A substrate grinding table and substrate grinding apparatus

Abstract

This invention discloses a substrate grinding worktable and substrate grinding equipment. The substrate grinding worktable includes: a mounting base; a rotary drive unit disposed below the mounting base; and a ceramic chuck disposed above the mounting base to attract the substrate to be ground. An auxiliary structure is provided at the contact point between the mounting base and the ceramic chuck, which can create a vacuum in at least a portion of the contact point, so that the ceramic chuck is tightly attached to the upper part of the mounting base. When the ceramic chuck is vacuum-attracted to the upper part of the mounting base, the substrate grinding worktable installs fixing bolts in a predetermined sequence to ensure the flatness of the top surface of the ceramic chuck.

Description

Technical Field

[0001] This invention belongs to the field of substrate grinding technology, and more specifically, relates to a substrate grinding worktable and substrate grinding equipment. Background Technology

[0002] In the semiconductor field, during the back-end process of integrated circuit (IC) manufacturing, in order to reduce the packaging height, decrease the chip package size, improve the chip's thermal diffusion efficiency, electrical performance, mechanical performance, and reduce the amount of chip processing, the substrate needs to undergo back-side grinding before subsequent packaging to thin the substrate to a predetermined thickness; the chip thickness after back-side grinding can even be less than 5% of the initial thickness.

[0003] Substrate thinning is performed on substrate grinding equipment, where the substrate grinding table is a key component used to hold the substrate to be ground. The assembly and manufacturing quality of the substrate grinding table directly affects the reliability of the substrate thinning equipment.

[0004] Substrate grinding stages typically include ceramic chucks, which are fixed to a mounting base. The ceramic chucks are used to pick up the substrate and contact grinding chips; they are consumable parts and require regular maintenance and / or replacement. Therefore, the secure mounting of the ceramic chucks is crucial.

[0005] In existing technologies, ceramic chucks are connected to the mounting base via fixing bolts. The ceramic chuck and the mounting base only fit tightly at the bolt connection points, while other areas are not tightly fitted. This affects the flatness of the substrate grinding table and even the quality of substrate grinding. Because of the loose fit between the ceramic chuck and the mounting base, the surface flatness of the ceramic chuck changes when a load is applied, which is detrimental to the control of the total thickness variation (TTV) of the substrate.

[0006] Improving the flatness of the contact surface between the ceramic chuck and the mounting base can improve the manufacturing quality of the substrate grinding table to some extent, but this will increase the difficulty of component processing and make it difficult to control equipment manufacturing costs. Summary of the Invention

[0007] The present invention provides a substrate grinding table and substrate grinding equipment, which aims to solve at least one of the technical problems existing in the prior art.

[0008] A first aspect of the present invention provides a substrate grinding stage, comprising:

[0009] Mounting base;

[0010] A rotary drive unit is disposed below the mounting base;

[0011] A ceramic suction cup is disposed above the mounting base to attract the substrate to be ground;

[0012] The mounting base is provided with an auxiliary structure at the contact point with the ceramic suction cup, which can create a vacuum in at least a portion of the contact point, so that the ceramic suction cup fits tightly against the top of the mounting base.

[0013] The substrate grinding worktable is equipped with fixing bolts installed in a set sequence when the ceramic chuck is vacuum-adhered above the mounting base to ensure the flatness of the top surface of the ceramic chuck.

[0014] In some embodiments, the auxiliary structure is a groove disposed on the top surface of the mounting base and / or the bottom surface of the ceramic suction cup, and the auxiliary structure is connected to an external vacuum source.

[0015] In some embodiments, the substrate grinding stage further includes a ventilation shaft, which is connected to the lower part of the mounting base via an adapter, to evacuate or supply air at the contact point between the mounting base and the ceramic chuck.

[0016] In some embodiments, the vent shaft is coaxially disposed inside the rotary drive unit, the adapter is sleeved on the end of the vent shaft, and the end face of the adapter abuts against the bottom surface of the mounting base, so that the vent shaft and the interior of the adapter form an air supply channel; the interior of the mounting base is provided with an air supply channel, the air supply channel communicates with the air supply channel, and the air supply channel communicates with the contact point.

[0017] In some embodiments, the auxiliary structure is an annular groove, which is concentrically disposed on the top surface of the mounting base.

[0018] In some embodiments, the number of auxiliary structures is multiple, and they are disposed in an area between 20% and 80% of the radius of the mounting base.

[0019] In some embodiments, the auxiliary structure is a plurality of radial grooves, which are evenly distributed along the circumference on the top surface of the mounting base.

[0020] In some embodiments, the auxiliary structure is disposed on the line connecting the diagonal fixing bolts between the ceramic suction cup and the mounting base.

[0021] In some embodiments, the auxiliary structure includes a main radial groove, with secondary circumferential grooves disposed on both sides of the main radial groove.

[0022] A second aspect of the present invention provides a substrate grinding apparatus, comprising:

[0023] Turntable;

[0024] The substrate grinding worktable described above is disposed above the turntable to support the substrate to be processed;

[0025] The grinding module is located above the substrate grinding stage to perform grinding on the substrate.

[0026] A third aspect of the present invention provides a method for manufacturing a substrate grinding stage, comprising:

[0027] S1. Place the ceramic suction cup above the mounting base and adjust the circumferential position of the ceramic suction cup to align the mounting holes of both.

[0028] S2, Vacuum the auxiliary structure located between the mounting base and the ceramic suction cup, so that the ceramic suction cup fits tightly against the top surface of the mounting base;

[0029] S3, maintain the vacuum level of the auxiliary structure, and install the fixing bolts in the set sequence to ensure the flatness of the top surface of the ceramic suction cup.

[0030] In some embodiments, a substrate grinding table with radial grooves is used to manufacture a substrate grinding table. The fixing holes corresponding to the fixing bolts to be installed are connected to the center of the mounting base. The auxiliary structure through which the connection line passes is kept at normal pressure, while other auxiliary structures are evacuated. The fixing bolts are installed diagonally in sequence.

[0031] The beneficial effects of this invention include:

[0032] a. An auxiliary structure is set between the ceramic chuck and the mounting base. After the holes of the ceramic chuck are aligned, the auxiliary structure is evacuated to ensure that the ceramic chuck fits tightly against the top of the mounting base, preventing displacement during installation and ensuring that the surface flatness of the ceramic chuck meets the process requirements, thereby improving the stability of substrate grinding.

[0033] b. The auxiliary structure is a groove structure, which is set on the bottom surface of the ceramic suction cup or the top surface of the mounting base, so as to evacuate the contact area between the two.

[0034] c. The evacuation treatment of the auxiliary structure between the ceramic chuck and the mounting base can remove the fluid containing particulate matter remaining between the two, which helps to ensure the assembly and manufacturing quality of the substrate grinding table.

[0035] d. The auxiliary structure is a concentric annular groove, and the evacuated auxiliary structure can provide a relatively uniform suction force;

[0036] e. The auxiliary structure is a radial groove, which is set on the line connecting the fixing hole of the mounting base and the center of the mounting base. When installing the fixing bolt, the auxiliary structure corresponding to the line where the bolt to be fixed is located is kept at constant pressure, while other auxiliary structures are evacuated to promote stress release, obtain a substrate grinding table with a surface flatness that meets the requirements, and improve the substrate grinding quality. Attached Figure Description

[0037] The advantages of the present invention will become clearer and easier to understand through the following detailed description in conjunction with the accompanying drawings, which are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0038] Figure 1 This is a schematic diagram of a substrate grinding worktable provided in an embodiment of the present invention;

[0039] Figure 2 This is a cross-sectional view of a substrate grinding table provided in an embodiment of the present invention;

[0040] Figure 3 This is a schematic diagram of an adapter provided in an embodiment of the present invention;

[0041] Figure 4 This is a schematic diagram of the connection between the vent shaft and the adapter according to an embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of a mounting base provided in an embodiment of the present invention;

[0043] Figure 6 yes Figure 5 A sectional view of the mounting base;

[0044] Figure 7 This is a schematic diagram of a mounting base provided in another embodiment of the present invention;

[0045] Figure 8 This is a top view of a mounting base with radial grooves provided in an embodiment of the present invention;

[0046] Figure 9 yes Figure 8 Schematic diagrams corresponding to variants of the embodiments;

[0047] Figure 10 This is a flowchart corresponding to the manufacturing method of a substrate grinding worktable provided by the present invention;

[0048] Figure 11 This is a schematic diagram of the fixing bolt installation steps provided by the present invention;

[0049] Figure 12 This is a schematic diagram of a substrate grinding equipment provided in an embodiment of the present invention. Detailed Implementation

[0050] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0051] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of the invention and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of the invention, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0052] In this invention, "Chemical Mechanical Polishing (CMP)" is also called "Chemical Mechanical Planarization (CMP)," and the wafer (W) is also called the substrate (Substrate), with the same meaning and actual function.

[0053] The embodiments disclosed in this invention generally relate to substrate grinding equipment in the field of semiconductor manufacturing, which achieves substrate thinning through grinding.

[0054] Figure 1 This is a schematic diagram of a substrate grinding worktable 100 provided in an embodiment of the present invention. The substrate grinding worktable 100 includes:

[0055] Mounting base 10;

[0056] A rotary drive unit 20 is disposed below the mounting base 10 and is used to drive the mounting base 10 to rotate around the central axis;

[0057] A ceramic suction cup 30 is disposed above the mounting base 10 to attract the substrate to be ground.

[0058] Furthermore, the ceramic suction cup 30 includes a suction cup base 31 and a porous ceramic element 32, such as... Figure 2 As shown; the porous ceramic 32 is disposed on the upper part of the suction cup seat 31; the suction cup seat 31 is provided with a fluid conveying passage to evacuate the porous ceramic 32 and adhere to the substrate to be ground, or to introduce clean air and / or deionized water toward the porous ceramic 32 to rinse off residual particles on the surface of the porous ceramic 32.

[0059] Figure 2 In the illustrated embodiment, an auxiliary structure 40 is provided at the contact point between the mounting base 10 and the ceramic chuck 30, which can create a vacuum in at least a portion of the contact point, so that the ceramic chuck 30 fits tightly against the top of the mounting base 10, so as to remove water and residual grinding chips remaining between the two.

[0060] When fixing the ceramic suction cup 30 to the mounting base 10, keep the ceramic suction cup 30 tightly attached to the top of the mounting base 10, and install the fixing bolts 50 in the set sequence to ensure the flatness of the top surface of the ceramic suction cup 30.

[0061] When installing the ceramic suction cup 30, first place the ceramic suction cup 30 on the upper surface of the mounting base 10, and pre-align the fixing holes of the two; then, turn on the vacuum source ( Figure 2 (Not shown) This creates a vacuum in the auxiliary structure 40 between the ceramic chuck 30 and the mounting base 10, allowing the ceramic chuck 30 to fit tightly against the upper part of the mounting base 10. Next, fixing bolts 50 are installed sequentially to secure the ceramic chuck 30 to the upper part of the mounting base 10. Through the above-described steps, a substrate grinding table 100 with good surface flatness can be obtained, ensuring the quality of substrate grinding.

[0062] As an embodiment of the present invention, the auxiliary structure 40 is a groove, which is disposed on the top surface of the mounting base 10 and / or the bottom surface of the ceramic suction cup 30. Furthermore, the auxiliary structure 40 is connected to an external vacuum source so that after the ceramic suction cup 30 is pre-placed above the mounting base 10, the vacuum source is turned on so that the two fit tightly together.

[0063] Figure 2 In the middle, the auxiliary structure 40 is a groove, which is set on the top surface of the mounting base 10. The external vacuum source is connected to the auxiliary structure 40 of the mounting base 10 to ensure a tight suction between the ceramic suction cup 30 and the mounting base 10.

[0064] Furthermore, the substrate grinding table 100 also includes a ventilation shaft 60, which is connected to the lower part of the mounting base 10 via an adapter 70, to provide vacuum or air supply at the contact point between the mounting base 10 and the ceramic chuck 30. It should be noted that when disassembling the ceramic chuck 30, appropriate clean gas can be introduced into the auxiliary structure 40 to give the ceramic chuck 30 an upward buoyancy force, making it easier for the operator to remove the ceramic chuck 30 from above the mounting base 10.

[0065] Furthermore, the ventilation shaft 60 is coaxially disposed inside the rotary drive unit 20, and is used to supply fluid to the auxiliary structure 40 and the ceramic suction cup 30 to obtain a vacuum or to supply fluid; specifically, a vertical through hole 21 is disposed in the middle position of the rotary drive unit 20, and the ventilation shaft 60 is disposed in the through hole 21 of the rotary drive unit 20.

[0066] The ventilation shaft 60 has a cylindrical structure, and the adapter 70 is sleeved on the end of the ventilation shaft 60. The end face of the adapter 70 abuts against the bottom surface of the mounting base 10, so that the ventilation shaft 60 and the interior of the adapter 70 form an air supply channel 60a.

[0067] Figure 2 In the process, the air supply channel 60a includes a first air supply channel 61 and a second air supply channel 71; wherein, the first air supply channel 61 is disposed inside the ventilation shaft 60, the first air supply channel 61 is disposed along the length direction of the ventilation shaft 60, and then extends along the radial direction of the ventilation shaft 60 to form a fluid channel inside the ventilation shaft 60; the second air supply channel 71 is disposed inside the adapter 70, and communicates with the first air supply channel 61 to transfer the fluid of the ventilation shaft 60 to the interior of the adapter 70.

[0068] Furthermore, the mounting base 10 is provided with a vent 10a inside, and the air supply vent 60a communicates with the vent 10a. The vent 10a is connected to the contact point. Specifically, the vent 10a is connected to the auxiliary structure 40 so that, through the combined action of the vent shaft 60 and the connector 70, a vacuum is drawn or a suitable gas is introduced into the auxiliary structure 40.

[0069] Figure 3 This is a schematic diagram of an adapter 70 provided in an embodiment of the present invention. The adapter 70 has a cylindrical structure and a through hole 72 inside, and a ventilation shaft 60 ( Figure 4 (Shown) It is coaxially connected inside the through hole 72. The second air supply channel 71 includes a second air supply channel transverse section 71a and a second air supply channel vertical section 71b, which are connected to each other. Furthermore, the second air supply channel transverse section 71a is connected to the first air supply channel 61 of the ventilation shaft 60.

[0070] To ensure the sealing between the transverse section 71a of the second air supply channel and the first air supply channel 61, a sealing groove is provided at the connection between the two to facilitate the installation of a sealing ring for sealing.

[0071] Furthermore, the ventilation shaft 60 is a metal part, and it is connected to the through hole 72 of the adapter 70 with a precise clearance fit to quickly install the ventilation shaft 60 and ensure the sealing of both, so as to prevent fluid leakage through the connection between the second air supply channel transverse section 71a and the first air supply channel 61.

[0072] In the prior art, the mounting base 10 is a ceramic component, and the vent shaft 60 is typically directly connected to the mounting base 10 to facilitate fluid transport. Specifically, during installation, the end of the vent shaft 60 needs to be inserted into the mounting hole on the mounting base 10 and a radial sealing ring needs to be installed to ensure a tight seal between the vent shaft 60 and the mounting base 10. However, during installation, the metal vent shaft 60 may come into contact with the mounting hole of the ceramic mounting base 10, especially the end face of the vent shaft 60, which could damage the mounting base 10 and even affect the sealing effect between the two.

[0073] In this invention, the substrate grinding table 100 is equipped with an adapter 70, which is disposed in the through hole 21 of the rotary drive unit 20. Due to the adapter 70, a radial seal is not used between the vent shaft 60 and the mounting base 10. Instead, an end face seal is used between the adapter 70 and the mounting base 10 to avoid direct contact between the metal vent shaft 60 and the ceramic mounting base 10, and to prevent the mounting base 10 from being bumped and affecting the sealing effect.

[0074] Figure 4 This is a schematic diagram of the connection between the ventilation shaft 60 and the adapter 70 provided in an embodiment of the present invention. The ventilation shaft 60 is disposed in the through hole 72 of the adapter 70, and the upper end surface of the ventilation shaft 60 is lower than the upper end surface of the adapter 70 to avoid the metal ventilation hole 60 abutting against the bottom surface of the mounting base 10.

[0075] Furthermore, a supply channel is provided at the center of the ventilation shaft 60 to provide vacuum, clean gas and deionized water for the operation of the ceramic chuck 30. Specifically, the operation of the ceramic chuck 30 includes: adsorbing the substrate to be ground, rinsing the surface of the ceramic chuck for particulate matter, etc., which will not be elaborated here.

[0076] As one embodiment of the present invention, the auxiliary structure 40 is an annular groove, which is concentrically arranged on the top surface of the mounting base 10, such as... Figure 5 As shown, Figure 6 yes Figure 5 The top view of the mounting base 10 shows that the mounting base 10 is a disc-shaped structure with a certain thickness, so that various process channels can be set inside it.

[0077] The vent 10a includes a first vertical vent 11, a horizontal vent 12, and a second vertical vent 13; the first vertical vent 11 is arranged along the thickness direction of the mounting base 10, and its lower end connects to the second vertical vent 71b of the adapter 70. Figure 3 (As shown) Corresponding to this, the horizontal section 12 of the vent is arranged along the radial direction of the mounting base 10 and is connected to the end of the vertical section 11 of the first vent; the vertical section 13 of the second vent is arranged along the thickness direction of the mounting base 10 and is connected to the horizontal section 12 of the vent.

[0078] Figure 5 In the illustrated embodiment, there are two auxiliary structures 40, located in the region between 20% and 80% of the radius of the mounting base 10. When an external vacuum source evacuates the auxiliary structures 40, the ceramic suction cup 30 is vacuum-adhered to the top surface of the mounting base 10. This ensures the reliability of the ceramic suction cup 30's fixation when the operator installs it, preventing the ceramic suction cup 30 from moving in the radial direction and affecting the accuracy of the fixation.

[0079] Understandably, the auxiliary structure 40 can also be any other number. Figure 7 In the illustrated embodiment, there are three auxiliary structures 40, which are annular grooves concentrically arranged on the top surface of the mounting base 10. The width of the auxiliary structure 40 is 5-30mm, so as to form a vacuum adsorption area at the contact point between the ceramic suction cup 30 and the mounting base 10.

[0080] At the same time, the vacuuming at the contact point between the ceramic suction cup 30 and the mounting base 10 is also beneficial for removing water and debris between them, ensuring a tighter fit between the ceramic suction cup 30 and the mounting base 10, which helps to improve the flatness of the upper surface of the substrate grinding table 100.

[0081] Figure 7 In this configuration, the innermost auxiliary structure 40 is an annular groove, located within 30% of the radius of the mounting base 10, to form a vacuum adsorption area within this range. In some embodiments, the innermost auxiliary structure 40 may also be a circular groove, located at the center of the mounting base 10, which works in combination with the outer auxiliary device 40 to ensure that the ceramic suction cup 30 is reliably adsorbed onto the upper part of the mounting base 10, preventing the ceramic suction cup 30 from moving in the radial direction.

[0082] In another embodiment of the present invention, the auxiliary structure 40 can also be a radial groove, such as... Figure 8 As shown. The auxiliary structure 40 is arranged along the radial direction of the mounting base 10. There are multiple auxiliary structures 40, which are evenly distributed along the circumference on the top surface of the mounting base 10.

[0083] As one aspect of this embodiment, the number of auxiliary structures 40 is equal to the number of fixing holes 10b on the mounting base 10, and the auxiliary structures 40 are arranged on the line connecting the diagonal fixing bolts between the ceramic suction cup 30 and the mounting base 10.

[0084] Furthermore, the auxiliary structure 40 includes a main radial groove 41, such as... Figure 8 As shown, the main radial groove 41 is provided along the radial direction of the mounting base 10, and its width is 5-20mm. The main radial groove 41 is provided within the range of 30%-80% of the radial direction of the mounting base 10.

[0085] Figure 9 yes Figure 8 In one variant of the embodiment, the auxiliary structure 40 includes a main radial groove 41, with secondary circumferential grooves 42 arranged on both sides of the main radial groove 41 to appropriately increase the area of ​​the vacuum adsorption region and ensure a tight fit between the ceramic suction cup 30 and the mounting base 10.

[0086] The secondary circumferential groove 42 is set perpendicular to the main radial groove 41. The secondary circumferential groove 42 can be a rectangular groove, an arc groove and / or other shaped closed groove, so as to appropriately expand the vacuum adsorption area at the contact between the ceramic suction cup 30 and the mounting base 10.

[0087] Meanwhile, the present invention also provides a method for manufacturing a substrate grinding stage, the flowchart of which is shown below. Figure 10 As shown, the above-described method for manufacturing a substrate grinding table is used to manufacture... Figure 8 and Figure 9 The substrate grinding table 100 shown is manufactured using a method comprising:

[0088] S1, place the ceramic suction cup 30 above the mounting base 10, and adjust the circumferential position of the ceramic suction cup 30 to align the fixing holes of both.

[0089] Figure 8 The mounting base 10 shows a fixing hole 10b. It can be understood that the ceramic suction cup 30 is also provided with a corresponding fixing hole to fix the ceramic suction cup 30 to the top of the mounting base 10. In step S1, the holes need to be pre-aligned in preparation for the installation and fixing of the fixing bolt 50.

[0090] S2, vacuum the auxiliary structure 40 located between the mounting base 10 and the ceramic suction cup 30 so that the ceramic suction cup 30 fits tightly against the top surface of the mounting base 10.

[0091] In this step, an external vacuum source is turned on to evacuate the auxiliary structure 40, so that the ceramic suction cup 30 and the mounting base 10 are tightly attracted to each other, preventing the ceramic suction cup 30 from shifting during the fixing process and affecting the installation quality of the ceramic suction cup 30; at the same time, the evacuation operation of the auxiliary structure 40 can remove the fluid containing particulate matter between the ceramic suction cup 30 and the mounting base 10, which also helps to ensure that the two are tightly attached.

[0092] S3, maintain the vacuum level of the auxiliary structure 40, and install the fixing bolts 50 in the set sequence to ensure the flatness of the top surface of the ceramic suction cup 30.

[0093] Specifically, when installing the fixing bolt 50, the auxiliary structure 40 between the ceramic chuck 30 and the mounting base 10 is evacuated to maintain the vacuum level at the contact point between the ceramic chuck 30 and the mounting base 10; after the ceramic chuck 30 is fixed to the mounting base 10, a substrate grinding table 100 with good flatness can be obtained.

[0094] Furthermore, during the installation of the fixing bolt 50, the auxiliary structure 40 corresponding to the center line connecting the fixing bolt 50 to be installed and the mounting base 10 is kept at normal pressure, while other auxiliary structures 40 are evacuated. This arrangement allows the installation areas of the ceramic suction cup 30 and the mounting base 10 to have a certain degree of freedom, which is beneficial for stress release between the ceramic suction cup 30 and the mounting base 10 and ensures the tightness of their fit.

[0095] Figure 11 In the process of installing the fixing bolts 50 corresponding to fixing holes 10b and 10b, the auxiliary structure 40 in the dashed rectangular frame is kept at normal pressure, while the other auxiliary structures 40 are evacuated. The fixing bolts 50 are then installed in fixing holes 10b and 10b, respectively, to achieve diagonal fixing of the fixing bolts 50.

[0096] When installing fixing bolts 50 for other numbered fixing holes 10b, follow the steps described above to fix the ceramic suction cup 30 to the top surface of the mounting base 10, achieving a tight fit between the two under appropriate stress relief conditions.

[0097] Furthermore, the present invention also provides a substrate grinding apparatus 1000, such as... Figure 12 As shown, the substrate grinding equipment 1000 includes:

[0098] A turntable 200 is disposed above the base of the substrate grinding equipment 1000; driven by a drive device, the turntable 200 can rotate around its central axis.

[0099] And the substrate grinding worktable 100 mentioned above, which is disposed above the turntable 200 to carry the substrate to be processed.

[0100] The grinding module 300 is disposed above the substrate grinding stage 100 to perform grinding on the substrate.

[0101] Figure 12 In the turntable 200, three substrate grinding worktables 100 are evenly arranged on the upper part. The center of the three substrate grinding worktables 100 and the center of the turntable 200 form a 120° angle with each other. The three substrate grinding worktables 100 rotate in a rough grinding station, a fine grinding station and a loading and unloading station. The two stations opposite to the grinding module 300 are used for rough grinding and fine grinding, respectively. The remaining station is used for loading, unloading and cleaning of substrates.

[0102] Furthermore, the grinding module 300 includes a rough grinding section and a fine grinding section. The two have similar structures, both equipped with a mechanism to drive the grinding wheel to move up and down and a mechanism to drive the grinding wheel to rotate along the central axis. The difference between the two is that the rough grinding section is equipped with a rough grinding wheel, and the fine grinding section is equipped with a fine grinding wheel. Their corresponding rotation speeds and feed speeds are different.

[0103] Because a substrate grinding equipment 1000 is equipped with Figure 2 The substrate grinding stage 100 shown undergoes a vacuum treatment on the auxiliary structure 40 during the installation of the ceramic chuck 30 to ensure that the ceramic chuck 30 is tightly attached to the upper surface of the mounting base 10. This ensures the flatness of the surface of the substrate grinding stage 100, which helps to improve the total thickness deviation of the substrate grinding and ensures the processing quality of the substrate thinning process.

[0104] Furthermore, the working environment for substrate grinding is relatively harsh, containing grinding fluid, grinding chips, and various chemical liquids. During substrate grinding, liquids containing grinding chips can remain inside the substrate grinding table 100, especially between the ceramic chuck 30 and the mounting base 10. Since the ceramic chuck 30 is a key component of the substrate grinding equipment, it requires regular inspection and replacement. Therefore, installing the ceramic chuck using the manufacturing method described above can effectively prevent residual particles from affecting the flatness of the substrate grinding table, ensuring the quality of substrate grinding.

[0105] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0106] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A substrate grinding worktable, characterized in that, include: The mounting base is made of ceramic. A rotary drive unit is located below the mounting base; A ceramic suction cup is positioned above the mounting base to hold the substrate to be ground. The mounting base is provided with an auxiliary structure at the contact point with the ceramic suction cup, which can create a vacuum in at least a part of the contact area, so that the ceramic suction cup fits tightly against the top of the mounting base. The substrate grinding worktable is set by installing fixing bolts in a predetermined sequence when the ceramic chuck is vacuum-adhered to the mounting base to ensure the flatness of the top surface of the ceramic chuck. The auxiliary structure is a radial groove, which is evenly distributed along the circumference on the top surface of the mounting base and is located on the line connecting the diagonal fixing bolts between the ceramic suction cup and the mounting base. When installing each fixing bolt, disconnect the radial groove corresponding to the fixing bolt to be installed, located on the line connecting it to the center of the mounting base, from the vacuum source and keep it at normal pressure, while keeping the other radial grooves connected to the vacuum source to maintain the vacuum adsorption state, and then tighten the fixing bolt. It also includes a ventilation shaft, which is a metal part and is connected to the bottom of the mounting base via an adapter to provide vacuum or air supply at the contact point between the mounting base and the ceramic suction cup; the adapter is sleeved on the end of the ventilation shaft, and the end face of the adapter abuts against the bottom surface of the mounting base, so that the ventilation shaft and the interior of the adapter form an air supply channel; the interior of the mounting base is provided with a ventilation channel, and the air supply channel communicates with the ventilation channel, and the ventilation channel is connected to the contact point; the upper end face of the ventilation shaft is lower than the upper end face of the adapter.

2. The substrate grinding table as described in claim 1, characterized in that, The auxiliary structure is connected to an external vacuum source.

3. The substrate grinding table as described in claim 1, characterized in that, The ventilation shaft is coaxially disposed inside the rotary drive unit.

4. The substrate grinding table as described in claim 1, characterized in that, The auxiliary structure includes a main radial groove, and secondary circumferential grooves are arranged on both sides of the main radial groove.

5. A substrate grinding equipment, characterized in that, include: Turntable; The substrate grinding stage according to any one of claims 1 to 4 is disposed above the turntable to carry the substrate to be processed; The grinding module is located above the substrate grinding stage to perform grinding on the substrate.

6. A method for manufacturing a substrate grinding worktable, used to manufacture the substrate grinding worktable according to any one of claims 1 to 4, characterized in that, include: S1. Place the ceramic suction cup above the mounting base and adjust the circumferential position of the ceramic suction cup to align the mounting holes of both. S2, Vacuum the auxiliary structure located between the mounting base and the ceramic suction cup, so that the ceramic suction cup fits tightly against the top surface of the mounting base; S3, maintain the vacuum level of the auxiliary structure, and install the fixing bolts in the set sequence to ensure the flatness of the top surface of the ceramic suction cup.

7. The method for manufacturing a substrate grinding table as described in claim 6, characterized in that, The fixing holes corresponding to the fixing bolts to be installed are connected to the center of the mounting base. The auxiliary structure through which the connection line passes is kept at normal pressure, while the other auxiliary structures are evacuated. The fixing bolts are installed in sequence diagonally.

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