Integrated cooling module

Abstract

The present invention relates to an integrated cooling module having an installation space therein and a refrigerant flow channel formed therein, through which components can be installed, refrigerant can flow, and through a central manifold having a connecting hole. By integrating each component around the central manifold, hoses or pipes are eliminated, thereby achieving miniaturization and weight reduction of the entire cooling system.

Description

Technical Field

[0001] This invention relates to an integrated cooling module for use in a vehicle cooling system, and more specifically, to an integrated cooling module comprising a central manifold having: a mounting space in which components can be mounted; a refrigerant flow channel in which refrigerant can flow; and a connecting hole for allowing the components and the refrigerant flow channel to communicate with each other, such that the components are integrated around the central manifold. This integrated cooling module does not include hoses or pipes and achieves miniaturization and weight reduction of the entire cooling system. Background Technology

[0002] In recent years, with increasing interest in energy efficiency and environmental pollution issues, there has been a need to develop environmentally friendly vehicles that can fully replace internal combustion engine vehicles. Environmentally friendly vehicles are generally classified into electric vehicles that operate using fuel cells or electricity as their power source, and hybrid vehicles that operate using both an engine and a battery.

[0003] Unlike air conditioning systems used in conventional vehicles, standalone heaters are not used in environmentally friendly electric or hybrid vehicles. Air conditioning systems used in environmentally friendly vehicles typically refer to heat pump systems.

[0004] Meanwhile, electric vehicles generate power by converting the energy produced by the chemical reaction between oxygen and hydrogen into electrical energy. During this process, heat is generated through the chemical reaction within the fuel cell, so effectively removing this heat is essential to ensure the fuel cell's performance.

[0005] Furthermore, hybrid vehicles generate driving force by operating an engine that uses conventional fuel and a motor that operates using electricity supplied from a fuel cell or battery. Therefore, to ensure motor performance, it is necessary to effectively remove the heat generated from the fuel cell or battery and the motor.

[0006] Therefore, in existing hybrid or electric vehicles, the battery cooling system, along with the cooling system and heat pump system, needs to be constructed as a separate closed loop to prevent overheating of the motor, electrical components, fuel cell, and battery.

[0007] For this reason, there are problems: the size and weight of the cooling module located at the front of the vehicle are increased, and the layout of the connecting pipes used to supply refrigerant or coolant to the heat pump system, cooling device and battery cooling system in the engine compartment is complicated.

[0008] [Related Technical Documents]

[0009] Korean Patent Application Publication No. 2019-0068125 (June 18, 2019) Summary of the Invention

[0010] Technical issues

[0011] The present invention aims to solve the above-mentioned problems, and the object of the present invention is to provide an integrated cooling module including a central manifold having: an installation space in which components can be installed; a refrigerant flow channel in which refrigerant can flow; and a connecting hole for allowing the components and the refrigerant flow channel to communicate with each other, such that the components are integrated around the central manifold. The integrated cooling module does not include hoses or pipes and achieves miniaturization and weight reduction of the entire cooling system.

[0012] Technical solution

[0013] An example of an integrated cooling module according to the invention may include: a central manifold having a mounting space for a mounting component, a plurality of refrigerant flow channels for refrigerant flow, and a communication port for allowing the component and the refrigerant flow channels to communicate with each other; and the component mounted on the central manifold and configured to communicate with at least one of the plurality of refrigerant flow channels, wherein the central manifold defines a cooling circulation loop by connecting the component.

[0014] The plurality of refrigerant flow channels may include refrigerant flow channels with different pressures of the refrigerant flowing within them.

[0015] The refrigerant flow channels, in which the refrigerant flows at different pressures, can be formed at different heights.

[0016] The plurality of refrigerant flow channels may include: one or more upper channels formed on the upper inner side of the central manifold; and one or more lower channels formed on the lower inner side of the central manifold and below the upper channels.

[0017] The pressure of the refrigerant flowing in the upper channel can be higher than the pressure of the refrigerant flowing in the lower channel.

[0018] The temperature of the refrigerant flowing in the upper channel can be higher than the temperature of the refrigerant flowing in the lower channel.

[0019] The upper channel may have a smaller internal cross-sectional area than the lower channel or a larger internal cross-sectional area than the lower channel.

[0020] A reservoir assembly structure can be provided at one end of the central manifold based on the longitudinal direction, and a reservoir can be provided at one end of the central manifold based on the longitudinal direction through the reservoir assembly structure.

[0021] The liquid reservoir assembly structure can be formed into a hollow annular shape.

[0022] The liquid reservoir may include an upper liquid reservoir and a lower liquid reservoir. The upper liquid reservoir may be disposed on the upper part of the liquid reservoir assembly structure and tightly assembled with the liquid reservoir assembly structure, and the lower liquid reservoir may be disposed on the lower part of the liquid reservoir assembly structure and tightly assembled with the liquid reservoir assembly structure.

[0023] The reservoir assembly structure can be integrated with the central manifold.

[0024] A condenser can be installed on one side of the upper part of the central manifold based on the longitudinal direction, an expansion valve can be installed on the other side of the upper part of the central manifold, and a cooler can be installed on the lower part of the central manifold.

[0025] The plurality of refrigerant flow channels may include: a first channel configured to connect the condenser and the receiver; a second channel configured to connect the receiver and the expansion valve; a third channel configured to connect the expansion valve and the cooler; and a fourth channel configured to connect the cooler and the receiver.

[0026] The first channel and the second channel may be formed above the third channel and the fourth channel.

[0027] Both the first channel and the second channel may have a smaller internal cross-sectional area than each of the third channel and the fourth channel.

[0028] In the cooling cycle loop, high-temperature, high-pressure refrigerant can be introduced into the condenser from the outside and discharged as high-temperature, high-pressure liquid refrigerant. The high-temperature, high-pressure liquid refrigerant discharged from the condenser can be introduced into the receiver through the first channel and discharged again. The high-temperature, high-pressure liquid refrigerant discharged from the receiver can be introduced into the expansion valve through the second channel and discharged as low-temperature, low-pressure liquid refrigerant. The low-temperature, low-pressure liquid refrigerant discharged from the expansion valve can be introduced into the cooler through the third channel and discharged as low-temperature, low-pressure gaseous refrigerant. The low-temperature, low-pressure gaseous refrigerant discharged from the cooler can be introduced into the receiver through the fourth channel and discharged again. The low-temperature, low-pressure gaseous refrigerant discharged from the receiver can be discharged to the outside.

[0029] One or more PT sensors connected to the refrigerant flow channel may be disposed on at least one of the front and rear surfaces of the central manifold.

[0030] The central manifold may have mounting bosses disposed in at least some of the communication holes, and the mounting bosses may extend from at least some of the communication holes and protrude to the outside.

[0031] The central manifold can be formed into a long plate shape with a predetermined thickness.

[0032] Beneficial effects

[0033] According to the present invention, the components constituting the cooling system can be integrated around the central manifold, and hoses or pipes can be eliminated, thereby achieving miniaturization and weight reduction of the entire cooling system.

[0034] Furthermore, the mounting structure used to install components in the vehicle can be eliminated, thereby reducing the number of components and assembly processes when constructing the cooling system. Attached Figure Description

[0035] Figure 1 This is a front perspective view of an integrated cooling module according to an example of the present invention.

[0036] Figure 2 yes Figure 1 Rear-view stereoscopic view.

[0037] Figure 3 yes Figure 2 An exploded 3D diagram.

[0038] Figure 4 This is an exploded perspective view of the central manifold of the present invention.

[0039] Figure 5 When viewed from below Figure 4 An exploded 3D diagram.

[0040] Figure 6 and Figure 7 This is a cross-sectional view of the refrigerant flow channel in the central manifold.

[0041] Figure 8 and Figure 9 This is a diagram illustrating a refrigerant circulation loop according to an example of the present invention. Detailed Implementation

[0042] The invention will be described below with reference to the accompanying drawings.

[0043] Figure 1 This is a front perspective view of an integrated cooling module according to an example of the present invention. Figure 2 yes Figure 1 The rear-view stereoscopic view, and Figure 3 yes Figure 2 An exploded perspective view. The integrated cooling module 10 of the present invention broadly includes a central manifold 100 and a plurality of components 200 mounted on the central manifold.

[0044] The present invention relates to an integrated cooling module 10, wherein components 200 are integrated around a central manifold 100. The central manifold 100 has: a mounting space in which a plurality of components 200 may be mounted; a plurality of refrigerant flow channels 110 in which refrigerant may flow; and a plurality of communication holes 120 for allowing the components 200 mounted on the central manifold and the refrigerant flow channels to communicate with each other.

[0045] Component 200 is a component of the vehicle cooling system. In this invention, component 200 may be one or more components selected from the receiver ACCU, condenser COND, expansion valve EXV, chiller, and PT sensor. The receiver ACCU is a liquid separator configured to separate liquid and gaseous refrigerant. The condenser COND is a heat exchanger configured to condense gaseous refrigerant into liquid refrigerant. The expansion valve EXV is a valve configured to reduce the pressure of the liquid refrigerant and evaporate the liquid refrigerant. The chiller is a heat exchanger configured to remove heat from the liquid refrigerant. The PT sensor (pressure / temperature sensor) is a sensor configured to measure the pressure and temperature of the refrigerant.

[0046] Component 200 is mounted on the central manifold 100 and constitutes an integrated cooling module. In this case, component 200 is mounted to communicate with at least one of the plurality of refrigerant flow channels 110 formed in the central manifold 100. More specifically, component 200 is mounted to communicate with a corresponding communication hole in a communication hole 120 formed in the central manifold 100. Finally, component 200 may communicate with the refrigerant flow channel 110.

[0047] Figure 4 This is an exploded perspective view of the central manifold of the present invention, and Figure 5 When viewed from below Figure 4 An exploded perspective view is provided. As shown, the central manifold 100 may have a plurality of mounting bosses 150 extending from the communication hole 120 and protruding to the outside. The component 200 is inserted into and mounted in the mounting bosses 150, such that the component 200 and the refrigerant flow passage 110 can communicate with each other. The mounting bosses 150 may be configured to be manufactured separately from the central manifold 100 and inserted into and sealed in the communication hole 120 formed in the central manifold 100. Alternatively, the mounting bosses 150 may be manufactured integrally with the central manifold 100. The mounting bosses 150, as described above, protruding to the outside, are inserted into the communication portion of the component 200, thereby improving the connectivity and coupling force between the component 200 and the central manifold 100.

[0048] However, in this case, the mounting boss 150 may not be provided in all the communication holes 120 of the central manifold 100. The mounting boss 150 may not be provided in some of the communication holes 120. This configuration can be selectively designed based on the structural features of the component 200 mounted on the central manifold 100. For example, the PT sensor itself has a detection port. Therefore, the mounting boss 150 may not be provided in the communication hole corresponding to the location where the PT sensor is mounted.

[0049] In the following text, reference will be made to Figure 4 and Figure 5 The structure of the central manifold and reservoir used for assembling the present invention is described in more detail.

[0050] The central manifold 100 of the present invention can be formed as a long plate with a predetermined thickness. Because the central manifold 100 is formed as a plate, the upper and lower parts of the central manifold 100 are flat, making it easy to install components on the central manifold 100. Because the central manifold 100 has a predetermined thickness, refrigerant flow channels can be freely formed in the central manifold 100.

[0051] As described above, refrigerant flow channels 110, through which refrigerant flows, can be formed in the central manifold 100. In this case, the refrigerant flow channels may include one or more upper channels formed on the upper inner side of the central manifold, and one or more lower channels formed on the lower inner side of the central manifold. The one or more upper channels may be formed at the same height or at different heights. The one or more lower channels may be formed at the same height or at different heights. In this invention, all upper channels may be formed higher than all lower channels. Furthermore, the internal cross-sectional area of ​​the upper channels may differ from the internal cross-sectional area of ​​the lower channels. That is, the upper channels may be formed to be narrower or wider than the lower channels. Details related to the upper and lower channels will be described below.

[0052] Simultaneously, a receiver assembly structure 190 can be provided at one end of the central manifold 100 in the longitudinal direction. Therefore, the receiver ACCU can be provided at one end of the central manifold 100 in the longitudinal direction. The receiver ACCU is a liquid separator for separating liquid and gaseous refrigerant. The receiver ACCU of the present invention can have an intermediate heat exchanger (tubular IHX) arranged in the form of a pipe. The intermediate heat exchanger IHX can be arranged in the form of a pipe and constructed to be spirally housed within the receiver ACCU. The refrigerant can be separated into liquid and gaseous refrigerant through heat exchange as it flows along the spiral shape.

[0053] In this case, the reservoir assembly structure 190 located on one side of the central manifold 100 can be formed into a hollow annular shape. That is, as... Figure 4 and Figure 5 As shown, the reservoir assembly structure 190 can be disposed on one side of the central manifold 100 in the longitudinal direction and have a thickness equal to that of the central manifold 100. The reservoir assembly structure 190 can protrude from and extend from the central manifold 100 in the longitudinal direction. In this case, the reservoir assembly structure 190 can be constructed as a separate structure manufactured separately from and connected to the central manifold 100. Alternatively, the reservoir assembly structure 190 can be manufactured integrally with and integrated with the central manifold 100.

[0054] In this configuration, the reservoir ACCU comprises an upper reservoir ACCU-Upper and a lower reservoir ACCU-Lower. The upper reservoir ACCU-Upper can be disposed on the upper part of the reservoir assembly structure 190 having an annular shape, and can be tightly assembled with the reservoir assembly structure 190. The lower reservoir ACCU-Lower can be disposed on the lower part of the reservoir assembly structure 190 having an annular shape, and can be tightly assembled with the reservoir assembly structure 190. For example, as a method for tightly assembling the reservoir assembly structure and the upper and lower reservoirs, mechanical fastening methods, such as welding or press fitting, can be used. Alternatively, threads can be formed on the reservoir assembly structure and the upper and lower reservoirs, and the reservoir assembly structure and the upper and lower reservoirs can be assembled via threaded connections.

[0055] As described above, in the case of the ACCU reservoir of the present invention, the reservoir assembly structure 190 can form the central part of the main body of the ACCU reservoir, the upper reservoir ACCU-Upper can form the upper cover of the main body, and the lower reservoir ACCU-Lower can form the lower part and bottom surface of the main body, so that the ACCU reservoir can have a sealed shape therein. In this case, the intermediate heat exchanger IHX with a pipe shape can be accommodated inside the sealed interior of the ACCU reservoir.

[0056] The following describes a specific implementation of the integrated cooling module in which the components are mounted on the central manifold.

[0057] Return to reference Figure 1 and Figure 2The condenser COND can be mounted longitudinally on one side of the upper portion of the central manifold 100, the expansion valve EXV can be mounted on the other side of the upper portion of the central manifold 100, and the chiller can be mounted on the lower portion of the central manifold 100. The expansion valve EXV can be configured as multiple expansion valves EXV1 and EXV2. Both the condenser COND and / or the chiller can be a single heat exchanger component or heat exchanger module comprising multiple heat exchanger components. For example, according to an embodiment of the invention, the condenser COND can be configured as a single chiller, and the chiller can be a chiller module comprising a first chiller (Chiller 1) and a second chiller (Chiller 2). Furthermore, one or more PT sensors connected to the refrigerant flow passage 110 can be disposed on at least one of the front and rear surfaces of the central manifold 100. As described above, the PT sensors can be connected to the refrigerant flow passage 110 by being directly inserted into the communication hole 120 formed in the central manifold.

[0058] The refrigerant flow passage 110 formed in the central manifold 100 will be described in detail below in a specific embodiment in which the component 200 is mounted on the central manifold 100. Figure 6 and Figure 7 This is a cross-sectional view of the refrigerant flow channel in the central manifold. Figure 6 It shows along Figure 4 The cross section intercepted by line AA' in the middle, and Figure 7 It shows along Figure 4 The cross section cut by line BB' in the middle.

[0059] like Figure 6 As shown, in a central manifold with a predetermined thickness, the refrigerant flow channel 110 of the present invention may include a first channel 111 and a second channel 112, which are two channels formed on the upper inner side of the central manifold 100. Figure 7As shown, the refrigerant flow passage 110 may include a third passage 113 and a fourth passage 114, which are two additional passages formed on the lower inner side of the central manifold 100. In the specific connection relationships between passages 111, 112, 113, and 114 and component 200, the first passage 111 may connect the condenser COND and the receiver ACCU; the second passage 112 may connect the receiver ACCU and the expansion valve EXV; the third passage 113 may connect the expansion valve EXV and the chiller; and the fourth passage 114 may connect the chiller and the receiver ACCU. Additionally, the first passage 111 may connect to one side of the intermediate heat exchanger IHX disposed in the receiver ACCU. The second passage 112 may connect to the other side of the intermediate heat exchanger IHX.

[0060] In this configuration, the first channel 111 and the second channel 112 can be formed above the third channel 113 and the fourth channel 114. Furthermore, both the first channel 111 and the second channel 112 can have a smaller internal cross-sectional area than each of the third channel 113 and the fourth channel 114. In this configuration, the first channel 111 and the second channel 112 can be the aforementioned upper channels, and the third channel 113 and the fourth channel 114 can be the aforementioned lower channels.

[0061] As described below, in the cooling cycle loop of the present invention, the refrigerant flowing through the first channel 111 and the second channel 112 has a high temperature and high pressure, while the refrigerant flowing through the third channel 113 and the fourth channel 114 has a low temperature and low pressure. This allows the first channel 111 and the second channel 112 to be separated from the third channel 113 and the fourth channel 114 as upper and lower channels, thereby minimizing their mutual influence. Furthermore, similarly, because the first channel 111 and the second channel 112 allow the refrigerant to form a high-pressure portion, and the third channel 113 and the fourth channel 114 allow the refrigerant to form a low-pressure portion, the first channel 111 and the second channel 112 can be formed to be narrow, and the third channel 113 and the fourth channel 114 can be formed to be wider than the first and second channels, thereby allowing the refrigerant to flow smoothly according to its condition.

[0062] Meanwhile, in the central manifold 100 of the present invention, the refrigerant flow channels including the first channel 111 to the fourth channel 114 can extend to the end of the central manifold, and the channel communication hole 119 can be formed at one end of the central manifold.

[0063] A plug or similar device can be inserted into the channel communication hole 119 to ensure a tight seal in the flow path. Figure 8 and Figure 9This is a diagram illustrating a refrigerant circulation loop according to an example of the present invention. The refrigerant circulation loop of the present invention can be constructed as follows: A high-temperature, high-pressure refrigerant can be introduced from the outside into the condenser COND and, through heat exchange, transforms into a high-temperature, high-pressure liquid refrigerant. Subsequently, the high-temperature, high-pressure liquid refrigerant can be discharged from the condenser COND and introduced into the receiver ACCU through a first channel 111, allowing the gaseous refrigerant to be separated. Subsequently, the high-temperature, high-pressure liquid refrigerant can be discharged from the receiver ACCU and introduced into the expansion valve EXV through a second channel 112, transforming into a low-temperature, low-pressure liquid refrigerant by means of a throttling effect. Subsequently, the low-temperature, low-pressure liquid refrigerant can be discharged from the expansion valve EXV and introduced into the chiller through a third channel 113, transforming into a low-temperature, low-pressure gaseous refrigerant by means of heat exchange. Subsequently, the low-temperature, low-pressure gaseous refrigerant can be discharged from the chiller and introduced into the receiver ACCU through a fourth channel 114, allowing the liquid refrigerant to be separated. Subsequently, the low-temperature, low-pressure gaseous refrigerant can be discharged to the outside from the receiver ACCU. The low-temperature, low-pressure gaseous refrigerant discharged from the receiver ACCU can then circulate through the external cooling system, transforming into a high-temperature, high-pressure refrigerant, and is then reintroduced into the condenser COND.

[0064] According to the integrated cooling module of the present invention, the components constituting the cooling system are integrated via a central manifold to define a cooling circulation loop. Therefore, hoses or pipes can be eliminated through the integration of the components constituting the cooling system, thereby achieving miniaturization and weight reduction of the entire cooling system. Furthermore, mounting structures (brackets, bolts, nuts, etc.) used to install components in the vehicle can be eliminated, which reduces the number of components and assembly processes when constructing the cooling system.

[0065] Furthermore, although not shown separately, other cooling lines of the cooling system, such as coolant lines or third working fluid lines, through which coolant or third working fluid flows, can be additionally formed in the central manifold, and multiple lines of the cooling system can be integrated to further maximize the space efficiency of the vehicle.

[0066] Although embodiments of the invention have been described with reference to the accompanying drawings, those skilled in the art will understand that the invention can be practiced in any other specific form without altering its technical spirit or essential characteristics. Therefore, it should be understood that the above embodiments are illustrative in all respects and do not limit the invention.

[0067] [Explanation of reference numerals and symbols in the attached figures]

[0068] 10: Integrated cooling module

[0069] 100: Central manifold

[0070] 110: Refrigerant Flow Channel

[0071] 111, 112, 113, 114: First Channel, Second Channel, Third Channel, and Fourth Channel

[0072] 120: Connecting hole

[0073] 150: Install boss

[0074] 190: Liquid reservoir assembly structure

[0075] 200: Components

[0076] ACCU: Liquid Storage Unit

[0077] IHX: Intermediate Heat Exchanger

[0078] COND: Condenser

[0079] EXV: Expansion valve

[0080] Chiller: Cooler

[0081] PT Sensor: PT sensor

Claims

1. An integrated cooling module, the integrated cooling module comprising: A central manifold having a mounting space for mounting components, a plurality of refrigerant flow channels for refrigerant flow, and a communication hole for allowing the components and the refrigerant flow channels to communicate with each other; as well as The component mounted on the central manifold and configured to communicate with at least one of the plurality of refrigerant flow channels. The central manifold defines a cooling circulation loop by connecting the components. Specifically, a reservoir assembly structure is provided at one end of the central manifold along the longitudinal direction, and a reservoir is provided at one end of the central manifold via the reservoir assembly structure along the longitudinal direction. The reservoir assembly structure is integrated with the central manifold. A condenser is installed on one side of the upper part of the central manifold along the longitudinal direction, an expansion valve is installed on the other side of the upper part of the central manifold, and a cooler is installed on the lower part of the central manifold. The plurality of refrigerant flow channels include: A first channel, configured to connect the condenser and the liquid reservoir; A second channel is configured to connect the reservoir and the expansion valve; A third channel, configured to connect the expansion valve and the cooler; and A fourth channel, configured to connect the cooler and the reservoir, The first channel is connected to one side of an intermediate heat exchanger located inside the reservoir, and the second channel is connected to the other side of the intermediate heat exchanger.

2. The integrated cooling module according to claim 1, wherein, The plurality of refrigerant flow channels include refrigerant flow channels in which the refrigerant flows at different pressures.

3. The integrated cooling module according to claim 2, wherein, The refrigerant flow channels, with different pressures of the refrigerant flowing within them, are formed at different heights.

4. The integrated cooling module according to claim 1, wherein, The plurality of refrigerant flow channels include: One or more upper channels are formed on the upper inner side of the central manifold; and One or more lower channels are formed inside the lower side of the central manifold and below the upper channel.

5. The integrated cooling module according to claim 4, wherein, The pressure of the refrigerant flowing in the upper channel is higher than the pressure of the refrigerant flowing in the lower channel.

6. The integrated cooling module according to claim 4, wherein, The temperature of the refrigerant flowing in the upper channel is higher than the temperature of the refrigerant flowing in the lower channel.

7. The integrated cooling module according to claim 4, wherein, The upper channel has an internal cross-sectional area that is smaller than or larger than that of the lower channel.

8. The integrated cooling module according to claim 1, wherein, The liquid reservoir assembly structure is formed into a hollow annular shape.

9. The integrated cooling module according to claim 8, wherein, The liquid reservoir includes an upper liquid reservoir and a lower liquid reservoir. The upper liquid reservoir is disposed on the upper part of the liquid reservoir assembly structure and is tightly assembled with the liquid reservoir assembly structure. The lower liquid reservoir is disposed on the lower part of the liquid reservoir assembly structure and is tightly assembled with the liquid reservoir assembly structure.

10. The integrated cooling module according to claim 1, wherein, The first channel and the second channel are formed above the third channel and the fourth channel.

11. The integrated cooling module according to claim 1, wherein, The first channel and the second channel each have a smaller internal cross-sectional area than each of the third channel and the fourth channel.

12. The integrated cooling module according to claim 1, wherein, In the cooling cycle loop, high-temperature, high-pressure refrigerant is introduced into the condenser from the outside and discharged as a high-temperature, high-pressure liquid refrigerant. The high-temperature, high-pressure liquid refrigerant discharged from the condenser is introduced into the receiver through the first channel and discharged again. The high-temperature, high-pressure liquid refrigerant discharged from the receiver is introduced into the expansion valve through the second channel and discharged as a low-temperature, low-pressure liquid refrigerant. The low-temperature, low-pressure liquid refrigerant discharged from the expansion valve is introduced into the cooler through the third channel and discharged as a low-temperature, low-pressure gaseous refrigerant. The low-temperature, low-pressure gaseous refrigerant discharged from the cooler is introduced into the receiver through the fourth channel and discharged again. The low-temperature, low-pressure gaseous refrigerant discharged from the receiver is discharged to the outside.

13. The integrated cooling module according to claim 1, wherein, One or more PT sensors connected to the refrigerant flow channel are disposed on at least one of the front and rear surfaces of the central manifold.

14. The integrated cooling module according to claim 1, wherein, The central manifold has mounting bosses disposed in at least some of the communication holes, and the mounting bosses extend from at least some of the communication holes and protrude to the outside.

15. The integrated cooling module according to claim 1, wherein, The central manifold is formed into a long plate shape with a predetermined thickness.

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