Electroplated diamond segmented staggered polygonal wire saw and processing method thereof

Abstract

The present application relates to a kind of electroplated diamond segmented staggered polygonal wire saw and its processing method, belong to wire saw grinding field.Electroplated diamond segmented staggered polygonal wire saw includes: multiple polygonal matrix, multiple circular matrix, multiple circular arc transition part and diamond electroplating plating layer, polygonal matrix and circular matrix are alternately arranged axially, circular arc transition part both ends are connected polygonal matrix and circular matrix one by one, multiple polygonal matrix is staggered in circumferential direction, diamond electroplating plating layer is arranged on polygonal matrix, circular matrix and circular arc transition part, the diameter of circumscribed circle of polygonal matrix is greater than the diameter of circular matrix.The present application is favorable to make wire saw and workpiece processing contact area or orientation change to automatically adapt the pressure required by working diamond, is favorable to improve the service life and cutting force of working diamond on wire saw matrix, enhance the processing efficiency of wire saw, reduce wire saw breakage rate, improve workpiece cutting surface parallelism.

Description

Technical Field

[0001] This invention relates to the field of wire saw grinding, and more particularly to an electroplated diamond segmented staggered polygonal wire saw and its processing method. Background Technology

[0002] Currently, most diamond-plated wire saws with a diameter of less than 1mm use a single strand of round carbon steel wire as the base (or baseline, mother wire), with a single layer of diamond plated on the surface. Existing technologies employ various layouts for this single layer of diamond, such as disordered, spiral, annular, and chip-guided grooves. During operation, the circular wire saw rotates due to internal stress and other forces, but macroscopically, a working diamond on half of the circumference always contacts the workpiece for grinding, resulting in minimal change in the contact area. The diamond is approximately spherical, and the single-layer plated working diamond is located within the same annular region. During the operation of a wire saw, under relatively fixed safety tension, the working diamond in contact with the workpiece wears down simultaneously. Microscopically, this causes the working surface area of ​​the working diamond in contact with the workpiece to continuously increase, and the pressure applied to the working diamond in contact with the workpiece to decrease exponentially. This results in a continuous weakening of the working diamond's cutting ability, i.e., a continuous reduction in the sharpness of the wire saw. Under these conditions, the cutting trajectory of the wire saw is prone to lateral deviation, resulting in a tilted kerf and reduced parallelism of the processed material, rendering it unusable. Furthermore, due to the limitations of the wire saw's own strength (i.e., breaking force), increasing the tension applied to the wire saw can easily cause it to break, leading to workpiece damage and other accidents. In other words, it is difficult to increase the pressure applied to the working diamond in contact with the workpiece by increasing the wire saw tension. To prevent wire saw breakage, a certain safety margin must be maintained for the wire saw's sharpness, thus relatively reducing the lifespan of the wire saw. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an electroplated diamond segmented misaligned polygonal wire saw and its processing method to solve the above-mentioned problem.

[0004] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: A segmented staggered polygonal wire saw with electroplated diamond, comprising: multiple polygonal substrates, multiple circular substrates, multiple arc transition portions, and a diamond electroplating coating layer, wherein the polygonal substrates and the circular substrates are alternately arranged axially, the two ends of the arc transition portions are correspondingly connected to the polygonal substrates and the circular substrates, the multiple polygonal substrates are staggered in the circumferential direction, and the diamond electroplating coating layer is disposed on the polygonal substrates, the circular substrates, and the arc transition portions, wherein the circumscribed circle diameter of the polygonal substrates is larger than the diameter of the circular substrates.

[0005] The beneficial effects of this invention are: the mechanical crushing effect of the polygonal wire saw helps to reduce the proportion of grinding in the machining process and improves the machining efficiency; the polygonal wire saw naturally generates a functional structure for cooling and chip removal, making it easier for cooling water to play its role and for rapid chip removal to be achieved, reducing unnecessary wear of diamond and ineffective power consumption of cooling water; the embedding effect of the second working surface in the polygonal wire saw base makes it more difficult for the wire saw to wobble laterally, reducing the "cross-cutting" phenomenon and helping the workpiece cutting surface to obtain a higher parallelism; under the same kerf size conditions, the polygonal wire saw can adapt to machining parameters with smaller tension, reducing the wire breakage rate of the wire saw.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, the polygonal base is a linear structure with a polygonal radial cross-section. The polygonal base has multiple first working surfaces and multiple second working surfaces arranged in the circumferential direction. The two sides of the second working surface are connected to two adjacent first working surfaces in a one-to-one correspondence.

[0008] The beneficial effects of adopting the above-mentioned further solution are: the second working surface helps to reduce the area of ​​the wire saw in contact with the workpiece, thereby increasing the pressure of the diamond in contact with the workpiece and improving the sharpness of the wire saw. At the same time, the second working surface can also make it more difficult for the wire saw to wobble laterally, reduce the "cross-cutting" phenomenon, and make the workpiece cutting surface obtain a higher degree of parallelism.

[0009] Furthermore, the circumferential side length of the first working surface on the radial polygonal cross section of the polygonal matrix is ​​greater than 70% of the diamond grain size.

[0010] The beneficial effect of adopting the above-mentioned further solution is that it helps the electroplating coating to better hold the diamond, making the diamond less likely to fall off under force.

[0011] Furthermore, the first working surface is a plane or an arc surface.

[0012] The beneficial effect of adopting the above-mentioned further solution is that the working plane of the base is an arc surface, which helps to reduce the manufacturing difficulty of the wire saw base.

[0013] Furthermore, within any length segment of the first working surface that is equal to the diamond particle size in the axial direction, the circumferential side length of the first working surface on the radial polygonal cross section of the polygonal matrix can be coated with at most one complete working diamond particle.

[0014] The beneficial effects of adopting the above-mentioned further solution are: when the diamonds are arranged in an approximately straight single-particle pattern along the axial direction on the first working surface, it is beneficial to improve the service life and cutting efficiency of the diamonds and improve the sharpness of the wire saw.

[0015] Furthermore, the length of the circular base is less than the cutting length of the workpiece.

[0016] The beneficial effects of adopting the above-mentioned further scheme are: to make the polygonal segment play the main processing role, which is conducive to the wire saw to perform balanced displacement grinding, automatically adapt to the contact area with sufficient pressure applied to the working diamond to achieve cutting processing, reduce the wire breakage rate of the wire saw, and improve the life of the wire saw.

[0017] The processing method of an electroplated diamond segmented staggered polygonal wire saw of the present invention includes the following steps:

[0018] S1: Determine the number of sides, single side length, cross-sectional area, and shape of the diamond-coated area of ​​the radial polygon cross-section of the polygonal base according to actual processing requirements;

[0019] S2: Using a wire drawing die to draw wire to obtain a wire saw base with a circular radial cross-section;

[0020] S3: Based on the number of sides, single side length, and cross-sectional area of ​​the radial polygon cross-section of the polygonal base determined in S1, make the extrusion die;

[0021] S4: A structure adapted to the arc transition section is provided at both ends of the extrusion die;

[0022] S5: Using an extrusion die, the wire saw base obtained in S2 is extruded to obtain a polygonal base with rounded transitions at both ends;

[0023] S6: After misaligning the extrusion die by a certain angle and shifting it by a certain distance, extrude it again to obtain a second polygonal base with rounded transition parts at both ends;

[0024] S7: Repeat S6 multiple times to obtain a segmented, misaligned polygonal wire saw base;

[0025] S8: Heat treatment is performed on the segmented misaligned polygonal wire saw substrate obtained in S7.

[0026] S9: Diamond is electroplated onto the polygonal substrate, circular substrate, and arc transition section according to the shape of the diamond plating area determined in S1.

[0027] The beneficial effects of this invention are: by designing an extrusion die to extrude a circular wire saw base into a segmented, staggered polygonal wire saw base, it is beneficial to customize the wire saw according to different processing requirements, thereby optimizing the grinding performance of the wire saw, improving the service life and cutting force of the wire saw, reducing the wire breakage rate of the wire saw, improving the parallelism of the workpiece cutting surface, and optimizing cooling and chip removal functions. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention;

[0029] Figure 2A top view of the overall structure provided in an embodiment of the present invention;

[0030] Figure 3 For along Figure 2 A schematic diagram of the structure cut along the mid-section line AA;

[0031] Figure 4 For along Figure 2 A schematic diagram of the structure cut along the mid-section line BB;

[0032] Figure 5 For along Figure 2 A schematic diagram of the structure cut along the center section line CC;

[0033] Figure 6 This is a processing diagram provided for an embodiment of the present invention;

[0034] Figure 7 This is a top view of the machining process provided in an embodiment of the present invention;

[0035] Figure 8 This is a processing side view provided for an embodiment of the present invention;

[0036] Figure 9 For along Figure 7 A schematic diagram of the structure cut along the mid-section line DD;

[0037] Figure 10 For along Figure 7 A schematic diagram of the structure cut along the mid-section line EE;

[0038] Figure 11 A flowchart of the processing method provided in an embodiment of the present invention.

[0039] in, Figures 3 to 5 In this context, Φ represents the diameter of the circumcircle on the cross-section of the polygonal base. Figure 3 In this context, B represents the length of a single side of the polygon on the cross-section of the polygonal base. Figure 4 and Figure 10 In this context, X represents the misalignment angle of multiple polygonal bases. Figure 4 In this context, L represents the arc length of the cross section at the corner of the polygonal base. Figure 7 and Figure 8 The arrows in the diagram indicate the direction of the wire saw's processing.

[0040] The attached diagram lists the components represented by each number as follows:

[0041] 1. Polygonal base; 2. Circular base; 3. Arc transition section; 11. First working surface; 12. Second working surface. Detailed Implementation

[0042] The principles and features of the present invention are described below. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0043] like Figures 1 to 6 As shown, a segmented, staggered polygonal wire saw with electroplated diamond comprises: multiple polygonal substrates 1, multiple circular substrates 2, multiple arc transition portions 3, and a diamond electroplating coating. The polygonal substrates 1 and the circular substrates 2 are arranged alternately along the axis. The two ends of the arc transition portions 3 are connected one-to-one to the polygonal substrates 1 and the circular substrates 2. The multiple polygonal substrates 1 are staggered in the circumferential direction. The diamond electroplating coating is disposed on the polygonal substrates 1, the circular substrates 2, and the arc transition portions 3. The diameter of the circumscribed circle of the polygonal substrate 1 is larger than the diameter of the circular substrate 2.

[0044] It is important to understand that the working process of a wire saw grinding a workpiece is as follows: after the wire saw contacts the workpiece surface, it moves back and forth repeatedly along the workpiece axis, while simultaneously moving the wire saw vertically downwards along the workpiece (e.g., ...). Figure 7 and Figure 8 As shown, since the multiple polygonal bases 1 are staggered, the orientation and area of ​​contact between each polygonal base 1 and the workpiece are different.

[0045] The polygonal matrix 1 has different advantages and applicable scenarios depending on the number of sides of its polygonal cross-section. Compared with existing circular cross-section wire saws, under the same cross-sectional area, fewer sides mean more diamond particles can be bonded to each side, resulting in a larger kerf. During grinding, the random contact points between the wire saw and the workpiece are more pronounced, with the polygonal edges making the cutting more obvious (refer to the description of wire saw grinding in the previous paragraph; the edges refer to the second working surface 12 circumferentially set on the polygonal matrix 1). This constitutes a plowshare-like cutting, resulting in a more significant macroscopic mechanical crushing effect, reducing the proportion of grinding processing, lowering the load during diamond processing, and significantly improving macroscopic sharpness (the plowshare-like cutting surface 12 is also mentioned). Plow-cutting refers to a process where the volume of material cut by a wire saw includes not only the material removed by the diamond grinding action of the wire saw, but also debris generated when the diamond grinding action, along with the diamond grinding action, transmits force to the workpiece around the contact surface. This processing method is similar to plowing a field, hence the name "plow-cutting." The macroscopic mechanical crushing refers to the fact that the fewer the number of sides of the polygon, the larger the volume of debris produced by the grinding action. The macroscopic sharpness refers to the fact that the fewer the number of sides of the polygon, the smaller the contact area between the wire saw and the workpiece, and the greater the pressure on the diamond grinding action when the applied force remains constant, resulting in greater sharpness of the wire saw. The more sides a polygon has, the fewer diamond particles can be bonded to each side, and the more ordered the diamond arrangement becomes (the ordered arrangement means that, in the extreme case where only one diamond particle can be bonded to a single side of the polygon, all diamond particles on the first working surface 11 are arranged in an approximately straight line along the axis of the wire saw matrix). The micro-mechanical crushing effect is more pronounced (the micro-mechanical crushing means that the more sides a polygon has, the smaller the volume of debris produced by the polygonal wire saw). Under the same consumption, the service life of the diamond is significantly improved. This characteristic can be used to improve the micro-sharpness of the wire saw by reducing the diamond consumption (this means that the more sides a polygon has, the more ordered the diamond arrangement on the first working surface 11 becomes, thereby reducing the unnecessary grinding loss caused by multiple rows of diamonds on the first working surface 11, thus increasing the diamond life. At the same time, since the number of diamonds on the first working surface 11 is reduced, the contact area between the wire saw and the workpiece is also reduced. Under the same applied force, the diamond in contact with the workpiece experiences greater pressure, and the micro-sharpness is greater). Therefore, when high surface roughness is required (i.e., a smoother workpiece surface is required), a polygonal wire saw with more sides is preferred; when high sawing sharpness (referring to macroscopic sharpness) is required, a polygonal wire saw with fewer sides is preferred.

[0046] When a polygonal wire saw contacts a workpiece, its orientation is random, and there is a high probability that the corner (i.e., the second working surface 12 set upwards around the circumference of the polygonal base) will contact the workpiece first. At this point, the contact area is small, so the working diamond pressure applied to the wire saw contact surface is strong. The corner quickly performs plow-like grinding on the workpiece and forms a locking effect. Unlike circular wire saws, polygonal wire saws do not rotate around the center of the wire saw. Instead, they use the corner locking point as a fulcrum and perform balanced displacement grinding under multiple forces, including radial force, axial force, internal stress, and the force exerted by the workpiece on the wire saw. During displacement grinding, the contact area between the wire saw and the workpiece changes. The contact area between the polygonal wire saw and the workpiece varies depending on the orientation of the polygonal wire saw. This characteristic allows the polygonal wire saw to adaptively change the contact area between the workpiece and the wire saw base, ensuring that the baseline remains within a safe force application range, thereby achieving sufficient pressure on the working diamond to achieve cutting.

[0047] The beneficial effects of this invention are: the mechanical crushing effect of the polygonal wire saw helps to reduce the proportion of grinding in the machining process and improves the machining efficiency; the polygonal wire saw naturally generates a functional structure for cooling and chip removal, making it easier for cooling water to play its role and for rapid chip removal to be achieved, reducing unnecessary wear of diamond and ineffective power consumption of cooling water; the embedding effect of the second working surface in the polygonal wire saw base makes it more difficult for the wire saw to wobble laterally, reducing the "cross-cutting" phenomenon and helping the workpiece cutting surface to obtain a higher parallelism; under the same kerf size conditions, the polygonal wire saw can adapt to machining parameters with smaller tension, reducing the wire breakage rate of the wire saw.

[0048] Preferred, such as Figure 1 and Figure 2 As shown, the polygonal base 1 is a linear structure with a polygonal radial cross section. The polygonal base 1 is provided with a plurality of first working surfaces 11 and a plurality of second working surfaces 12 in the circumferential direction. The two sides of the second working surface 12 are connected to two adjacent first working surfaces 11 in a one-to-one correspondence.

[0049] It is important to understand that the second working surface 12 is an arc-shaped surface that functions similarly to an edge-and-corner interlocking mechanism. Ideally, the radius of the arc on the second working surface 12 should be as small as possible. Using the smallest radius arc reduces the contact area between the second working surface 12 and the workpiece, resulting in greater pressure on the working diamond within the contact surface, making it easier to form an interlocking shape and reducing the "cross-cutting" phenomenon. In electroplated wire saws with polygonal substrates, the second working surface 12 is used more extensively. Under small radius arc conditions, the diamond in the second working surface 12 extends from the diamonds of the two adjacent first working surfaces 11, meaning the working diamond concentration is higher than that of the first working surfaces 11. This is beneficial for improving the wear resistance and lifespan of the second working surface 12. Setting the second working surface 12 between two adjacent first working surfaces 11 also helps reduce tip discharge during wire saw substrate electroplating and balances the plating thickness.

[0050] The advantages of adopting the above-mentioned preferred solution are: the second working surface helps to reduce the area of ​​the wire saw in contact with the workpiece, thereby increasing the pressure of the diamond in contact with the workpiece and improving the sharpness of the wire saw. At the same time, the second working surface can also make it more difficult for the wire saw to wobble laterally, reduce the "cross-cutting" phenomenon, and make the workpiece cutting surface obtain a higher degree of parallelism.

[0051] Preferably, the circumferential side length of the first working surface 11 on the radial polygonal cross section of the polygonal matrix 1 is greater than 70% of the diamond grain size.

[0052] The advantages of adopting the above-mentioned preferred solution are: it helps the electroplated coating to better hold the diamond, making the diamond less likely to fall off under stress.

[0053] Preferably, the first working surface 11 is a plane or an arc surface.

[0054] It should be understood that when the first working surface 11 is a plane, the embodiment is as follows: Figure 1 As shown; when the first working surface 11 is an arc surface, it exists as another preferred embodiment of the present invention, in which the cross section of the wire saw base is similar to the shape of a petal.

[0055] The advantages of adopting the above preferred solution are: the working plane of the base is an arc surface, which helps to reduce the manufacturing difficulty of the wire saw base.

[0056] Preferably, within any length segment of the first working surface 11 that is axially equal to the diamond particle size, the circumferential side length of the first working surface 11 on the radial polygonal cross section of the polygonal substrate 1 is coated with at most one complete working diamond particle.

[0057] It should be understood that, in a preferred embodiment of the present invention, within any length segment of the first working surface 11 equal to the diamond particle size along its axial direction, the circumferential side length of the first working surface 11 on the radial polygonal cross-section of the wire saw base 1 can be coated with at most one complete working diamond particle. In this case, a polygonal wire saw with more sides can be selected. Here, "coated with at most one complete working diamond particle" means that on the first working surface 11, there can be one complete working diamond particle while simultaneously having multiple incomplete working diamond particles; there can be multiple incomplete working diamond particles; or there can be no diamond particle. In other embodiments of the present invention, within any length segment of the first working surface 11 equal to the diamond particle size along its axial direction, when the circumferential side length of the first working surface 11 on the radial polygonal cross-section of the wire saw base 1 can be coated with two or more complete diamond particles side-by-side, a polygonal wire saw with fewer sides is selected. The included angle between the two first working surfaces 11 of the wire saw base is smaller, which is suitable for the second working surface 12 to quickly form a clamping effect on the workpiece and perform plow-like grinding.

[0058] The beneficial effects of adopting the above-mentioned preferred scheme are: when the diamonds are arranged in an approximately straight single-particle pattern along the axial direction on the first working surface, it is beneficial to improve the service life and cutting efficiency of the diamonds and improve the sharpness of the wire saw.

[0059] Preferably, the length of the circular base 2 is less than the cutting length of the workpiece.

[0060] The advantages of adopting the above-mentioned preferred scheme are: it enables the polygonal segment to play the main processing role, which is conducive to the wire saw to perform balanced displacement grinding, automatically adapts to the contact area with sufficient pressure applied to the working diamond to achieve cutting processing, reduces the wire breakage rate of the wire saw, and improves the life of the wire saw.

[0061] like Figure 11 As shown, the processing method of an electroplated diamond segmented staggered polygonal wire saw of the present invention includes the following steps:

[0062] S1: Determine the number of sides, single side length, cross-sectional area, and shape of the diamond-coated area of ​​the radial polygon cross section of the polygonal base 1 according to actual processing requirements;

[0063] S2: Using a wire drawing die to draw wire to obtain a wire saw base with a circular radial cross-section;

[0064] S3: Based on the number of sides, single side length, and cross-sectional area of ​​the radial polygon cross section of the polygonal base 1 determined in S1, make the extrusion die;

[0065] S4: A structure adapted to the arc transition section 3 is provided at both ends of the extrusion die;

[0066] S5: Using an extrusion die, the wire saw base obtained in S2 is extruded to obtain a polygonal base 1 with rounded transition parts 3 at both ends;

[0067] S6: After misaligning the extrusion die by a certain angle and shifting it by a certain distance, extrude it again to obtain a second polygonal base 1 with rounded transition parts 3 at both ends;

[0068] S7: Repeat S6 multiple times to obtain a segmented, misaligned polygonal wire saw base;

[0069] S8: Heat treatment is performed on the segmented misaligned polygonal wire saw substrate obtained in S7.

[0070] S9: Diamond is electroplated onto the polygonal substrate 1, the circular substrate 2 and the arc transition portion 3 according to the shape of the diamond plating area determined in S1.

[0071] It is important to understand that in S1, the number of sides N, the length of a single side B, and the cross-sectional area S of the polygonal cross-section in the polygonal base 1 need to be selected based on actual processing requirements, such as considering the cost of the wire saw base and the kerf of the wire saw (i.e., Figures 3 to 5 The diameter Φ of the circumcircle of the polygon on the cross-section of the wire saw substrate, the diamond particle size, and the maximum number of diamond particles bonded to each side of the polygon cross-section of the wire saw substrate, the number of sides N, the length of a single side B, and the cross-sectional area S of the polygon cross-section must satisfy the following formula: S=N / 4*B2*cot(π / 2N). The shape of the diamond coating area also needs to be set according to the actual processing requirements, such as being set as disordered, spiral ring, annular, or with different particle size segments (i.e., different numbers of diamonds coated in different segments along the axial direction of the wire saw substrate), to achieve various functions, such as efficient cooling, rapid chip removal, orderly diamond arrangement, intermittent grinding, and frequent or random changes in the area of ​​the grinding zone (i.e., the contact area between the wire saw and the workpiece).

[0072] In a preferred embodiment of the present invention, the cross-sectional arc length of the second working surface 12 also needs to be selected according to the actual processing requirements and the reference diamond grit size. When the selected diamond grit size is much smaller than the cross-sectional arc length of the second working surface 12, it is easier to be coated with a relatively higher concentration of diamond on the second working surface 12. This is beneficial to improving the wear resistance of the corner parts of the wire saw base (i.e., the service life of the second working surface 12). When the selected diamond grit size is closer to the circumferential side length of the first working surface 11, it is less likely to be coated with diamond of a higher than average concentration. However, the second working surface 12 is easily protected by the diamond extension on the adjacent first working surface 11. At the same time, it is also easier to obtain diamond with an orderly arrangement effect on the first working surface 11. This structure is beneficial to increase the pressure of the diamond in contact with the workpiece by reducing the diamond concentration, that is, to improve the sharpness of the wire saw.

[0073] In S2, wire drawing using a wire drawing die is an existing technology.

[0074] In S6, the angle of misalignment of the extrusion die X = 360° / N / 2 (e.g., Figure 4 (As shown); the displacement distance is the length of a single circular base 2.

[0075] In S8, the purpose of heat treatment is to eliminate the stress on the wire saw substrate after extrusion and to adjust its mechanical properties.

[0076] As a preferred embodiment of the present invention, after the multi-strand segmented staggered polygonal wire saw base is made by the above processing method, the multi-strand segmented staggered polygonal wire saw base can be twisted into a wire saw, thereby adapting to more application scenarios.

[0077] The beneficial effects of this invention are: by designing an extrusion die to extrude a circular wire saw base into a segmented, staggered polygonal wire saw base, it is beneficial to customize the wire saw according to different processing requirements, thereby optimizing the grinding performance of the wire saw, improving the service life and cutting force of the wire saw, reducing the wire breakage rate of the wire saw, improving the parallelism of the workpiece cutting surface, and optimizing cooling and chip removal functions.

[0078] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0079] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0080] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0081] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0082] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0083] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for processing an electroplated diamond segmented staggered polygonal wire saw, characterized in that, Includes the following steps: S1: Determine the number of sides, single side length, cross-sectional area, and diamond coating area of ​​the polygonal matrix (1) radial polygonal cross-section according to actual processing requirements; S2: Using a wire drawing die to draw wire to obtain a wire saw base with a circular radial cross-section; S3: Based on the number of sides, single side length and cross-sectional area of ​​the radial polygon cross section of the polygonal base (1) determined in S1, make the extrusion die; S4: A structure adapted to the arc transition part (3) is provided at both ends of the extrusion die; S5: Using an extrusion die, the wire saw base obtained in S2 is extruded to obtain a polygonal base (1) with rounded transition parts (3) at both ends; S6: After the extrusion die is misaligned by a certain angle and displaced by a certain distance, it is extruded again to obtain a second polygonal base (1) with rounded transition parts (3) at both ends; S7: Repeat S6 multiple times to obtain a segmented, misaligned polygonal wire saw base; S8: Heat treatment is performed on the segmented misaligned polygonal wire saw substrate obtained in S7. S9: Diamond is electroplated onto the polygonal substrate (1), the circular substrate (2) and the arc transition part (3) according to the shape of the diamond plating area determined in S1; The electroplated diamond segmented staggered polygonal wire saw includes: multiple polygonal substrates (1), multiple circular substrates (2), multiple arc transition portions (3), and a diamond electroplating coating. The polygonal substrates (1) and the circular substrates (2) are arranged alternately in the axial direction. The two ends of the arc transition portions (3) are connected to the polygonal substrates (1) and the circular substrates (2) respectively. The multiple polygonal substrates (1) are staggered in the circumferential direction. The diamond electroplating coating is disposed on the polygonal substrates (1), the circular substrates (2), and the arc transition portions (3). The circumscribed circle diameter of the polygonal substrates (1) is larger than the diameter of the circular substrates (2).

2. The processing method of the electroplated diamond segmented staggered polygonal wire saw according to claim 1, characterized in that, The polygonal base (1) is a linear structure with a polygonal radial cross section. The polygonal base (1) has multiple first working surfaces (11) and multiple second working surfaces (12) arranged in the circumferential direction. The two sides of the second working surface (12) are connected to two adjacent first working surfaces (11) in a one-to-one correspondence.

3. The processing method of the electroplated diamond segmented staggered polygonal wire saw according to claim 2, characterized in that, The circumferential side length of the first working surface (11) on the radial polygonal cross section of the polygonal matrix (1) is greater than 70% of the diamond grain size.

4. The processing method of the electroplated diamond segmented staggered polygonal wire saw according to claim 2, characterized in that, The first working surface (11) is a plane or an arc surface.

5. The processing method of the electroplated diamond segmented staggered polygonal wire saw according to claim 2, characterized in that, Within any length segment of the first working surface (11) that is equal to the diamond particle size in the axial direction, the circumferential side length of the first working surface (11) on the radial polygonal cross section of the polygonal substrate (1) can be coated with at most one complete working diamond particle.

6. The processing method of the electroplated diamond segmented staggered polygonal wire saw according to claim 1, characterized in that, The length of the circular base (2) is less than the cutting length of the workpiece.

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