glass sheet

Abstract

The present application relates to a kind of glass plate, the glass plate includes sequentially adjacent first compressive stress zone and first tensile stress zone by edge inward, the width of the first compressive stress zone is K1, the width of the first tensile stress zone is K2;At least one surface of the glass plate is provided with conductive element, the orthogonal projection of the conductive element on glass plate surface does not overlap with first tensile stress zone, the spacing T of the side of the conductive element close to glass plate edge with glass plate edge is K1+K2, the tensile stress of the orthogonal projection area of the conductive element on glass plate surface is less than or equal to 9MPa.The present application controls the position of the conductive element on glass plate with glass plate edge, makes the stress area formed by mold and glass plate contact in forming process overlap or offset with the stress area formed by conductive element, and then makes new stress distribution at the edge of glass plate, to reduce the risk of glass plate breakage.

Description

Technical Field

[0001] This invention relates to the field of glass technology. Background Technology

[0002] In automotive glass, glass products with antennas or heating wires are prone to cracking during subsequent glass forming due to improper use of edge enamel or unreasonable design of conductive element placement. This can be caused by the superposition of tensile stress from the conductive elements near the glass edge and the tensile stress from the mold supporting the glass edge. Excessive tensile stress at the conductive element location can lead to cracking of the glass at that point. Summary of the Invention

[0003] In order to overcome the shortcomings of the prior art, the technical problem to be solved by the present invention is how to enhance the mechanical strength at the location of the conductive element in the glass plate and reduce the risk of the glass plate edge cracking.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a glass plate, wherein the glass plate includes a first compressive stress zone and a first tensile stress zone that are sequentially adjacent from the edge inward, the width of the first compressive stress zone is K1, and the width of the first tensile stress zone is K2.

[0005] A conductive element is provided on at least one surface of the glass plate. The orthographic projection of the conductive element on the surface of the glass plate does not overlap with the first tensile stress zone. The distance T between the side of the conductive element near the edge of the glass plate and the edge of the glass plate is greater than or equal to K1+K2. The tensile stress in the orthographic projection area of ​​the conductive element on the surface of the glass plate is less than or equal to 9MPa.

[0006] Specifically, the distance between the side of the first stress zone closest to the glass edge and the glass edge is 5mm≤x1≤15mm, and the distance between the side of the first stress zone furthest from the glass edge and the glass edge is 20mm≤x2≤35mm.

[0007] Specifically, the width of the first compressive stress zone K1 ≤ x1, and the width of the first tensile stress zone K2 = x2 - x1.

[0008] Specifically, the distance T between the side of the conductive element closest to the edge of the glass plate and the edge of the glass plate is ≥30mm.

[0009] Specifically, the glass plate further includes a second compressive stress zone and a second tensile stress zone adjacent to the second compressive stress zone and located on the side of the second compressive stress zone away from the edge of the glass plate. The width of the second compressive stress zone is K3, and the width of the second tensile stress zone is K4. The distance T between the side of the conductive element near the edge of the glass plate and the edge of the glass plate is T≥K3+K4.

[0010] Specifically, the distance between the side of the second stress zone closest to the glass edge and the glass edge is 25mm≤x3≤30mm, and the distance between the side of the second stress zone furthest from the glass edge and the glass edge is 45mm≤x4≤50mm.

[0011] Specifically, the width of the second compressive stress zone is K3≤x3, and the width of the second tensile stress zone is K4=x4-x3.

[0012] Specifically, the distance T between the side of the conductive element closest to the edge of the glass plate and the edge of the glass plate is ≥ 50 mm.

[0013] Specifically, the glass plate also includes a first mold projection area located at the edge, the first compressive stress area is located within the first mold projection area, and the width of the first mold projection area is 8-12mm.

[0014] Specifically, the glass plate also includes a second mold projection area, which is located on the side of the first mold projection area away from the edge of the glass plate. The distance between the second mold projection area and the first mold projection area is 5-15mm, and the width of the second mold projection area is 3-8mm.

[0015] Specifically, the width of the conductive element is 15-20 mm.

[0016] Specifically, the conductive element is a busbar printed or bonded to the surface of the glass plate, and the busbar includes at least one of silver paste or copper foil.

[0017] Specifically, the glass plate further includes an ink layer, which is disposed on the surface of the glass plate and located at the edge of the glass plate, and the conductive element is disposed on the surface of the ink layer.

[0018] Specifically, the glass plate surface is also provided with functional elements, and the conductive elements are electrically connected to the functional elements. The functional elements include at least one of an electric heating film, a conductive wire, or a conductive silver paste.

[0019] The beneficial effects of this invention are as follows: by controlling the position of the conductive element on the glass plate relative to the edge of the glass plate, the stress area formed by the contact between the mold and the glass plate during the forming process overlaps or cancels out the stress area formed by the conductive element, thereby forming a new stress distribution at the edge of the glass plate. This not only indirectly enhances the mechanical strength at the location of the conductive element on the glass plate, but also reduces the edge tensile stress of the glass plate as a whole, thereby reducing the risk of the glass plate breaking. Attached Figure Description

[0020] Figure 1 The diagram shown is a structural schematic of the glass plate in this invention;

[0021] Figure 2 The diagram shows the positional distribution of the first mold projection area for the glass plate in this invention.

[0022] Figure 3 The diagram shows the location distribution of the first compressive stress zone and the first tensile stress zone of the glass plate in this invention.

[0023] Figure 4 The diagram shows the positional distribution of the projection area of ​​the second mold for the glass plate in this invention.

[0024] Figure 5 The diagram shows the location distribution of the second compressive stress zone and the second tension stress zone of the glass plate in this invention.

[0025] Label Explanation:

[0026] 1. Glass plate; 2. Conductive element; 31. First compressive stress zone; 32. First tensile stress zone; 41. Second compressive stress zone; 42. Second tensile stress zone; 51. First mold projection area; 52. Second mold projection area; 61. Die; 62. Inner forming ring; 7. Ink layer; 8. Functional element. Detailed Implementation

[0027] To explain in detail the technical content, objectives, and effects of the present invention, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0028] Please refer to Figure 1 As shown, the glass plate 1 of the present invention has conductive elements 2 for electric heating on its surface. Conductive elements 2, capable of forming an electrical connection with the functional element 8, are arranged on both sides of the functional element 8. The conductive elements 2 can be connected to an external power source, energizing the functional element 8 and causing it to heat up, thereby achieving the purpose of electric heating of the glass plate 1. An ink layer 7 is also provided at the edge of the glass plate 1, and the conductive elements 2 are located within the range of the ink layer 7. This allows the conductive elements 2 to be concealed by the ink layer 7 after the glass plate 1 is installed on a vehicle body, thus achieving an aesthetic effect. After bending and forming, the glass plate 1 has different curvatures in the X and Y directions, thereby forming a complex curved surface shape with curvature in at least two directions; furthermore, as... Figure 1 The glass plate 1 shown is rectangular. In some embodiments, the glass plate 1 can also be trapezoidal, triangular or other shapes.

[0029] like Figure 3 As shown, glass plate 1 includes... Figure 3 The upper surface and the lower surface, which face the same direction in the Z-direction, and whose direction is opposite, are as follows: Figure 3 In the illustrated embodiment, the conductive element 2, the ink layer 7, and the conductive element 2 are all located on the upper surface of the glass plate 1. In other embodiments, the ink layer 7 may also be located on the lower surface of the glass plate 1.

[0030] like Figure 3 As shown, the glass plate 1 includes a first compressive stress zone 31 and a first tensile stress zone 32 adjacent to each other from the edge inwards. The width of the first compressive stress zone 31 is K1, and the width of the first tensile stress zone 32 is K2. During the bending and forming process, the glass plate 1 is supported on a ring-shaped mold. The inner edge of the mold at the contact point with the glass plate 1 forms the boundary line between the first compressive stress zone 31 and the first tensile stress zone 32. The first compressive stress zone 31 is located on the inner edge of the mold at the contact point with the glass plate 1, closer to the edge of the glass plate. The first compressive stress zone 31 is mainly formed by the contact between the mold and the glass plate 1. Because the edge area of ​​the glass plate 1 is supported on the mold during the forming process, the cooling rate of the edge area and the interior of the glass is inconsistent, resulting in the formation of the first compressive stress zone 31 with compressive stress in the edge area. On the inner edge of the mold at the contact point with the glass plate 1, closer to the middle of the glass plate 1, i.e., the side of the first compressive stress zone 31 closer to the middle of the glass plate 1, the corresponding first tensile stress zone 32 is formed. The mold generally refers to the cavity mold 61 used to support the forming of the glass plate 1. The cavity mold 61 is ring-shaped and supports the edge of the glass plate 1 from the lower surface of the glass plate 1. Since the cavity mold 61 is ring-shaped, the first compressive stress zone 31 will also form a ring similar in shape to the cavity mold 61, and the first tensile stress zone 32 will also be arranged in a ring on the side of the first compressive stress zone 31 away from the edge of the glass plate 1.

[0031] like Figure 3 As shown, at least one surface of the glass plate 1 is provided with a conductive element 2. The orthographic projection of the conductive element 2 on the surface of the glass plate 1 does not overlap with the first tensile stress zone 32. The distance T between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 is greater than or equal to K1+K2. The tensile stress in the orthographic projection area of ​​the conductive element 2 on the surface of the glass plate 1 is less than or equal to 9MPa.

[0032] The conductive element 2 is preferably disposed on the upper surface of the glass plate 1. In some embodiments, the conductive element 2 is a busbar printed or bonded to the upper surface of the glass plate 1, and the busbar includes at least one of silver paste or copper foil. The conductive element 2 mainly serves to guide current. In the subsequent processing of the glass plate 1, terminals for conducting electricity need to be soldered onto the conductive element 2.

[0033] In some embodiments, such as Figure 1As shown, the surface of the glass plate 1 is also provided with a functional element 8. The conductive element 2 is electrically connected to the functional element 8. The functional element 8 includes at least one of an electric heating film, a conductive wire, or a conductive silver paste. After the functional element 8 is electrically connected to the conductive element 2, the conductive element 2 is connected to an external power source through terminals soldered to its surface. The functional element 8 can then be energized, thereby realizing auxiliary functions such as electric heating or signal transmission.

[0034] Furthermore, during the molding process of glass plate 1, tensile stress will be generated in the area within the projection range of conductive element 2 on the surface of glass plate 1. The range of tensile stress generated by conductive element 2 on the surface of glass plate 1 will not exceed the projection range of conductive element 2 on the surface of glass plate 1, that is, the width of the tensile stress generated by conductive element 2 on the surface of glass plate 1 will not exceed the width of conductive element 2 itself. On both sides of the tensile stress range generated by conductive element 2, that is, on the side closer to the edge of glass plate 1 and the side farther away from the edge of glass plate 1, some areas will be affected by conductive element 2 and form compressive stress. Therefore, if the orthographic projection of conductive element 2 on the surface of glass plate 1 overlaps or partially overlaps with the first tensile stress area 32, the tensile stress of conductive element 2 and the tensile stress of the first compressive stress area will be superimposed. After superposition, the tensile stress value in the area corresponding to conductive element 2 on glass plate 1 will reach 15MPa. At this time, the risk of glass plate 1 cracking will increase significantly, especially after the terminal is soldered to conductive element 2, the possibility of cracking at the soldering position will be further increased. By setting the orthographic projection of the conductive element 2 on the surface of the glass plate 1 to not overlap with the first tensile stress zone 32, and setting the distance T between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 to be greater than or equal to K1+K2, the orthographic projection of the conductive element 2 on the surface of the glass plate 1 can completely avoid the first tensile stress zone 32 of the glass plate 1. At the same time, the compressive stress formed by the conductive element 2 on the glass plate 1 can also cancel out the tensile stress in the first tensile stress zone 32, thereby achieving the effect of reducing the tensile stress in the first tensile stress zone 32.

[0035] In some embodiments, the distance between the side of the first stress zone 32 closest to the glass edge and the glass edge is 5mm ≤ x1 ≤ 15mm, and the distance between the side of the first stress zone 32 furthest from the glass edge and the glass edge is 20mm ≤ x2 ≤ 35mm. In some specific embodiments, the distance x1 between the side of the first stress zone 32 closest to the glass edge and the glass edge is 5mm, 8mm, 10mm, 15mm, etc., and the distance x2 between the side of the first stress zone 32 furthest from the glass edge and the glass edge is 20mm, 25mm, 30mm, 35mm, etc. The values ​​within the above distance ranges are merely examples, and the actual distance between the first stress zone 32 and the glass edge is not limited to the specific values ​​mentioned above.

[0036] In some embodiments, the width K1 of the first compressive stress zone 31 is ≤ x1, and the width K2 of the first tensile stress zone 32 is x2 - x1. The width K1 of the first compressive stress zone 31 extends from the inner edge of the contact point between the mold and the glass plate 1 towards the edge of the glass plate 1. Since the first tensile stress zone 32 and the first compressive stress zone 31 are adjacent, the maximum width of the first compressive stress zone 31 does not exceed the distance between the side of the first tensile stress zone 32 closest to the glass edge and the glass edge. In some embodiments, the width of the first compressive stress zone 31 is equal to the distance between the side of the first tensile stress zone 32 closest to the glass edge and the glass edge. For example, if the distance x1 between the side of the first tensile stress zone 32 closest to the glass edge and the glass edge is 8mm, the width K1 of the first compressive stress zone 31 is ≤ 8mm. Similarly, when x1 is 10mm, the width K1 of the first compressive stress zone 31 is ≤ 10mm.

[0037] Secondly, the width of the first stress zone 32 is the difference between its two sides. Taking the distance x1 between the side of the first stress zone 32 closest to the glass edge and the glass edge as 8mm and the distance x2 between the side of the first stress zone 32 furthest from the glass edge and the glass edge as 25mm as an example, the width K2 of the first stress zone 32 is 17mm. Similarly, when x1 is 10mm and x2 is 30mm, the width K3 of the first stress zone 32 is 20mm.

[0038] In some embodiments, the distance T between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 is ≥30mm. When the glass plate 1 is pressed and formed using a die 61 without an inner forming ring 62, a distance T ≥30mm between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 allows the position of the conductive element 2 to avoid the first tensile stress zone 32 formed by the contact between the die 61 and the glass plate 1, thereby reducing the risk of the glass plate 1 cracking.

[0039] In some embodiments, such as Figure 2As shown, the glass plate 1 also includes a first mold projection area 51 located at the edge, and the first compressive stress area 31 is located within the first mold projection area 51. The width of the first mold projection area 51 is 8-12 mm. The mold used for glass forming is generally a concave mold 61. The first mold projection area 51 is the projection area of ​​the concave mold 61 on the glass. The concave mold 61 is used to support the glass plate 1 during the forming process, and the actual contact position between the glass plate 1 and the concave mold 61 is also located within the first mold projection area 51. The inner edge of the contact position between the concave mold 61 and the glass plate 1 forms the boundary line between the first compressive stress area 31 and the first tensile stress area 32, that is, the inner edge of the first mold projection area 51 forms the boundary line between the first compressive stress area 31 and the first tensile stress area 32. The first compressive stress zone 31 is located on the inner edge of the first mold projection area 51, near the edge of the glass plate 1. Therefore, the first compressive stress zone 31 is located within the first mold projection area 51, and the width of the first mold projection area 51 is equal to or similar to the width of the first compressive stress zone 31. The width of the first mold projection area 51 can be 8mm, 10mm, 12mm, etc. In some embodiments, the width of the first compressive stress zone 31 is smaller than the width of the first mold projection area 51.

[0040] In some embodiments, such as Figure 5 As shown, the glass plate 1 further includes a second compressive stress region 41 and a second tensile stress region 42 adjacent to the second compressive stress region 41 and located on the side of the second compressive stress region 41 away from the edge of the glass plate 1. The width of the second compressive stress region 41 is K3, and the width of the second tensile stress region 42 is K4. The distance T between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 is ≥ K3 + K4. The second compressive stress region 41 and the second tensile stress region 42 are formed by the contact between the inner forming ring 62 and the glass plate 1. If the orthographic projection of the conductive element 2 on the surface of the glass plate 1 overlaps or partially overlaps with the second tensile stress region 42, the tensile stress of the conductive element 2 and the tensile stress of the second compressive stress region will be superimposed. After superposition, the tensile stress value in the area corresponding to the conductive element 2 on the glass plate 1 will reach 15 MPa. At this time, the risk of cracking of the glass plate 1 increases significantly, especially after the terminal is soldered to the conductive element 2, the possibility of cracking at the soldering position will further increase. By setting the distance T between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 to be greater than or equal to K3+K4, the orthogonal projection of the conductive element 2 on the surface of the glass plate 1 can completely avoid the second tensile stress zone 42 of the glass plate 1. At the same time, the compressive stress formed by the conductive element 2 on the glass plate 1 can also cancel out the tensile stress in the second tensile stress zone 42, thereby achieving the effect of reducing the tensile stress in the second tensile stress zone 42.

[0041] In some embodiments, such as Figure 4As shown, the glass plate 1 further includes a first mold projection area 51 located at the edge, and the first compressive stress area 31 is located within the first mold projection area 51. The width of the first mold projection area 51 is 8-12 mm. The glass plate 1 also includes a second mold projection area 52 located on the side of the first mold projection area 51 away from the edge of the glass plate 1. The distance between the second mold projection area 52 and the first mold projection area 51 is 5-15 mm, and the width of the second mold projection area 52 is 3-8 mm. The mold used for forming the glass plate 1 is generally a concave mold 61. The first mold projection area 51 is the projection area of ​​the concave mold 61 on the glass plate 1. The concave mold 61 is used to support the glass plate 1 during the forming process, and the actual contact position between the glass plate 1 and the concave mold 61 is also located within the first mold projection area 51. The inner edge of the contact position between the concave mold 61 and the glass plate 1 forms the boundary line between the first compressive stress zone 31 and the first tensile stress zone 32, that is, the inner edge of the first mold projection area 51 forms the boundary line between the first compressive stress zone 31 and the first tensile stress zone 32. The first compressive stress zone 31 is located on the side of the inner edge of the first mold projection area 51 close to the edge of the glass plate 1. Therefore, the first compressive stress zone 31 is located within the first mold projection area 51, and the width of the first mold projection area 51 is equal to or similar to the width of the first compressive stress zone 31. The width of the first mold projection area 51 can be 8mm, 10mm, 12mm, etc. In some embodiments, the width of the first compressive stress zone 31 is smaller than the width of the first mold projection area 51.

[0042] In addition, such as Figures 4 to 5 As shown, in addition to the annular cavity mold 61, some molds used for forming glass plate 1 also have an inner forming ring 62 located inside the cavity mold 61. The function of the inner forming ring 62 is the same as that of the cavity mold 61, which is to provide support for the glass plate 1 during the forming process. The inner forming ring 62 generally contacts the glass plate 1 before the cavity mold 61, so that the glass plate 1 is pre-formed. This avoids the glass plate 1 being too heavy in the middle when placed directly on the cavity mold 61, which would cause the forming surface of the glass plate 1 to be uncontrollable and cause the edges to warp during the forming process. The area projected onto the glass plate 1 by the inner forming ring 62 is the second mold projection area 52. Since the inner forming ring 62 does not contact the cavity mold 61, there is generally a gap of 5 to 15 mm between the second mold projection area 52 and the first mold projection area 51. In some specific embodiments, the gap between the second mold projection area 52 and the first mold projection area 51 can be 5 mm, 8 mm, 10 mm, 12 mm, 15 mm, etc. In some embodiments, the gap between the second mold projection area 52 and the first mold projection area 51 is in the range of 5 to 10 mm.

[0043] When the inner forming ring 62 comes into actual contact with the glass plate 1, it will also cause the glass plate 1 to form a compressive stress zone and a tensile stress zone, namely the second compressive stress zone 41 and the second tensile stress zone 42 mentioned above. The inner edge of the contact position between the inner forming ring 62 and the glass plate 1 forms the boundary line between the second compressive stress zone 41 and the second tensile stress zone 42, that is, the inner edge of the second mold projection area 52 forms the boundary line between the second compressive stress zone 41 and the second tensile stress zone 42. The second compressive stress zone 41 is located on the side of the inner edge of the second mold projection area 52 near the edge of the glass plate 1, but the second compressive stress zone 41 is not limited to the area of ​​the second mold projection area 52. Figure 5 In the illustrated embodiment, the second compressive stress zone 41 extends from the inner edge of the second mold projection area 52 to the outer edge of the glass plate 1. That is, the second compressive stress zone 41 overlaps with the first compressive stress zone 31, thereby increasing the compressive stress within the range of the first compressive stress zone 31, which is beneficial to improving the strength of the glass plate edge. At the same time, the second compressive stress zone 41 partially overlaps with the first tensile stress zone 32, thereby reducing or even eliminating the tensile stress or forming compressive stress in the overlapping part of the second compressive stress zone 41 and the first tensile stress zone 32, which is beneficial to improving the strength of the glass plate edge.

[0044] In addition, the distance T between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 is greater than the sum of the widths of the second compressive stress zone 41 and the second tensile stress zone 42. This can further prevent the tensile stress formed by the conductive element 2 on the glass plate 1 from superimposing with the first tensile stress zone 32 or the second tensile stress zone 42, thereby reducing the risk of the glass plate 1 cracking.

[0045] In some embodiments, the distance between the side of the first tensile stress zone 32 furthest from the glass edge and the glass edge is 20mm ≤ x2 ≤ 35mm. The second tensile stress zone 42 is located on the side of the first tensile stress zone 32 furthest from the glass plate 1. The distance between the side of the second tensile stress zone 42 closest to the glass edge and the glass edge is 25mm ≤ x3 ≤ 30mm, and the distance between the side of the second tensile stress zone 42 furthest from the glass edge and the glass edge is 45mm ≤ x4 ≤ 50mm. In some specific embodiments, the distance x3 between the side of the second tensile stress zone 42 closest to the glass edge and the glass edge is 25mm, 28mm, 30mm, etc., and the distance x4 between the side of the second tensile stress zone 42 furthest from the glass edge and the glass edge is 45mm, 48mm, 50mm, etc. The values ​​within the above distance range are only examples; the actual distance between the second tensile stress zone 42 and the glass edge depends on the distribution of the first tensile stress zone 32 and the second compressive stress zone 41.

[0046] In some embodiments, the width K3 of the second compressive stress zone 41 is ≤ x3, and the width K4 of the second tensile stress zone 42 is x4 = x3 - x3. The second compressive stress zone 41 extends from the inner edge of the second mold projection area 52, and can extend up to the outer edge of the glass plate 1, in which case the width K3 of the second compressive stress zone 41 is x3. In some embodiments, the range of the second compressive stress zone 41 does not reach the outer edge of the glass plate 1, i.e., the width K3 of the second compressive stress zone 41 is < x3. Furthermore, taking the case where the distance x3 between the side of the second tensile stress zone 42 closest to the glass edge and the glass edge is 28mm as an example, the maximum width K3 of the second compressive stress zone 41 is 28mm. The second stress zone 42 is adjacent to the second compressive stress zone 41. Therefore, taking the case where the distance x3 between the side of the second stress zone 42 closest to the glass edge and the glass edge is 28mm, and the distance x4 between the side of the second stress zone 42 furthest from the glass edge and the glass edge is 50mm as an example, the width K4 of the second stress zone 42 is 22mm.

[0047] In some embodiments, the distance T between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 is ≥ 50 mm. When the glass plate 1 is pressed and formed using a die 61 with an inner forming ring 62, a distance T ≥ 50 mm between the side of the conductive element 2 near the edge of the glass plate 1 and the edge of the glass plate 1 allows the position of the conductive element 2 to avoid the first tensile stress zone 32 formed by the contact between the die 61 and the glass plate 1 and the second tensile stress zone 42 formed by the contact between the inner forming ring 62 and the glass plate 1, thereby reducing the risk of the glass plate 1 cracking.

[0048] In some embodiments, the width of the conductive element 2 is 15-25 mm. The tensile stress formed by the conductive element 2 on the glass plate 1 is related to the width of the conductive element 2 itself. When the width of the conductive element 2 is 15-25 mm, the tensile stress formed by the conductive element 2 on the glass plate 1 is approximately 8-10 MPa. Therefore, when the conductive element 2 does not overlap with the first tensile stress region 32 or the second tensile stress region 42, the tensile stress formed by the conductive element 2 within this width range can effectively offset the compressive stress of the glass plate 1 itself. This ensures that the tensile stress in the orthographic projection area of ​​the conductive element 2 on the surface of the glass plate 1 meets the requirement of being less than or equal to 9 MPa. Simultaneously, the compressive stress formed in the areas on the surface of the glass plate 1 located on both sides of the conductive element 2 due to the influence of the conductive element 2 can also partially overlap with the first tensile stress region 32 or the second tensile stress region 42, thereby reducing the tensile stress value of the first tensile stress region 32 or the second tensile stress region 42 to a certain extent.

[0049] In some embodiments, such as Figure 1As shown, the glass plate 1 also includes an ink layer 7, which is disposed on the surface of the glass plate 1 and located at its edge. The conductive element 2 is disposed on the surface of the ink layer 7. The ink layer 7 is generally arranged around the edge of the glass plate 1. Because the glass surface does not have good adhesion properties, the ink layer 7 needs to be printed on the glass surface to ensure good adhesion between the glass plate 1 and the connecting accessories. Simultaneously, the ink layer 7 also serves to conceal the accessories connecting the glass plate 1 to the vehicle body sheet metal, thus achieving a certain aesthetic effect. Therefore, by being disposed on the surface of the ink layer 7, the conductive element 2 can improve the adhesion between the conductive element 2 and the surface of the glass plate 1. Furthermore, the ink layer 7 can also conceal the conductive element 2, thereby improving the overall aesthetics of the glass plate 1.

[0050] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A glass plate, characterized in that, The glass plate includes a first compressive stress zone and a first tensile stress zone that are sequentially adjacent from the edge inward. The width of the first compressive stress zone is K1, and the width of the first tensile stress zone is K2. A conductive element is provided on at least one surface of the glass plate. The orthographic projection of the conductive element on the surface of the glass plate does not overlap with the first tensile stress zone. The distance T between the side of the conductive element near the edge of the glass plate and the edge of the glass plate is greater than or equal to K1+K2. The tensile stress in the orthographic projection area of ​​the conductive element on the surface of the glass plate is less than or equal to 9MPa. The conductive element is used to guide current. The width of the conductive element is 15-25 mm. A portion of the glass plate is affected by the conductive element and compressive stress is formed. The compressive stress can cancel out the tensile stress in the first tensile stress zone to reduce the tensile stress in the first tensile stress zone.

2. The glass plate according to claim 1, characterized in that, The distance between the side of the first stress zone closest to the glass edge and the glass edge is 5mm≤x1≤15mm, and the distance between the side of the first stress zone furthest from the glass edge and the glass edge is 20mm≤x2≤35mm.

3. The glass plate according to claim 2, characterized in that, The width of the first compressive stress zone K1 ≤ x1, and the width of the first tensile stress zone K2 = x2 - x1.

4. The glass plate according to claim 1, characterized in that, The distance T between the side of the conductive element closest to the edge of the glass plate and the edge of the glass plate is ≥30mm.

5. The glass plate according to any one of claims 1 to 4, characterized in that, The glass plate further includes a second compressive stress zone and a second tensile stress zone adjacent to the second compressive stress zone and located on the side of the second compressive stress zone away from the edge of the glass plate. The width of the second compressive stress zone is K3, and the width of the second tensile stress zone is K4. The distance T between the side of the conductive element near the edge of the glass plate and the edge of the glass plate is T≥K3+K4.

6. The glass plate according to claim 5, characterized in that, The distance between the side of the second stress zone closest to the glass edge and the glass edge is 25mm≤x3≤30mm, and the distance between the side of the second stress zone furthest from the glass edge and the glass edge is 45mm≤x4≤50mm.

7. The glass plate according to claim 6, characterized in that, The width of the second compressive stress zone is K3≤x3, and the width of the second tensile stress zone is K4=x4-x3.

8. The glass plate according to claim 5, characterized in that, The distance T between the side of the conductive element closest to the edge of the glass plate and the edge of the glass plate is ≥ 50 mm.

9. The glass plate according to claim 1, characterized in that, The glass plate also includes a first mold projection area located at the edge, the first compressive stress area is located within the first mold projection area, and the width of the first mold projection area is 8~12mm.

10. The glass plate according to claim 9, characterized in that, The glass plate also includes a second mold projection area, which is located on the side of the first mold projection area away from the edge of the glass plate. The distance between the second mold projection area and the first mold projection area is 5~15mm, and the width of the second mold projection area is 3~8mm.

11. The glass plate according to claim 1, characterized in that, The width of the conductive element is 15~20mm.

12. The glass plate according to claim 1, characterized in that, The conductive element is a busbar printed or bonded to the surface of a glass plate, and the busbar includes at least one of silver paste or copper foil.

13. The glass plate according to claim 1, characterized in that, The glass plate also includes an ink layer, which is disposed on the surface of the glass plate and located at the edge of the glass plate, and the conductive element is disposed on the surface of the ink layer.

14. The glass plate according to claim 1, characterized in that, The glass plate surface is also provided with functional elements, and the conductive elements are electrically connected to the functional elements. The functional elements include at least one of an electric heating film, a conductive wire, or a conductive silver paste.

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