Repairing device

Abstract

The present application discloses a repairing device, which comprises a base, a first carrying device, a second carrying device and a laser repairing device. The base comprises a first mounting area, a second mounting area, a first track, a second track and a third track. The second mounting area extends upward from the first mounting area, and the first track and the second track are fixedly arranged on the first mounting area. The third track is arranged on the second mounting area. The first carrying device is connected with the first track and used for carrying a tray. The tray comprises a semiconductor element. The second carrying device is connected with the second track and used for carrying a circuit substrate. The laser repairing device is connected with the third track and can move above the first carrying device and the second carrying device, and the laser repairing device is used for electrically connecting the semiconductor element to the circuit substrate.

Description

Technical Field

[0001] This invention relates to repair equipment, and more particularly to a repair equipment for semiconductor components. Background Technology

[0002] Panels composed of optoelectronic components require a huge number of light-emitting diodes (LEDs), which are arranged in a dense matrix. Therefore, although electrical testing of the panel can identify malfunctioning LEDs and their locations, electrical testing and repair currently require different equipment. As a result, the transportation, material handling, and repair processes waste a lot of time.

[0003] Furthermore, LEDs are not only tiny in size, but they are also closely packed together, making them very difficult to repair. Summary of the Invention

[0004] In view of the above deficiencies, the purpose of the present invention is to provide a repair device that places a circuit board and a tray on the same device, and uses a movable laser repair device to move on the circuit board and the tray to repair the location of malfunctioning or missing semiconductor components on the circuit board.

[0005] To achieve the above objectives, the present invention provides a repair device, comprising a base, a first support device, a second support device, and a laser repair device. The base includes a first mounting area, a second mounting area, a first track, a second track, and a third track. The second mounting area extends upward from the first mounting area, and the first and second tracks are fixedly disposed in the first mounting area. The third track is disposed in the second mounting area. The first support device is connected to the first track and is used to support a tray. The tray includes a semiconductor element. The second support device is connected to the second track and is used to support a circuit board. The laser repair device is connected to the third track and is movable above the first and second support devices. The laser repair device is used to electrically connect the semiconductor element to the circuit board.

[0006] The laser repair device includes a mounting base, a laser system, and a material handling system. The mounting base is connected to the third track, the laser system is connected to the mounting base and is used to project a laser beam, the material handling system is connected to the mounting base and includes an adhesive tape, a conveying module, and a pushing module. The adhesive tape can adhere to the semiconductor component, the conveying module is connected to the adhesive tape and can convey the adhesive tape, and the pushing module can push the adhesive tape on the conveying module. The laser beam passes through the pushing module and the adhesive tape to solder the semiconductor component to the circuit board.

[0007] The tape includes a flat area where the semiconductor device is adhered. The pushing module includes a lifting unit and a pressing member. The pressing member is connected to the lifting unit, faces the flat area, and can push the tape downward.

[0008] The pressing component includes a connecting block and a contact block. The connecting block is connected to the lifting unit, and the contact block is connected to the connecting block and protrudes from the side of the connecting block. It includes a head and a window. The head is formed at the protruding end of the contact block, and the window is formed at the head to allow the laser beam to pass through.

[0009] The head includes a top slope, a bottom surface, and at least one protrusion. The window extends through the top slope and the bottom surface. The at least one protrusion protrudes downward from the bottom surface and is adjacent to the window.

[0010] The conveying module includes two positioning rollers, and the leveling area is located between the two positioning rollers.

[0011] The second carrier device is capable of testing the circuit board.

[0012] Thus, the repair equipment of the present invention places the material tray and the circuit board on the same equipment simultaneously, thereby shortening the time spent on movement and improving the repair efficiency.

[0013] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0014] The detailed structure, features, and manufacturing method of the repair equipment will be described in the following embodiments. However, it should be understood that the embodiments and drawings described below are merely illustrative and should not be used to limit the patent scope of this invention.

[0015] Figure 1 This is a perspective view of the repair device of the present invention.

[0016] Figure 2 yes Figure 1 Enlarged view of the laser repair device in the repair equipment.

[0017] Figure 3 yes Figure 2 A three-dimensional view of the pressing component of the laser repair device.

[0018] Figure 4 yes Figure 3 Enlarged schematic diagram of the circle at the head of the middle pressing component.

[0019] Figures 5 to 7 yes Figure 1A simplified schematic diagram of the first support device, the second support device, and the laser repair device, and a schematic diagram of the removal operation.

[0020] Figures 8 to 10 yes Figure 1 A simplified schematic diagram of the first bearing device, the second bearing device, and the laser repair device, and a schematic diagram of the material handling operation.

[0021] Figures 11 to 13 yes Figure 1 A simplified schematic diagram of the first support device, the second support device, and the laser repair device, and a schematic diagram of the repair operation.

[0022] In the attached figures, the following labels are used:

[0023] 10: Repair equipment

[0024] 11: Base

[0025] 111: First Installation Area

[0026] 113: Second Installation Area

[0027] 115: First Track

[0028] 117: Second Track

[0029] 119: Third Track

[0030] 13: First bearing device

[0031] 15: Second bearing device

[0032] 17: Laser Repair Device

[0033] 171: Mounting bracket

[0034] 173: Laser System

[0035] 1731: Laser Beam

[0036] 175: Material Handling System

[0037] 176: Tape

[0038] 177: Conveying Module

[0039] 1771: First Roller

[0040] 1773: Second Roller

[0041] 1775: Third Roller

[0042] 1777: Positioning Roller

[0043] 179: Drive Module

[0044] 1791: Lifting Unit

[0045] 1793: Pressing component

[0046] 1795: Connecting Block

[0047] 1797: Contact Block

[0048] 1798: Head

[0049] 17981: Top slope

[0050] 17983: Bottom

[0051] 17985:convex part

[0052] 1799: Window

[0053] 30: Tray

[0054] 50: Circuit board

[0055] 51: Defective semiconductor components

[0056] 31: Good quality semiconductor components Detailed Implementation

[0057] To illustrate the technical features of the present invention in detail, the following embodiments are provided in conjunction with the accompanying drawings, wherein:

[0058] like Figure 1 As shown, the repair equipment 10 includes a base 11, a first supporting device 13, a second supporting device 15, and a laser repair device 17. The base 11 includes a first mounting area 111, a second mounting area 113, a first track 115, a second track 117, and a third track 119. The second mounting area 113 extends upward from the first mounting area 111. The first track 115 and the second track 117 are fixedly disposed in the first mounting area 111. The third track 119 is fixedly disposed in the second mounting area 113.

[0059] The first carrier device 13 is connected to the base 11 and the first track 115, and can move along the first track 115. The first carrier device 13 is used to carry the tray 30, which includes multiple arrayed semiconductor elements, such as optoelectronic elements or integrated circuits. The tray 30 can be a wafer. The semiconductor elements are micro-elements, that is, one dimension of the semiconductor element is less than 150 micrometers (µm).

[0060] The second support device 15 is connected to the second track 117 and can move along the second track 117. The second support device 15 is used to support and test the circuit board 50. The test is to check the function of the circuit board 50 by means of power supply or signal. In other embodiments, the test function can also be performed by other devices.

[0061] The circuit board 50 includes a substrate body, conductive lines, and multiple semiconductor components. The substrate body is made of materials such as glass or polyimide (PI). Conductive lines are formed on the substrate body. The semiconductor components are electrically connected to the conductive lines.

[0062] The laser repair device 17 is connected to the base 11 and the third track 119, and can move along the third track 119 while moving on the first support device 13 and the second support device 15. The laser repair device 17 moves above the first support device 13 to obtain semiconductor components, and when the laser repair device moves above the second support device, it can selectively remove semiconductor components from the circuit board or reconnect semiconductor components.

[0063] Thus, after the first support device 13 and the second support device 15 support the corresponding tray 30 and circuit board 50, they can move below the laser repair device 17 via the first track 115 and the second track 117. Then, the laser repair device 17 only needs to make a short-stroke movement above the tray 30 and circuit board 50 to achieve efficient operation. Furthermore, the first support device 13 and the second support device 15 can operate independently to re-support the tray 30 and circuit board 50. The number of tracks can be greater than that in this embodiment, and is not limited to one track per device.

[0064] like Figure 2 As shown, the laser repair device 17 includes a mounting base 171, a laser system 173, and a material handling system 175. The laser system 173 and the material handling system 175 are connected to the mounting base 171.

[0065] The laser system 173 is used to project a laser beam, the spot of which is preferably rectangular in shape to provide uniform energy.

[0066] The material handling system 175 includes a conveyor belt 176, a conveying module 177, and a pushing module 179. The conveying module 177 is connected to the conveyor belt 176 and is used to convey the conveyor belt 176. In this embodiment, the conveying module 177 includes a first roller 1771, a second roller 1773, a third roller 1775, and two positioning rollers 1777. One end of the conveyor belt 176 is connected to the first roller 1771, and the other end of the conveyor belt 176 is connected to the second roller 1773. The first roller 1771 and the second roller 1773 convey the conveyor belt 176 by rolling.

[0067] In this embodiment, the first roller 1771 supplies the tape 176, and the second roller 1773 recycles the tape 176. The third roller 1775 contacts the tape 176 and is used to adjust the conveying direction of the tape 176. The two positioning rollers 1777 contact the tape 176 so that the tape 176 forms a flat area between the two positioning rollers 1777. In other embodiments, the conveying module 177 may have more or fewer rollers, and the range of the flat area can be adjusted by the two positioning rollers 1777.

[0068] The tape 176 includes a substrate and an adhesive layer. The tape 176 is, for example, a polyimide (PI) tape or a thermal release tape. The adhesive layer is bonded to the body layer and faces the first mounting area.

[0069] The pushing module 179 is used to push the tape 176 conveyed by the conveying module 177. The pushing module 179 includes a lifting unit 1791 and a pressing member 1793. The pressing member 1793 is connected to the lifting unit 1791, and moves upward or downward with the lifting unit 1791 to move downward to push the tape 176, and moves upward to release the tape 176. The pressing member 1793 is located on a flat area and is used to press the tape 176. The pushing module 179 moves downward to push the tape 176, so that the tape 176 deforms downward to adhere to the semiconductor device. A laser beam passes through the pushing module 179 and the tape 176.

[0070] like Figure 3 and Figure 4 As shown, the pressing component 1793 includes a connecting block 1795 and a contact block 1797. The connecting block 1795 is connected to the lifting unit 1791. The contact block 1797 is connected to the connecting block 1795. The contact block 1797 extends radially from the side of the connecting block 1795 and includes a head 1798 and a window 1799. The head 1798 is formed at the protruding end of the contact block 1797, and the window 1799 is formed in the head 1798. The laser beam projection path passes through the window. The head 1798 includes a top slope 17981, a bottom surface 17983, and two protrusions 17985. The window 1799 penetrates the top slope 17981 and the bottom surface 17983. The two protrusions 17985 protrude downward from the bottom surface and are adjacent to the area around the window 1799. The distance between the two protrusions 17985 is slightly larger than that between the semiconductor components, so that the semiconductor components can be brought into contact with the conductive lines of the circuit board by the downward pressure of the tape during the pressing process, and the downward pressure of the two protrusions 17985 can be avoided to prevent damage to the semiconductor components.

[0071] In this embodiment, the head 1798 is slightly conical, and the window 1799 not only allows the laser system 173 to effectively project the laser beam, but also allows the laser system 173 to effectively focus and achieve efficient repair work.

[0072] The above describes the composition of the repair device of the present invention, and then... Figures 5 to 13 Explanation of the operation of the repair equipment. To facilitate understanding of this invention, Figures 5 to 13 It is simplification Figure 1 The structure of the first support device 13, the second support device 15 and the laser repair device 17 are shown, and the size of some parts is enlarged.

[0073] When a repair procedure is performed by determining the location of a defective semiconductor component on a circuit board through testing, it means that the defective semiconductor component on the circuit board must first be removed, and then a good semiconductor component must be reconnected. The location of the defective semiconductor component is defined as the repair location.

[0074] Laser repair equipment is used for removal operations, such as... Figure 5-7 As shown, Figure 5 The laser repair device 17 first moves above the second support device 15 and aligns with the repair position, namely the defective semiconductor element 51 on the circuit board 50, and then... Figure 6 As shown, the pressing member 1793 is moved downward to push the adhesive tape 176 to adhere the defective semiconductor component 51 in the repair location, and the defective semiconductor component 51 is heated by the laser beam 1731, so that the defective semiconductor component 51 is desoldered from the conductive lines of the circuit board 50 and removed by the adhesive tape. Figure 7 As shown, the pressing member 1793 moves upward, leaving conductive lines at the repair position of the circuit board 50, and the defective semiconductor component 51 is removed.

[0075] Next, the material handling system 175 performs a re-material handling operation to obtain a good semiconductor device 31, such as... Figure 8-10 As shown. Figure 8 As shown, the laser repair device 17 moves onto the first support device 13, and the tape 176 is displaced as the two positioning rollers 1777 of the material handling system 175 rolls, so that the unused tape 176 is aligned with the good semiconductor device 31. Then, as... Figure 9 As shown, the pressing member 1793 moves downward again to push the adhesive tape 176 to adhere the good semiconductor component 31 carried by the first carrier device 13, and then, as Figure 10 As shown, the laser repair device 17 moves upward so that the tape 176 can remove the good semiconductor component 31.

[0076] Finally, the laser repair device 17 performs the repair work, such as... Figure 11-13 As shown. Figure 11As shown, the material handling system 175 returns to the repair position, as... Figure 12 As shown, the laser repair device 17 moves downward to bring the good semiconductor component 31, which is adhered to the adhesive tape 176, into contact with the conductive line. The laser beam 1731 heats the good semiconductor component 31, thus soldering it onto the conductive line. After soldering, as shown... Figure 13 As shown, the pressing component 1793 moves upward, causing the tape 176 to separate from the good semiconductor component 31. After the repair work, testing can be conducted to confirm whether the repair is complete. Figures 9 to 12 The position of the pressing component 1793 remains unchanged to facilitate subsequent laser welding operations.

[0077] Separation of the tape from the good semiconductor component can be achieved by using a laser beam to pyrolyze the adhesive, or by ensuring that the bonding strength of the good semiconductor component soldered to the conductive circuit is greater than the adhesive strength of the tape.

[0078] The above embodiments illustrate that those skilled in the art can understand the technology and purpose of the repair device of the present invention. Therefore, the above-described configuration of the repair device can also be changed in hardware by changing the number or arrangement of logical elements to achieve the same technology and purpose. Therefore, the repair device described in the embodiments is only for the purpose of illustration in this embodiment and is not intended to limit the scope of the claims.

[0079] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the claims of the present invention.

Claims

1. A repair device, characterized in that, include: A base includes a first mounting area, a second mounting area, a first track, a second track and a third track, the second mounting area extending upward from the first mounting area, the first track and the second track being fixedly installed in the first mounting area, and the third track being fixedly installed in the second mounting area; A first carrier device is connected to the first track and is used to carry a tray, the tray including a semiconductor element; A second support device is connected to the second track and is capable of supporting a circuit board; and A laser repair device is connected to the third track and can move above the first support device and the second support device. The laser repair device can electrically connect the semiconductor element to the circuit board. The laser repair device includes a mounting base, a laser system, and a material handling system. The mounting base is connected to the third track. The laser system is connected to the mounting base and is used to project a laser beam. The material handling system is connected to the mounting base and includes an adhesive tape, a conveying module, and a pushing module. The adhesive tape can pick up the semiconductor device. The conveying module is connected to the adhesive tape and can convey the adhesive tape. The pushing module can push the adhesive tape on the conveying module. The laser beam passes through the pushing module and the adhesive tape to solder the semiconductor device to the circuit board. The tape includes a flat area on which the semiconductor device is adhered. The push module includes a lifting unit and a pressing member. The pressing member is connected to the lifting unit and faces the flat area, and is capable of pushing the tape downward. The pressing component includes a connecting block and a contact block. The connecting block is connected to the lifting unit, and the contact block is connected to the connecting block and protrudes from the side of the connecting block. It includes a head and a window. The head is formed at the protruding end of the contact block, and the window is formed at the head to allow the laser beam to pass through.

2. The repair equipment according to claim 1, characterized in that, The head includes a top slope, a bottom surface, and at least one protrusion, the window extending through the top slope and the bottom surface, and the at least one protrusion projecting downward from the bottom surface.

3. The repair equipment according to claim 1, characterized in that, The conveying module includes two positioning rollers, and the leveling area is located between the two positioning rollers.

4. The repair equipment according to claim 1, characterized in that, The second carrier device is capable of testing the circuit board.

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