Manufacturing method of LED lamp bead and LED lamp bead

Abstract

This invention relates to a method for manufacturing LED chips and the LED chips themselves, comprising the following steps: etching the desired pin shape on a rigid substrate; forming metal pin electrodes on the formed pin shape; performing a secondary deposition on the rigid substrate to form a metal deposition layer; placing a driver IC on the rigid substrate, such that the bottom pins of the driver IC are electrically connected to the corresponding metal deposition layer on the rigid substrate; molding an insulating colloid onto the surface of the rigid substrate, such that the insulating colloid covers the surface of the driver IC; transferring an RGB chip onto the insulating colloid; covering the surfaces of the insulating colloid and the RGB chip with a transparent colloid; punching holes to expose the electrode pins of the RGB chip and the top pins of the driver IC; and electrically connecting the top pins of the driver IC to the corresponding electrode pins of the RGB chip through conductive metal disposed in the punched area. This invention can reduce or shorten wiring and reduce vias on the rigid substrate, thereby reducing manufacturing costs and minimizing damage to the rigid substrate.

Description

Technical Field

[0001] This invention relates to the field of LED lamp bead technology, and in particular to a method for manufacturing LED lamp beads and LED lamp beads. Background Technology

[0002] Light-emitting diodes (LEDs) are widely used in displays, automotive lighting, general lighting, and other related fields due to their energy-saving, environmentally friendly, safe, durable, high photoelectric conversion efficiency, and strong controllability. Currently, LED chip structures are mainly divided into three types: upright, vertical, and flip-chip. Compared with the upright structure, the flip-chip structure has better heat dissipation capabilities, higher reliability, and longer lifespan, making it more popular.

[0003] In related technologies, the driver chip and RGB chip of conventional LED beads are currently arranged on two sides of the light board, resulting in more wiring on the light board and requiring more through holes. Therefore, the manufacturing cost of the light board is relatively high, and the light board with components on both sides is more prone to damage. In addition, the conventional manufacturing method of LED beads is difficult to produce small-sized LED beads.

[0004] Therefore, it is necessary to design a new method for manufacturing LED beads and LED beads in order to overcome the above problems. Summary of the Invention

[0005] This invention provides a method for manufacturing LED beads and LED beads to solve the problems in related technologies, such as the large number of wirings on the lamp board, the need for many through holes, the high manufacturing cost of the lamp board, the easier damage of lamp boards with components on both sides, and the difficulty in manufacturing small-sized LED beads.

[0006] In a first aspect, a method for manufacturing LED beads is provided, comprising the following steps: covering an optical mask on a rigid substrate and etching a desired pin shape on the optical mask; depositing metal on the formed pin shape and dissolving the optical mask outside the desired pin shape to form a metal pin electrode; performing a secondary deposition on the rigid substrate to form a metal deposition layer suitable for placing the bottom pin of a driver IC on the surface of the metal pin electrode.

[0007] A driver IC is placed on the rigid substrate, and the bottom pins of the driver IC are electrically connected to the corresponding metal deposition layer on the rigid substrate. An insulating colloid is molded onto the surface of the rigid substrate, covering the surface of the driver IC. An RGB chip is transferred onto the insulating colloid, and a transparent colloid is applied to the surfaces of the insulating colloid and the RGB chip. Holes are punched to expose the electrode pins of the RGB chip and the top pins of the driver IC. The top pins of the driver IC are electrically connected to the corresponding electrode pins of the RGB chip via conductive metal disposed in the punched area.

[0008] In some embodiments, molding an insulating colloid onto the surface of the rigid base plate to cover the surface of the driver IC includes: molding a dark black insulating colloid onto the top of the rigid base plate to surround the driver IC, wherein the height of the insulating colloid is higher than the upper surface of the driver IC.

[0009] In some embodiments, the step of transferring the RGB chip onto the insulating colloid, covering the surfaces of the insulating colloid and the RGB chip with a transparent colloid, drilling holes to expose the electrode pins of the RGB chip and the top pins of the driver IC, and electrically connecting the top pins of the driver IC to the corresponding electrode pins of the RGB chip through conductive metal disposed in the drilled area, includes:

[0010] The first number of RGB chips are transferred onto the insulating colloid, and a transparent colloid is then applied to the surfaces of the insulating colloid and the RGB chips.

[0011] Holes are drilled at corresponding positions in the transparent colloid and the insulating colloid to expose the electrode pins of the RGB chip and the top pins of the driver IC;

[0012] Conductive metal is deposited in the punched area to electrically connect the top pin of the driver IC to the corresponding electrode pin of the RGB chip.

[0013] In some embodiments, drilling holes at corresponding locations in the transparent colloid and the insulating colloid to expose the electrode pins of the RGB chip and the top pins of the driver IC includes:

[0014] A connection hole is made by laser at the positive electrode position of the R chip corresponding to the transparent colloid, and a connection hole is made at the R+ pin position on the top of the driver IC corresponding to the transparent colloid and the insulating colloid, so that the connection hole at the positive electrode position of the R chip and the connection hole at the R+ pin position on the top of the driver IC are interconnected.

[0015] A connection hole is made by laser at the positive electrode position of the G chip corresponding to the transparent colloid, and a connection hole is made at the G+ pin position on the top of the driver IC corresponding to the transparent colloid and the insulating colloid, so that the connection hole at the positive electrode position of the G chip and the connection hole at the G+ pin position on the top of the driver IC are interconnected.

[0016] A connection hole is made by laser at the positive electrode position of the B chip corresponding to the transparent colloid, and a connection hole is made at the B+ pin position on the top of the driver IC corresponding to the transparent colloid and the insulating colloid, so that the connection hole at the positive electrode position of the B chip and the connection hole at the B+ pin position on the top of the driver IC are interconnected.

[0017] A laser is used to create connection holes at the negative electrode positions of the R, G, and B chips corresponding to the transparent colloid, and connection holes are also created at the GND pin positions on the top of the driver IC on the transparent colloid and the insulating colloid, so that the connection holes at the negative electrode positions of the R, G, and B chips are all connected to the connection holes at the GND pin positions on the top of the driver IC.

[0018] In some embodiments, the step of transferring the RGB chip onto the insulating colloid, covering the surfaces of the insulating colloid and the RGB chip with a transparent colloid, drilling holes to expose the electrode pins of the RGB chip and the top pins of the driver IC, and electrically connecting the top pins of the driver IC to the corresponding electrode pins of the RGB chip through conductive metal disposed in the drilled area, includes:

[0019] The first chip in the RGB chip is transferred onto the insulating colloid and covered with the first transparent colloid;

[0020] Holes are drilled at corresponding positions in the first transparent colloid and the insulating colloid to expose the electrode pins of the first chip and the corresponding top pins of the driver IC, and conductive metal is deposited in the drilled area to electrically connect the electrode pins of the first chip and the corresponding top pins of the driver IC.

[0021] The second chip in the RGB chip is transferred onto the first transparent colloid, and then covered with the second transparent colloid;

[0022] Holes are drilled at corresponding positions in the second transparent colloid, the first transparent colloid, and the insulating colloid to expose the electrode pins of the second chip and the corresponding top pins of the driver IC. Conductive metal is deposited in the drilled area to electrically connect the electrode pins of the second chip with the corresponding top pins of the driver IC.

[0023] The third chip in the RGB chip is transferred onto the second transparent colloid, and then covered with the third transparent colloid.

[0024] Holes are drilled at corresponding positions in the third transparent colloid, the second transparent colloid, the first transparent colloid, and the insulating colloid to expose the electrode pins of the third chip and the corresponding top pins of the driver IC. Conductive metal is deposited in the drilled areas to electrically connect the electrode pins of the third chip with the corresponding top pins of the driver IC.

[0025] Secondly, an LED light bead is provided, comprising:

[0026] A rigid base plate, wherein a driver IC is encapsulated on the rigid base plate by an insulating colloid, and the bottom pins of the driver IC are electrically connected to the corresponding metal pin electrodes on the rigid base plate, and the insulating colloid covers the surface of the driver IC;

[0027] An RGB chip is encapsulated on the surface of an insulating colloid by a transparent colloid, and the transparent colloid covers the surface of the RGB chip. The transparent colloid and the insulating colloid have connection holes to expose the electrode pins of the RGB chip and the top pins of the driver IC. A conductive metal is disposed in the connection hole, and the conductive metal electrically connects the top pins of the driver IC to the corresponding electrode pins of the RGB chip.

[0028] In some embodiments, the RGB chips are located on the same plane of the insulating colloid surface, and the R, G, and B chips in the RGB chips are staggered.

[0029] In some embodiments, the R chip, G chip, and B chip in the RGB chip are stacked on top of the insulating colloid, and the R chip, G chip, and B chip are of different sizes to expose the light-emitting layer of the R chip, G chip, and B chip.

[0030] In some embodiments, a metal deposition layer is disposed on the surface of the metal pin electrode, the metal deposition layer is electrically connected to the metal pin electrode, and the metal deposition layer is electrically connected to the bottom pin of the driver IC.

[0031] The beneficial effects of the technical solution provided by this invention include:

[0032] This invention provides a method for manufacturing LED beads and the LED beads themselves. Since both the driver IC and the RGB chip are located on one side of a rigid substrate, compared to arranging the driver IC and RGB chip on opposite sides of the lamp board, placing them on the same side reduces or shortens the wiring. Furthermore, the wiring does not need to pass through the rigid substrate; the driver IC and RGB chip on the same side of the rigid substrate can be directly electrically connected. This reduces the number of through-holes on the rigid substrate, lowers manufacturing costs, and reduces the risk of damaging the rigid substrate. Moreover, using a rigid substrate provides higher strength, and forming metal lead electrodes and a metal deposition layer on the rigid substrate to achieve electrical connection with the driver IC enables the manufacture of small-sized LED beads. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A flowchart illustrating a method for manufacturing LED beads according to an embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram of the structure of an LED chip provided in an embodiment of the present invention;

[0036] Figure 3 A schematic diagram of the bottom structure of the driver IC provided in an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the structure of the rigid base plate provided in an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of the structure of the driver IC mounted on the rigid base plate according to an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the structure of the insulating colloid molded on the surface of the driver IC provided in an embodiment of the present invention;

[0040] Figure 7 This is a schematic diagram of a structure for placing an RGB chip on the surface of an insulating colloid, as provided in an embodiment of the present invention.

[0041] Figure 8 This is a schematic diagram of the structure of an RGB chip surface covered with a transparent colloid provided in an embodiment of the present invention;

[0042] Figure 9 This is a schematic diagram of the laser drilling structure provided in an embodiment of the present invention;

[0043] Figure 10 A schematic diagram of a structure in which conductive metal is disposed in the perforated area according to an embodiment of the present invention;

[0044] Figure 11 This is a schematic diagram of the structure of an LED lamp bead provided in an embodiment of the present invention;

[0045] Figure 12 This is a schematic diagram of a structure in which a B-chip is placed on the surface of an insulating colloid, as provided in an embodiment of the present invention.

[0046] Figure 13 This is a schematic diagram of the structure of chip B with a first transparent colloid covering the surface and holes punched, provided in an embodiment of the present invention.

[0047] Figure 14 This is a side view of the hole punched at the corresponding position on the B chip according to an embodiment of the present invention;

[0048] Figure 15 for Figure 14 A schematic diagram of the structure in which conductive metal is deposited in the perforated region;

[0049] Figure 16 for Figure 15 A side view diagram;

[0050] Figure 17 This is a schematic diagram of a structure in which a G chip is placed on the surface of a first transparent colloid, as provided in an embodiment of the present invention.

[0051] Figure 18 A schematic diagram of the structure of a G chip surface covered with a second transparent colloid and perforated as provided in an embodiment of the present invention;

[0052] Figure 19 for Figure 18 A schematic diagram of the structure in which conductive metal is deposited in the perforated region;

[0053] Figure 20 for Figure 19 A side view diagram;

[0054] Figure 21 A schematic diagram of a structure provided in an embodiment of the present invention, showing an R chip disposed on the surface of a second transparent colloid and electrically connected to it by a conductive metal;

[0055] Figure 22 A schematic diagram of a structure in which conductive metal is disposed in the corresponding perforated area of ​​an R chip according to an embodiment of the present invention;

[0056] Figure 23 This is a schematic diagram of the overall structure of the RGB chip and the driver IC electrically connected according to an embodiment of the present invention;

[0057] Figure 24 This is a schematic diagram of the structure of the third transparent colloid surface molded matte film provided in an embodiment of the present invention;

[0058] Figure 25 for Figure 24 A side view diagram;

[0059] Figure 26 This is a schematic diagram of the structure of a B chip provided in an embodiment of the present invention;

[0060] Figure 27 This is a schematic diagram of the structure of a G chip provided in an embodiment of the present invention;

[0061] Figure 28 This is a schematic diagram of the structure of an R chip provided in an embodiment of the present invention.

[0062] In the picture:

[0063] 1. Rigid base plate; 11. Metal lead electrodes; 12. Metal deposition layer;

[0064] 2. Driver IC; 21. Bottom pin; 22. Top pin;

[0065] 3. Insulating colloid; 4. Transparent colloid; 41. First transparent colloid; 42. Second transparent colloid; 43. Third transparent colloid;

[0066] 5. Conductive metal; 6. Connecting hole; 7. Metal pin; 8. Insulating layer; 9. Light-emitting layer. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0068] This invention provides a method for manufacturing LED beads and LED beads, which can solve the problems in related technologies such as the large number of wirings on the lamp board, the need for many through holes, the high manufacturing cost of the lamp board, the easier damage of lamp boards with double-sided components, and the difficulty in manufacturing small-sized LED beads.

[0069] See Figure 1 As shown, an embodiment of the present invention provides a method for manufacturing an LED lamp bead, which may include the following steps:

[0070] S1: Cover the rigid base plate 1 with an optical mask and etch the desired pin shape on the optical mask.

[0071] S2: Deposit metal onto the formed pin shape, then dissolve the excess optical mask outside the desired pin shape to form the metal pin electrode 11. The metal pin electrode 11 is made of a conductive metal, such as copper, nickel, gold, or silver. (See [reference needed]). Figure 4 As shown. Metal deposition can be achieved through vacuum sputtering or electroplating.

[0072] S3: Then, a secondary deposition can be performed on the rigid substrate 1 to form a metal deposition layer 12 on the surface of the metal pin electrode 11 suitable for placing the bottom pin 21 of the driver IC2. See [link to relevant documentation]. Figure 5As shown. The secondary deposition method can be consistent with the method of depositing the metal pin electrodes 11. That is, an optical mask is covered on the rigid substrate 1, the desired shape is etched by photolithography, and then a metal layer is deposited on the surface by vacuum sputtering or electroplating. After deposition, the excess (i.e., the portion outside the desired shape) of the optical mask is dissolved to form a metal deposition layer 12. Each metal deposition layer 12 corresponds one-to-one with each metal pin electrode 11, and the metal deposition layer 12 is electrically connected to the metal pin electrode 11. The metal deposition layer 12 can be used to electrically connect with the corresponding bottom pin 21 of the driver IC2. In this embodiment, by forming the metal deposition layer 12 on the metal pin electrode 11, a metal layer suitable for placing the bottom pin 21 of the driver IC2 can be formed, thereby achieving the electrical connection between the bottom pin 21 and the metal pin electrode 11.

[0073] S4: Place the driver IC2 on the rigid substrate 1, and electrically connect the bottom pin 21 of the driver IC2 to the corresponding metal deposition layer 12 on the rigid substrate 1 (see...). Figure 5 (As shown). The rigid substrate 1 can be made of alloy metal or sapphire, as alloy metal or sapphire has high corrosion resistance and is relatively stable. When manufacturing the LED beads, a large rigid substrate 1 can be selected, and multiple LED beads can be fabricated on this large rigid substrate 1. After the LED beads are packaged, the circuitry is separated from the rigid substrate, and then they are cut into individual LED beads. In this embodiment, the upper surface of the rigid substrate 1 can be provided with multiple metal pin electrodes 11 (that is, multiple metal pin electrodes 11 corresponding to each LED bead). The multiple metal pin electrodes 11 can be defined as SIN, CLK, SDO, VCC, and GND, respectively. SIN, CLK, SDO, and VCC are distributed at the four corners of the rigid substrate 1 where each LED bead is located, and GND is distributed at the center of the rigid substrate 1 where each LED bead is located. The bottom pin 21 of driver IC2 has the same definition as the multiple metal pin electrodes 11 on the surface of the rigid base plate 1. That is, the bottom pin 21 of driver IC2 is also defined as SIN, CLK, SDO, VCC, and GND, respectively. See [link to relevant documentation]. Figure 3 As shown.

[0074] S5: Molding insulating colloid 3 onto the surface of the rigid base plate 1, so that the insulating colloid 3 covers the surface of the driver IC 2.

[0075] S6: Transfer the RGB chip onto the insulating colloid 3, cover the surface of the insulating colloid 3 and the RGB chip with transparent colloid 4, punch holes to expose the electrode pins of the RGB chip and the top pin 22 of the driver IC2, and electrically connect the top pin 22 of the driver IC2 to the corresponding electrode pins of the RGB chip through the conductive metal 5 set in the punched area. Figure 2 This is a schematic diagram of the structure of any RGB chip.

[0076] In this embodiment, since both the driver IC2 and the RGB chip are located on one side of the rigid base plate 1, compared to arranging the driver IC2 and the RGB chip on opposite sides of the lamp board, placing them on the same side reduces or shortens the wiring. Furthermore, the wiring does not need to pass through the rigid base plate 1; the driver IC2 and the RGB chip on the same side of the rigid base plate 1 can be directly electrically connected. This reduces the number of through-holes on the rigid base plate 1, lowers manufacturing costs, and reduces the risk of damaging the rigid base plate 1. Simultaneously, by drilling holes in the insulating colloid 3 and the transparent colloid 4, and utilizing the conductive metal 5 in the drilled areas to achieve electrical connection between the driver IC2 and the RGB chip, the drilling method places lower precision requirements on the mass transfer chip compared to traditional electrical connection methods. The drilling method allows mass transfer to achieve conduction within a reasonable deviation range. Therefore, the embodiment provided by this invention improves the yield of mass transfer. Moreover, using a rigid base plate provides higher strength than a flexible base plate. Forming metal lead electrodes and a metal deposition layer on the rigid base plate to achieve electrical connection with the driver IC enables the fabrication of small-sized LED beads.

[0077] In some alternative embodiments, see Figure 6 and Figure 7 As shown, molding an insulating colloid 3 onto the surface of the rigid base plate 1 to cover the surface of the driver IC 2 may include: molding a layer of dark black insulating colloid 3 onto the top of the rigid base plate 1, so that the insulating colloid 3 surrounds the driver IC 2, wherein the height of the insulating colloid 3 is higher than the upper surface of the driver IC 2. In this embodiment, by molding a dark black insulating colloid, both insulation and contrast of the LED beads are enhanced; the darker the LED beads, the higher the contrast.

[0078] See Figure 7 and Figure 8As shown, in some embodiments, transferring the RGB chips onto the insulating colloid 3, covering the surfaces of the insulating colloid 3 and the RGB chips with a transparent colloid 4, punching holes to expose the electrode pins of the RGB chips and the top pin 22 of the driver IC 2, and electrically connecting the top pin 22 of the driver IC 2 to the corresponding electrode pins of the RGB chips through conductive metal 5 disposed in the punched area, may include: transferring a first number of RGB chips onto the insulating colloid 3 using mass transfer technology, and covering the surfaces of the insulating colloid 3 and the RGB chips with a transparent colloid 4. In this embodiment, the RGB chips may be located on the same plane, and the R, G, and B chips in the RGB chips may be staggered. Of course, they may also not be located on the same plane (for example, the R, G, and B chips in the RGB chips may be stacked on the insulating colloid 3). Above, the R, G, and B chips are of different sizes to expose their light-emitting layers. In this embodiment, the RGB chips are arranged on the same plane. The transparent colloid 4 covering the RGB chip surface is also insulating, serving as a molding agent, and can be a matte colloid. Holes are drilled at corresponding positions on the transparent colloid 4 and the insulating colloid 3 to expose the electrode pins of the RGB chips and the top pin 22 of the driver IC2. Conductive metal 5 is deposited in the drilled areas to electrically connect the top pin 22 of the driver IC2 to the corresponding electrode pins of the RGB chips. In this embodiment, using drilling and depositing conductive metal 5 to electrically connect the driver IC2 and the RGB chips reduces the manufacturing process difficulty. Of course, drilling and depositing conductive metal 5 can also be done simultaneously.

[0079] The first quantity mentioned above can refer to the three R, G, and B chips in a set of RGB chips, or it can refer to multiple sets of RGB chips, in which case the first quantity is a multiple of 3.

[0080] See Figure 9As shown, further, the step of drilling holes at corresponding positions on the transparent colloid 4 and the insulating colloid 3 to expose the electrode pins of the RGB chip and the top pin 22 of the driver IC2 may include: drilling a connection hole at the positive electrode position of the R chip corresponding to the transparent colloid 4 using a laser, and drilling connection holes at the R+ pin positions on the top of the driver IC2 corresponding to the transparent colloid 4 and the insulating colloid 3, so that the connection hole at the positive electrode position of the R chip is interconnected with the connection hole at the R+ pin position on the top of the driver IC2; drilling a connection hole at the positive electrode position of the G chip corresponding to the transparent colloid 4 using a laser, and drilling connection holes at the G+ pin positions on the top of the driver IC2 corresponding to the transparent colloid 4 and the insulating colloid 3, so that the connection hole at the positive electrode position of the G chip is interconnected with the... The connection holes at the G+ pin positions on the top of the driver IC2 are interconnected. A laser is used to create connection holes at the positive electrode positions of the transparent colloid 4 corresponding to the B chip, and connection holes are also created at the B+ pin positions on the top of the driver IC2 on both the transparent colloid 4 and the insulating colloid 3, ensuring that the connection holes at the positive electrode positions of the B chip are interconnected with the connection holes at the B+ pin positions on the top of the driver IC2. Similarly, a laser is used to create connection holes at the negative electrode positions of the transparent colloid 4 corresponding to the R, G, and B chips, and connection holes are also created at the GND pin positions on the top of the driver IC2 on both the transparent colloid 4 and the insulating colloid 3, ensuring that the connection holes at the negative electrode positions of the R, G, and B chips are interconnected with the connection holes at the GND pin positions on the top of the driver IC2. In this embodiment, a laser can create a connection between the positive and negative electrodes of the RGB chip and the R+, G+, B+, and GND electrodes on the top of the driver IC2 chip. After this laser connection, the electrodes of both the RGB chip and the driver IC2 are exposed, as shown in the diagram. Figure 9 As shown, a total of 10 laser holes need to be drilled.

[0081] Of course, in other embodiments, other drilling methods may also be adopted, not limited to laser drilling.

[0082] Further, see Figures 10 to 11As shown, the deposition of conductive metal 5 in the punched area to electrically connect the top pin 22 of the driver IC2 with the corresponding electrode pin of the RGB chip can include: etching lines on the surface of the transparent colloid 4 using an optical mask, then depositing a layer of conductive metal 5 on the lines by vacuum sputtering or electroplating, and then removing the excess (i.e., the portion outside the required lines) optical mask to form a deposited conductive metal 5 slightly higher than the transparent colloid 4. The shape of the conductive metal 5 depends on the position and distance between the positive and negative electrodes of the RGB chip and the top electrode of the driver IC2. The conductive metal 5 is required to cover the positive electrode of the R chip and the R+ electrode of the driver IC2, the positive electrode of the G chip and the G+ electrode of the driver IC2, the positive electrode of the B chip and the B+ electrode of the driver IC2, and the negative electrode of the RGB chip and the GND electrode of the driver IC2, and these four areas of conductive metal 5 are not interconnected.

[0083] In some alternative embodiments, see Figures 12 to 23 As shown, the step of transferring the RGB chip onto the insulating colloid 3, covering the surfaces of the insulating colloid 3 and the RGB chip with a transparent colloid 4, drilling holes to expose the electrode pins of the RGB chip and the top pin 22 of the driver IC2, and electrically connecting the top pin 22 of the driver IC2 to the corresponding electrode pins of the RGB chip through a conductive metal 5 disposed in the drilled area, may include:

[0084] The first chip in the RGB chip is transferred onto the insulating colloid 3 and covered with a first transparent colloid 41; holes are drilled at corresponding positions on the first transparent colloid 41 and the insulating colloid 3 to expose the electrode pins of the first chip and the corresponding top pins 22 of the driver IC2, and conductive metal 5 is deposited in the drilled area to electrically connect the electrode pins of the first chip with the corresponding top pins 22 of the driver IC2 (see [reference]). Figures 12 to 16 ).

[0085] The second chip in the RGB chip is transferred onto the first transparent colloid 41, and covered with a second transparent colloid 42. Holes are drilled at corresponding positions on the second transparent colloid 42, the first transparent colloid 41, and the insulating colloid 3 to expose the electrode pins of the second chip and the corresponding top pins 22 of the driver IC2. Conductive metal 5 is deposited in the drilled areas to electrically connect the electrode pins of the second chip with the corresponding top pins 22 of the driver IC2 (see [reference]). Figures 17 to 20 ).

[0086] The third chip in the RGB chip is transferred onto the second transparent colloid 42, and covered with the third transparent colloid 43. Holes are drilled at corresponding positions on the third transparent colloid 43, the second transparent colloid 42, the first transparent colloid 41, and the insulating colloid 3 to expose the electrode pins of the third chip and the corresponding top pins 22 of the driver IC2. Conductive metal 5 is deposited in the drilled area to electrically connect the electrode pins of the third chip with the corresponding top pins 22 of the driver IC2 (see [reference]). Figures 21 to 23 ).

[0087] It is understood that the first chip, the second chip, and the third chip in the above embodiments are encapsulated on the insulating colloid 3 in a stacked manner, and the size or arrangement of each chip can be different, as long as the light-emitting layer does not block each other after multiple chips are stacked (see...). Figures 26 to 28 As shown in the figure, in this embodiment, each chip is set as a chip of different size, and the light-emitting layer 9 of each chip can be set in different positions so that the light-emitting layers 9 of each chip do not block each other after being stacked. Preferably, when arranging the chips, the first chip can be set as the largest, the second chip as the second largest, and the third chip as the smallest; of course, other structural arrangements are also possible, such as setting the second chip as the largest or the third chip as the largest, etc. The order of the size of each chip, the stacking order, and the position are not limited here.

[0088] In this embodiment, the first chip has the largest size and is a B chip; the second chip has the second largest size and is a G chip; and the third chip has the smallest size and is an R chip. Of course, in other embodiments, the G chip or the R chip can also be set as the first chip, etc.

[0089] Taking the largest B-chip as an example (see...) Figure 26 As shown, during the stacking process, chip B is first placed on the insulating colloid 3. The size and placement of chip B do not completely cover the four top pins 22 of driver IC2; that is, each of the four top pins 22 needs to be exposed at least partially to facilitate subsequent electrical connections. After placing chip B, a layer of first transparent colloid 41 can be molded. Laser holes are then drilled at corresponding positions on the first transparent colloid 41 and the insulating colloid 3 to expose the positive and negative pins of chip B and the B+ and GND pins on the top of driver IC2. Circuits are etched in the drilled area using an optical mask, and conductive metal 5 is deposited on the circuit (after cleaning off excess optical mask). This allows the positive pin of chip B to be electrically connected to the B+ pin on the top of driver IC2, and the negative pin of chip B to be electrically connected to the GND pin on the top of driver IC2.

[0090] Then the G chip (see Figure 27 The material is transferred to the first transparent colloid 41 and covered with the second transparent colloid 42. Laser holes are drilled at the corresponding positions of the second transparent colloid 42, the first transparent colloid 41 and the insulating colloid 3 to expose the positive and negative pins of the G chip and the G+ and GND pins on the top of the driver IC2. The circuit is etched in the drilled area by an optical mask, and conductive metal 5 is deposited on the circuit (excess optical mask is cleaned off). The positive pin of the G chip is electrically connected to the G+ pin on the top of the driver IC2, and the negative pin of the G chip is electrically connected to the GND pin on the top of the driver IC2.

[0091] The R chip (see similar process steps) is manufactured using a similar method. Figure 28 The material is transferred to the second transparent colloid 42 and covered with the third transparent colloid 43. Laser holes are drilled at the corresponding positions of the third transparent colloid 43, the second transparent colloid 42, the first transparent colloid 41 and the insulating colloid 3 to expose the positive and negative pins of the R chip and the R+ pin and GND pin on the top of the driver IC2. The circuit is etched in the drilled area by an optical mask, and conductive metal 5 is deposited on the circuit (excess optical mask is cleaned off). The positive pin of the R chip is electrically connected to the R+ pin on the top of the driver IC2, and the negative pin of the R chip is electrically connected to the GND pin on the top of the driver IC2.

[0092] Finally, a layer of matte molding compound or matte epoxy resin can be molded onto the top of the third transparent colloid 43 to complete the encapsulation of the LED chip, forming a complete LED chip (see [link]). Figures 24 to 25 (As shown).

[0093] This invention also provides an LED chip, which may include: a rigid base plate 1, on which a driver IC 2 is encapsulated by an insulating colloid 3, and the bottom pin 21 of the driver IC 2 is electrically connected to the corresponding metal pin electrode 11 on the rigid base plate 1. The insulating colloid 3 covers the surface of the driver IC 2, wherein the insulating colloid 3 is preferably dark black, and the height of the insulating colloid 3 is slightly higher than the upper surface of the driver IC 2; and an RGB chip, which is encapsulated on the surface of the insulating colloid 3 by a transparent colloid 4, and the transparent colloid 4 covers the surface of the RGB chip. The transparent colloid 4 and the insulating colloid 3 have a connection hole 6 to expose the electrode pins of the RGB chip and the top pin 22 of the driver IC 2, and a conductive metal 5 is disposed in the connection hole 6, the conductive metal 5 electrically connecting the top pin 22 of the driver IC 2 to the corresponding electrode pin of the RGB chip. In this embodiment, the arrangement of the RGB chip on the insulating colloid 3 is not specifically limited. The LED chip can be obtained using any of the manufacturing methods provided in the above embodiments, which will not be elaborated here.

[0094] In some embodiments, see Figure 10 and Figure 11 As shown, the RGB chips can be located on the same plane of the insulating colloid 3 surface, and the R, G, and B chips in the RGB chips are staggered. That is, the R, G, and B chips are not arranged in a straight line. This staggered arrangement improves the integration of the LED chips, increases the precision of LED chip manufacturing, facilitates wiring, makes it easier to connect to the common electrode, facilitates the manufacturing of small-sized LED chips, simplifies the process, concentrates the light source, improves the light emission effect, and reduces color differences of the product at different angles. The RGB chips can be... Figure 2 The structure shown.

[0095] Preferably, the positions and polarity orientations of the RGB chips are varied according to the pin definitions of the driver IC2. In this embodiment, the G chip is located between the R and B chips, and the R and B chips can be positioned directly opposite each other, while the G chip is offset. The positive and negative terminals of the G and R chips are on the same side, while the polarity orientation of the B chip is opposite to that of the R chip. This arrangement makes the positive terminals of the R, G, and B chips closer to the corresponding positions of the R+, G+, and B+ pins on the driver IC2, and the negative terminals of the R, G, and B chips are roughly aligned with the GND pin on the driver IC2, which is beneficial for drilling holes and forming the conductive metal 5.

[0096] In some alternative embodiments, see Figure 24 and Figure 25 As shown, the R, G, and B chips in the RGB chip are preferably stacked on top of the insulating colloid 3, and the R, G, and B chips are of different sizes to expose the light-emitting layer 9 of the R, G, and B chips. In other words, in this embodiment, by specially designing the size of each chip and setting different areas of the light-emitting layer 9, it is easy for the three chips to be stacked without obstructing each other's light-emitting layers 9. This stacking scheme facilitates the production of smaller LED beads, simplifies the chip stacking method, and, while maintaining a small size, does not affect the light-emitting effect of each chip, reducing color differences in the product at different angles.

[0097] In this embodiment, the RGB chip is a flip chip. Each chip includes a P-terminal, an N-terminal, and a light-emitting layer 9. The positive and negative terminals of the chip are led out through an insulating layer 8 and metal leads 7, creating an RGB chip with positive and negative leads at both ends of the chip (see [link to documentation]). Figures 26 to 28 (As shown).

[0098] In the stacked design, taking the R chip, G chip, and B chip as examples where the sizes increase sequentially, the region between the P and N poles of the B chip can be provided with an insulating layer 8 and a light-emitting layer 9; the region between the P and N poles of the G chip can also be provided with an insulating layer 8 and a light-emitting layer 9, wherein the light-emitting layer 9 of the G chip corresponds to the insulating layer 8 of the B chip and will not block the light-emitting layer 9 of the B chip; the region between the P and N poles of the R chip can be provided with a light-emitting layer 9, wherein the R chip has the smallest size, and the light-emitting layer 9 of the R chip can correspond to the insulating layer 8 of the G chip, without blocking the light-emitting layers 9 of the G chip and the B chip.

[0099] Of course, the size order of each chip can be set according to actual needs and is not limited to the embodiments given above.

[0100] Further, see Figure 5 As shown, in some embodiments, a metal deposition layer 12 is disposed on the surface of the metal pin electrode 11, wherein the metal deposition layer 12 can correspond one-to-one with the metal pin electrode 11, the metal deposition layer 12 is electrically connected to the metal pin electrode 11, and the metal deposition layer 12 is electrically connected to the bottom pin 21 of the driver IC2. This embodiment achieves the electrical connection between the metal pin electrode 11 and the bottom pin 21 of the driver IC2 by adding a metal deposition layer 12, thus forming a metal layer suitable for placing the bottom pin 21 of the driver IC2.

[0101] In the description of this invention, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0102] It should be noted that, in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0103] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for manufacturing LED beads, characterized in that, It includes the following steps: An optical mask is covered on a rigid substrate (1), and the desired pin shape is etched on the optical mask; Metal is deposited on the formed pin shape, and the optical mask outside the desired pin shape is dissolved to form a metal pin electrode (11). A secondary deposition is performed on the hard substrate (1) to form a metal deposition layer (12) suitable for placing the bottom pin (21) of the driver IC (2) on the surface of the metal pin electrode (11). Multiple driver ICs (2) are placed on the rigid substrate (1), and the bottom pins (21) of the driver ICs (2) are electrically connected to the corresponding metal deposition layer (12) on the rigid substrate (1); wherein, the driver IC (2) is a driver chip; An insulating colloid (3) is molded onto the surface of the rigid base plate (1) so that the insulating colloid (3) covers the surface of the driver IC (2); Multiple RGB chips are transferred onto the insulating colloid (3) so that the RGB chips are positioned above the driver IC (2); a transparent colloid (4) is covered on the surface of the insulating colloid (3) and the RGB chips, and holes are punched to expose the electrode pins of the RGB chips and the top pins (22) of the driver IC (2). The top pins (22) of the driver IC (2) are electrically connected to the corresponding electrode pins of the RGB chips through the conductive metal (5) set in the punched area, and then cut to form a single LED bead.

2. The method for manufacturing LED beads as described in claim 1, characterized in that, The process of molding an insulating colloid (3) onto the surface of the rigid base plate (1) to cover the surface of the driver IC (2) includes: A dark black insulating colloid (3) is molded and covered on the top of the rigid base plate (1), so that the insulating colloid (3) wraps around the driver IC (2), wherein the height of the insulating colloid (3) is higher than the upper surface of the driver IC (2).

3. The method for manufacturing LED beads as described in claim 1, characterized in that, The process of transferring multiple RGB chips onto the insulating colloid (3) so that the RGB chips are positioned above the driver IC (2); covering the insulating colloid (3) and the surface of the RGB chips with a transparent colloid (4), drilling holes to expose the electrode pins of the RGB chips and the top pins (22) of the driver IC (2), and electrically connecting the top pins (22) of the driver IC (2) to the corresponding electrode pins of the RGB chips through conductive metal (5) disposed in the drilling area, includes: The first number of RGB chips are transferred to the insulating colloid (3), and a transparent colloid (4) is covered on the surface of the insulating colloid (3) and the RGB chips. Holes are drilled at corresponding positions in the transparent colloid (4) and the insulating colloid (3) to expose the electrode pins of the RGB chip and the top pin (22) of the driver IC (2). Conductive metal (5) is deposited in the punched area, so that the top pin (22) of the driver IC (2) is electrically connected to the corresponding electrode pin of the RGB chip.

4. The method for manufacturing LED beads as described in claim 3, characterized in that, The step of drilling holes at corresponding positions in the transparent colloid (4) and the insulating colloid (3) to expose the electrode pins of the RGB chip and the top pin (22) of the driver IC (2) includes: A connection hole is made in the transparent colloid (4) at the positive electrode position of the R chip by laser, and a connection hole is made in the transparent colloid (4) and the insulating colloid (3) at the R+ pin position on the top of the driver IC (2) so that the connection hole at the positive electrode position of the R chip and the connection hole at the R+ pin position on the top of the driver IC (2) are connected to each other. A connection hole is made in the transparent colloid (4) at the positive electrode position of the G chip by laser, and a connection hole is made in the transparent colloid (4) and the insulating colloid (3) at the G+ pin position on the top of the driver IC (2) so that the connection hole at the positive electrode position of the G chip is connected to the connection hole at the G+ pin position on the top of the driver IC (2). A connection hole is made in the transparent colloid (4) at the positive electrode position of the B chip by laser, and a connection hole is made in the transparent colloid (4) and the insulating colloid (3) at the B+ pin position on the top of the driver IC (2) so that the connection hole at the positive electrode position of the B chip is connected to the connection hole at the B+ pin position on the top of the driver IC (2). A laser is used to create connection holes at the negative positions of the R, G, and B chips on the transparent colloid (4), and connection holes are also created at the GND pin positions on the top of the driver IC (2) on the transparent colloid (4) and the insulating colloid (3), so that the connection holes at the negative positions of the R, G, and B chips are all connected to the connection holes at the GND pin positions on the top of the driver IC (2).

5. The method for manufacturing LED beads as described in claim 1, characterized in that, The process of transferring multiple RGB chips onto the insulating colloid (3) so that the RGB chips are positioned above the driver IC (2); covering the insulating colloid (3) and the surface of the RGB chips with a transparent colloid (4), drilling holes to expose the electrode pins of the RGB chips and the top pins (22) of the driver IC (2), and electrically connecting the top pins (22) of the driver IC (2) to the corresponding electrode pins of the RGB chips through conductive metal (5) disposed in the drilling area, includes: The first chip in the RGB chip is transferred onto the insulating colloid (3) and covered with the first transparent colloid (41). Holes are punched in the first transparent colloid (41) and the insulating colloid (3) at corresponding positions to expose the electrode pins of the first chip and the corresponding top pins (22) of the driver IC (2), and conductive metal (5) is deposited in the punched area to electrically connect the electrode pins of the first chip with the corresponding top pins (22) of the driver IC (2). The second chip in the RGB chip is transferred onto the first transparent colloid (41) and covered with the second transparent colloid (42). Holes are punched in the corresponding positions of the second transparent colloid (42), the first transparent colloid (41) and the insulating colloid (3) to expose the electrode pins of the second chip and the corresponding top pins (22) of the driver IC (2), and conductive metal (5) is deposited in the punched area to electrically connect the electrode pins of the second chip with the corresponding top pins (22) of the driver IC (2). The third chip in the RGB chip is transferred onto the second transparent colloid (42) and covered with the third transparent colloid (43). Holes are drilled at corresponding positions of the third transparent colloid (43), the second transparent colloid (42), the first transparent colloid (41), and the insulating colloid (3) to expose the electrode pins of the third chip and the corresponding top pins (22) of the driver IC (2), and conductive metal (5) is deposited in the drilled area to electrically connect the electrode pins of the third chip with the corresponding top pins (22) of the driver IC (2).

6. An LED bead prepared using the manufacturing method described in claim 1, characterized in that, It includes: A rigid base plate (1) is provided, on which a driver IC (2) is encapsulated by an insulating colloid (3), and the bottom pin (21) of the driver IC (2) is electrically connected to the corresponding metal pin electrode (11) on the rigid base plate (1). The insulating colloid (3) covers the surface of the driver IC (2). An RGB chip is encapsulated on the surface of an insulating colloid (3) by a transparent colloid (4), and the transparent colloid (4) covers the surface of the RGB chip. The transparent colloid (4) and the insulating colloid (3) have a connection hole (6) to expose the electrode pins of the RGB chip and the top pin (22) of the driver IC (2). A conductive metal (5) is provided in the connection hole (6), and the conductive metal (5) electrically connects the top pin (22) of the driver IC (2) to the corresponding electrode pins of the RGB chip.

7. The LED lamp bead as described in claim 6, characterized in that: The RGB chips are located on the same plane of the surface of the insulating colloid (3), and the R chip, G chip and B chip in the RGB chips are staggered.

8. The LED lamp bead as described in claim 6, characterized in that: The R, G, and B chips in the RGB chip are stacked on top of the insulating colloid (3), and the R, G, and B chips are of different sizes to expose the light-emitting layers of the R, G, and B chips.

9. The LED lamp bead as described in claim 6, characterized in that: A metal deposition layer (12) is provided on the surface of the metal pin electrode (11), the metal deposition layer (12) is electrically connected to the metal pin electrode (11), and the metal deposition layer (12) is electrically connected to the bottom pin (21) of the driver IC (2).

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