Optical device power-on and temperature control device

Abstract

The application discloses a light device power-on and temperature control device, which comprises a heating cover plate, a current source module, an integrated structure of a device power-on clamp and a device fixing jig, and the integrated structure is installed in a cavity of a device main body. The device meets the requirement of providing a constant current and high temperature working environment during the light device test process, and solves the problems of low production efficiency, high operation cost and large operation noise of the existing power-on and temperature control equipment. In addition, the device realizes modular application of the equipment, can be simultaneously used after being inserted and fixed, improves the reliability, manufacturability and maintainability of the equipment, and lays a solid foundation for mass production and large-scale application of the equipment.

Description

Technical Field

[0001] This application relates to the field of optical communication, specifically to an optical device with electrically controlled temperature. It is mainly used for optical device testing, optical device aging verification, and optical device reliability verification. Background Technology

[0002] Optical device testing, optical device aging verification, and optical device reliability verification are key links in the quality inspection and quality control process of optical device production and processing. Power-on temperature control devices are essential devices for optical device testing, optical device aging verification, and optical device reliability verification.

[0003] For a long time, the current operating method of the equipment has had many problems. One is the low production efficiency caused by the inconsistency of tooling fixtures between optical device testing equipment and optical device aging verification and reliability verification equipment in the optical device production process. Another problem is the high operating cost and high operating noise of the power-controlled temperature aging equipment based on hot air. Summary of the Invention

[0004] The purpose of this invention is to solve the problems of low production efficiency, high operating cost, and high operating noise of existing power-on temperature control equipment, and to provide a power-on temperature control device for optical devices to improve working efficiency.

[0005] The technical solution adopted by the present invention to solve the above problems is as follows: A power-on temperature control device for an optical device includes a device body 1003 and a functional unit installed in the cavity of the device body 1003. The functional unit includes a heating cover plate 1001, a current source module 3501, a device power-on clamp 3001, and a device fixing fixture 2501. The heating cover is fixed to the main body 1003 of the device and is used to detect the device and control the device temperature. The current source module 3501 is inserted into the main body 1003 of the device; it is used to provide a constant current. The device fixing fixture 2501 is disposed between the device body 1003 and the heating cover plate 1001 for limiting and fixing the device; The device power-on clamp 3001 is fixed on the top of the functional unit and assembled in parallel on the upper device body 1003 for clamping the device.

[0006] Preferably, the heating cover plate 1001 has a heat insulation cavity 1504 near the device end, a ceramic heating element 1505 is installed in the heat insulation cavity 1504, a thermistor is provided on the inner side of the ceramic heating element 1505, and a thermally conductive pad 1502 is installed in the groove of the heat insulation cavity 1504. Preferably, the heating cover 1001 is also provided with a status indicator light 1004 at the remote device end, and the wires of the ceramic heating element 1505 and the wires of the thermistor 1506 are soldered to the pads on the inner side of the heating cover circuit board 1501.

[0007] Preferably, the current source module 3501 is connected to the current source module circuit board 3502 via a Pogopin 3003a, and the current source module circuit board 3502 is fastened to the device body 1003 by countersunk screws. The two outer ends of the current source module 3501 are connected to the device body 1003 via the first connecting part.

[0008] Preferably, the first connection part includes a limiting protrusion 3501a disposed on the outside of the current source module 3501 and a limiting groove that cooperates with the limiting protrusion 3501a, and the Pogopin 3003 on the side of the current source module 3501 contacts the pad at the corresponding position on the power flow module circuit board 3502.

[0009] Preferably, the device fixing fixture 2501 is provided with a plurality of device limiting grooves, which are used to limit the installation position of the device; one end of the device fixing fixture 2501 is provided with an interface 2501d compatible with LC type fiber optic connector.

[0010] Preferably, the device power-on clamp 3001 is also equipped with a test circuit board 3003; the test circuit board 3003 is fastened to the device body 1003, and the device power-on clamp 3001 is used to ensure that the pads of the optical device FPC are tightly connected to the corresponding pads on the test circuit board 3003.

[0011] Preferably, the device body 1003 includes a back plate 4002, and a pair of fixed sliders 4001 are provided on the back plate 4002. The fixed sliders 4001 are used to connect the back plate 4002 and the device body 1003.

[0012] Preferably, limiting grooves are provided on both sides of the functional unit, and the limiting grooves cooperate with the fixing pins on the fixing slider 4001.

[0013] Preferably, several electrically powered temperature control devices are fixed inside the frame 4501, and the electrically powered temperature control devices are interconnected and used in combination via network cables.

[0014] This invention discloses an electrical temperature control device for optical devices. While meeting the requirements of providing a constant current and high-temperature operating environment during optical device testing, the device creatively integrates a fixture, a constant current source, and a ceramic heating element. Based on this structural design, the device achieves modular application, improving its reliability, manufacturability, and maintainability, laying a solid foundation for mass production and large-scale application.

[0015] Compared to traditional hot air heating, the electrically powered temperature control device of this application improves equipment efficiency while significantly reducing energy consumption. The heating cover plate in the device uses a thermistor and ceramic heating element to detect and heat the temperature, thus achieving temperature control. The temperature control method implemented by this device can reduce equipment operating costs and noise. The power of the ceramic heating element can be selected according to specific operating conditions.

[0016] The current source module provides a constant current to the power-on temperature control device, and also provides overcurrent protection, overvoltage protection, and device temperature monitoring functions.

[0017] The power-on temperature control device of this application is designed and developed based on a modular concept, enabling modular application to improve production efficiency and equipment maintainability. The device uses a limiting groove and a fixing pin on a fixed slider to cooperate with each other, allowing for reliable plugging and unplugging of the power-on temperature control device via a board-to-board connector. Attached Figure Description

[0018] Figure 1 A schematic diagram illustrating the connection method between the heating cover and the main body of the electrically powered temperature control device; Figure 2 This is a schematic diagram of the heating cover plate as a whole. Figure 3 This is a schematic diagram of the heating cover structure; Figure 4 This is a schematic diagram showing the structure and connection of circuit board one and circuit board two; Figure 5 A schematic diagram of the component fixing fixture assembly; Figure 6 A schematic diagram illustrating the structure and function of the device fixing fixture; Figure 7 A schematic diagram of the device fixing fixture structure; Figure 8 A schematic diagram of the device power-on fixture and circuit board assembly; Figure 9 This is a schematic diagram of the assembly and connection of the current source module; Figure 10 This is a schematic diagram of the limiting groove structure; Figure 11 A schematic diagram of an implementation method for an electrically powered temperature control device; Figure 12 A schematic diagram of an implementation method for an electrically powered temperature control device; 1000-Electrified temperature control device, 1000a-Limiting groove one, 1000b-Limiting groove two, 1001-Heating cover plate, 1001a-Unremovable screw one, 1001b-Unremovable screw two, 1003-Main body of the device, 1003a-Main body anti-reverse insertion structure one, 1003b-Main body anti-reverse insertion structure two, 1003c-Threaded hole one, 1003d-Threaded hole two, 1003e-Limiting groove, 1003f-Plate edge limiting groove, 1004-Workpiece Status indicator light guide column, 1501-Heating cover plate circuit board, 1501a-Board to board connector male terminal one, 1501b-Board to board connector male terminal two, 1502-Thermal conductive pad, 1503-Front cover plate, 1503a-Cover plate anti-reverse insertion structure one, 1503b-Cover plate anti-reverse insertion structure two, 1504-Insulation cavity, 1505-Ceramic heating element, 1506-Thermistor, 2001-Connecting circuit board one, 2001a-Board to board... Connector female terminal 1, 2002a - Board-to-board connector female terminal 2, 2002 - Connecting circuit board 2, 2501 - Device fixing fixture, 2501a - Device limiting slot 1, 2501b - Device limiting slot 2, 2501c - Device limiting slot 3, 2501d - Interface, 2502 - Pointing screw, 2503 - Optical device, 3001 - Device power-on clamp, 3002 - Fixing screw, 3003 - Test circuit board, 3003a - POG OPIN, 3003b - Board-to-board connector male terminal three, 3003c - Board-to-board connector male terminal four, 3501 - Current source module, 3501a - Limiting protrusion, 3502 - Current source module circuit board, 4001 - Fixing slider, 4001a - Fixing pin one, 4001b - Fixing pin two, 4002 - Backplate, 4002a - Board-to-board connector female terminal three, 4002b - Board-to-board connector female terminal four, 4501 - Frame. Implementation

[0019] The present invention will be further described below with reference to the embodiments and accompanying drawings. Example

[0020] This invention discloses a power-on temperature control device 1000 for testing optical devices. This device, through its ingenious structural design, is based on a highly integrated device heating cover plate 1001 and current source module 3501, and is further complemented by a compact device power-on clamp 3001 and device fixing fixture 2501, forming a testing functional unit. This solves the problems of low production efficiency, high operating costs, and high operating noise in existing power-on temperature control equipment. This embodiment discloses its specific structure.

[0021] like Figure 1 , 4The heating cover plate 1001 and the main body 1003 of the device are connected to the board-to-board connector male terminal 1501a and board-to-board connector male terminal 1501b on the circuit board of the heating cover plate 1001, and the board-to-board connector female terminal 2001a on the connecting circuit board 1 and the board-to-board connector female terminal 2002a on the connecting circuit board 2002 on the connecting circuit board 2002. The board-to-board connector female terminal 1001a is connected to the temperature control circuit and the thermistor circuit. The circuit board where the board-to-board connector female terminal 2002a is located is equipped with a control unit to realize the control function of the power-on temperature control device status indicator 1004. The anti-reverse insertion structure 1503a and anti-reverse insertion structure 1503b of the heating cover 1001 cooperate with the anti-reverse insertion structures 1003a and 1003b of the main body of the power-on temperature control device 1003 to ensure correct assembly during operation. To prevent the heating cover 1001 from loosening during power-on heating, the non-removable screws 1001a and 1001b of the heating cover 1001 cooperate with the threaded holes 1003c and 1003d of the main body of the power-on temperature control device to ensure that the heating cover 1001 does not loosen during power-on heating.

[0022] Through the electrical connection between the female connector terminal 2001a and the male connector terminal 1501a and the male connector terminal 1501b of the heating cover plate 1001, the functions of temperature control and detection, as well as the display of the working status of the power-on temperature control device, are realized.

[0023] like Figure 2 , 3The heating cover 1001 mainly consists of a front cover 1503, a working status indicator light guide post 1004, a heat insulation cavity 1504, a ceramic heating element 1505, a thermistor 1506, a thermally conductive pad 1502, and a heating cover circuit board 1501. The thermistor 1506 is fixed to the center of the inner side of the ceramic heating element 1505 (near the working status indicator light guide post 1004) using heat-resistant adhesive, and is the core component for temperature detection. The ceramic heating element 1505 is inserted into the cavity of the heat insulation cavity 1504. The function of the heat insulation cavity 1504 is to fix the ceramic heating element 1505 and control its heat diffusion. The thermally conductive pad 1502 is installed in the groove of the heat insulation cavity 1504, and its function is to assist heat diffusion and prevent damage to the optical devices caused by gaps or hard contacts during the mounting process. The heating cover circuit board 1501 has multi-color LEDs on its inner side, which indicate the working status through the corresponding light guide pillars 1004. The wires of the thermistor 1506 and the ceramic heating element 1505 are soldered to the corresponding pads on the inner side of the heating cover circuit board 1501 to achieve temperature detection and control functions. The heat insulation cavity 1504 is assembled with the heating cover circuit board 1501 by screws, and the heating cover circuit board 1501 together with the heat insulation cavity 1504 is fixed to the front cover 1503 with screws. The above structure and assembly method constitute the heating cover 1001.

[0024] like Figure 5-7 The device fixing fixture 2501 is fixed to the corresponding screw holes on the device body 1003 through the positioning holes and pointing screws 2502. It serves to isolate heat conduction and fix the optical device, and at the same time, it serves to modularize the device fixing fixture 2501, realizing the function of clamping devices with different appearance contours by changing the limiting contour of the device fixing fixture 2501.

[0025] The FPC of optical device 2503 is limited by device limiting groove 2501a, the main body of optical device 2503 is limited by device limiting groove 2501b, and the socket positioning ring of optical device 2503 is limited by device limiting groove 2501c. Through these limiting grooves, optical device 2503 is pre-loaded onto device fixing fixture 2501. Device power-on clamp 3001 clamps the FPC pads, ensuring full contact with the corresponding pads on the test circuit board 3003, achieving reliable power-on and simultaneously fixing optical device 2503. These limiting functions achieve device fixing and precise blind mounting alignment of the FPC and test circuit board 3003 pads. One end of device fixing fixture 2501 is equipped with an interface 2501d compatible with LC-type fiber optic connectors. This feature ensures real-time detection of optical power during power-on heating processes such as optical device testing, optical device aging verification, and optical device reliability verification.

[0026] like Figure 8 The device power-on clamp 3001 and the test circuit board 3003 are fastened to the main body 1003 of the power-on temperature control device with screws. The fixing screws 3002 fix the device power-on clamp 3001 to the main body 1003 of the device through the positioning holes at the corresponding positions of the device body 1003. The device power-on clamp 3001 ensures that the pads of the optical device FPC are tightly connected to the pads at the corresponding positions on the test circuit board 3003.

[0027] See Figure 9 , 10 The current source module 3501 engages with the limiting groove 1003e via a limiting protrusion 3501a, and the lower edge engages with the edge limiting groove 1003f. The module is assembled inside the cavity of the power-on temperature control device body 1003. The side Pogopin 3003a of the current source module 3501 is in close contact with the corresponding pad on the current source module circuit board 3502. The side Pogopin 3003a of the test circuit board 3003 is in close contact with the corresponding pad on the current source module circuit board 3502. The current source module circuit board 3502 is fastened to the power-on temperature control device body 1003 with countersunk screws to achieve full contact between the Pogopin and the pad, thus achieving a reliable electrical connection.

[0028] like Figure 11 The main body 1003 of the device includes a back plate 4002, on which a pair of fixed sliders 4001 are provided. The fixed sliders 4001 are used to connect the back plate 4002 and the main body 1003. The back plate 4002 is also provided with limiting grooves. By the mutual cooperation of the limiting grooves 1000a and 1000b with the fixing pins 4001a and 4001b on the fixed sliders 4001, modular application can be realized, and the device can reliably insert and remove the male terminal 3003b and the female terminal 3003c of the board-to-board connector 3002a and the female terminal 4002b of the board-to-board connector 4002.

[0029] like Figure 12 The power-on temperature control device 1000 fixes the fixed slider 4001 and the back plate 4002 in the frame 4501 made of aluminum profiles by screws and aluminum profile fasteners. Multiple power-on temperature control devices 1000 are connected by network cables to realize power supply and communication control functions.

[0030] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A device for electrically controlling the temperature of an optical device, characterized in that, The device includes a main body (1003) and functional units installed in the cavity of the main body (1003). The functional units include a heating cover plate (1001), a current source module (3501), a device power-on clamp (3001), and a device fixing fixture (2501). The heating cover plate is fixed on the main body (1003) of the device and is used to detect the device and control the device temperature. The heating cover plate (1001) has a heat insulation cavity (1504) near the device end. A ceramic heating element (1505) is installed in the heat insulation cavity (1504). A thermistor is provided on the inner side of the ceramic heating element (1505). A thermally conductive pad (1502) is installed in the groove of the heat insulation cavity (1504). A current source module (3501) is inserted into the device body (1003) to provide a constant current. The current source module (3501) is connected to the current source module circuit board (3502) via a Pogopin (3003a). The current source module circuit board (3502) is fastened to the device body (1003) by countersunk screws. The two outer ends of the current source module (3501) are connected to the device body (1003) via a first connecting part. The device fixing fixture (2501) is disposed between the device body (1003) and the heating cover plate (1001) for limiting and fixing the device. The device fixing fixture (2501) is provided with a plurality of device limiting grooves, which are used to limit the installation position of the optical device. One end of the device fixing fixture (2501) is provided with an interface (2501d) compatible with LC type fiber optic connector. The device power-on clamp (3001) is fixed on the top of the functional unit and assembled in parallel on the upper device body (1003) for clamping the device. The device power-on clamp (3001) is also equipped with a test circuit board (3003). The test circuit board (3003) is fastened to the device body (1003). The device power-on clamp (3001) is fixed to the device body (1003) by fixing screws (3002) through the positioning holes of the device body (1003) to ensure that the pads of the optical device FPC are tightly connected to the corresponding pads on the test circuit board (3003).

2. The optical device temperature control device according to claim 1, characterized in that, The heating cover plate (1001) is also provided with a status indicator light (1004) at the remote device end, and the wires of the ceramic heating element (1505) and the wires of the thermistor (1506) are soldered to the pads on the inner side of the heating cover plate circuit board (1501).

3. The optical device temperature control device according to claim 1, characterized in that, The first connection part includes a limiting protrusion (3501a) disposed on the outside of the current source module (3501) and a limiting groove that cooperates with the limiting protrusion (3501a). The Pogopin (3003) on the side of the current source module (3501) contacts the pad at the corresponding position on the power flow module circuit board (3502).

4. The optical device temperature control device according to any one of claims 1-3, characterized in that, The main body (1003) of the device includes a back plate (4002), on which a pair of fixed sliders (4001) are provided. The fixed sliders (4001) are used to connect the back plate (4002) and the main body (1003).

5. The optical device temperature control device according to claim 4, characterized in that, Limiting grooves are provided on both sides of the functional unit, and the limiting grooves cooperate with the fixing pins on the fixed slider (4001).

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