An environmentally friendly cleaning agent for semiconductor chips, its preparation method and application

Abstract

This invention discloses an environmentally friendly cleaning agent for semiconductor chips, its preparation method, and its application, relating to the fields of printed circuit board production and semiconductor chip cleaning technology. The environmentally friendly cleaning agent comprises the following components by mass concentration: softening material 2-15 g / L, accelerator 5-20 g / L, dispersant 0.2-2 g / L, penetrant 5-15 g / L, metal protectant 0.02-0.1 g / L, stripper 5-20 g / L, with the balance being deionized water; the mass ratio of the accelerator to the dispersant is 1:(0.02-0.3); the stripper is a mixture of alcohol ethers, organic amines, surfactants, and organic solvents. The environmentally friendly cleaning agent provided by this invention can quickly clean and remove oil stains, oxides, metal particles, photoresist, and wax residues from the surface of semiconductor chips, reducing cleaning time and improving economic efficiency and quality yield.

Description

Technical Field

[0001] This invention relates to the fields of printed circuit board production and semiconductor chip cleaning technology, and in particular to an environmentally friendly cleaning agent for semiconductor chips, its preparation method and application. Background Technology

[0002] With the rapid development of the electronics and information industry, semiconductor chip production has become particularly important in integrated circuit manufacturing, as the quality of semiconductor chips directly affects the quality of integrated circuits. In each stage of semiconductor chip production, contamination from dust particles and metals can easily damage circuit functions, causing short circuits or open circuits, leading to integrated circuit failure and geometric defects. Therefore, semiconductor chip cleaning is a crucial step. The main purpose of cleaning is to remove fine particulate contaminants, metal particles, organic matter, oil, wax, and photoresist residues left over from the previous process. While ensuring rapid and effective removal of these substances, the cleaning solution must not corrode or damage the metal components on the semiconductor chip. The cleaned semiconductor chip surface must meet technical requirements such as being corrosion-free, oxidation-free, bright, and residue-free. Simultaneously, the cleaning agent must not contain toxic or harmful components, and the waste liquid must be easily disposed of, effectively reducing the generation of harmful gases and avoiding environmental pollution.

[0003] Existing semiconductor chip cleaning agents often use hydrochloric acid, nitric acid, strong alkaline solutions, or surfactants containing phosphates. However, hydrochloric acid and nitric acid are corrosive and cannot remove particulate matter and organic components. Strong alkaline cleaning agents have unsatisfactory overall removal effects. While cleaning agents containing phosphate surfactants have better cleaning effects, they cannot remove photoresist and its residues, and they also pollute the environment, easily causing problems such as eutrophication and water pollution.

[0004] Existing technologies have always been limited in their scope, failing to achieve the simultaneous cleaning of semiconductor chip surfaces and removal of residues such as wax and photoresist, while also ensuring that the solution is environmentally friendly, non-toxic, and harmless. For example:

[0005] 1) Chinese patent CN109679790A discloses a solvent-based cleaning agent with hydrocarbon solvent as the main component: it has good solubility for wax, but in the wax removal process, acetone is required to clean the residual cleaning agent. Acetone has a low boiling point, is volatile, and is consumed in large quantities. Not only is the waste liquid treatment environmentally unfriendly, but it also poses certain risks to the workshop environment and the health of operators.

[0006] 2) Chinese patent CN105542990A discloses a water-based LED chip cleaning agent. The cleaning agent has high cleaning efficiency and strong decontamination ability; good safety performance and does not pollute the environment; saves energy and has low washing cost; the cleaning agent can form a protective film on the chip surface during the washing process, isolate the air, prevent water and other molecules in the atmosphere from corroding the chip, and resist oxidation, but it cannot effectively remove wax and photoresist residues.

[0007] Therefore, there is an urgent need to develop an environmentally friendly cleaning agent for semiconductor chips, along with its preparation method and application, to address the problems of existing semiconductor chip cleaning agents, such as strong corrosivity, poor cleaning effect, poor removal of wax and photoresist, and serious environmental pollution. The goal is to create a semiconductor chip cleaning agent that can efficiently and quickly remove any residual substances from the semiconductor surface without the use of ultrasonic equipment, while also being environmentally friendly, having low production costs, and promoting sustainable development. Summary of the Invention

[0008] To address the aforementioned technical problems, this invention provides an environmentally friendly cleaning agent for semiconductor chips, its preparation method, and its application. This environmentally friendly cleaning agent, under pure immersion conditions, can efficiently and quickly clean surfaces, removing any residual substances such as wax and photoresist. The cleaning time is short, it does not corrode or damage metal components, leaving the surface bright and free of oxidation. The cleaning rate reaches over 99.8%, improving quality yield. It also has positive implications for green environmental protection, low production costs, and sustainable development. Specifically, it includes the following technical solutions:

[0009] In a first aspect, an environmentally friendly cleaning agent for semiconductor chips is provided, comprising the following components in mass concentration:

[0010]

[0011] The mass ratio of the accelerator to the dispersant is 1:(0.02-0.3);

[0012] The accelerator is selected from at least one of propylene glycol methyl ether acetate, vinyltrimethylsilane, and dodecaguanidine acetate;

[0013] The dispersant is selected from at least one of sodium humate, sodium hexametaphosphate, and sodium tripolyphosphate.

[0014] The stripping agent is a mixture of alcohol ether, organic amine, surfactant and organic solvent, wherein the mass ratio of alcohol ether, organic amine, surfactant and organic solvent is 1:(0.05-0.3):(0.06-0.25):(1-6);

[0015] The alcohol ether is selected from at least one of propylene glycol methyl ether acetate, fatty alcohol polyoxyethylene ether, and glycerol polyoxyethylene ether; the organic amine is selected from at least one of N,N-diethylethanolamine, m-ethoxyaniline, and ethylene bis-stearamide; the surfactant is selected from at least one of cocoyl glucoside, lauryl glucoside, and cetearyl glucoside; and the organic solvent is N,N-diethylformamide (DEF solvent).

[0016] Furthermore, the softening material is selected from at least one of dodecylpropyl betaine, N,N-diethylbenzylamine, dodecyl dimethyl benzyl ammonium chloride, and trialkylamine; the penetrant is selected from at least one of disodium monolaurate sulfosuccinate, sodium diisooctyl succinate sulfonate, and sodium diisooctyl succinate sulfonate; and the metal protectant is selected from at least one of 2-undecylimidazoline, sodium 2-heptadecenyl-1-aminoethylimidazoline chloride, sodium lauroyl methylaminopropionate, and amide imidazole.

[0017] Furthermore, the mass ratio of the accelerator to the dispersant is 1:(0.02-0.25).

[0018] Furthermore, the environmentally friendly cleaning agent for semiconductor chips comprises the following components in mass concentration:

[0019]

[0020] Furthermore, the environmentally friendly cleaning agent for semiconductor chips comprises the following components in mass concentration:

[0021]

[0022] In a second aspect, a method for preparing an environmentally friendly cleaning agent for semiconductor chips according to the first aspect is provided, comprising the following steps:

[0023] The stripping agent, softening material, accelerator, dispersant, penetrant, metal protectant and deionized water are mixed and stirred for 1-2 hours at a water bath temperature of 50-60℃ and a rotation speed of 1000-2000 r / min to obtain the environmentally friendly cleaning agent for semiconductor chips.

[0024] Furthermore, the stripping agent is obtained by mixing and stirring alcohol ethers, organic amines, surfactants and organic solvents for 10-30 minutes.

[0025] Thirdly, a method for cleaning semiconductor chips is provided, which uses the environmentally friendly cleaning agent for semiconductor chips described in the first aspect to clean the semiconductor chips.

[0026] Furthermore, the cleaning of the semiconductor chip includes the following steps:

[0027] S1. Prepare an environmentally friendly cleaning solution containing 8-20% by mass of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 35-40℃ for 5-10 minutes, and then remove the semiconductor chip.

[0028] S2. Rinse the semiconductor chip 2-3 times with deionized water at a temperature of 60-80℃, and then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

[0029] Furthermore, in step S1, the environmentally friendly cleaning agent solution contains 10-12% by mass of an environmentally friendly cleaning agent for semiconductor chips.

[0030] The beneficial effects of this invention are as follows:

[0031] (1) The hydrophobic groups among the stripping agent, softening material, accelerator, dispersant, penetrant, and metal protectant in the environmentally friendly cleaning agent used for semiconductor chips interact, softening contaminants such as wax and photoresist through the softening material. At the same time, the stripping agent has very good surface tension and penetration ability during the cleaning process, and can quickly replace or wet the interface between contaminants and the chip in a room temperature aqueous solution, ensuring that contaminants are peeled off from the surface of semiconductor chip electrode elements in a very short cleaning time, which greatly improves production efficiency. Meanwhile, through intermolecular chemical interaction with contaminants, the contaminants can be encapsulated in clusters, ensuring the hydrophobicity of the peeled contaminants in water. The contaminants will quickly disperse and suspend, and are not easy to re-adhere to the semiconductor chip electrode elements, making the semiconductor chip surface less susceptible to secondary contamination.

[0032] (2) The organic solvent in the stripping agent is replaced with N,N-diethylformamide (DEF solvent) instead of N-methylpyrrolidone (NMP solvent) and N,N-dimethylformamide (DMF solvent), which can effectively reduce the generation of harmful gases and avoid environmental pollution.

[0033] (3) At a solution temperature of 35-40 degrees Celsius, without the use of ultrasonic equipment, the surface of semiconductor chips can be completely cleaned by pure immersion for 5-10 minutes. This thoroughly removes stubborn residues such as oil, oxides, fine metal particles, wax, and photoresist, achieving a cleaning and removal rate of over 99.8%. The cleaning agent does not corrode metal components, and the cleaned semiconductor chip surface is bright and free of oxidation, greatly improving production quality and saving production costs. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a diagram showing the effect of cleaning a semiconductor chip with an environmentally friendly cleaning agent according to Embodiment 1 of the present invention.

[0036] Figure 2 This is a diagram showing the effect of cleaning a semiconductor chip with an environmentally friendly cleaning agent, as described in Comparative Example 1 of the present invention. Detailed Implementation

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0039] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0040] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0041] To better understand the technical content of the present invention, the technical solution of the present invention will be further introduced and explained below with reference to specific embodiments.

[0042] Preparation method of environmentally friendly cleaning agent for semiconductor chips

[0043] The stripping agent, softening material, accelerator, dispersant, penetrant, metal protectant and deionized water are mixed and stirred for 1-2 hours at a water bath temperature of 50-60℃ and a rotation speed of 1000-2000 r / min to obtain the environmentally friendly cleaning agent for semiconductor chips.

[0044] The stripping agent is obtained by mixing and stirring alcohol ethers, organic amines, surfactants and organic solvents for 10-30 minutes.

[0045] A method for cleaning semiconductor chips

[0046] The cleaning of semiconductor chips using the aforementioned environmentally friendly cleaning agent includes the following steps:

[0047] S1. Prepare an environmentally friendly cleaning solution containing 8-20% (by mass) an environmentally friendly cleaning agent for semiconductor chips (the remainder being deionized water). Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 35-40℃ for 5-10 minutes, then remove the semiconductor chip.

[0048] S2. Rinse the semiconductor chip 2-3 times with deionized water at a temperature of 60-80℃, and then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

[0049] Preferably, in step S1, the environmentally friendly cleaning agent solution contains 10-12% by mass of an environmentally friendly cleaning agent for semiconductor chips.

[0050] After cleaning, the semiconductor chip is tested according to the subsequent performance testing methods.

[0051] Performance testing methods:

[0052] Surface appearance: Observe the semiconductor chip with a 10x microscope or microscope to check whether there are visible spots, oil stains, contaminants, oxidation, metal corrosion, wax and photoresist residues on the surface of the semiconductor chip.

[0053] Cleaning efficiency: The formula for calculating the cleaning efficiency x is: x = (m1 - m2) / (m1 - m0) × 100%. Where: m0: Unprocessed semiconductor chip, weighed. m1: Semiconductor chip after a series of processing steps, weighed again. m2: Semiconductor chip after cleaning with cleaning agent, weighed. (The processing steps in m1 refer to the semiconductor chip's production processes such as wafer fabrication, oxidation, photolithography, etching, thin film deposition, interconnection, testing, and packaging.)

[0054] Example 1

[0055] An environmentally friendly cleaning agent for semiconductor chips comprises the following components at mass concentrations: 8 g / L dodecylpropyl betaine, 10 g / L propylene glycol methyl ether acetate, 0.8 g / L sodium humate, 8 g / L disodium monolaurate sulfosuccinate, 0.04 g / L 2-undecylimidazoline, and 8 g / L stripping agent, wherein the stripping agent is a mixture of propylene glycol methyl ether acetate, N,N-diethylethanolamine, cocoyl glucoside, and N,N-diethylformamide, with a mass ratio of 1:0.1:0.10:2, and the balance being deionized water.

[0056] The preparation method of the environmentally friendly cleaning agent for semiconductor chips in Example 1 includes the following steps:

[0057] The stripping agent, softening material, accelerator, dispersant, penetrant, metal protectant and deionized water were mixed and stirred for 1.5 h at a water bath temperature of 55°C and a rotation speed of 1500 r / min to obtain the environmentally friendly cleaning agent for semiconductor chips of Example 1.

[0058] The stripping agent is obtained by mixing and stirring alcohol ether, organic amine, surfactant and organic solvent for 20 min.

[0059] The environmentally friendly cleaning agent for semiconductor chips described in Example 1 is used to clean semiconductor chips, including the following steps:

[0060] S1. Prepare an environmentally friendly cleaning solution containing 10% (w / w) of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 35°C for cleaning. After cleaning for 6 minutes, remove the semiconductor chip.

[0061] S2. Rinse the semiconductor chip with deionized water at 60℃ 2-3 times, then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip. Figure 1 This is a diagram showing the effect of cleaning a semiconductor chip with an environmentally friendly cleaning agent according to Embodiment 1 of the present invention.

[0062] The preparation methods of the environmentally friendly cleaning agents for semiconductor chips in Examples 2-7 are the same as those in Example 1.

[0063] Example 2

[0064] An environmentally friendly cleaning agent for semiconductor chips comprises the following components by mass concentration: 10 g / L of N,N-diethylbenzylamine, 12 g / L of vinyltrimethylsilane, 0.9 g / L of sodium hexametaphosphate, 10 g / L of sodium diisooctyl succinate sulfonate, 0.04 g / L of sodium 2-heptadecenyl-1-aminoethylimidazoline chloride, and 12 g / L of a stripping agent, wherein the stripping agent is a mixture of fatty alcohol polyoxyethylene ether, N,N-diethylethanolamine, cocoyl glucoside, and N,N-diethylformamide, with a mass ratio of fatty alcohol polyoxyethylene ether, N,N-diethylethanolamine, cocoyl glucoside, and N,N-diethylformamide of 1:0.08:0.12:3.6, and the balance being deionized water.

[0065] The environmentally friendly cleaning agent for semiconductor chips described in Example 2 is used to clean semiconductor chips, including the following steps:

[0066] S1. Prepare an environmentally friendly cleaning solution containing 10% (w / w) of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 36°C for 8 minutes, and then remove the semiconductor chip.

[0067] S2. Rinse the semiconductor chip twice with deionized water at 65°C, then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

[0068] Example 3

[0069] An environmentally friendly cleaning agent for semiconductor chips comprises the following components by mass concentration: 12 g / L dodecyl dimethyl benzyl ammonium chloride, 8 g / L dodecyl acetate, 1.0 g / L sodium tripolyphosphate, 8 g / L disodium monolaurate sulfosuccinate, and 0.04 g / L metal protectant, wherein the metal protectant is a mixture of 2-undecyl imidazoline, 10 g / L propylene glycol methyl ether acetate, ethylene bis-stearamide, cocoyl glucoside, and N,N-diethylformamide, wherein the mass ratio of propylene glycol methyl ether acetate, ethylene bis-stearamide, cocoyl glucoside, and N,N-diethylformamide is 1:0.12:0.1:3.78, and the balance is deionized water.

[0070] The environmentally friendly cleaning agent for semiconductor chips described in Example 3 is used to clean semiconductor chips, including the following steps:

[0071] S1. Prepare an environmentally friendly cleaning solution containing 11% (w / w) of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 39°C for 8 minutes, and then remove the semiconductor chip.

[0072] S2. Rinse the semiconductor chip twice with deionized water at 70°C, then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

[0073] Example 4

[0074] An environmentally friendly cleaning agent for semiconductor chips comprises the following components by mass concentration: 10 g / L of trialkylamine, 15 g / L of vinyltrimethylsilane, 0.8 g / L of sodium tripolyphosphate, 10 g / L of disodium monolaurate sulfosuccinate, 0.06 g / L of 2-undecylimidazoline, and 12 g / L of a stripping agent, wherein the stripping agent is a mixture of glycerol polyoxyethylene ether, m-ethoxyaniline, cetearyl glucoside, and N,N-diethylformamide, and the mass ratio of glycerol polyoxyethylene ether, m-ethoxyaniline, cetearyl glucoside, and N,N-diethylformamide is 1:0.2:0.15:3.45, with the balance being deionized water.

[0075] The environmentally friendly cleaning agent for semiconductor chips described in Example 4 is used to clean semiconductor chips, including the following steps:

[0076] S1. Prepare an environmentally friendly cleaning solution containing 12% (w / w) of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 40°C for 10 minutes, and then remove the semiconductor chip.

[0077] S2. Rinse the semiconductor chip twice with deionized water at 65°C, then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

[0078] Example 5

[0079] An environmentally friendly cleaning agent for semiconductor chips comprises the following components by mass concentration: 10 g / L dodecylpropyl betaine, 12 g / L propylene glycol methyl ether acetate, 0.8 g / L sodium tripolyphosphate, 8 g / L disodium monolaurate sulfosuccinate, 0.06 g / L sodium lauroyl methylaminopropionate, and 8 g / L stripping agent, wherein the stripping agent is a mixture of propylene glycol methyl ether acetate, ethylene bis-stearamide, cocoyl glucoside, and N,N-diethylformamide, and the mass ratio of propylene glycol methyl ether acetate, ethylene bis-stearamide, cocoyl glucoside, and N,N-diethylformamide is 1:0.2:0.12:2.68, with the balance being deionized water.

[0080] The environmentally friendly cleaning agent for semiconductor chips described in Example 5 is used to clean semiconductor chips, including the following steps:

[0081] S1. Prepare an environmentally friendly cleaning solution containing 11% (w / w) of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 37°C for cleaning. After cleaning for 6 minutes, remove the semiconductor chip.

[0082] S2. Rinse the semiconductor chip twice with deionized water at 80°C, and then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

[0083] Example 6

[0084] An environmentally friendly cleaning agent for semiconductor chips comprises the following components by mass concentration: 12 g / L dodecyl dimethyl benzyl ammonium chloride, 10 g / L propylene glycol methyl ether acetate, 1.0 g / L sodium tripolyphosphate, 11 g / L disodium monolaurate sulfosuccinate, and 0.08 g / L metal protectant. The metal protectant is a mixture of 2-undecyl imidazoline, 12 g / L propylene glycol methyl ether acetate, ethylene bis-stearamide, cetearyl glucoside, and N,N-diethylformamide. The mass ratio of propylene glycol methyl ether acetate, ethylene bis-stearamide, cetearyl glucoside, and N,N-diethylformamide is 1:0.25:0.18:4.57, with the balance being deionized water.

[0085] The environmentally friendly cleaning agent for semiconductor chips described in Example 6 is used to clean semiconductor chips, including the following steps:

[0086] S1. Prepare an environmentally friendly cleaning solution containing 12% (w / w) of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 37°C for cleaning. After cleaning for 10 minutes, remove the semiconductor chip.

[0087] S2. Rinse the semiconductor chip twice with deionized water at 75°C, and then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

[0088] Example 7

[0089] An environmentally friendly cleaning agent for semiconductor chips comprises the following components by mass concentration: 11 g / L of dodecyl dimethyl benzyl ammonium chloride, 12 g / L of vinyltrimethylsilane, 1.1 g / L of sodium humate, 10 g / L of sodium diisooctyl succinate sulfonate, 0.08 g / L of sodium 2-heptadecenyl-1-aminoethylimidazoline chloride, and 12 g / L of a stripping agent, wherein the stripping agent is a mixture of glycerol polyoxyethylene ether, N,N-diethylethanolamine, cetearyl glucoside, and N,N-diethylformamide, with a mass ratio of 1:0.3:0.25:4.45, and the balance being deionized water.

[0090] The environmentally friendly cleaning agent for semiconductor chips described in Example 7 is used to clean semiconductor chips, including the following steps:

[0091] S1. Prepare an environmentally friendly cleaning solution containing 12% (w / w) of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 38°C for 10 minutes, and then remove the semiconductor chip.

[0092] S2. Rinse the semiconductor chip twice with deionized water at 70°C, then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

[0093] The performance of the environmentally friendly cleaning agents for semiconductor chips in Examples 1-7 was tested, and the test results are shown in Table 1 below:

[0094] Table 1. Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1-7.

[0095]

[0096]

[0097] As shown in Table 1, the environmentally friendly cleaning agent for semiconductor chips provided by this invention is simple to prepare, has a short cleaning time, is easy to operate, is non-toxic and harmless, does not produce other side effects, and is economically cost-effective. The environmentally friendly cleaning agent for semiconductor chips of this invention has a significant effect on improving the quality and yield of semiconductor chips. The cleaned semiconductor chips have a uniform and bright color, a clean surface, no visible spots, and are free of contaminants or oil stains. It also thoroughly removes residues such as wax and photoresist.

[0098] The preparation methods of the environmentally friendly cleaning agents for semiconductor chips in Comparative Examples 1-22, and the cleaning steps of the semiconductor chips using the environmentally friendly cleaning agents for semiconductor chips, are the same as in Example 1.

[0099] I. The Influence of Different Mass Concentrations of Softening Materials

[0100] The difference between Comparative Examples 1-3 and Example 1 is the mass concentration of the softening material; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Examples 1 and Comparative Examples 1-3, and the results are shown in Table 2.

[0101] Table 2. Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1 and Comparative Examples 1-3.

[0102]

[0103] Figure 2 This is a diagram showing the effect of cleaning a semiconductor chip with an environmentally friendly cleaning agent, as described in Comparative Example 1 of the present invention. Figure 1 and Figure 2 As shown in Table 2, when no softening material is added to the above-mentioned environmentally friendly cleaning agent for semiconductor chips (Comparative Example 1), the cleaning rate is poor, the surface appearance shows oxidation and poor color, and there is contamination and residue. When the mass concentration of the softening material is below 1 g / L (Comparative Example 2) or above 15 g / L (Comparative Example 3), the performance test results are unsatisfactory. Therefore, the preferred mass concentration of the softening material in the environmentally friendly cleaning agent for semiconductor chips is 2-15 g / L.

[0104] II. Effects of Different Accelerator Mass Concentrations

[0105] The difference between Comparative Examples 4-6 and Example 1 is the mass concentration of the accelerator; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Examples 1 and Comparative Examples 4-6, and the results are shown in Table 3.

[0106] Table 3. Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1 and Comparative Examples 4-6.

[0107]

[0108] As shown in Table 3, the environmentally friendly cleaning agent for semiconductor chips without the addition of an accelerator (Comparative Example 4) exhibits poor cleaning efficiency, surface oxidation, poor color, and contamination and residue. Performance test results are unsatisfactory when the accelerator concentration is below 5 g / L (Comparative Example 5) or above 20 g / L (Comparative Example 6). Therefore, the preferred accelerator concentration in the environmentally friendly cleaning agent for semiconductor chips is 5-20 g / L.

[0109] III. Effect of Different Mass Concentrations of Dispersant

[0110] The difference between Comparative Examples 7-9 and Example 1 is the mass concentration of the dispersant; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Examples 1 and Comparative Examples 7-9, and the results are shown in Table 4.

[0111] Table 4. Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1 and Comparative Examples 7-9.

[0112]

[0113]

[0114] As shown in Table 4, when no dispersant is added to the above-mentioned environmentally friendly cleaning agent for semiconductor chips (Comparative Example 7), the cleaning rate is poor, the surface appearance shows oxidation and poor color, and there is contamination and residue. The performance test results are unsatisfactory when the mass concentration of the dispersant is below 0.2 g / L (Comparative Example 8) or above 2 g / L (Comparative Example 9). Therefore, the preferred mass concentration of the dispersant in the environmentally friendly cleaning agent for semiconductor chips is 0.2-2 g / L.

[0115] IV. The Influence of Different Mass Concentrations of Penetrant

[0116] The difference between Comparative Examples 10-12 and Example 1 is the mass concentration of the penetrant; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Examples 1 and 10-12, and the results are shown in Table 5.

[0117] Table 5. Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1 and Comparative Examples 10-12.

[0118]

[0119] As shown in Table 5, when no penetrant is added to the above-mentioned environmentally friendly cleaning agent for semiconductor chips (Comparative Example 10), the cleaning rate is poor, the surface appearance shows oxidation and poor color, and there is contamination and residual adhesive. When the mass concentration of the penetrant is below 5 g / L (Comparative Example 11) or above 15 g / L (Comparative Example 12), the performance test results are unsatisfactory. Therefore, the preferred mass concentration of the penetrant in the environmentally friendly cleaning agent for semiconductor chips is 5-15 g / L.

[0120] V. Effect of different mass ratios of accelerator and dispersant

[0121] The difference between Comparative Examples 13-14 and Example 1 is the mass ratio of accelerator and dispersant; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Examples 1 and 13-14, and the results are shown in Table 6.

[0122] Table 6. Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1 and Comparative Examples 13-14.

[0123]

[0124] As shown in Table 6, when the proportion of dispersant in the mass ratio of accelerator to dispersant in the above-mentioned environmentally friendly cleaning agent for semiconductor chips is small (Comparative Example 13) or large (Comparative Example 14), the performance test results are not ideal. Therefore, the preferred mass ratio of accelerator to dispersant in the environmentally friendly cleaning agent for semiconductor chips is 1:(0.02-0.3).

[0125] VI. Effects of Different Mass Concentrations of Metal Protective Agents

[0126] The difference between Comparative Examples 15-17 and Example 1 is the mass concentration of the metal protectant; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Examples 1 and Comparative Examples 15-17, and the results are shown in Table 7.

[0127] Table 7 Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1 and Comparative Examples 15-17

[0128]

[0129]

[0130] As shown in Table 7, when no metal protectant is added to the above-mentioned environmentally friendly cleaning agent for semiconductor chips (Comparative Example 15), the cleaning rate is poor, the surface appearance shows oxidation and poor color, and there is contamination and residue. The performance test results are unsatisfactory when the mass concentration of the metal protectant is below 0.02 g / L (Comparative Example 16) or above 0.1 g / L (Comparative Example 17). Therefore, the preferred mass concentration of the metal protectant in the environmentally friendly cleaning agent for semiconductor chips is 0.02-0.1 g / L.

[0131] VII. Effects of Different Mass Concentrations of Stripping Agent

[0132] The difference between Comparative Examples 18-20 and Example 1 is the mass concentration of the stripping agent; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Examples 1 and 18-20, and the results are shown in Table 8.

[0133] Table 8 Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1 and Comparative Examples 18-20

[0134]

[0135] As shown in Table 8, when no stripping agent is added to the above-mentioned environmentally friendly cleaning agent for semiconductor chips (Comparative Example 16), the cleaning rate is poor, the surface appearance shows oxidation and poor color, and there is contamination and residual adhesive. When the mass concentration of the stripping agent is below 5 g / L (Comparative Example 19) or above 20 g / L (Comparative Example 20), the performance test results are unsatisfactory. Therefore, the preferred mass concentration of the metal protectant in the environmentally friendly cleaning agent for semiconductor chips is 5-20 g / L.

[0136] 8. Effect of different mass ratios and concentrations of alcohol ethers, organic amines, surfactants, and organic solvents in the stripping agent

[0137] The difference between Comparative Examples 21-22 and Example 1 is the mass ratio of alcohol ethers, organic amines, surfactants, and organic solvents in the stripping agent; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Examples 1 and Comparative Examples 21-22, and the test results are shown in Table 9.

[0138] Table 9. Performance test results of environmentally friendly cleaning agents for semiconductor chips in Examples 1 and Comparative Examples 21-22.

[0139]

[0140] As shown in Table 9, when the mass ratio of alcohol ethers, organic amines, surfactants, and organic solvents in the stripping agent of the environmentally friendly cleaning agent for semiconductor chips is too low (Comparative Example 21) or too high (Comparative Example 22), the performance test results are not ideal. Therefore, the preferred mass ratio of alcohol ethers, organic amines, surfactants, and organic solvents in the stripping agent of the environmentally friendly cleaning agent for semiconductor chips is 1:(0.05-0.3):(0.06-0.25):(1-6).

[0141] IX. Blank Example

[0142] The blank example differs from Example 1 in that the environmentally friendly cleaning agent for semiconductor chips contains only deionized water; all other conditions are the same. Performance tests were conducted on the environmentally friendly cleaning agents for semiconductor chips from Example 1 and the blank example. The test results are shown in Table 10.

[0143] Table 10 Performance test results of environmentally friendly cleaning agents for semiconductor chips in Example 1 and Blank Example.

[0144]

[0145]

[0146] As can be seen from the test results in Table 10, the performance test results of the blank example of the environmentally friendly cleaning agent used for semiconductor chips are very unsatisfactory.

[0147] In summary, this invention provides an environmentally friendly cleaning agent for semiconductor chips, its preparation method, and its application. Without the use of ultrasonic equipment, and under pure immersion conditions, it can efficiently and quickly clean the surface of semiconductor chips, removing any residual substances such as wax and photoresist. The cleaning time is short, it does not corrode or damage metal components, leaving the surface bright and free of oxidation. The cleaning rate reaches over 99.8%, improving quality yield. In this invention's environmentally friendly cleaning agent for semiconductor chips, N,N-diethylformamide (DEF solvent) replaces N-methylpyrrolidone (NMP solvent) and N,N-dimethylformamide (DMF solvent) in the stripping agent, effectively reducing the generation of harmful gases and avoiding environmental pollution. It also has positive significance for green environmental protection, low production costs, and sustainable development.

[0148] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. An environmentally friendly cleaning agent for semiconductor chips, characterized in that, It is prepared from the following components by mass concentration: 8 g / L dodecylpropyl betaine, 10 g / L propylene glycol methyl ether acetate, 0.8 g / L sodium humate, 8 g / L disodium monolaurate sulfosuccinate, 0.04 g / L 2-undecylimidazoline, a mixture of 8 g / L propylene glycol methyl ether acetate, N,N-diethylethanolamine, cocoyl glucoside, and N,N-diethylformamide, with a mass ratio of propylene glycol methyl ether acetate, N,N-diethylethanolamine, cocoyl glucoside, and N,N-diethylformamide of 1:0.1:0.10:2, and the balance being deionized water.

2. The method for preparing the environmentally friendly cleaning agent for semiconductor chips according to claim 1, characterized in that, Includes the following steps: A mixture of propylene glycol methyl ether acetate, N,N-diethylethanolamine, cocoyl glucoside, N,N-diethylformamide, dodecylpropyl betaine, propylene glycol methyl ether acetate, sodium humate, disodium monolaurate sulfosuccinate, 2-undecyl imidazoline, and deionized water was mixed and stirred for 1.5 h in a water bath at 55 °C and a rotation speed of 1500 r / min to obtain the aforementioned environmentally friendly cleaning agent for semiconductor chips.

3. The method for preparing the environmentally friendly cleaning agent for semiconductor chips according to claim 2, characterized in that, The mixture of propylene glycol methyl ether acetate, N,N-diethylethanolamine, cocoyl glucoside, and N,N-diethylformamide is obtained by mixing and stirring propylene glycol methyl ether acetate, N,N-diethylethanolamine, cocoyl glucoside, and N,N-diethylformamide for 20 minutes.

4. A method for cleaning a semiconductor chip, characterized in that, The semiconductor chip is cleaned using the environmentally friendly cleaning agent for semiconductor chips as described in claim 1.

5. The semiconductor chip cleaning method according to claim 4, characterized in that, The cleaning of the semiconductor chip includes the following steps: S1. Prepare an environmentally friendly cleaning solution containing 10% (w / w) of an environmentally friendly cleaning agent for semiconductor chips. Immerse the semiconductor chip in the environmentally friendly cleaning solution at a temperature of 35°C for cleaning. After cleaning for 6 minutes, remove the semiconductor chip. S2. Rinse the semiconductor chip with deionized water at 60℃ 2-3 times, then wipe the surface of the semiconductor chip with a dry cloth to complete the cleaning of the semiconductor chip.

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