Receive PCBA heat dissipation device, laser receiving module and laser radar

Abstract

The embodiment discloses a receiving PCBA heat dissipation device, a laser receiving module and a laser radar. The heat dissipation component connected with the laser radar shell is arranged to connect a heat dissipation shell. The receiving PCBA is at least partially located in the heat dissipation shell. Therefore, when the electronic components on the receiving PCBA work, the heat generated by the electronic components can be conducted to the heat dissipation component through the heat dissipation shell, and then transmitted to the shell of the laser radar through the heat dissipation component. In addition, a part of the heat can also be directly transmitted to the shell of the laser radar through the heat dissipation shell. The heat conduction mode can achieve good heat dissipation effect of the receiving PCBA, the heat conduction path is short, the heat conduction efficiency is increased, the service life and reliability of the electronic components on the receiving PCBA are ensured, and the accuracy and reliability of the laser radar during ranging are ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of ranging equipment, in particular to a receiving PCBA heat dissipation device, a laser receiving module and a laser radar. BACKGROUND

[0002] The laser radar is a core perception sensor of the vehicle end unmanned driving, has the characteristics of high resolution, wide field of view, long ranging, and is not affected by environmental and climate conditions, and the laser radar can effectively identify non-metallic objects, so the laser radar has irreplaceable advantages in high-level automatic driving. As a kind of electronic product with high power density, the laser radar has high requirements for heat dissipation performance, especially in the laser receiving module, the photoelectric detection device arranged on the printed circuit board (PCBA) is the core element of the laser radar, which has large heat generation and its performance is greatly affected by temperature.

[0003] However, in the prior art, the heat dissipation of the receiving PCBA is generally through convective heat transfer inside the radar to transfer heat to the air in the internal cavity, and the internal air is in convective heat transfer with the radar shell, so the heat dissipation effect is poor. SUMMARY

[0004] The purpose of the present application is to provide a receiving PCBA heat dissipation device, a laser receiving module and a laser radar, which can effectively dissipate heat from the receiving PCBA through heat conduction, has a short heat conduction path and high heat conduction efficiency, thereby ensuring the service life and reliability of the electronic components on the receiving PCBA, and ensuring the accuracy and reliability of the laser radar during ranging.

[0005] In a first aspect, the present application provides a receiving PCBA heat dissipation device, comprising:

[0006] A heat dissipation assembly is used to connect with the shell of the laser radar.

[0007] A PCBA assembly includes a heat dissipation shell and a receiving PCBA, the heat dissipation shell is in a hollow structure, the heat dissipation shell is connected with the heat dissipation assembly, and the receiving PCBA is at least partially located in the heat dissipation shell.

[0008] In an optional embodiment, the heat dissipation assembly includes a heat dissipation block and a heat dissipation strip, the heat dissipation shell is connected to one end of the heat dissipation block, and the heat dissipation strip is connected to the circumferential side of the heat dissipation block and the circumferential side of the heat dissipation shell.

[0009] In an optional embodiment, the heat dissipation block is in a hollow structure, the heat dissipation shell is provided with a light transmission hole at a portion thereof facing the heat dissipation block, the light transmission hole is in communication with the inner cavity of the heat dissipation block, the receiving PCBA is provided with a photoelectric detection device, and the photoelectric detection device corresponds to the light transmission hole.

[0010] In an optional embodiment, the part of the receiving PCBA located inside the heat dissipation shell has a first mounting surface and a second mounting surface opposite to each other, the second mounting surface being away from the heat dissipation block relative to the first mounting surface;

[0011] The first mounting surface is provided with the photoelectric detection device and a first heat generating device, the photoelectric detector being opposite to the light transmission hole;

[0012] The second mounting surface is provided with a second heat generating device, the power of the second heat generating device being greater than that of the first heat generating device.

[0013] In an optional embodiment, the inner surface of the heat dissipation shell comprises a first surface and a second surface opposite to each other, the second surface being away from the heat dissipation block relative to the first surface;

[0014] The first surface and the first mounting surface are opposite to each other, and the light transmission hole penetrates through the first surface;

[0015] The second surface and the second mounting surface are opposite to each other, and there is a heat conductive insulation layer between the second surface and the second heat generating device.

[0016] In an optional embodiment, the second surface is in a stepped form.

[0017] In an optional embodiment, the receiving PCBA has a via penetrating through the first mounting surface and the second mounting surface, and the photoelectric detection device covers the via.

[0018] In an optional embodiment, the inner wall of the via is covered with a heat conductive layer.

[0019] In an optional embodiment, the heat dissipation shell comprises a first shell and a second shell opposite to each other, the first shell being connected to the heat dissipation block and provided with the light transmission hole, and the end of the heat dissipation strip being connected to the side wall of the second shell;

[0020] and / or,

[0021] The light transmission hole is in a gradually expanding structure with gradually increasing inner diameter size from inside to outside.

[0022] In an optional embodiment, the outer surface of the heat dissipation shell is provided with a protruding part.

[0023] In a second aspect, the present application provides a laser receiving module comprising the receiving PCBA heat dissipation device according to any one of the foregoing embodiments.

[0024] In a third aspect, the present application provides a laser radar comprising the laser receiving module according to the foregoing embodiments.

[0025] The beneficial effects of the embodiments of the present application include:

[0026] The embodiment discloses a receiving PCBA heat dissipation device, a laser receiving module and a laser radar. The receiving PCBA is at least partially located in the heat dissipation shell, so that the heat generated by the electronic components on the receiving PCBA can be conducted to the heat dissipation assembly through the heat dissipation shell, and then transmitted to the shell of the laser radar through the heat dissipation assembly. In addition, a part of the heat can also be directly transmitted to the shell of the laser radar through the heat dissipation shell. The heat conduction mode can achieve good heat dissipation effect of the receiving PCBA, the heat conduction path is short, the heat conduction efficiency is high, so as to ensure the service life and reliability of the electronic components on the receiving PCBA, and the accuracy and reliability of the laser radar during ranging. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the specific embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0028] Figure 1 It is a perspective view of the receiving PCBA heat dissipation device of the embodiment;

[0029] Figure 2 It is a perspective view of the PCBA assembly of the embodiment;

[0030] Figure 3 It is one of the exploded schematic views of Figure 2 ;

[0031] Figure 4 It is the second of the exploded schematic views of Figure 2 ;

[0032] Figure 5 It is a top view of the PCBA assembly of the embodiment;

[0033] Figure 6 It is the A-A sectional view of Figure 5 ;

[0034] Figure legend: 1-first shell; 11-first surface; 12-light transmission hole; 121-reflective surface; 2-second shell; 21-second surface; 22-protruding part; 3-receiving PCBA; 31-first mounting surface; 32-second mounting surface; 33-via hole; 4-heat dissipation strip; 5-heat dissipation block; 6-optoelectronic detection device; 7-first heat generating device; 8-second heat generating device. DETAILED DESCRIPTION

[0035] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. Generally, the components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents the selected embodiments of the application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0037] It should be noted that: similar reference numerals and letters indicate similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0038] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0039] In addition, the terms "horizontal", "vertical", "overhang" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0040] In the description of the present application, it is also necessary to explain that, unless otherwise explicitly specified and limited, the terms "arrange", "mount", "connect", "connect", "contact" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements; it can be direct contact, or it can be indirect contact through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] The following will be described in detail in combination with the accompanying drawings Figures 1 to 6 Some embodiments of the present application will be described in detail. The following examples and features in the examples can be combined with each other without conflict.

[0042] The embodiment of the present application discloses a laser radar, which comprises a shell and a laser emitting module and a laser receiving module arranged inside the shell. The laser emitting module is mainly used for emitting laser to the outside of the shell. When the laser is reflected on the outside object and enters the shell, the reflected laser is received by the laser receiving module, so as to measure the distance between the laser radar and the outside object.

[0043] The laser receiving module comprises a receiving PCBA heat dissipation device and a receiving lens group. The receiving lens group is arranged in the PCBA heat dissipation device, and is mainly used for focusing the laser reflected by the outside object and then entering the receiving PCBA assembly, so as to detect and process the laser by the receiving PCBA assembly.

[0044] The receiving PCBA heat dissipation device comprises a heat dissipation assembly and a PCBA assembly. The heat dissipation assembly is used to connect and fix on the shell of the laser radar. The receiving lens group is arranged in the heat dissipation assembly. The PCBA assembly comprises a heat dissipation shell and a receiving PCBA 3. The heat dissipation shell is in a hollow structure. The heat dissipation shell is connected with the heat dissipation assembly and the shell of the laser radar. The receiving PCBA 3 is at least partially located in the heat dissipation shell. In this way, when the electronic components on the receiving PCBA 3 work, the heat generated by the electronic components can be conducted to the heat dissipation assembly through the heat dissipation shell, and then transmitted to the shell of the laser radar through the heat dissipation assembly. In addition, a part of the heat can also be directly transmitted to the shell of the laser radar through the heat dissipation shell. In this way, the receiving PCBA 3 is well cooled by the heat conduction, the heat conduction path is short, the heat conduction efficiency is increased, the service life and reliability of the electronic components on the receiving PCBA 3 are ensured, and the accuracy and reliability of the laser radar during distance measurement are ensured.

[0045] The heat dissipation assembly comprises a heat dissipation block 5 and a heat dissipation strip 4. The heat dissipation block 5 and the shell of the laser radar can be connected in one piece, or can be connected by screws, adhesion or the like, as long as there is a large contact area between the heat dissipation block 5 and the shell of the laser radar. The specific material of the heat dissipation block 5 is not limited, as long as it has good thermal conductivity.

[0046] The heat dissipation block 5 is in a hollow structure, both ends of which are open. The receiving lens group is arranged inside the heat dissipation block 5. The heat dissipation shell is connected to one end of the heat dissipation block 5. The heat dissipation strip 4 is connected to the circumferential side of the heat dissipation block 5 and the circumferential side of the heat dissipation shell. In this way, by connecting the heat dissipation shell to one end of the heat dissipation block 5, the heat generated by the PCBA 3 can be directly conducted to the heat dissipation block 5 through the heat dissipation shell. At the same time, a part of the heat is transferred to the heat dissipation block 5 through the heat dissipation strip 4. Thus, the contact area between the heat dissipation block 5 and the heat dissipation shell is increased through the heat dissipation strip 4, and the heat conduction efficiency is improved.

[0047] The material of the heat dissipation strip 4 can be red copper or graphene with good thermal conductivity. The connection of the plurality of heat dissipation strips 4 with the heat dissipation shell and the heat dissipation block 5 can increase the contact area between the heat dissipation shell and the heat dissipation block 5, and improve the heat conduction efficiency.

[0048] The heat dissipation block 5 is in a hollow structure. The heat dissipation shell is provided with a light passing hole 12 facing the heat dissipation block 5. The light passing hole 12 is in communication with the inner cavity of the heat dissipation block 5. The receiving PCBA 3 is provided with a photoelectric detection device 6. The photoelectric detection device 6 corresponds to the light passing hole 12.

[0049] In this way, the laser reflected from the external object can be focused by the receiving lens group in the inner cavity of the heat dissipation block 5, and then enter the heat dissipation shell through the light passing hole 12. Since the photoelectric detection device 6 on the receiving PCBA 3 corresponds to the light passing hole 12, the laser entering the heat dissipation shell through the light passing hole 12 can irradiate the photoelectric detection device 6, so as to perform distance measurement.

[0050] The photoelectric detection device can be a silicon photomultiplier (SiPM for short internationally). It is a new type of photoelectric detection device 6 composed of an avalanche diode array working in a Geiger mode, and has the characteristics of high gain, high sensitivity, low bias voltage, magnetic field insensitivity, compact structure and the like.

[0051] It can be understood that the receiving PCBA 3 has other electronic components in addition to the photoelectric detection device 6, and these electronic components also generate heat when working. The part of the receiving PCBA 3 located in the heat dissipation shell has a first mounting surface 31 and a second mounting surface 32 on the opposite sides, and the second mounting surface 32 is away from the heat dissipation block 5 relative to the first mounting surface 31. The first mounting surface 31 and the second mounting surface 32 both have electronic components. Since the first mounting surface 31 is close to the heat dissipation block 5, the photoelectric detection device 6 is included in the electronic components on the first mounting surface 31. The electronic components on the first mounting surface 31 except the photoelectric detection device 6 are defined as first heat generating devices 7, and the electronic components on the second mounting surface 32 are defined as second heat generating devices 8.

[0052] In this embodiment, the power of the second heat generating devices 8 is greater than the power of the first heat generating devices 7.

[0053] In this way, by optimizing the layout of the electronic components arranged on the receiving PCBA 3, the second heat generating devices 8 with greater heat generation than the photoelectric detection device 6 are all arranged on the second mounting surface 32 of the receiving PCBA 3, and the first heat generating devices 7 with smaller heat generation are arranged on the first mounting surface 31, thereby reducing the size of the receiving PCBA 3, and at the same time, the influence of the heat generated by other electronic components with higher heat generation on the photoelectric detection device 6 can be reduced, and the normal work of the photoelectric detection device 6 is ensured.

[0054] The heat dissipation shell includes a first shell 1 and a second shell 2 connected opposite to each other. The first shell 1 is connected to the heat dissipation block 5 and is provided with a light passing hole 12. The end of the heat dissipation strip 4 is connected to the side wall of the second shell 2, and the heat dissipation strip 4 can also be connected to the first shell 1, so that the heat of the second shell 2 farther away from the heat dissipation block 5 is transmitted to the heat dissipation block 5 through the heat dissipation strip 4.

[0055] The connection mode of the first shell 1 and the heat dissipation block 5 is not limited, for example, it can be adhesive or welding, as long as the light passing hole 12 arranged on the first shell 1 is connected with the inner cavity of the heat dissipation block 5, and the optical axis of the receiving lens group passes through the light passing hole 12, so that the focused laser can pass through the light passing hole 12 and irradiate on the photoelectric detection device.

[0056] In this embodiment, the receiving PCBA 3 is partially located in the heat dissipation shell, and the first shell 1 and the second shell 2 are located on the opposite sides of the receiving PCBA 3, respectively.

[0057] Specifically, the first shell 1, the receiving PCBA 3 and the second shell 2 are sequentially penetrated by fasteners such as screws, so as to realize the fixation of the first shell 1, the second shell 2 and the receiving PCBA 3.

[0058] Of course, in some embodiments, the receiving PCBA 3 can also be located entirely within the heat dissipation shell, that is, the first shell 1 and the second shell 2 form an enclosed inner cavity, and the receiving PCBA 3 is located in the inner cavity.

[0059] In the embodiment, the inner surface of the heat dissipation shell includes opposite first and second faces 11 and 21, the second face 21 is away from the heat dissipation block 5 relative to the first face 11, the first face 11 is opposite to the first mounting surface 31, and the second face 21 is opposite to the second mounting surface 32, that is, the first shell 1 has the first face 11, the second shell 2 has the second face 21, and the corresponding light passing hole 12 penetrates the first face 11.

[0060] The heat-conducting insulating layer is made of an insulating material with high thermal conductivity, such as heat-conducting insulating glue, and can fill the gap between the second face 21 and the second heat generating device 8, so that the second heat generating device 8 and the second face 21 can be indirectly contacted through the heat-conducting insulating layer. In this way, the heat of the second heat generating device 8 can be directly transmitted to the second face 21 through the heat-conducting insulating layer, reducing the thermal resistance between the two and improving the heat conduction efficiency, thereby improving the heat dissipation effect.

[0061] Since the heights of the second heat generating devices 8 on the second mounting surface 32 are different, the second face 21 is arranged in a stepped shape, so that the gap between the second face 21 and each heat generating device is small enough, and the thickness of the heat-conducting insulating layer is also small.

[0062] It should be noted that the heat dissipation shell is made of a metal material with small thermal resistance, so that the heat dissipation shell has good heat conduction performance and also has electromagnetic shielding effect, which improves the electromagnetic compatibility of the receiving PCBA 3. At the same time, since the heat-conducting insulating layer has insulation effect, the electrical conduction between the electronic components and the second shell 2 can be avoided, thereby ensuring the normal operation of the electronic components.

[0063] The second shell 2 is made of a material with high thermal conductivity, such as 6061 copper alloy or oxygen-free copper, so as to improve the efficiency of heat transfer from the second heat generating device 8 to the laser radar shell.

[0064] In order to better transfer the heat of the photoelectric detection device 6 to the second shell 2, a via hole 33 is arranged on the receiving PCBA 3 and penetrates the first and second mounting surfaces 31 and 32, and the photoelectric detector covers the via hole 33. In this way, part of the heat of the photoelectric detection device 6 can enter between the second mounting surface 32 and the second face 21 through the via hole 33, and be directly conducted to the laser radar shell or the heat dissipation strip 4 through the second shell 2.

[0065] A heat-conducting layer, which can be a metal layer such as a copper layer, is coated on the inner wall of the via hole 33, so that the heat of the photoelectric detection device 6 can be more efficiently transferred to the second housing 2 through the heat-conducting layer with good heat conductivity.

[0066] Of course, in some embodiments, if the heat dissipation housing is made of a material without electrical conductivity, the first heat-conducting insulating layer can not be provided, and the stepped second surface 21 can directly contact the second heat-generating device 8.

[0067] In the present embodiment, the light transmission hole 12 has a gradually expanding structure with an increasing inner diameter from the inside to the outside, that is, the end of the light transmission hole 12 with a smaller inner diameter penetrates through the first surface 11, and the end of the light transmission hole 12 with a larger inner diameter penetrates through the outer surface of the first housing 1. In this way, the tapered inner part of the light transmission hole 12 can serve as a reflection surface 121 to reflect stray light and only allow the laser light to pass through, thereby playing a role similar to an aperture. This can save the aperture, reduce the overall size, simplify the assembly process, and improve the production efficiency.

[0068] The size of the light transmission hole 12 is the same as the size and shape of the laser spot after being focused by the receiving lens group.

[0069] In addition, the heat dissipation housing is provided with a protruding portion 22 on the outer surface, which can be clamped to facilitate the fixation of the heat dissipation housing on the housing of the laser radar, and can increase the contact area between the heat dissipation housing and the air inside the laser radar, thereby improving the heat dissipation effect of convection and playing a role in conducting heat.

[0070] Specifically, the protruding portion 22 is arranged on the heat dissipation housing at a position away from the light transmission hole 12, that is, on the side of the second housing 2 away from the first housing 1. The specific shape and size of the protruding portion 22 are not limited.

[0071] In summary, the present embodiment discloses a receiving PCBA heat dissipation device, a laser receiving module and a laser radar. A heat dissipation housing is connected to a heat dissipation assembly that can be connected to the housing of the laser radar. The receiving PCBA 3 is at least partially located in the heat dissipation housing, so that when the electronic components on the receiving PCBA 3 are working, the heat generated thereby can be conducted to the heat dissipation assembly through the heat dissipation housing, and then transferred to the housing of the laser radar through the heat dissipation assembly. In addition, a part of the heat can also be directly transferred to the housing of the laser radar through the heat dissipation housing. This heat conduction method can effectively dissipate the heat of the receiving PCBA 3, shorten the heat conduction path, increase the heat conduction efficiency, and thus ensure the service life and reliability of the electronic components on the receiving PCBA 3, and ensure the accuracy and reliability of the laser radar during ranging.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device for receiving PCBA, characterized in that, include: A heat dissipation component for connecting to the housing of a lidar, the heat dissipation component including a heat sink and heat dissipation bars, the heat sink having a hollow structure and openings at both ends; A PCBA assembly includes a heat sink housing and a receiving PCBA. The heat sink housing has a hollow structure and is connected to one end of a heat sink block. The heat sink strip is connected to the periphery of the heat sink block and the periphery of the heat sink housing. The receiving PCBA is at least partially located inside the heat sink housing. The heat dissipation housing has a light-transmitting hole on the part facing the heat dissipation block, and the light-transmitting hole is connected to the inner cavity of the heat dissipation block; The receiving PCBA is equipped with a photodetector, which corresponds to the light-transmitting hole.

2. The PCBA heat dissipation device according to claim 1, characterized in that, The portion of the receiving PCBA located inside the heat sink housing has a first mounting surface and a second mounting surface facing away from each other, with the second mounting surface being farther away from the heat sink relative to the first mounting surface. The first mounting surface is provided with the photodetector and the first heating device, and the photodetector is opposite to the light-transmitting hole; The second mounting surface is provided with a second heating element, the power of which is greater than that of the first heating element.

3. The PCBA heat dissipation device according to claim 2, characterized in that, The inner surface of the heat dissipation housing includes a first surface and a second surface opposite to each other, with the second surface being farther away from the heat dissipation block relative to the first surface; The first surface and the first mounting surface are opposite to each other, and the light-transmitting hole penetrates through the first surface; The second surface and the second mounting surface are opposite each other, and there is a thermally conductive insulating layer between the second surface and the second heating device.

4. The PCBA heat dissipation device according to claim 3, characterized in that, The second surface is stepped.

5. The PCBA heat dissipation device according to claim 2, characterized in that, The receiving PCBA has a through-hole that penetrates the first mounting surface and the second mounting surface, and the photodetector covers the through-hole.

6. The PCBA heat dissipation device according to claim 5, characterized in that, The inner wall of the via is covered with a thermally conductive layer.

7. The PCBA heat dissipation device according to claim 1, characterized in that, The heat dissipation housing includes a first housing and a second housing that are connected to each other. The first housing is connected to the heat dissipation block and is provided with the light-transmitting hole. The end of the heat dissipation strip is connected to the side wall of the second housing. And / or, The light-transmitting aperture has a gradually expanding structure with its inner diameter increasing from the inside out.

8. The PCBA heat dissipation device according to claim 1, characterized in that, The outer surface of the heat dissipation housing is provided with protrusions.

9. A laser receiving module, characterized in that, Includes the PCBA heat dissipation device according to any one of claims 1-8.

10. A lidar, characterized in that, Includes the laser receiving module as described in claim 9.

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