Load port apparatus, system and method for manufacturing electronic devices

Abstract

An electronic device manufacturing system includes a factory interface having a load port. The load port may include a faceplate having an opening therein and a carrier door opener that seals the opening when the door is closed. The carrier door opener may have a groove along an outer portion of the door. The groove may have a cross-sectional shape of a triangular prism frustum. A hollow O-ring may be disposed in the groove and configured to engage the panel when the carrier door opener is closed against the faceplate. Methods of assembling a factory interface for an electronic device manufacturing system are also provided, as are other aspects.

Description

[0001] This application is a divisional application of the invention patent application with the application date of November 9, 2017, application number 201780068417.3, and invention name "Loading port equipment, system and method for manufacturing electronic devices".

[0002] Related Applications

[0003] This application claims priority to U.S. non-provisional patent application Ser. No. 15 / 348,947, filed on Nov. 10, 2016, entitled “ELECTRONIC DEVICE MANUFACTURING LOAD PORT APPARATUS, SYSTEMS, AND METHODS” (Agent Docket No. 24538-02 / USA), which is hereby incorporated by reference in its entirety for all purposes. Technical Field

[0004] The present disclosure relates to the manufacture of electronic devices and, more particularly, to factory interface loadports. Background Art

[0005] Substrate processing in semiconductor electronic device manufacturing is typically accomplished by multiple processing tools, with substrates traveling between processing tools in substrate carriers (e.g., Front Opening Unified Pods or FOUPs). The substrate carriers may dock to a loading port of a factory interface, such as an Equipment Front End Module or EFEM. The factory interface may include a robotic substrate handling device operable to transfer substrates between the substrate carriers and the processing tools. An environmentally controlled atmosphere may be provided within and between the substrate carriers and the factory interface, and within and between the factory interface and the processing tools. Poor control of various environmental factors (e.g., humidity, temperature, oxygen, and / or levels of contaminants / particles) may adversely affect substrate properties and substrate processing. Existing electronic device manufacturing systems may therefore benefit from improved environmental control at the factory interface.

[0006] Thus, improved electronic device manufacturing loadport apparatus, systems, and methods are desired. Summary of the invention

[0007] According to a first aspect, a factory interface for an electronic device manufacturing system is provided. The factory interface includes a loading port configured to interface with a substrate carrier. The loading port includes a panel having a panel opening and a carrier door opener. The carrier door opener seals the panel opening when the carrier door opener is closed, the carrier door opener contacts and opens a door of a substrate carrier at the loading port, and the carrier door opener includes a groove along an outer portion of the carrier door opener. The loading port also includes a hollow O-ring disposed in the groove. The hollow O-ring is configured to engage with the panel when the carrier door opener is closed against the panel.

[0008] According to a second aspect, an electronic device manufacturing system is provided. The electronic device manufacturing system includes a substrate processing tool and a factory interface. The factory interface includes a housing having a front side and a rear side, the front side having a front side opening, and the rear side is coupled to the substrate processing tool. The factory interface also includes a loading port, which is configured to dock with a substrate carrier. The loading port includes a panel, which is coupled to the front side at the front side opening, and the panel has a panel opening. The loading port also includes a carrier door opener, which seals the panel opening when the carrier door opener is closed, the carrier door opener contacts and opens a door of a substrate carrier located at the loading port, and the carrier door opener includes a groove along an outer portion of the carrier door opener. The loading port also includes a hollow O-ring, which is disposed in the groove. The hollow O-ring is configured to engage the panel when the carrier door opener is closed against the panel.

[0009] According to a third aspect, a method of assembling a factory interface for an electronic device manufacturing system is provided. The method includes the steps of providing a load port, the load port being configured to interface with a substrate carrier, the load port including a panel having a panel opening. The method also includes the steps of providing a carrier door opener, the carrier door opener sealing the panel opening when the carrier door opener is closed, the carrier door opener contacting and opening a door of a substrate carrier at the load port, and the carrier door opener including a groove along an outer portion of the carrier door opener. The method also includes the steps of disposing a hollow O-ring in the groove, the hollow O-ring being configured to engage with the panel when the carrier door opener is closed against the panel.

[0010] Other aspects, features and advantages of these and other embodiments according to the present disclosure may be apparent from the following detailed description, the appended claims and the accompanying drawings. Accordingly, the drawings and descriptions herein should be considered illustrative in nature and should not be considered restrictive. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described below are for illustration purposes only and are not necessarily drawn to scale. The drawings are not intended to limit the scope of the present disclosure in any way.

[0012] Figure 1 A side schematic diagram of an electronic device manufacturing system according to an embodiment of the present disclosure is shown.

[0013] Figure 2 Depicted is a front perspective view of a loadport according to an embodiment of the present disclosure.

[0014] Figure 3 A simplified rear view of a loadport is depicted in accordance with an embodiment of the present disclosure.

[0015] Figure 4A Depicted is a front view of a carrier door opener according to an embodiment of the present disclosure.

[0016] Figure 4B The embodiment according to the present disclosure is shown along Figure 4A A partial cross-sectional view of the carrier door opener at section line 4B-4B.

[0017] Figure 5 A method of assembling a factory interface for an electronic device manufacturing system according to an embodiment of the present disclosure is depicted. DETAILED DESCRIPTION

[0018] Reference will now be made in detail to exemplary embodiments of the present disclosure, which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.

[0019] Electronic device manufacturing may involve maintaining and / or providing a controlled environment between various components (e.g., substrate carriers, load ports, factory interfaces, and processing tools) in order to reduce undesirable humidity, temperature, oxygen, and / or contaminant / particle levels that may adversely affect substrate characteristics and / or substrate processing. The interfaces between components may include various seals. As various doors, door openers, or similar mechanisms are moved to allow substrates to be transferred from one component to another, these interfaces may be exposed to repeated opening and closing (unsealing and sealing). Repeated opening and / or closing of certain sealing mechanisms may result in undesirable particle generation caused by wear of the materials used to seal the component interfaces. The particles generated may adversely interfere with substrate processing (e.g., by contaminating the substrate being processed, affecting the processing performed on the substrate, etc.).

[0020] In one aspect, an electronic device manufacturing system according to one or more embodiments of the present disclosure includes an improved load port seal. The improved load port seal in some embodiments may employ a hollow O-ring disposed in a groove of a specific shape and size that extends along an outer portion of a carrier door opener. The combined construction of the hollow O-ring and groove may reduce or eliminate the generation of particles despite the repeated opening and closing of the carrier door opener as substrates are transferred between substrate carriers and processing tools through the load port of the factory interface. The combined construction of the hollow O-ring and groove may have other advantages, such as requiring less force to close the carrier door opener, requiring a less robust design of the carrier door opener and associated drive components and other components, and / or having a larger sealing surface area.

[0021] Further details of exemplary embodiments depicting and describing improved load port seals and other aspects including methods of assembling a factory interface for an electronic device manufacturing system are described below in conjunction with Figures 1 to 5 Explain in more detail.

[0022] Figure 1 A schematic side view of an electronic device manufacturing system 100 is depicted in accordance with one or more embodiments. The electronic device manufacturing system 100 may include a substrate carrier 102, a load port 104, a factory interface 106, and a substrate processing tool 108. The load port 104 may be coupled to the factory interface 106, which may be coupled to the substrate processing tool 108. In some embodiments, equipment within and / or coupled to the electronic device manufacturing system 100 (e.g., gas supply lines, vacuum pumps, etc., not shown) may place one or more of the substrate carrier 102, the load port 104, the factory interface 106, and the substrate processing tool 108 in an environmentally controlled atmosphere (e.g., in a non-reactive and / or inert gas environment, under vacuum, etc.), depending on the open or closed state of a mechanism (e.g., a door, door opener, gate or slit valve, or the like) at its interface.

[0023] The substrate carrier 102 may be configured to carry one or more substrates. The substrate may be any suitable article for manufacturing electronic devices or circuit components, such as a disk or wafer containing silicon, a patterned wafer, a glass plate, or the like. The substrate carrier 102 in some embodiments may be, for example, a front opening unmanned unit or FOUP, and may include a carrier door 110. In some embodiments, the carrier door 110 may be a FOUP door.

[0024] The load port 104 can be configured to receive a substrate carrier 102 thereon. The load port 104 can have a panel 112 having a panel opening 114 configured to receive a carrier door 110 therein. The load port 104 can also have a carrier door opener 116 configured to contact (i.e., for example, latch to or otherwise attach to) the carrier door 110 and open the carrier door 110 to allow substrates to be transferred into and out of the substrate carrier 102. In some embodiments, the carrier door opener 116 can contact the carrier door 110, move the carrier door 110 inward (i.e., as Figure 1 The substrate carrier 102 is then moved to the right (as shown) sufficiently to clear the panel 112 and the carrier door 110 is then moved downward to provide access to the substrate carrier 102.

[0025] The factory interface 106 may be any suitable enclosure having a housing 117 having a front side 118, a back side 120, a top 122, a bottom 124, and two side walls (not separately shown). The front side 118 may have one or more front side openings 126 configured to receive and couple to corresponding load ports 104. The factory interface 106 may include a robotic substrate handling device (not shown) configured to transfer substrates from the substrate carrier 102 through the factory interface 106 to the substrate processing tool 108.

[0026] The substrate processing tool 108 may perform one or more processes on one or more substrates, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, pre-cleaning, metal or metal oxide removal, or the like. Other processes may be performed on the substrates therein. The substrate processing tool 108 may include one or more load lock chambers, a transfer chamber, and one or more processing chambers (all not shown). The one or more load lock chambers may be coupled to the factory interface 106, and the transfer chamber may be coupled to the one or more load lock chambers and coupled to the one or more processing chambers. The robot substrate handling device of the factory interface 106 may transfer substrates into and out of the one or more load lock chambers. The substrate processing tool 108 may include a transfer robot (not shown) that is at least partially housed in the transfer chamber. The transfer robot may be configured to transfer substrates to and from the one or more load lock chambers and the one or more processing chambers.

[0027] Figure 2A front perspective view of a load port 204 is depicted according to one or more embodiments. In some embodiments, the load port 204 can be the same or similar to the load port 104. The load port 204 can include a panel 212 having a panel opening 214. The load port 204 can also include a carrier door opener 216 that seals the panel opening 214 when the carrier door opener 216 is closed against the panel 212. The carrier door opener 216 can have one or more connectors 228 that are configured to contact and attach to the carrier door 110 of the substrate carrier 102. The connector 228 can be, for example, a suction type device, a vacuum device, etc. Other suitable types of connector devices that can be attached to the carrier door 110 can be used. A mounting table 230 extending outwardly from the panel 212 can be provided. The mounting table 230 can be configured to receive the substrate carrier 102 thereon. Various mechanisms (not shown) may be included on and / or around the mounting table 230 to lock the substrate carrier 102 into place on the mounting table 230. The load port 204 may also include a lower portion 232 that may house an open / close mechanism ( Figure 2 ), the opening / closing mechanism is coupled to the carrier door opener 216. In some embodiments, the opening / closing mechanism can attach the carrier door opener 216 to the carrier door 110 and open the carrier door 110, as described above in conjunction with Figure 1 described.

[0028] Figure 3 A rear view of a load port 304 is depicted according to one or more embodiments. In some embodiments, the load port 304 can be the same or similar to the load ports 104 and / or 204. The load port 304 can include a panel 312 and a seal 334 that extends around an outer portion and / or periphery of the panel 312. The seal 334 can seal an interface between the load port 304 and a factory interface (e.g., factory interface 106) when the load port 304 and the factory interface are coupled together. The load port 304 can also include a carrier door opener 316 that seals the panel opening when the carrier door opener 316 is closed against the panel 312 ( Figure 3 The loading port 304 may also include an opening / closing mechanism 336 (not shown in FIG. Figure 3 ), the opening / closing mechanism 336 can open and close the carrier door opener 316, as described above in conjunction with Figure 1 and / or Figure 2 When the carrier door opener 316 is attached to a substrate carrier door (e.g. Figure 1When the substrate carrier door 110 of the substrate carrier 102 is opened, the opening / closing mechanism 336 can be retracted from the panel opening and the substrate carrier door 110 can be lowered below the panel opening to allow access to the substrate with the substrate carrier. The lifting / lowering mechanism (not shown) can move the carrier door opener 316 and any substrate carrier door supported by the carrier door opener 316 relative to the panel opening ( Figure 2 The carrier door opener 316 may be slightly larger than the panel opening so that the carrier door opener 316 may seal the panel opening by engaging the back surface 338 of the panel 312, as described in more detail below.

[0029] Figure 4A and Figure 4B A carrier door opener 416 is depicted in accordance with one or more embodiments. In some embodiments, the carrier door opener 416 can be the same or similar to the carrier door openers 116, 216, and / or 316. Figure 4A The front face 440 of the carrier door opener 416 is shown. In some embodiments, the carrier door opener 416 may have two or more latch keys 448 configured to attach to a FOUP door, which may be the same or similar to the carrier door 110 of the substrate carrier 102, as described above in conjunction with Figures 1 to 3 The carrier door opener 416 may have an outer periphery 442 that, in some embodiments, is rectangular in shape. Other suitable shapes are possible. The carrier door opener 416 may have a groove 444 that extends along an outer portion of the carrier door opener 416, and in some embodiments, the groove 444 extends along the entire outer periphery 442, thereby forming a continuous groove therearound. The carrier door opener 416 may also have a hollow O-ring 446 disposed in the groove 444, the hollow O-ring 446 being configured to align with a panel (e.g., a panel) of the load port when the carrier door opener 416 is closed against the panel. Figures 1 to 3 The back surface 438 ( Figure 4B ) or back surface 338 ( Figure 3 ) connection. Figure 4B As shown, the carrier door opener 416 is slightly larger about the perimeter of the panel opening 414 so that the carrier door opener 416 can seal the panel opening 414 by engaging the back surface 438 when closed.

[0030] like Figure 4BAs shown, the groove 444 may have a cross-sectional shape similar to the shape of a triangular prism frustum. That is, the cross-sectional shape of the groove 444 may be similar to the base portion of a triangular prism, the upper portion of which is cut off by a plane parallel to the base. In the embodiment shown, the interface between the side and the bottom of the triangular prism is smooth or rounded. More discontinuous side / base interfaces and / or other side / base interface configurations may be used. In some embodiments, the groove 444 may have a top width TW ranging from about 5mm to 6mm, a bottom width BW ranging from about 8.5mm to 9.5mm, and a depth D ranging from about 4mm to 5mm. In one or more embodiments, the depth D may be less than the diameter of the O-ring 446. In some embodiments, the groove 444 may have a ratio of the top width TW to the bottom width BW of about 0.58 to about 0.65. Other suitable groove widths and / or depths may be used.

[0031] In some embodiments, the hollow O-ring 446 may have a wall thickness in the range of about 0.762 mm to 1.016 mm. In some embodiments, the hollow O-ring 446 may have an outer diameter of about 0.22 inches to 0.27 inches (about 5.6 mm to 6.85 mm). In some embodiments, the hollow O-ring 446 may have a durometer hardness in the range of about 60 to 75. Other suitable wall thicknesses, diameters and / or hardnesses may be used. In some embodiments, the hollow O-ring 446 may have a slurry-processed surface. In one or more embodiments, the back surface 438 may have a surface roughness Ra of about 14.5 to 17.5 μin or less. For example, the ratio of the diameter of the O-ring 446 to the depth D of the groove 444 may be about 1.35 to 1.45. Other suitable surface processing, back surface roughness and / or diameter-depth ratios may be used. The hollow O-ring 446 may be advantageous over a solid O-ring because less force may be required to compress and seal the hollow O-ring 446 against the back surface 438. For example, for a length of about 52 inches (about 132.1 cm), the force used to seal the hollow O-ring 446 at 25% compression may range from about 84N to 216N (Newtons). Further, in some embodiments, the design of the carrier door opener 416 / slot 444 / back surface 438 may allow the hollow O-ring 446 to accommodate non-parallelism or non-flatness between these components, such as + / - 0.5 mm non-parallelism or non-flatness, and still provide an effective seal. Other non-parallelism or non-flatness may be accommodated.

[0032] In some embodiments, the substrate carrier may have a locking or latching mechanism that secures the substrate carrier door to the substrate carrier. In one or more embodiments, the carrier door opener 416 may include one or more keys or latching mechanisms 448 ( Figure 4A ), a key or latch mechanism 448 interfaces with the substrate carrier door and latches, unlatches, locks, or unlocks (eg, by, for example, rotating clockwise or counterclockwise).

[0033] Figure 5 A method 500 of assembling a factory interface for an electronic device manufacturing system is depicted in accordance with one or more embodiments. At process block 502, the method 500 may include the following steps: providing a load port configured to interface with a substrate carrier, the load port including a panel having a panel opening. For example, referring to Figure 1 and Figure 2 A load port 104 or 204 may be provided that is configured to interface with the substrate carrier 102 and may include a faceplate 112 or 212 having a faceplate opening 114 or 214 .

[0034] At process block 504, a carrier door opener may be provided that seals a panel opening when the carrier door opener is closed, the carrier door opener contacts and opens a door of a substrate carrier at a load port, and the carrier door opener includes a slot extending along an outer portion of the carrier door opener. Figure 1 , Figure 4A and Figure 4B As shown, for example, a carrier door opener 416 may be provided, the carrier door opener 416 may seal the panel opening 414 when the carrier door opener 416 is closed, the carrier door opener 416 may contact and open the carrier door 110 of the substrate carrier 102 located at the load port 104, and the carrier door opener 416 may have a slot 444 along an outer portion of the carrier door opener 416.

[0035] And at process block 506, method 500 may include placing a hollow O-ring in the groove, the hollow O-ring engaging the panel when the carrier door opener is closed against the panel. For example, hollow O-ring 466 may be placed in groove 444, such as Figure 4B When the carrier door opener 416 is closed, the hollow O-ring 446 may engage the back surface 438 of the faceplate of the loadport.

[0036] The above processing blocks of method 500 may be executed or performed in an order or sequence, which is not limited to the order and sequence shown and described. For example, in some embodiments, processing block 504 may be performed simultaneously with processing block 502 or after processing block 502.

[0037] The above description discloses only exemplary embodiments of the present disclosure. Modifications of the above disclosed devices, systems, and methods may fall within the scope of protection of the present disclosure. Accordingly, although exemplary embodiments of the present disclosure have been disclosed, it should be understood that other embodiments may fall within the scope of the present disclosure, which is determined by the appended claims.

Claims

1. A carrier door opener comprising one or more connector devices configured to interface with a door of a substrate carrier at a loadport; an outer surface, the outer surface forming a groove; and A loading port seal is disposed in the groove, wherein the loading port seal is configured to seal the panel opening by engaging a back surface of the panel around a panel opening formed by the loading port, wherein the loading port is coupled to a factory interface via the panel, wherein the back surface of the panel faces the factory interface, and the panel seals an interface between the loading port and the factory interface by a seal extending around the panel. 2 . The carrier door opener of claim 1 , wherein the one or more connector devices include one or more of a suction-type device or a vacuum device. 3 . The carrier door opener of claim 1 , wherein the one or more connector devices are configured to retract the door from the substrate carrier.

4. The carrier door opener of claim 1, wherein the slot extends along an outer periphery of the carrier door opener, thereby forming a continuous slot.

5. The carrier door opener of claim 1, wherein the slot of the carrier door opener has a cross-sectional shape substantially similar to a frustum of a triangular prism.

6. The carrier door opener of claim 1, wherein the groove has a depth that is less than a diameter of the loadport seal seated in the groove.

7. The carrier door opener of claim 1, wherein the load port seal is an O-ring.

8. A factory interface of an electronic device manufacturing system, wherein the factory interface comprises: a load port configured to interface with a substrate carrier; and A carrier door opener, the carrier door opener comprising: one or more connector devices configured to interface with a door of the substrate carrier at the loadport; an outer surface, the outer surface forming a groove; and A loading port seal is disposed in the groove, wherein the loading port seal is constructed to seal the panel opening by engaging a back surface of the panel around a panel opening formed by the loading port, wherein the loading port is coupled to the factory interface via the panel, wherein the back surface of the panel faces the factory interface, and the panel seals the interface between the loading port and the factory interface by a seal extending around the panel.

9. The factory interface of claim 8, wherein the one or more connector devices include one or more of a suction-type device or a vacuum device.

10. The factory interface of claim 8, wherein the one or more connector devices are configured to retract the door from the substrate carrier.

11. The factory interface of claim 8, wherein the slot extends along an outer perimeter of the carrier door opener, thereby forming a continuous slot.

12. The factory interface of claim 8, wherein the slot of the carrier door opener has a cross-sectional shape substantially similar to a frustum of a triangular prism.

13. The factory interface of claim 8, wherein the groove has a depth that is less than a diameter of the loadport seal disposed in the groove.

14. The factory interface of claim 8, wherein the load port seal is an O-ring.

15. A method comprising the steps of: sealing the panel opening by engaging a back surface of a panel of a loadport around a panel opening formed by the panel of the loadport via a loadport seal disposed in a groove in an outer surface of a carrier door opener, wherein the loadport is coupled to a factory interface via the panel, wherein the back surface of the panel faces the factory interface, and the panel seals an interface between the loadport and the factory interface via a seal extending around a circumference of the panel; and One or more connector devices through the carrier door opener interface with a door of a substrate carrier located at the load port.

16. The method of claim 15, wherein the one or more connector devices include one or more of a suction-type device or a vacuum device.

17. The method according to claim 15, further comprising the steps of: The door is retracted from the substrate carrier using the one or more connector devices.

18. The method of claim 15, wherein the slot extends along an outer periphery of the carrier door opener, thereby forming a continuous slot.

19. The method of claim 15, wherein the slot of the carrier door opener has a cross-sectional shape substantially similar to a frustum of a triangular prism.

20. The method of claim 15, wherein the groove has a depth that is less than a diameter of the loadport seal disposed in the groove.

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