Laser processing method for packaged product, packaged product and electronic equipment

Abstract

The present invention provides a laser processing method for a packaged product, a packaged product, and an electronic device. The laser processing method for a packaged product comprises the following steps: providing a vacuum suction holder; wherein the vacuum suction holder comprises a main body and a telescopic suction nozzle retractably mounted on the main body; placing a workpiece on the telescopic suction nozzle, wherein the telescopic suction nozzle adjusts its height according to the shape of the workpiece to accommodate the shape and absorb the workpiece; obtaining height information of the telescopic suction nozzle; and controlling a laser to process the workpiece based on the height information. This laser processing method for a packaged product eliminates the step of flattening the workpiece, resulting in no significant stress on the processed product and the advantage of preventing damage to the workpiece due to stress.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging product manufacturing, and in particular to a laser processing method for a packaging product, a packaging product and an electronic device. Background Art

[0002] In related products, especially system-level packaging (SLP), after the product is plastic-sealed to form a packaged product, it is cut to form individual units. However, since the plastic-sealed product often exhibits excessive warping, the laser focus position significantly affects the processing effect during subsequent laser processing (such as laser marking, laser cutting, and laser grooving). To ensure the product processing effect, the product needs to be flattened. Therefore, the plastic-sealed packaged product is usually flattened using tooling before laser processing. However, the product is subjected to significant stress after being flattened, which can easily damage the workpiece within the packaged product.

[0003] In view of this, it is necessary to provide a new laser processing method for packaging products, packaging products and electronic equipment to solve or at least alleviate the above technical defects. Summary of the Invention

[0004] In view of the above problems, the present invention provides a laser processing method for packaging products, packaging products and electronic equipment, aiming to solve the technical problem that products made by the laser processing method for packaging products in related technologies have large stress and are prone to damage to the workpiece.

[0005] According to one aspect of the present invention, the present invention provides a laser processing method for a packaged product, comprising the following steps:

[0006] A vacuum suction base is provided; wherein the vacuum suction base comprises a body and a telescopic suction nozzle telescopically arranged on the body;

[0007] The workpiece to be processed is placed on the telescopic suction nozzle, and the telescopic suction nozzle adjusts its height according to the shape of the workpiece to be processed to adapt to the shape of the workpiece to be processed and absorbs the workpiece to be processed;

[0008] Obtaining height information of the telescopic nozzle;

[0009] The workpiece to be processed is processed according to the height information.

[0010] In one embodiment, the number of the telescopic suction nozzles is multiple, and the step of the telescopic suction nozzle adjusting its height according to the shape of the workpiece to be processed to absorb the workpiece to be processed includes:

[0011] Each of the telescopic suction nozzles independently adjusts its height according to the shape of the workpiece to be processed so as to adapt to the shape of the workpiece to be processed and adsorbs on the surface of the workpiece to be processed.

[0012] In one embodiment, the telescopic nozzle includes a connecting tube, an elastic deformable member, a hollow tube, and a pressure sensor. The connecting tube is connected to the body. The hollow tube is slidably disposed on the inner wall surface of the connecting tube. Both ends of the elastic deformable member abut against the hollow tube and the connecting tube, respectively. The pressure sensor is disposed at an end of the elastic deformable member facing the connecting tube. The step of obtaining height information of the telescopic nozzle includes:

[0013] Obtaining a pressure value received by the pressure sensor;

[0014] Obtaining a deformation amount of the elastic deformable member according to the pressure value and the elastic modulus of the elastic deformable member;

[0015] The height information is obtained according to the deformation amount and the initial height of the telescopic suction nozzle.

[0016] In one embodiment, the telescopic nozzle includes a connecting tube, an elastically deformable member, and a hollow tube, the connecting tube being connected to the body, the hollow tube being slidably disposed on an inner wall surface of the connecting tube, and two ends of the elastically deformable member respectively abutting against the hollow tube and the connecting tube. The step of obtaining height information of the telescopic nozzle includes:

[0017] A laser rangefinder or an infrared sensor is used to obtain the height information of the telescopic nozzle.

[0018] In one embodiment, the step of processing the workpiece according to the height information includes:

[0019] Controlling the controller to receive the altitude information;

[0020] The distance between the light source and the lens of the laser head is adjusted during the processing of the workpiece according to the height information and the processing path of the laser head.

[0021] In one embodiment, the step of processing the workpiece according to the height information includes:

[0022] Controlling the controller to receive the altitude information;

[0023] Acquiring a moving path of the workpiece to be processed according to the height information;

[0024] The workpiece to be processed is controlled to move according to the movement path during the processing.

[0025] In one embodiment, the main body is further provided with a fixed suction nozzle, and the fixed suction nozzle and the telescopic suction nozzle jointly suck the workpiece to be processed, and the height information of the telescopic suction nozzle is obtained;

[0026] Acquire height information of the fixed suction nozzle and the telescopic suction nozzle.

[0027] In one embodiment, the step of providing a vacuum suction base, wherein the vacuum suction base includes a body and a telescopic suction nozzle telescopically disposed on the body, comprises:

[0028] A vacuum suction seat is provided; wherein, the vacuum suction seat comprises a body, the fixed suction nozzle and a telescopic suction nozzle telescopically arranged on the body, and the fixed suction nozzle is arranged on the inner side of the telescopic suction nozzle.

[0029] According to another aspect of the present invention, the present invention further provides a packaging product, which is manufactured using the laser processing method for packaging products described above.

[0030] According to yet another aspect of the present invention, the present invention further provides an electronic device, comprising the packaged product described above.

[0031] In the above scheme, the laser processing method of the packaged product includes the following steps: providing a vacuum suction seat; wherein the vacuum suction seat includes a main body and a telescopic suction nozzle that is telescopically arranged on the main body; placing the workpiece to be processed on the telescopic suction nozzle, and the telescopic suction nozzle adjusts its own height according to the shape of the workpiece to be processed to adapt to the shape of the workpiece to be processed and adsorbs the workpiece to be processed; obtaining the height information of the telescopic suction nozzle; and controlling the laser to process the workpiece to be processed according to the height information. The telescopic suction nozzle can adjust its own height according to the shape of the workpiece to be processed to adapt to the shape of the workpiece to be processed and adsorb the workpiece to be processed; by obtaining the height information of the telescopic suction nozzle, the shape information of the workpiece to be processed can be determined, and then the laser can be controlled to process the workpiece according to the shape of the workpiece to be processed. This embodiment eliminates the step of flattening the workpiece to be processed, and the processed product will not have a large stress, which has the advantage of not damaging the workpiece due to stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference numerals are used throughout the drawings to denote the same components. In the drawings:

[0035] Figure 1Schematic diagram of the process of the laser processing method of the packaged product according to the first embodiment of the present invention;

[0036] Figure 2 A schematic structural diagram of a packaged product processing method according to an embodiment of the present invention;

[0037] Figure 3 Schematic diagram of the process of the laser processing method of the packaged product according to the first embodiment of the present invention;

[0038] Figure 4 Schematic diagram of the process of the laser processing method of the packaged product according to the first embodiment of the present invention;

[0039] Figure 5 Schematic diagram of the process of the laser processing method of the packaged product according to the first embodiment of the present invention;

[0040] Figure 6 Schematic diagram of the process of the laser processing method of the packaged product according to the first embodiment of the present invention;

[0041] Figure 7 Schematic diagram of the process of the laser processing method of the packaged product according to the first embodiment of the present invention;

[0042] Figure 8 Schematic diagram of the process of the laser processing method of the packaged product according to the first embodiment of the present invention;

[0043] Figure 9 This is a schematic structural diagram of a telescopic nozzle according to an embodiment of the present invention;

[0044] Figure 10 Schematic diagram of the structure of the vacuum suction base according to an embodiment of the present invention.

[0045] The accompanying drawings in the specific implementation manner are as follows:

[0046] 10. Workpiece to be processed; 20. Laser head; 40. Fixed suction nozzle; 50. Telescopic suction nozzle; 51. Connecting tube; 52. Elastic deformation part; 53. Hollow tube; 54. Cavity; 60. Vacuum suction seat; 61. First through hole; 62. Second through hole; 63. Main body; 64. First vacuum tank; 65. Second vacuum tank. DETAILED DESCRIPTION

[0047] The following embodiments of the technical solution of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only examples and are not intended to limit the scope of protection of the present invention.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which the present invention belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions.

[0049] In the description of the embodiments of the present invention, technical terms such as "first" and "second" are used solely to distinguish between different objects and should not be understood to indicate or imply relative importance or to implicitly specify the quantity, specific order, or primary and secondary relationship of the technical features indicated. In the description of the embodiments of the present invention, "plurality" means more than two, unless otherwise specifically defined.

[0050] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0051] In the description of the embodiments of the present invention, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exists simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0052] In the description of the embodiments of the present invention, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0053] In the description of the embodiments of the present invention, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present invention.

[0054] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and can refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0055] Reference Figure 1 、 Figure 2 and Figure 10 , Figure 1 1 is a flow chart of a laser processing method for a packaged product according to a first embodiment of the present invention. The laser processing method for a packaged product includes the following steps:

[0056] S10, providing a vacuum suction base 60; wherein the vacuum suction base 60 includes a body 63 and a telescopic suction nozzle 50 telescopically disposed on the body 63;

[0057] The vacuum suction seat 60 is used to connect with the vacuum generator. The vacuum suction seat 60 includes a main body 63 and a telescopic suction nozzle 50 arranged on the main body 63. The telescopic suction nozzle 50 can be a vacuum suction nozzle. A through hole is also provided on the main body 63. The through hole is used to connect the vacuum generator and the telescopic suction nozzle 50. When the vacuum generator starts working, it can generate negative pressure to enable the telescopic suction nozzle 50 to adsorb the workpiece 10 to be processed thereon. The telescopic suction nozzle 50 can be extended or shortened on the main body 63, specifically, it can be extended or shortened along the direction of its own central axis.

[0058] S20, placing the workpiece 10 on the telescopic suction nozzle 50, and the telescopic suction nozzle 50 adjusts its height according to the shape of the workpiece 10 to adapt to the shape of the workpiece and sucks the workpiece 10;

[0059] It should be noted that the workpiece 10 to be processed can be of any shape as long as it can be sucked by the telescopic suction nozzle 50. The laser processing method of the packaged product of the present invention is particularly suitable for products with curvature or warping, such as plastic-sealed packaged products. The packaged products formed by plastic-sealing circuit boards and electronic components thereon often have warping. In such cases, if laser processing is directly used, the processed product will have many defects because the curved processing surface is not a flat surface. The present invention places the workpiece 10 on the telescopic suction nozzle 50. Under the action of the gravity of the workpiece 10, the telescopic suction nozzle 50 can be compressed. Specifically, the telescopic suction nozzle 50 is compressed more in the portion of the workpiece 10 that bends downward toward the telescopic suction nozzle 50; the telescopic suction nozzle 50 is compressed less or not compressed in the portion of the workpiece 10 that is tilted upward away from the telescopic suction nozzle 50. In this way, the compression amount of the telescopic suction nozzle 50 is adjusted according to the shape of the workpiece 10, so that the top of each telescopic suction nozzle 50 will contact the workpiece 10. After the vacuum generator starts working, the workpiece 10 can also be tightly adsorbed to facilitate subsequent processing. It should be noted that Figure 2 The workpiece 10 shown is bent downward, but the present invention is also applicable to a workpiece 10 that is bent upward.

[0060] S30, obtaining height information of the telescopic nozzle 50;

[0061] There can be multiple telescopic suction nozzles 50, and the height information of each telescopic suction nozzle 50 is obtained separately. Since the deformation of the telescopic suction nozzle 50 changes according to the shape of the workpiece 10 to be processed, the shape information of the workpiece 10 to be processed can be obtained based on the height information of the telescopic suction nozzle 50.

[0062] S40 , controlling the laser to process the workpiece 10 according to the height information.

[0063] The shape information of the workpiece 10 to be processed is obtained based on the height information, and the adjustment can be made according to the shape of the workpiece 10 to be processed, so that the laser can always be focused on the workpiece 10 to be processed during the processing, thereby improving the processing effect.

[0064] In the above-described embodiment of the present invention, the telescopic suction nozzle 50 can adjust its height according to the shape of the workpiece 10 to accommodate the shape of the workpiece 10 and absorb the workpiece 10. By acquiring information about the height of the telescopic suction nozzle 50, the shape of the workpiece 10 can be determined, and the laser can then be controlled to process the workpiece 10 in accordance with the shape of the workpiece 10. This embodiment eliminates the step of flattening the workpiece 10, and the processed product is free of significant stress, thus preventing damage to the workpiece due to stress.

[0065] The number of the telescopic nozzle 50 can be multiple, refer to Figure 3 , Figure 3 Schematic diagram of the process of the laser processing method of the packaged product according to the second embodiment of the present invention; step S20 includes:

[0066] S21 , each telescopic suction nozzle 50 independently adjusts its own height according to the shape of the workpiece 10 to adapt to the shape of the workpiece 10 and adsorbs on the surface of the workpiece 10 .

[0067] Depending on the size and curvature of the workpiece 10, multiple telescopic nozzles 50 may be required to hold the workpiece 10. The adjustments of each telescopic nozzle 50 are independent of one another and do not affect each other. Each telescopic nozzle 50 contracts based on the shape of the workpiece 10 at the location it corresponds to. This allows all telescopic nozzles 50 to be attached to various locations on the warped product, improving suction strength while also allowing the highly accurate reflection of the warped workpiece 10's shape through the telescopic nozzles 50, facilitating subsequent laser processing based on the shape information of the workpiece 10.

[0068] In the above-mentioned embodiment of the present invention, each telescopic suction nozzle 50 can be independently adjusted according to the shape of the workpiece 10 to be processed. While improving the adsorption strength, the telescopic suction nozzle 50 can also highly realistically reflect the shape of the warped packaged product and obtain accurate product shape information.

[0069] Reference Figure 4 and Figure 9 , Figure 4 This is a flow chart of a laser processing method for a packaged product according to a third embodiment of the present invention. The telescopic nozzle 50 includes a connecting tube 51, an elastic deformable member 52, a hollow tube 53, and a pressure sensor. The connecting tube 51 is connected to the body 63. The hollow tube 53 is slidably disposed on the inner wall of the connecting tube 51. The ends of the elastic deformable member 52 abut against the hollow tube 53 and the connecting tube 51, respectively. The pressure sensor is disposed at the end of the elastic deformable member 52 facing the connecting tube 51. Step S30 includes:

[0070] S31, obtaining a pressure value received by a pressure sensor;

[0071] The pressure sensor can detect the pressure value of the elastic deformable member 52 , which is the elastic force generated by the elastic deformable member 52 after deformation. The elastic deformable member 52 here can be a spring.

[0072] S32, obtaining a deformation amount of the elastic deformable member 52 according to the pressure value and the elastic modulus of the elastic deformable member 52;

[0073] According to the formula F=kx, where F represents the elastic force, k represents the elastic modulus coefficient, which is determined by the material of the elastic deformable member 52, and x represents the deformation, the elastic force is the pressure value, from which the deformation of the elastic deformable member 52 can be obtained.

[0074] S33 , obtaining height information according to the deformation amount and the initial height of the telescopic nozzle 50 .

[0075] Assuming that the initial height information of the telescopic nozzle 50 is H, the deformation amount x of the elastic deformable member 52 is actually the height of the telescopic nozzle 50 descent. Therefore, the height h of the telescopic nozzle 50 after extension and contraction is: h=Hx.

[0076] In the above-described embodiment of the present invention, the connecting tube 51 is connected to the through-hole of the main body 63. The connecting tube 51 forms a cavity 54. The hollow tube 53 is hollow and slidably disposed within the cavity 54. The hollow tube 53 is used to absorb the workpiece to be processed. The hollow tube 53 is connected to the cavity 54. In this way, when the vacuum generator is in operation, it can evacuate air through the path of the through-hole-cavity 54-hollow tube, generating negative pressure to absorb the workpiece to be processed. The elastic deformable member 52 is disposed in the cavity 54. One end of the elastic deformable member 52 abuts the connecting tube 51, and the other end of the elastic deformable member 52 is connected to the hollow tube 53. When the hollow tube 53 is subjected to the gravity of the workpiece to be processed, the elastic deformable member 52 deforms, causing the hollow tube 53 to move toward the bottom of the connecting tube 51. This embodiment obtains the elastic force and deformation amount of the elastic deformable part 52 through a pressure sensor, and obtains the height information of the telescopic suction nozzle 50 based on the deformation amount and the initial height of the telescopic suction nozzle 50. It can accurately detect the height position of each telescopic suction nozzle 50 after the workpiece 10 to be processed is placed. The detection method is simple and easy to manufacture.

[0077] Reference Figure 5 and Figure 9 , Figure 5 This is a flow chart of a laser processing method for a packaged product according to a fourth embodiment of the present invention. The telescopic nozzle 50 includes a connecting tube 51, an elastically deformable member 52, and a hollow tube 53. The connecting tube 51 is connected to the body 63. The hollow tube 53 is slidably disposed on the inner wall of the connecting tube 51. The ends of the elastically deformable member 52 abut against the hollow tube 53 and the connecting tube 51, respectively. Step S30 includes:

[0078] S30 ′, using a laser rangefinder or an infrared sensor to obtain height information of the telescopic nozzle 50 .

[0079] A laser rangefinder or an infrared sensor may be used to directly obtain the height information of the telescopic nozzle 50 , which is more direct and has higher detection efficiency.

[0080] Reference Figure 6 , Figure 6Schematic diagram of the process of the laser processing method of the packaged product according to the fifth embodiment of the present invention; step S40 includes:

[0081] S41, controlling the controller to receive altitude information;

[0082] The controller receives the height information of the telescopic nozzle 50 calculated in step S31 , or the controller receives the height information of the telescopic nozzle 50 measured and obtained by a laser rangefinder or an infrared sensor in step S31 ′.

[0083] S42 , adjusting the distance between the light source and the lens of the laser head 20 during the processing of the workpiece 10 according to the height information and the processing path of the laser head 20 .

[0084] The laser head 20 includes both variable-focus and fixed-focus models. For laser heads 20 with variable focal length, the distance between the light source and the lens of the laser head 20 can be adjusted to achieve zoom. Specifically, the required focal length for each position of the workpiece 10 can be determined based on the height information of each telescopic nozzle 50. This allows real-time adjustments to be made during processing based on the shape of the workpiece 10 to ensure optimal processing results. It should be noted that adjusting the zoom of the laser head 20 based on the height information of the telescopic nozzle 50 or the shape of the workpiece 10 is a mature prior art technique and, therefore, is not discussed in detail in this application.

[0085] Reference Figure 7 , Figure 7 Schematic diagram of the process of the laser processing method of the packaged product according to the sixth embodiment of the present invention; step S40 includes:

[0086] S43, controlling the controller to receive altitude information;

[0087] The controller receives the height information of the telescopic nozzle 50 calculated in step S31 , or the height information of the telescopic nozzle 50 acquired by the laser rangefinder or the infrared sensor in step S31 ′.

[0088] S44, obtaining a moving path of the workpiece 10 to be processed according to the height information;

[0089] This embodiment is particularly targeted at situations where the laser head 20 cannot be zoomed. In this case, the workpiece 10 can be moved. Specifically, the workpiece's movement path can be obtained based on the height information. It should be noted that obtaining the workpiece's movement path based on the height information of the telescopic suction nozzle 50 or the shape information of the workpiece 10 is a mature existing technology and, therefore, is not described in detail in this application.

[0090] S45 , controlling the workpiece 10 to move according to the moving path during the machining process.

[0091] Then the workpiece 10 to be processed is controlled to move according to the moving path.

[0092] Reference Figure 8 , Figure 8 FIG. 7 is a flow chart of a laser processing method for a packaged product according to a seventh embodiment of the present invention; Figure 2 The main body 63 may also be provided with a fixed suction nozzle 40, and the fixed suction nozzle 40 and the telescopic suction nozzle 50 jointly adsorb the workpiece 10 to be processed. The step S30 includes:

[0093] S30 ′, obtaining height information of the fixed suction nozzle 40 and the telescopic suction nozzle 50 .

[0094] The steps of S10 include:

[0095] S10 ′, providing a vacuum suction base 60 ; wherein the vacuum suction base 60 includes a body 63 , a fixed suction nozzle 40 and a telescopic suction nozzle 50 telescopically disposed on the body 63 , and the fixed suction nozzle 40 is disposed on the inner side of the telescopic suction nozzle 50 .

[0096] This embodiment is suitable for workpieces 10 with minimal deformation in the center. Because the center is less deformed and can be considered approximately flat, a fixed suction nozzle 40 positioned inside the telescopic suction nozzle 50 is used to hold it. A fixed suction nozzle is a non-retractable vacuum nozzle that provides a more secure hold on the workpiece 10. The periphery of the workpiece 10 typically deforms significantly, so a telescopic suction nozzle 50 is positioned there to accommodate the changing shape of the workpiece 10. Using a fixed suction nozzle 40 enhances the secure hold on the workpiece 10. In a further embodiment, the body 63 is provided with a first vacuum groove 64 and a second vacuum groove 65. The through hole may include a first through hole 61 and a second through hole 62. The first through hole 61 is provided through the first vacuum groove 64, and the second through hole 62 is provided through the second vacuum groove 65. The first vacuum groove 64 and the second vacuum groove 65 are respectively connected to two independently controlled vacuum generators. The first through hole 61 is connected to the fixed suction nozzle 40, and the second through hole 62 is connected to the telescopic suction nozzle 50. The two vacuum generators work independently and affect each other. The two vacuum grooves are also separated and not connected. In this way, the fixed suction nozzle 40 and the telescopic suction nozzle 50 are controlled by different vacuum generators and belong to different vacuum extraction paths.

[0097] With this design, when the workpiece is uneven or warped, if the fixed suction nozzle 40 is not in contact with the workpiece, it will only affect the vacuum level of the first vacuum slot 64, and will not affect the vacuum level of the second vacuum slot 65, and thus will not affect the adsorption of the telescopic suction nozzle 50; similarly, if the telescopic suction nozzle 50 is not in contact with the workpiece and is not adsorbed tightly, it will only affect the vacuum level of the second vacuum slot 65, and will not affect the vacuum level of the first vacuum slot 64, and thus will not affect the adsorption of the fixed suction nozzle 40. That is, this embodiment separates the first vacuum slot 64 and the second vacuum slot 65 and sets them independently of each other. When one slot is not in contact with the workpiece, it will not affect the vacuum level of the other slot. That is, it can still ensure that the vacuum adsorption seat has a certain adsorption strength, thereby improving positioning accuracy.

[0098] According to another aspect of the present invention, a packaged product is provided, which is manufactured using the aforementioned laser processing method for packaged products. The packaged product manufactured using this embodiment does not experience significant stress due to deformation, and can effectively encapsulate components within the product.

[0099] According to another aspect of the present invention, there is further provided an electronic device comprising the aforementioned packaged product. Since the electronic device comprises all technical solutions of all embodiments of the aforementioned packaged product, it at least possesses all the beneficial effects brought about by all the aforementioned technical solutions, and thus will not be further elaborated herein.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and description of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A laser processing method for a packaged product, characterized in that: The following steps are involved: A vacuum suction base is provided; wherein the vacuum suction base comprises a body and a telescopic suction nozzle telescopically arranged on the body; The workpiece to be processed is placed on the telescopic suction nozzle, and the telescopic suction nozzle adjusts its height according to the shape of the workpiece to be processed to adapt to the shape of the workpiece to be processed and absorbs the workpiece to be processed; Obtaining height information of the telescopic nozzle; Processing the workpiece according to the height information; The main body is further provided with a fixed suction nozzle, and both the fixed suction nozzle and the telescopic suction nozzle are used to suck the workpiece to be processed, and the telescopic suction nozzle and the fixed suction nozzle are respectively connected to two vacuum generators; The step of obtaining the height information of the telescopic nozzle includes: Acquire height information of the fixed suction nozzle and the telescopic suction nozzle; The step of processing the workpiece to be processed according to the height information includes: The shape information of the workpiece to be processed is acquired according to the height information, and the laser head is controlled to process the workpiece to be processed according to the shape information.

2. The laser processing method for a packaged product according to claim 1, characterized in that: There are multiple telescopic suction nozzles, and the steps of adjusting the height of the telescopic suction nozzle according to the shape of the workpiece to be processed to adapt to the shape of the workpiece to be processed and adsorbing the workpiece to be processed include: Each of the telescopic suction nozzles independently adjusts its height according to the shape of the workpiece to be processed so as to adapt to the shape of the workpiece to be processed and adsorbs on the surface of the workpiece to be processed.

3. The laser processing method for a packaged product according to claim 1, characterized in that: The telescopic nozzle includes a connecting tube, an elastic deformable member, a hollow tube, and a pressure sensor. The connecting tube is connected to the body. The hollow tube is slidably arranged on the inner wall surface of the connecting tube. The two ends of the elastic deformable member are respectively in contact with the hollow tube and the connecting tube. The pressure sensor is arranged at one end of the elastic deformable member facing the connecting tube. The step of obtaining the height information of the telescopic nozzle includes: Obtaining a pressure value received by the pressure sensor; Obtaining a deformation amount of the elastic deformable member according to the pressure value and the elastic modulus of the elastic deformable member; The height information is obtained according to the deformation amount and the initial height of the telescopic suction nozzle.

4. The laser processing method for a packaged product according to claim 1, wherein: The telescopic nozzle includes a connecting tube, an elastic deformable member, and a hollow tube. The connecting tube is connected to the body. The hollow tube is slidably arranged on the inner wall surface of the connecting tube. The two ends of the elastic deformable member are respectively in contact with the hollow tube and the connecting tube. The step of obtaining the height information of the telescopic nozzle includes: A laser rangefinder or an infrared sensor is used to obtain the height information of the telescopic nozzle.

5. The laser processing method for a packaged product according to any one of claims 1 to 4, characterized in that: The step of processing the workpiece to be processed according to the height information includes: Controlling the controller to receive the altitude information; The distance between the light source and the lens of the laser head is adjusted during the processing of the workpiece according to the height information and the processing path of the laser head.

6. The laser processing method for a packaged product according to any one of claims 1 to 4, characterized in that: The step of processing the workpiece to be processed according to the height information includes: Controlling the controller to receive the altitude information; Acquiring a moving path of the workpiece to be processed according to the height information; The workpiece to be processed is controlled to move according to the movement path during the processing.

7. The laser processing method for a packaged product according to any one of claims 1 to 4, characterized in that: The step of providing a vacuum suction seat, wherein the vacuum suction seat includes a body and a telescopic suction nozzle telescopically arranged on the body, comprises: A vacuum suction seat is provided; wherein, the vacuum suction seat comprises a body, the fixed suction nozzle and a telescopic suction nozzle telescopically arranged on the body, and the fixed suction nozzle is arranged on the inner side of the telescopic suction nozzle.

8. A packaged product, characterized in that: The packaged product is manufactured by the laser processing method for a packaged product according to any one of claims 1 to 7.

9. An electronic device, characterized in that: The electronic device comprises the packaged product according to claim 8.

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