Liquid treatment circulation method and substrate treatment method

Abstract

A processing liquid circulation method circulates processing liquid in a processing liquid supply device (200). The processing liquid supply device (200) has a pump (34), a filter (37), and a pressure regulating valve (43). The pump (34) sends out the processing liquid. The filter (37) traps fine particles contained in the processing liquid. The pressure regulating valve (43) regulates the pressure of the processing liquid circulating in an external circulation pipe (60). The processing liquid circulation method includes a step (S1) of keeping the pressure of the pump (34) constant, and a step (S4) of setting the pressure of the processing liquid to a first pressure (P1) by the pressure regulating valve (43) while the pressure of the pump (34) is kept constant, and circulating the processing liquid through the external circulation pipe (60). The first pressure (P1) is lower than a second pressure (P2). The second pressure (P2) indicates the pressure of the processing liquid flowing in the external circulation pipe (60) when the nozzle (14) sprays the processing liquid to the substrate W.

Description

Technical Field

[0001] This invention relates to a process liquid circulation method and a substrate processing method. Background Technology

[0002] The liquid processing apparatus described in Patent Document 1 includes a tank, a circulation line, a pump, a filter, a back pressure valve, and a control unit. The tank stores the processing liquid. The circulation line returns the processing liquid discharged from the tank to the tank. The pump forms a circulating flow of the processing liquid in the circulation line. The filter is located downstream of the pump in the circulation line. The back pressure valve is located downstream of the filter in the circulation line. The control unit controls the pump and the back pressure valve. Furthermore, the control unit controls the pump's ejection pressure in such a manner that when the circulation of the processing liquid in the circulation line begins, the pump's ejection pressure starts at a first pressure, and after a predetermined time, the pump's ejection pressure increases to a second pressure greater than the first pressure.

[0003] By controlling the circulation of the treated liquid to begin with the pump's ejection pressure as the primary pressure, the differential pressure applied between the upstream and downstream sides of the filter can be suppressed to a small value. As a result, it is possible to prevent foreign matter (particles) from passing through the filter due to the pump's ejection pressure after the treated liquid circulation has just begun.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-41039 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] The inventors have been working on a technique to reduce the particulate matter contained in the treatment liquid by using a method different from that described in Patent Document 1.

[0009] The purpose of this invention is to provide a process liquid circulation method and a substrate processing method that can effectively reduce the amount of particulate matter contained in the process liquid.

[0010] Technical means to solve the problem

[0011] According to one embodiment of the present invention, a process liquid circulation method circulates the process liquid in a process liquid supply device that supplies the process liquid to a nozzle that sprays the process liquid onto a substrate. The process liquid supply device includes a process liquid tank, a first circulation pipe, a piping, a pump, a filter, and a pressure regulating valve. The process liquid tank stores the process liquid. The upstream end of the first circulation pipe is connected to the process liquid tank, and the downstream end of the first circulation pipe is connected to the process liquid tank, the first circulation pipe circulating the process liquid. The piping is connected to the first circulation pipe and supplies the process liquid to the nozzle. The pump is disposed on the first circulation pipe to deliver the process liquid. The filter is disposed on the first circulation pipe to capture particles contained in the process liquid. The pressure regulating valve is disposed downstream of the filter on the first circulation pipe to adjust the pressure of the process liquid circulating in the first circulation pipe. The processing fluid circulation method includes: a pressure holding step, in which the pressure of the pump is maintained at a constant level; and a first circulation step, in which, while the pump pressure is maintained at a constant level, the pressure of the processing fluid is set to a first pressure via the pressure regulating valve, causing the processing fluid to circulate through the first circulation piping. The first pressure is lower than a second pressure. The second pressure represents the pressure of the processing fluid flowing in the first circulation piping when the nozzle sprays the processing fluid onto the substrate.

[0012] In one embodiment of the present invention, preferably, the first circulation process includes a first pre-dispensing process. Preferably, in the first pre-dispensing process, the nozzle performs a first pre-dispensing process by supplying the processing liquid from the first circulation pipe to the nozzle. Preferably, the first pre-dispensing process refers to the process of the nozzle spraying the processing liquid toward the liquid receiving portion before the nozzle sprays the processing liquid toward the substrate.

[0013] In one embodiment of the invention, preferably, the treatment fluid supply device further includes a drain pipe extending from the filter. Preferably, the treatment fluid circulation method further includes a draining step. Preferably, in the draining step, prior to the first circulation step, the treatment fluid is discharged from the filter to the drain pipe while the pump pressure is maintained at a constant level.

[0014] In one embodiment of the invention, preferably, the treatment fluid supply device further comprises: a second circulation pipe extending from the first circulation pipe to the treatment fluid tank on the primary side of the filter. Preferably, the treatment fluid circulation method further comprises a circulation step. Preferably, in the circulation step, prior to the drainage step, while the pump pressure is maintained at a constant state, the treatment fluid is circulated by supplying the treatment fluid to the second circulation pipe.

[0015] In one embodiment of the present invention, preferably, the treatment fluid circulation method further includes a second circulation step. Preferably, in the second circulation step, after the first circulation step, while the pump pressure is maintained at a constant state, the pressure of the treatment fluid is set to the second pressure via the pressure regulating valve, causing the treatment fluid to circulate through the first circulation piping.

[0016] In one embodiment of the present invention, preferably, the second circulation process includes a second pre-dispensing process. Preferably, in the second pre-dispensing process, the nozzle performs a second pre-dispensing process by supplying the processing liquid from the first circulation pipe to the nozzle. Preferably, the second pre-dispensing process refers to the process of the nozzle spraying the processing liquid toward the liquid receiving portion before the nozzle sprays the processing liquid toward the substrate.

[0017] In one embodiment of the present invention, preferably, the treatment fluid circulation method further includes a treatment fluid supply step. Preferably, in the treatment fluid supply step, after the second pre-dispensing step, the treatment fluid is supplied from the first circulation piping to the nozzle.

[0018] According to another embodiment of the present invention, a substrate processing method involves processing a substrate with a processing liquid. In the substrate processing method, the processing liquid supplied to the nozzle in the processing liquid supply step of the processing liquid circulation method is sprayed onto the substrate through the nozzle.

[0019] Invention Effects

[0020] The processing liquid circulation method and substrate processing method according to the present invention can effectively reduce the particulate matter contained in the processing liquid. Attached Figure Description

[0021] Figure 1 This is a top view showing the interior of a substrate processing apparatus according to an embodiment of the present invention.

[0022] Figure 2 This is a side view showing the interior of the processing unit in this embodiment.

[0023] Figure 3 This is a diagram showing the structure of the processing fluid supply device according to this embodiment.

[0024] Figure 4 This is a flowchart illustrating the substrate processing method of this embodiment.

[0025] Figure 5 This diagram illustrates the internal circulation operation of the processing fluid supply device in this embodiment.

[0026] Figure 6This diagram illustrates the filter draining operation of the processing liquid supply device in this embodiment.

[0027] Figure 7 This diagram illustrates the external circulation operation of the processing fluid supply device under the first pressure according to this embodiment.

[0028] Figure 8 This diagram illustrates the pre-dispensing operation of the processing fluid supply device in this embodiment.

[0029] Figure 9 This diagram illustrates the external circulation operation of the processing fluid supply device under the second pressure in this embodiment.

[0030] Figure 10 This diagram illustrates the processing fluid supply operation of the processing fluid supply device in this embodiment.

[0031] Figure 11 This is a graph showing the time-varying pressure of the primary side of the pressure regulating valve and the time-varying particle number in this embodiment. Detailed Implementation

[0032] The following is a reference to the appendix. Figure 1 Embodiments of the present invention will be described below. Furthermore, the same or equivalent parts are labeled with the same reference numerals in the figures without repetition of descriptions. Additionally, for ease of explanation, a three-dimensional orthogonal coordinate system (X, Y, Z) is appropriately shown in the figures. Furthermore, in the figures, the X and Y axes are parallel to the horizontal direction, while the Z axis is parallel to the vertical direction.

[0033] First, refer to Figure 1 The substrate processing apparatus 100 will be described below. Figure 1 This is a top view showing the interior of the substrate processing apparatus 100. Figure 1 The substrate processing apparatus 100 shown processes the substrate W using a processing liquid.

[0034] The substrate W can be, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disc, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell.

[0035] The treatment solution may be a chemical solution. Examples of chemical solutions include diluted hydrofluoric acid (DHF), hydrofluoric acid (HF), fluoronitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia, hydrogen peroxide solution, organic acids (e.g., citric acid, oxalic acid), organic bases (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid-hydrogen peroxide solution (SPM), ammonia-hydrogen peroxide solution (SC1), hydrochloric acid-hydrogen peroxide solution (SC2), isopropanol (IPA), surfactants, or corrosion inhibitors.

[0036] like Figure 1 As shown, the substrate processing apparatus 100 has multiple load ports LP, an indexer robot IR, a central robot CR, multiple processing units 1, a control device 2, multiple fluid tanks 3, and a processing liquid tank 4.

[0037] Each loading port LP holds multiple substrates W stacked together. A sorting robot IR moves substrates W between loading ports LP and a central robot CR. The central robot CR moves substrates W between the sorting robot IR and processing unit 1. Each processing unit 1 supplies processing fluid to substrates W for processing. Each fluid tank 3 contains fluid devices. The processing fluid tank 4 contains the processing fluid.

[0038] Specifically, multiple processing units 1 are formed in a top view and configured to surround a central robotic arm CR with multiple towers TW (in Figure 1 In this example, there are four towers (TW). Each tower (TW) includes multiple processing units 1 stacked vertically (in... Figure 1 In this example, there are three processing units 1. Multiple fluid tanks 3 correspond to multiple towers TW respectively. The processing liquid in the processing liquid tank 4 is supplied to all processing units 1 contained in the tower TW corresponding to any one of the fluid tanks 3 via any one of the fluid tanks 3.

[0039] Control device 2 controls the loading port LP, indexing robot IR, central robot CR, processing unit 1, fluid tank 3, and processing liquid tank 4. Control device 2 is, for example, a computer.

[0040] The control device 2 includes a control unit 21 and a storage unit 22. The control unit 21 includes a processor such as a CPU (Central Processing Unit). The storage unit 22 includes storage devices for storing data and computer programs. Specifically, the storage unit 22 includes a main storage device such as a semiconductor memory, and auxiliary storage devices such as semiconductor memory, solid-state drives, and / or hard disk drives. The storage unit 22 may also include removable media. The storage unit 22 is an example of a non-transitory computer-readable storage medium.

[0041] Secondly, refer to Figure 2 The processing unit 1 will be described below. Figure 2 This is a side view showing the interior of processing unit 1.

[0042] like Figure 2 As shown, the processing unit 1 includes a chamber 11, a rotary chuck 12, a rotary motor 13, a nozzle 14, a nozzle moving part 15, multiple stops 16, a standby container 17, and a nozzle 18. The substrate processing apparatus 100 also includes a processing liquid supply device 200, a drain pipe 7, a valve 8, a valve 19, and a pipe 20. The processing liquid supply device 200 includes a valve 5 and a pipe 6. Furthermore, the drain pipe 7 and the valve 8 can also be considered as structural components of the processing liquid supply device 200.

[0043] The chamber 11 has a generally box-shaped form. The chamber 11 houses a rotary chuck 12, a rotary motor 13, a nozzle 14, a nozzle moving part 15, multiple stops 16, a standby container 17, a nozzle 18, a portion of piping 6, a portion of drain piping 7, and a portion of piping 20. In addition, for example, valves 5, 8, and 19 may also be housed in the chamber 11.

[0044] The rotary chuck 12 holds the substrate W. Specifically, the rotary motor 13 rotates the rotary chuck 12 about the rotation axis AX1. Therefore, the rotary chuck 12 holds the substrate W horizontally while rotating the substrate W about the rotation axis AX1. Specifically, the rotary chuck 12 includes a rotating base 121 and a plurality of chuck members 122. The rotating base 121 is generally circular and supports the plurality of chuck members 122 in a horizontal position. The plurality of chuck members 122 hold the substrate W in a horizontal position.

[0045] The nozzle 14 sprays a processing liquid onto the substrate W. The nozzle moving part 15 raises or lowers the nozzle 14 or rotates the nozzle 14 horizontally about the rotation axis AX2. The nozzle moving part 15, for raising or lowering the nozzle 14, includes, for example, a ball screw mechanism and an electric motor that drives the ball screw mechanism. Similarly, the nozzle moving part 15, for rotating the nozzle 14 horizontally, includes, for example, an electric motor.

[0046] The processing fluid supply device 200 supplies processing fluid to the nozzle 14. Specifically, the processing fluid supply device 200 supplies processing fluid to the nozzle 14 via piping 6. Therefore, the processing fluid flows in piping 6. A valve 5 is disposed on piping 6. Moreover, the valve 5 opens and closes the flow path of piping 6, switching between supplying processing fluid to the nozzle 14 and stopping the supply.

[0047] The standby container 17 is positioned below the standby position of the nozzle 14. The standby position refers to a position further outward than the rotary chuck 12 relative to the rotation axis AX1. The standby container 17 receives the processing liquid ejected by the nozzle 14 located in the standby position. The nozzle moving part 15 rotates the nozzle 14 horizontally between the standby position and the processing position. The processing position of the nozzle 14 refers to a position above the substrate W. Before ejecting the processing liquid onto the substrate W, the nozzle 14 performs a pre-dispensing process in the standby position. The pre-dispensing process is the process of ejecting the processing liquid toward the standby container 17 before ejecting the processing liquid onto the substrate W. On the other hand, the nozzle 14 ejects the processing liquid toward the substrate W in the processing position. The standby container 17 corresponds to an example of the "liquid receiving part" of the present invention.

[0048] The standby container 17 is connected to a drain pipe 7. During pre-dispensing, the processing liquid received in the standby container 17 is discharged through the drain pipe 7. The drain pipe 7 is connected, for example, to a drain tank. A valve 8 is installed on the drain pipe 7. The valve 8 opens and closes the flow path of the drain pipe 7, switching between discharging processing liquid through the drain pipe 7 and stopping the discharge.

[0049] The nozzle 18 supplies rinsing fluid toward the substrate W. As a result, the treatment fluid is rinsed away from the substrate W. The rinsing fluid may be, for example, deionized water, carbonated water, electrolyzed water, hydrogen water, ozone water, or hydrochloric acid diluted to a concentration of, for example, about 10 ppm to 100 ppm.

[0050] Pipe 20 supplies flushing fluid to nozzle 18. Therefore, flushing fluid flows within pipe 20. Valve 19 is disposed on pipe 20. Valve 19 opens and closes the flow path of pipe 20, switching between supplying flushing fluid to nozzle 18 and stopping the supply.

[0051] Each baffle 16 has a generally cylindrical shape. Each baffle 16 blocks the processing liquid or rinsing liquid discharged from the substrate W.

[0052] Secondly, refer to Figure 3 The details of the treatment fluid supply device 200 are explained below. Figure 3 This is a diagram showing the processing fluid supply device 200. (See diagram for example.) Figure 3As shown, the processing fluid supply device 200 also includes a processing fluid tank 30, heaters 31 and 32, a temperature sensor 33, a pump 34, a pulse damper 35, a valve 36, a filter 37, a valve 38, temperature sensors 39 and 40, a pressure gauge 41, a temperature sensor 42, a pressure regulating valve 43, valves 44, 45, 46, 47, 48, and 49, an external circulation pipe 60, an internal circulation pipe 61, a drain pipe 62, a pipe 63, a drain pipe 64, and pipes 65 and 66. The external circulation pipe 60 corresponds to an example of the "first circulation pipe" of the present invention. The internal circulation pipe 61 corresponds to an example of the "second circulation pipe" of the present invention. In addition, the processing fluid supply device 200 includes multiple pipes 6 and multiple valves 5 corresponding to the multiple processing units 1.

[0053] Heaters 31 and 32, pump 34, valves 36 and 38, pressure regulating valve 43, and valves 5, 8, 44, 45, 46, 47, 48, and 49 are controlled by control device 2. Additionally, temperature sensors 33, 39, 40, and 42 detect the temperature of the processed liquid and output the detected temperature value to control device 2. Furthermore, pressure gauge 41 detects the pressure of the processed liquid and outputs the detected pressure value to control device 2.

[0054] Additionally, for example, the processing liquid tank 30, heaters 31 and 32, temperature sensor 33, pump 34, pulse damper 35, valve 36, filter 37, valve 38, temperature sensor 39, valves 44, 45, 46, 47, 48, 49, a portion of external circulation piping 60, internal circulation piping 61, a portion of drain piping 62, piping 63, a portion of drain piping 64, piping 65, and a portion of piping 66 are housed within the processing liquid tank 4. Figure 1 ).

[0055] On the other hand, for example, a portion of the external circulation piping 60, temperature sensor 40, pressure gauge 41, temperature sensor 42, pressure regulating valve 43, valve 5, and a portion of piping 6 are housed in the fluid tank 3. Figure 1 ).

[0056] The treatment fluid tank 30 stores the treatment fluid. Pipeline 66 replenishes the treatment fluid tank 30 with fresh fluid. Valve 49 is located on pipeline 66 to open and close the flow path of pipeline 66.

[0057] The upstream end 70 and downstream end 71 of the external circulation piping 60 are connected to the processing liquid tank 30. The external circulation piping 60 includes a first piping 601 and a second piping 602. One end of the first piping 601 is connected to the processing liquid tank 30, and the other end is connected to the filter 37. One end of the first piping 601 is the upstream end of the external circulation piping 60. One end of the second piping 602 is connected to the filter 37, and the other end is connected to the processing liquid tank 30. The other end of the second piping 602 is the downstream end of the external circulation piping 60. Furthermore, although the figures are omitted for simplicity, multiple second piping 602 correspond to multiple towers TW (TW). Figure 1 And, multiple second pipes 602 branch off on the secondary side of filter 37.

[0058] Heater 31, heater 32, pump 34, pulse damper 35, valve 36, and filter 37 are arranged in this order from upstream to downstream on the external circulation piping 60 (specifically, the first piping 601). Additionally, filter 37 is located at position 73 on the external circulation piping 60. Position 73 is downstream of pump 34 and upstream of branch position 74 and pressure regulating valve 43.

[0059] Heaters 31 and 32 heat the processing liquid in the processing liquid tank 30 to adjust the temperature of the processing liquid in the processing liquid tank 30. In addition, although the processing liquid supply device 200 has two heaters 31 and 32 connected in series in this embodiment, it may have one heater or more than three heaters.

[0060] Pump 34 delivers the processed liquid from the processed liquid tank 30 to the external circulation piping 60. Specifically, pump 34 delivers the processed liquid from the processed liquid tank 30 to the first piping 601. Temperature sensor 33, located at position 80 between heater 32 and pump 34, detects the temperature of the processed liquid flowing in the first piping 601. Pulse damper 35 suppresses pulsations in the processed liquid delivered from pump 34. Valve 36, located on the primary side of filter 37, opens and closes the flow path of the first piping 601.

[0061] Filter 37 captures particles contained in the processed liquid as it passes through. In other words, filter 37 removes particles contained in the processed liquid as it passes through. More specifically, filter 37 filters the processed liquid.

[0062] For example, filter 37 has multiple pores (not shown). The treatment liquid passes through the pores of filter 37. As a result, the treatment liquid is filtered by filter 37. Specifically, particles contained in the treatment liquid are adsorbed by the walls of the pores as they pass through the pores of filter 37 and are captured within the pores. As a result, the particles are removed from the treatment liquid.

[0063] If the flow rate of the processed liquid through filter 37 is high, the particle capture capacity of filter 37 will increase. That is, in the external circulation piping 60, if the circulation flow rate of the processed liquid increases, more particles will be captured by filter 37 because more processed liquid passes through it. On the other hand, if the flow rate of the processed liquid through filter 37 is low, the particle capture capacity of filter 37 will decrease. That is, in the external circulation piping 60, if the circulation flow rate of the processed liquid decreases, the particle capture capacity of filter 37 will decrease because the flow rate of the processed liquid through filter 37 is reduced.

[0064] Valve 38, located on the secondary side of filter 37, opens and closes the flow path of the second piping 602. Temperature sensor 39, located at position 81 further downstream of filter 37 and valve 38, detects the temperature of the processed liquid flowing in the second piping 602 (external circulation piping 60). Temperature sensor 40, located at position 82 further downstream of temperature sensor 39, detects the temperature of the processed liquid flowing in the second piping 602 (external circulation piping 60). Position 82 is located further upstream than branch position 74.

[0065] Pressure gauge 41, located at position 83 on the primary side of pressure regulating valve 43, detects the pressure of the processed fluid flowing in the second piping 602 (external circulation piping 60). That is, pressure gauge 41 detects the pressure on the primary side of pressure regulating valve 43. Position 83 is further downstream than branch position 74. Temperature sensor 42, located at position 84 on the primary side of pressure regulating valve 43, detects the temperature of the processed fluid flowing in the second piping 602 (external circulation piping 60). That is, temperature sensor 42 detects the temperature on the primary side of pressure regulating valve 43. Position 84 is further downstream than branch position 74.

[0066] The pressure regulating valve 43 is located downstream of the filter 37 and branch position 74, in the second piping 602 (external circulation piping 60). The pressure regulating valve 43 adjusts the pressure of the treated fluid to maintain a constant pressure. For example, when the primary side pressure of the pressure regulating valve 43 exceeds the target pressure, the pressure regulating valve 43 releases the primary side pressure to the secondary side, thus maintaining the primary side pressure at the target pressure. That is, the pressure regulating valve 43 sets the pressure of the treated fluid on the primary side of the pressure regulating valve 43 to the target pressure set by the pressure regulating valve 43. For example, control device 2 ( Figure 1 Set the target pressure for the pressure regulating valve 43. The pressure regulating valve 43 is, for example, a back pressure valve or a pressure relief valve.

[0067] The flow rate of the treatment fluid corresponding to the target pressure set by the pressure regulating valve 43 flows in the external circulation piping 60. For example, the lower the target pressure set by the pressure regulating valve 43, the greater the flow rate of the treatment fluid flowing in the external circulation piping 60. In other words, the higher the target pressure set by the pressure regulating valve 43, the smaller the flow rate of the treatment fluid flowing in the external circulation piping 60.

[0068] Multiple pipes 6 are connected to multiple branch points 74 of the external circulation pipe 60 (second pipe 602). Furthermore, the pipes 6 extend from the branch points 74 to the nozzle 14. The branch points 74 are located downstream of the filter 37 and upstream of the pressure regulating valve 43. Hereinafter, the pressure regulating valve 43 may be simply referred to as "valve 43".

[0069] The internal circulation piping 61 extends from the branch point 72 of the first piping 601 (external circulation piping 60) to the treatment fluid tank 30. The branch point 72 is located downstream of the pump 34 and upstream of the filter 37. A valve 44 is disposed on the internal circulation piping 61. Moreover, the valve 44 opens and closes the flow path of the internal circulation piping 61.

[0070] A drain pipe 62 extends from the filter 37. The drain pipe 62 is used to drain the processed liquid present inside the filter 37 (specifically, the internal primary side). Specifically, one end of the drain pipe 62 is connected to the internal primary side space of the filter 37, and the other end is connected, for example, to a drain trough. A valve 45 is disposed on the drain pipe 62. Furthermore, the valve 45 opens and closes the flow path of the drain pipe 62.

[0071] A drain pipe 64 extends from the filter 37. The drain pipe 64 is used to drain the processed liquid present inside the filter 37 (specifically, the internal secondary side). Specifically, one end of the drain pipe 64 is connected to the internal secondary side space of the filter 37, and the other end is connected, for example, to a drain trough. A valve 46 is disposed on the drain pipe 64. Furthermore, the valve 46 opens and closes the flow path of the drain pipe 64.

[0072] Pipe 63 extends from filter 37 to treatment liquid tank 30. Pipe 63 is used for bubble removal inside (specifically, the internal primary side) of filter 37, which is the cause of particulate generation. Specifically, one end of pipe 63 is connected to the internal primary side space of filter 37, and the other end of pipe 63 is connected to treatment liquid tank 30. Valve 47 is disposed on pipe 63. Moreover, valve 47 opens and closes the flow path of pipe 63.

[0073] Pipe 65 extends from filter 37 to treatment liquid tank 30. Pipe 65 is used for bubble removal inside (specifically, the internal secondary side) of filter 37, which is the cause of particulate generation. Specifically, one end of pipe 65 is connected to the internal secondary side space of filter 37, and the other end of pipe 65 is connected to treatment liquid tank 30. Valve 48 is disposed on pipe 65. Moreover, valve 48 opens and closes the flow path of pipe 65.

[0074] Secondly, refer to Figures 4 to 10 The substrate processing method of this embodiment will be described. Figure 4 This is a flowchart illustrating the substrate processing method of this embodiment. Figure 5 This is a diagram showing the internal circulation operation of the treatment fluid supply device 200. Figure 6 This diagram illustrates the filter draining operation of the treatment fluid supply device 200. Figure 7 This is a diagram showing the external circulation operation of the treatment fluid supply device 200 under the first pressure P1. Figure 8 This diagram illustrates the pre-distribution operation of the processing fluid supply device 200. Figure 9 This is a diagram showing the external circulation operation of the treatment fluid supply device 200 under the second pressure P2. Figure 10 This diagram illustrates the processing fluid supply operation of the processing fluid supply device 200.

[0075] exist Figures 5 to 10 In the markings for valves 5, 8, 36, 38, 43, 44, 45, 46, 47, and 48, white indicates the valve is closed, while black indicates the valve is open. Similarly, in the markings for pump 34, a white triangle indicates pump 34 is stopped, while a black triangle indicates pump 34 is in operation. Furthermore, the flow path of the treated fluid is indicated by thick lines.

[0076] like Figure 4 As shown, the substrate processing method of this embodiment includes steps S1 to S10. Step S4 includes step S40. Step S5 includes step S50. The substrate processing method is performed by the substrate processing apparatus 100. In particular, steps S1 to S5 constitute a processing liquid circulation method. The processing liquid circulation method is performed by a processing liquid supply apparatus 200. In the processing liquid circulation method, the processing liquid is circulated in the processing liquid supply apparatus 200 that supplies processing liquid to nozzles 14, which spray the processing liquid onto the substrate W.

[0077] like Figure 4 and Figure 5 As shown, firstly, in process S1, the processing fluid supply device 200 drives the pump 34 to maintain the pressure (ejection pressure) of the pump 34 at a constant level. Specifically, the control device 2 ( Figure 1Pump 34 is controlled in such a way that the pressure (ejection pressure) of pump 34 is kept constant. Step S1 corresponds to an example of the "pressure holding step" of the present invention.

[0078] Next, in step S2, the processing fluid supply device 200 circulates the processing fluid internally. Internal circulation means that the processing fluid is circulated through the internal circulation piping 61. Step S2 is an example of the "circulation step" of the present invention.

[0079] Specifically, such as Figure 5 As shown, the processing fluid supply device 200 opens valve 44 and closes valves 5, 8, 36, 38, 43, 45, 46, 47, and 48 under the control of the control device 2. As a result, the processing fluid stored in the processing fluid tank 30 circulates through the first piping 601 and the internal circulation piping 61. In this case, the control device 2 monitors the temperature of the processing fluid detected by the temperature sensor 33 and controls the heaters 31 and 32 to ensure that the temperature of the internally circulated processing fluid reaches the target temperature. If the temperature of the internally circulated processing fluid reaches the target temperature, the process proceeds to step S3.

[0080] That is, in step S2, before step S3, the processing fluid supply device 200 circulates the processing fluid by supplying it to the internal circulation pipe 61 while the pressure of the pump 34 is kept constant. As a result, the temperature of the processing fluid can reach the target temperature before step S3.

[0081] Secondly, such as Figure 4 and Figure 6 As shown, in process S3, the processing liquid supply device 200 discharges the processing liquid inside the filter 37 to the drain pipe 62. Figure 6 In this example, the treatment fluid supply device 200 discharges the treatment fluid present in the primary side space inside the filter 37 to the drain pipe 62. Step S3 corresponds to an example of the "drainage step" of the present invention.

[0082] Specifically, such as Figure 6 As shown, the treatment fluid supply device 200, under the control of the control device 2, opens valves 36 and 45 only during a specified drainage period and closes valves 5, 8, 38, 43, 44, 46, 47, and 48. Therefore, during the specified drainage period, the treatment fluid inside the filter 37 is discharged to the drainage pipe 62. As a result, particles in the treatment fluid are also discharged from the drainage pipe 62. Furthermore, the specified drainage period is determined in advance, for example, through experimentation and / or experience.

[0083] That is, before step S4, the processing liquid supply device 200 discharges the processing liquid from the filter 37 to the drain pipe 62 while the pressure of the pump 34 is kept constant. Therefore, particles present on the primary side of the filter 37, as well as particles present inside the filter 37 (internal primary side), can be discharged through the drain pipe 62. As a result, the particles contained in the processing liquid can be effectively reduced.

[0084] Furthermore, for example in step S3, the processing fluid supply device 200 may open valve 46 either simultaneously with opening valve 45 or only during a constant period before opening valve 45. In this case, particles present inside the filter 37 (internal secondary side) can be discharged through the drain pipe 64. As a result, the particles contained in the processing fluid can be reduced more effectively.

[0085] Secondly, such as Figure 4 and Figure 7 As shown, in step S4, the processing liquid supply device 200 circulates the processing liquid externally. External circulation means circulating the processing liquid through the external circulation pipe 60. Specifically, in step S4, the processing liquid supply device 200 sets the pressure of the processing liquid to a first pressure P1 and circulates the processing liquid externally. The first pressure P1 is lower than the second pressure P2. The second pressure P2 represents the pressure of the processing liquid flowing in the external circulation pipe 60 when the processing liquid is sprayed from the nozzle 14 onto the substrate W. That is, the second pressure P2 represents the pressure of the processing liquid when the processing liquid is supplied from the external circulation pipe 60 to the nozzle 14 via the pipe 6 when the processing liquid is sprayed from the nozzle 14 onto the substrate W. Step S4 corresponds to an example of the "first circulation step" of the present invention.

[0086] Specifically, such as Figure 7 As shown, the processing fluid supply device 200, under the control of the control device 2, opens valves 36, 38, and 43 only during the first cycle and closes valves 5, 8, 45, 46, 47, and 48. As a result, during the first cycle, the processing fluid stored in the processing fluid tank 30 circulates through the external circulation pipe 60. In this case, the control device 2 sets the pressure of the processing fluid to the first pressure P1 by setting the target pressure of the pressure regulating valve 43 to the first pressure P1. Therefore, the processing fluid circulates in the external circulation pipe 60 at a flow rate corresponding to the first pressure P1. Furthermore, the first cycle period is predetermined, for example, through experimentation and / or experience. The first cycle period is the external circulation period at the first pressure P1. Additionally, if the target pressure of the pressure regulating valve 43 is set to the first pressure P1, since the pressure of the processing fluid on the primary side of the pressure regulating valve 43 becomes the first pressure P1, the pressure of the processing fluid to be detected by the pressure gauge 41 is the first pressure P1.

[0087] That is, in step S4, the processing fluid supply device 200, with the pressure of pump 34 maintained at a constant state, sets the pressure of the processing fluid to a first pressure P1 via pressure regulating valve 43, thereby circulating the processing fluid through external circulation piping 60. Therefore, compared to setting the pressure of the processing fluid to a second pressure P2 (> first pressure P1), the flow rate of the processing fluid flowing in external circulation piping 60 can be increased. As a result, the particle capture capacity of filter 37 can be improved, thereby more effectively reducing the particles contained in the processing fluid.

[0088] Furthermore, the opening degree of the pressure regulating valve 43 when the target pressure is set to the first pressure P1 is relatively larger than the opening degree of the pressure regulating valve 43 when the target pressure is set to the second pressure P2. This is because the first pressure P1 is smaller than the second pressure P2.

[0089] In addition, such as Figure 4 and Figure 8 As shown, preferably, the processing liquid supply device 200 performs process S40 during the execution of process S4.

[0090] In step S40, the processing liquid supply device 200 causes the nozzle 14 to perform a first pre-dispensing process. The first pre-dispensing process refers to the process where, before the nozzle 14 sprays processing liquid onto the substrate W and during the execution of step S4, the nozzle 14 sprays processing liquid toward the standby container 17. Specifically, in step S40, the processing liquid supply device 200 sets the pressure of the processing liquid to a first pressure P1 to cause the nozzle 14 to perform the first pre-dispensing process. Step S40 corresponds to an example of the "first pre-dispensing process" of the present invention.

[0091] Specifically, such as Figure 8 As shown, the treatment fluid supply device 200, under the control of the control device 2, opens valves 5, 8, 36, 38, and 43 only during the first drainage period, and closes valves 45, 46, 47, and 48. As a result, during the first drainage period, the treatment fluid flowing in the external circulation piping 60 is supplied from piping 6 to nozzle 14. Then, nozzle 14 sprays treatment fluid into the standby container 17 during the first drainage period. Therefore, during the first drainage period, the treatment fluid in the standby container 17 is discharged to the drainage piping 7. As a result, particles in the treatment fluid are also discharged from the drainage piping 7. Furthermore, the first drainage period is predetermined, for example, through experimentation and / or experience.

[0092] That is, in step S40, the nozzle 14 performs a first pre-dispensing process by supplying the treatment fluid from the external circulation pipe 60 to the nozzle 14. Therefore, particles present between the secondary side of the filter 37 and the nozzle 14 are removed by the drain pipe 7. As a result, the particles contained in the treatment fluid can be reduced more effectively.

[0093] Furthermore, the processing fluid supply device 200 can also perform process S40 multiple times during the execution of process S4. By performing process S40 multiple times, the particulate matter contained in the processing fluid can be reduced more effectively. When performing process S40 multiple times, the processing fluid supply device 200 performs process S40 periodically or irregularly.

[0094] For example, the lower the temperature of the processing fluid, the more times the processing fluid supply device 200 performs step S40. This is because the lower the temperature of the processing fluid, the higher its viscosity, making it difficult for the fluid to circulate. If the processing fluid cannot circulate, the particle capture capacity of the filter 37 decreases; therefore, by increasing the number of steps S40, particles can be effectively reduced. Similarly, for the same reason, for example, the higher the concentration of the processing fluid, the more times the processing fluid supply device 200 can perform step S40. Furthermore, for the same reason, for example, the higher the viscosity of the processing fluid, the more times the processing fluid supply device 200 can perform step S40.

[0095] In addition, the processing fluid supply device 200 can also remove air bubbles inside the filter 37 by opening valves 47 and 48 in process S4.

[0096] Secondly, such as Figure 4 and Figure 9 As shown, in step S5, the processing fluid supply device 200 circulates the processing fluid externally. Specifically, in step S5, the processing fluid supply device 200 sets the pressure of the processing fluid to a second pressure P2 to circulate the processing fluid externally. The second pressure P2 is higher than the first pressure P1. Step S5 corresponds to an example of the "second circulation step" of the present invention.

[0097] Specifically, such as Figure 9 As shown, the processing fluid supply device 200, under the control of the control device 2, opens valves 36, 38, and 43 only during the second cycle and closes valves 5, 8, 45, 46, 47, and 48. As a result, during the second cycle, the processing fluid stored in the processing fluid tank 30 circulates through the external circulation pipe 60. In this case, the control device 2 sets the target pressure of the pressure regulating valve 43 to the second pressure P2, and thus sets the pressure of the processing fluid to the second pressure P2. Therefore, the processing fluid circulates in the external circulation pipe 60 at a flow rate corresponding to the second pressure P2. Furthermore, the second cycle period is predetermined, for example, through experimentation and / or experience. The second cycle period is the external circulation period at the second pressure P2. Additionally, if the target pressure of the pressure regulating valve 43 is set to the second pressure P2, since the pressure of the processing fluid on the primary side of the pressure regulating valve 43 becomes the second pressure P2, the pressure of the processing fluid to be detected by the pressure gauge 41 is the second pressure P2.

[0098] That is, in process S5, while the pressure of pump 34 is kept constant, the processing liquid supply device 200 sets the pressure of the processing liquid to a second pressure P2 (> first pressure P1) via pressure regulating valve 43, and circulates the processing liquid through external circulation piping 60. Therefore, the pressure of the processing liquid increases. As a result, the pressure of the processing liquid can be set to an appropriate value for spraying the processing liquid onto the substrate W through nozzle 14.

[0099] In addition, such as Figure 4 and Figure 8 As shown, preferably, the processing liquid supply device 200 performs process S50 during the execution of process S5.

[0100] In step S50, the processing liquid supply device 200 causes the nozzle 14 to perform a second pre-dispensing process. The second pre-dispensing process refers to the process where, before the nozzle 14 sprays processing liquid onto the substrate W and during the execution of step S5, the nozzle 14 sprays processing liquid toward the standby container 17. Specifically, in step S50, the processing liquid supply device 200 sets the pressure of the processing liquid to a second pressure P2, causing the nozzle 14 to perform the second pre-dispensing process. Step S50 corresponds to an example of the "second pre-dispensing process" of the present invention.

[0101] Specifically, such as Figure 8 As shown, the treatment fluid supply device 200, under the control of the control device 2, opens valves 5, 8, 36, 38, and 43 only during the second drainage period, and closes valves 45, 46, 47, and 48. As a result, during the second drainage period, the treatment fluid flowing in the external circulation piping 60 is supplied from piping 6 to nozzle 14. Then, nozzle 14 sprays treatment fluid into the standby container 17 during the second drainage period. Therefore, during the second drainage period, the treatment fluid in the standby container 17 is discharged to the drainage piping 7. As a result, particles in the treatment fluid are also discharged from the drainage piping 7. Furthermore, the second drainage period is predetermined, for example, through experimentation and / or experience.

[0102] That is, in step S50, the nozzle 14 performs a second pre-dispensing process by supplying treatment fluid from the external circulation pipe 60 to the nozzle 14. Therefore, particles present between the secondary side of the filter 37 and the nozzle 14 are removed by the drain pipe 7. As a result, the particles contained in the treatment fluid can be reduced more effectively.

[0103] Furthermore, the processing fluid supply device 200 can also perform process S50 multiple times during the execution of process S5. By performing process S50 multiple times, the particulate matter contained in the processing fluid can be reduced more effectively. When performing process S50 multiple times, the processing fluid supply device 200 performs process S50 periodically or irregularly.

[0104] For example, the lower the temperature of the processing liquid, the more times the processing liquid supply device 200 performs step S50. The reasoning is the same as for performing step S40 multiple times. Furthermore, for the same reason, for example, the higher the concentration of the processing liquid, the more times the processing liquid supply device 200 can perform step S50. Moreover, for the same reason, for example, the higher the viscosity of the processing liquid, the more times the processing liquid supply device 200 can perform step S50.

[0105] In addition, the processing fluid supply device 200 can also remove air bubbles inside the filter 37 by opening valves 47 and 48 in process S5.

[0106] Secondly, such as Figure 1 , Figure 2 ,as well as Figure 4 As shown, in process S6, the central robot CR moves the substrate W into the processing unit 1. Then, in the processing unit 1, the rotating chuck 12 holds the substrate W while rotating it.

[0107] Secondly, such as Figure 4 and Figure 10 As shown, in step S7, the processing liquid supply device 200 supplies processing liquid from the external circulation pipe 60 to the nozzles 14 via the pipe 6. As a result, the nozzles 14 spray the processing liquid onto the substrate W. Then, the substrate W is processed by the processing liquid. Step S7 corresponds to an example of the "processing liquid supply step" of the present invention. In addition, step S7 may also be included in the processing liquid circulation method of this embodiment.

[0108] Specifically, such as Figure 10 As shown, the processing fluid supply device 200, under the control of the control device 2, opens valves 5, 36, 38, and 43 only during a specified processing period, and closes valves 8, 45, 46, 47, and 48. As a result, during the specified processing period, the processing fluid flowing in the external circulation piping 60 is supplied from piping 6 to nozzle 14. Then, during the specified processing period, nozzle 14 sprays the processing fluid onto the substrate W. If the specified processing period has elapsed since valve 5 was opened, valve 5 is closed, and the spraying of the processing fluid from nozzle 14 is stopped. Furthermore, the specified processing period is predetermined according to the processing purpose of the substrate W.

[0109] That is, in step S7, the treatment fluid supply device 200 supplies treatment fluid from the external circulation pipe 60 to the nozzle 14 after step S5. Figure 4 In the example, in step S7, after step S50, the processing liquid supply device 200 supplies processing liquid from the external circulation pipe 60 to the nozzle 14. Then, the processing liquid supplied to the nozzle 14 is sprayed onto the substrate W through the nozzle 14. As a result, the substrate W can be processed with a processing liquid containing fewer particles.

[0110] Secondly, such as Figure 2 and Figure 4 As shown, in process S8, nozzle 18 sprays rinsing liquid onto substrate W. As a result, the processing liquid on substrate W is washed away by the rinsing liquid.

[0111] Specifically, such as Figure 2 As shown, if valve 19 is opened, nozzle 18 sprays rinsing fluid onto substrate W. If a predetermined rinsing period has elapsed after valve 19 has been opened, valve 19 is closed, and the spraying of rinsing fluid from nozzle 18 stops. Furthermore, the predetermined rinsing period is determined in advance, for example, through experimentation and / or experience.

[0112] Secondly, such as Figure 2 and Figure 4 As shown, in process S9, the substrate W is dried by high-speed rotation of the substrate W.

[0113] Specifically, the rotary motor 13 accelerates the substrate W in the rotational direction, causing the substrate W to rotate at a high speed greater than the rotational speed of the substrate W in steps S7 and S8. As a result, liquid is removed from the substrate W, and the substrate W dries. If a predetermined drying period has elapsed since the high-speed rotation of the substrate W was initiated, the rotary motor 13 stops rotating. Then, the rotation of the substrate W stops. Furthermore, the predetermined drying period is determined in advance, for example, through experimentation and / or experience.

[0114] Secondly, such as Figure 1 , Figure 2 ,as well as Figure 4 As shown, in process S10, the central robot CR removes the substrate W from the processing unit 1. That is, the processed substrate W is removed from the chamber 11. Then, the substrate processing method ends.

[0115] Secondly, refer to Figure 4 and Figure 11 The following will explain how the processing liquid supply device 200 of this embodiment can effectively reduce the number of particles in the processing liquid. Figure 11 This is a graph showing the time-varying changes in the primary side pressure of the pressure regulating valve 43 and the time-varying changes in the number of particles. In graph GP1, the horizontal axis represents time, and the vertical axis represents the pressure of the processing fluid. In this case, the pressure of the processing fluid represents the primary side pressure of the pressure regulating valve 43. That is, the pressure of the processing fluid represents the pressure of the processing fluid measured by the pressure gauge 41. Additionally, in graph GP2, the horizontal axis represents time, and the vertical axis represents the number of particles in the processing fluid. The number of particles represents the number of particles contained in the processing fluid on the substrate W after the processing fluid is sprayed onto the substrate W.

[0116] like Figure 11 As shown, during the execution of the inner loop (process S2), the number of particles is the highest at time t1.

[0117] Then, through the execution of filter drainage (step S3), the number of particles at time t2 is reduced compared to the number of particles at time t1. This is because particles located on the primary side of filter 37, as well as particles located inside filter 37, are discharged by the drainage pipe 62.

[0118] Secondly, through the execution of external circulation (process S4) at the first pressure P1, the number of particles at time t3 is reduced compared to the number of particles at time t2. This is because at time t3, the pressure of the processing fluid is set to the first pressure P1 (< the second pressure P2), thereby increasing the circulation flow rate of the processing fluid, allowing the filter 37 to capture more particles. That is, if the circulation flow rate of the processing fluid increases, more particles are captured by the filter 37 because more processing fluid passes through it. Specifically, particles located on the secondary side of the filter 37 flow from the primary side into the filter 37 through external circulation and are thus captured by the filter 37.

[0119] Secondly, at time t4, immediately after the external circulation begins under the first pressure P1, the first pre-distribution process (step S40) is performed. Therefore, particles present between the secondary side of filter 37 and nozzle 14 are removed by the drain pipe 7. As a result, the number of particles at time t4 is reduced compared to the number of particles at time t3.

[0120] Secondly, at time t5 in the external circulation under the first pressure P1, the first pre-distribution process (step S40) is performed again. Therefore, particles present between the secondary side of the filter 37 and the nozzle 14 are further removed through the drain pipe 7. As a result, the number of particles at time t5 is reduced compared to the number of particles at time t4.

[0121] Secondly, due to the execution of external circulation (process S5) under the second pressure P2, the number of particles at time t6 is slightly higher than that at time t5. This is because at time t6, the pressure of the processing fluid is set to the second pressure P2 (> the first pressure P1), thereby reducing the circulation flow rate of the processing fluid and slightly decreasing the particle capture capacity of filter 37. In other words, if the circulation flow rate of the processing fluid decreases, the particle capture capacity of filter 37 decreases because the flow rate of the processing fluid through filter 37 is reduced.

[0122] Therefore, at time t7, immediately after the external circulation begins under the second pressure P2, the second pre-distribution process (step S50) is performed. As a result, particles present between the secondary side of filter 37 and nozzle 18 are removed by the drain pipe 7. Consequently, the number of particles at time t7 is reduced compared to the number of particles at time t6.

[0123] Then, the processing liquid is supplied to the nozzle 14 via external circulation under the second pressure P2. In this case, the number of particles contained in the processing liquid is greatly reduced. As a result, the substrate W can be processed with a processing liquid containing very few particles. In addition, the second pressure P2 (> the first pressure P1) ensures the ejection pressure required for the nozzle 14 to eject the processing liquid to the substrate W.

[0124] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described above, and can be implemented in various embodiments without departing from the spirit of the invention. Furthermore, the various structural components disclosed in the above embodiments can be appropriately modified. For example, one of the structural components shown in one embodiment may be added to a structural component in another embodiment, or several structural components shown in one embodiment may be deleted from the embodiment.

[0125] To facilitate understanding of the invention, the accompanying drawings schematically illustrate the various structural components. However, the thickness, length, number, and spacing of the illustrated structural components may differ from the actual components due to considerations in the creation of the drawings. Furthermore, the structures of the structural components shown in the above embodiments are merely examples and are not particularly limited; various modifications can certainly be made without substantially departing from the technical effects of the invention.

[0126] (1) In this embodiment, Figure 4 The treatment fluid circulation method shown only needs to include at least steps S1 and S4. This is because it can effectively remove particles contained in the treatment fluid. Therefore, the treatment fluid circulation method may also omit steps S2, S3, and S5. Alternatively, the treatment fluid circulation method may include more than one of steps S2, S3, and S5. Furthermore, step S4 may omit step S40. Additionally, step S5 may omit step S50.

[0127] (2) Figure 3 The processing fluid supply device 200 shown may also be without valve 38. The reason is as follows. That is, for example, in step S3, when the temperature of the processing fluid is low, the viscosity of the processing fluid is high, so even without valve 38, the processing fluid is difficult to flow to the secondary side of filter 37. Therefore, the processing fluid flows to drain pipe 62, and step S3 can be easily performed.

[0128] (3) Figure 3The processing fluid supply device 200 shown may also be without valve 36. The reason is as follows. That is, for example, in step S2, because the temperature of the processing fluid is low and the viscosity of the processing fluid is high, even without valve 36, the processing fluid is difficult to flow to the secondary side of filter 37 and drain pipe 62. Therefore, the processing fluid flows to internal circulation pipe 61, and step S2 can be easily executed.

[0129] (4) Figure 3 The processing fluid supply device 200 shown may also be without valves 36 and 38. The reasons are as explained in (1) and (2) above.

[0130] Industrial availability

[0131] This invention relates to a method for circulating a processing liquid and a method for processing a substrate, and is industrially applicable.

[0132] Explanation of reference numerals in the attached figures:

[0133] 6 piping

[0134] 14 nozzles

[0135] 17 Standby Container (Liquid Receiving Section)

[0136] 30 treatment liquid tank

[0137] 34 pumps

[0138] 37 Filter

[0139] 43 Pressure regulating valve

[0140] 60 External circulation piping (first circulation piping)

[0141] 61 Internal circulation piping (secondary circulation piping)

[0142] 62, 64 drain piping

[0143] 100 substrate processing apparatus

[0144] 200 processing fluid supply device

Claims

1. A processing liquid circulation method, comprising circulating the processing liquid in a processing liquid supply device that supplies the processing liquid to a nozzle that sprays the processing liquid onto a substrate, wherein, The processing fluid supply device has: A treatment liquid tank is used to store the treatment liquid. The first circulation piping is connected to the treatment liquid tank at its upstream end and at its downstream end, and the first circulation piping circulates the treatment liquid. A piping system, connected to the first circulation piping system, supplies the treatment fluid to the nozzle; A pump, configured in the first circulation piping, delivers the treatment liquid. A filter, configured in the first circulation piping, captures particles contained in the treatment liquid; as well as A pressure regulating valve, located downstream of the filter in the first circulation piping, adjusts the pressure of the treatment fluid circulating in the first circulation piping. The treatment fluid circulation method includes: The pressure holding process maintains the pressure of the pump at a constant level. as well as In the first circulation process, with the pump pressure maintained at a constant level, the pressure of the treatment fluid is set to a first pressure via the pressure regulating valve, causing the treatment fluid to circulate through the first circulation piping. The first pressure is lower than the second pressure. The second pressure represents the pressure of the processing liquid flowing in the first circulation piping when the nozzle sprays the processing liquid onto the substrate.

2. The treatment liquid circulation method as described in claim 1, wherein, The first circulation process includes a first pre-dispensing process, which involves supplying the treatment fluid to the nozzle from the first circulation piping, causing the nozzle to perform a first pre-dispensing treatment. The first pre-dispensing process refers to the process of the nozzle spraying the processing liquid toward the liquid receiving part before the nozzle sprays the processing liquid toward the substrate.

3. The treatment liquid circulation method as described in claim 1 or 2, wherein, The treatment fluid supply device also has a drain pipe extending from the filter. The treatment fluid circulation method further includes a drainage process, prior to the first circulation process, in which the pressure of the pump is kept constant, the treatment fluid is discharged from the filter to the drainage pipe.

4. The treatment fluid circulation method as described in claim 3, wherein, The treatment fluid supply device further includes: a second circulation pipe extending from the first circulation pipe to the treatment fluid tank on the primary side of the filter. The treatment fluid circulation method further includes a circulation process in which the treatment fluid is supplied to the second circulation pipe to circulate the treatment fluid before the drainage process, while the pump pressure is kept constant.

5. The treatment fluid circulation method as described in claim 1 or 2, wherein, The treatment fluid circulation method further includes: after the first circulation step, while the pump pressure is kept constant, a second circulation step is performed by setting the pressure of the treatment fluid to the second pressure through the pressure regulating valve, so that the treatment fluid circulates through the first circulation piping.

6. The treatment fluid circulation method as described in claim 5, wherein, The second circulation process includes a second pre-dispensing process in which the nozzle performs a second pre-dispensing treatment by supplying the treatment fluid from the first circulation piping to the nozzle. The second pre-dispensing process refers to the process of the nozzle spraying the processing liquid toward the liquid receiving part before the nozzle sprays the processing liquid toward the substrate.

7. The process fluid circulation method as claimed in claim 6, wherein, The treatment fluid circulation method further includes a treatment fluid supply step, which involves supplying the treatment fluid from the first circulation pipe to the nozzle after the second pre-distribution step.

8. A substrate processing method, wherein the substrate is treated with a processing solution, wherein, The processing liquid supplied to the nozzle in the processing liquid supply step of the processing liquid circulation method of claim 7 is sprayed onto the substrate through the nozzle.

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