Ghz burst laser source system and method for drilling composites

Abstract

The application discloses a GHz pulse train laser light source system, which comprises a bearing module, a laser generation module, a laser expander, an X-axis laser galvanometer scanning module, an X-axis laser galvanometer controller, a Y-axis laser galvanometer scanning module, a Y-axis laser galvanometer controller and a condenser lens.

Description

TECHNICAL FIELD

[0001] The present application relates to a laser source system, in particular to a GHz pulse train laser source system and method for drilling composite materials. BACKGROUND

[0002] Glass has been an indispensable material in industry, and its potential applications include optical components, microelectronics, microfluidics, and display technology. In recent years, many products have been miniaturized to the micron and nanometer levels, which means that the precision requirements for glass processing will be more stringent than in the past.

[0003] Femtosecond laser is a very important technical breakthrough in recent years. Femtosecond laser refers to a laser pulse width in the order of femtosecond (fs, 10-15 seconds). The laser beam can produce extremely high power density through focusing, and when processing materials, the heat-affected zone is extremely small and can process the inside of transparent materials. Welding is one of the most popular technologies in laser applications, and when drilling or welding with femtosecond laser, there are many advantages, such as no need for prior thermal processing, high spatial resolution, no significant thermal deformation, melting and recrystallization only near the focal point, etc. In addition, compared with traditional drilling or welding, femtosecond laser glass drilling or welding can effectively achieve complete transparency of the welding point, which is absolutely a great leap for glass drilling or welding.

[0004] Therefore, how to use femtosecond laser to improve the processing efficiency of glass drilling or welding has become the direction of the industry. SUMMARY

[0005] The embodiments of the present application provide a GHz pulse train laser source system and method for drilling or welding composite materials to avoid delamination at the drilled hole of the processed composite material and maintain a small heat-affected zone (HAZ), so that any debris and cracks can be avoided at the drilled hole of the processed composite material.

[0006] The embodiment of the present application discloses a GHz pulse train laser source system for drilling or welding composite material, which comprises a bearing module, a laser generation module, a laser beam expander, an X-axis laser galvanometer scanning module, an X-axis laser galvanometer controller, a Y-axis laser galvanometer scanning module, a Y-axis laser galvanometer controller and a condenser. The bearing module is used to bear the composite material. The laser generation module is used to provide a laser beam. The laser beam expander is used to expand the laser spot of the laser beam to generate an expanded laser beam. The X-axis laser galvanometer scanning module is used to reflect the expanded laser beam according to a plurality of X-axis direction rotation angles of the X-axis laser galvanometer scanning module. The X-axis laser galvanometer controller is coupled to the X-axis laser galvanometer scanning module and is used to control the X-axis direction rotation angles of the X-axis laser galvanometer scanning module. The Y-axis laser galvanometer scanning module is used to receive the expanded laser beam reflected from the X-axis laser galvanometer scanning module and reflect the expanded laser beam according to a plurality of Y-axis direction rotation angles of the Y-axis laser galvanometer scanning module. The Y-axis laser galvanometer controller is used to control the Y-axis direction rotation angles of the Y-axis laser galvanometer scanning module. The condenser is used to focus the expanded laser beam reflected from the Y-axis laser galvanometer scanning module into a focused laser beam with a predetermined high aspect ratio, so as to project the focused laser beam to one or more drilled holes of the composite material. The projection path of the focused laser beam is adjusted by the X-axis laser galvanometer scanning module and the Y-axis laser galvanometer scanning module, so that the focused laser beam projected to the one or more drilled holes of the composite material is offset, or the composite material is moved by the bearing module, so that the one or more drilled holes of the composite material are offset. The pulse width of the laser beam is between 50-500 fs, the repetition frequency of the laser beam is between 0.5-10 GHz, and the pulse energy of the laser beam is between 100-1000 μJ. The laser generation module, the laser beam expander, the X-axis laser galvanometer scanning module, the Y-axis laser galvanometer scanning module, the condenser and the bearing module are arranged in the same optical path.

[0007] This invention also discloses a method for drilling or welding composite materials, comprising: S1: providing a laser beam through a laser generation module of a GHz pulse train laser source system; S2: generating a focused laser beam based on the laser beam through a laser beam expander, an X-axis laser galvanometer scanning module, a Y-axis laser galvanometer scanning module, and a condenser lens of the GHz pulse train laser source system; S3: projecting the focused laser beam onto one or more drilled holes in the composite material on a support module; S4: melting (ablation) the surface of one or more drilled holes when the focused laser beam contacts the surface of one or more drilled holes; S5: after the focused laser beam has melted the surface, the focused laser beam is incident on the inner wall of one or more drilled holes in the composite material and smooths it; S6: effectively removing a portion of the composite material based on multiple laser parameters of the focused laser beam, thereby creating one or more drilled holes in one or more drilled holes. The laser beam pulse width is between 50 and 500 fs, the laser beam repetition frequency is between 0.5 and 10 GHz, and the laser beam pulse energy is between 100 and 1000 μJ. The laser generation module, laser beam expander, X-axis laser galvanometer scanning module, Y-axis laser galvanometer scanning module, condenser lens, and carrier module are arranged in the same optical path.

[0008] In summary, the GHz burst laser source system and method disclosed in this invention utilize a GHz burst laser beam with a pulse width between 50 and 500 fs to drill or weld holes in composite materials, thereby preventing delamination at the drilled holes and maintaining a small HAZ (Hyperzone Area). Furthermore, because the HAZ of the processed composite material is small, any debris and cracks can be avoided at the drilled holes.

[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0010] Figure 1 A schematic diagram of a GHz pulse train laser source system for drilling or welding composite materials according to an embodiment of the present invention is shown.

[0011] Figure 2A A schematic diagram of the laser generation module is shown.

[0012] Figure 2B A schematic diagram illustrating the structure of multiple pulse trains of a laser beam.

[0013] Figure 3 A schematic diagram illustrating the drilling method of a focused laser beam.

[0014] Figure 4 Drawing for Figure 1 , 3 The flowchart of the drilling method.

[0015] Figure 5 Drawing and utilization Figure 3 A schematic diagram of the machining results using the drilling method.

[0016] Figure 6 Drawing and utilization Figure 3 A schematic diagram of the processing results of composite materials using the drilling method. Detailed Implementation

[0017] The following specific embodiments illustrate the implementation of the "GHz pulse train laser source system and method for drilling composite materials" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0018] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0019] Please see Figure 1The diagram illustrates a schematic of a GHz burst laser source system D1 for drilling or welding composite materials according to an embodiment of the present invention. The GHz burst laser source system D1 includes a laser generation module 102, a laser beam expander 104, an X-axis laser galvanometer scanning module 106, an X-axis laser galvanometer controller 108, a Y-axis laser galvanometer scanning module 110, a Y-axis laser galvanometer controller 112, a condenser lens 114, and a support module 116. The laser generation module 102, laser beam expander 104, X-axis laser galvanometer scanning module 106, Y-axis laser galvanometer scanning module 110, condenser lens 114, and support module 116 are arranged along the same optical path, but the present invention is not limited thereto. It is worth noting that, for example, in another feasible embodiment, the GHz burst laser source system D1 includes a laser generation module 102, a collimation module 104, a laser adjustment module (not shown), a condenser lens 114, and a support module 116. The laser generating module 102, collimation module 104, laser adjustment module, condenser lens 114 and carrier module 116 are arranged in the same optical path, but the present invention is not limited thereto.

[0020] Please see Figure 2A The diagram illustrates the structure of the laser generation module 102. The laser generation module 102 includes a pulsed laser generation module 1022, an acousto-optic modulator (AOM) 1024, and a laser amplifier 1026. The pulsed laser generation module 1022 generates a laser source Ls with multiple pulse signals P1-Pn. The acousto-optic modulator (AOM) 1024 is located adjacent to the pulsed laser generation module 1022 and is used to increase the repetition frequency of the laser source Ls, thereby generating a pulsed laser Lb with multiple bursts based on the increased laser source Ls. Laser amplifier 1026 is located adjacent to acousto-optic modulator 1024 and is used to increase the pulse energy of pulse train laser Lb to generate laser beam L1, wherein the repetition frequency of pulse train laser Lb is between 0.5 and 10 GHz (e.g., any positive integer between 0.5 and 10 GHz), and the pulse energy of laser beam L1 is between 100 and 1000 μJ (e.g., any positive integer between 10 and 30 mJ), but the invention is not limited thereto.

[0021] Please see Figure 2B The diagram illustrates the structure of multiple pulse trains B1-Bn of the laser beam L1. Figure 2BIt is understood that these pulse trains B1-Bn include multiple pulse signals P1-Pn, that is, multiple pulse signals P1 form pulse train B1, multiple pulse signals P2 form pulse train B2, ..., multiple pulse signals Pn form pulse train Bn, so that these pulse trains B1-Bn respectively form multiple pulse signals P1-Pn. The pulse width of these pulse signals P1-Pn is between 50 and 500 fs (e.g., any positive integer between 50 and 500 fs), the number of these pulse signals P1-Pn is between 50 and 1000 (e.g., any positive integer between 50 and 1000), and the frequency of these pulse signals P1-Pn is between 1 and 2000 kHz (e.g., any positive integer between 1 and 2000 kHz), but the present invention is not limited thereto.

[0022] Please see Figure 1 , 2A 2B, Laser generating module 102 is used to provide laser beam L1. Laser beam expander 104 is adjacent to laser generating module 102 and is used to expand a laser spot of laser beam L1 to generate an expanded laser beam L2. Laser beam L1 can be adjusted by laser generating module 102. The pulse width of laser beam L1 (i.e., the pulse width of the pulse signals P1-Pn) is between 50 and 500 fs (e.g., any positive integer between 50 and 500 fs), and the repetition frequency of laser beam L1 (i.e., the repetition frequency of the pulse train laser Lb) is between 0.5 and 10 GHz (e.g., any positive integer between 0.5 and 10 GHz). The average power of laser beam L1 is determined based on the pulse energy and the repetition frequency, but the invention is not limited thereto.

[0023] It is worth noting that the pulse width, pulse energy, frequency, repetition frequency, and number of pulse signals P1-Pn of the laser beam L1 can be adjusted appropriately according to individual needs. For example, if the pulse energy of the laser beam L1 used for drilling or welding composite materials is high, the repetition frequency of the laser beam L1 can be adjusted to a lower frequency. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0024] Furthermore, it is worth noting that if the pulse width, pulse energy, frequency, repetition frequency, and number of pulse signals P1-Pn of the laser beam L1 used for drilling or welding composite materials are below the aforementioned predetermined range, the laser beam will have difficulty drilling or welding the composite material. Conversely, if these parameters exceed the aforementioned predetermined range, cracks are likely to occur at the drilled hole in the composite material. For example, if the pulse width of the laser beam L1 used for drilling or welding composite materials is 600 fs, cracks are likely to occur at the drilled hole in the composite material. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0025] The X-axis laser galvanometer scanning module 106 is located adjacent to the laser beam expander 104 and is used to reflect and expand the laser beam L2 according to multiple X-axis rotation angles (e.g., 0°, 30°, 60°, ...) (not shown). That is, the X-axis laser galvanometer scanning module 106 rotates to generate multiple rotation angles in the X-axis direction, so that the X-axis laser galvanometer scanning module 106 expands the laser beam L2 by mirror reflection at different angles.

[0026] The X-axis laser galvanometer controller 108 is coupled to the X-axis laser galvanometer scanning module 106 and is used to control the rotation angles of the X-axis laser galvanometer scanning module 106 in certain X-axis directions. For example, the X-axis laser galvanometer controller 108 can drive the X-axis laser galvanometer scanning module 106 to rotate according to control commands, so that the X-axis laser galvanometer scanning module 106 generates multiple rotation angles in a specific X-axis direction. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0027] The Y-axis laser galvanometer scanning module 110 is adjacent to the X-axis laser galvanometer scanning module 106 and is used to receive the amplified laser beam L2 reflected from the X-axis laser galvanometer scanning module 106. The amplified laser beam L2 is reflected according to multiple rotation angles in the Y-axis direction of the Y-axis laser galvanometer scanning module 110. That is, the Y-axis laser galvanometer scanning module 110 rotates to generate multiple rotation angles in the Y-axis direction, so that the Y-axis laser galvanometer scanning module 110 amplifies the laser beam L2 by mirror reflection at different angles.

[0028] The Y-axis laser galvanometer controller 112 is coupled to the Y-axis laser galvanometer scanning module 110 and is used to control the rotation angles of the Y-axis laser galvanometer scanning module 110 in certain Y-axis directions. For example, the Y-axis laser galvanometer controller 112 can drive the Y-axis laser galvanometer scanning module 110 to rotate according to control commands, so that the Y-axis laser galvanometer scanning module 110 generates multiple rotation angles in a specific Y-axis direction. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0029] Specifically, the user can input control commands to the X-axis laser galvanometer controller 108 and the Y-axis laser galvanometer controller 112 according to drilling requirements. The X-axis laser galvanometer controller 108 and the Y-axis laser galvanometer controller 112 then send corresponding drive commands to the X-axis laser galvanometer scanning module 106 and the Y-axis laser galvanometer scanning module 110, respectively. This causes the X-axis laser galvanometer scanning module 106 and the Y-axis laser galvanometer scanning module 110 to rotate according to their respective drive commands, generating multiple rotation angles in specific X-axis and Y-axis directions. This allows the X-axis laser galvanometer scanning module 106 and the Y-axis laser galvanometer scanning module 110 to amplify the laser beam L2 through mirror reflection at different angles according to drilling requirements. However, the above example is only one feasible embodiment and is not intended to limit the invention.

[0030] The carrier module 116 is used to carry the composite material 118. A condenser lens 114 is adjacent to the Y-axis laser galvanometer scanning module 110 and is used to focus the amplified laser beam L2 reflected from the Y-axis laser galvanometer scanning module 110 into a focused laser beam L3 with a predetermined high aspect ratio, so as to project the focused laser beam L3 onto one or more drilled holes 120 in the composite material 118. The composite material 118 has a thickness of 50–1000 μm and includes at least two substrates prepared for drilling. Each substrate is a glass, a metal, a ceramic, or a semiconductor wafer, but the invention is not limited thereto.

[0031] Specifically, the projection path of the focused laser beam L3 can be adjusted by the X-axis laser galvanometer scanning module 106 and the Y-axis laser galvanometer scanning module 110, so that the focused laser beam L3 projected onto one or more drilled holes 120 of the composite material 118 is deflected at a deflection speed V. That is, the focused laser beam L3 is projected onto one or more drilled holes 120 of the composite material 118 at a deflection speed V. In one embodiment, the composite material 118 can be deflected at a deflection speed V by moving the support module 116 (for example, the support module 116 can move along the X-axis or Y-axis direction on a horizontal plane). That is, the support module 116 is deflected parallel at a deflection speed V, thereby causing one or more drilled holes 120 of the composite material 118 to be deflected at a deflection speed V. The deflection speed V of the focused laser beam L3 is determined according to the repetition frequency of the laser beam L1, but the present invention is not limited thereto.

[0032] Therefore, by adjusting the X-axis laser galvanometer scanning module 106 and the Y-axis laser galvanometer scanning module 110, or by moving the support module 116, the focused laser beam L3 is projected onto the drilling location 120 of the composite material 118 for drilling. For details regarding the drilling method of the focused laser beam L3 on the composite material 118, please refer to the following text. Figure 3 A detailed explanation.

[0033] Please see Figure 3The diagram illustrates the drilling method of the focused laser beam L3. First, the focused laser beam L3 is projected onto one or more drilled holes 120 on the composite material 118 of the support module 116. When the focused laser beam L3 contacts the surface 122 of the drilled holes 120, it melts (ablation) the surface 122. Then, after the focused laser beam L3 has completely melted the surface 122, it is incident on the inner wall 124 of the drilled holes 120 of the composite material 118 and smooths it. Finally, based on the focused laser beam... Multiple laser parameters of beam L3 are used to effectively remove a portion of the composite material, thereby creating one or more drill holes 126 at one or more drill points 120. The process by which the focused laser beam L3 melts from the surface 122 to the inner wall 124 is called a preheating phenomenon. The multiple laser parameters include the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the number of multiple pulse signals P1-Pn of the multiple pulse trains B1-Bn of the laser beam L1, the repetition frequency of the laser beam L1, and the frequency of the multiple pulse signals P1-Pn. In addition, during the process of the focused laser beam L3 melting the inner wall 124, the focused laser beam L3 undergoes reflection under grazing incidence and multiple scattering at the inner wall 124. The focused laser beam L3 loses some energy with each reflection, causing the drilling energy to decrease with the increase of drilling depth, eventually reaching saturation at the drilling depth.

[0034] Specifically, when the bottom influence of the focused laser beam L3 falls below a melting threshold, melting of the inner wall 124 is stopped. The bottom influence can be defined as the energy density of the composite material melted by the laser beam; energy density refers to the energy density of the laser beam per square unit of joules (J / cm²). 2 The melting threshold can be adjusted based on the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the number of multiple pulse signals P1-Pn of multiple pulse trains B1-Bn of the laser beam L1, the repetition frequency of the laser beam L1, and the frequency of the multiple pulse signals P1-Pn, but the present invention is not limited thereto.

[0035] Please see Figure 4 Its drawing is used for Figure 1 , 3The flowchart of the drilling method includes: Step S1: Providing a laser beam L1 through the laser generation module 102 of the GHz pulse train laser source system D1; Step S2: Generating a focused laser beam L3 based on the laser beam L1 through the laser beam expander 104, X-axis laser galvanometer scanning module 106, Y-axis laser galvanometer scanning module 110, and condenser lens 114 of the GHz pulse train laser source system D1; Step S3: Projecting the focused laser beam L3 onto one or more drilling locations 120 of the composite material 118 on the support module 116; Step S4 Step S5: When the focused laser beam L3 contacts the surface 122 of one or more drill holes 120, the focused laser beam L3 melts (ablation) the surface 122; Step S6: When the focused laser beam L3 has melted the surface 122, the focused laser beam L3 is incident on the inner wall 124 of one or more drill holes 120 of the composite material 118 and smooths it; Step S7: According to multiple laser parameters of the focused laser beam L3, a portion of the composite material is effectively removed, thereby creating one or more drill holes 126 in one or more drill holes 120.

[0036] Please see Figure 5 Its drawing uses Figure 3 A schematic diagram of the machining results using the drilling method. (From...) Figure 5 It is understood that the drill holes 126 at one or more drill points 120 are cylindrical holes with a fixed diameter. The inner wall of the drill holes 126 is a smooth surface. The depth of the drill holes 126 is determined by the number of pulse trains and the energy density, and the depth of the drill holes 126 varies linearly. The diameter of the drill holes 126 is between 20 and 40 μm, the depth is between 70 and 295 μm, and the smoothness (Rz) of the inner wall of the drill holes 126 is between 100 and 5000 nm (ten-point average roughness Rz), but the present invention is not limited thereto.

[0037] Please see Figure 6 Its drawing uses Figure 3 A schematic diagram of the processing results of composite material 118 using the drilling method. (From...) Figure 6 It can be seen that, through Figure 3The drilling method ensures that no delamination occurs at one or more drilled holes 120 in the processed composite material 118, and a small heat-affected zone (HAZ) is maintained. Therefore, the processed composite material 118 and its surface 122 are undamaged, and the measured electrical properties are normal. Furthermore, due to the small HAZ of the processed composite material 118, any debris and cracks can be avoided at one or more drilled holes 120 in the processed composite material 118.

[0038] Therefore, the GHz pulse train laser source system D1 of the present invention uses a laser beam L1 with a GHz pulse train (burst) having a pulse width between 50 and 500 fs to drill or weld one or more drilled holes 120 in the composite material 118, thereby avoiding delamination at one or more drilled holes 120 in the processed composite material 118 and maintaining a small HAZ. Furthermore, because the HAZ of the processed composite material 118 is small, any debris and cracks can be avoided at one or more drilled holes 120 in the processed composite material 118.

[0039] It is worth mentioning that the implementation of the GHz pulse train laser source system D1 for welding composite materials of the present invention can be clearly understood through the above specific embodiments, as well as the advantages and effects of the present invention. However, the present invention is not limited to the examples given above.

[0040] In summary, the GHz burst laser source system and method disclosed in this invention utilize a GHz burst laser beam with a pulse width between 50 and 500 fs to drill or weld holes in composite materials, thereby preventing delamination at the drilled holes and maintaining a small HAZ (Hyperzone Area). Furthermore, because the HAZ of the processed composite material is small, any debris and cracks can be avoided at the drilled holes.

[0041] Furthermore, the GHz pulse train laser source system and method provided by this invention can be used for drilling or welding composite materials such as glass-to-glass, glass-to-metal, glass-to-ceramic, and glass-to-silicon wafers, and can be applied to 5G power components using third-generation semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC).

[0042] Furthermore, the composite materials used in this invention (e.g., glass) have advantages such as low electromagnetic signal shielding, high hardness, low cost, and light weight, which have led to their gradual adoption as materials for 3C panels and camera modules in recent years. Therefore, the value of using femtosecond lasers for glass drilling or welding in this invention is correspondingly increased, processing efficiency is improved, and economic costs are reduced, thus showing broad prospects.

[0043] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. A GHz burst laser source system for drilling of composite materials, characterized by, The GHz pulse train laser source system comprises: a carrying module for carrying the composite material; a laser generating module for providing a laser beam; a laser beam expander for expanding a laser spot of the laser beam to generate an expanded laser beam; an X-axis laser galvanometer scanning module for reflecting the expanded laser beam according to a plurality of X-axis direction rotation angles of the X-axis laser galvanometer scanning module; an X-axis laser galvanometer controller coupled to the X-axis laser galvanometer scanning module and configured to control the X-axis direction rotation angles of the X-axis laser galvanometer scanning module; a Y-axis laser galvanometer scanning module for receiving the expanded laser beam reflected from the X-axis laser galvanometer scanning module and reflecting the expanded laser beam according to a plurality of Y-axis direction rotation angles of the Y-axis laser galvanometer scanning module; a Y-axis laser galvanometer controller configured to control the Y-axis direction rotation angles of the Y-axis laser galvanometer scanning module; and a condenser for focusing the expanded laser beam reflected from the Y-axis laser galvanometer scanning module into a focused laser beam with a predetermined height-to-depth ratio, so as to project the focused laser beam to one or more drilled holes of the composite material; wherein the projection path of the focused laser beam is adjusted by the X-axis laser galvanometer scanning module and the Y-axis laser galvanometer scanning module, so that the focused laser beam projected to the one or more drilled holes of the composite material is offset, or the composite material is moved by the carrying module, so that the one or more drilled holes of the composite material are offset; wherein the pulse width of the laser beam is between 50-500 fs, the repetition frequency of the laser beam is between 0.5-10 GHz, and the pulse energy of the laser beam is between 100-1000 μJ, the laser generating module, the laser beam expander, the X-axis laser galvanometer scanning module, the Y-axis laser galvanometer scanning module, the condenser, and the carrying module are arranged in the same optical path; wherein the laser generating module comprises a pulse laser generating module, an acousto-optic modulator adjacent to the pulse laser generating module, and a laser amplifier adjacent to the acousto-optic modulator; wherein the pulse laser generating module is configured to generate a laser source; wherein the acousto-optic modulator is configured to increase the repetition frequency of the laser source and to generate a pulse train laser with a plurality of pulse trains according to the laser source with the increased repetition frequency; wherein the laser amplifier is configured to generate the laser beam by increasing the pulse energy of the pulse train laser; wherein each pulse train of the pulse train laser comprises a plurality of pulse signals, the number of pulse signals of each pulse train is between 50-1000, the pulse width of the pulse signals of each pulse train is between 50-500 fs, and the frequency of the pulse signals of each pulse train is between 1-2000 KHz.

2. The GHz-pulse train laser source system of claim 1, wherein, The focused laser beam is projected to the one or more drilling holes of the composite material at an offset speed, the carrier module is offset at the offset speed, the one or more drilling holes include one or more drilling holes, the one or more drilling holes are cylindrical holes, the one or more drilling holes have a fixed hole diameter, the inner wall of the one or more drilling holes is a smooth wall, the depth of the one or more drilling holes is determined according to a pulse train number and an energy density, the hole diameter is between 20-40 µm, the depth of the one or more drilling holes is between 70-295 µm, and the smoothness of the inner wall of the one or more drilling holes is between 100-5000 nm.

3. The GHz-pulse train laser source system of claim 2, wherein, The offset speed of the focused laser beam is determined according to the repetition frequency, and an average power of the laser beam is determined according to the pulse energy and the repetition frequency.

4. The GHz-pulse train laser source system of claim 1, wherein, The thickness of the composite material is 50-1000 µm, and includes at least two substrates prepared for drilling, each of the substrates being a glass, a metal, a ceramic, or a semiconductor wafer.

5. A method for drilling a composite material, characterized in that, The method for drilling a composite material includes: S1: providing a laser beam by a laser generation module of a GHz pulse train laser source system; S2: generating a focused laser beam according to the laser beam by a laser beam expander, an X-axis laser galvanometer scanning module, a Y-axis laser galvanometer scanning module, and a condenser lens of the GHz pulse train laser source system; S3: projecting the focused laser beam to one or more drilling holes of a composite material on a carrier module; S4: melting a surface of the one or more drilling holes by the focused laser beam when the focused laser beam contacts the surface; S5: when the focused laser beam melts the surface, the focused laser beam is incident to an inner wall of the one or more drilling holes of the composite material and smoothes the inner wall; and S6: removing a portion of the composite material according to a plurality of laser parameters of the focused laser beam, thereby generating one or more drilling holes at the one or more drilling holes; wherein a pulse width of the laser beam is between 50-500 fs, a repetition frequency of the laser beam is between 0.5-10 GHz, and a pulse energy of the laser beam is between 100-1000 µJ, the laser generation module, the laser beam expander, the X-axis laser galvanometer scanning module, the Y-axis laser galvanometer scanning module, the condenser lens, and the carrier module are disposed in the same optical path; wherein the laser generation module includes a pulse laser generation module, an acousto-optic modulator adjacent to the pulse laser generation module, and a laser amplifier adjacent to the acousto-optic modulator; wherein the pulse laser generation module is configured to generate a laser source; wherein the acousto-optic modulator is configured to increase the repetition frequency of the laser source and to generate a pulse train laser with a plurality of pulse trains according to the laser source after increasing the repetition frequency; wherein the laser amplifier is configured to generate the laser beam by increasing the pulse energy of the pulse train laser; Each of the pulse trains includes a plurality of pulse signals, the number of the pulse signals of each of the pulse trains is between 50 and 1000, the pulse width of the pulse signals of each of the pulse trains is between 50 and 500 fs, and the frequency of the pulse signals of each of the pulse trains is between 1 and 2000 KHz.

6. The method for drilling a composite material according to claim 5, characterized in that, The focused laser beam is projected to the one or more drilled holes of the composite material at a displacement speed, the carrier module is displaced at the displacement speed, the one or more drilled holes are cylindrical holes, the one or more drilled holes have a hole diameter, the inner wall of the one or more drilled holes is a smooth wall, the depth of the one or more drilled holes is determined according to a pulse train number and an energy density, the hole diameter is between 20 and 40 µm, the depth of the one or more drilled holes is between 70 and 295 µm, and the smoothness of the inner wall of the one or more drilled holes is between 100 and 5000 nm.

7. The method for drilling a hole in a composite material according to claim 6, characterized in that, The displacement speed of the focused laser beam is determined according to the repetition frequency, and an average power of the laser beam is determined according to the pulse energy and the repetition frequency.

8. The method for drilling a composite material according to claim 5, characterized in that, The thickness of the composite material is between 50 and 1000 µm, and the composite material includes at least two substrates to be drilled, each of the substrates is a glass, a metal, a ceramic, or a semiconductor wafer.

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