Marking and cutting control method, device, equipment and computer readable storage medium

Abstract

The embodiment of the application belongs to the field of laser processing, and relates to a marking and cutting control method, comprising the following steps: acquiring current marking task data and current cutting task data; acquiring the position of a marking device and the position of a cutting device; controlling the marking device to perform marking of a current marking task according to the acquired current marking task data, monitoring whether the distance between the position of the current marking device and the position of the current cutting device satisfies the execution condition of the current cutting task in the marking process; and if the positions of the marking device and the cutting device satisfy the execution condition of the current cutting task, controlling the cutting device to perform cutting of the current cutting task according to the acquired current cutting task data. The application also provides a marking and cutting control device, equipment and computer readable storage medium. The application can continuously perform different size processing tasks, reduce the gap time of mutual waiting between two processes, and improve the generation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a marking and cutting control method, device, equipment and computer readable storage medium. BACKGROUND

[0002] The existing laser processing technology generally mainly includes laser cutting, marking, welding, surface treatment, engraving and the like. In the processing process, the material to be processed is generally cut first, and then the semi-finished product after processing is marked by laser at the position where marking is required. After marking, the product is convenient for identification and subsequent traceability, and marking and cutting are respectively performed by a device with only a single processing function.

[0003] Some existing laser equipment integrates marking and cutting into one device, but the marking and cutting control methods used by these devices can only perform one of the marking process and the cutting process at a time. After completing the marking task, feeding is performed, and then the cutting task is performed. After completing the cutting task, feeding is performed again, and thus one processing task is completed. After the cutting task is completed, the next marking task is started, and the cycle is repeated until all processing tasks are completed. Such a processing method makes the cutting and marking processes single even if they are integrated into one device, resulting in low processing efficiency and long processing time. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide a marking and cutting control method, device, computer equipment and computer readable storage medium, which can solve the technical problem of low processing efficiency of the marking and cutting processes.

[0005] To solve the above technical problems, the embodiments of the present application provide a marking and cutting control method, which adopts the following technical solution:

[0006] The marking and cutting control method comprises the following steps:

[0007] Obtain the current marking task data and the current cutting task data;

[0008] Obtain the position of the marking device and the position of the cutting device;

[0009] Control the marking device to perform the marking of the current marking task according to the obtained current marking task data. In the marking process, when it is detected that there is material to be processed under the cutting device, monitor whether the distance between the current position of the marking device and the current position of the cutting device satisfies the execution condition of the current cutting task;

[0010] If the execution condition of the current cutting task is met, the cutting device is controlled to perform the cutting of the current cutting task according to the current cutting task data, after the cutting device completes the cutting of the current cutting task and the marking device completes the marking of the current marking task, the feeding of the current cutting task is performed according to the current cutting task data, the next cutting task data is acquired, the position of the marking device is adjusted according to the feeding size of the current cutting task and the current marking task data, and the next marking task data is acquired.

[0011] To solve the above technical problems, the embodiment of the application further provides a marking and cutting control device, which adopts the technical scheme as follows:

[0012] The marking and cutting control device comprises:

[0013] A first acquisition module is configured to acquire current marking task data and current cutting task data.

[0014] A second acquisition module is configured to acquire the position of the marking device and the position of the cutting device.

[0015] A monitoring module is configured to control the marking device to perform the marking of the current marking task according to the acquired current marking task data, and detect whether the distance between the current position of the marking device and the current position of the cutting device meets the execution condition of the current cutting task when the cutting device below is detected to have materials to be processed in the marking process.

[0016] A control module is configured to, if the position of the marking device and the position of the cutting device meet the execution condition of the current cutting task, control the cutting device to perform the cutting of the current cutting task according to the acquired current cutting task data, after the cutting device completes the cutting of the current cutting task and the marking device completes the marking of the current marking task, perform the feeding of the current cutting task according to the current cutting task data, acquire the next cutting task data, adjust the position of the marking device according to the feeding size of the current cutting task and the current marking task data, and acquire the next marking task data.

[0017] To solve the above technical problems, the embodiment of the application further provides a computer device, which adopts the technical scheme as follows:

[0018] The computer device comprises a memory and a processor, the memory stores a computer program, and the processor implements the steps of the marking and cutting control method according to any one of the above-mentioned schemes when executing the computer program.

[0019] To solve the above technical problems, the embodiment of the application further provides a computer readable storage medium, which adopts the technical scheme as follows:

[0020] The computer readable storage medium stores a computer program, and the computer program is executed by the processor to implement the steps of the marking and cutting control method according to any one of the above solutions.

[0021] Compared with the prior art, the marking and cutting control method provided in the application has the following beneficial effects:

[0022] The application monitors the positions of the marking device and the cutting device when the material to be processed is below the cutting device, and the cutting is performed when the positions of the marking device and the cutting device meet the execution condition of the current cutting task, so that the current marking task and the current cutting task are simultaneously performed under the premise of the position condition, the cutting device no longer needs to wait for the marking device to complete the entire marking task before starting cutting, the correlation between the marking and cutting processes is improved, and the processing time is greatly saved.

[0023] The marking and cutting control method provided in the application can also adapt to the continuous execution of different sizes of processing tasks, and the marking process and the cutting process of different sizes of processing tasks can be simultaneously performed, without affecting each other between the two processes, on the basis of ensuring processing safety, the gap time of mutual waiting between the two processes is greatly reduced, and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the solutions in the application, the drawings needed in the description of the embodiments of the application will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0025] Figure 1 is a flowchart of an embodiment of the marking and cutting control method according to the application;

[0026] Figure 2 is Figure 1 is a flowchart of one specific implementation of step S300 in the application;

[0027] Figure 3 is a schematic diagram of the working principle of the marking and cutting control method according to the application;

[0028] Figure 4 is a structural schematic diagram of one embodiment of the marking and cutting control device according to the application.

[0029] Figure 5 is a structural schematic diagram of one embodiment of the computer equipment according to the application. DETAILED DESCRIPTION

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. The terms "comprises", "comprising", "includes", "including", "has", "having" and their variants are intended to be inclusive and allow for items not listed to be present. The terms "first", "second" and the like, do not denote any order, quantity, combination or importance, but are used to identify different features.

[0031] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive or alternative embodiments. It is expressly understood that the described embodiments are merely examples from a technique that will be apparent to those of skill in the art in light of the disclosure, and that modifications are to be expected from the skill of the art. It is to be understood that features disclosed in connection with one embodiment can be used in conjunction with another embodiment to form yet another embodiment.

[0032] In order to make the technical personnel in the art better understand the scheme of the application, the technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings.

[0033] With reference to Figures 1 to 3 , a flow chart of one embodiment of the marking and cutting control method according to the application is shown. The marking and cutting control method comprises the following steps:

[0034] In step S100, current marking task data and current cutting task data are acquired.

[0035] In the embodiment, the marking task data comprises a feeding size of the marking task. The cutting task data comprises a cutting size and a feeding size of the cutting task.

[0036] It should be noted that when the feeding size of the cutting task is equal to the cutting size of the cutting task, the feeding size of the cutting task can be omitted in the acquired current cutting task data.

[0037] At least one marking task data and one cutting task data are stored in the pre-established processing database, and a marking task list and a cutting task list are respectively generated according to the sequence of the processing tasks, and subsequent marking tasks and cutting tasks are performed according to the sequence of the marking task list and the cutting task list.

[0038] In some embodiments, the marking task data can further comprise a marking pattern and a marking coordinate, and the cutting task data can further comprise a cutting pattern and a cutting coordinate.

[0039] In the embodiment, a plurality of different marking task data can be accepted, and a marking task list is generated, and a plurality of different cutting task data corresponding to the plurality of different marking task data is generated, and a cutting task list is generated.

[0040] It should be noted that the current marking task data can be obtained by reading the feeding size of the marking task in the marking task list in the order of the marking task list.

[0041] The current cutting task data can be obtained by reading the cutting size of the cutting task and the feeding size of the cutting task in the cutting task list in the order of the cutting task list.

[0042] It should be noted that before the first marking of the marking task, the initial position setting range of the first marking of the marking device can be determined according to the marking size of the current marking task and the maximum allowed processing range, so that the distance between the initial position of the first marking of the marking device and the position of the maximum allowed processing range is greater than or equal to the marking size of the current marking task. In the initial position setting range of the first marking, a coordinate value is randomly set as the initial position of the first marking of the marking device. The initial position setting range of the first cutting of the cutting device is determined according to the initial position of the first marking of the marking device and the preset safety distance, and a coordinate value is randomly selected as the initial position of the first cutting in the initial position setting range of the first cutting. Wherein, the distance between the cutting device and the marking device is greater than or equal to the safety distance, the marking device is controlled to move to the initial position of the first marking, and the cutting device is controlled to move to the initial position of the first cutting.

[0043] It should be noted that the marking task specifically includes a marking operation and an adjustment operation of the marking device after marking. The adjustment operation of the marking device after marking specifically refers to moving the marking device a distance after marking is completed, so that the marking device moves out of the top of the material to be processed after marking. Wherein, the current feeding size of the marking task specifically refers to the distance that the marking device moves from the current position to the starting position of the next marking task after the marking of the marking task is completed.

[0044] In the embodiment, the cutting task specifically includes a cutting operation and a feeding operation performed after cutting. After the cutting operation of the cutting task is completed, the feeding operation is performed to move the material to be processed relative to the cutting device, and the cutting device remains in the original position, so that the cutting device after feeding is above the material to be processed, and waits for the next cutting task to be executed. In the embodiment, the feeding operation is performed by controlling the feeding device. In some embodiments, the feeding operation can also be performed by manual operation.

[0045] Step S200, obtaining the position of the marking device and the position of the cutting device.

[0046] Specifically, for the convenience of understanding, the embodiment establishes a rectangular coordinate system as shown in the figure Figure 3 The position of the marking device and the cutting device can be obtained by reading the coordinate values of the marking device and the cutting device in the rectangular coordinate system.

[0047] In step S300, the marking device is controlled to perform the current marking task according to the current marking task data, and in the marking process, it is detected that there is material to be processed under the cutting device, and it is monitored whether the distance between the current position of the marking device and the current position of the cutting device meets the execution condition of the current cutting task.

[0048] In some optional implementations of the embodiment, before step S300, the method further comprises:

[0049] obtaining a safety distance between the marking device and the cutting device;

[0050] calculating the sum of the safety distance and the cutting size of the current cutting task to obtain a distance threshold.

[0051] Specifically, the safety distance between the marking device and the cutting device can be pre-stored in the processing database and obtained only before the first execution of the processing task. The safety distance between the marking device and the cutting device can be directly used for subsequent processing tasks after the first processing task, and does not need to be re-obtained. The safety distance is a constant value, which remains unchanged in the marking and cutting control method of the application.

[0052] In step S300 of the embodiment, when it is detected that there is material to be processed under the cutting device, the step of monitoring whether the distance between the current position of the marking device and the current position of the cutting device meets the execution condition of the current cutting task specifically comprises:

[0053] In step S310, when it is detected that there is material to be processed under the cutting device, the distance between the current position of the marking device and the current position of the cutting device is calculated.

[0054] In step S320, it is judged whether the distance between the current marking device and the current cutting device is greater than or equal to the distance threshold.

[0055] In step S330, if it is greater than or equal to the distance threshold, it is determined that the positions of the marking device and the cutting device meet the execution condition of the current cutting task.

[0056] In step S340, if it is less than the distance threshold, it is determined that the positions of the marking device and the cutting device do not meet the execution condition of the current cutting task.

[0057] Specifically, the safety distance between the marking device and the cutting device is D sCalculate the current position coordinates X of the marking device. m and the starting position coordinates X of the current cutting task cN The distance between them determines the current position coordinate value X of the marking device. m and the starting position coordinates X of the current cutting task cN Is the distance between them greater than or equal to the safety clearance D between the marking device and the cutting device? s Compared to the current cutting task size L cN The sum of these values ​​determines the current position coordinates X of the marking device. m and the starting position coordinates X of the current cutting task cN Does it meet the distance threshold D? s +L cN That is, whether X is satisfied m -X cN ≥D s +L cN If yes, then the positions of the marking device and the cutting device meet the execution conditions of the current cutting task; if no, then the positions of the marking device and the cutting device do not meet the execution conditions of the current cutting task.

[0058] It is understandable that during the execution of the marking task, the current position coordinate value X of the marking device is... m It is changing, depending on the current position coordinate value X of the marking device. m When considering the distance between the current cutting device's position coordinates and the current cutting device's position coordinates, the current cutting device's position coordinates read in step S200 above are the starting position coordinates X of the current cutting task. cN While waiting to execute the cutting task, the starting position coordinate X of the cutting task is... cN Remain unchanged until the cutting device begins to perform the cutting task.

[0059] The cutting device is controlled to perform cutting only when the positions of the marking device and the cutting device meet the execution conditions of the current cutting task. This ensures that the cutting device can safely perform the current cutting task size, prevents collisions between the cutting device and the marking device during the simultaneous cutting and marking process, ensures the safety of the processing, and also prevents damage to the cutting device and the marking device.

[0060] In step S410, if the positions of the marking device and the cutting device satisfy the execution condition of the current cutting task, the cutting device is controlled to perform the cutting of the current cutting task according to the acquired current cutting task data, after the cutting device completes the cutting of the current cutting task and the marking device completes the marking of the current marking task, the feeding of the current cutting task is performed according to the current cutting task data, the next cutting task data is acquired, the position of the marking device is adjusted according to the feeding size of the current cutting task and the current marking task data, and the next marking task data is acquired.

[0061] In the embodiment, the step of performing the feeding of the current cutting task according to the current cutting task data specifically includes:

[0062] The feeding of the current cutting task is performed according to the feeding size of the current cutting task, and the feeding length is the feeding size of the acquired current cutting task.

[0063] In the embodiment, the position of the current cutting device is read as the starting position of the current cutting task. During the marking process of the marking device performing the marking of the current marking task, the marking device performs marking and moving according to the marking task, and the cutting device remains stationary at this time, so that the distance between the marking device and the cutting device changes, and the distance between the marking device and the cutting device gradually increases with the execution of the marking operation. By monitoring the positions of the marking device and the cutting device in real time, the relative position change between the starting position of the marking device and the starting position of the cutting task can be monitored in real time. When it is detected that there is material to be processed below the cutting device, if the positions of the marking device and the cutting device satisfy the execution condition of the current cutting task, the cutting device is controlled to perform the cutting of the current cutting task according to the acquired current cutting task data.

[0064] In the embodiment, on the premise that it is detected that there is material to be processed below the cutting device, the positions of the marking device and the cutting device are monitored in real time, so that the cutting of the current cutting task can be performed when the positions of the marking device and the cutting device satisfy the execution condition of the current cutting task, to ensure that the current marking task and the current cutting task are simultaneously performed on the premise that the position condition allows, and the cutting device no longer needs to wait for the marking device to complete the entire marking task before starting the cutting, thereby improving the correlation between the marking and cutting processes and greatly saving the processing time.

[0065] In step S410 of the embodiment, the step of adjusting the position of the marking device according to the feeding size of the current cutting task and the current marking task data specifically includes:

[0066] The starting position of the next marking task is calculated according to the feeding size of the current cutting task, the starting position of the current marking task and the feeding size of the current marking task, and the marking device is moved to the starting position of the next marking task.

[0067] Specifically, for ease of understanding, the embodiment establishes a rectangular coordinate system as shown in the drawings, wherein the increasing direction of the coordinate on the X axis is opposite to the feeding direction of the feeding module. Figure 3

[0068] Suppose the read position coordinate value of the current marking device is X m , the current marking task data is the n-th marking task, the starting position coordinate value of the marking task is X sn , the feeding size of the marking task is D mn , the next marking task is the (n+1)-th, and the starting position coordinate value of the next marking task is X s(n+1) .

[0069] Suppose the read current cutting task data is the N-th cutting task, wherein n is not equal to N, the starting position coordinate value of the cutting task is X cN , the feeding size of the cutting task is D cN , and the cutting size of the cutting task is L cN , wherein X sn ≥ X cN . It can be understood that the cutting size L cN of the cutting task is the maximum length size of the cutting pattern, and the feeding size D cN of the cutting task is the distance size between the starting position of the current cutting task and the starting position of the next cutting task. It should be noted that Figure 3 the feeding size D cN of the cutting task shown in the drawings is greater than the cutting size L cN of the cutting task, which is only one possible implementation of the processing method provided in the present application. In another implementation, the cutting patterns of two adjacent cutting tasks are both axisymmetric patterns, and there is no gap between the cutting patterns of the two adjacent cutting tasks, and the obtained feeding size D cN of the cutting task can also be equal to the cutting size L cN of the cutting task; or the obtained feeding size D cN of the cutting task can also be less than the cutting size L cN of the cutting task.

[0070] Specifically, in the embodiment, according to the feeding size of the current cutting task and the current marking task data, the step of adjusting the position of the marking device is specifically:

[0071] According to the feeding size D cN of the current cutting task, the starting position coordinate value X sn of the current marking task, and the feeding size D mn of the current marking task, the starting position coordinate value X​s(n+1) = X sn + D mn - D cN , the marking device is moved to a position with coordinate value X s(n+1) , after the marking device is moved to the end position of the current marking task, i.e. X m = X s(n+1) .

[0072] In this embodiment, the step of obtaining the next marking task data is specifically: reading the next marking task data, and covering the original marking task data with the obtained marking task data to become the current marking task data.

[0073] It can be understood that, in this embodiment, one marking task includes a marking operation and an operation of moving and adjusting the marking device. After the cutting device completes the cutting of the current cutting task and the marking device completes the marking of the current marking task, the feeding operation of the current cutting task is implemented according to the current cutting task data, so as to realize the feeding of the cutting task. During the feeding operation, the cutting device and the marking device remain stationary. Since the specific size of the feeding operation is the feeding size of the current cutting task. After the feeding operation of the current cutting task is completed, it can be considered that the current cutting task is completed, and the next cutting task data is obtained to prepare for the next cutting task. Since the displacement between the marking device and the processing material is the feeding size, and the distance of the displacement is the feeding size of the cutting task, the feeding size of the current marking task and the feeding size of the current cutting task can be different, so the position of the marking device is adjusted according to the feeding size of the current cutting task and the current marking task data, so that the marking device moves to the starting position of the next marking task on the basis of adapting to the movement of the processing material by the feeding size. After the adjustment is completed, it is considered that the current marking task is completed, and the next marking task data is obtained to prepare for the next marking task.

[0074] After the feeding operation of the current cutting task according to the current cutting task data is completed, since the size of the feeding operation is the feeding size of the current cutting task, and the feeding size of the current cutting task and the feeding size of the current marking task can be different, after the movement of the processing material, the movement of the marking device to the starting position of the next marking task is determined according to the movement size of the processing material and the feeding size of the current marking task, so that the marking task and the cutting task can be performed independently, while adapting to each other.

[0075] It should be noted that in the embodiment, the cutting route of the cutting task is a closed route, and thus the position of the cutting device when the cutting of the current cutting task is completed coincides with the starting position of the current cutting task. In the feeding operation of the current cutting task according to the current cutting task data, the cutting device remains stationary while the workpiece moves, and thus the position of the cutting device when the feeding operation of the current cutting task is completed serves as the starting position of the next cutting task.

[0076] In some other embodiments, when the cutting route of the cutting task is not a closed route, the position of the cutting device when the cutting of the current cutting task is completed can not coincide with the starting position of the current cutting task. In this case, the cutting device can be controlled to move back to the starting position of the current cutting task after the cutting of the current cutting task is completed, and the next cutting task data can be acquired so that the starting position of the cutting device remains unchanged in each cutting task.

[0077] In the embodiment, the step of acquiring the next cutting task data includes: covering the original cutting task data with the current cutting task data after the next cutting task data is acquired.

[0078] It can be understood that the feeding module will not perform feeding if the cutting of the current cutting task is completed and the marking of the current marking task is not completed, or the marking of the current marking task is completed and the cutting of the current cutting task is not completed.

[0079] Specifically, when the cutting device starts to perform the cutting of the current cutting task, the marking device continues to perform the marking of the current marking task until the marking of the current marking task is completed. After the marking device completes the marking of the current marking task, a marking completion signal sent by the marking device is received. After the cutting device completes the cutting of the current cutting task, a cutting completion signal sent by the cutting device is received. After the marking completion signal and the cutting completion signal are received, the feeding device is controlled to perform the feeding operation of the current cutting task.

[0080] The marking and cutting control method provided in the embodiment can also adapt to the continuous execution of processing tasks of different sizes, and the marking process and the cutting process of the processing tasks of different sizes can be performed simultaneously without affecting each other. On the basis of ensuring processing safety, the gap time of mutual waiting between the two processes is greatly reduced, and the production efficiency is improved.

[0081] In step S420, if the positions of the marking device and the cutting device do not satisfy the execution condition of the current cutting task, the cutting device does not perform the cutting of the current cutting task, and the following steps are repeatedly executed until the positions of the marking device and the cutting device satisfy the execution condition of the current cutting task.

[0082] After the marking device completes the marking of the current marking task, it moves to the starting position of the next marking task, obtains the data of the next marking task to overwrite the data of the original marking task, and uses it as the parameters of the current marking task.

[0083] The marking device is controlled to perform the marking task based on the acquired marking task data.

[0084] Specifically, when the positions of the marking device and the cutting device do not meet the execution conditions of the current cutting task, the cutting device does not perform cutting, and the marking device continues marking for the current marking task. After completing marking, the marking device moves to the starting position of the next marking task, thus completing one marking task. The starting position coordinates of the next marking task are X. s(n+1) X s(n+1) =X sn +D cn The loop then proceeds to the next marking task: The feeding size D of the next marking task is read. c(n+1) And read the current position X of the marking device m The original marking task data is overwritten as the current marking task data, and the marking device is controlled to perform the marking of the current marking task.

[0085] It should be noted that the current position X of the marking device m It is obtained by reading the current position X of the marking device before the marking task begins. m To cover the original starting position coordinates X of the marking task sn Therefore, the starting position coordinates X of the current marking task are... sn This is an indeterminate value. Because the calculation method for the starting position coordinates of the next marking task differs depending on whether the cutting task execution conditions are met or not, the calculated starting position coordinates of the next marking task in both cases are X. s(n+1) They are different.

[0086] Understandably, if the positions of the marking device and the cutting device do not meet the execution conditions of the current cutting task, the marking device will continue to execute the next marking task in sequence, and the position of the marking device and the cutting device will be continuously judged during the execution of the marking task until the position of the marking device and the cutting device meets the execution conditions of the current cutting task.

[0087] Specifically, when there are two or more marking tasks and cutting tasks, steps S300, S410 or S420 are repeated until all marking tasks are completed, thereby realizing the sequential marking of multiple marking tasks and the sequential cutting of multiple cutting tasks.

[0088] In some optional implementations of the embodiment, the current marking task data further includes a marking size.

[0089] In some optional implementations of the embodiment, before the step of controlling the marking device to perform marking of the current marking task according to the obtained current marking task data in step S300, the method further includes:

[0090] calculating a sum of the starting position of the current marking task and the marking size of the current marking task;

[0091] determining whether the sum of the starting position of the current marking task and the marking size of the current marking task is less than or equal to a preset maximum allowed machining range;

[0092] if the sum is less than or equal to the maximum allowed machining range, stopping the marking device at the starting position of the current marking task;

[0093] if the sum is greater than the maximum allowed machining range, repeatedly performing the following steps until the sum of the starting position of the current marking task and the marking size of the current marking task is less than or equal to the maximum allowed machining range: recording the starting position of the current marking task as a first position of the marking device, moving the marking device to a position within the maximum allowed machining range away from the cutting device, controlling the cutting device to perform cutting of the current cutting task, after the cutting of the current cutting task is completed, feeding based on a feeding size of the current cutting task, and calculating a target position of the marking device based on the first position of the marking device and the feeding size of the current cutting task, moving the marking device to the target position, and covering the target position of the marking device with the original starting position of the marking task as the starting position of the current marking task.

[0094] In the embodiment, the sum of the starting position of the current marking task and the marking size of the current marking task is less than or equal to the maximum allowed machining range, specifically, a sum of a coordinate value of the starting position of the current marking task and the marking size of the current marking task is less than or equal to a coordinate value of the maximum allowed machining range. It can be understood that, assuming that the read current marking task data is an nth marking task, the marking size of the current marking task is L mn , the coordinate value of the starting position of the current marking task is X sn , and the coordinate value of the maximum allowed machining range is X max , the sum of the starting position of the current marking task and the marking size of the current marking task is less than or equal to the maximum allowed machining range, i.e., X sn + L mn ≤ X max .

[0095] The sum of the starting position and the marking size of the current marking task is greater than the maximum allowable processing range, specifically: the sum of the coordinates of the starting position and the current marking size of the current marking task is greater than the maximum allowable processing coordinate value, i.e., X. sn +L mn >X max .

[0096] It should be noted that the marking size L mn The maximum length dimension of the marked graphic, and the feeding dimension D of the marking task. mn L represents the distance between the starting position of the current marking task and the starting position of the next marking task. This is analogous to the cutting dimension and cutting feed dimension of a cutting task. mn It can be equal to D mn L mn It may not be equal to D mn .

[0097] Specifically, in this embodiment, when X sn +L mn ≤X max At that time, the marking device stops at the starting position coordinate value X of the marking task. sn Then proceed with subsequent steps S300, S410, or S420.

[0098] When X sn +L mn >X max At that time, repeat the following steps until X is satisfied. sn +L mn ≤X max Record the starting position coordinates X of the current marking task. sn Let X1 be the first position coordinate value of the marking device. Move the marking device away from the cutting device to the maximum allowable processing coordinate value X. max At the position, control the cutting device at the starting coordinate value X of the current cutting task. cN The current cutting task is executed. After the current cutting task is completed, the feeding module is controlled to feed the material for the current cutting task. The feeding length is the feeding size D of the current cutting task. cN To obtain the data for the next cutting task, the first position coordinate value X1 of the marking device and the feeding size D of the current cutting task are used. cN Calculate the target position coordinates X of the marking device. t The calculation formula is: X t =X1-D cN Move the marking device to the target position coordinates X. t Above, read the current position coordinate value X of the marking device. tThe starting position coordinate value of the original marking task is covered as the starting position coordinate value of the current marking task, that is, the position coordinate value X of the current marking device is replaced by the starting position coordinate value X of the current marking task. t The starting position coordinate value X of the current marking task is replaced. sn The adjustment of the starting position coordinate value of the current marking task is realized.

[0099] When X sn +L mn ≤X max , the subsequent step S300, step S410 or step S420 is executed again.

[0100] The embodiment judges whether there is enough space condition for the marking device to perform the marking of the current marking task at the position of the maximum allowed machining range from the starting position of the current marking task before performing the marking of the current marking task, and when the space condition is not met, that is, X sn +L mn >X max , the marking device is adjusted to the position of the maximum allowed machining range to avoid the cutting device, the cutting of the current cutting task is performed first, and the feeding operation of the cutting size is performed after the cutting is completed. Since the machining material moves during the feeding process and the marking device does not move, the relative displacement occurs between the machining material and the marking device. After the feeding operation is completed, the marking device is controlled to move in the feeding direction. Since the feeding direction is the direction away from the position of the maximum allowed machining range, the distance between the marking device and the maximum allowed machining range becomes larger after the marking device completes the movement, the space for the marking device to perform the current marking task becomes larger, and the marking of the current marking task provides enough space condition, that is, X sn +L mn ≤X max .

[0101] It should be noted that the current cutting task and the current marking task described in the present application are not the same machining task, the reading of the current marking task and the reading of the current cutting task are performed independently, and the marking of the current marking task and the cutting of the current cutting task are also performed independently.

[0102] Referring to Figures 1 to 4 , in some optional implementation manners of the embodiment, the step of controlling the marking device to perform the marking of the current marking task according to the obtained current marking task data in the step S300 specifically includes:

[0103] The machining material is placed below the marking device.

[0104] According to the acquired current marking task data, the marking device is controlled to perform marking of the current marking task, and after the marking device completes marking of the current marking task, the marking device is controlled to move to a starting position of a next marking task in a direction away from the cutting device, wherein a moving distance of the marking device is equal to a feeding size of the current marking task;

[0105] Before the material to be processed moves below the cutting device, it is monitored whether a distance between a current position of the marking device and a current position of the cutting device is less than twice a preset interval;

[0106] If the distance is less than twice the preset interval, next marking task data is acquired as current marking task data, and the steps of controlling the marking device to perform marking of the current marking task according to the acquired current marking task data and controlling the marking device to move to the starting position of the next marking task after the marking device completes marking of the current marking task are repeated until a distance between a position of the marking device and a position of the cutting device is greater than or equal to twice the preset interval;

[0107] If the distance is greater than or equal to twice the preset interval, the material to be processed is fed in a direction of the cutting device, a feeding length of the material to be processed is one time of the preset interval, next marking task data is acquired as current marking task data, and the marking device is controlled to perform marking of the current marking task according to the acquired current marking task data.

[0108] In the embodiment, before the step of placing the material to be processed below the marking device, the method further includes:

[0109] The marking device and the cutting device are moved to make a distance between the marking device and the cutting device be the preset interval.

[0110] In the embodiment, the preset interval is specifically a safety interval D between the marking device and the cutting device s .

[0111] The above step is a process of special adjustment of the head material of the material to be processed when the material to be processed is below the marking device and there is no material to be processed below the cutting device. After the adjustment of the head material of the material to be processed, the material to be processed can be fed to the lower part of the cutting device, so that the material to be processed is below the cutting device, and the material utilization can be maximized to meet the actual processing requirements. And the subsequent cutting task is performed on the premise that the material to be processed is detected below the cutting device, which can avoid the situation of empty cutting of the cutting device, and ensure that the processing task can be effectively and safely performed. It should be noted that before the material to be processed moves to the lower part of the cutting device, it is detected whether the distance between the current position of the marking device and the current position of the cutting device is less than twice the preset distance, and then the subsequent processing step is executed until the material to be processed moves to the lower part of the cutting device. After the material to be processed moves to the lower part of the cutting device, it is monitored whether the distance between the current position of the marking device and the current position of the cutting device meets the execution condition of the current cutting task, and the subsequent processing step is executed.

[0112] In the embodiment, the material to be processed is a roll material.

[0113] It can be understood that in some other embodiments, if the material to be processed is directly placed below the cutting device, the first marking task is started, and the above adjustment of the head material of the material to be processed is not required. Instead, the marking device is directly controlled to perform the marking of the current marking task according to the obtained current marking task data. During the marking process, it is monitored whether the distance between the current position of the marking device and the current position of the cutting device meets the execution condition of the current cutting task. If the execution condition of the current cutting task is met, the cutting device is controlled to perform the cutting of the current cutting task according to the obtained current cutting task data. After the cutting device completes the cutting of the current cutting task and the marking device completes the marking of the current marking task, the feeding of the current cutting task is performed according to the current cutting task data, the next cutting task data is obtained, the position of the marking device is adjusted according to the feeding size of the current cutting task and the current marking task data, and the next marking task data is obtained.

[0114] It can be understood that the safety distance D s and the maximum allowed processing position coordinate value X max are parameters pre-stored in the device and are fixed values. The safety distance D s between the cutting device and the marking device and the maximum allowed processing position coordinate value X max can be retrieved and used during the execution of any one of the above steps S100-S420.

[0115] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer readable storage medium. When the program is executed, it can include the processes of the above-mentioned embodiment methods. The storage medium can be a non-volatile storage medium such as a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0116] It should be understood that although each step in the flowchart of the accompanying drawings is shown in sequence according to the direction of the arrow, these steps are not necessarily executed in sequence according to the direction of the arrow. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and they can be executed in other sequences. Moreover, at least part of the steps in the flowchart of the accompanying drawings can include multiple sub-steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence is not necessarily sequential, but can be alternately or alternately executed with at least part of other steps or sub-steps or stages of other steps.

[0117] Further referring to Figure 4 , as an implementation of the method shown in Figure 1 , the present application provides an embodiment of a marking and cutting control device 500, which corresponds to the method embodiment shown in Figure 1 , and the device can be applied to various cutting and marking laser processing.

[0118] As shown in Figure 4 , the marking and cutting control device 500 described in the embodiment comprises a first acquisition module 501, a second acquisition module 502, a monitoring module 503, and a control module 504. Wherein:

[0119] The first acquisition module 501 is configured to acquire current marking task data and current cutting task data.

[0120] The second acquisition module 502 is configured to acquire the position of the marking device 10 and the position of the cutting device 20.

[0121] The monitoring module 503 is configured to control the marking device 10 to perform the marking of the current marking task according to the acquired current marking task data, and in the marking process, when it is detected that there is a material to be processed under the cutting device 20, monitor whether the distance between the current position of the marking device 10 and the current position of the cutting device 20 satisfies the execution condition of the current cutting task.

[0122] The control module 504 is configured to control the cutting device 20 to perform cutting of the current cutting task according to the current cutting task data, and after the cutting device 20 completes the cutting of the current cutting task and the marking device 10 completes the marking of the current marking task, control the feeding device to feed according to the feeding size of the current cutting task, obtain next cutting task data, adjust the position of the marking device 10 according to the feeding size of the current cutting task and the current marking task data, and obtain next marking task data.

[0123] In this embodiment, the control module 504 can also be configured to control the feeding device to perform feeding according to the feeding size of the current cutting task.

[0124] The marking and cutting control device 500 provided in the application can adapt to continuous execution of processing tasks of different sizes, and the marking process and the cutting process of processing tasks of different sizes can be performed simultaneously without affecting each other, thereby greatly reducing the gap time of mutual waiting between the two processes on the basis of ensuring processing safety, and improving the production efficiency.

[0125] In some optional implementation manners of this embodiment, the marking and cutting control device further includes a third acquisition module and a threshold calculation module, wherein the third acquisition module is configured to acquire a safety distance between the marking device and the cutting device, and the threshold calculation module is configured to calculate a sum of the safety distance and a cutting size of the current cutting task to obtain a distance threshold.

[0126] In some optional implementation manners of this embodiment, the monitoring module includes a distance calculation unit and a first judgment unit. The distance calculation unit is configured to calculate a distance between the position of the current marking device and the position of the current cutting device when detecting that there is material to be processed below the cutting device. The first judgment unit is configured to judge whether the distance between the current marking device and the current cutting device is greater than or equal to the distance threshold. If the distance is greater than or equal to the distance threshold, it is determined that the positions of the marking device and the cutting device satisfy the execution condition of the current cutting task. If the distance is less than the distance threshold, it is determined that the positions of the marking device and the cutting device do not satisfy the execution condition of the current cutting task.

[0127] In some optional implementation manners of this embodiment, the control module 504 includes an adjustment unit configured to calculate a starting position of next marking task according to the feeding size of the current cutting task, the starting position of the current marking task, and the feeding size of the current marking task, and move the marking device to the starting position of the next marking task.

[0128] In some optional implementation manners of this embodiment, the marking and cutting control device further includes a position calculation module, a judgment module, and a control module, wherein:

[0129] a position calculation module configured to calculate a starting position of a current marking task and a sum of marking sizes of the current marking task;

[0130] a determination module configured to determine whether the starting position of the current marking task and the sum of the marking sizes of the current marking task are less than or equal to a preset maximum allowed machining range.

[0131] a manipulation module configured to, if the starting position of the current marking task and the sum of the marking sizes of the current marking task are less than or equal to the maximum allowed machining range, keep the marking device at the starting position of the current marking task; if the starting position of the current marking task and the sum of the marking sizes of the current marking task are greater than the maximum allowed machining range, repeatedly perform the following steps until the starting position of the current marking task and the sum of the marking sizes of the current marking task are less than or equal to the maximum allowed machining range: recording the starting position of the current marking task as a first position of the marking device, moving the marking device to a position of the maximum allowed machining range in a direction away from the cutting device, controlling the cutting device to perform cutting of a current cutting task, after the cutting of the current cutting task is completed, feeding based on a feeding size of the current cutting task, and calculating a target position of the marking device according to the first position of the marking device and the feeding size of the current cutting task, moving the marking device to the target position, and covering the target position of the marking device with the starting position of the original marking task as the starting position of the current marking task.

[0132] In some optional implementations of the embodiment, the monitoring module 503 includes a material placing unit, a first processing unit, a second processing unit, and a second determination unit. The material placing unit is configured to place the material to be processed below the marking device. The first processing unit is configured to control the marking device to perform marking of a current marking task according to the acquired current marking task data, and control the marking device to move to a starting position of a next marking task in a direction away from the cutting device after the marking device completes the marking of the current marking task, where the moving distance of the marking device is equal to a feeding size of the current marking task.

[0133] The second determination unit is configured to monitor whether a distance between a current position of the marking device and a current position of the cutting device is less than twice a preset interval before the material to be processed moves below the cutting device.

[0134] The second processing unit is configured to: if the distance is less than twice the preset distance, acquire next marking task data as current marking task data, and repeatedly perform the following steps until the distance between the position of the marking device and the position of the cutting device is greater than or equal to twice the preset distance: after the marking device completes marking of the current marking task, control the marking device to move to a starting position of a next marking task; and acquire next marking task data as current marking task data, and control the marking device to perform marking of the current marking task according to the acquired current marking task data; and if the distance is greater than or equal to twice the preset distance, transport the material to be processed in the direction of the cutting device, the length of the transported material being one time of the preset distance, acquire next marking task data as current marking task data, and control the marking device to perform marking of the current marking task according to the acquired current marking task data.

[0135] In some optional implementations of the embodiment, the control module 504 includes an execution unit. The execution unit is configured to: if the execution condition of the current cutting task is not met, the cutting device does not perform cutting of the current cutting task, and repeatedly performs the following steps until the distance between the position of the marking device and the position of the cutting device meets the execution condition of the current cutting task: after the marking device completes marking of the current marking task, move the marking device to a starting position of a next marking task, acquire next marking task data to replace the original marking task data as current marking task parameters; and control the marking device to perform marking of the current marking task according to the acquired current marking task data.

[0136] The computer device 60 includes a memory 61, a processor 62, and a network interface 63 which are communicatively connected through a system bus. It should be noted that only the computer device 60 with components 61-63 is shown in the figure, but it should be understood that all the shown components are not required to be implemented, and more or fewer components can be alternatively implemented. Among them, those skilled in the art can understand that the computer device 60 herein is a device capable of automatically performing numerical calculation and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to a microprocessor 62, an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), an embedded device, etc.

[0137] The computer device 60 can be a desktop computer, a notebook computer, a palm computer, a cloud server, and the like. The computer device 60 can interact with a user through a keyboard, a mouse, a remote controller, a touchpad, a voice control device, and the like.

[0138] The memory 61 includes at least one type of readable storage medium, such as a flash memory, a hard disk, a multimedia card, a card-type memory 61 (e.g., an SD or DX memory 61, etc.), a random access memory 61 (RAM), a static random access memory 61 (SRAM), a read-only memory 61 (ROM), an electrically erasable programmable read-only memory 61 (EEPROM), a programmable read-only memory 61 (PROM), a magnetic memory 61, a magnetic disk, an optical disk, etc. In some embodiments, the memory 61 can be an internal storage unit of the computer device 60, such as a hard disk or a memory of the computer device 60. In other embodiments, the memory 61 can also be an external storage device of the computer device 60, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the computer device 60. Of course, the memory 61 can also include both the internal storage unit and the external storage device of the computer device 60. In this embodiment, the memory 61 is generally used to store an operating system and various application software installed on the computer device 60, such as program codes of the intelligent machining method, etc. In addition, the memory 61 can also be used to temporarily store various data that have been output or will be output.

[0139] The processor 62 can be a central processing unit 62 (CPU), a controller, a microcontroller, a microprocessor 62, or other data processing chip in some embodiments. The processor 62 is generally used to control the overall operation of the computer device 60. In this embodiment, the processor 62 is used to run program codes or process data stored in the memory 61, such as running program codes of the intelligent machining method.

[0140] The network interface 63 can include a wireless network interface 63 or a wired network interface 63, which is generally used to establish a communication connection between the computer device 60 and other electronic devices.

[0141] The present application also provides another embodiment, i.e., to provide a computer readable storage medium, which stores a marking and cutting program, and the marking and cutting program can be executed by at least one processor to make the at least one processor execute the steps of the marking and cutting control method as described above.

[0142] Those skilled in the art can clearly understand the above-mentioned embodiment method can be realized by means of software and the necessary general hardware platform, of course, it can also be realized by hardware, but in many cases, the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes a plurality of instructions for making a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) execute the methods described in various embodiments of the present application.

[0143] Obviously, the above-described embodiments are only some of the embodiments of the present application, not all the embodiments, and the drawings show the preferred embodiments of the present application, but do not limit the patent scope of the present application. The present application can be implemented in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacements to some of the technical features. Any equivalent structure made by using the contents of the specification and drawings, directly or indirectly applied to other related technical fields, is also within the scope of the patent protection of the present application.

Claims

1. A marking and cutting control method, characterized in that, Includes the following steps: Get the current marking task data and the current cutting task data; Obtain the positions of the marking device and the cutting device; Based on the acquired current marking task data, the marking device is controlled to perform the marking of the current marking task. During the marking process, if material to be processed is detected below the cutting device, the distance between the current marking device position and the current cutting device position is monitored to see if it meets the execution conditions of the current cutting task. If the execution conditions of the current cutting task are met, the cutting device is controlled to perform the cutting of the current cutting task based on the acquired current cutting task data. After the cutting device completes the cutting of the current cutting task and the marking device completes the marking of the current marking task, the material is fed for the current cutting task based on the current cutting task data, and the next cutting task data is obtained. The position of the marking device is adjusted according to the feeding size of the current cutting task and the current marking task data, and the next marking task data is obtained.

2. The marking and cutting control method according to claim 1, characterized in that, The cutting task data includes: cutting dimensions; Before the marking device executes the marking step of the current marking task, the method further includes: Obtain the safe distance between the marking device and the cutting device; Calculate the sum of the safety distance and the cutting size of the current cutting task to obtain the distance threshold; When material to be processed is detected below the cutting device, the step of monitoring whether the distance between the current position of the marking device and the current position of the cutting device meets the execution conditions of the current cutting task specifically includes: When material to be processed is detected below the cutting device, calculate the distance between the current position of the marking device and the current position of the cutting device; Determine whether the distance between the current marking device and the current cutting device is greater than or equal to the distance threshold; If the distance threshold is greater than or equal to the distance threshold, then the positions of the marking device and the cutting device are determined to meet the execution conditions of the current cutting task. If the distance is less than the specified threshold, then the positions of the marking device and the cutting device do not meet the execution conditions of the current cutting task.

3. The marking and cutting control method according to claim 1, characterized in that, The marking task data includes: the feeding size of the marking task; The cutting task data also includes: the feeding dimensions of the cutting task; The step of feeding the material for the current cutting task based on the current cutting task data specifically includes: Feed the material for the current cutting task according to the feeding size of the current cutting task; The step of adjusting the position of the marking device based on the current cutting task's feeding size and the current marking task data specifically includes: Based on the current cutting task's feeding size, the current marking task's starting position, and the current marking task's feeding size, the starting position of the next marking task is calculated, and the marking device is moved to the starting position of the next marking task.

4. The marking and cutting control method according to claim 3, characterized in that, The current marking task data also includes: marking size; Before the step of controlling the marking device to execute the marking of the current marking task based on the acquired current marking task data, the method further includes: Calculate the sum of the starting position and the marking size of the current marking task; Determine whether the sum of the starting position of the current marking task and the marking size of the current marking task is less than or equal to the preset maximum allowable processing range; If the value is less than or equal to the maximum allowable processing range, the marking device will remain at the starting position of the current marking task. If the value is greater than the maximum allowable processing range, the following steps are repeated until the sum of the starting position of the current marking task and the current marking size is less than or equal to the maximum allowable processing range: the starting position of the current marking task is recorded as the first position of the marking device; the marking device is moved away from the cutting device to the position of the maximum allowable processing range; the cutting device is controlled to perform the cutting of the current cutting task; after the cutting of the current cutting task is completed, the material is fed based on the feeding size of the current cutting task; and the target position of the marking device is calculated according to the first position of the marking device and the feeding size of the current cutting task; the marking device is moved to the target position; and the target position of the marking device covers the original starting position of the marking task, which is taken as the starting position of the current marking task.

5. The marking and cutting control method according to claim 3, characterized in that, The step of controlling the marking device to perform the marking task based on the acquired current marking task data includes: Place the material to be processed below the marking device; Based on the acquired current marking task data, the marking device is controlled to perform the marking of the current marking task. After the marking device completes the marking of the current marking task, it is controlled to move away from the cutting device to the starting position of the next marking task. The moving distance of the marking device is equal to the feeding size of the current marking task. Before the material to be processed moves below the cutting device, monitor whether the distance between the current position of the marking device and the current position of the cutting device is less than twice the preset spacing; If the distance is less than twice the preset distance, the next marking task data is obtained as the current marking task data. The process of controlling the marking device to perform the marking of the current marking task based on the obtained current marking task data is repeated. After the marking device completes the marking of the current marking task, the marking device is controlled to move to the starting position of the next marking task until the distance between the position of the marking device and the position of the cutting device is greater than or equal to twice the preset distance. If the distance is greater than or equal to twice the preset spacing, the material to be processed is conveyed in the direction of the cutting device. The length of the material to be processed is twice the preset spacing. The next marking task data is obtained as the current marking task data. The marking device is controlled to perform the marking of the current marking task based on the obtained current marking task data.

6. The marking and cutting control method according to claim 5, characterized in that, Before the step of placing the material to be processed below the marking device, the method further includes: The marking and cutting devices are moved so that the distance between them is a preset interval.

7. The marking and cutting control method according to any one of claims 1 to 6, characterized in that, After the step of monitoring whether the distance between the current position of the marking device and the current position of the cutting device meets the execution conditions of the current cutting task, the method further includes: If the execution conditions for the current cutting task are not met, the cutting device will not perform the cutting for the current cutting task, and will repeat the following steps until the distance between the position of the marking device and the position of the cutting device meets the execution conditions for the current cutting task: After the marking device completes the marking of the current marking task, it moves to the starting position of the next marking task, obtains the data of the next marking task to overwrite the data of the original marking task, and uses it as the parameters of the current marking task. The marking device is controlled to perform the marking task based on the acquired marking task data.

8. A marking and cutting control device, characterized in that, include: The first acquisition module is used to acquire the current marking task data and the current cutting task data; The second acquisition module is used to acquire the positions of the marking device and the cutting device; The monitoring module is used to control the marking device to perform the marking of the current marking task based on the acquired current marking task data. During the marking process, when material to be processed is detected below the cutting device, the module monitors whether the distance between the current marking device position and the current cutting device position meets the execution conditions of the current cutting task. The control module is used to control the cutting device to perform the current cutting task if the positions of the marking device and the cutting device meet the execution conditions of the current cutting task, based on the acquired current cutting task data. After the cutting device completes the current cutting task and the marking device completes the current marking task, the module feeds the material for the current cutting task based on the current cutting task data, acquires the next cutting task data, adjusts the position of the marking device based on the current cutting task feeding size and the current marking task data, and acquires the next marking task data.

9. A computer device, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the marking and cutting control method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the marking and cutting control method as described in any one of claims 1 to 7.

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