Method of manufacturing an electronic device

Abstract

A method of manufacturing an electronic device includes providing a first liquid crystal cell including a first substrate and a third substrate, performing a pre-cutting step to form a pre-cut mark on the third substrate, disposing a second substrate on the third substrate to form a second liquid crystal cell, and performing a cutting step to cut off a portion of the first substrate along a first cut mark, cut off a portion of the second substrate along a second cut mark, and simultaneously remove a portion of the third substrate along the pre-cut mark.

Description

[0001] This application is a divisional application of the patent application No. 201911080193.5 with the title of "Electronic device" and filed on November 7, 2019. TECHNICAL FIELD

[0002] The present application relates to an electronic device, in particular to an electrically controlled light adjusting device. BACKGROUND

[0003] The light adjusting device, also known as electrically controlled light adjusting device, electrically controlled device or intelligent light adjusting device, is an electrochromic electronic device which uses voltage to control the state of functional material layer to achieve the purpose of color change and light adjustment.

[0004] Extensive research has been conducted on the development of electrically controlled light adjusting device, but there are still many technical problems to be overcome. For example, how to further reduce the light transmittance of the light adjusting device in the low light transmittance state to achieve better shading effect and obtain a larger adjustable range between the high light transmittance state and the low light transmittance state of the light adjusting device is still an active research project in the field. SUMMARY

[0005] Therefore, one of the purposes of the present application is to provide an electronic device with a larger adjustable range between the high light transmittance state and the low light transmittance state.

[0006] According to an embodiment of the electronic device of the present application, the electronic device comprises a first substrate, a first alignment layer disposed on a surface of the first substrate and having a first alignment direction, a second substrate disposed opposite to the first substrate, a second alignment layer disposed on a surface of the second substrate, a third substrate disposed between the first substrate and the second substrate and having a first surface close to the first substrate and a second surface close to the second substrate, a third alignment layer disposed on the first surface of the third substrate and having a third alignment direction, wherein the first alignment direction is perpendicular to the third alignment direction, and a fourth alignment layer disposed on the second surface of the third substrate.

[0007] The present application uses the alignment layer to make the arrangement of liquid crystal molecules twist at a specific angle, which in turn makes the dye molecules twist at a specific angle, absorb light of a specific polarization direction, and reduce the light leakage of the dye liquid crystal layer at a large viewing angle in the low light transmittance state, achieving a better shading effect. That is, the present application can improve the adjustable range between the high light transmittance state and the low light transmittance state of the electrically controlled light adjusting device.

[0008] Another object of the present application is to provide a manufacturing method of an electronic device, by sharing a third substrate to form a two-layer stacked liquid crystal cell to absorb light of a specific polarization direction, so as to further improve light absorption rate and reduce the thickness of the overall liquid crystal cell.

[0009] The manufacturing method of an electronic device according to an embodiment of the present application comprises the following steps. First, a first liquid crystal cell is provided, which comprises a first substrate and a third substrate. Then, a pre-cutting step is performed to form a pre-cut mark on the third substrate. Next, a second substrate is arranged on the third substrate to form a second liquid crystal cell. Subsequently, a cutting step is performed to cut off part of the first substrate along a first cut mark, cut off part of the second substrate along a second cut mark, and simultaneously remove part of the third substrate along the pre-cut mark. BRIEF DESCRIPTION OF DRAWINGS

[0010] For the purpose of facilitating understanding, the same reference numerals are used to indicate the same elements common to the drawings wherever possible, and it is expected that the elements invented in one embodiment can be utilized in other embodiments without specific description. Unless otherwise specified, the drawings herein should not be construed as being drawn to scale, and for the purpose of clear expression and explanation, the drawings are generally simplified and details or elements are omitted, and the drawings herein and the detailed description are used to explain the principles discussed below, and the same elements are indicated by the same reference numerals.

[0011] Figures 1 to 4 Structure cross-sectional schematic diagram of an electronic device according to a first embodiment of the present application at different process stages.

[0012] Figure 5 Structure cross-sectional schematic diagram of an electronic device according to a second embodiment of the present application.

[0013] Figure 6 Structure cross-sectional schematic diagram of an electronic device according to a third embodiment of the present application.

[0014] Figure 7A 、 Figure 7B and Figure 8A 、 Figure 8B Schematic diagram of liquid crystal molecules and dye molecules of a dye liquid crystal layer of an electronic device according to some embodiments of the present application when an electric field is applied and when no electric field is applied.

[0015] Figure 9 Schematic diagram of the path of light through an electronic device according to an embodiment of the present application.

[0016] Reference numerals: 1-electronic device; 50-first dye liquid crystal layer; 10-first substrate; 52-second dye liquid crystal layer; 12-first conductive layer; 60-precut mark; 12a-electrode; 62, 64-cut mark; 14-first alignment layer; 70-first conductive adhesive; 20-second substrate; 72-second conductive adhesive; 22-second conductive layer; 80-recess; 22a-electrode; 82-protrusion; 24-second alignment layer; 100-light; 30-third substrate; 1A-first liquid crystal cell; 30a-first surface; 1B-second liquid crystal cell; 30b-second surface; 14a-first alignment direction; 32-third conductive layer; 24a-second alignment direction; 32a-electrode; 34a-third alignment direction; 34-third alignment layer; 38a-fourth alignment direction; 36-fourth conductive layer; 50a, 52a-liquid crystal molecule; 36a-electrode; 50b, 52b-dye molecule; 38-fourth alignment layer; X-first component; 40-frame adhesive; Y-second component; 42- dummy frame adhesive; D1-direction; 44-frame adhesive; D2-direction; 46-dummy frame adhesive; W1, W2, W3-width; 10a-upper surface; 50a'-axial direction; 10c, 10d-side wall; 50b'-axial direction; 20a-lower surface; 20c, 20d-side wall; 30c, 30d-side wall. DETAILED DESCRIPTION

[0017] The present application can be understood with reference to the following detailed description and drawings. It is noted that, for the sake of brevity, the figures of the drawings are not to scale. Like numbers in different figures represent the same or similar elements.

[0018] In this description and in the claims, certain terminology is used to designate certain features. One of ordinary skill in the art will understand that electronic device manufacturers can refer to the same element by different names. This document does not intend to distinguish between those elements that do the same thing but have different names. In the following description and in the claims, the terms "comprises," "includes," and "has" are open-ended terms that are intended to be interpreted to cover also the corresponding closed-ended terms "consists of" and "consists only of."

[0019] It is to be understood that when an element or film layer is referred to as being "on" or "connected to" another element or film layer, it can be directly on the other element or film layer, or be indirectly on the other element or film layer with intervening elements or film layers intervening therebetween. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or film layer, there are no intervening elements or film layers therebetween.

[0020] Although terms such as "first", "second", "third" and the like can be used herein to describe or identify various structures, these structures should not be limited by these terms. These terms are used only to distinguish one structure from another. The first structure can be termed a second structure in a claim. The terms "first", "second", "third", and the like can be used herein to describe or identify various structures, and the terms "first", "second", "third", and the like are not necessarily used consistently in different examples.

[0021] It should be understood that the following examples can be combined, rearranged, mixed, and / or substituted for other examples to realize further examples without departing from the spirit of the present application.

[0022] The transmittance (T) of the present application represents the ability of light to pass through a medium, and is generally expressed as a percentage of the light flux passing through the medium to the incident light flux, for example, 0% to 100%, 0% indicating that the light is completely absorbed by the medium, and 100% indicating that the light completely passes through the medium. The "high transmittance state" and the "low transmittance state" described herein are relative, as long as the transmittance of the "high transmittance state" is higher than that of the "low transmittance state". In an embodiment, the difference between the transmittance of the "high transmittance state" and the "low transmittance state" can be greater than or equal to 10% and less than or equal to 30%. In an embodiment, the "high transmittance state" is the state of the electronic device at its highest transmittance that it can reach, for example, the transmittance can be approximately greater than or equal to 30% and less than or equal to 100%, or a transmittance within the range defined by the above values, and the "low transmittance state" is the state of the electronic device at its lowest transmittance that it can reach, for example, the transmittance can be approximately less than or equal to 20% and greater than or equal to 0%. The ratio of the transmittance of the "high transmittance state" to the transmittance of the "low transmittance state" is the contrast ratio of the electronic device.

[0023] The electronic device provided by the embodiments of the present application is, for example, an electrically controlled light modulation device, which can be applied in the fields of buildings, automobiles, interior decoration, signs, show windows, optical devices, etc., but is not limited thereto.

[0024] Figures 1 to 4 The structure cross-sectional schematic diagram of the electronic device according to the first embodiment of the present application at different process stages. Please refer to Figure 3The electronic device 1 includes a first liquid crystal cell 1A, which includes a first substrate 10 and a third substrate 30 disposed opposite to each other, and includes a first conductive layer 12 and a first alignment layer 14 disposed on an upper surface 10a of the first substrate 10, and a third conductive layer 32 and a third alignment layer 34 disposed on a lower surface (defined as a first surface 30a) of the third substrate 30. A frame glue 40 is further disposed between the first substrate 10 and the third substrate 30, and is disposed on both sides of the first alignment layer 14 and the third alignment layer 34 to seal a space that can be filled with an optical medium layer. In the embodiment, the space surrounded by the frame glue 40 can be filled with a first dye liquid crystal layer 50, but is not limited thereto. In some embodiments, a dummy frame glue 42 can be selectively disposed between the first substrate 10 and the third substrate 30 and is disposed outside the frame glue 40. In some embodiments, a gap material (not shown in the figure) can be included between the first substrate 10 and the third substrate 30, or an insulating layer, an optical film, or an anti-reflection layer can be provided on a surface 10b of the first substrate 10 and a surface 20b of a second substrate 20, but is not limited thereto. The optical film is, for example, an ultraviolet light resistant film, a filter film, or other suitable optical film, but is not limited thereto.

[0025] Please refer to Figure 1 and Figure 2 . The manufacturing steps of the first liquid crystal cell 1A are, for example, first providing the first substrate 10, forming the first conductive layer 12 on the upper surface 10a of the first substrate 10 by, for example, deposition, plating, or coating, then manufacturing the first alignment layer 14 on the first conductive layer 12, then forming the frame glue 40 and the dummy frame glue 42, then performing a one drop fill (ODF) process to drop the dye liquid crystal into the range surrounded by the frame glue 40 to form the first dye liquid crystal layer 50, and then bonding the third substrate 30, which has been formed with the third conductive layer 32 and the third alignment layer 34, to the first substrate 10. In other embodiments, after the space for accommodating the liquid crystal is manufactured by bonding the first substrate 10 and the third substrate 30, a vacuum suction process can be performed to inject the liquid crystal mixed with the dye. The above manufacturing process is known in the art, and for the sake of simplicity, the detailed steps will not be described here. As shown in Figure 1 , the third substrate 30 can be pre-formed with a fourth conductive layer 36 on a second surface 30b opposite to the first surface 30a before being bonded to the first substrate 10 to simplify the subsequent process. In other embodiments, the fourth conductive layer 36 can also be formed on the second surface 30b after the first substrate 10 and the third substrate 30 are bonded.

[0026] The first substrate 10 and the third substrate 30 can be a rigid substrate or a flexible substrate, and the material of the first substrate and the third substrate can include, for example, glass, quartz, sapphire, plastic, or other suitable material, or a combination thereof. The plastic material can include, for example, polyimide (PI), polycarbonate (PC), or polyethylene terephthalate (PET), or other suitable material, or a combination thereof, but is not limited thereto. According to an embodiment of the present application, the first substrate 10 and the third substrate 30 can be soda-lime glass substrates, but are not limited thereto.

[0027] The first conductive layer 12 and the third conductive layer 32 can include a transparent conductive material, such as indium tin oxide (ITO), antimony doped tin oxide (ATO), fluorine doped tin oxide (FTO), or the like, but are not limited thereto.

[0028] The first alignment layer 14 and the third alignment layer 34 have the ability to align liquid crystal molecules in a specific alignment direction. The first alignment layer 14 and the third alignment layer 34 can be formed, for example, by applying an alignment material (e.g., polyimide (PI)) to a substrate and then performing an alignment process, such as a rubbing alignment process, a photo alignment process, an ion beam alignment process, a plasma beam alignment process, or the like, but are not limited thereto. According to an embodiment of the present application, the alignment directions of the first alignment layer 14 and the third alignment layer 34 are substantially perpendicular to each other.

[0029] The first dye liquid crystal layer 50 includes liquid crystal molecules and at least one dye molecule. Due to the refractive index anisotropy of the liquid crystal material, light of different polarization directions will have different refractive indices when passing through the liquid crystal molecules, so that the liquid crystal material can modulate the polarization direction of the light. The liquid crystal molecules can be equivalent to long strips (long rods), and the long axis direction of the liquid crystal molecules is consistent with the optical axis direction. In addition, according to the dielectric anisotropy of the liquid crystal molecules, the liquid crystal molecules can be positive (positive dielectric anisotropy) or negative (negative dielectric anisotropy). If the long axis of the liquid crystal molecules is parallel to the direction of the electric field under the action of the electric field, it is a positive liquid crystal. On the contrary, if the short axis of the liquid crystal molecules is parallel to the direction of the electric field under the action of the electric field, it is a negative liquid crystal. According to an embodiment of the present application, the liquid crystal molecules of the first dye liquid crystal layer 50 can be nematic liquid crystals, smectic liquid crystals, or cholesteric liquid crystals, but are not limited thereto. The first dye liquid crystal layer 50 can also include other components, such as chirality molecules or other components for adjusting the properties of the liquid crystal.

[0030] The dye molecules can be selected from any suitable dichroic dye, such as a long rod-shaped dichroic dye with geometric anisotropy, which has anisotropy of absorption of visible light along the long axis and short axis of the dye molecule, and the selective absorption of polarized light is more obvious. If the light component is parallel to the long axis (absorption axis) of the dye molecule, it can be absorbed, and it is a positive dichroic dye. On the contrary, if the light component is parallel to the short axis of the dye molecule, it can be absorbed, and it is a negative dichroic dye. The dye molecule has a long axis and a short axis. The orientation of the dye molecule doped in the liquid crystal has a significant correlation with the orientation of the liquid crystal, and the long axis of the dye molecule is parallel to the long axis of the liquid crystal, for example Figure 7A The axial direction 50a' of the liquid crystal is parallel to the first alignment direction 14a of the first alignment layer, and the axial direction 50b' of the dye molecule is parallel to the first alignment direction 14a of the first alignment layer 14 as the axial direction 50a' of the liquid crystal, which causes the dye molecule to be easily pushed by the liquid crystal molecules. Therefore, the orientation of the liquid crystal can be controlled by using a control electric field, and then the orientation of the dye molecule in the absorption state or the non-absorption state is controlled. The selection of the type of dye molecule needs to consider good filling and compatibility with the liquid crystal molecules, and also needs to consider the optical resistance (light stability) and heat resistance (thermal stability). According to an embodiment of the present application, the absorption wavelength of the dye molecule is in the visible light band, for example, between 380 nanometers and 780 nanometers. The dye molecule is, for example, an azo or anthraquinone dichroic dye.

[0031] The parameters of the first liquid crystal cell 1A, the second liquid crystal cell 1B, or the combination of both, such as the cell gap, the twist angle, the pre-title angle, the rubbing direction, the phase retardation of light passing through the first liquid crystal cell 1A and / or the second liquid crystal cell 1B, the polarizer efficiency, the transmittance, the absorption, the depolarization, the dichorism, etc., can be measured using a measuring device, but are not limited thereto. According to an embodiment of the present application, the first rubbing direction (e.g., the first rubbing direction 14a of the first alignment layer 14) and the third rubbing direction (e.g., the third rubbing direction 34a of the third alignment layer 34) of the first alignment layer 14 and the third alignment layer 34, respectively, are perpendicular to each other, with an included angle of about 90 degrees ± 10 degrees, or between 80 degrees and 100 degrees. According to an embodiment of the present application, the thickness of the first liquid crystal cell 1A and the second liquid crystal cell 1B is about between 0.003 millimeters (mm) and 0.03 mm, respectively, and the thickness of the combination of both is about between 1 mm and 20 mm, but is not limited thereto. The liquid crystal cells can have better optical modulation effects in this thickness range. Figure 9 Figure 9 According to an embodiment of the present application, the first rubbing direction (e.g., the first rubbing direction 14a of the first alignment layer 14) and the third rubbing direction (e.g., the third rubbing direction 34a of the third alignment layer 34) of the first alignment layer 14 and the third alignment layer 34, respectively, are perpendicular to each other, with an included angle of about 90 degrees ± 10 degrees, or between 80 degrees and 100 degrees. According to an embodiment of the present application, the thickness of the first liquid crystal cell 1A and the second liquid crystal cell 1B is about between 0.003 millimeters (mm) and 0.03 mm, respectively, and the thickness of the combination of both is about between 1 mm and 20 mm, but is not limited thereto. The liquid crystal cells can have better optical modulation effects in this thickness range.

[0032] Please refer to Figure 2 The fabrication of the second liquid crystal cell 1B is then performed on the first liquid crystal cell 1A. A fourth conductive layer 36 is formed on the upper surface (defined as the second surface 30b) of the third substrate 30, and a fourth alignment layer 38 is formed on the fourth conductive layer 36. A pre-cut step is then performed on the third substrate 30 to form a pre-cut mark 60 on the third substrate 30, which defines the portion of the third substrate 30 (and the conductive layer thereon) to be cut off. The pre-cut mark 60 is located between the frame glue 40 and the dummy frame glue 42. The dummy frame glue 42 provides temporary support for the portion of the third substrate 30 to be cut off, so as to prevent it from peeling off in the subsequent processes. The materials and fabrication methods of the fourth conductive layer 36 and the fourth alignment layer 38 are as described above, and are not repeated here.

[0033] Please refer to Figure 3 ​Next, a frame adhesive 44 and a dummy frame adhesive 46 disposed outside the frame adhesive 44 are formed on the second surface 30b of the third substrate 30. A second dye liquid crystal layer 52 is formed within the area enclosed by the frame adhesive 44. Then, a second substrate 20 with a second conductive layer 22 and a second alignment layer 24 formed on its surface is provided, so that the second substrate 20 is assembled and fixed to the third substrate 30 by the frame adhesive 44 and the dummy frame adhesive 46. The liquid crystal injection method can be a one-drop fill (ODF) process before the second substrate assembly or a vacuum suction process after the second substrate assembly, but is not limited to these methods. Figure 3 As shown, the second conductive layer 22 and the second alignment layer 24 are disposed on the lower surface 20a of the second substrate 20, facing the third substrate 30. Subsequently, a cutting step is performed on the first substrate 10 and the second substrate 20. The first substrate 10 is cut along the cut 62, and the second substrate 20 is cut along the cut 64. Then, predetermined portions of the first substrate 10, the third substrate 30, and the second substrate 20 are removed along the cut 62, the pre-cut 60, and the cut 64, resulting in the desired material. Figure 4 The structure is shown. According to one embodiment of the present invention, the second dye liquid crystal layer 52 may include the same components as the first dye liquid crystal layer 50, such as the same liquid crystal molecules and dye molecules, but the proportion of the components may be adjusted as needed.

[0034] According to some embodiments of the present invention, the pre-cutting and cutting processes described above can be used to make the sidewalls of the first substrate 10, the third substrate 30, and the second substrate 20 misaligned in the direction perpendicular to the normal direction of the upper surface 10a of the first substrate 10 (e.g., direction D1 perpendicular to the upper surface 10a of the first substrate 10). That is, the sidewalls of the first substrate 10, the third substrate 30, and the second substrate 20 are not located on the same vertical plane. This design allows for adjustment of the electrical connection relationship between the first conductive layer 12, the third conductive layer 32, the fourth conductive layer 36, and the second conductive layer 22 as needed. For example... Figure 4 As shown, a portion of the sidewall of the third substrate 30 ( Figure 4 The right-side sidewall 30c is recessed between the sidewall 10c of the first substrate 10 and the sidewall 20c of the second substrate 20, forming a recessed portion 80 of the electronic device 1. In other words, in the direction D1 perpendicular to the surface of the first substrate 10, the sidewall 10c of the first substrate 10 and the sidewall 20c of the second substrate 20 protrude beyond the sidewall 30c of the third substrate 30. Therefore, the third substrate 30 does not overlap certain portions of the first conductive layer 12 and the second conductive layer 22, and these portions of the first conductive layer 12 and the second conductive layer 22 are exposed in the recessed portion 80. The exposed portions of the first conductive layer 12 and the second conductive layer 22 can be designed as electrodes 12a (see reference). Figure 4 (the range of arrow 12a) and electrode 22a (refer to) Figure 4(within the range of arrow 22a) or connecting portion, used to provide contact points for electrical connection. Similarly, another portion of the sidewall of the third substrate 30 ( Figure 4 The left-side sidewall 30d protrudes between the sidewall 10d of the first substrate 10 and the sidewall 20d of the second substrate 20, forming a protrusion 82 of the electronic device 1. Therefore, certain portions of the third conductive layer 32 on the first surface 30a and the fourth conductive layer 36 on the second surface 30b of the third substrate 30 are exposed. These exposed portions can be designed as electrodes 32a (see reference). Figure 4 (the range of arrow 32a) and electrode 36a (refer to) Figure 5 (within the range of arrow 36a) provides contact points for electrical connection with other components. In some embodiments, the width W1 of the first substrate 10 along a direction D2 (e.g., a direction parallel to the upper surface 10a of the first substrate 10) may differ from the width W2 of the second substrate 20 along direction D2, and the width W1 of the first substrate 10 may also differ from the width W3 of the third substrate 30 along direction D2. For example, the width W1 may be greater than both the widths W2 and W3. In some embodiments, the width W2 may be greater than the width W3. The width relationship of the substrates in the same direction is not limited to the above. In some embodiments, the sidewalls 10d of the first substrate 10 and the sidewalls 20d of the second substrate 20 may be aligned in direction D1, and the sidewalls 10c of the first substrate 10 and the sidewalls 20c of the second substrate 20 may not be aligned in direction D1.

[0035] Please refer to Figure 5 , Figure 5 This is a schematic cross-sectional view of the electronic device according to a second embodiment of the present invention. Figure 4 and Figure 5 The main difference between their electronic devices is that... Figure 6 The electronic device may optionally have a first conductive adhesive 70 (e.g., silver paste) provided in the recess 80, covering a portion of the sidewall 30c of the third substrate 30 and directly contacting the electrodes 12a of the first conductive layer 12 and the electrodes 22a of the second conductive layer 22, so that the first conductive layer 12 and the second conductive layer 22 are electrically connected. Similarly, a second conductive adhesive 72 (e.g., silver paste) may optionally be provided in the protrusion 82, covering a portion of the sidewall 30d of the third substrate 30 and covering at least a portion of the electrodes 32a of the third conductive layer 32 and at least a portion of the electrodes 36a of the fourth conductive layer 36, so that the third conductive layer 32 and the fourth conductive layer 36 are electrically connected.

[0036] Please refer to Figure 4 This is a schematic cross-sectional view of an electronic device according to a third embodiment of the present invention. (As described above) Figure 5 and Figure 6 The difference in the illustrated embodiments is that, Figure 6The sidewalls of the first substrate 10, the third substrate 30 and the second substrate 20 of the electronic device 1 shown are displaced in layers in a direction D2 (e.g. horizontal direction) parallel to the upper surface 10a of the first substrate 10, forming a stepped structure, on one side (right side) revealing the electrodes 22a of the second conductive layer 22 and the electrodes 32a of the third conductive layer 32, and on the other side (left side) revealing the electrodes 36a of the fourth conductive layer 36 and the electrodes 12a of the first conductive layer 12, to facilitate subsequent electrical connections. Figure 6 Figures 4 to 6 Figure 7A The structure shown is merely an example and is not intended to limit the pre-cutting and cutting methods of the present application. The positions of the pre-cutting and cutting of the first substrate 10, the second substrate 20 and the third substrate 30 can be adjusted according to the needs of the application.

[0037] The present application can select the types of liquid crystal molecules and dye molecules according to the needs of the application, both of which have good filling and compatibility, and also have good optical rotation resistance (light stability) and heat resistance (thermal stability). Figure 7B Figure 8A Figure 8B Figure 7A The schematic diagram of the axial direction of the liquid crystal molecules 50a and the dye molecules 50b of the first dye liquid crystal layer 50 of the first liquid crystal cell 1A (or the second dye liquid crystal layer 52 of the second liquid crystal cell 1B) of the electronic device 1 of some embodiments of the present application when there is no electric field and when there is an electric field is shown. Among them, Figure 7B Figure 8A Figure 8B Figure 7A For ease of understanding, Figure 7B Figure 8A Figure 8B Figure 7A The axial direction 50a' (optical axis direction) of the liquid crystal molecules 50a and the axial direction 50b' (light absorption axis direction) of the dye molecules 50b are also indicated in

[0038] Please refer to Figure 7B ​​​​​​​​​​​When no electric field is applied, if the liquid crystal molecules 50a between the first alignment layer 14 and the third alignment layer 34 are positive type, the axial direction 50a' of the liquid crystal molecules 50a is substantially naturally parallel to the first alignment direction 14a of the first alignment layer 14, and is twisted layer by layer between the first alignment layer 14 and the third alignment layer 34, for example, co-twisted by 90 degrees ± 10 degrees, thereby causing the axial direction 50b' of the dye molecules 50b to twist along with the axial direction 50a' of the liquid crystal molecules 50a. When the light ray 100 passes through the first dye liquid crystal layer 50 along the direction D1, the component parallel to the axial direction 50b' of the dye molecules 50b is absorbed layer by layer by the dye molecules 50b, thereby reducing the penetration of the light ray 100 through the first dye liquid crystal layer 50, and the electronic device is in a low light transmittance state (dark state). Please refer to Figure 8A When an electric field in the direction D1 is applied between the first conductive layer 12 and the third conductive layer 32, the liquid crystal molecules 50a of the positive type are twisted to have the axial direction 50a' parallel to the direction D1, thereby causing the axial direction 50b' of the dye molecules 50b to also be twisted to be parallel to the direction D1. At this time, when the light ray 100 passes through the first dye liquid crystal layer 50 along the direction D1, since the axial direction 50b' of the dye molecules 50b is substantially parallel to the electric field, the axial direction 50a' of the liquid crystal is parallel to the axial direction 50b' of the dye molecules 50b, and thus most of the light ray 100 is not absorbed by the dye molecules 50b'. When the axial direction 50b' of the dye molecules 50b is parallel to the electric field, the short axis of the dye molecules 50b is perpendicular to the electric field, and thus a small amount of the light ray 100 is absorbed by the short axis of the dye molecules 50b. At this time, the electronic device is in a high light transmittance state (or bright state). The inclination angle of the liquid crystal molecules 50a can be adjusted by controlling the intensity of the electric field, thereby adjusting the light transmittance of the electronic device between the high light transmittance state and the low light transmittance state.

[0039] Please refer to Figure 8B When no electric field is applied, if the liquid crystal molecules 50a between the first alignment layer 14 and the third alignment layer 34 are negative type, the axial direction 50a' of the liquid crystal molecules 50a is substantially naturally perpendicular to the first alignment direction 14a of the first alignment layer 14, thereby causing the axial direction 50b' of the dye molecules 50b to also be perpendicular to the first alignment direction 14a of the first alignment layer 14, and the light ray 100 does not pass through the first dye liquid crystal layer 50 along the direction D1, and the electronic device is in a high light transmittance state (or bright state). Please refer to Figure 7AWhen an electric field with direction D1 is applied between the first conductive layer 12 and the third conductive layer 32, the axis 50a' of the negative liquid crystal molecules 50a will be twisted to be parallel to the first alignment direction 14a of the first alignment layer 14 under the action of the electric field, and twist layer by layer between the first alignment layer 14 and the third alignment layer 34, for example, co-twist by 90 degrees ± 10 degrees, and the axis 50b' of the dye molecules 50b will twist along with the axis 50a' of the liquid crystal molecules 50a. When the light ray 100 passes through the first dye liquid crystal layer 50 along the direction D1, the component parallel to the axis 50b' of the dye molecules 50b will be absorbed layer by layer by the dye molecules 50b, thereby reducing the transmittance of the light ray 100 through the first dye liquid crystal layer 50, and at this time, the electronic device is in a low light transmittance state (dark state).

[0040] It should be noted that, Figure 7B , Figure 8A , Figure 8B and Figure 7A The types and arrangement states of the liquid crystal molecules shown in Figure 7B , Figure 8A , Figure 8B and Figure 9 are only examples, and the types and arrangement modes of the liquid crystal molecules contained in the electronic device of the present application are not limited to those shown in

[0041] Please refer to Figure 4 for a schematic diagram of the path of the light ray through the electronic device 1 shown in Figure 9 for example, according to an embodiment of the present application. For simplicity of illustration, Figure 9 only the first alignment layer 14 disposed on the first substrate 10 of the electronic device 1, the second alignment layer 24 disposed on the second substrate 20, and the third alignment layer 34 and the fourth alignment layer 38 disposed on the third substrate 30 are shown. In order to facilitate understanding, the axis 50a' of the liquid crystal molecules 50a of the first dye liquid crystal layer 50 between the first alignment layer 14 and the third alignment layer 34 (which can also represent the axis 50b' of the dye molecules 50b) and the axis 52a' of the liquid crystal molecules 52a of the second dye liquid crystal layer 52 between the fourth alignment layer 38 and the second alignment layer 24 (which can also represent the axis 52b' of the dye molecules 52b) are also shown. It should be noted that, Figure 9 the arrangement state of the liquid crystal molecules shown in Figure 9 is only an example, and the types and arrangement modes of the liquid crystal molecules contained in the electronic device of the present application are not limited to those shown in

[0042] As Figure 9As shown, the first alignment direction 14a of the first alignment layer 14 and the third alignment direction 34a of the third alignment layer 34 are perpendicular to each other, with an included angle of 90 degrees ± 10 degrees. The fourth alignment direction 38a of the fourth alignment layer 38 and the second alignment direction 24a of the second alignment layer 24 are perpendicular, with an included angle of 90 degrees ± 10 degrees. The liquid crystal molecules 50a in the first dye liquid crystal layer 50 are twisted layer by layer between the first alignment layer 14 and the third alignment layer 34, for example, from the axial direction (optical axis) 50a' parallel to the first alignment direction 14a to the axial direction (optical axis) 50a' parallel to the third alignment direction 34a, with a total twist of 90 degrees ± 10 degrees. The dye molecules 50b are also twisted layer by layer with the liquid crystal molecules 50a, from the axial direction 50b' parallel to the first alignment direction 14a to the axial direction 50b' parallel to the third alignment direction 34a. Similarly, the liquid crystal molecules 52a in the second dye liquid crystal layer 52 are twisted layer by layer between the fourth alignment layer 38 and the second alignment layer 24, for example, from the optical axis 52a' parallel to the fourth alignment direction 38a to the optical axis 52a' parallel to the second alignment direction 24a, with a total twist of 90 degrees ± 10 degrees. The dye molecules 52b are also twisted layer by layer with the liquid crystal molecules 52a, from the axial direction 52b' parallel to the fourth alignment direction 38a to the axial direction 52b' parallel to the second alignment direction 24a.

[0043] From Figure 9 The light ray incident from the left in a direction D1 perpendicular to the surface of the first alignment layer 14 can contain two polarization components, one parallel to the alignment direction of the incident surface alignment layer and one perpendicular to the alignment direction of the incident surface alignment layer, for example Figure 9 As shown, the first component X is parallel to the first alignment direction 14a of the first alignment layer 14 and the second component Y is perpendicular to the first alignment direction 14a. When the light ray passes through the first dye liquid crystal layer 50, the first component X of the light ray is polarized by the liquid crystal molecules 50a to keep parallel to the axial direction 50b' of the dye molecules 50b, and thus is absorbed layer by layer by the dye molecules 50b, and the energy of the first component X is thus reduced. After passing through the first dye liquid crystal layer 50, the light ray is rotated by 90 degrees ± 10 degrees due to the polarization by the first dye liquid crystal layer 50, i.e., the direction of the first component X is changed to be perpendicular to the first alignment direction 14a and the fourth alignment direction 38a after passing through the first dye liquid crystal layer 50, and the direction of the second component Y is changed to be parallel to the first alignment direction 14a and the fourth alignment direction 38a after passing through the first dye liquid crystal layer 50.

[0044] The light then enters the second liquid crystal layer 52, the second component Y parallel to the fourth alignment direction 38a is polarized by the liquid crystal molecules 52a and kept parallel to the axis 52b' of the dye molecules 52b and is absorbed layer by layer by the dye molecules 52b, the energy of the second component Y is thus reduced. After the light passes through the second dye liquid crystal layer 52, it is rotated by 90 degrees ± 10 degrees due to the polarization of the second dye liquid crystal layer 52, the first component X thus becomes parallel to the fourth alignment direction 38a and perpendicular to the second alignment direction 24a, and the second component Y thus becomes perpendicular to the fourth alignment direction 38a and parallel to the second alignment direction 24a. After the light passes through the first dye liquid crystal layer 50 and the second dye liquid crystal layer 52 as described above, Figure 9 The energy of the first component X and the second component Y of the remaining light on the right side is smaller than that of the light before the light enters from the left side. The energy of the first component X and the second component Y of the remaining light on the right side is smaller than that of the light before the light enters from the left side. ​ The present application can effectively absorb the components of the light in different directions by making the light continuously pass through the first dye liquid crystal layer 50 and the second dye liquid crystal layer 52 of the electronic device, further reduces the penetration of the light when the electronic device is in a low light transmission state, and obtains a better light shielding effect.

[0045] In summary, the electrically controlled light modulation device provided by the present application makes the alignment direction of the alignment layer opposite to each other in the liquid crystal cell perpendicular to each other, makes the liquid crystal molecules twist layer by layer between the two alignment layers in the absence of an electric field, and makes the dye molecules parallel to the surface of the alignment layer (pushed by the liquid crystal molecules), that is, makes the light absorption axis of the dye molecules more parallel to the alignment direction of the incident light alignment layer, thereby improving the light absorption efficiency of the dye molecules and reducing the light leakage at a large viewing angle. On the other hand, the present application forms two layers of liquid crystal cells by sharing the third substrate to absorb light of a specific polarization direction, which can further improve the light absorption rate and also reduce the thickness of the overall liquid crystal cell.

[0046] The above only describes the embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing an electronic device, characterized in that, include: A first liquid crystal cell is provided, which includes a first substrate and a third substrate, wherein a first conductive layer is provided on the first substrate, and a third conductive layer and a fourth conductive layer are respectively provided on opposite sides of the third substrate. A pre-cutting step is performed to form a pre-cutting mark and another pre-cutting mark on the third substrate; A second substrate is disposed on the third substrate to form a second liquid crystal cell, wherein a second conductive layer is provided on the second substrate; The cutting step involves removing a portion of the first substrate and a portion of the first conductive layer along the first cut, removing a portion of the second substrate and a portion of the second conductive layer along the second cut, and simultaneously removing a portion of the third substrate along the pre-cut, exposing one sidewall and the other sidewall of the third substrate. A first conductive adhesive is formed, which covers the sidewall of the third substrate and directly contacts the first conductive layer and the second conductive layer; as well as A second conductive adhesive is formed, which covers the other sidewall of the third substrate and directly contacts the third conductive layer and the fourth conductive layer.

2. The method for manufacturing an electronic device as claimed in claim 1, characterized in that, The first liquid crystal cell further includes a first frame adhesive for sealing a first space between the first substrate and the third substrate, and a first dummy frame adhesive located between the first substrate and the third substrate and outside the first space, wherein the method further includes: The pre-cut mark is formed between the first frame adhesive and the first dummy frame adhesive; and When removing portions of the first substrate and the third substrate, the first dummy frame adhesive is also removed.

3. The method for manufacturing an electronic device as claimed in claim 1, characterized in that, Also includes: A second frame adhesive is formed on the third substrate; as well as The second frame adhesive is formed to combine the second substrate with the third substrate and seal the second space between the second substrate and the third substrate, wherein the pre-cut marks are located outside the second space.

4. The method for manufacturing an electronic device as described in claim 3, characterized in that, Along one direction, the first cut and the second cut are closer to the second frame adhesive than the pre-cut.

5. The method for manufacturing an electronic device as described in claim 3, characterized in that, Along one direction, the first cut and the second cut are further away from the second frame adhesive than the pre-cut.

6. The method for manufacturing an electronic device as claimed in claim 3, characterized in that, Also includes: A second dummy frame adhesive is formed on the third substrate, which is located on the side of the pre-cut relative to the second frame adhesive; The second frame adhesive and the second dummy frame adhesive are used to combine the second substrate with the third substrate; and When removing portions of the second substrate and the third substrate, the second dummy frame adhesive is also removed.

7. The method for manufacturing an electronic device as claimed in claim 1, characterized in that, The pre-cut marks cut through the third and fourth conductive layers so that portions of the third and fourth conductive layers are removed together with portions of the third substrate.

8. The method for manufacturing an electronic device as claimed in claim 1, characterized in that, Also includes: A first dye liquid crystal layer is formed between the first substrate and the third substrate; as well as A second dye liquid crystal layer is formed between the third substrate and the second substrate, wherein the first dye liquid crystal layer and the second dye liquid crystal layer each comprise at least one dichroic dye.

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