Laser processing control methods, devices, equipment and storage media

Abstract

This application discloses a laser processing control method, apparatus, equipment, and storage medium. The laser processing control method includes the following steps: sampling the Z-axis coordinate values ​​of the laser nozzle at a set sampling period to obtain three Z-axis coordinate values ​​Z0, Z1, and Z2 of the laser nozzle; calculating ΔZ based on the following formula: ΔZ = ΔZ2 - ΔZ1 = (Z2 - Z1) - (Z1 - Z0) = Z2 + Z0 - 2Z1; and determining whether the laser nozzle is outside the material at the sampling time corresponding to Z2 based on the magnitude of ΔZ. Edge detection can be performed without adding new hardware, avoiding additional costs; there are no restrictions on the material, size, processing speed, and processing contour of the processed material, all of which can be detected; it reduces the wear and tear of consumables such as laser nozzles and ceramic rings, avoiding damage to valuable items such as height sensors and laser nozzles; and it reduces the scrap rate of parts and workpieces.

Description

Technical Field

[0001] This application relates to the field of laser processing equipment, and in particular to a laser processing control method, apparatus, equipment and storage medium. Background Technology

[0002] Laser cutting machines are widely used in metal sheet metal processing. The laser head is a valuable component of the laser processing machine. If an impact occurs during use, the laser processing machine will stop. There are three main types of laser head impacts: rapid downward impact during processing startup, impact during laser head follow-up movement, and impact during the parabolic motion of the laser head when jumping to the contour at the end of processing.

[0003] Furthermore, during laser cutting, the CNC system controls the Z-axis to move up and down, keeping the sensing distance H between the laser nozzle and the material near a set value h to ensure processing quality. This set value is the following distance h. When the laser nozzle is inside the material, H is the vertical distance between the bottom of the laser nozzle and the surface of the material. When the lower end of the laser nozzle is outside the material and the main body of the laser nozzle is at the edge of the material, H is the vertical distance between the edge of the material and the sidewall of the laser nozzle. This is determined by the characteristics of the capacitive sensor and the shape of the laser nozzle.

[0004] When the processing range exceeds the size of the sheet material, the height (H) increases. To maintain this sensing distance, the CNC system continuously controls the Z-axis to move downwards. This can cause the laser head to collide with the sheet material or the worktable support, damaging the laser nozzle, ceramic ring, height sensor, or even the laser nozzle itself. Related technologies generally use visual inspection to detect the laser nozzle's position, but this visual recognition method is costly. Summary of the Invention

[0005] This application proposes a laser processing control method, apparatus, equipment, and storage medium that can detect whether the laser nozzle has moved to the outside of the material without adding new hardware.

[0006] To achieve the above objectives, this application proposes a laser processing control method, comprising the following steps:

[0007] The Z-axis coordinate values ​​of the laser nozzle are sampled at a set sampling period to obtain the three Z-axis coordinate values ​​Z0, Z1 and Z2 of the laser nozzle;

[0008] ΔZ is obtained based on the following formula: ΔZ = ΔZ2 - ΔZ1 = (Z2 - Z1) - (Z1 - Z0) = Z2 + Z0 - 2Z1;

[0009] The magnitude of ΔZ determines whether the laser nozzle is located outside the substrate at the sampling time corresponding to Z2.

[0010] In some embodiments, the method of obtaining ΔZ based on the following formula further includes the following steps:

[0011] The sensing height value of the laser nozzle is sampled at a set sampling period to obtain three sensing height values ​​H0, H1 and H2 of the laser nozzle. The sensing height values ​​correspond one-to-one with the Z-axis coordinate values.

[0012] In some embodiments, after obtaining the three sensing height values ​​H0, H1, and H2 of the laser nozzle, the method further includes the following steps:

[0013] ΔH is obtained based on the following formula: ΔH = ΔH2 - ΔH1 = (H2 - H1) - (H1 - H0) = H2 + H0 - 2H1;

[0014] The magnitude of ΔH determines whether the laser nozzle is located outside the substrate at the sampling time corresponding to H2.

[0015] In some embodiments, the step of calculating ΔH based on the following formula is further included:

[0016] Determine whether H2>c is true. If it is true, it means that the laser nozzle is outside the plate at the sampling time corresponding to H2; otherwise, calculate ΔH. The preset following distance between the laser nozzle and the plate is h, and the maximum range of the height sensor is d, where d>c>h.

[0017] In some embodiments, determining whether the laser nozzle is located outside the substrate at the sampling time corresponding to Z2 based on the magnitude of ΔZ includes the following steps:

[0018] Determine whether ΔZ>a holds true. If it does, it means that at the sampling time corresponding to Z2, the laser nozzle is outside the plate. The preset following distance between the laser nozzle and the plate is h, where h>a>0.

[0019] In some embodiments, the steps before obtaining ΔZ based on the following formula are included:

[0020] Determine whether H0, H1, and H2 are all within the set range. If yes, calculate ΔZ; otherwise, calculate ΔH.

[0021] In some embodiments, determining whether the laser nozzle is located outside the substrate at the sampling time corresponding to H2 based on the magnitude of ΔH includes the following steps:

[0022] Determine whether ΔH>b holds true. If it does, it means that at the sampling time corresponding to H2, the laser nozzle is outside the plate. The preset following distance between the laser nozzle and the plate is h, where h>b>0.

[0023] In some embodiments, after obtaining the three sensing height values ​​H0, H1, and H2 of the laser nozzle, the method further includes the following steps:

[0024] Determine whether H0, H1, and H2 are all within the set range. If so, calculate ΔZ, ΔZ1, and ΔZ2 based on the following formula: ΔZ = ΔZ2 - ΔZ1 = (Z2 - Z1) - (Z1 - Z0).

[0025] The magnitudes of ΔZ, ΔZ2, and ΔZ1 determine whether the laser nozzle is located outside the substrate during the sampling period.

[0026] This application also proposes a laser processing control device, comprising:

[0027] The sampling module is used to sample the sensing height value and Z-axis coordinate value of the laser nozzle at a set sampling period to obtain three sensing height values ​​H0, H1 and H2 of the laser nozzle, and the corresponding three Z-axis coordinate values ​​Z0, Z1 and Z2.

[0028] The processing module is used to calculate ΔZ and / or ΔH based on the following formula;

[0029] ΔZ=ΔZ2-ΔZ1=(Z2-Z1)-(Z1-Z0)=Z2+Z0-2Z1;

[0030] ΔH=ΔH2-ΔH1=(H2-H1)-(H1-H0)=H2+H0-2H1;

[0031] The processing module is also used to determine whether the laser nozzle is located outside the plate at the sampling time corresponding to H2 based on the magnitudes of ΔZ and ΔH.

[0032] This application also proposes a laser processing control device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above-described laser processing control method.

[0033] This application also proposes a storage medium storing computer-executable instructions configured to perform the laser processing control method described above.

[0034] The advantages of this application's embodiments are: no new hardware is required, avoiding additional costs; there are no restrictions on the material, size, processing speed, and processing contour of the processed sheet, all of which can be detected; the wear and tear of consumables such as laser nozzles and ceramic rings is reduced, and damage to valuable items such as height sensors and laser nozzles is avoided; and the scrap rate of parts and workpieces is reduced. Attached Figure Description

[0035] Figure 1 This is a flowchart of a laser processing control method in one embodiment of this application;

[0036] Figure 2 This is a schematic diagram showing the positional relationship between the laser nozzle and the substrate in another embodiment of this application;

[0037] Figure 3 This is a schematic diagram showing the positional relationship between the laser nozzle and the substrate in another embodiment of this application;

[0038] Figure 4 This is a schematic diagram showing the positional relationship between the laser nozzle and the substrate in another embodiment of this application;

[0039] Figure 5 This is a flowchart of a laser processing control method in another embodiment of this application;

[0040] Figure 6 This is a flowchart of a laser processing control method in another embodiment of this application;

[0041] Figure 7 This is a schematic diagram of the functional modules of a laser processing control device in one embodiment of this application;

[0042] Figure 8 This is a flowchart of a laser processing control method in another embodiment of this application.

[0043] Figure 9 This is a schematic diagram showing the positional relationship between the laser nozzle and the substrate in another embodiment of this application;

[0044] Label Explanation:

[0045] 10. Sampling module; 20. Processing module;

[0046] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0047] The solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments in this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0048] It should be noted that all directional indications in the embodiments of this application, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indication will also change accordingly.

[0049] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0050] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0051] This application proposes a laser processing control method, referring to... Figure 1 The laser processing control method includes:

[0052] S10. Sample the Z-axis coordinate values ​​of the laser nozzle at the set sampling period to obtain the three Z-axis coordinate values ​​Z0, Z1 and Z2 of the laser nozzle.

[0053] S20. Based on the following formula, ΔZ is obtained: ΔZ = ΔZ2 - ΔZ1 = (Z2 - Z1) - (Z1 - Z0) = Z2 + Z0 - 2Z1;

[0054] S30. Determine whether the laser nozzle is outside the substrate at the sampling time corresponding to Z2 based on the magnitude of ΔZ.

[0055] Reference Figure 2 At time T0, the interpolation velocity direction is A, and a planar coordinate system AOZ is established with A and the Z-axis. Within two adjacent cycles, T0-T1 constitutes one cycle, and T1-T2 constitutes another. Typically, the scanning cycle of a capacitive sensor is 6ms; the scanning cycle of a Z-axis position sensor is 0.5ms; and the sampling cycle T is typically 12ms. At times T1 and T2, the laser nozzle moves to different positions. As long as the cycle time T is short enough, the material can be considered uniform and continuous within two adjacent cycles, and the interpolation distance is also similar. Assume that at times T0 and T1, the center of the laser nozzle is on the material, and at time T2, the center of the laser nozzle is not on the material, meaning the laser has cut outside the material. At times T0, T1, and T2, the sensing distances between the laser nozzle and the material are H0, H1, and H2, respectively, and the Z-axis coordinates are Z0, Z1, and Z2, respectively. At time T2, the distance from the bottom of the laser nozzle center to the extension line of the material is H. At time T2, the center of the laser nozzle is not on the substrate. Therefore, the sensing distance H2 is not the distance from the bottom of the center of the laser nozzle to the substrate, but the distance from one of the points on the laser nozzle or the part of the laser nozzle opposite to the substrate to the laser nozzle.

[0056] Under these circumstances, there are two possibilities:

[0057] Scenario 1: The scanning cycle of the capacitive sensor is the same as that of the Z-axis position sensor. The Z-axis movement is adjusted promptly. When the center bottom of the laser nozzle moves beyond the edge of the material, the sensing distance increases dramatically. At this time, the Z-axis controls the laser nozzle to accelerate to maintain H2 at the set value. The descent rate of the Z-axis changes at this point. Because the Z-axis movement is adjusted promptly, the position change ΔZ1 = Z1 - Z0 from T0 to T1 is reasonable. From T1 to T2, the position change ΔZ2 = Z2 - Z1 must be greater than ΔZ1. Therefore, by setting an appropriate threshold 'a' for ΔZ, if ΔZ is greater than 'a', it is determined that the laser nozzle has cut into the material.

[0058] Outside. That is, ΔZ=ΔZ2-ΔZ1=(Z2-Z1)-(Z1-Z0)=Z2+Z0-2Z1>a;(2)

[0059] Reference Figure 6 In this embodiment of the application, the preset following distance between the laser nozzle and the substrate is h, where h > a > 0. If ΔZ is less than a, further calculation and judgment are required.

[0060] The advantages of this application's embodiments are: no new hardware is required, avoiding additional costs; there are no restrictions on the material, size, processing speed, and processing contour of the processed sheet, all of which can be detected; the wear and tear of consumables such as laser nozzles and ceramic rings is reduced, and damage to valuable items such as height sensors and laser nozzles is avoided; and the scrap rate of parts and workpieces is reduced.

[0061] Reference Figure 5 In some embodiments of this application, the following steps are included before obtaining ΔZ based on the following formula:

[0062] S11. Sample the sensing height value of the laser nozzle at a set sampling period to obtain three sensing height values ​​H0, H1, and H2. The sensing height values ​​correspond one-to-one with the Z-axis coordinate values. In this step, the magnitudes of H0, H1, and H2 can be used to assist in the judgment.

[0063] S12. Determine whether H0, H1 and H2 are all within the set range. If so, proceed to step S20.

[0064] When H0, H1, and H2 are within the preset following distance h,

[0065] That is, H0≈H1≈H2; (1)

[0066] This indicates that the scanning cycle of the capacitive sensor is the same as that of the Z-axis position sensor, and the Z-axis movement adjustment is timely. The position of the laser nozzle can then be determined based on S20 and S30.

[0067] Scenario 2, such as Figure 3 and Figure 6If the Z-axis motion adjustment is not timely, and one of H0, H1, and H2 is not within the preset following distance h, then the following steps will be executed:

[0068] S40 calculates ΔH based on the following formula.

[0069] S50 determines whether the laser nozzle is outside the substrate at the sampling time corresponding to H2 based on the magnitude of ΔH.

[0070] In scenario two, the scan period of the capacitive sensor is shorter than that of the Z-axis position sensor. The Z-axis adjustment movement based on the sensed height will generally lag behind. In this case...

[0071] ΔZ1≈ΔZ2, that is, Z1-Z0≈Z2-Z1; (3)

[0072] ΔH=ΔH2-ΔH1=(H2-H1)-(H1-H0)=H2+H0-2H1>b; (4)

[0073] Reference Figure 6 Because the Z-axis motion adjustment is not timely, ΔZ1≈ΔZ2. Therefore, the change in sensing distance ΔH1=H1-H0 from T0 to T1 is reasonable, while the change in sensing distance ΔH2=H2-H1 from T1 to T2 is unreasonable. Therefore, by setting a suitable threshold b for the unreasonable positional change portion ΔH=ΔH2-ΔH1 of ΔH2, we can determine whether the laser has cut outside the board. The preset following distance between the laser nozzle and the board is h, where h>b>0. We determine whether ΔH>b holds true; if so, it means that at the sampling time corresponding to H2, the laser nozzle is outside the board.

[0074] Reference Figure 6 In some embodiments of this application, before calculating ΔH based on the following formula, the method further includes the following steps: determining whether H2>c holds true; if H2>c holds true, then determining that the laser nozzle is outside the plate at the sampling time corresponding to H2. The preset following distance between the laser nozzle and the plate is h, and the maximum range of the height sensor is d, where d>c>h.

[0075] Scenario 3, such as Figure 4 and Figure 6 As shown, if equations (3) and (4) do not hold simultaneously, the center of the laser nozzle is already outside the material at time T0. After continuing to move to times T1 and T2, ΔZ1≈ΔZ2 and ΔH1≈ΔH2. At this time, the simplest method can be used to detect it. Set an appropriate threshold c, and when H2>c, it is determined that the laser nozzle has cut outside the material.

[0076] During normal machining, the machining contour remains within the material's outline. However, in cases of machining abnormalities, such as when the material is placed at an angle and the contour angle is not corrected during machining, the machining contour will not be completely within the material and will cut outside the material. To maintain the machining sensing distance, the CNC system continuously controls the Z-axis downward movement, which may cause the laser head to collide with the material or the worktable support. If the impact causes the material to shift, the trajectory of parts that have been machined but not yet completed cannot be closed, resulting in scrapped parts and greater losses. Using this invention, the CNC system can promptly detect machining outside the material, issue an alarm, and stop controlling the Z-axis downward movement to avoid collisions. After the alarm is triggered, the machining position can be adjusted promptly, effectively utilizing the remaining material and preventing the machining trajectory from being unable to close, thus affecting workpiece machining.

[0077] Reference Figure 8 and Figure 9 After performing step S12, this application also needs to perform S21 and S31 in sequence. S21 can be regarded as a further limitation of S20; S31 can be regarded as a further limitation of S30.

[0078] S21. Based on the following formula, we can obtain ΔZ, ΔZ1 and ΔZ2, ΔZ = ΔZ2 - ΔZ1 = (Z2 - Z1) - (Z1 - Z0);

[0079] S31. Determine whether the laser nozzle is located outside the substrate during the sampling period based on the magnitudes of ΔZ, ΔZ1, and ΔZ2.

[0080] If ΔZ>a, ΔZ1<0 and ΔZ2>0 are satisfied simultaneously, it means that during the two sampling periods T0 to T2, the projection of the laser nozzle path onto the board crosses the protrusion on the board, and the laser nozzle is inside the board during the two sampling periods.

[0081] This application also proposes a laser processing control device, referring to... Figures 1 to 7 The laser processing control device includes:

[0082] The sampling module 10 is used to sample the sensing height value and the Z-axis coordinate value of the laser nozzle at a sampling period, and obtain three sensing height values ​​H0, H1 and H2 of the laser nozzle, as well as the corresponding three Z-axis coordinate values ​​Z0, Z1 and Z2.

[0083] Processing module 20 is used to calculate ΔZ and / or ΔH based on the following formula;

[0084] ΔZ=ΔZ2-ΔZ1=(Z2-Z1)-(Z1-Z0)=Z2+Z0-2Z1;

[0085] ΔH=ΔH2-ΔH1=(H2-H1)-(H1-H0)=H2+H0-2H1;

[0086] The processing module 20 is also used to determine whether the laser nozzle is located outside the plate at the sampling time corresponding to H2 based on the magnitudes of ΔZ and ΔH.

[0087] The processing module 20 is further configured to determine whether ΔZ>a or ΔH>b is true. If either inequality is true, it is determined that the laser nozzle is outside the plate at the sampling time corresponding to H2. The preset following distance between the laser nozzle and the plate is h, where h>a>0 and h>b>0.

[0088] like Figure 2 As shown, due to timely adjustment of the Z-axis movement, H0≈H1≈H2. Therefore, the Z-axis position change ΔZ1=Z1-Z0 from T0 to T1 is reasonable, while the Z-axis position change ΔZ2=Z2-Z1 from T1 to T2 is unreasonable. Therefore, by setting an appropriate threshold 'a' for ΔZ (the unreasonable part of ΔZ2), we can determine whether the cut has occurred outside the material. Where ΔZ=ΔZ2-ΔZ1.

[0089] H0≈H1≈H2;(1)

[0090] ΔZ=ΔZ2-ΔZ1=(Z2-Z1)-(Z1-Z0)=Z2+Z0-2Z1>a; (2)

[0091] like Figure 3 As mentioned above, the Z-axis motion adjustment is not timely, meaning the scanning period of the capacitive sensor is less than the scanning period of the Z-axis position sensor. In this case, the Z-axis adjustment movement based on the sensed height will generally lag behind. Figure 3 Because the Z-axis motion adjustment is not timely, ΔZ1≈ΔZ2. Therefore, the change in sensing distance ΔH1=H1-H0 from T0 to T1 is reasonable, while the change in sensing distance ΔH2=H2-H1 from T1 to T2 is unreasonable. Therefore, as long as an appropriate threshold b is set for the unreasonable positional change part ΔH2 ΔH=ΔH2-ΔH1, it can be determined that the material has been cut outside the plate.

[0092] ΔZ1≈ΔZ2, that is, Z1-Z0≈Z2-Z1; (3)

[0093] ΔH=ΔH2-ΔH1=(H2-H1)-(H1-H0)=H2+H0-2H1>b; (4)

[0094] In some embodiments, the processing module 20 is further configured to determine whether H2>c is true; if H2>c is true, then it is determined that the laser nozzle is outside the plate at the sampling time corresponding to H2. The preset following distance between the laser nozzle and the plate is h, and the maximum range of the height sensor is d, where d>c>h. If the set threshold b does not detect that the laser processing has cut outside the plate, then a third situation will occur:

[0095] like Figure 4 If the Z-axis motion adjustment is not timely, the center of the laser nozzle is already outside the material at time T0. After continuing to move to times T1 and T2, ΔZ1≈ΔZ2 and ΔH1≈ΔH2, (3) and (4) still cannot be detected. At this time, the simplest method can be used to detect it. Set an appropriate threshold c. When H2>c, it is determined that the laser has cut outside the material.

[0096] This application also proposes a laser processing control device, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the laser processing control method described above. The processor can be a central processing unit, or it can be other general-purpose processors, digital signal processors, application-specific integrated circuits, off-the-shelf programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Furthermore, the logic instructions in the memory can be implemented as software functional units and, when sold or used as independent workpieces, can be stored in a computer-readable storage medium. The memory, as a storage medium, can be configured to store software programs, computer-executable programs, such as the program instructions or modules corresponding to the methods in the embodiments of this application. The central processing unit executes functional applications and data processing by running the software programs, instructions, or modules stored in the memory, thereby implementing the methods in the embodiments described above. The memory can include a program storage area and a data storage area, wherein the program storage area can store the operating system and at least one application program required for a function; the data storage area can store data created based on the use of the terminal device, etc. In addition, the memory can include high-speed random access memory and can also include non-volatile memory.

[0097] This application also proposes a storage medium storing computer-executable instructions configured to execute the aforementioned laser processing control method. All or part of the steps in the above embodiments can be implemented by hardware, or by a program instructing related hardware to implement them. This program can be stored in a storage medium, which can be a non-transitory storage medium, including various media capable of storing program code such as USB flash drives, portable hard drives, read-only memory, random access memory, magnetic disks, or optical disks, or it can be a transient storage medium.

[0098] The above are only some or preferred embodiments of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A laser processing control method characterized by, The method comprises the following steps: sampling the Z-axis coordinate values of the laser nozzle at a set sampling period to obtain three Z-axis coordinate values Z0, Z1 and Z2 of the laser nozzle; sampling the sensing height values of the laser nozzle at a set sampling period to obtain three sensing height values H0, H1 and H2 of the laser nozzle, which correspond to the Z-axis coordinate values one by one; determining whether H0, H1 and H2 are all within a set range, and if so, obtaining ΔZ; obtaining ΔZ based on the following formula: ΔZ = ΔZ2 - ΔZ1 = (Z2 - Z1) - (Z1 - Z0) = Z2 + Z0 - 2Z1; determining whether the laser nozzle is outside the plate at the sampling time corresponding to Z2 according to the size of ΔZ; otherwise, obtaining ΔH; obtaining ΔH based on the following formula: ΔH = ΔH2 - ΔH1 = (H2 - H1) - (H1 - H0) = H2 + H0 - 2H1; determining whether the laser nozzle is outside the plate at the sampling time corresponding to H2 according to the size of ΔH.

2. The laser processing control method according to claim 1, characterized by, The method further comprises the following steps before obtaining ΔH based on the following formula: determining whether H2 > c is true, and if so, it is determined that the laser nozzle is outside the plate at the sampling time corresponding to H2; otherwise, ΔH is obtained; the preset following distance between the laser nozzle and the plate is h, the maximum range of the height sensor is d, and d > c > h.

3. The laser processing control method according to claim 1, characterized by, The method further comprises the following steps of determining whether the laser nozzle is outside the plate at the sampling time corresponding to Z2 according to the size of ΔZ: determining whether ΔZ > a is true, and if so, it is determined that the laser nozzle is outside the plate at the sampling time corresponding to Z2; the preset following distance between the laser nozzle and the plate is h, and h > a > 0.

4. The laser processing control method according to claim 1, characterized by, The method further comprises the following steps of determining whether the laser nozzle is outside the plate at the sampling time corresponding to H2 according to the size of ΔH: determining whether ΔH > b is true, and if so, it is determined that the laser nozzle is outside the plate at the sampling time corresponding to H2; the preset following distance between the laser nozzle and the plate is h, and h > b > 0.

5. A laser processing control device characterized by comprising: The method comprises: a sampling module for sampling the sensing height values of the laser nozzle and the Z-axis coordinate values of the laser nozzle at a set sampling period to obtain three sensing height values H0, H1 and H2 of the laser nozzle and corresponding three Z-axis coordinate values Z0, Z1 and Z2; a processing module for obtaining ΔZ and / or ΔH based on the following formulae: ΔZ = ΔZ2 - ΔZ1 = (Z2 - Z1) - (Z1 - Z0) = Z2 + Z0 - 2Z1; ΔH = ΔH2 - ΔH1 = (H2 - H1) - (H1 - H0) = H2 + H0 - 2H1; the processing module is further configured to determine whether the laser nozzle is outside the plate at the sampling time corresponding to H2 according to the sizes of ΔZ and ΔH.

6. A laser processing control apparatus characterized by comprising: The storage medium stores computer executable instructions, and the computer executable instructions are configured to execute the laser processing control method according to any one of claims 1 to 4.

7. A storage medium, characterized by The storage medium stores computer executable instructions, and the computer executable instructions are configured to execute the laser processing control method according to any one of claims 1 to 4.

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