Cooling device and cooling method

Abstract

The application provides a cooling device and a cooling method. The cooling device is used for dissipating heat of a heat source. The cooling device comprises a container, a working liquid is contained in the container; the heat source is arranged in a preset position range above a liquid surface of the working liquid; and a bubble generating device is arranged at least partially in the working liquid and used for generating bubbles in the working liquid. After the bubbles are generated, the bubbles float upwards to the liquid surface of the working liquid and break to generate microdroplets. The microdroplets can be sputtered at least partially to a surface of the heat source, and the microdroplets sputtered on the surface of the heat source can absorb heat of the heat source and vaporize into gas. The cooling device provided by the application can generate microdroplets, the heat generated by the heat source can be directly transmitted to the microdroplets, the microdroplets can absorb the heat of the heat source and vaporize into gas, and the heat of the heat source is taken away. Therefore, when the cooling device provided by the application cools the heat source, heat transmission needs not to be performed twice, the heat transmission path is shorter, and the heat exchange efficiency is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling equipment, and in particular to a cooling equipment and a cooling method. Background Art

[0002] In the related art, a cooling device based on the thermal siphon principle is used to cool high-power electronic devices. This type of cooling device generally includes a heat dissipation substrate and heat dissipation fins connected to the heat dissipation substrate. The heat dissipation substrate and the heat dissipation fins are both provided with a cavity structure, and the cavity structures of the two are connected to allow the phase change working medium contained in the above cavity structure to circulate. When the above cooling device cools the high-power electronic device, the heat generated by the high-power electronic device is first transferred to the heat dissipation substrate. The heat dissipation substrate then exchanges heat with the liquid phase change working medium in its cavity structure. The liquid phase change working medium in the cavity structure of the heat dissipation substrate absorbs heat and vaporizes into a gaseous phase change working medium. The gaseous phase change working medium flows into the cavity structure of the heat dissipation fins, condenses and liquefies into a liquid phase change working medium, and then flows back to the cavity structure of the heat dissipation substrate. This cycle is repeated to meet the heat dissipation needs of the high-power electronic device.

[0003] In the process of implementing the present invention, the inventors discovered that the prior art has at least the following problems:

[0004] Using the above-mentioned cooling equipment to cool high-power electronic devices requires two heat transfers before the heat generated by the high-power electronic devices can be transferred to the phase change working fluid. The heat generated by the high-power electronic devices cannot be directly exchanged with the phase change working fluid in the cooling equipment, and the heat exchange efficiency is low. Summary of the Invention

[0005] In view of this, the main purpose of this application is to provide a cooling device that can improve heat exchange efficiency. This application also provides a cooling method for cooling a heat source using the above cooling device.

[0006] In a first aspect, the present application provides a cooling device for dissipating heat from a heat source, the cooling device comprising:

[0007] a container containing a working liquid; wherein the heat source is disposed within a preset position range above the liquid level of the working liquid;

[0008] A bubble generating device, at least partially disposed within the working liquid, for generating bubbles within the working liquid; DD225211I

[0009] in:

[0010] After being generated, the bubbles float to the surface of the working liquid and burst to form micro-droplets;

[0011] At least a portion of the micro-droplets can be splashed onto the surface of the heat source, and the micro-droplets splashed onto the surface of the heat source can absorb the heat of the heat source and vaporize into gas.

[0012] In one possible design, the bubble generating device includes:

[0013] A gas source and a bubble generator are arranged in the working liquid. The gas source is connected to the bubble generator. The gas source can be used to transport gas to the bubble generator. The bubble generator can be used to generate the bubbles in the working liquid.

[0014] In a possible design, the bubble generator is provided with at least one exhaust channel, one end of the exhaust channel is connected to the gas source, and the other end of the exhaust channel is connected to the working liquid.

[0015] In a possible design, the inner diameter of the exhaust channel is 0.2-2000 μm.

[0016] In a possible design, the bubble generator and the exhaust channel are both extended along the first direction.

[0017] In a possible design, the bubble generating device includes a plurality of bubble generators.

[0018] In a possible design, the gas source is provided with a flow control device, and the flow control device is used to adjust the gas flow delivered by the gas source to the bubble generator.

[0019] In one possible design, the bubble generating device includes: a heating element, which is at least partially disposed in the working liquid and can be used to heat the working liquid to generate the bubbles in the working liquid.

[0020] In one possible design, the cooling device further includes: a circulation component connected to the container, which can be used to accommodate the gas and condense the gas so that the gas is condensed into liquid, and the liquid flows back into the container through the circulation component.

[0021] In a second aspect, the present application provides a cooling method, wherein a heat source is cooled using the cooling device according to any one of the first aspects, the cooling method comprising:

[0022] generating bubbles in the working fluid by a bubble generating device;

[0023] The bubbles float to the surface of the working liquid and burst to generate micro droplets;

[0024] The micro-droplets are splashed onto the surface of a heat source disposed within a preset position range above the liquid surface of the working liquid;

[0025] in:

[0026] The micro droplets splashed onto the surface of the heat source can absorb the heat of the heat source and evaporate into gas.

[0027] The cooling device and cooling method provided by this application have at least the following advantages:

[0028] In the cooling device provided by the present application, bubbles are generated in the working liquid by a bubble generating device, and the bubbles can burst on the liquid surface of the working liquid to generate micro-droplets, and the generated micro-droplets can be splashed onto the surface of a heat source within a preset position range above the liquid surface of the working liquid. In this way, the heat generated by the heat source can be directly transferred to the micro-droplets, and the micro-droplets can absorb the heat of the heat source and vaporize into gas, taking away the heat of the heat source. Therefore, when the cooling device provided by the present application cools the heat source, there is no need to go through two heat transfers, the heat transfer path is shorter, and the heat exchange efficiency is higher. In summary, the cooling device provided by the present application can improve the heat exchange efficiency.

[0029] The cooling method provided in the present application utilizes the cooling device to cool the heat source, and can have the same advantages as the cooling device, which will not be repeated here.

[0030] Other features and advantages of the embodiments of the present application will be described in the subsequent description, and in part will become apparent from the description, or be understood by practicing the embodiments of the present application. The purposes and other advantages of the embodiments of the present application are achieved and obtained by the structures particularly pointed out in the description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic diagram of the structure of the cooling device provided in an embodiment of the present application;

[0033] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0034] Figure 3 A schematic structural diagram of a bubble generator provided in an embodiment of the present application;

[0035] Figure 4A schematic structural diagram of another bubble generator provided in an embodiment of the present application;

[0036] Figure 5 Schematic diagram of micro-droplet generation provided in the embodiment of the present application;

[0037] Figure 6 A flow chart of the cooling method provided in an embodiment of the present application.

[0038] Reference numerals:

[0039] 100. Cooling equipment;

[0040] 110. Bubbles;

[0041] 120, micro droplets;

[0042] 1. Container;

[0043] 11. Working fluid;

[0044] 2. Bubble generating device;

[0045] 21. Gas source;

[0046] 22. Bubble generator;

[0047] DD225211I

[0048] 221, exhaust channel;

[0049] 3. Heat source.

[0050] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0051] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0052] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0053] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0054] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0055] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise explicitly and specifically defined.

[0056] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0057] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0058] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also be indirectly connected to the other element "on" or "under" through an intermediate element.

[0059] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0060] In areas such as chip cooling, communication equipment heat dissipation, battery thermal management, and data center heat dissipation, electronic devices are becoming increasingly integrated and physically smaller, but their power consumption remains high. The high temperatures caused by high power consumption not only affect the performance of electronic devices, but in severe cases, can burn out the entire device.

[0061] In the related art, a cooling device based on the thermal siphon principle is used to cool high-power electronic devices. This type of cooling device generally includes a heat dissipation substrate and heat dissipation fins connected to the heat dissipation substrate. The heat dissipation substrate and the heat dissipation fins are both provided with a cavity structure, and the cavity structures of the two are connected to allow the phase change working medium contained in the above cavity structure to circulate. When the above cooling device cools the high-power electronic device, the heat generated by the high-power electronic device is first transferred to the heat dissipation substrate. The heat dissipation substrate then exchanges heat with the liquid phase change working medium in its cavity structure. The liquid phase change working medium in the cavity structure of the heat dissipation substrate absorbs heat and vaporizes into a gaseous phase change working medium. The gaseous phase change working medium flows into the cavity structure of the heat dissipation fins, condenses and liquefies into a liquid phase change working medium, and then flows back to the cavity structure of the heat dissipation substrate. This cycle is repeated to meet the heat dissipation needs of the high-power electronic device.

[0062] At present, using the above-mentioned cooling equipment to cool high-power electronic devices requires two heat transfers before the heat generated by the high-power electronic devices can be transferred to the phase change working fluid. The heat generated by the high-power electronic devices cannot be directly exchanged with the phase change working fluid, and the heat exchange efficiency is low.

[0063] In order to improve the above-mentioned problems, the present application provides a cooling device and a cooling method.

[0064] The following describes the specific embodiments of the cooling device and cooling method provided in the embodiments of the present application.

[0065] In a first aspect, the present invention provides a cooling device 100. Figure 1 The cooling device 100 can be used to dissipate heat from the heat source 3. The cooling device 100 includes:

[0066] Container 1, containing working liquid 11;

[0067] a bubble generating device 2, wherein the bubble generating device 2 is at least partially disposed in the container 1;

[0068] in:

[0069] The bubble generating device 2 is at least partially disposed within the working liquid 11. The bubble generating device 2 can be used to generate bubbles 110 within the working liquid 11. The bubbles 110 will at least rise to the surface of the working liquid 11 due to buoyancy and float on the liquid surface. When the bubbles 110 cannot be supported, for example, when the pressure inside the bubbles 110 is the same as the pressure outside the bubbles 110, wrinkles will form around the bubbles 110, causing the structure of the bubbles 110 to become unstable. In this case, the bubbles 110 will be unable to be supported and will burst on the surface of the working liquid 11. The bubbles 110 burst to generate micro-droplets 120. That is, after the bubbles 110 are generated, they float to the surface of the working liquid 11 and burst to generate micro-droplets 120.

[0070] The heat source 3 is arranged within a preset position range above the liquid surface of the working liquid 11, and the micro-droplets 120 can at least partially splash onto the surface of the heat source 3. The micro-droplets 120 splashed onto the surface of the heat source 3 can absorb the heat of the heat source 3 and vaporize into gas, taking away the heat of the heat source 3.

[0071] In some embodiments, the bubble 110 generated in the working liquid 11 by the bubble generating device 2 may have a particle size ranging from 30 to 5000 μm, and the particle size of the micro-droplets 120 generated when the bubble 110 bursts may range from 10 to 500 μm.

[0072] It should be noted that the micro-droplets 120 generated by the bursting of the bubbles 110 have an initial velocity and can splash onto a target within a certain range. Therefore, the heat source 3 being positioned within a predetermined position range above the liquid surface of the working liquid 11 can mean that the heat source 3 is positioned within a position range above the liquid surface of the working liquid 11 that can receive the micro-droplets 120. That is, the heat source 3 is positioned within a position range above the liquid surface of the working liquid 11 that can receive the micro-droplets 120. For example, assuming that the micro-droplets 120 can splash onto a target at a height of 10 mm from the liquid surface of the working liquid 11, the predetermined position range can be a position range of 3-6 mm from the liquid surface of the working liquid 11. By positioning the heat source 3 within a position range of 3-6 mm above the liquid surface of the working liquid 11, the micro-droplets 120 can at least partially splash onto the surface of the heat source 3. In this way, the heat dissipation requirements of the heat source 3 are met through heat exchange between the micro-droplets 120 and the heat source 3.

[0073] Specifically, the heat source 3 is arranged above the liquid surface of the working liquid 11 within a position range that can receive the micro-droplets 120. The micro-droplets 120 generated when the bubbles 110 burst can be splashed onto the surface of the heat source 3. The micro-droplets 120 splashed onto the surface of the heat source 3 can absorb the heat of the heat source 3 and vaporize, that is, after the micro-droplets 120 absorb heat, they can be converted from liquid to gas. The micro-droplets 120 will absorb a large amount of heat during the vaporization process, thereby taking away the heat of the heat source 3. Such a cycle can achieve heat dissipation for the heat source 3.

[0074] It should be noted that the heat source 3 here refers to a high-power electronic device, such as a chip, etc. Of course, the heat source 3 can also be other types of electronic devices, and this application does not make any special restrictions on this.

[0075] It can be understood that the cooling device 100 generates bubbles 110 in the working liquid 11 through the bubble generating device 2, and the bubbles 110 will have an initial movement speed. Since the bubbles 110 have an initial movement speed and the bubbles 110 are affected by buoyancy, the bubbles 110 will at least rise from the inside of the working liquid 11 to the liquid surface of the working liquid 11 due to the buoyancy and can float on the liquid surface. When the bubbles 110 cannot be supported, for example, when the pressure inside the bubbles 110 is consistent with the pressure outside the bubbles 110, wrinkles are formed around the bubbles 110, causing the structure of the bubbles 110 to no longer be stable. In this case, the bubbles 110 will not be able to be supported, and the bubbles 110 will burst on the liquid surface of the working liquid 11. The bursting of the bubbles 110 will generate micro-droplets 120. Therefore, the heat source 3 can be set above the liquid surface of the working liquid 11 in the container 1 of the cooling device 100, specifically, the heat source 3 can be set within a preset position range above the liquid surface of the working liquid 11 (that is, within the position range that can receive the micro-droplets 120). When dissipating heat to the heat source 3, bubbles 110 are generated in the working liquid 11 by the bubble generating device 2. After the bubbles 110 are generated, they float to the surface of the working liquid 11 and burst to generate micro-droplets 120. The micro-droplets 120 are splashed onto the surface of the heat source 3. The micro-droplets 120 splashed onto the surface of the heat source 3 absorb the heat of the heat source 3, undergo a phase change reaction, and vaporize into gas. In this cycle, the heat of the heat source 3 can be taken away based on the phase change heat, thereby meeting the heat dissipation needs of the heat source 3.

[0076] As can be seen from the above, in the cooling device 100 provided by the present application, bubbles 110 are generated in the working liquid 11 by the bubble generating device 2, and the bubbles 110 can rupture on the liquid surface of the working liquid 11 to generate micro-droplets 120, and the generated micro-droplets 120 can be splashed onto the surface of the heat source 3 within a preset position range above the liquid surface of the working liquid 11. In this way, the heat generated by the heat source 3 can be directly transferred to the micro-droplets 120, and the micro-droplets 120 can absorb the heat of the heat source 3 and vaporize into gas, taking away the heat of the heat source 3. Therefore, when the cooling device 100 provided by the present application cools the heat source, it does not need to go through two heat transfers, the heat transfer path is shorter, and the heat exchange efficiency is higher. In summary, the cooling device 100 provided by the present application can improve the heat exchange efficiency.

[0077] On the other hand, the cooling device 100 provided in the present application cools the heat source 3 by exchanging heat with the heat source 3 through the micro-droplets 120 sputtered onto the surface of the heat source 3. Its specifications and dimensions are less restricted by the heat dissipation requirements of the heat source 3, and the container 1 and the bubble generating device 2 can be designed according to the actual scenario. Therefore, the cooling device 100 can be suitable for small spaces, and the micro-droplets 120 generated when the bubbles 110 burst are themselves small in size. The micro-droplets 120 can cool high-power electronic devices (i.e., the heat source 3) in a small space and can achieve a good cooling effect.

[0078] See also Figure 2 Container 1 can be a box, barrel, or box, and can be a closed or semi-open structure. It is understood that in some embodiments, container 1 can be the shell of heat source 3, that is, the shell of heat source 3 is used as container 1, so that no additional container is required. Of course, in other embodiments, container 1 can be an independent structure unrelated to heat source 3, that is, container 1 can be prepared according to the actual scenario. This application does not make any special restrictions on this, and can be flexibly selected according to actual needs.

[0079] The working liquid 11 can be a non-conductive single liquid working medium such as pure water, R134a (tetrafluoroethane), electronic fluorinated liquid, or a non-conductive mixed solution containing any one of the above components.

[0080] It should be noted that the working liquid 11 is a non-conductive liquid working medium that can undergo a phase change reaction. That is, the working liquid 11 is non-conductive and can be vaporized from a liquid to a gas. In one embodiment, the working liquid 11 can be an electronic fluoride liquid. When the working liquid 11 is non-conductive, the micro-droplets 120 sputtering on high-power electronic devices (i.e., heat source 3) will not pose a short circuit risk to the electronic devices. It is understood that the working liquid 11 can undergo a phase change, that is, the working liquid 11 can be vaporized from a liquid to a gas.

[0081] It can be understood that the cooling device provided in the present application can use a non-conductive single liquid working medium to generate microdroplets 120, or can use a non-conductive mixed solution to generate microdroplets 120, and can change the generation rate and generation quantity of microdroplets 120 by adjusting the initial movement speed of the bubbles 110.

[0082] See also Figure 3 and Figure 5 The bubbles 110 generated in the working liquid 11 are at least floated to the surface of the working liquid 11 by the buoyancy, and can break on the surface of the liquid to generate micro droplets 120. Figure 5 As can be seen from the figure, the micro-droplet 120 can rise in a direction nearly perpendicular to the liquid surface of the working liquid 11.

[0083] It should be noted that the sputtering direction and the number of generated droplets 120 can be adjusted by adjusting factors such as the particle size of the bubbles 110 and the surface tension of the working liquid 11 .

[0084] In some embodiments, the bubble generating device 2 includes a heating element, and the heating portion of the heating element can extend into the working liquid 11, that is, the heating element is at least partially disposed in the working liquid 11. The heating element can be used to heat the working liquid 11 to generate bubbles 110 in the working liquid 11. Specifically, the working liquid 11 is heated by the heating element, so that the gas dissolved in the working liquid 11 is heated to generate bubbles 110. The bubbles 110 will at least float to the surface of the working liquid 11 due to buoyancy, and may burst on the surface to generate micro-droplets 120.

[0085] The heat source 3 can be any electronic device. The heat source 3 is positioned within a predetermined range above the liquid surface of the working liquid 11. The distance between the heat source 3 and the working liquid 11 should ensure that the micro-droplets 120 generated when the bubbles 110 burst can splash onto the surface of the heat source 3. It is understood that the distance between the heat source 3 and the liquid surface of the working liquid 11 should not be too large so that the heat source 3 can more fully receive the micro-droplets 120, thereby ensuring the cooling effect on the heat source 3.

[0086] In some embodiments, the bubble generating device 2 includes: a gas source 21 and a bubble generator 22 arranged in the working liquid 11. The gas source 21 is connected to the bubble generator 22. The gas source 21 can be used to transport gas to the bubble generator 22. The bubble generator 2 can be used to generate bubbles 110 in the working liquid 11.

[0087] See also Figure 1 and Figure 2The gas source 21 can be a device capable of conveying gas, such as an air pump or a syringe pump. The bubble generator 22 can be a nozzle array with multiple exhaust channels 221 inside. The exhaust channels 221 in the nozzle array are connected to the gas outlet of the gas source 21 through a pipeline, that is, one end of the exhaust channel 221 is connected to the gas source 21. The inner diameter of the exhaust channel 221 is at the micron level. In one embodiment, the inner diameter of the exhaust channel 221 is 0.2-2000μm. Specifically, the inner diameter of the exhaust channel 221 can be 0.2μm, 1μm, 10μm, 50μm, 100μm, 150μm, 200μm, 500μm, 800μm, 1000μm, 1500μm, 2000μm, etc. By adjusting the inner diameter of the exhaust channel 221, the particle size of the bubbles 110 generated by the gas output from the exhaust channel 221 can be controlled. The gas source 21 can transport gas into the exhaust channel 221. Furthermore, the gas can be a non-condensable gas (non-condensable gas means that it cannot be liquefied by isothermal compression above the critical temperature) to ensure that bubbles 110 can be stably generated in the working liquid 11. The non-condensable gas can be filtered air, nitrogen, argon or other inert gases.

[0088] This embodiment can improve the generation efficiency of bubbles 110 and micro-droplets 120 by providing a bubble generator 22 with multiple exhaust channels 221, so that more micro-droplets 120 can be splashed onto the heat source 3 per unit time, thereby improving the cooling efficiency of the cooling device 100.

[0089] In one embodiment, the gas source 21 is provided with a flow control device, and the flow control device is used to adjust the flow rate of gas delivered by the gas source 21 to the bubble generator 22 .

[0090] The following is a specific structural example of a flow control device: The flow control device includes a control unit, a proportional valve, and a mass flow sensor connected to the control unit. The flow control device uses the mass flow sensor to measure the flow rate of gas delivered from gas source 21 to bubble generator 22 in real time. The control unit processes this flow rate information and issues a control command to the proportional valve mounted on gas source 21, which then regulates the gas flow rate.

[0091] In this embodiment, a flow control device is used to adjust the gas flow rate delivered from the gas source 21 to the bubble generator 22, thereby controlling the number of bubbles 110 generated per unit time and the initial velocity of the generated bubbles 110, thereby controlling the generation rate and number of micro-droplets 120. The greater the number of micro-droplets 120 generated per unit time, the higher the cooling efficiency of the cooling device 100. By adjusting the generation efficiency of the bubbles 110 through the flow control device, this embodiment indirectly adjusts the cooling efficiency of the cooling device 100.

[0092] In one embodiment, the bubble generator 22 is provided with at least one exhaust channel 221 , one end of the exhaust channel 221 is connected to the gas source 21 , and the other end of the exhaust channel 221 is connected to the working liquid 11 .

[0093] See also Figure 4 When the bubble generator 22 is only provided with a single exhaust channel 221, the bubble generator 22 can be set to a needle tube structure, and the gas source 21 is connected to one end of the exhaust channel 221 and can transport gas into the exhaust channel 221, that is, the gas source 21 is connected to one end of the exhaust channel 221, and the gas transported into the exhaust channel 221 by the gas source 21 can be discharged from the other end of the exhaust channel 221 and form bubbles 110 in the working liquid 11. The bubbles 110 in this embodiment can be generated at only one position, and the position of the bubbles 110 is highly controllable. The micro-droplets 120 generated when the bubbles 110 burst are also more controllable, which is conducive to controlling the micro-droplets 120 to be precisely sputtered onto the surface of the heat source 3.

[0094] When the bubble generator 22 is provided with a plurality of exhaust channels 221, the bubble generator 22 can be provided with a structure similar to a shower head, such as a nozzle array, and the gas source 21 is connected to each exhaust channel 221 of the nozzle array and supplies gas into the exhaust channel 221, that is, each exhaust channel 221 of the nozzle array is connected to the gas source 21, and the gas transported to the nozzle array by the gas source 21 can be discharged from the output end of each exhaust channel 221 and form bubbles 110 in the working liquid 11. The bubbles 110 in this embodiment can be generated at multiple positions, the generation efficiency of the bubbles 110 is high, the number of micro-droplets 120 generated per unit time is also large, and the cooling efficiency of the cooling device 100 is high.

[0095] In one embodiment, the bubble generating device 2 includes a plurality of bubble generators 22 .

[0096] See also Figure 2 Providing multiple bubble generators 22 can further improve the cooling efficiency of the cooling device 100, and can also cool multiple heat sources 3 above the liquid surface of the working liquid 11 or multiple positions of a single heat source 3.

[0097] In one embodiment, the bubble generator 22 and the exhaust channel 221 are both arranged to extend along a first direction. In the illustrated embodiment, the bubble generator 22 and the exhaust channel 221 are both arranged to extend along a vertical direction, that is, the first direction can be a vertical direction. In other embodiments, the first direction can also be an inclined direction that forms a certain angle (such as an angle of 1°, 5°, etc.) with the vertical direction, etc., and the specific details are not elaborated or specifically limited in this application.

[0098] See also Figure 4The gas source 21 can be connected to and communicated with the opening at the lower end of the exhaust channel 221. The gas delivered into the exhaust channel 221 by the gas source 21 flows along the exhaust channel 221 and forms bubbles 110 at the opening at the upper end of the exhaust channel 221. The arrangement of the bubble generator 22 and the exhaust channel 221 in this embodiment allows for smoother gas discharge and makes it easier for the bubbles 110 generated at the end of the exhaust channel 221 to separate from the bubble generator 22.

[0099] In one embodiment, the cooling device 100 further includes a circulation component connected to the container 1 , and the circulation component can be used to contain gas and condense the gas so that the gas is condensed into liquid, and the liquid flows back into the container 1 through the circulation component.

[0100] The circulation component includes a collecting port, a gas-liquid separator, and a reflux port that leads into the interior of the container 1 at one end. The collecting port and the reflux port are both connected to the gas-liquid separator through a pipeline. The gas generated by the heat absorption and vaporization of the micro-droplets 120 on the surface of the heat source 3 can enter the gas-liquid separator along the pipeline from the collecting port. The gas can be condensed and liquefied into liquid during the transportation process. The liquid is stored in the gas-liquid separator and then flows back into the container 1 through the reflux port, thereby realizing the recycling of the working liquid 11 and reducing operating costs. It is understandable that in other embodiments, the cooling device 100 may include a circulation component connected to the container 1, and a working liquid 11 supply device may be used to transport the working liquid 11 to the container 1. The specific application does not elaborate or limit it.

[0101] Second, see Figure 6 The present application provides a cooling method, which utilizes the cooling device 100 to cool the heat source 3. The cooling method includes:

[0102] S1: Generate bubbles 110 in the working liquid 11 through the bubble generating device 2;

[0103] S2: The bubbles 110 float to the surface of the working liquid 11 and burst to form micro-droplets 120;

[0104] S3: The micro-droplets 120 are splashed onto the surface of the heat source 3 which is arranged within a preset position range above the liquid surface of the working liquid 11;

[0105] in:

[0106] DD225211I

[0107] The fine droplets 120 splashed onto the surface of the heat source 3 can absorb the heat of the heat source 3 and evaporate into gas.

[0108] The cooling method can be used in conjunction with any of the aforementioned cooling devices 100. The cooling method provided herein can generate bubbles 110 within the working liquid 11 by ventilating the working liquid 11, or can generate bubbles 110 by heating the working liquid 11 so that dissolved gas within the working liquid 11 precipitates from the working liquid 11. The heat source 3 can be suspended or otherwise fixed above the surface of the working liquid 11, with the heat source 3 being at a distance from the surface of the working liquid 11 that is less than the expected rise height of the microdroplets 120 generated when the bubbles 110 rupture.

[0109] The cooling method provided in the present application utilizes the cooling device 100 to cool the heat source 3, and can have the same advantages as the cooling device 100, which will not be repeated here.

[0110] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A cooling device for dissipating heat from a heat source (3), characterized in that: The cooling device comprises: A container (1), wherein the container (1) contains a working liquid (11); the heat source (3) is arranged within a preset position range above the liquid surface of the working liquid (11); a bubble generating device (2), at least partially disposed in the working liquid (11), and configured to generate bubbles (110) in the working liquid (11); in: After being generated, the bubbles (110) float to the surface of the working liquid (11) and burst to generate micro-droplets (120); At least a portion of the micro-droplets (120) can be splashed onto the surface of the heat source (3), and the micro-droplets (120) splashed onto the surface of the heat source (3) can absorb the heat of the heat source (3) and vaporize into gas.

2. The cooling device according to claim 1, characterized in that The bubble generating device (2) comprises: A gas source (21) and a bubble generator (22) disposed in the working liquid (11), wherein the gas source (21) is connected to the bubble generator (22), the gas source (21) can be used to deliver gas to the bubble generator (22), and the bubble generator (22) can be used to generate the bubbles (110) in the working liquid (11).

3. The cooling device according to claim 2, characterized in that The bubble generator (22) is provided with at least one exhaust channel (221), one end of the exhaust channel (221) is connected to the gas source (21), and the other end of the exhaust channel (221) is connected to the working liquid (11).

4. The cooling device according to claim 3, characterized in that The inner diameter of the exhaust channel (221) is 0.2-2000 μm.

5. The cooling device according to claim 3, characterized in that The bubble generator (22) and the exhaust channel (221) are both extended along a first direction.

6. The cooling device according to any one of claims 2 to 5, characterized in that: The bubble generating device (2) includes a plurality of bubble generators (22).

7. The cooling device according to any one of claims 2 to 5, characterized in that: The gas source (21) is provided with a flow control device, and the flow control device is used to adjust the flow of gas delivered by the gas source (21) to the bubble generator (22).

8. The cooling device according to claim 1, characterized in that The bubble generating device (2) comprises a heating element, which is at least partially disposed in the working liquid (11) and can be used to heat the working liquid (11) to generate the bubbles (110) in the working liquid (11).

9. The cooling device according to claim 1, characterized in that The cooling device further comprises: a circulation component connected to the container (1), wherein the circulation component can be used to accommodate the gas and condense the gas so as to condense the gas into liquid, and the liquid flows back into the container (1) through the circulation component.

10. A cooling method, characterized in that: The heat source (3) is cooled using the cooling device according to any one of claims 1 to 9, wherein the cooling method comprises: generating bubbles (110) in the working liquid (11) by a bubble generating device (2); The bubbles (110) float to the surface of the working liquid (11) and burst to generate micro droplets (120); The micro-droplets (120) are splashed onto the surface of a heat source (3) disposed within a preset position range above the liquid surface of the working liquid (11); in: The micro-droplets (120) splashed onto the surface of the heat source (3) can absorb the heat of the heat source (3) and evaporate into gas.

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