A soldering tool for a rigid-flex combined board double-sided ceramic array device and a method of using the same

Abstract

The application discloses a welding tool for rigid-flex combination board double-sided ceramic array devices, which comprises a tool body, a flexible area protective cover and a heat shield; the tool body is internally provided with a concave cavity and a connecting part, a through groove is arranged in the concave cavity, and a magnetic positioning member is arranged on one side of the concave cavity and the connecting part; the flexible area protective cover is detachably mounted on the tool body and located above the connecting part. The welding tool for rigid-flex combination board double-sided ceramic array devices and the using method thereof effectively ensure the position precision of the mother board and the daughter board of batch rigid-flex combination boards in the welding process, effectively avoid the remelting problem of the rigid-flex combination board double-sided ceramic array devices during welding, realize high-reliability welding of the double-sided ceramic array devices based on the same solder, and improve the consistency and production efficiency of the rigid-flex combination board double-sided welding ceramic array devices.

Description

Technical Field

[0001] This invention relates to the field of electronic assembly technology, specifically to the assembly and soldering fixtures for rigid-flex plate double-sided ceramic array devices and their usage methods. Background Technology

[0002] As military electronic equipment, including ground-based, airborne, missile-borne, and spaceborne systems, continues to evolve towards miniaturization, high frequency, large capacity, and high integration, printed circuit board assemblies (PCBAs), as essential components, are also gradually developing towards miniaturization, multi-functionality, high density, high precision, and high reliability. As is well known, rigid-flex boards combine rigid and flexible layers, breaking away from the traditional planar design of printed circuit boards. They enable three-dimensional assembly, replacing cable connections, significantly reducing assembly space, and are key to weight reduction. Therefore, they are widely used in printed circuit board assemblies for ground, aviation, and aerospace applications. Furthermore, rigid-flex boards utilize microwave digital hybrid technology, simultaneously deploying high-density components on both sides of the board. This allows for multi-level amplification, power division, combining, control, and power supply integration, effectively meeting the overall requirements of multi-channel, multi-beam, miniaturization, lightweight, and high integration systems. Furthermore, ceramic array devices (such as CBGA and CCGA) are a hermetically sealed packaging form with high packaging density, stable chemical properties, good thermal and electrical conductivity, and high long-term reliability. Therefore, they are widely used in high-reliability electronic products, especially in highly integrated rigid-flex boards. Thus, surface mount technology (SMT) of double-sided ceramic array devices on rigid-flex boards is a major trend in PCBA development.

[0003] However, since the rigid-flex plate has both flexible and rigid areas, there are problems with loading and fixing during production processes such as solder paste printing, chip mounting, reflow soldering, cleaning, and debugging.

[0004] Secondly, each rigid-flex PCB has dimensional tolerances, and the relative positions between the mother and daughter boards also have tolerances. These random tolerances inevitably affect the printing and mounting accuracy of the mother and daughter boards during mass SMT (Surface Mount Technology) of rigid-flex PCBs, thus impacting the reliability of component solder joints. Currently, most solutions address these issues by designing process edges, but GJB 3243A-2021, section 6.1.2, explicitly requires that "for PCBs with designed process clamping edges, components should not be placed within a 2mm to 5mm area of ​​the board edge." However, many existing high-density rigid-flex PCBs cannot meet this requirement.

[0005] In addition, the welding of double-sided ceramic array devices on high-density rigid-flex boards requires two SMT processes, both of which require the use of Sn63Pb37 solder paste, which is the most widely used and has stable welding performance. Sn63Pb37 tin-lead alloy solder has a eutectic point of 183℃ and has good welding performance, electrical conductivity, thermal conductivity and mechanical properties. It is the main welding material for electronic assembly. If two solder pastes with different melting points are used, it will not only increase the cost of board assembly, but also bring a series of reliability problems: (1) The temperature resistance of the components on the rigid-flex board (<250℃) limits the welding temperature to be too high. At the same time, the use environment of the rigid-flex board requires the solder to have a high-temperature service temperature as high as possible. (2) Most high-temperature solder paste (melting point >183℃) / low-temperature solder paste (melting point <183℃) are lead-free solder paste or non-eutectic solder paste. Their welding stability and performance are far inferior to Sn63Pb37 solder paste.

[0006] Because solder paste with the same melting point is used, during the soldering of the A-side ceramic array device, the B-side ceramic array device is prone to remelting and is also affected by gravity, making it impossible to guarantee the soldering quality of the B-side ceramic array device. As one of the key components of a highly integrated rigid-flex board assembly, the soldering quality of the ceramic array device directly determines the reliability of the board-level assembly.

[0007] Based on this, the present invention proposes a welding fixture for rigid-flex plate double-sided ceramic array devices and its usage method to solve the above-mentioned defects. Summary of the Invention

[0008] The technical problem to be solved by this invention is: how to solve the problems of load-bearing fixation, low batch welding accuracy, and reduced weld point reliability due to welding remelting of double-sided ceramic array devices in the current double-sided welding process of high-density rigid-flex plates.

[0009] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0010] A welding fixture for a rigid-flex plate double-sided ceramic array device includes a fixture body, a flexible area protective cover, and a heat insulation cover. The fixture body has a cavity and a connecting part. The cavity has a through groove. A magnetic positioning element is also provided on one side of the cavity and the connecting part. The flexible area protective cover can be detachably installed on the fixture body and is located above the connecting part. The heat insulation cover is installed on the back of the fixture body.

[0011] This invention, by combining structures such as recesses, through slots, flexible area protective covers, and magnetic positioning components, enables the stable mounting of rigid-flex PCBs onto the tooling body. It also solves common problems related to loading and fixing rigid-flex PCBs throughout the entire production process, including solder paste printing, surface mount technology (SMT), reflow soldering, and cleaning, as well as flexible area protection, ensuring the welding quality of the rigid-flex PCB assembly. The magnetic positioning components guarantee the positional accuracy of the mother and daughter boards during the assembly and welding of batches of rigid-flex PCBs, avoiding solder joint reliability issues caused by random tolerances. The heat insulation cover design balances the temperature difference between the two-sided ceramic array devices, effectively solving the problem of remelting of the B-side ceramic array devices during the welding of the A-side ceramic array devices on the rigid-flex PCB, achieving highly reliable welding of two-sided ceramic array devices based on the same solder.

[0012] As a further aspect of the present invention: the magnet positioning component includes a magnet, a magnet layout groove and a magnetic baffle. The magnet layout groove is formed on the tooling body and located on one side of the cavity and the connecting part, wherein the magnet is embedded in the magnet layout groove and is magnetically connected to the magnetic baffle.

[0013] As a further aspect of the present invention: the magnetic baffle is a block with an embedded magnet, wherein the distribution of the magnet is off-center from the center line of the corresponding block.

[0014] As a further aspect of the present invention: the tooling body further includes a plate taking part and a binding hole opened on one side of the cavity, as well as Mark points opened on both sides of the tooling body, and the binding hole binds the rigid-flexible plate to the tooling body by binding wire.

[0015] As a further aspect of the present invention: the connecting portion is located below the flexible region within the rigid-flexible bonded plate, and is limited in the Y direction, and the number of both is the same;

[0016] The connection point is located on one side of the rigid zone within the rigid-flexible plate and is limited in the X direction.

[0017] As a further aspect of the present invention: the bottom surface of the flexible region does not contact the top surface of the connecting part, and the two sides of the connecting part do not contact the surface of the adjacent rigid region.

[0018] As a further aspect of the present invention: the height of the bottom surface of the flexible region from the upper surface of the adjacent rigid region is h1 and h2, the thickness of the two adjacent rigid regions of the flexible region is H1 and H2, the sinking depth of the connecting part is h, and the length of the connecting part is l;

[0019] When h1 = h2, the sinking depth h of the connection part is greater than h1;

[0020] When |h1-h2|>0 and max{h1,h2}<min{H1,H2}, the sinking depth h of the connection part is >max{h1,h2};

[0021] When |h1-h2|>0 and max{h1,h2}≥min{H1,H2}, the sinking depth h of the connection part is the gradient value, and the sinking depths at both ends are greater than h1 and h2 respectively.

[0022] As a further aspect of the present invention, the length l of the connecting portion is 0.5 mm to 2 mm smaller than the length of the projected surface of the flexible region.

[0023] As a further aspect of the present invention: the material of the heat insulation cover is any one of polyimide, synthetic stone, graphite, and stainless steel; heat insulation material can be attached to the inner side of the heat insulation cover; the heat insulation material is heat insulation cotton or aerogel; and the thickness of the heat insulation material is 1mm-2mm.

[0024] This invention also discloses a method for mounting and soldering a rigid-flex plate double-sided ceramic array device, comprising the following steps:

[0025] S1. Clean the tooling assembly surface, place the bare rigid-flex plate on the tooling, and use a right-angled side of the rigid area of ​​the rigid-flex plate as the positioning surface. Use a magnetic block to perform high-precision positioning in the X / Y direction.

[0026] S2. Printing, mounting, and soldering of ceramic array devices on the B-side of the rigid-flex plate;

[0027] S3. After welding, remove the magnetic block and take the rigid-flexible plate off the tooling through the plate removal part.

[0028] S4. According to the heat insulation requirements of the ceramic array device on the B side of the rigid-flex plate bonding plate, heat insulation material is attached to the inside of the heat insulation cover.

[0029] S5. Place the rigid-flex plate with the B-side ceramic array device welded on the tooling, and use a right-angled side of the rigid area of ​​the rigid-flex plate as the positioning surface, and use a magnetic block to perform high-precision positioning in the X / Y direction.

[0030] S6. Refer to the Mark points on the tooling to print and mount the ceramic array devices on the A side of the rigid-flex board, and then perform component welding.

[0031] S7. After welding, remove the heat insulation cover, assemble the flexible area protective cover onto the tooling body, use binding wire to tie and fix the double-sided welded rigid-flexible joint plate to the tooling, and perform post-weld cleaning.

[0032] S8. After cleaning, remove the flexible area protective cover, binding wire, and magnetic block, and take off the welded rigid-flex plate assembly.

[0033] Compared with the prior art, the beneficial effects of the present invention are:

[0034] I. This invention, by combining structures such as concave cavities, through slots, flexible area protective covers, and magnetic positioning components, can stably install rigid-flex plates on the tooling body. It can also solve common problems of loading and fixing rigid-flex plates and protecting flexible areas throughout the entire production process, including printing solder paste, surface mount technology, reflow soldering, and cleaning, thus ensuring the welding quality of rigid-flex plate assemblies.

[0035] Second, the present invention, through the setting of magnetic positioning components, wherein the magnetic positioning components are magnets embedded in the blocks and the distribution of the magnets is off the center line of the blocks, can ensure that the magnetic force plays a positioning role during assembly, thus ensuring the positional accuracy of the mother and daughter boards during the assembly and welding process of batch rigid-flex boards, and avoiding the reliability problems of weld points caused by random tolerances.

[0036] Third, the design of the heat insulation cover of this invention balances the temperature difference of the double-sided ceramic array devices, effectively solving the problem of remelting of the B-sided ceramic array device when welding the A-sided ceramic array device of the rigid-flex plate, realizing highly reliable welding of double-sided ceramic array devices based on the same solder. Furthermore, the material of the heat insulation cover of this application can be any one of polyimide, synthetic stone, graphite, and stainless steel. According to the heat insulation requirements, heat insulation material can be attached to the inside of the heat insulation cover to achieve better heat insulation effect.

[0037] Fourth, the invention is simple in design and uses common materials; multiple components can be combined and used together, and a rigid-flex plate assembly can be reused after welding, which further reduces production costs and can be promoted in other applications. Attached Figure Description

[0038] Figure 1 This is a front structural diagram of the tooling body and the rigid-flexible bonding plate during assembly according to an embodiment of the present invention;

[0039] Figure 2 This is a schematic diagram of the back structure of the tooling body and the rigid-flexible bonding plate during assembly according to an embodiment of the present invention;

[0040] Figure 3 This is a cross-sectional view of the rigid-flexible bonding plate according to an embodiment of the present invention;

[0041] Figure 4 This is a schematic diagram of the A-side structure of the rigid-flex plate assembly for the double-sided ceramic array device according to an embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of the structure of the rigid-flex plate assembly of the double-sided ceramic array device according to an embodiment of the present invention;

[0043] Figure 6 This is a schematic diagram of the front side of the tooling for assembling and soldering the double-sided ceramic array device according to Embodiment 1 of the present invention;

[0044] Figure 7 This is a schematic diagram of the back side of the tooling used for assembling and soldering the double-sided ceramic array device according to Embodiment 1 of the present invention;

[0045] Figure 8 This is a schematic diagram of the structure of an "L"-shaped magnetic block according to an embodiment of the present invention;

[0046] Figure 9 This is a schematic diagram of the structure of the "I"-shaped magnetic block two according to an embodiment of the present invention;

[0047] Figure 10 This is a schematic diagram of the heat insulation cover structure according to an embodiment of the present invention;

[0048] Figure 11 This is a partial cross-sectional view of the assembly of the rigid-flexible plate and the tooling body at the connection point in Embodiment 1 of the present invention;

[0049] Figure 12 This is a cross-sectional view of the rigid-flexible plate of Embodiment 2 of the present invention;

[0050] Figure 13 This is a partial cross-sectional view of the rigid-flexible bonding plate and the tooling body during assembly according to Embodiment 2 of the present invention;

[0051] Explanation of reference numerals in the attached drawings: 1. Rigid-flexible bonded plate; 11. Sub-plate; 12. Flexible zone; 13. Mother plate; 2. Tooling body; 21. Cavity; 22. Connection part; 23. Through groove; 24. Magnet; 25. Magnet layout groove; 26. Plate removal part; 27. Mark point; 28. Wire binding hole; 29. ​​Edge overlap groove; 3. Magnetic stop; 31. "L"-shaped magnetic stop one; 32. "I"-shaped magnetic stop two; 4. Flexible zone protective cover; 5. Wire binding; 6. Elevating support column; 7. Heat insulation cover. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0053] Example 1

[0054] Reference Figure 3 , Figure 4 and Figure 5The rigid-flex plate 1 of this embodiment 1 includes three parts: a sub-plate 11, a flexible area 12, and a mother plate 13. Two CBGA packaged devices 111 and two CCGA packaged devices 112 need to be soldered to the A side of the sub-plate 11; sixteen CBGA packaged devices 131 need to be soldered to the A side of the mother plate 13, and three CBGA packaged devices 132 need to be soldered to the B side.

[0055] Reference Figure 1 , Figure 2 and Figure 10 The mounting fixture for rigid-flex double-sided ceramic array devices includes a fixture body 2, a magnetic baffle 3, a flexible area protective cover 4, binding wires 5, a support pillar 6, and a heat insulation cover 7 (e.g., Figure 10 As shown), the tool body 2, magnetic stop 3, and raised support 6 are made of any one of synthetic stone, graphite, or stainless steel.

[0056] Reference Figure 6 and Figure 7 The total thickness of the tooling body 2 is ≤20mm, the machining accuracy is better than ±0.03mm, and the flatness is better than ±0.05mm. The tooling body 2 includes two concave cavities 21, two through slots 23, a connecting part 22, twelve magnets 24, two magnet layout slots 25, two plate picking parts 26, three mark points 27, four binding holes 28 and two overlapping grooves 29.

[0057] The tooling body 2 has a cavity 21 inside, and a through groove 23 inside the cavity 21. The width of the through groove 23 at the junction with the cavity 21 is 1mm-4mm. The junction is used to support the rigid-flexible bonded plate 1 (i.e., the sub-plate 11 and the mother plate 13). At the same time, the junction must avoid the components on the edge of the B side of the rigid-flexible bonded plate to avoid interference during assembly. At this time, the through groove 23 is used to avoid obstruction during the welding process of the rigid-flexible bonded plate 1 and ensure effective heat transfer.

[0058] like Figure 1 As shown, the flexible area 12 is placed on the connecting part 22, and a magnetic positioning element composed of a magnet 24, a magnet layout groove 25 and a magnetic baffle 3 is also provided on one side of the cavity 21 and the connecting part 22.

[0059] It should be noted that the tooling body 2 also includes a plate-removing part 26 and a binding hole 28 on one side of the cavity 21, as well as Mark points 27 on both sides of the tooling body 2. It also includes an overlap groove 29 located on the rear side of the tooling body 2 for mounting the tooling body. The Mark point 27 is used for the equipment to identify the position of the rigid-flex plate 1 during the welding process to ensure assembly accuracy. The binding hole 28 binds the rigid-flex plate to the tooling body 2 with binding wire 5. The binding hole 28 and the binding wire 5 are used to bind and fix the rigid area of ​​the rigid-flex plate 1 to the tooling during the post-weld cleaning process to prevent the rigid-flex plate from shifting when the cleaning fluid is sprayed. The width of the overlap groove 29 is slightly larger than the width of the welding equipment track and is used for the overlap limit between the tooling body 2 and the welding equipment track.

[0060] Furthermore, refer to Figure 1 The number of connecting parts 22 is the same as the number of flexible areas 12. They are used to limit the rigid area and protect the flexible area 12. The connecting parts 22 are located below the flexible area within the rigid-flexible plate and limit it in the Y direction, and the number of both is the same. The connecting parts 22 are located on one side of the rigid area within the rigid-flexible plate and limit it in the X direction. The bottom surface of the flexible area does not contact the top of the connecting parts 22, which can prevent the flexible area 12 from being stressed. The two sides of the connecting parts 22 do not contact the surfaces of the adjacent rigid areas, which can prevent the flexible area 12 from being taut and leave a certain buffer margin for the flexible area 12.

[0061] Reference Figure 1 , Figure 6 A magnet layout groove 25 is formed on the tooling body 2 and located on one side of the cavity 21 and the connecting part 22. A magnet 24 is embedded in the magnet layout groove 25 and magnetically connected to a magnetic baffle 3. The magnetic baffle 3 is a stop block for the embedded magnets, and the distribution of the magnets is offset from the center line of the corresponding stop block, so that the magnetic force plays a positioning role during assembly. The magnets 24 are used in conjunction with the magnetic baffles. The number of magnets 24 on the tooling body 2 is the same as the number of magnets on the magnetic baffle 3, for high-precision positioning of the rigid-flexible joint plate in the X / Y directions.

[0062] It should be noted that the magnetic baffle 3 includes an "L"-shaped magnetic stop block 31 (such as...). Figure 8 (as shown) and the "I"-shaped magnetic stop block 2 32 (as shown) Figure 9 As shown), the "L"-shaped magnetic stop 31 has four sets, which are respectively locked between the sub-plate 11 and the mother plate 13, that is, one end abuts against the sub-plate 11 or the mother plate 13, and the other end abuts against the flexible area 12, so as to realize the limiting of the three (as shown). Figure 1 (as shown); while the "I"-shaped magnetic stop block 2 32 has two sets (as shown) Figure 1As shown), the magnets are located in the magnet layout slots 25 opened on the tooling body 2, and on one side of the sub-plate 11 and the mother plate 13, respectively. The center distribution of the magnets on the "I"-shaped magnetic stop block 32 is offset from the center line of the corresponding stop block (as shown). Figure 9 As shown, when the "I"-shaped magnetic stop 32 is installed in the corresponding magnet layout slot 25, the "I"-shaped magnetic stop 32 will move towards the magnet 24 on the magnet layout slot 25 to form a magnetic connection. During the movement, it can play a positioning role for the sub-board 11 and the mother board 13. The thickness of the "L"-shaped magnetic stop 31 and the "I"-shaped magnetic stop 32 in this application is 3mm-5mm.

[0063] Reference Figure 1 The flexible area protection cover 4 is detachably installed on the tooling body 2 and is located above the connection part 22. It is used to protect the flexible area 12 during the post-weld cleaning of the rigid-flexible bond plate 1, and to prevent the flexible area 12 from being stressed when the cleaning fluid is sprayed. The material of the flexible area protection cover 4 can be any one of synthetic stone, graphite, stainless steel, or aluminum alloy.

[0064] Reference Figure 1 The binding thread 5 is made of either natural or synthetic fibers.

[0065] Reference Figure 2 The support column 6 is located on the rear side of the tooling body 2. It can be an integral structure with the tooling body 2, or it can be fixed to the tooling body 2 with screws. It is used to raise the assembly of the tooling and the rigid-flexible joint plate 1 to avoid unevenness at the bottom of the assembly.

[0066] Reference Figure 2 The heat shield 7 is installed on the back of the fixture body 2 and is used to provide local heat insulation protection for the ceramic array device on the B side when welding the rigid-flex plate 1A side, so as to prevent it from remelting. The heat shield 7 can be fixed to the fixture body 2 with screws.

[0067] like Figure 3 and Figure 11 As shown, in this invention, the heights of the bottom surface of the flexible region from the upper surface of the adjacent rigid region are h1 and h2, the thicknesses of the two adjacent rigid regions of the flexible region are H1 and H2, the sinking depth of the connecting part 22 is h, and the length of the connecting part 22 is l.

[0068] To ensure that the heights of the sub-plate 11 and the mother plate 13 are on the same horizontal line, that the two plates do not shift randomly, and that the flexible area 12 is not stressed or taut, it is necessary to meet three conditions: the bottom surface of the flexible area 12 does not contact the top of the connecting part 22 to prevent the connecting part 22 from causing stress on the flexible area 12; and the two sides of the connecting part 22 do not contact the surfaces of the adjacent rigid areas (sub-plate 11 and mother plate 13) to prevent the flexible area 12 from taut and affecting its lifespan.

[0069] To satisfy the above conditions, in this invention, when h1 = h2, the sinking depth h of the connecting part 22 is greater than h1, and the length l of the connecting part 22 is smaller than the length of the projected surface of the flexible region. It should be noted that since h1 = h2, the length of the projected surface of the flexible region is the length L of the flexible region 12 (e.g., Figure 11 (As shown); the formula for calculating the length of the projected surface of the flexible region is: The calculation formula is based on the Pythagorean theorem.

[0070] In this embodiment, as Figure 3 As shown, let the thickness of the two adjacent rigid regions of the flexible region 12 be H1 = H2 = 4mm, the height of the bottom surface of the flexible region 12 from the upper surface of the adjacent rigid region be h1 = h2 = 2.1mm, the length of the flexible region 12 be L = 25mm; the sinking depth of the connection part 22 be h = 2.5mm (as shown). Figure 10 As shown, the connecting part 22 has a "convex" shaped structure. This shape prevents the rigid areas on both sides (sub-plate 11 and mother plate 13) from shifting randomly towards the flexible area 12 in the middle, affecting the lifespan of the flexible area 12. The length l of the upper surface of the connecting part 22 that is inserted into the flexible area 12 is 24.5 mm (here, the length l of the connecting part 22 is 0.5 mm smaller than the length L of the flexible area 12, which is one embodiment of this application). The center line of the magnet of the "I"-shaped magnetic stop 32 is offset from the center of the stop by 1 mm. The heat shield 7 and the tooling body 2 are fixed by screws. The height of the heat shield 7 is 1.5 mm higher than the height of the CBGA packaged device 132. The thickness of the top of the heat shield 7 is 1 mm, and the wall thickness of the heat shield 7 is 0.5 mm. The heat shield material is polyimide.

[0071] The rigid-flex plate assembly of this embodiment 1 uses a double-sided ceramic array device mounting fixture, and the specific steps include:

[0072] (1) Clean the assembly surface of fixture 2, place the rigid-flexible joint plate 1 on fixture 2, and use a right-angled side of the rigid area of ​​the rigid-flexible joint plate as the positioning surface, and use the magnetic block 3 to perform high-precision positioning in the X / Y direction.

[0073] (2) Printing, mounting and soldering of the B-side ceramic array device 132 on the rigid-flex plate 1;

[0074] (3) After welding, remove the magnetic block 3 and remove the rigid-flexible plate 1 from the tooling through the plate removal part 26.

[0075] (4) Assemble the raised support column 6 and the heat insulation cover 7 onto the tooling body 2 to form a whole;

[0076] (5) Place the rigid-flex plate 1 with the B-side ceramic array device welding completed on the tooling 2, and use a right-angled side of the rigid area of ​​the rigid-flex plate as the positioning surface, and use the magnetic block 3 to perform high-precision positioning in the X / Y direction.

[0077] (6) Referring to Mark point 27 on the tooling, print and mount the ceramic array devices 111, 112 and 131 on the A side of the rigid-flex plate, and then perform component welding.

[0078] (7) After welding, remove the heat insulation cover 7, assemble the flexible area protective cover 4 onto the tooling body 2, use the binding wire 5 to tie and fix the rigid-flexible joint plate 1 that has completed double-sided welding to the tooling 2, and perform post-weld cleaning.

[0079] (8) After cleaning, remove the flexible area protective cover 4, binding wire 5, magnetic block 3, and remove the welded rigid-flexible bonded plate.

[0080] Example 2

[0081] The rest is the same as above, except that: the thickness of the two adjacent rigid areas of the flexible area 12 is H1 = 2mm and H2 = 3mm, that is, the thickness of the sub-board 11 and the mother board 13 is not the same. The height of the bottom surface of the flexible area from the upper surface of the adjacent rigid area is h1 = 1.2mm and h2 = 2mm, h1 < h2, and max{h1,h2}≥min{H1,H2}, that is, h2 = H1. Let the length of the flexible area L = 40mm, then the sinking depth h of the connection part 22 is a gradient value. The sinking depths at both ends are greater than h1 and h2 respectively, so as to prevent the top of the connection part 22 from not contacting the flexible area 12. The A side of the sub-board 11 needs to be soldered with 3 CBGA packaged devices 111 and 3 CCGA packaged devices 112. The A side of the mother board 13 needs to be soldered with 12 CBGA packaged devices 131 and the B side needs to be soldered with 3 CBGA packaged devices 132.

[0082] In this embodiment 2, the fixture body 2, magnetic stop 3, flexible area protective cover 4, and raised support 6 used for double-sided mounting of ceramic array devices on rigid-flex plate 1 are made of stainless steel, and the binding wire 5 is made of cotton thread. The heat shield 7 and the fixture body 2 are integral structures. The height of the heat shield 7 is 2mm higher than the height of the CBGA packaged device 132. The thickness of the top of the heat shield 7 is 1mm, and the thickness of the walls around the heat shield 7 is 0.5mm. The heat shield material is stainless steel.

[0083] To ensure that the upper surfaces of the sub-plate 11 and the mother plate 13 are on the same horizontal line, an additional protrusion is added to the top of the connecting part 22 based on the convex block. This protrusion precisely supports the lower sub-plate 11 (e.g., Figure 13 As shown), this makes the tops of the sub-plate 11 and the mother plate 13 on the same horizontal line;

[0084] The depth h of the tooling connection 22 is a gradient value, with 1.5mm at both ends (a value greater than h1, ensuring the flexible area 12 does not contact the connection 22) and 2.5mm at the ends (a value greater than h2, ensuring the flexible area 12 does not contact the connection 22). To ensure that the two sides of the connection 22 do not contact the adjacent rigid areas (sub-plate 11 and mother plate 13), the length l of the connection 22 needs to be 0.8mm smaller than the length of the projected surface of the flexible area (a value between 0.5mm and 2mm can be selected; in this embodiment, 0.8mm is selected). Therefore, the length of the connection 22 is...

[0085] The rigid-flex plate assembly in this embodiment 2 uses a double-sided ceramic array device mounting fixture, and the specific steps include:

[0086] (1) Clean the assembly surface of fixture 2, place the rigid-flexible joint plate 1 on fixture 2, and use a right-angled side of the rigid area of ​​the rigid-flexible joint plate as the positioning surface, and use the magnetic block 3 to perform high-precision positioning in the X / Y direction.

[0087] (2) Printing, mounting and soldering of the B-side ceramic array device 132 on the rigid-flex plate 1;

[0088] (3) After welding, remove the magnetic block 3 and remove the rigid-flexible plate 1 from the tooling through the plate removal part 26.

[0089] (4) Heat insulation cotton is attached to the inside of the heat insulation cover 7, with a thickness of 1mm;

[0090] (5) Elevate the support column 6 onto the tooling body 2 to form a whole;

[0091] (6) Place the rigid-flex plate 1 with the B-side ceramic array device welding completed on the fixture 2, and use a right-angled side of the rigid area of ​​the rigid-flex plate as the positioning surface, and use the magnetic block 3 to perform high-precision positioning in the X / Y direction.

[0092] (7) Referring to Mark point 27 on the tooling, print and mount the ceramic array devices 111, 112 and 131 on the A side of the rigid-flex plate 1, and perform component welding.

[0093] (8) After welding, remove the heat insulation cotton inside the heat insulation cover 7, assemble the flexible area protective cover 4 onto the tool body 2, use the binding wire 5 to tie and fix the rigid-flexible joint plate 1 that has completed double-sided welding to the tool body 2, and perform post-weld cleaning.

[0094] (9) After cleaning, remove the flexible area protective cover 4, binding wire 5, magnetic block 3, and remove the welded rigid-flexible bonded plate.

[0095] Example 3

[0096] Other parts are the same as those in Embodiment 1, except that: the thicknesses of two adjacent rigid regions in the flexible region 12 are H1 = 2.2 mm and H2 = 3 mm, that is, the thicknesses of the daughter board 11 and the mother board 13 are inconsistent. The heights from the bottom surface of the flexible region 12 to the upper surfaces of the adjacent rigid regions are h1 = 1.2 mm and h2 = 2 mm, h1 < h2, and max{h1, h2} < min{H1, H2}, that is, h2 < H1. Then the sinking depth h of the connecting part 22 > h2, and the connecting structure 22 is still the same convex-shaped structure as that in Embodiment 2, ensuring that the tops of the daughter board 11 and the mother board 13 are on the same horizontal line. The length l of the connecting part 22 is 0.8 mm smaller than the length of the projection plane of the flexible region (a value between 0.5 mm and 2 mm can be selected here, and 0.8 mm is selected in this embodiment). Let the length of the flexible region L = 40 mm; then the length of the connecting part 22

[0097] A detailed explanation of the calculation formula for the length of the projection plane of the flexible region is as follows: It is specifically divided into two cases:

[0098] First, referring to Figure 11 , when h1 = h2, at this time, the length of the projection plane of the flexible region is the same as the length L of the flexible region. It can also be deduced from the length formula of the projection plane of the flexible region that the length of the projection plane of the flexible region is equal to the length L of the flexible region. Then, to prevent the two sides of the connecting part 22 from contacting the daughter board 11 and the mother board 13, the length l of the connecting part 22 needs to be smaller than the length of the projection plane of the flexible region (in this case, that is, the length L of the flexible region);

[0099] Second, referring to Figure 12 and Figure 13 , when |h1 - h2| > 0, in this situation, it can be further divided into two cases: h1 > h2 or h1 < h2; in Figure 13 state, at this time, the length L of the inclined flexible plate forms the hypotenuse of a triangle, and |h1 - h2| forms a right side of the triangle, and the length of the projection plane of the flexible region is the other right side. Using the Pythagorean theorem, it can be deduced that After obtaining the length of the projection plane of the flexible region, to prevent the two sides of the connecting part 22 from contacting the daughter board 11 and the mother board 13, the length l of the connecting part 22 needs to be smaller than the length of the projection plane of the flexible region.

[0100] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A mounting fixture for rigid-flex plate double-sided ceramic array devices, characterized in that, It includes the tooling body (2), the flexible area protective cover (4), and the heat insulation cover (7); The tooling body (2) is provided with a cavity (21) and a connecting part (22). The cavity (21) is provided with a through groove (23). A magnetic positioning component is also provided on one side of the cavity (21) and the connecting part (22). The flexible area protective cover (4) is detachably installed on the tooling body (2) and is located above the connecting part (22). The heat insulation cover (7) is installed on the back of the tooling body (2). The bottom surface of the flexible zone in the rigid-flexible plate does not contact the top of the connection part (22), and the two sides of the connection part (22) do not contact the surface of the adjacent rigid zone. Let h1 and h2 be the heights of the bottom surface of the flexible region from the upper surface of the adjacent rigid region, and let H1 and H2 be the thicknesses of the two adjacent rigid regions of the flexible region. Let h be the sinking depth of the connecting part (22). When h1 = h2, the sinking depth h of the connecting part (22) is greater than h1; When |h1-h2|>0 and max{h1,h2}<min{H1,H2}, the sinking depth h of the connecting part (22)>max{h1,h2}; When |h1-h2|>0 and max{h1,h2}≥min{H1,H2}, the sinking depth h of the connection part is the gradient value, and the sinking depth h at both ends is greater than h1 and h2 respectively.

2. The mounting fixture for the rigid-flex plate double-sided ceramic array device according to claim 1, characterized in that: The magnet positioning component includes a magnet (24), a magnet layout groove (25), and a magnetic baffle (3). The magnet layout groove (25) is opened on the tooling body (2) and located on one side of the cavity (21) and the connecting part (22). The magnet (24) is embedded in the magnet layout groove (25) and magnetically connected to the magnetic baffle (3).

3. The mounting fixture for the rigid-flex plate double-sided ceramic array device according to claim 2, characterized in that: The magnetic baffle (3) is a block with an embedded magnet, wherein the distribution of the magnet is off-center from the center line of the corresponding block.

4. The mounting fixture for the rigid-flex plate double-sided ceramic array device according to claim 1, characterized in that: The tooling body (2) also includes a plate taking part (26) and a binding hole (28) on one side of the cavity (21), and Mark points (27) on both sides of the tooling body (2). The binding hole (28) binds the rigid-flexible plate to the tooling body (2) through the binding wire (5).

5. The mounting fixture for the rigid-flex plate double-sided ceramic array device according to claim 1, characterized in that: The connection part (22) is located below the flexible area inside the rigid-flexible plate and is limited in the Y direction, and the number of both is the same.

6. The mounting fixture for the rigid-flex plate double-sided ceramic array device according to claim 5, characterized in that: The connection part (22) is located on one side of the rigid zone inside the rigid-flexible plate and is limited in the X direction.

7. The mounting fixture for the rigid-flex plate double-sided ceramic array device according to claim 1, characterized in that: Let the length of the connecting part (22) be l, and the length l of the connecting part (22) is 0.5 mm to 2 mm smaller than the length of the projected surface of the flexible region.

8. The mounting fixture for the rigid-flex plate double-sided ceramic array device according to claim 1, characterized in that: The heat insulation cover (7) is made of any one of polyimide, synthetic stone, graphite, or stainless steel.

9. The mounting fixture for the rigid-flex plate double-sided ceramic array device according to claim 8, characterized in that: The inner side of the heat insulation cover (7) may be covered with heat insulation material, which is heat insulation cotton or aerogel, and the thickness of the heat insulation material is 1mm-2mm.

10. A method for mounting and soldering a rigid-flexible double-sided ceramic array device as described in any one of claims 1-9, characterized in that, Includes the following steps: S1. Clean the tooling assembly surface, place the bare rigid-flex plate on the tooling, and use a right-angled side of the rigid area of ​​the rigid-flex plate as the positioning surface. Use a magnetic block to perform high-precision positioning in the X / Y direction. S2. Printing, mounting, and soldering of ceramic array devices on the B-side of the rigid-flex plate; S3. After welding, remove the magnetic block and take the rigid-flexible plate off the tooling through the plate removal part. S4. According to the heat insulation requirements of the ceramic array device on the B side of the rigid-flex plate bonding plate, heat insulation material is attached to the inside of the heat insulation cover. S5. Place the rigid-flex plate with the B-side ceramic array device welded on the tooling, and use a right-angled side of the rigid area of ​​the rigid-flex plate as the positioning surface, and use a magnetic block to perform high-precision positioning in the X / Y direction. S6. Refer to the Mark points on the tooling to print and mount the ceramic array devices on the A side of the rigid-flex board, and then perform component welding. S7. After welding, remove the heat insulation cover, assemble the flexible area protective cover onto the tooling body, use binding wire to tie and fix the double-sided welded rigid-flexible joint plate to the tooling, and perform post-weld cleaning. S8. After cleaning, remove the flexible area protective cover, binding wire, and magnetic block, and take off the welded rigid-flex plate assembly.

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