 4A is set on the first carrier module 3A, and the scraper 41A is electrically connected to the control module 8 as an example, but it is not limited to this.
[0037] Next, cooperate Figure 1 、 Figure 4 and Figure 5 As shown, a first rotary insert module 5A is movably disposed within the apparatus body 1, adjacent to at least one conveying module 2 or at least one first carrier module 3A. The at least one first rotary insert module 5A has a plurality of first chuck sections 510A. The at least one first rotary insert module 5A is configured to drive the plurality of first transfer modules 6 to move and to force the at least one first transfer module 6 into contact with a substrate S or a coating C. For example, the at least one first rotary insert module 5A may include a first drive element 50A and a first rotating element 51A. The first drive element 50A is movably disposed within the apparatus body 1, adjacent to at least one conveying module 2 or at least one first carrier module 3A. The first rotating element 51A is movably disposed within the first drive element 50A and may have a plurality of first chuck sections 510A. The first drive element 50A is configured to drive the first rotating element 51A to move and to force the at least one first transfer module into contact with a substrate S or a coating C. Specifically, the first driving element 50A can be a two-axis or multi-axis displacement device, configured to drive the first rotating element 51A to a position corresponding to the first loader 40A or the conveyor module 2. The first rotating element 51A can be a rotary placement head device. The first rotating element 51A can have an inclination relative to the device body 1, the conveyor module 2, and the first feeding module 4A, such as, but not limited to, 45 degrees. The first clamping portion 510A can be a clamping claw structure.
[0038] Next, cooperate Figure 4 and Figure 6 As shown, multiple first transfer modules 6 are detachably mounted on one of the first chuck sections 510A. For example, the first transfer modules 6 can be customized with a placement head or transfer head structure, and can be made of plastic, metal, or other hard materials. In this embodiment, the first transfer modules 6 are exemplified by a T-shape, but are not limited thereto.
[0039] Next, cooperate Figure 1 and Figure 5 As shown, the image capture module 7 is disposed on the apparatus body 1 or at least one of the first rotating mounting modules 5A. The image capture module 7 is used to capture an image of the surface of the substrate S. For example, the image capture module 7 can capture an image of the surface of the substrate S according to preset software instructions or operator control to generate a surface image; the surface image is an image that divides the surface of the substrate S into multiple sections. Furthermore, the image capture module 7 can be connected to the first driving element 50A or movably disposed on the apparatus body 1 via another independent driving element (a two-axis or multi-axis displacement device).
[0040] Next, cooperate Figure 1 and Figure 5 As shown, a control module 8 is disposed within the apparatus body 1. The control module 8 is electrically connected to at least one conveying module 2, at least one first carrier module 3A, at least one first rotating placement module 5A, and the image capture module 7. For example, the control module 8 may be a controller for the SMT placement equipment, such as a circuit board with processing and control functions, but the present invention is not limited thereto. The control module 8 is detachably mounted on the apparatus body 1.
[0041] Therefore, when the control module 8 receives a contact instruction, the control module 8 drives the at least one first rotary placement module 5A to perform a first movement to drive the plurality of first transfer modules 6 to approach the at least one first feeding module 4A. Furthermore, the control module 8 drives the at least one first rotary placement module 5A to perform a rotational movement to cause the at least one first rotary placement module 5A to drive the plurality of first transfer modules 6 to contact the coating C in sequence.
[0042] For example, with Figures 1 to 6 As shown, during operation of the transfer device Z of the present invention, the control module 8 can, based on preset instructions or operator control, drive the image capture module 7 to capture an image of the surface of the substrate S to generate a board surface image. The image capture module 7 can identify multiple processing areas S1 on the substrate S.
[0043] Then, when the control module 8 receives a material contact command (such as a preset instruction of a software program or an instruction provided by an operator), the control module 8 controls the first driving element 50A to perform the first movement (i.e., drives the first rotating element 51A to move and approach the first hopper 40A of the first feeding module 4A), and the control module 8 also controls the first rotating element 51A to rotate so that the multiple first transfer modules 6 on the first rotating element 51A contact the paint C in the material storage tank 400a of the first hopper 40A in sequence.
[0044] It is worth noting that when the control module 6 receives a wiping command, it can drive the scraper 41A to perform a reciprocating motion within the trough 400a to evenly coat the trough 400a with the coating C. The first loader 40A can include a printing plate 400b disposed within the trough 400a. Therefore, when the scraper 41A performs a reciprocating motion within the trough 400a, the scraper 41A evenly coats the printing plate 400b with the coating C, and the first transfer module 6 then smears the coating C onto the printing plate 400b.
[0045] When the control module 8 receives a coating command, the control module 8 drives the at least one first rotary placement module 5A to perform a second displacement action according to the board image, thereby driving the plurality of first transfer modules 6 to approach the substrate S. Furthermore, the control module 8 drives the at least one first rotary placement module 5A to rotate, so that the plurality of first transfer modules 6 sequentially contact the substrate S, thereby transferring the coating C to the substrate S.
[0046] For example, with Figures 1 to 6 As shown, when the control module 8 receives a coating command (e.g., a preset command in a software program or a command provided by an operator), the control module 8 can identify the positions of the multiple processing areas S1 on the substrate S based on the board surface image generated by the image capture module 7. Next, the control module 8 controls the first driving element 50A to perform a second displacement action (i.e., driving the first rotating element 51A to move closer to the substrate S on the conveying module 2). Furthermore, the control module 8 controls the first rotating element 51A to rotate so that the multiple first transfer modules 6 on the first rotating element 51A sequentially contact the surface of the substrate S. Furthermore, the first driving element 50A drives the first rotating element 51A to move in a stepwise manner in the corresponding areas of the substrate S. Simultaneously, in conjunction with the rotation of the first rotating element 51A, different first transfer modules 6 on the first rotating element 51A can contact different processing areas S1 on the substrate S, thereby transferring the coating C to the multiple processing areas S1 on the substrate S.
[0047] It is worth noting that the above transfer process can be completed by one instruction, or can be completed step by step through multiple instructions.
[0048] Thus, the transfer-capable placement device Z of the present invention utilizes the aforementioned technical solution, improves the feeder, and customizes the placement head (i.e., transfer head) to apply the first feeding module 4A and the first transfer module 6 to existing SMT placement equipment. This embodies the goal of resource sharing with the placement equipment and integrating the placement and transfer functions. This significantly improves accuracy and speed while also reducing the cost of purchasing and maintaining specialized transfer equipment. Furthermore, the transfer-capable placement device Z of the present invention utilizes the placement equipment to accurately identify the product's unit mark (or block mark) for precise positioning. It then uses the transfer head to apply conductive adhesive (ink) to the transfer head, causing it to adhere to the transfer head. The transfer head, then precisely positioned with the conductive adhesive, adheres to the target location, ensuring efficient and precise conductive adhesive transfer.
[0049] Furthermore, the placement device Z with transfer function of the present invention may further include at least one second feeding module 4B, which can be detachably mounted on at least one first carrier module 3A, and the at least one second feeding module 4B is used to provide a viscous body T. For example, Figure 1 、 Figure 4 、 Figure 7 and Figure 8 As shown, the second feeding module 4B can be a specially designed feeder. The second feeding module 4B can include a second hopper 40B and a plastic carrier 41B. The second hopper 40B can be removably mounted on at least one first carrier module 3A and adjacent to at least one conveyor module 2. The plastic carrier 41B can be movably mounted on the second hopper 40B and is used to carry and provide adhesive T; the plastic carrier 41B can be a tape or other similar object. The second hopper 40B can be electrically connected to the controller or control module 8 of the first carrier module 3A, or it can have its own controller.
[0050] Therefore, when the control module 8 receives a cleaning command, the control module 8 drives the at least one first rotary placement module 5A to perform a third displacement action to drive the plurality of first transfer modules 6 to approach the adhesive carrier 41B of the at least one second feeding module 4B. Furthermore, the control module 8 drives the at least one first rotary placement module 5A to perform a rotation action so that the at least one first rotary placement module 5A drives the plurality of first transfer modules 6 to sequentially contact the adhesive T.
[0051] For example, with Figure 1 、 Figure 4 、 Figure 7 and Figure 8As shown, after the transfer device Z of the present invention completes a specific number of transfer operations or cycles, the control module 8 may receive a material contact command (e.g., a preset command of a software program or a command provided by the operator) according to a preset command or control by the operator. At this time, the control module 8 controls the first driving element 50A to perform a third displacement action (i.e., driving the first rotating element 51A to move closer to the adhesive carrier 41B of the second feeding module 4B). In addition, the control module 8 controls the first rotating element 51A to rotate so that the multiple first transfer modules 6 on the first rotating element 51A sequentially contact the adhesive T on the surface (i.e., the adhesive surface) of the adhesive carrier 41B, thereby allowing the residual coating C on the first transfer modules 6 to adhere to the adhesive carrier 41B.
[0052] It is worth mentioning that when the control module 6 receives a scrolling command, the control module 6 can drive the second loader 40B to drive the plastic carrier 41B to perform a scrolling action, so that the first transfer modules 6 can contact the adhesive T at different positions on the surface of the plastic carrier 41B.
[0053] When the control module 8 receives a reset command, the control module 8 may drive the at least one first rotating placement module 5A to perform a fourth displacement action, so as to move the at least one first rotating placement module 5A away from the at least one second feeding module 4B.
[0054] For example, with Figure 1 、 Figure 4 、 Figure 7 and Figure 8 As shown, when the control module 8 receives a reset command (e.g., a preset command of a software program or a command provided by an operator), the control module 8 can control the first driving element 50A to perform a fourth displacement action (i.e., drive the first rotating element 51A to move away from the second feeding module 4B), so that the first rotating placement module 5A and the plurality of first transfer modules 6 are moved away from the second feeding module 4B.
[0055] Therefore, the placement device Z with transfer function of the present invention removes the conductive adhesive residue on the transfer head by using the adhesiveness of the tape, thereby achieving the purpose of automatically cleaning the transfer head.
[0056] However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0057] Second embodiment
[0058] See also Figure 9 , which is a three-dimensional schematic diagram of the second carrier module and the third feeding module of the placement device with transfer function according to the second embodiment of the present invention, and please refer to Figures 1 to 8As shown in the figure, the transfer placement device Z of this embodiment is substantially similar to the transfer placement device Z of the above-mentioned embodiment. Therefore, the configuration or operation of the same components will not be repeated here. However, the difference between the transfer placement device Z of this embodiment and the transfer placement device Z of the first embodiment is that the transfer placement device Z of this embodiment further includes at least one second carrier module 3B, at least one third feeding module 4C, and at least one second rotating placement module 5B.
[0059] Cooperate Figure 1 and Figure 9 As shown, the second carrier module 3B is detachably mounted on the device body 1. For example, the second carrier module 3B can be disposed opposite to at least one first carrier module 3A. The second carrier module 3B can be a mechanical trolley for carrying at least one third feeding module 4C.
[0060] Next, cooperate Figure 1 and Figure 9 As shown, the third feeding module 4C is detachably mounted on at least one second carrier module 3B, and the second feeding module 4C is used to provide at least one accessory E. For example, the third feeding module 4C may be a thin feeder, and the accessory E may be an electronic component.
[0061] Next, cooperate Figure 1 and Figure 4As shown, at least one second rotary placement module 5B is movably mounted on the apparatus body 1, adjacent to at least one conveying module 2 or at least one second carrier module 3B. The at least one second rotary placement module 5B has multiple second gripping sections 510B, each of which is used to pick up an accessory E. For example, the at least one second rotary placement module 5B includes a second driving element 50B and a second rotating element 51B. The second driving element 50B is movably mounted on the apparatus body 1, adjacent to at least one conveying module 2 or at least one second carrier module 3B, and corresponds to the second carrier module 3B. The structural design of the second rotary placement module 5B is similar to that of the first rotary placement module 5A and is therefore not specifically illustrated. The second rotating element 51B is movably mounted on the second driving element 50B and has multiple second gripping sections 510B. The second rotating element 51B is used to bring one of the second gripping sections 510B into contact with a substrate S or to grip an accessory E. The second driving element 50B is used to drive the second rotating element 51B to move. Furthermore, the second driving element 50B can be a two-axis or multi-axis displacement device, used to drive the second rotating element 51B to a position corresponding to the second carrier module 3B, the third feeding module 4C, or the conveyor module 2. The second rotating element 51B can be a rotary placement head device. The second rotating element 51B can have an inclination relative to the device body 1, the conveyor module 2, and the third feeding module 4C, such as, but not limited to, 45 degrees. The second clamping portion 510B can be a clamping claw structure.
[0062] Therefore, when the control module 8 receives a pick-up command, the control module 8 can drive the at least one second rotary placement module 5B to perform a fifth displacement action to approach the at least one third feeding module 4C. In addition, the control module 8 can drive the at least one second rotary placement module 5B to perform a rotation action and a pick-up action to enable the plurality of second gripping parts 510B to sequentially pick up the parts E.
[0063] For example, with Figure 1 、 Figure 2 、 Figure 4 and Figure 8 As shown, when the placement device Z with a transfer function of the present invention is in operation, when the control module 8 receives a picking command (such as a preset instruction of a software program or an instruction provided by an operator), the control module 8 controls the second driving element 50B to perform a fifth displacement action (i.e., drives the second rotating element 51B to move and approach the third feeding module 4C on the second carrier module 3B), and the control module 8 also controls the second rotating element 51B to rotate so that the multiple second clamping parts 510B on the second rotating element 51B sequentially contact and clamp the accessories E provided by the third feeding module 4C.
[0064] It is worth mentioning that when the control module 8 receives a feeding command, the control module 8 can drive the third feeding module 4C to perform a feeding action so that at least one accessory E corresponds to at least one first clamping part 510B.
[0065] When the control module 8 receives a placement command, the control module 8 can drive the at least one second rotary placement module 5B to perform a sixth displacement action based on the board surface image to drive the plurality of second gripping parts 510B to approach the substrate S. Furthermore, the control module 8 can drive the at least one second rotary placement module 5B to perform a rotation action and a placement action to enable the plurality of second gripping parts 510B to sequentially place the accessories E on the substrate S.
[0066] For example, with Figure 1 、 Figure 2 、 Figure 4 and Figure 8 As shown, when the control module 8 receives a placement command (e.g., a preset command in a software program or a command provided by an operator), the control module 8 identifies the locations of the multiple processing areas S1 on the substrate S based on the substrate surface image generated by the image capture module 7. The control module 8 then controls the second driving element 50B to perform a sixth displacement action (i.e., driving the second rotating element 51B to move closer to the substrate S on the conveyor module 2). Furthermore, the control module 8 controls the second rotating element 51B to rotate so that the multiple second chucks 510B on the second rotating element 51B sequentially contact the surface of the substrate S. Specifically, the second driving element 50B drives the second rotating element 51B to move in a stepwise manner in areas corresponding to the substrate S. Simultaneously, in conjunction with the rotation of the second rotating element 51B, different second chucks 510B on the second rotating element 51B contact different processing areas S1 on the substrate S, thereby placing the accessory E on the multiple processing areas S1 of the substrate S.
[0067] Accordingly, the placement device Z with transfer function of the present invention can simultaneously perform placement and transfer processes on the same substrate S on the same production line by respectively arranging a first carrier module 3A for loading the first feeding module 4A and the second feeding module 4B and a second carrier module 3B for loading the third feeding module 4C at both ends of the same conveying module 2, thereby embodying the purpose of sharing resources with placement equipment and integrating placement functions with transfer functions, not only greatly improving the accuracy and speed, but also reducing the cost of purchasing and maintaining special transfer equipment.
[0068] However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0069] Advantageous Effects of the Embodiments
[0070] One of the beneficial effects of the present invention is that the placement device Z with a transfer function provided by the present invention can achieve the function of transferring conductive adhesive through the technical solution of "at least one first feeding module 4A can be detachably set on at least one first carrier module 3A, and at least one first feeding module 4A is used to provide a coating C. Multiple first transfer modules 6 can be detachably set on one of the first chuck parts 510A. At least one first rotating placement module 5A is used to drive the multiple first transfer modules 6 to move, and drive at least one first transfer module 6 to contact the substrate S or the coating C". This reflects the resource sharing with the placement device, thereby reducing the cost of purchasing and maintaining special transfer equipment.
[0071] Furthermore, one of the biggest differences between the transfer technology of the placement device Z with transfer function of the present invention and the original printing technology used in the prior art is that the original printing technology positions the entire circuit board (i.e., the entire surface of the substrate S) and prints at one time; while the placement device Z with transfer function of the present invention uses a single block or a combination of multiple blocks to position the block (as shown below). Figure 6 ), after precise positioning, each piece is then coated or shipped one by one. Based on the accuracy of current placement equipment, the positioning accuracy can reach ±20μm, which is an excellent choice for products with high precision requirements.
[0072] Furthermore, the second major difference between the transfer technology of the transfer-capable placement device Z of the present invention and the original printing technology used in the prior art is that the original transfer technology requires dedicated transfer equipment (such equipment is single-function and cannot be applied to other purposes). However, based on the transfer technology used by the placement device, the present invention only requires optimization (for the placement of printing plates) of the placement device's auxiliary tool feeder (rosin dipping feeder) to meet transfer requirements, embodying the sharing of placement device components and resources. Therefore, for factories with existing SMT production lines, the transfer-capable placement device Z of the present invention can achieve the goal of sharing multiple process equipment, reducing the investment in the purchase and maintenance costs of dedicated transfer equipment, making it a very economical choice.
[0073] It can be seen that the placement device Z with transfer function of the present invention not only solves the problem of insufficient precision of the original printing technology, but also reflects the sharing of resources and components with existing SMT placement equipment, reducing the cost of purchasing and maintaining special transfer equipment.
[0074] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the description and drawings of the present invention are included in the scope of protection of the claims of the present invention.
Claims
1. A device with a transfer function, characterized in that: include: a device body; At least one conveying module, the at least one conveying module being movably disposed in the device body, the at least one conveying module being used to carry and transport at least one substrate; at least one first carrier module, the at least one first carrier module being detachably disposed on the device body and adjacent to the at least one conveying module; At least one first feeding module, the at least one first feeding module being detachably disposed on the at least one first carrier module, the at least one first feeding module being used to provide paint; At least one first rotating component module, the at least one first rotating component module being movably disposed on the device body and adjacent to the at least one conveying module or the at least one first carrier module, the at least one first rotating component module having a plurality of first chuck sections; a plurality of first transfer modules, each of which is detachably disposed on one of the first chuck sections; An image capture module, the image capture module being disposed in the device body or the at least one first rotating component module, and being used to capture a surface image of the substrate; as well as a control module, the control module being disposed in the device body and electrically connected to the at least one conveying module, the at least one first carrier module, the at least one first rotating component module, and the image capture module; The at least one first rotating placement module is used to drive the plurality of first transfer modules to move, and to drive the at least one first transfer module to contact the substrate or the coating; In which, the image extraction module can identify multiple processing blocks on the substrate, and the control module can identify the positions of the multiple processing blocks on the substrate based on the board surface image generated by the image extraction module, so that different first transfer modules can contact different processing blocks of the substrate.
2. The placement device with transfer function according to claim 1, characterized in that: When the control module receives a material contact command, the control module drives the at least one first rotary placement module to perform a first movement action to drive the plurality of first transfer modules to approach the at least one first feeding module. Furthermore, the control module drives the at least one first rotary placement module to perform a rotation action to enable the at least one first rotary placement module to drive the plurality of first transfer modules to contact the coating in sequence.
3. The placement device with transfer function according to claim 1, characterized in that: When the control module receives a coating command, the control module drives the at least one first rotary placement module to perform a second displacement action according to the plate surface image, so as to drive the plurality of first transfer modules to approach the substrate. Furthermore, the control module drives the at least one first rotary placement module to perform the rotation action, so as to make the plurality of first transfer modules contact the substrate in sequence, thereby transferring the coating to the substrate.
4. The placement device with transfer function according to claim 1, characterized in that: The at least one first feeding module comprises: A first material hopper, the first material hopper being detachably mounted on the at least one first carrier module, the first material hopper having a material storage tank for storing the paint; and a scraper, the scraper being movably disposed on the first material loader and located in the material storage trough; The scraper is used to perform a back and forth movement in the material storage tank so that the paint is evenly covered in the material storage tank.
5. The placement device with transfer function according to claim 1, characterized in that: The placement device with transfer function further includes at least one second feeding module, which is detachably mounted on the at least one first carrier module and is used to provide adhesive.
6. The placement device with transfer function according to claim 5, characterized in that: When the control module receives a cleaning command, the control module drives the at least one first rotary placement module to perform a third displacement action to drive the plurality of first transfer modules to approach the at least one second feeding module. Furthermore, the control module drives the at least one first rotary placement module to perform a rotation action to enable the at least one first rotary placement module to drive the plurality of first transfer modules to sequentially contact the adhesive.
7. The placement device with transfer function according to claim 6, characterized in that: When the control module receives the reset command, the control module drives the at least one first rotating placement module to perform a fourth displacement action, so as to move the at least one first rotating placement module away from the at least one second feeding module.
8. The placement device with transfer function according to claim 6, characterized in that: The at least one second feeding module includes a second loader and a glue carrier. The second loader can be detachably arranged on the at least one first carrier module. The glue carrier can be movably arranged on the second loader. The glue carrier is used to carry and provide the adhesive.
9. The placement device with transfer function according to claim 8, characterized in that: When the control module receives a scrolling command, the control module drives the second loader to roll the adhesive carrier, so that the plurality of first transfer modules can contact the adhesive at different positions on the surface of the adhesive carrier.
10. The placement device with transfer function according to claim 1, characterized in that: The at least one first rotating component module comprises: a first driving element, the first driving element being movably disposed on the device body and adjacent to the at least one conveying module or the at least one first carrier module; and a first rotating element, the first rotating element being movably disposed on the first driving element, the first rotating element having the plurality of first chuck portions; The first driving element is used to drive the first rotating element to move; and the first rotating element is used to drive the at least one first transfer module to contact the substrate or the coating.
Citation Information
Patent Citations
Pad printer with alignment mechanism
CN102015304A
Turntable-type pad printer with double printing heads
CN102069629A