Chemical delivery system and method

Abstract

This application provides a chemical substance delivery system and method. A carrier gas inlet is connected to a vaporizer via a first carrier gas branch and to a liquid chemical substance tank via a second carrier gas branch. The liquid chemical substance tank is connected to the vaporizer via a liquid chemical substance delivery pipeline. The inlet of a fast diaphragm valve in the vaporizer is connected to the first carrier gas branch. The gas-liquid outlet of the fast diaphragm valve is connected to the cavity of the vaporizer. The liquid inlet of the fast diaphragm valve is connected to the liquid chemical substance delivery pipeline. The vaporizer is connected to a process gas deposition reaction chamber via a process gas deposition pipeline. The fast diaphragm valve is used to open when supplying chemical vapor to the reaction chamber and to close when purging the reaction chamber. The fast diaphragm valve shortens the response time, enabling the rapid input of large quantities of chemical substances into the reaction chamber, meeting the requirements of process gas deposition with complex microstructures.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a chemical substance delivery system and method. Background Technology

[0002] In common process gas deposition technologies such as ALD (Atomic layer deposition), PEALD (Plasma enhanced atomic layer deposition), CVD (Chemical Vapor Deposition), and PECVD (Plasma Enhanced Chemical Vapor Deposition), one or more chemical substances are typically delivered into a reaction chamber to undergo a process gas deposition reaction on the substrate surface, thereby forming a process gas film on the substrate surface.

[0003] During the coating process, a large amount of chemical source is required. Since the vapor pressure of liquid chemical source is low, the chemical source is currently mainly provided to the reaction chamber by bubbling in the source bottle and saturated vapor pressure. However, the above methods cannot provide a large amount of chemical source quickly.

[0004] Meanwhile, in actual gas deposition processes, as the microstructure of the substrate surface becomes more and more complex, the area to be coated becomes larger and larger, thus placing increasingly higher demands on the reaction time.

[0005] Therefore, there is an urgent need for a method to rapidly introduce large quantities of chemical substances into the reaction chamber within a short period of time. Summary of the Invention

[0006] In view of this, a summary section is provided to briefly introduce the concepts, which will be described in detail in the detailed description section below. This summary section is not intended to identify key or essential features of the claimed technical solution, nor is it intended to limit the scope of the claimed technical solution.

[0007] The purpose of this application is to provide a chemical substance delivery system that can rapidly input a large amount of chemical substances into a reaction chamber in a short time, meeting the needs of process gas deposition with complex microstructures.

[0008] To achieve the above objectives, this application provides the following technical solution:

[0009] In a first aspect, embodiments of this application provide a chemical substance delivery system, comprising:

[0010] The carrier gas inlet is connected to the vaporizer via the first carrier gas branch;

[0011] The carrier gas inlet is connected to the liquid chemical substance tank via a second carrier gas branch.

[0012] The liquid chemical substance tank is connected to the vaporizer via a liquid chemical substance delivery pipeline;

[0013] A fast diaphragm valve located in the vaporizer;

[0014] The air inlet of the rapid diaphragm valve is connected to the first carrier gas branch; the gas-liquid outlet of the rapid diaphragm valve is connected to the cavity of the vaporizer; and the liquid inlet of the rapid diaphragm valve is connected to the liquid chemical substance delivery pipeline.

[0015] The vaporizer is connected to the reaction chamber of the process gas deposition via a process gas deposition pipeline;

[0016] The rapid diaphragm valve is used to open when chemical vapor is supplied to the reaction chamber and to close when the reaction chamber is purged.

[0017] In one possible implementation, the rapid diaphragm valve includes an arc-shaped diaphragm for controlling the opening and closing of the inlet; the outlet end of the inlet is flush with the horizontal plane.

[0018] The rapid diaphragm valve includes a sunken annular groove structure connecting the air inlet and the gas-liquid outlet.

[0019] One possible implementation also includes:

[0020] The cooling liquid tank is connected to the liquid chemical substance delivery pipeline via a first recovery pipeline;

[0021] A seventh valve is installed on the first recovery pipeline;

[0022] The seventh valve is used to close when supplying chemical vapor to the reaction chamber and to open when purging the reaction chamber.

[0023] One possible implementation also includes:

[0024] The carrier gas inlet is connected to the first carrier gas branch through a main pipeline;

[0025] A carrier gas control valve is installed on the main pipeline; a first valve and a first gas mass flow controller are installed on the first carrier gas branch line.

[0026] One possible implementation also includes:

[0027] The purge gas inlet is connected to the main pipeline via the first purge branch;

[0028] A purging gas control valve is installed on the first purging branch.

[0029] One possible implementation also includes:

[0030] A liquid flow controller located on the liquid chemical substance delivery pipeline and connected to the vaporizer.

[0031] One possible implementation also includes:

[0032] The second valve and the second gas mass flow controller are located on the second carrier gas branch.

[0033] One possible implementation also includes:

[0034] A fourth carrier gas branch connecting the second carrier gas branch to the liquid chemical substance delivery pipeline;

[0035] A third valve is installed on the fourth carrier gas branch.

[0036] One possible implementation also includes:

[0037] An automated liquid chemical source delivery system connected to the liquid chemical substance tank.

[0038] One possible implementation also includes:

[0039] A first cooling branch is connected to the cooling liquid tank and the first recovery pipeline, respectively; a sixteenth valve is provided on the first cooling branch.

[0040] A second cooling branch connected to the cooling liquid tank; a seventeenth valve is installed on the second cooling branch;

[0041] A second recovery pipeline is respectively connected to the first recovery pipeline, the first cooling branch, and the second cooling branch; an eighth valve is installed on the second recovery pipeline.

[0042] The second recovery pipeline is connected to the upstream pipeline via a third recovery pipeline; a ninth valve is installed on the third recovery pipeline.

[0043] Secondly, embodiments of this application provide a chemical substance delivery method, including:

[0044] Carrier gas is introduced into the inlet of the fast diaphragm valve in the vaporizer through the carrier gas inlet connected to the first carrier gas branch; the vaporizer is connected to the reaction chamber of process gas deposition through the process gas deposition pipeline.

[0045] Carrier gas is introduced into the liquid chemical substance tank through the carrier gas inlet connected to the second carrier gas branch, so as to push the liquid chemical substance in the liquid chemical substance tank into the liquid chemical substance delivery pipeline, which is connected to the vaporizer.

[0046] The rapid diaphragm valve is opened to introduce liquid chemical substances into the inlet of the rapid diaphragm valve; the carrier gas introduced into the air inlet of the rapid diaphragm valve pushes the liquid chemical substances through the gas-liquid outlet of the rapid diaphragm valve into the cavity of the vaporizer, forming chemical vapor;

[0047] The chemical vapor is delivered to the reaction chamber through the process gas deposition pipeline;

[0048] The rapid diaphragm valve is closed, and the reaction chamber is purged with the carrier gas.

[0049] In one possible implementation, opening the rapid diaphragm valve to introduce a liquid chemical substance into the inlet of the rapid diaphragm valve includes:

[0050] The arc-shaped diaphragm of the rapid diaphragm valve is raised, and the liquid outlet of the inlet is flush with the horizontal plane to introduce liquid chemical substances into the inlet of the rapid diaphragm valve.

[0051] One possible implementation also includes:

[0052] When the arc-shaped diaphragm is pressed down, carrier gas is introduced through the sunken annular groove structure connecting the air inlet and the gas-liquid outlet.

[0053] One possible implementation also includes:

[0054] Unreacted chemical vapors from the liquid chemical delivery line are introduced into the cooling liquid tank through a first recovery line connected to the liquid chemical delivery line.

[0055] Compared with the prior art, the embodiments of this application have the following beneficial effects:

[0056] This application provides a chemical substance delivery system and method. A carrier gas inlet is connected to a vaporizer via a first carrier gas branch and to a liquid chemical substance tank via a second carrier gas branch. The liquid chemical substance tank is connected to the vaporizer via a liquid chemical substance delivery pipeline. The inlet of a fast diaphragm valve in the vaporizer is connected to the first carrier gas branch. The gas-liquid outlet of the fast diaphragm valve is connected to the cavity of the vaporizer. The liquid inlet of the fast diaphragm valve is connected to the liquid chemical substance delivery pipeline. The vaporizer is connected to a process gas deposition reaction chamber via a process gas deposition pipeline. The fast diaphragm valve is used to open when supplying chemical vapor to the reaction chamber and to close when purging the reaction chamber. The fast diaphragm valve shortens the response time, enabling the rapid input of large quantities of chemical substances into the reaction chamber, meeting the requirements of process gas deposition with complex microstructures. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0058] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0059] Figure 1 A schematic diagram of a chemical substance delivery system provided in an embodiment of this application is shown;

[0060] Figure 2 This paper shows a schematic diagram of the internal structure of a vaporizer provided in an embodiment of this application;

[0061] Figure 3 A flowchart of a method for delivering chemical substances according to an embodiment of this application is shown. Detailed Implementation

[0062] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0063] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0064] As described in the background section, the applicant has found that common process gas deposition technologies such as ALD (Atomic layer deposition), PEALD (Plasma enhanced atomic layer deposition), CVD (Chemical Vapor Deposition), and PECVD (Plasma Enhanced Chemical Vapor Deposition) typically involve delivering one or more chemical substances into a reaction chamber to conduct a process gas deposition reaction on the substrate surface, thereby forming a process gas film on the substrate surface.

[0065] During the coating process, a large amount of chemical source is required. Since the vapor pressure of liquid chemical source is low, the chemical source is currently mainly provided to the reaction chamber by bubbling in the source bottle and saturated vapor pressure. However, the above methods cannot provide a large amount of chemical source quickly.

[0066] Meanwhile, in actual gas deposition processes, as the microstructure of the substrate surface becomes more and more complex, the area to be coated becomes larger and larger, thus placing increasingly higher demands on the reaction time.

[0067] Therefore, there is an urgent need for a method to rapidly introduce large quantities of chemical substances into the reaction chamber within a short period of time.

[0068] Based on the above technical problems, this application provides a chemical substance delivery system and method. A carrier gas inlet is connected to a vaporizer via a first carrier gas branch and to a liquid chemical substance tank via a second carrier gas branch. The liquid chemical substance tank is connected to the vaporizer via a liquid chemical substance delivery pipeline. The inlet of a fast diaphragm valve in the vaporizer is connected to the first carrier gas branch. The gas-liquid outlet of the fast diaphragm valve is connected to the cavity of the vaporizer. The liquid inlet of the fast diaphragm valve is connected to the liquid chemical substance delivery pipeline. The vaporizer is connected to the reaction chamber for process gas deposition via a process gas deposition pipeline. The fast diaphragm valve in the liquid chemical substance delivery pipeline is used to open when supplying chemical vapor to the reaction chamber and to close when purging the reaction chamber. The fast diaphragm valve shortens the response time, enabling the rapid input of large quantities of chemical substances into the reaction chamber, meeting the requirements of process gas deposition with complex microstructures.

[0069] To better understand the technical solution and effects of this application, the specific embodiments will be described in detail below with reference to the accompanying drawings.

[0070] Exemplary piping

[0071] See Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of a chemical substance delivery system provided in an embodiment of this application. Figure 2 A schematic diagram of the internal structure of a vaporizer provided in this application embodiment includes:

[0072] The carrier gas inlet 71 is connected to the vaporizer 6 (VAP) through the first carrier gas branch 11, and the carrier gas inlet 71 is connected to the liquid chemical tank 91 through the second carrier gas branch 12. The liquid chemical tank 91 is connected to the vaporizer 6 through the liquid chemical delivery pipeline 2.

[0073] The fast diaphragm valve 100 is located in the vaporizer 6. The air inlet 101 of the fast diaphragm valve 100 is connected to the first carrier gas branch 11; the gas-liquid outlet 104 of the fast diaphragm valve 100 is connected to the cavity of the vaporizer 6; and the liquid inlet 102 of the fast diaphragm valve 100 is connected to the liquid chemical substance delivery pipeline 2.

[0074] The vaporizer 6 is connected to the process gas deposition reaction chamber 7 (PROCESSCHAMBER) via the process gas deposition pipeline 3.

[0075] The quick-release diaphragm valve 100 is used to open when supplying chemical vapor to the reaction chamber 7 and to close when purging the reaction chamber 7.

[0076] Therefore, in this embodiment, the carrier gas inlet 71 can be connected to the vaporizer 6 via the first carrier gas branch 11, thereby providing carrier gas to the vaporizer 6. When the fast diaphragm valve 100 is opened, the vaporizer 6 mixes the chemical vapors obtained by vaporizing the liquid chemical substance supplied through the liquid chemical substance delivery pipeline 2 with the carrier gas supplied through the first carrier gas branch 11, and then inputs the mixture into the reaction chamber 7.

[0077] Specifically, in this embodiment, carrier gas can be introduced into the liquid chemical substance tank 91 through the carrier gas inlet 71 connected to the second carrier gas branch 12. The carrier gas can push the liquid chemical substances in the liquid chemical substance tank 91 into the liquid chemical substance delivery pipeline 2. When the fast diaphragm valve 100 is opened, since the liquid inlet 102 of the fast diaphragm valve 100 is connected to the liquid chemical substance delivery pipeline 2, the liquid chemical substances in the liquid chemical substance delivery pipeline 2 can be delivered into the vaporizer 6.

[0078] Meanwhile, the liquid chemical substance introduced through the inlet 102 of the quick diaphragm valve 100 enters the cavity 105 of the vaporizer 6 through the gas-liquid outlet 104 of the quick diaphragm valve 100. After the liquid chemical substance vaporizes to form chemical vapor, it is discharged through the outlet 103 of the vaporizer 6.

[0079] Specifically, the outlet 103 of the vaporizer 6 is connected to the process gas deposition reaction chamber 7 via the process gas deposition pipeline 3, thereby introducing chemical vapor into the reaction chamber 7 for process gas deposition.

[0080] For details, see Figure 2 As shown, the arc-shaped diaphragm 1001 of the rapid diaphragm valve 100 is used to control the opening and closing of the liquid inlet 102. The liquid outlet 1002 of the liquid inlet 102 is flush with the horizontal plane 1004. When the rapid diaphragm valve 100 is open, the arc-shaped diaphragm 1001 is raised and not pressed down. The liquid chemical substance introduced into the liquid inlet 102 of the rapid diaphragm valve 100 enters the cavity 105 of the vaporizer 6 through the gas-liquid outlet 104 of the rapid diaphragm valve 100. After the liquid chemical substance vaporizes to form chemical vapor, it is discharged through the outlet 103 of the vaporizer. When the rapid diaphragm valve 100 is closed, the arc-shaped diaphragm 1001 is pressed down, blocking the liquid outlet 1002 of the liquid inlet 102. Since the structure connecting the air inlet 101 and the gas-liquid outlet 104 is a sunken annular groove type structure 1003, the normal flow of carrier gas is not affected when the arc-shaped diaphragm 1001 is pressed down. Therefore, the rapid diaphragm valve 100 can be used to achieve rapid switching and improve preparation efficiency.

[0081] In one possible implementation, see Figure 1 As shown, the chemical substance delivery system provided in this application embodiment may further include:

[0082] The cooling liquid tank 92 is connected to the liquid chemical substance delivery pipeline 2 via the first recovery pipeline 21;

[0083] A seventh valve 57 is installed on the first recovery pipeline 21. The seventh valve 57 is used to close when chemical vapor is supplied to the reaction chamber 7 and to open when the reaction chamber 7 is purged.

[0084] Therefore, in this embodiment of the application, after opening the seventh valve 57, a cooling liquid tank 92 can be set up to introduce excess chemical vapor into the cooling liquid tank 92, thereby realizing the recycling of chemical vapor, avoiding waste, and maintaining the pressure stability in each pipeline of the chemical substance delivery system in the process gas deposition.

[0085] In one possible implementation, see Figure 1 As shown, the chemical substance delivery system provided in this application embodiment may further include:

[0086] The carrier gas inlet 71 is connected to the first carrier gas branch 11 through the main pipeline 1.

[0087] The main pipeline 1 is equipped with a carrier gas control valve 60, and the first carrier gas branch 11 is equipped with a first valve 51 and a first gas mass flow controller 81.

[0088] Therefore, in this embodiment, a carrier gas control valve 60 can be installed on the main pipeline 1 to control the on / off of the carrier gas; the first valve 51 can control the on / off of the carrier gas in the first carrier gas branch 11, and the first gas mass flow controller 81 can control the flow rate of the carrier gas, thereby providing carrier gas to the vaporizer 6 as needed.

[0089] The first gas mass flow controller 81 and the first valve 51 can control the constant flow of carrier gas, so that when the fast diaphragm valve 100 of the vaporizer 6 is closed, the residual liquid chemicals in the pipeline between the vaporizer 6 and the reaction chamber 7, i.e. the process gas deposition pipeline 3, can be quickly purged.

[0090] See Figure 2 As shown, after one chemical vapor deposition cycle is completed and the rapid diaphragm valve 100 is closed, liquid chemicals cannot be introduced into the chamber 105 of the vaporizer 6 through the liquid inlet 102. However, carrier gas can still be supplied to the chamber 105 of the vaporizer 6 through the gas inlet 101, and the carrier gas can be used to purge the reaction chamber 7. Carrier gas purging typically uses normally circulating gases such as argon.

[0091] In this embodiment, the gas flow rates of the first carrier gas branch 11, the second carrier gas branch 12, the third carrier gas branch 13, and the fourth carrier gas branch 14 can be kept consistent so as to maintain the pressure balance of the reaction chamber 7 and the pipeline when switching the pipeline to introduce carrier gas or chemical vapor.

[0092] The liquid chemical tank 91 provides a continuous supply of chemical substances to the vaporizer 6, which vaporizes the chemical substances to obtain chemical vapor. When the rapid diaphragm valve 100 is closed and the seventh valve 57 is open, the chemical substances that do not enter the reaction chamber 7 can be recovered; when the rapid diaphragm valve 100 is open and the seventh valve 57 is closed, the chemical vapor can enter the reaction chamber 7. That is, in this embodiment, the rapid switching between the rapid diaphragm valve 100 and the seventh valve 57 allows the chemical vapor to quickly enter the reaction chamber 7 during the period when process gas deposition is required, enabling the rapid input of a large amount of chemical substances into the reaction chamber 7 to meet the needs of process gas deposition with complex microstructures.

[0093] In one possible implementation, see Figure 1 As shown, the chemical substance delivery system provided in this application embodiment may further include:

[0094] The purge gas inlet 72 can be connected to the main pipeline 1 through the first purge branch 10;

[0095] A purging gas control valve 61 is installed on the first purging branch 10.

[0096] Therefore, in this embodiment of the application, by connecting the first purging branch 10 to the main pipeline 1, it is possible to control the purging gas to purge the residual chemical source in the pipeline by switching the state of each valve after the process gas deposition is completed, which facilitates the replacement of various valves, pipelines and other components.

[0097] Similarly, after the overall process gas deposition is completed and the rapid diaphragm valve 100 is closed, liquid chemicals cannot be introduced into the vaporizer 6 cavity 105 through the liquid inlet 102. However, purge gas can still be supplied to the vaporizer 6 cavity 105 through the air inlet 101, which can be used to purge the reaction chamber 7. Purge gas is generally made from relatively inexpensive gases such as nitrogen to purge the entire pipeline, thus saving costs.

[0098] Meanwhile, a purging gas control valve 61 can be installed on the first purging branch 10 to realize the on / off control of the purging gas.

[0099] In one possible implementation, see Figure 1 As shown, the chemical substance delivery system provided in this application embodiment may further include:

[0100] Located on the liquid chemical substance delivery pipeline 2 and connected to the vaporizer 6, the liquid flow meter controller 8 (LFMC) can not only monitor the flow rate of the liquid chemical substance, but also accurately control the amount of liquid chemical substance entering the vaporizer 6.

[0101] Thus, by controlling the liquid flow controller 8 and the vaporizer 6, the chemical vapor produced by vaporizing the liquid chemical substance at a rated flow rate is delivered to the reaction chamber 7.

[0102] In one possible implementation, see Figure 1 As shown, the chemical substance delivery system provided in this application embodiment may further include:

[0103] The second valve 52 and the second gas mass flow controller 82 are located on the second carrier gas branch 12.

[0104] Therefore, in this embodiment, the second valve 52 can control the on / off of the carrier gas in the second carrier gas branch 12, and the second gas mass flow controller 82 can control the flow rate of the carrier gas, thereby providing carrier gas to the liquid chemical tank 91 or the vaporizer 6 as needed.

[0105] Specifically, the second carrier gas branch 12 can be connected to the liquid chemical substance tank 91 through the third carrier gas branch 13, and the second carrier gas branch 12 can be connected to the liquid chemical substance delivery pipeline 2 through the fourth carrier gas branch 14.

[0106] A fifth valve 55 and a fourteenth valve 64 can be installed on the third carrier gas branch 13 to control the flow of carrier gas into the liquid chemical substance tank 91. A third valve 53 can be installed on the fourth carrier gas branch 14 to control the flow of carrier gas into the liquid chemical substance delivery pipeline 2. Optionally, a fifteenth valve 65 and a sixth valve 56 can also be installed on the liquid chemical substance delivery pipeline 2 to control the flow of liquid chemical substances.

[0107] In this embodiment, when chemical vapor needs to be introduced into the reaction chamber 7 for process gas deposition, the third valve 53 can be closed, and the carrier gas enters the liquid chemical substance tank 91 through the third carrier gas branch 13 to push the liquid chemical substance in the liquid chemical substance tank 91 into the liquid chemical substance delivery pipeline 2. When the reaction chamber 7 is purged with carrier gas after one chemical vapor deposition, the quick diaphragm valve 100 can be closed, the third valve 53 can remain closed, the fifth valve 55 and the sixth valve 56 can remain open, and the seventh valve 57 can be opened. At this time, the liquid chemical substance can be recovered and introduced into the cooling liquid tank 92. The carrier gas can enter the liquid chemical substance tank 91 through the second carrier gas branch 12 and the third carrier gas branch 13 to push the liquid chemical substance in the liquid chemical substance tank 91 into the liquid chemical substance delivery pipeline 2, and then enter the cooling liquid tank 9 through the opened seventh valve 57 to achieve recovery. When the overall process gas deposition is complete and the pipeline needs to be purged with purge gas, the third valve 53 can be opened, the fifth valve 55 and the sixth valve 56 can be closed, the sixteenth valve 66 and the seventeenth valve 67 can be closed, and the eighth valve 58 and the ninth valve 59 can be opened. The purge gas does not enter the liquid chemical tank 91 and the cooling liquid tank 92. This allows the residual liquid in the liquid chemical substance delivery pipeline 2 to be purged. The purge gas purifies the reaction chamber 7 through the first carrier gas branch 11, and enters the pre-feed pipeline 5 through the second carrier gas branch 12, the fourth carrier gas branch 14, the first recovery pipeline 21, the second recovery pipeline 22, and the third recovery pipeline 23.

[0108] The second gas mass flow controller 82 and the second valve 52 can control the on / off state of the carrier gas and the purging gas 53.

[0109] In one possible implementation, see Figure 1 As shown, the chemical substance delivery system provided in this application embodiment may further include:

[0110] An automated liquid chemical source delivery system 73 (LDS) is connected to the liquid chemical substance tank 91.

[0111] Therefore, in this embodiment of the application, liquid chemicals can be supplied to the liquid chemical tank 91 by the automatic liquid chemical source delivery system 73, so as to ensure that the vaporizer 6 can be supplied with a continuous supply of liquid chemicals.

[0112] Optionally, the automatic liquid chemical source delivery system 73 can be connected to the third carrier gas branch 13 via the liquid chemical source replenishment pipeline 4, thereby replenishing the liquid chemical substance tank 91. A twelfth valve 62 and a thirteenth valve 63 can be installed on the chemical source replenishment pipeline 4 to control the flow of the liquid chemical substance.

[0113] In one possible implementation, see Figure 1 As shown, the chemical substance delivery system provided in this application embodiment may further include:

[0114] A first cooling branch 31 is connected to the cooling liquid tank 92 and the first recovery pipeline 21 respectively; a sixteenth valve 66 is provided on the first cooling branch 31; a second cooling branch 32 is connected to the cooling liquid tank 92; a seventeenth valve 67 is provided on the second cooling branch 32.

[0115] A second recovery pipe 22 is connected to the first recovery pipe 21, the first cooling branch 31, and the second cooling branch 32 respectively; an eighth valve 58 is installed on the second recovery pipe 22; the second recovery pipe 22 is connected to the foreline 5 through the third recovery pipe 23; a ninth valve 59 is installed on the third recovery pipe 23.

[0116] Therefore, in this embodiment of the application, by setting up a cooling liquid tank 92, the cooling liquid tank 92 can perform refrigeration. When the seventh valve 57 is opened, the carrier gas carrying the liquid chemical substance will flow through the first recovery pipeline 21 and the first cooling branch 31 to the cooled cooling liquid tank 92. After being cooled in the cooling liquid tank 92, the condensed liquid chemical substance can be reused, and the carrier gas enters the pre-pipeline 5 and is discharged.

[0117] A sixteenth valve 66 is installed on the first cooling branch 31, which controls the flow of liquid chemicals into the cooling liquid tank 92. The condensed liquid chemicals can enter a subsequent reuse pipeline through the second cooling branch 32, which is connected to the cooling liquid tank 92. A seventeenth valve 67 is installed on the second cooling branch 32, which controls the flow of carrier gas and liquid chemicals out of the cooling liquid tank 92.

[0118] In addition, when the purging gas is purging the pipeline, it can bypass the cooling liquid tank 92 by closing the sixteenth valve 66 and the seventeenth valve 67, and directly introduce the purging gas into the subsequent pre-pipeline 5 through the second recovery pipeline 22, which is connected to the first recovery pipeline 21, the first cooling branch 31 and the second cooling branch 32 respectively. The second recovery pipeline 22 is connected to the pre-pipeline 5 through the third recovery pipeline 23.

[0119] The second recovery pipeline 22 is equipped with an eighth valve 58, and the third recovery pipeline 23 is equipped with a ninth valve 59, so that the opening and closing of their respective pipelines can be controlled respectively.

[0120] This application provides a chemical substance delivery system, comprising: a carrier gas inlet connected to a vaporizer via a first carrier gas branch and to a liquid chemical substance tank via a second carrier gas branch; the liquid chemical substance tank connected to the vaporizer via a liquid chemical substance delivery pipeline; an inlet of a fast diaphragm valve in the vaporizer connected to the first carrier gas branch; a gas-liquid outlet of the fast diaphragm valve connected to the cavity of the vaporizer; a liquid inlet of the fast diaphragm valve connected to the liquid chemical substance delivery pipeline; and the vaporizer connected to a process gas deposition reaction chamber via a process gas deposition pipeline. The fast diaphragm valve is used to open when delivering chemical vapor to the reaction chamber and to close when purging the reaction chamber. The fast diaphragm valve shortens the response time, enabling rapid input of large quantities of chemical substances into the reaction chamber, meeting the requirements of process gas deposition with complex microstructures.

[0121] Exemplary methods

[0122] See Figure 3 The diagram shown is a flowchart of a chemical substance delivery method provided in an embodiment of this application. Figure 1 and Figure 2 As shown, the method may include:

[0123] S101: Carrier gas is introduced into the inlet 101 of the fast diaphragm valve 100 in the vaporizer 6 through the carrier gas inlet 71 connected to the first carrier gas branch 11; the vaporizer 6 is connected to the reaction chamber 7 of process gas deposition through the process gas deposition pipeline 3.

[0124] S102: Carrier gas is introduced into the liquid chemical substance tank 91 through the carrier gas inlet 71 connected to the second carrier gas branch 12 to push the liquid chemical substance in the liquid chemical substance tank 91 into the liquid chemical substance delivery pipeline 2, which is connected to the vaporizer 6.

[0125] S103: Open the rapid diaphragm valve 100 to introduce liquid chemical substances into the inlet 102 of the rapid diaphragm valve 100 of the vaporizer 6;

[0126] S104: The carrier gas introduced through the air inlet 101 of the fast diaphragm valve 100 pushes the liquid chemical substance through the gas-liquid outlet 104 of the fast diaphragm valve 100 into the cavity 105 of the vaporizer 6 to form chemical vapor.

[0127] S105: The chemical vapor is transported to the reaction chamber 7 through the process gas deposition pipeline 3;

[0128] S106: When the chemical vapor is stopped from being supplied to the reaction chamber 7, the rapid diaphragm valve 100 is closed, and the reaction chamber 7 is purged with the carrier gas.

[0129] In one possible implementation, the method provided in this application embodiment may further include:

[0130] When the chemical vapor is stopped from being supplied to the reaction chamber 7, the unreacted liquid chemical substance from the liquid chemical substance supply line 2 is introduced into the cooling liquid tank 92 through the first recovery line 21 connected to the liquid chemical substance supply line 2.

[0131] This application provides a method for delivering chemical substances. The method includes: introducing carrier gas into the inlet of a fast diaphragm valve in a vaporizer through a carrier gas inlet connected to a first carrier gas branch; connecting the vaporizer to a process gas deposition reaction chamber via a process gas deposition pipeline; introducing carrier gas into a liquid chemical substance tank through a carrier gas inlet connected to a second carrier gas branch to push the liquid chemical substance from the tank into a liquid chemical substance delivery pipeline, which is connected to the vaporizer; opening the fast diaphragm valve to introduce liquid chemical substances into its liquid inlet in the vaporizer; the carrier gas introduced through the inlet of the fast diaphragm valve pushing the liquid chemical substances through the gas-liquid outlet of the fast diaphragm valve into the vaporizer chamber, forming chemical vapor; delivering the chemical vapor to the reaction chamber via the process gas deposition pipeline; and closing the fast diaphragm valve when the delivery of chemical vapor to the reaction chamber stops to purge the reaction chamber. Thus, this application, through the fast diaphragm valve, can shorten the response time, enabling the rapid input of large quantities of chemical substances into the reaction chamber, meeting the requirements of process gas deposition with complex microstructures. Purging with carrier gas or purge gas can prevent residual chemical sources from accumulating in dead corners of pipelines or reaction chambers.

[0132] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on its differences from other embodiments. In particular, the method embodiments are basically similar to the system embodiments, so they are described more simply; relevant parts can be referred to the descriptions of the method embodiments.

[0133] The above description is merely a preferred embodiment of this application. Although this application has disclosed preferred embodiments above, it is not intended to limit this application. Any person skilled in the art can make many possible variations and modifications to the technical solutions of this application using the methods and techniques disclosed above, or modify them into equivalent embodiments with equivalent changes, without departing from the scope of the technical solutions of this application. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall still fall within the protection scope of the technical solutions of this application.

Claims

1. A chemical substance delivery system, characterized in that, include: The carrier gas inlet is connected to the vaporizer via the first carrier gas branch; The carrier gas inlet is connected to the liquid chemical substance tank via a second carrier gas branch. The liquid chemical substance tank is connected to the vaporizer via a liquid chemical substance delivery pipeline; A fast diaphragm valve located in the vaporizer; The air inlet of the rapid diaphragm valve is connected to the first carrier gas branch; the gas-liquid outlet of the rapid diaphragm valve is connected to the cavity of the vaporizer; and the liquid inlet of the rapid diaphragm valve is connected to the liquid chemical substance delivery pipeline. The vaporizer is connected to the reaction chamber of the process gas deposition via a process gas deposition pipeline; The rapid diaphragm valve is used to open when chemical vapor is supplied to the reaction chamber and to close when the reaction chamber is purged; The rapid diaphragm valve includes an arc-shaped diaphragm sheet for controlling the opening and closing of the inlet; the outlet end of the inlet is flush with the horizontal plane. The rapid diaphragm valve includes a sunken annular groove structure connecting the air inlet and the gas-liquid outlet; The carrier gas inlet is connected to the first carrier gas branch through a main pipeline; A carrier gas control valve is installed on the main pipeline; a first valve and a first gas mass flow controller are installed on the first carrier gas branch line.

2. The system according to claim 1, characterized in that, Also includes: The cooling liquid tank is connected to the liquid chemical substance delivery pipeline via a first recovery pipeline; A seventh valve is installed on the first recovery pipeline; The seventh valve is used to close when supplying chemical vapor to the reaction chamber and to open when purging the reaction chamber.

3. The system according to claim 1, characterized in that, Also includes: The purge gas inlet is connected to the main pipeline via the first purge branch; A purging gas control valve is installed on the first purging branch.

4. The system according to any one of claims 1-3, characterized in that, Also includes: A liquid flow controller located on the liquid chemical substance delivery pipeline and connected to the vaporizer.

5. The system according to any one of claims 1-3, characterized in that, Also includes: The second valve and the second gas mass flow controller are located on the second carrier gas branch.

6. The system according to claim 1, characterized in that, Also includes: A fourth carrier gas branch connecting the second carrier gas branch to the liquid chemical substance delivery pipeline; A third valve is installed on the fourth carrier gas branch.

7. The system according to claim 1, characterized in that, Also includes: An automated liquid chemical source delivery system connected to the liquid chemical substance tank.

8. The system according to claim 2, characterized in that, Also includes: A first cooling branch is connected to the cooling liquid tank and the first recovery pipeline respectively; a sixteenth valve is provided on the first cooling branch. A second cooling branch connected to the cooling liquid tank; a seventeenth valve is installed on the second cooling branch; A second recovery pipeline is respectively connected to the first recovery pipeline, the first cooling branch, and the second cooling branch; an eighth valve is installed on the second recovery pipeline. The second recovery pipeline is connected to the upstream pipeline through the third recovery pipeline; a ninth valve is installed on the third recovery pipeline.

9. A method for delivering chemical substances, characterized in that, include: Carrier gas is introduced into the inlet of the fast diaphragm valve in the vaporizer through the carrier gas inlet connected to the first carrier gas branch. The vaporizer is connected to the reaction chamber of the process gas deposition via a process gas deposition pipeline; Carrier gas is introduced into the liquid chemical substance tank through the carrier gas inlet connected to the second carrier gas branch, so as to push the liquid chemical substance in the liquid chemical substance tank into the liquid chemical substance delivery pipeline, which is connected to the vaporizer. Open the rapid diaphragm valve to introduce liquid chemical substances into the inlet of the rapid diaphragm valve; The carrier gas introduced through the inlet of the rapid diaphragm valve pushes the liquid chemical substance through the gas-liquid outlet of the rapid diaphragm valve into the cavity of the vaporizer, forming chemical vapor; The chemical vapor is delivered to the reaction chamber through the process gas deposition pipeline; When the supply of chemical vapor to the reaction chamber is stopped, the rapid diaphragm valve is closed to purge the reaction chamber. The rapid diaphragm valve includes an arc-shaped diaphragm sheet for controlling the opening and closing of the inlet; the outlet end of the inlet is flush with the horizontal plane. The rapid diaphragm valve includes a sunken annular groove structure connecting the air inlet and the gas-liquid outlet; The carrier gas inlet is connected to the first carrier gas branch through a main pipeline; A carrier gas control valve is installed on the main pipeline; a first valve and a first gas mass flow controller are installed on the first carrier gas branch line.

10. The method according to claim 9, characterized in that, The step of opening the rapid diaphragm valve to introduce a liquid chemical substance into the inlet of the rapid diaphragm valve includes: The arc-shaped diaphragm of the rapid diaphragm valve is raised, and the liquid outlet of the inlet is flush with the horizontal plane to introduce liquid chemical substances into the inlet of the rapid diaphragm valve.

11. The method according to claim 10, characterized in that, Also includes: When the arc-shaped diaphragm is pressed down, carrier gas is introduced through the sunken annular groove structure connecting the air inlet and the gas-liquid outlet.

12. The method according to claim 9, characterized in that, Also includes: When the chemical vapor is stopped from being supplied to the reaction chamber, the unreacted chemical vapor from the liquid chemical substance delivery pipeline is introduced into the cooling liquid tank through a first recovery pipeline connected to the liquid chemical substance delivery pipeline.

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