Mold stripping device for headphone housings

Abstract

The application discloses a mold stripping device for a headphone shell, and relates to the technical field of stripping devices.The device comprises an upper mold plate and a lower mold plate which are arranged side by side from top to bottom;an upper mold sliding block is horizontally arranged in the upper mold plate;an oblique lower mold ejector which is arranged in swing mode is vertically arranged on the lower mold plate;an upper mold sliding block is vertically arranged on the upper mold plate;an activity opening and closing device sleeve is vertically arranged in the upper mold plate;and a resin opening and closing device is fixedly connected to the lower mold plate, which pushes the activity opening and closing device sleeve to move upwards first, and then locks the activity opening and closing device sleeve.The device solves the problem that the traditional device causes the oblique lower mold ejector and the upper mold sliding block to collide when the mold is closed;and the problem that the thickness of the top surface of the headphone shell is non-uniform, and different shape stress marks appear on the surface of the headphone shell.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of demolding device, in particular to a mold demolding device for headset shell. BACKGROUND

[0002] Headset refers to the headset worn on the head, not inserted into the ear canal, which is different from the earplug. It is composed of two parts, signal transmitter and headset with signal receiving and amplifying device (usually moving coil type). The transmitter is connected to the signal source, and a pre-stage or earphone amplifier can be connected in front of the transmitter to improve the sound quality and adjust the tone.

[0003] The shell of the headset not only affects the overall appearance of the headset, but also has an important influence on the comfort of wearing, so the processing of the headset shell is important to the quality of the headset shell. The headset shell is generally made of plastic material, and the processing technology generally used is mold forming. However, the existing mold for the complex-shaped headset shell is a whole mold, which is difficult to take out the headset shell, and requires skilled workers to open the mold according to experience, which is easy to cause damage to the headset shell and affect the yield of the finished product.

[0004] The prior art discloses a patent with publication number CN212860181U, named headset shell forming device. The scheme includes a plurality of lower mold parts uniformly distributed along the circumference and tightly matched, the side walls between adjacent lower mold parts are tightly sealed, the lower part of the lower mold shell is provided with a mold platform, the mold core is fixed at the center top of the mold platform, a plurality of limiting sliding grooves are provided on the mold platform along the circumferential direction of the center, the bottom of each lower mold part is slidably connected in the limiting sliding groove at the corresponding position, and a push assembly is fixedly installed on the mold platform outside each limiting sliding groove. The device sets the lower mold shell as a split structure, which can ensure the rapid and convenient opening of the mold. By controlling the extension and retraction of each push cylinder, each lower mold part and the formed headset shell can be loosened and separated, reducing the difficulty of mold opening.

[0005] The existing devices including the above patent gradually expose the deficiencies with use, mainly in the following aspects:

[0006] First, the headset shell has a shaft hole structure, and the inner glue position is too thick, which may cause shrinkage, and needs to be treated to reduce the glue and ensure that the headset shell appearance has no shrinkage phenomenon. However, according to the conventional structure design, it will not be demolded normally, and the upper mold sliding block and the lower mold inclined top mechanism need to be added. However, the existing structure causes the lower mold inclined top and the upper mold sliding block to collide when the mold is closed.

[0007] Secondly, because the thickness of the top surface of the earphone shell is non-uniform, when the plastic flows to the top surface, the thin area cools faster, the thick area cools slower, and the temperature of the top surface of the earphone shell on the mold is lower, thus causing the earphone shell surface to have different shape stress marks.

[0008] Therefore, the prior art has the inconvenience and defects in actual use, and it is necessary to improve. SUMMARY

[0009] In view of the defects in the prior art, the device in the prior art causes the lower mold inclined top and the upper mold sliding block to collide when the mold is closed, and because the thickness of the top surface of the earphone shell is non-uniform, the earphone shell surface is prone to have different shape stress marks.

[0010] To solve the above problems, the present application provides the following technical scheme:

[0011] The mold stripping device for the headset shell comprises an upper mold plate and a lower mold plate arranged side by side from top to bottom.

[0012] An upper mold sliding block is horizontally slidably arranged in the upper mold plate, and a lower mold inclined top is swingably arranged on the lower mold plate and vertically lifted.

[0013] A shovel base for controlling the horizontal movement of the upper mold sliding block is arranged above the upper mold plate and vertically lifted.

[0014] An active switch sleeve is vertically slidably arranged in the upper mold plate, and a resin switch is fixedly connected to the lower mold plate and sequentially pushes the active switch sleeve upward and then locks the active switch sleeve.

[0015] As an optimized scheme, an upper mold core is arranged on the upper mold plate, and a water cooling cavity is arranged on the upper mold core and stacked in a spiral shape along the surface of the earphone shell.

[0016] As an optimized scheme, the water cooling cavity has two, one of which has the same inlet and outlet directions, and the other has opposite inlet and outlet directions.

[0017] As an optimized scheme, an upper mold shovel base plate for fixing the shovel base is vertically slidably arranged above the upper mold plate, and a spring is arranged between the upper mold shovel base plate and the upper mold plate.

[0018] As an optimized scheme, a driving inclined hole is arranged in the upper mold core, and when the lower mold inclined top moves upward, the lower mold inclined top swings outward and separates from the earphone shell through the driving inclined hole.

[0019] As an optimized scheme, the resin switch and the active switch sleeve are in interference fit.

[0020] As an optimized scheme, the end of the upper mold slider is fixedly connected with a driving sleeve, the shovel base is fixedly connected with a wedge-shaped plate, and the driving sleeve is provided with a driving hole matched with the wedge-shaped plate.

[0021] As an optimized scheme, the lower end of the lower mold inclined ejector is hinged to an ejector plate, and the ejector plate is also provided with a plurality of ejector pins arranged side by side.

[0022] As an optimized scheme, the side wall of the upper mold plate is fixedly connected with a mold opening and closing controller, and the side wall of the lower mold plate is fixedly connected with a pull rod matched with the mold opening and closing controller.

[0023] As an optimized scheme, the upper mold shovel base plate is sequentially provided with a stripping plate and an upper fixed plate upwards, and the upper fixed plate is fixedly connected with an insertion rod matched with the mold opening and closing controller.

[0024] As an optimized scheme, the lower end of the lower mold inclined ejector is hinged to an ejector plate, and the ejector plate is also provided with a plurality of ejector pins arranged side by side.

[0025] As an optimized scheme, the ejector plate is divided into an upper ejector plate and a lower ejector plate from top to bottom.

[0026] Compared with the prior art, the present application has the following beneficial effects:

[0027] In order to avoid the collision between the lower mold inclined ejector and the upper mold slider, an active opening and closing sleeve is designed, which can move upwards in the upper mold plate. When the upper mold plate and the lower mold plate are in contact, the resin opening and closing sleeve on the lower mold plate will first contact the active opening and closing sleeve, and the resin opening and closing sleeve will move upwards in the upper mold plate against the active opening and closing sleeve.

[0028] The resin opening and closing sleeve will not be inserted into the active opening and closing sleeve, and at this time, the upper mold plate and the lower mold plate can be smoothly closed without resistance. The outer diameter of the resin opening and closing sleeve is larger than the inner diameter of the active opening and closing sleeve, and the two are locked together through interference fit and will not be separated.

[0029] Secondly, the upper mold plate and the upper mold shovel base plate are closed, and the shovel base fixed on the upper mold shovel base plate pulls the upper mold slider to move horizontally to reset, so that the upper mold slider and the lower mold inclined ejector do not collide.

[0030] The lower mold inclined ejector and the ejector pin are fixed on the ejector plate, and the lower mold inclined ejector slides upward through the driving inclined hole of the lower mold core to be ejected. At this time, the lower mold inclined ejector is separated from the inner buckle of the earphone shell, the ejector pin ejects the earphone shell and separates from the lower mold core, and the ejection process of the earphone shell is completed.

[0031] The water cooling cavity is two and is arranged in spiral stack, realizes that the heat exchange area and the heat exchange uniformity of lower mould core and earphone shell surface are increased, and then the temperature of earphone shell top surface is guaranteed, thereby eliminating the adverse phenomenon of earphone shell surface stress mark. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings required to be used in the specific embodiments or the prior art description will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion.

[0033] Figure 1 It is a three-dimensional structure schematic diagram of the mould open-close state of the present application;

[0034] Figure 2 It is a three-dimensional structure schematic diagram of the mould closed state of the present application;

[0035] Figure 3 It is a plane structure schematic diagram of the mould closed state of the present application;

[0036] Figure 4 It is a plane structure schematic diagram of the mould open-close state of the present application;

[0037] Figure 5 It is a structure schematic diagram of the driving inclined hole of the present application;

[0038] Figure 6 It is a structure schematic diagram of the upper mould inclined ejector of the present application;

[0039] Figure 7 It is a structure schematic diagram of the water cooling cavity of the present application;

[0040] Figure 8 It is a structure schematic diagram of the mould injection product of the present application.

[0041] In the drawings: 1-upper fixed plate; 2-removal plate; 3-upper mould shovel base plate; 4-upper mould plate; 5-open-close mould controller; 6-movable open-close device cover; 7-inserting rod; 8-pulling rod; 9-resin open-close device; 10-lower mould plate; 11-needle plate; 12-lower fixed plate; 13-upper mould sliding block; 14-lower mould inclined ejector; 15-shovel base; 16-upper mould core; 17-spring; 18-upper mould shovel base plate limiting screw; 19-removal plate limiting screw; 20-upper mould pulling rod; 21-driving inclined hole; 22-earphone shell; 23-water cooling cavity. DETAILED DESCRIPTION

[0042] The embodiments of the technical solutions of the present application will be described in detail below with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0043] As Figures 1 to 8 The headset shell mold stripping device comprises an upper mold plate 4 and a lower mold plate 10 arranged side by side from top to bottom.

[0044] An upper mold sliding block 13 is horizontally slidably arranged in the upper mold plate 4, and an obliquely arranged lower mold inclined ejector pin 14 is vertically lifted on the lower mold plate 10.

[0045] A shovel base for controlling the horizontal movement of the upper mold sliding block 13 is vertically lifted above the upper mold plate 4.

[0046] An active shutter sleeve 6 is vertically slidably arranged in the upper mold plate 4, and a resin shutter 9 for first pushing the active shutter sleeve 6 to move upward and then locking the active shutter sleeve 6 is fixedly connected to the lower mold plate 10.

[0047] An upper mold core 16 is arranged on the upper mold plate 4, and the upper mold core 16 is provided with water cooling channels 23 arranged in a spiral stack along the surface of the headset shell.

[0048] The water cooling channels 23 are provided with two, one of which has the same inlet and outlet direction, and the other has opposite inlet and outlet directions.

[0049] A upper mold shovel base plate 3 with a fixed shovel base is vertically slidably arranged above the upper mold plate 4, and a spring 17 is arranged between the upper mold shovel base plate 3 and the upper mold plate 4.

[0050] A driving inclined hole 21 is arranged in the upper mold core 16, and when the lower mold inclined ejector pin 14 moves upward, it swings outward and separates from the headset shell.

[0051] The resin shutter 9 and the active shutter sleeve 6 are in interference fit.

[0052] A driving sleeve is fixedly connected to the end of the upper mold sliding block 13, a wedge-shaped plate is obliquely fixedly connected to the shovel base, and a driving hole matched with the wedge-shaped plate is arranged on the driving sleeve.

[0053] The lower end of the lower mold inclined ejector pin 14 is hingedly connected to the ejector pin plate 11, and a plurality of ejector pins are also arranged side by side on the ejector pin plate 11.

[0054] A mold opening and closing controller 5 is fixedly connected to the side wall of the upper mold plate 4, and a pull rod 8 that cooperates with it is fixedly connected to the side wall of the lower mold plate 10. A stripping plate 2 and an upper fixing plate 1 are arranged sequentially above the upper mold shovel base plate 3. An insert rod 7 that cooperates with the mold opening and closing controller 5 is fixedly connected to the upper fixing plate 1. This structure and working principle are common in daily life and are not innovative in this solution, so they will not be described in detail here.

[0055] A lower fixing plate 12 is also provided below the ejector plate 11.

[0056] The ejector plate 11 is divided into an upper ejector plate 11 and a lower ejector plate 11 from top to bottom.

[0057] The working principle of this device is as follows:

[0058] To avoid the collision between the lower mold slant ejector 14 and the upper mold slider 13, a movable opening and closing sleeve 6 is designed. The movable opening and closing sleeve 6 can move upward within the upper mold plate 4. In this way, when the upper mold plate 4 and the lower mold plate 10 come into contact, the resin opening and closing device 9 on the lower mold plate 10 will first come into contact with the movable opening and closing sleeve 6, and the resin opening and closing device 9 will push against the movable opening and closing sleeve 6 and move upward within the upper mold plate 4.

[0059] The resin opener 9 will not be inserted into the movable opener sleeve 6. At this time, the upper template 4 and the lower template 10 can close smoothly without resistance. The outer diameter of the resin opener 9 is larger than the inner diameter of the movable opener sleeve 6. The two are locked together by interference fit and will not separate.

[0060] Secondly, the upper template 4 and the upper mold shovel base plate 3 are closed, and the shovel base fixed on the upper mold shovel base plate 3 pulls the upper mold slider 13 to move horizontally and reset, so that the upper mold slider 13 and the lower mold inclined top 14 will not collide.

[0061] The lower mold angled ejector 14 and the ejector pin are both fixed on the ejector plate 11. The lower mold angled ejector 14 slides upward through the drive angled hole 21 of the lower mold core. At this time, the lower mold angled ejector 14 is disengaged from the inner buckle of the earphone shell 22. The ejector pin pushes the earphone shell 22 out and separates it from the lower mold core, completing the ejection process of the earphone shell 22.

[0062] There are two water-cooling channels 23, which are arranged in a spiral stack, thereby increasing the heat exchange area and heat exchange uniformity between the lower mold core and the surface of the earphone shell 22, thus ensuring the temperature at the top surface of the earphone shell 22 and eliminating the undesirable phenomenon of stress marks on the surface of the earphone shell 22.

[0063] The mold opening sequence is as follows:

[0064] First, the upper template 4 and the upper mold base plate 3 are separated. Four 40mm diameter springs 17, each compressed by 10mm, are hidden on the back of the upper template 4. The strong elastic force of the springs 17 acts on the upper mold base plate 3, forcing it to move forward 10mm. This initiates the separation between the upper template 4 and the upper mold base plate 3. When the upper template 4 moves backward 46mm, the upper mold base plate limiting screw 18 fixed to the upper mold base plate 3 begins to function. After the step of the upper mold base plate limiting screw 18 contacts the upper template 4, when the distance between the upper template 4 and the upper mold base plate 3 reaches 46mm, the upper mold base plate limiting screw 18 will pull the upper mold base plate 3 backward 54mm. As the upper mold base plate 3 moves backward with the upper template 4... When the upper die moves 54mm backward (reverse movement is downward in the attached diagram, and forward movement is upward in the attached diagram), the upper die pull rod 20 hidden in the upper die part begins to function. The upper die pull rod 20 has stepped screws at both ends. One step is fixed to the stripper plate 2. When the movement reaches 115mm, the other step of the upper die pull rod 20 will be hooked by the upper die shovel base plate 3 and stop moving. The stripper plate 2 is pulled and stops moving. At this time, the separation between the upper die shovel base plate 3 and the stripper plate 2 is completed. When the upper fixed plate 1 continues to move forward 10mm, the step of the stripper plate limiting screw 19 fixed on the back of the stripper plate 2 will hook the upper fixed plate 1 and stop moving. At this time, the separation between the stripper plate 2 and the upper fixed plate 1 is completed. The separation of the upper die part is completed. At this time, the upper mold plate 4 and the lower mold plate 10 are still closed together.

[0065] The method to ensure that the upper template 4 and the lower template 10 are closed together is achieved by locking the opening and closing device. The insert rod 7, the pull rod 8 and the mold opening and closing controller 5 are tightly locked together when closed by the internal spring damping block, and will not separate.

[0066] The lower resin switch 9 is inserted into the movable switch sleeve 6. The outer diameter of the lower resin switch 9 is slightly larger than the inner diameter of the movable switch sleeve 6. They are locked together by an interference fit and will not separate.

[0067] The mold opening and closing controller 5 and the movable opening and closing sleeve 6 are fixed on the upper mold plate 4, and the pull rod 8 and the resin opening and closing device 9 are fixed on the lower mold plate 10. This ensures that the upper mold plate 4 and the lower mold plate 10 can be tightly closed together and will not separate first, and can move backward together.

[0068] Then the rear mold continues to move backward to open the mold. The lower mold plate 10 and the rear mold plate are locked together as a whole by screws. After the pulling force of the injection molding machine overcomes the resistance of the resin opener / closer 9 and the movable opener / closer sleeve 6, it forcibly separates the lower mold plate 10 from the upper mold plate 4. At this time, the front mold and the rear mold are completely separated.

[0069] The rear mold continues to move backward, and stops moving once the set opening and closing distance is reached.

[0070] Working process of upper mold slider 13:

[0071] The upper mold slider 13 is hidden and fixed inside the upper template 4 and can move horizontally. The shovel base is fixed inside the upper mold shovel base plate 3. When the upper template 4 and the upper mold shovel base plate 3 open and close, the upper mold slider 13 is pulled horizontally out of the mold by the inclined surface of the shovel base 15. When the front end of the upper mold slider 13 is pulled out of the outer recess of the earphone shell 22 by a certain distance, the demolding action of the upper mold slider 13 is completed.

[0072] Mold closing sequence:

[0073] When closing the mold, the upper mold plate 4 and the lower mold plate 10 must be closed together first before the upper mold slider 13 can be reset under the drive of the shovel base 15.

[0074] When the mold is closed, the upper mold plate 4 and the lower mold plate 10 will make contact first. However, due to the particularly high resistance when the traditional fixed opening and closing device closes, the upper mold plate 4 and the lower mold plate 10 cannot close together smoothly first. Instead, the upper mold plate 4 and the upper mold base plate 3 will close first.

[0075] At this point, the upper mold slider 13 was reset first under the drive of the shovel base 15. This caused the front end of the upper mold slider 13 to interfere with the upper surface of the lower mold inclined ejector 14, resulting in a collision between the front end of the upper mold slider 13 and the lower mold inclined ejector 14, which damaged the mold.

[0076] To avoid this undesirable phenomenon, the traditional fixed opening and closing device sleeve was abandoned and replaced with a movable opening and closing device sleeve 6. The movable opening and closing device sleeve 6 can move forward 28mm within the upper template 4, and the resin opening and closing device 9 is 27mm high. When the upper template 4 and the lower template 10 come into contact, the resin opening and closing device 9 on the lower template 10 will contact the movable opening and closing device sleeve 6 first. The resin opening and closing device 9 will push against the movable opening and closing device sleeve 6 and move forward 27mm within the upper template 4. The resin opening and closing device 9 will not be inserted into the movable opening and closing device sleeve 6 and will not close together first. At this time, there is no resistance between the resin opening and closing devices 9, so the upper template 4 and the lower template 10 can close smoothly first without resistance.

[0077] Next, the upper template 4 and the upper mold shovel base plate 3 are closed. The shovel base 15 fixed on the upper mold shovel base plate 3 pulls the upper mold slider 13 to move horizontally and reset to its position. In this way, the upper mold slider 13 and the lower mold inclined top 14 will not collide.

[0078] Then the upper mold base plate 3 and the stripper plate 2 close together, and finally the stripper plate 2 and the upper fixing plate 1 close together, thus completing the mold closing process.

[0079] Working process of lower die angled ejector 14:

[0080] After the rear mold section stops moving, the ejector pin plate 11 is pushed forward 35mm by the ejector pin of the injection molding machine. The lower mold angled ejector 14 and the ejector pin are both fixed on the ejector pin plate 11.

[0081] The lower mold angled ejector 14 slides upward through the drive angled hole 21 of the lower mold core and is ejected. At this time, the lower mold angled ejector 14 is disengaged from the inner buckle of the earphone shell 22. The ejector pin pushes the earphone shell 22 out and separates it from the lower mold core, completing the ejection process of the earphone shell 22.

[0082] Then the ejector pin of the injection molding machine retracts, and the ejector plate 11 retracts under the action of the spring, driving the lower mold inclined ejector 14 and the ejector pin to reset, thus completing the entire process of mold opening and closing.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. A demolding device for a headphone shell, characterized in that: Including the upper template (4) and the lower template (10) set side by side from top to bottom; The upper template (4) is provided with a horizontal sliding upper mold slider (13), and the lower template (10) is provided with a swinging lower mold inclined top (14) that moves vertically up and down along its upper edge. Above the upper template (4) is a shovel base (15) that moves vertically and controls the horizontal movement of the upper template slider (13). The upper template (4) is provided with a movable opening and closing sleeve (6) that slides vertically along the inner edge. The lower template (10) is fixed with a resin opening and closing device (9) that first pushes the movable opening and closing sleeve (6) upward and then locks with the movable opening and closing sleeve (6). The upper template (4) is provided with an upper mold core (16), and the upper mold core (16) is provided with a water-cooling cavity (23) arranged in a spiral stack along the surface of the earphone shell (22). The upper mold core (16) has a drive oblique hole (21), and the lower mold oblique top (14) moves upward through the drive oblique hole (21) and swings outward and separates from the earphone shell (22). The lower end of the lower mold inclined top (14) is hinged to the ejector plate (11), and a number of ejector pins are arranged in parallel on the ejector plate (11).

2. The demolding device for the headphone shell according to claim 1, characterized in that: The water-cooled cavity (23) is provided in two ways. One water-cooled cavity (23) has the same inlet and outlet directions, while the other water-cooled cavity (23) has the opposite inlet and outlet directions.

3. The demolding device for the headphone shell according to claim 1, characterized in that: The upper mold shovel base plate (3) for fixing the shovel base (15) is slidably provided above the upper mold plate (4) along the vertical direction, and a spring (17) is provided between the upper mold shovel base plate (3) and the upper mold plate (4).

4. The demolding device for the headphone shell according to claim 1, characterized in that: The resin opener (9) and the movable opener sleeve (6) are interference-fitted.

5. The demolding device for the headphone shell according to claim 1, characterized in that: The upper mold slider (13) is fixedly connected to a drive sleeve at its end, and a wedge plate is fixedly connected to the shovel base (15) at an incline. The drive sleeve is provided with a drive hole that matches the wedge plate.

6. The demolding device for the headphone shell according to claim 3, characterized in that: A mold opening and closing controller (5) is fixedly connected to the side wall of the upper template (4), and a pull rod (8) that cooperates with it is fixedly connected to the side wall of the lower template (10).

7. The demolding device for the headphone shell according to claim 6, characterized in that: Above the upper mold shovel base plate (3), there is a stripping plate (2) and an upper fixing plate (1) arranged in sequence. The upper fixing plate (1) is fixed with a plug rod (7) that cooperates with the mold opening and closing controller (5).

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