Mask adhesion test method

Abstract

The application relates to a mask adhesion test method. The test method comprises the following steps: placing a spacer on the surface of a substrate, so that the spacer covers part of the surface of the substrate. A test mask is prepared on part of the surface of the spacer, and the test mask extends to the exposed surface of the substrate. The test mask is completely separated from the substrate by applying force to the exposed part of the spacer, and the size of the force is tested. In the test method, a spacer is arranged between the substrate and the test mask, the spacer covers part of the surface of the substrate, and part of the surface of the spacer is exposed. The test mask is completely separated from the substrate by applying force to the exposed part of the spacer, and the size of the force is tested. In this way, the adhesion between the test mask and the substrate can be reflected by the size of the force, and the adhesion between the mask and the substrate can be tested.

Description

Technical Field

[0001] This application relates to the field of electronic product manufacturing technology, and in particular to a method for testing mask adhesion. Background Technology

[0002] In the manufacturing process of electronic products, circuit fabrication is often involved. When fabricating circuits, a mask material is often used to form a mask on a substrate. Then, through operations such as exposure and development, a portion of the substrate is exposed. Finally, the corresponding circuits are formed on the exposed substrate through methods such as etching and electroplating.

[0003] During circuit fabrication, the adhesion between the mask and the substrate has a significant impact on the performance of the resulting circuit. Excessive or insufficient adhesion can lead to defective circuits, consequently reducing product yield. Please refer to [link / reference]. Figure 1 If the adhesion between the mask 200 and the substrate 100 is too weak, the portion of the substrate 100 that needs to be masked may be exposed after subsequent exposure and development operations. For example... Figure 1 The gap between the mask 200 and the substrate 100 exposes the portion of the substrate 100 that needs to be masked, potentially leading to over-etching and plating issues later on. Please refer to [link / reference]. Figure 2 When the bonding force between the mask 200 and the substrate 100 is too strong, residual adhesive may occur after the subsequent exposure and development operations. That is, the mask 200 will block the part of the substrate 100 that needs to be exposed, affecting subsequent etching, electroplating and other operations.

[0004] Therefore, testing the adhesion between the mask and the substrate, and then adjusting production conditions based on the test results, is of great significance for improving product yield. However, in traditional production processes, it is difficult to measure the adhesion between the mask and the substrate. Summary of the Invention

[0005] Therefore, it is necessary to provide a method for testing the adhesion of a mask.

[0006] A method for testing mask adhesion includes the following steps:

[0007] A spacer is placed on the surface of a substrate, so that the spacer covers part of the surface of the substrate;

[0008] A test mask is prepared on a portion of the surface of the separator, and the test mask extends to the exposed surface of the substrate.

[0009] The test mask is completely separated from the substrate by applying a force to the exposed portion of the separator, and the magnitude of the force is then tested.

[0010] In some embodiments, the test mask extends equidistantly on the exposed surface of the substrate on opposite sides of the separator.

[0011] In some embodiments, the extension distance is 2mm to 5mm.

[0012] In some embodiments, the direction of the force is perpendicular to the surface of the substrate.

[0013] In some embodiments, the exposed portion of the spacer includes both ends of the spacer, and when the force is applied, the force is applied simultaneously to both ends of the spacer.

[0014] In some embodiments, the exposed distances at both ends of the separator are 2cm to 4cm, respectively, on the surface parallel to the substrate and in a direction away from the test mask.

[0015] In some embodiments, the isolator is elongated; the test mask extends to the exposed surface of the substrate on both sides of the isolator in the width direction; the exposed portion of the isolator is at both ends in the length direction of the isolator.

[0016] In some embodiments, preparing a test mask on a portion of the surface of the separator and extending the test mask to the exposed surface of the substrate includes:

[0017] A base mask is prepared on the surface of the isolator and the exposed surface of the substrate. The base mask completely covers the preset area on the surface of the isolator and the surface of the substrate used to form the test mask, and the area of ​​the base mask is larger than the area of ​​the preset area.

[0018] A dividing groove is formed on the base mask, the dividing groove extending from the surface of the base mask to the surface of the substrate, the dividing groove being located at the edge of the preset area to form the test mask in the area of ​​the base mask corresponding to the preset area.

[0019] In some embodiments, the spacer has an adhesive surface that is positioned away from the substrate when the spacer is placed on the surface of the substrate.

[0020] In some embodiments, the process further includes preparing a test mask on a portion of the surface of the isolator before:

[0021] A roughening film is adhered to the adhesive surface of the separator, wherein the roughness of the surface of the roughening film away from the separator is greater than the roughness of the surface of the roughening film close to the separator.

[0022] In the above-described mask adhesion testing method, a spacer is placed between the substrate and the test mask. The spacer partially covers the surface of the substrate while simultaneously exposing a portion of its own surface. A force is applied to the exposed portion of the spacer to completely separate the test mask from the substrate, and the magnitude of this force is measured. Thus, the magnitude of the applied force reflects the adhesion between the test mask and the substrate, allowing for the testing of the adhesion between them. Attached Figure Description

[0023] Figure 1 This is a schematic diagram illustrating the situation where the mask adhesion force is too low in the background art of this application.

[0024] Figure 2 This is a schematic diagram illustrating the situation where the mask bonding force is too large in the background art of this application.

[0025] Figure 3 This is a schematic diagram of the separator and the roughening film in one embodiment of this application.

[0026] Figure 4 This is a schematic diagram showing the positions of the separator, the dividing trench, and the mask in one embodiment of this application.

[0027] Figure 5 for Figure 4 A diagram showing another angle of the corresponding position.

[0028] Figure 6 for Figure 4 A schematic diagram showing the test mask after it separates from the substrate at the corresponding location.

[0029] Figure 7 This is a schematic diagram of a test of tensile force in one embodiment of this application.

[0030] Figure 8 This is a schematic diagram of a heterojunction battery according to one embodiment of this application.

[0031] Explanation of markings in the diagram:

[0032] 100. Substrate; 200. Mask; 300. Isolator; 301. Adhesive surface; 400. Roughening film; 401. Roughening surface; 500. Test mask; 600. Base mask; 601. Boundary trench; 700. Tensile gauge; 701. Tensile gauge clamping part; 800. Heterojunction cell; 801. N-type monocrystalline silicon wafer; 802. Textured layer; 803. Intrinsic amorphous silicon layer; 804. N-type doped layer; 805. P-type doped layer; 806. TCO conductive layer; 807. Copper seed layer; 808. Copper grid layer; 809. Tin protective layer. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] Please see Figures 3-7 This application provides a method for testing mask adhesion strength. The method includes the following steps: placing a spacer 300 on the surface of a substrate 100, such that the spacer 300 covers a portion of the surface of the substrate 100; preparing a test mask 500 on a portion of the surface of the spacer 300, extending the test mask 500 to the exposed surface of the substrate 100; applying a force to the exposed portion of the spacer 300 to completely separate the test mask 500 from the substrate 100, and testing the magnitude of the force.

[0038] In the testing method of this embodiment, a spacer 300 is provided between the substrate 100 and the test mask 500. The spacer 300 shields a portion of the surface of the substrate 100 while exposing a portion of its surface. A force is applied to the exposed portion of the spacer 300 to completely separate the test mask 500 from the substrate 100, and the magnitude of the force is tested. The test mask 500 and the substrate 100 are bonded together by an adhesive force. By applying a force to the spacer 300 to resist this adhesive force, the test mask 500 is completely separated from the substrate 100. Thus, the magnitude of the force reflects the adhesive force between the test mask 500 and the substrate 100, allowing for the testing of the adhesive force between the mask 200 and the substrate 100.

[0039] Furthermore, after obtaining the adhesion strength between the test mask and the substrate, the result can be compared with the adhesion strength required for producing qualified products. When the tested adhesion strength meets the required level, production can proceed according to the conditions for obtaining the test mask. When the tested adhesion strength does not meet the required level, production conditions can be adjusted until the required adhesion strength is achieved. This provides good guidance for product production, improves product yield, and avoids batch scrapping. During the production process, corresponding quality control specifications can be developed based on the mask adhesion strength test results to guide production and improve efficiency.

[0040] In addition, when a product is defective, the cause of the defect can be investigated by testing the mask adhesion force. This will help to quickly locate and find the cause of the defect.

[0041] Furthermore, comparing the mask adhesion test results with the adhesion required for a qualified product can guide the formulation of mask materials, thereby developing a suitable mask material formula. For example, when the mask material is photosensitive emulsion, the adhesion test results between the photosensitive emulsion and the substrate can be compared with the adhesion required for a qualified product. If the test results meet the adhesion requirements, the current photosensitive emulsion can be used in production. If the test results do not meet the adhesion requirements, the adhesion between the photosensitive emulsion and the substrate can be changed by adjusting the emulsion formula until the adhesion between the photosensitive emulsion and the substrate meets the requirements for a qualified product, and then production can proceed with the adjusted, qualified photosensitive emulsion.

[0042] In some embodiments, a tensile testing device can be used to apply force to the exposed portion of the separator 300. Specifically, the tensile testing device can be used to pull up the exposed portion of the separator 300 to completely separate the test mask 500 from the substrate 100, and the bonding force between the test mask 500 and the substrate 100 can be represented by the magnitude of the tensile force measured by the tensile testing device. Optionally, the tensile testing device is a tensile gauge 700. It is understood that the tensile gauge 700 includes a tensile gauge clamping part 701. When a tensile force is applied, the tensile gauge clamping part 701 clamps the exposed portion of the separator 300 to pull up the separator 300, thereby completely separating the test mask 500 from the substrate 100, and then testing the tensile force.

[0043] In some embodiments, the test mask 500 extends equidistantly over the exposed surface of the substrate 100 on both sides of the spacer 300. In this case, when a force is applied to the spacer 300, the force on the test mask 500 is more uniform, which improves the accuracy of the force test, i.e., improves the accuracy of the mask adhesion test. Simultaneously, the equidistant extension distance reduces variable factors in each test, resulting in better repeatability of the test results.

[0044] Optionally, on both sides of the separator 300, the test mask 500 extends 2mm to 5mm over the exposed surface of the substrate 100. If the extension distance is too small, the contact area between the test mask and the substrate is too small, which may lead to an underestimation of the adhesion strength test result. If the extension distance is too large, the contact area between the test mask and the substrate is too large, which may lead to an overestimation of the adhesion strength test result. An extension distance within the range of 2mm to 5mm is beneficial for improving the accuracy of the adhesion strength test. Further optionally, on opposite sides of the separator 300, the test mask 500 extends over the exposed surface of the substrate 100 by a distance of 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, 3mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm, 3.5mm, 3.6mm, 3.7mm, 3.8mm, 3.9mm, 4mm, 4.1mm, 4.2mm, 4.3mm, 4.4mm, 4.5mm, 4.6mm, 4.7mm, 4.8mm, 4.9mm, 5mm, etc.

[0045] Please see Figure 4 and Figure 5 Where the X direction represents the width direction, the Y direction represents the length direction, and the Z direction represents the thickness direction. The X, Y, and Z directions are perpendicular to each other. Figure 5In this configuration, on opposite sides of the separator 300, the test mask 500 extends equidistantly over the exposed surface of the substrate 100, which is expressed as the width 'a' of the test mask 500 on both sides of the separator 300. Optionally, 'a' is 2 mm to 3 mm.

[0046] In some embodiments, the spacer 300 is elongated. On both sides of the spacer 300 in the width direction, the test mask 500 extends to the exposed surface of the substrate 100; the exposed portion of the spacer 300 is at both ends in the length direction of the spacer 300.

[0047] Optionally, the width of the spacer 300 is 5mm to 10mm. For example, the width of the spacer 300 can be 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, etc. Figure 5 In the middle, the width of the spacer 300 is c. Optionally, c is 5mm to 10mm.

[0048] In some embodiments, when the test mask 500 is prepared on a portion of the surface of the isolator 300, at least one end of the isolator 300 is exposed. Optionally, the length of the isolator 300 covered by the test mask 500 is 10cm to 15cm. For example, the length of the isolator 300 covered by the test mask 500 is 10cm, 11cm, 12cm, 13cm, 14cm, 15cm, etc. Figure 4 In the test, the length of the spacer 300 covered by the mask 500 is b. Optionally, b is 10cm to 15cm. More optionally, the total length of the spacer 300 is 14cm to 20cm. For example, the total length of the spacer 300 is 14cm, 15cm, 16cm, 17cm, 18cm, 19cm, 20cm, etc. Figure 7 In the middle, the total length of the spacer 300 is d. Optionally, d is 10cm to 15cm.

[0049] In some embodiments, when a force is applied to the exposed portion of the spacer 300, the direction of the force is perpendicular to the surface of the substrate 100. This further improves the accuracy of the force test. Please refer to [link to relevant documentation]. Figure 7 The angle between the pulling force direction of the isolation component 300 and the surface of the substrate 100 is α, where α is 90°.

[0050] In some embodiments, the exposed portion of the spacer 300 includes both ends of the spacer 300, and when a force is applied, the force is applied simultaneously to both ends of the spacer 300. Applying the force simultaneously to both ends of the spacer 300 can subject the test mask 500 to a more balanced tensile force, which can further improve the accuracy of the mask bonding force test.

[0051] Please see Figure 4 and Figure 7Both ends of the spacer 300 are exposed. During tensile testing, both ends of the spacer 300 can be simultaneously pulled up using a tensile gauge 700. Optionally, when simultaneously pulling up both ends of the spacer 300 for tensile testing, the angle between the tensile force direction at both ends of the spacer 300 and the surface of the substrate 100 is equal. More optionally, when simultaneously pulling up both ends of the spacer 300 for tensile testing, the angle between the tensile force direction at both ends of the spacer 300 and the surface of the substrate 100 is 90°. Figure 7 During the tensile test, when both ends of the separator 300 are simultaneously pulled up, the angle between the pulling direction at both ends of the separator 300 and the surface of the substrate 100 is α, where α is 90°. It can be understood that during the tensile test, both ends of the separator 300 are clamped by the tensile tester clamping part 701.

[0052] In some embodiments, the exposed distances at both ends of the spacer 300 are equal in a direction parallel to the surface of the substrate 100 and away from the test mask 500. Optionally, the exposed distances at both ends of the spacer 300 are 2cm to 4cm. More preferably, the exposed distances at both ends of the spacer 300 are 2cm, 2.2cm, 2.5cm, 2.8cm, 3cm, 3.2cm, 3.5cm, 3.8cm, 4cm, etc. Please refer to [link / reference]. Figure 4 The exposed distance between both ends of the spacer 300 is e. Optionally, e is 2cm to 4cm.

[0053] In some embodiments, preparing a test mask 500 on a portion of the surface of the isolator 300 and extending the test mask 500 to the exposed surface of the substrate 100 includes: preparing a base mask 600 on the surface of the isolator 300 and the exposed surface of the substrate 100, the base mask 600 completely covering a predetermined area on the surface of the isolator 300 and the substrate 100 used to form the test mask 500, and the area of ​​the base mask 600 being larger than the area of ​​the predetermined area. A boundary trench 601 is formed on the base mask 600, extending from the surface of the base mask 600 to the surface of the substrate 100, the boundary trench 601 being located at the edge of the predetermined area to form the test mask 500 in the area of ​​the base mask 600 corresponding to the predetermined area.

[0054] Understandably, the width of the test mask 500 and the width of the test masks 500 on both sides of the separator 300 are relatively small. By first forming the base mask 600 and then forming the dividing groove 601 on the area of ​​the base mask 600 corresponding to the preset area to form the test mask 500, the accuracy of the width of the test mask 500 and the width of the test masks 500 on both sides of the separator 300 can be improved, and the accuracy of the bonding force test can be further improved.

[0055] In some embodiments, the width of the dividing groove 601 is 20 μm to 30 μm. Optionally, the width of the dividing groove 601 is 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, etc.

[0056] Understandably, the width of the base mask 600 is greater than the width of the test mask 500. The dividing trench 601 can be formed through exposure and development, thereby obtaining the test mask 500.

[0057] It is also understandable that the test mask 500 and / or the base mask 600 can be obtained by coating a masking material.

[0058] Please see Figure 3 In some embodiments, the spacer 300 has an adhesive surface 301. When the spacer 300 is placed on the surface of the substrate 100, the adhesive surface 301 is positioned away from the substrate 100. This allows for adhesion between the spacer 300 and the test mask 500, improving the bonding strength between them. Further, the surface of the spacer 300 opposite the adhesive surface 301 is non-adhesive. This eliminates adhesion between the spacer 300 and the substrate 100, preventing adhesion from affecting test results. When a force is applied to the spacer 300 to separate the test mask 500 from the substrate 100, the test mask 500 is less likely to separate from the spacer 300, further improving the accuracy of the mask bonding strength test.

[0059] Optionally, the separator 300 is a single-sided adhesive tape. Further, the single-sided adhesive tape is 3M single-sided adhesive tape. Further, the single-sided adhesive tape is a high-temperature resistant tape. High-temperature resistant tape has good high-temperature resistance, which allows the single-sided adhesive tape to maintain stable performance during adhesion testing. For example, when a coated mask material is used to form the test mask 500, the mask material may have a high temperature; using a high-temperature resistant single-sided adhesive tape can ensure good stability of the single-sided adhesive tape during testing. Optionally, the single-sided adhesive tape can withstand temperatures above 150°C.

[0060] Understandably, during the adhesion test, when the test mask 500 separates from the substrate 100, the test mask 500 does not separate from the single-sided tape. To maintain good adhesion between the single-sided tape and the test mask 500, a single-sided tape with strong adhesion can be selected for the test.

[0061] Please see Figure 3In some embodiments, before preparing the test mask 500 on a portion of the surface of the separator 300, the method further includes: adhering a roughening film 400 to the adhesive surface 301 of the separator 300, wherein the roughness of the surface of the roughening film 400 away from the separator 300 is greater than the roughness of the surface of the roughening film 400 near the separator 300.

[0062] Understandably, during the mask adhesion test, the test mask 500 separates from the substrate 100, while the separator 300, the roughening film 400, and the test mask 500 do not separate from each other.

[0063] The roughened film 400 has a larger surface roughness away from the separator 300, i.e., the roughened surface 401 has a larger surface roughness, which is beneficial to improving the adhesion between the roughened film 400 and the test mask 500. The roughened film 400 has a smaller surface roughness near the separator 300, which is beneficial to improving the adhesion between the roughened film 400 and the adhesive surface 301 of the separator 300.

[0064] Optionally, the roughening film 400 is made of the same material as the substrate 100. During the formation of the test mask 500, the mask material may chemically react with groups on the surfaces of the roughening film 400 and the substrate 100, thereby improving adhesion. In this case, having the roughening film 400 made of the same material as the substrate 100 can improve the consistency of the interaction forces between the test mask 500, the roughening film 400, and the substrate 100, further enhancing the accuracy of the adhesion test.

[0065] Optionally, the roughening film 400 is made of a metallic material. The substrate 100 is also made of a metallic material. Further optionally, both the roughening film 400 and the substrate 100 are made of copper. Still further optionally, the roughening film 400 is a copper foil, and the substrate 100 is a copper substrate 100.

[0066] In some embodiments, the preparation of the roughened film 400 includes: roughening one surface of the original film so that the roughened surface has a roughness greater than that of the opposing surface. The original film is the raw material film used to prepare the roughened film 400.

[0067] In some embodiments, the roughening film 400 is a copper foil. During the roughening process, a sulfuric acid-hydrogen peroxide solution can be used to roughen one surface of the copper foil, making the roughness of the roughened surface greater than that of the opposing surface. Optionally, the sulfuric acid-hydrogen peroxide solution is dropped onto one surface of the copper foil and held for 1 to 2 seconds to roughen that surface. It is understood that the sulfuric acid-hydrogen peroxide solution can be selected from those conventionally used in production for roughening copper foil.

[0068] Please see Figure 8 The paper illustrates a copper-plated heterojunction solar cell 800. The fabrication method of the copper-plated heterojunction solar cell 800 includes:

[0069] S101: Texturing and cleaning process is performed on the N-type monocrystalline silicon wafer 801 to form a texturing layer 802 with a thickness of 2μm to 8μm.

[0070] S102: An intrinsic amorphous silicon layer 803 and an N-type amorphous silicon thin film (i.e., an N-type doped layer 804) are sequentially deposited on the front side of the texturized silicon wafer. An intrinsic amorphous silicon layer 803 and a P-type amorphous silicon thin film (i.e., a P-type doped layer 805) are sequentially deposited on the back side of the texturized silicon wafer. The thickness of the intrinsic amorphous silicon layer 803 on the front side is 3nm to 6nm. The thickness of the intrinsic amorphous silicon layer 803 on the back side is 3nm to 9nm. The thickness of the N-type doped layer 804 is 5nm to 10nm. The thickness of the P-type doped layer 805 is 5nm to 15nm.

[0071] S103: A transparent conductive film (i.e., TCO conductive layer 806) is deposited on the N-type doped layer 804 and the P-type doped layer 805, respectively. The thickness of the TCO conductive layer 806 is 90nm to 110nm.

[0072] S104: Deposit a copper seed layer 807 on the TCO conductive layer 806. The thickness of the copper seed layer 807 is 150nm to 250nm.

[0073] S105: The silicon wafer is coated with adhesive on all four sides and corners, with an adhesive thickness of 30μm to 60μm and an adhesive thickness of 8μm to 14μm.

[0074] S106: Photosensitive emulsion (i.e., mask material) is coated onto the copper seed layer 807 to obtain a photosensitive emulsion layer (i.e., mask). The thickness of the photosensitive emulsion layer is 10μm to 14μm.

[0075] S107: Laser-printed grid pattern, laser energy 85mJ.

[0076] S108: Development removes unexposed photosensitive emulsion. The developer is a sodium carbonate solution with a concentration of 8 g / L to 13 g / L, exposing the copper seed layer 807.

[0077] S109: Electroplated copper grid layer 808 and tin protective layer 809. The copper grid layer 808 has a thickness of 8μm to 10μm. The tin protective layer 809 has a thickness of 2μm to 5μm. The electroplating solution for the copper grid layer 808 includes: 20g / L to 100g / L Cu 2+ The electroplating solution for the tin protective layer 809 includes 20 g / L to 100 g / L of H2SO4 and additives. 2+Methylsulfonic acid at concentrations of 100 g / L to 300 g / L and additives. It is understandable that the plating solutions for the copper grid layer 808 and the tin protective layer 809 can be selected from conventional plating solutions used in production.

[0078] S110: Removal and Etching: Remove excess photosensitive emulsion and copper seed layer 807. Removal: Remove excess photosensitive emulsion and side-sealing emulsion with a 10g / L~20g / L NaOH solution. Etching: The etch solution includes 2.5g / L H2SO4 and 10g / L H2O2. Immerse in the etch solution to remove excess copper seed layer 807.

[0079] S111: Light injection processing, light injection temperature 200℃~220℃, light injection time 60s~120s.

[0080] In S106, the mask adhesion test method of this application can be used to test the adhesion between the photosensitive adhesive and the copper seed layer 807 to determine whether the adhesion meets the requirements. This can then guide the adjustment of the fabrication parameters of the copper electroplated heterojunction solar cell 800, thereby improving the yield of the copper electroplated heterojunction solar cell 800. It is understood that when using the mask adhesion test method of this application to test the adhesion between the photosensitive adhesive and the copper seed layer 807, the mask is the photosensitive adhesive layer, and the substrate 100 is the copper seed layer 807.

[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims, and the specification and drawings can be used to interpret the content of the claims.

Claims

1. A method of testing the adhesion of a mask, characterized by, Includes the following steps: A spacer is placed on the surface of a substrate, so that the spacer covers part of the surface of the substrate; A base mask is prepared on the surface of the isolator and the exposed surface of the substrate. The base mask completely covers the preset area on the surface of the isolator and the surface of the substrate used to form the test mask, and the area of ​​the base mask is larger than the area of ​​the preset area. A dividing groove is formed on the base mask, the dividing groove extending from the surface of the base mask to the surface of the substrate, the dividing groove being located at the edge of the preset area to form the test mask in the area of ​​the base mask corresponding to the preset area; The test mask is completely separated from the substrate by applying a force to the exposed portion of the separator, and the magnitude of the force is then tested. The exposed portion of the isolator includes both ends of the isolator, and when the force is applied, the force is applied simultaneously to both ends of the isolator.

2. The method of claim 1, wherein, On opposite sides of the isolator, the test mask extends equidistantly over the exposed surface of the substrate.

3. The method of claim 2, wherein the mask force is measured by a force sensor. The extension distance is 2mm to 5mm.

4. The method of claim 1, wherein, The direction of the force is perpendicular to the surface of the substrate.

5. The mask bonding force testing method according to claim 1, characterized in that, The exposed distances at both ends of the separator are 2cm to 4cm, parallel to the surface of the substrate and in a direction away from the test mask.

6. The mask bonding force testing method according to claim 1, characterized in that, The isolation element is elongated; on both sides of the isolation element in the width direction, the test mask extends to the exposed surface of the substrate; the exposed portion of the isolation element is at both ends in the length direction of the isolation element.

7. The mask adhesion test method according to any one of claims 1 to 6, characterized in that, The width of the dividing groove is 20μm~30μm.

8. The mask adhesion test method according to any one of claims 1 to 6, characterized in that, The spacer has an adhesive surface, which is placed away from the substrate when the spacer is placed on the surface of the substrate.

9. The mask bonding force testing method according to claim 8, characterized in that, Before preparing the test mask on a portion of the surface of the isolator, the following steps are also included: A roughening film is adhered to the adhesive surface of the separator, wherein the roughness of the surface of the roughening film away from the separator is greater than the roughness of the surface of the roughening film close to the separator.

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