A 5G flexible circuit board back glue process without knife marks for roll materials

Abstract

The present invention discloses a 5G non-flexible circuit board back glue non-knife mark coiling process. This process generally includes the following steps: laminating the component materials of the product; performing the first punching to process the non-glue handle area of the product and discharging waste; performing the second punching to process the outer shape of the product and discharging waste; trimming the product; and coiling the product. The 5G non-flexible circuit board back glue non-knife mark coiling process in the present invention cooperates with a high-speed register die cutting machine to process the product, reducing the traditional four processing procedures of non-knife mark coiling to two processing procedures, and can process products with different materials and outer shapes but the same structure, solving the problems of long processing procedures and high processing costs in conventional stamping processing.

Description

Technical Field

[0001] The present invention relates to the field of coil material processing, and particularly to a 5G flexible circuit board back glue knife-free coil material process. Background Art

[0002] When processing some coil materials, such as 5G flexible circuit board back glue, etc., stamping is generally carried out using equipment. Since the materials and shapes of different types of products are different, when stamping multiple products, the equipment needs to be frequently operated. To achieve knife-free coil material processing, generally at least four processes are required, resulting in a long processing process and high processing costs. Summary of the Invention

[0003] To solve the above problems, the present invention provides a 5G flexible circuit board back glue knife-free coil material process.

[0004] According to one aspect of the present invention, there is provided a 5G flexible circuit board back glue knife-free coil material process, including the following steps:

[0005] 1) Bond a layer of transparent protective film on the bottom protective film, and then bond a layer of blue release film and a layer of transparent release film on the transparent protective film. Among them, the non-release surfaces of the blue release film and the transparent release film are bonded to the transparent protective film.

[0006] 2) Bond a layer of double-sided tape on the release surfaces of the blue release film and the transparent release film, and then bond a layer of matte release film on the double-sided tape;

[0007] 3) Perform the first punching, cut out one side of the double-sided tape, and punch through to the transparent protective film on both sides;

[0008] 4) Exclude the bottom protective film and the waste generated by the first punching;

[0009] 5) Perform the second punching, punch through to the blue release film, and cut out the product shape.

[0010] 6) Exclude the matte release film and the waste generated by the second punching;

[0011] 7) Bond a layer of transparent tape release film on the double-sided tape, and use a jig to slit the transparent tape release film for trimming work;

[0012] 8) Peel off the transparent protective film and wind up the product.

[0013] In some embodiments, in step 1), the blue release film is attached to one side of the transparent protective film, and one end of the transparent release film is attached to the other side of the transparent protective film, and the other end is attached to the blue release film. The advantage is that it further describes the situation where the blue release film and the transparent release film are attached to the transparent protective film.

[0014] In some embodiments, in step 2), the double-sided adhesive is attached only to some release surfaces of the blue release film and the transparent release film. The advantage is that it describes some selective situations when attaching the double-sided adhesive.

[0015] In some embodiments, in steps 3) and 5), a high-speed nesting die-cutting machine is used in cooperation with an engraved die for punching. The advantage is that it describes the equipment used for punching.

[0016] In some embodiments, in step 3), the blue release film is also punched. The advantage is that the punching situation can be set as needed.

[0017] In some embodiments, in step 4), the waste materials generated by the first punching are the two side edge parts of the transparent protective film and the blue release film, which are only connected to the bottom protective film. The advantage is that it describes the concept of the waste materials generated by the first punching.

[0018] In some embodiments, in step 6), the waste materials generated by the second punching are the two side edge parts where the blue release film is located, which are only connected to the transparent protective film. The advantage is that it describes the concept of the waste materials generated by the second punching.

[0019] In some embodiments, in step 6), a waste discharging tape is first attached to the matte release film and the blue release film, and then the waste discharging tape, the matte release film, and the waste materials generated by the second punching are removed together. The advantage is that it describes the specific method for removing the matte release film and the waste materials generated by the second punching.

[0020] In some embodiments, in step 7), the edge tolerance of the product to the transparent tape release film is not greater than ±0.1 mm. The advantage is that it describes the dimensional requirements of the product.

[0021] In some embodiments, in step 8), the transparent protective film is peeled off by using the peeling knife on the fixture. The advantage is that it describes the specific method for peeling off the transparent protective film. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a sectional view of material attachment of a 5G flexible circuit board back adhesive without knife marks roll stock process according to an embodiment of the present invention;

[0023] Figure 2 The Figure 1 sectional view of the first punching of the material shown;

[0024] Figure 3 The Figure 2 sectional view of the second punching of the material shown.

[0025] In the figure: the bottom protection film 1, the transparent protection film 2, the blue release film 3, the transparent release film 4, the double-sided adhesive 5, the matte release film 6. Specific implementation manner

[0026] The present invention will be further described in detail below with reference to the accompanying drawings.

[0027] This process is used to process coiled materials such as the back glue of 5G flexible circuit boards, and it includes several main steps, which are described as follows.

[0028] The first step is, as Figure 1 shown, to laminate a transparent protection film 2 on the bottom protection film 1, and then laminate a blue release film 3 and a transparent release film 4 on the transparent protection film 2. Among them, the non-release surfaces of the blue release film 3 and the transparent release film 4 are laminated on the transparent protection film 2.

[0029] The width of the blue release film 3 is narrower than that of the transparent protection film 2, and it is laminated on one side of the transparent protection film 2. One end of the transparent release film 4 is laminated on the other side of the transparent protection film 2, and the other end is laminated on the blue release film 3.

[0030] The second step is to laminate a layer of TESA61360 double-sided adhesive 5 on the release surfaces of the blue release film 3 and the transparent release film 4. Then, remove the release paper of the double-sided adhesive 5, and laminate a matte release film 6 on the double-sided adhesive 5.

[0031] Among them, according to needs, the double-sided adhesive 5 can be laminated only on a part of the release surfaces of the blue release film 3 and the transparent release film 4. At this time, the part outside the double-sided adhesive 5 forms a non-adhesive handle area.

[0032] The third step is, as Figure 2 shown, to use a high-speed register die-cutting machine and cooperate with an engraved die to perform the first punching on the above product. In the figure, the vertical line shows the punching depth.

[0033] Among them, in the first punching, in the middle part, one side of the double-sided adhesive 5 is cut out, and in the two side parts, it is punched to the transparent protection film 2, that is, the non-adhesive handle area is punched. At this time, the two side edge parts of the transparent protection film 2 and the blue release film 3 become waste materials that are only connected to the bottom protection film 1.

[0034] In addition, in the first punching, the blue release film 3 can also be punched according to needs.

[0035] Step 4: Remove the bottom protection film 1 and the waste materials generated from the first die-cutting connected thereto.

[0036] Step 5: As Figure 3 shown, use a high-speed nesting die-cutting machine and cooperate with an engraving die to perform a second die-cutting on the above product. In the figure, the vertical line shows the depth of the die-cutting.

[0037] Among them, in the second die-cutting, die-cut to the blue release film 3 and cut out the outer shape of the product, so that the two side edge parts of the blue release film 3 become waste materials only connected to the transparent protection film 2.

[0038] Step 6: Use a laminating machine to laminate a waste discharging tape on the matte release film 6 and the blue release film 3, and then discharge the waste discharging tape, the matte release film 6 and the waste materials generated from the second die-cutting together.

[0039] Step 7: Laminate a transparent tape release film on the double-sided adhesive 5, and use a jig to slit the transparent tape release film, thereby completing the trimming work of the product. Among them, when slitting, ensure that the edge tolerance of the product to the transparent tape release film is not greater than ±0.1 mm.

[0040] Step 8: Use the peeling knife on the jig to peel off the transparent protection film 2, and then wind up the product to complete the processing.

[0041] In summary, a 5G flexible circuit board back glue knife-free roll material process in the present invention cooperates with a high-speed nesting die-cutting machine, uses an engraving die to perform die-cutting processing on the product, reduces the traditional four processing procedures of the knife-free roll material to two processing procedures. The first processing is the glue-free handle area of the product, the second processing is the outer shape of the product, and the product tape is trimmed by using a jig. And this process can also process products with different materials, different shapes but generally the same overall structure, thus solving the problems of long processing procedures and high processing costs in conventional stamping processing.

[0042] The above are only some embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention.

Claims

1. A 5G flexible circuit board back adhesive process without knife marks for roll materials, characterized in that: Including the following steps 1) Bond a layer of transparent protective film on the bottom protective film, and then bond a layer of blue release film and a layer of transparent release film on the transparent protective film. Among them, bond the non-release surfaces of the blue release film and the transparent release film on the transparent protective film; 2) Bond a layer of double-sided tape on the release surfaces of the blue release film and the transparent release film, and then bond a layer of matte release film on the double-sided tape; 3) Conduct the first die-cutting, cut out one side of the double-sided tape, and die-cut to the transparent protective film on both sides; 4) Exclude the bottom protective film and the waste materials generated by the first die-cutting; 5) Conduct the second die-cutting, die-cut to the blue release film, and cut out the product shape; 6) Exclude the matte release film and the waste materials generated by the second die-cutting; 7) Bond a layer of transparent tape release film on the double-sided tape, and use a jig to slit the transparent tape release film to perform the trimming work; 8) Peel off the transparent protective film and wind up the product.

2. The 5G flexible circuit board back glue knife-free roll stock process according to claim 1, characterized in that: In step 1), the blue release film is bonded on one side of the transparent protective film, and one end of the transparent release film is bonded on the other side of the transparent protective film, and the other end is bonded on the blue release film.

3. A 5G flexible circuit board back glue without knife mark roll material process according to claim 1, characterized in that: In step 2), bond the double-sided tape only on the partial release surfaces of the blue release film and the transparent release film.

4. A 5G flexible circuit board back glue and knife mark-free roll stock process according to claim 1, characterized in that: In steps 3) and 5), use a high-speed nesting die-cutting machine in cooperation with an engraved die to conduct die-cutting.

5. A 5G flexible circuit board back glue and knife mark-free roll material process according to claim 1, characterized in that: In step 3), also conduct die-cutting on the blue release film.

6. A 5G flexible circuit board back glue without knife mark roll material process according to claim 1, characterized in that: In step 4), the waste materials generated by the first die-cutting are the two side edge parts of the transparent protective film and the blue release film, and they are only connected to the bottom protective film.

7. A 5G flexible circuit board back glue and knife mark-free roll material process according to claim 1, characterized in that: In step 6), the waste materials generated by the second die-cutting are the two side edge parts where the blue release film is located, and they are only connected to the transparent protective film.

8. A 5G flexible circuit board back glue knife-free roll material process according to claim 1, characterized in that: In step 6), first bond a waste discharging tape on the matte release film and the blue release film, and then exclude the waste discharging tape, the matte release film and the waste materials generated by the second die-cutting together.

9. A 5G flexible circuit board back glue knife-free roll stock process according to claim 1, characterized in that: In step 7), the edge tolerance of the product to the transparent tape release film is not greater than ±0.1 mm.

10. A 5G flexible circuit board back glue without knife mark roll material process according to claim 1, characterized in that: In step 8), use the peeling knife on the jig to peel off the transparent protective film.

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