Liquid jet head and liquid jetting equipment

Abstract

This application relates to liquid jetting heads and liquid jetting devices. A technique is provided to suppress displacement of the jetting substrate arrangement even when the flow path components undergo thermal expansion. A substrate equipped with a jetting liquid and a module fluidly connected to the substrate are inserted and engaged with a frame supporting a support member for supporting the substrate, such that the frame and the flow path face each other spatially in a direction intersecting the insertion direction. Furthermore, when inserted and engaged with the frame, the module abuts against the frame in the insertion direction and is thus supported.

Description

Technical Field

[0001] This invention relates to liquid ejector heads, which can be widely used as, for example, printheads capable of ejecting ink in inkjet systems, and liquid ejection devices equipped with liquid ejector heads. Background Technology

[0002] Japanese Patent Application Publication 2015-039795 discloses a technology in which a printhead for ejecting ink in an inkjet system is constructed by engaging an ejection module, which includes an ejection substrate (the ejection substrate is equipped with an ejection port for ejecting ink and a pressure generating chamber communicating with the ejection port), with a flow path member that supplies ink to the ejection substrate.

[0003] In a printhead based on the technology disclosed in Japanese Patent Application Publication 2015-039795, a high-precision arrangement of the jetting substrate is required to form a high-resolution image. However, in such a printhead, an adhesive is used to integrally form the jetting module and the flow path components. Therefore, for example, when the ink is heated to a high temperature and then jetted, the temperature of the ink flow path components rises due to the ink temperature, and the flow path components thermally expand, thus posing a risk that the position of the precisely arranged jetting substrate may shift. Summary of the Invention

[0004] The present invention was made in view of the above-mentioned problems, in order to provide a technique that can suppress the displacement of the arrangement position of the jetting substrate even when the flow path component supplying ink to the jetting substrate undergoes thermal expansion.

[0005] In a first aspect of the invention, a liquid injection head is provided, comprising:

[0006] The module is equipped with a substrate capable of spraying liquid by driving a jet energy generation element and a flow path that is fluidly connected to the substrate.

[0007] Supporting components, configured to support a base plate; and

[0008] A frame configured to support modules and support members, and to support the support members at the insertion surfaces of the inserted and engaged modules;

[0009] If a module is inserted and engages with a frame, the frame and the flow path face each other spatially in a direction intersecting the insertion direction of the module, and abut against each other in the insertion direction to be supported.

[0010] In a second aspect of the invention, a liquid jetting device is provided, comprising:

[0011] A liquid jet head includes: a module equipped with a substrate capable of jetting liquid by driving a jetting energy generating element and a flow path fluidly connected to the substrate; a support member configured to support the substrate; and a frame configured to support the module and the support member, and supporting the support member at the insertion surface of the inserted and engaged module; wherein, if the module is inserted and engaged with the frame, the frame and the flow path face each other spatially in a direction intersecting the insertion direction of the module, and abut against each other in the insertion direction to be supported.

[0012] According to the present invention, even if the flow path components supplying ink to the jetting substrate undergo thermal expansion, the displacement of the jetting substrate arrangement position can be suppressed.

[0013] Other features of the invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0014] Figure 1 It is a schematic structural diagram of the printing equipment.

[0015] Figure 2A and Figure 2B This is a perspective view of the printhead.

[0016] Figure 3A and Figure 3B This is a perspective view of the substrate and flow path sections.

[0017] Figure 4 This is an exploded view of the printhead.

[0018] Figure 5A and Figure 5B This is a perspective view of the injection module.

[0019] Figure 6 This is an exploded view of the injection module.

[0020] Figure 7 It is along Figure 5A A cross-sectional view of line VII-VII in the middle.

[0021] Figure 8 yes Figure 7 Enlarged view of box VIII in the middle.

[0022] Figure 9 It is along Figure 2A The diagram shown is based on the IX arrow.

[0023] Figure 10 It is along Figure 9 A cross-sectional view of the XX line.

[0024] Figure 11 It is along Figure 10 A cross-sectional view of the XI-XI line.

[0025] Figure 12A and Figure 12B This is a perspective view of the printhead in a different embodiment.

[0026] Figure 13A and Figure 13B yes Figure 12A and Figure 12B A perspective view of the substrate and flow path of the printhead.

[0027] Figure 14 yes Figure 12A and Figure 12B Exploded view of the printhead.

[0028] Figure 15 It is along Figure 12A The diagram shown is based on the XV arrow.

[0029] Figure 16 It is along Figure 15 A cross-sectional view along line XVI-XVI.

[0030] Figure 17 It is along Figure 15 A cross-sectional view of line XVII-XVII in the middle. Detailed Implementation

[0031] Hereinafter, embodiments of the liquid injection head and liquid injection device are described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the invention, and not all combinations of features described in these embodiments are necessary for the solutions of the present invention. Furthermore, the positions, shapes, etc., of the constituent elements described in the embodiments are merely examples and are not intended to limit the invention to the scope of these examples.

[0032] (First Embodiment)

[0033] First refer to Figures 1 to 11 The liquid ejector head according to the first embodiment will be described. In this embodiment, an inkjet printhead (hereinafter referred to as "printhead") capable of performing printing on an object by ejecting ink through a piezoelectric element will be described as an example of a liquid ejector head. Note that the ejection energy generating element is not limited to a piezoelectric element, and an electrothermal conversion element (heater element) may also be used. In this case, ink is ejected by bubbles generated by the heater element. Furthermore, the liquid ejection system is not limited to the system described above, and various known systems may be used.

[0034] <Printing equipment>

[0035] Figure 1 This is a schematic structural diagram of a printing device equipped with a printhead, which is a liquid jetting head according to this embodiment. Figure 1The printing device 10 shown is a printing device that performs printing on a printing medium P by ejecting ink from a printhead in an inkjet system. Note that the liquid ejected from the printhead is not limited to ink; a processing liquid that performs a predetermined treatment on the ink ejected onto the printing medium P can also be used.

[0036] The printing apparatus 10 is equipped with a transport section 12 that conveys printing media P along the +Y direction and a printing section 14 that performs printing by spraying ink onto the printing media P conveyed by the transport section 12. The transport section 12 includes a belt 20 that is annularly tensioned around two rollers 16 and 18. Roller 16 is a drive roller driven by a drive motor, and roller 18 is a driven roller that rotates by the driving force of roller 16 transmitted via the belt 20.

[0037] The printing unit 14 is equipped with printheads 22, the ink-ejecting surfaces of which face the printing medium P conveyed by the transport unit 12. In this embodiment, the printing unit 14 includes printheads 22 that eject different colors of ink. Specifically, it includes a printhead 22C that ejects cyan (C) ink, a printhead 22M that ejects magenta (M) ink, a printhead 22Y that ejects yellow (Y) ink, and a printhead 22K that ejects black (K) ink. In the printing device 10, the array of printheads 22 is arranged along the +Y direction in the order of printhead 22C, printhead 22M, printhead 22Y, and printhead 22K.

[0038] In each printhead 22, an array of multiple ejection nozzles for ink ejection is arranged along an X direction that intersects the Y direction (perpendicular in this embodiment). The length of the nozzle array in the X direction formed by arranging the array of multiple ejection nozzles in the printhead 22 corresponds to the length in the width direction (X direction) of the maximum printable medium P that can be printed by the printing device 10. Each printhead 22 is connected to an ink tank (not shown) storing the corresponding ink and is configured such that the ink circulates between the ink tank and the printhead 22. Note that various known techniques can be used for structures that circulate ink between the ink tank and the printhead 22, therefore detailed descriptions are omitted.

[0039] Although this embodiment is configured to circulate ink between the ink tank and the printhead 22, it is not limited to this. For example, it could be a form in which two ink tanks are provided without ink circulation, and the printhead is positioned between the two tanks, so that ink flows in the printhead 22 by flowing ink from one tank to the other. Furthermore, in the printing device 10, at the moment when the printing start position on the printing medium P is below the printhead 22C, ink C is ejected under the control of the control unit (not shown) controlling the printing device 10. Afterward, the printing medium P is conveyed, and ink is ejected from the printheads 22M, 22Y, and 22K in the same manner, thereby performing printing on the printing medium P. That is, in this embodiment, the printing device 10 prints on the printing medium by conveying the printing medium once in the +Y direction. The structure of the printing device 10 is not limited to the full-line structure described above, but could also be a serial scanning structure or a flatbed structure.

[0040] <Structure of the print head>

[0041] Next, the structure of the print head installed on the printing device 10 will be described. Figure 2A and Figure 2B This is a perspective view of the printhead. Figure 2A This is a view taken from the downstream side in the +Z direction. Figure 2B This is a view taken from the upstream side in the +Z direction. Figure 3A and Figure 3B It is contained in Figure 2A and Figure 2B A perspective view of the substrate section and flow path section inside the printhead. Figure 3A It is the substrate section. Figure 3B It is the flow path section. Figure 4 This is an exploded view of the printhead.

[0042] Printhead 22 is equipped with: a substrate section 202, which includes a printing element substrate 200 capable of ejecting ink; and a flow path section 204, in which flow paths are formed for supplying ink to the printing element substrate 200 and recovering ink from the printing element substrate (see [link]). Figure 3A and Figure 3B Note that in this embodiment, the case where the printhead 22 is equipped with a printing element substrate 200 will be described. In the printhead 22, the substrate portion 202 and the flow path portion 204 are connected to each other and are housed in the cover member 206 in a state supported by the support member 205 (hereinafter also referred to as the "frame"). Here, the flow path connection portion 324 (described later) for connecting to the external flow path is in a state where it protrudes from the upper side of the printhead 22 (see...). Figure 2A Furthermore, on the lower surface of the printhead 22, the print element substrate 200 is exposed while being supported by the print element substrate support member 406 (described later) (see [link]). Figure 2B ).

[0043] The substrate 202 is equipped with a printing element substrate 200, a drive circuit substrate 304, a flexible wiring substrate 306, and an electrical wiring substrate 308. The printing element substrate 200 is electrically connected to a control unit (not shown in the figure) that controls the entire printing device via the drive circuit substrate 304, the flexible wiring substrate 306, and the electrical wiring substrate 308. Note that the printing element substrate 200 corresponds to the jetting substrate described in the background section. That is, the printing element substrate 200 is equipped with a jetting nozzle and a pressure generating chamber communicating with the jetting nozzle. Pressure is generated in the pressure generating chamber by driving the printing element (jet energy generating element), thereby jetting ink from the jetting nozzle by pressure. As the printing element, various known components such as electrothermal conversion elements and piezoelectric elements can be used, for example.

[0044] The electrical wiring board 308 is equipped with electrical connection terminals 310. Furthermore, the electrical wiring board 308 is connected to the flexible wiring board 306 via electrical connection portions 311 provided on the flexible wiring board 306. Regarding the two sides of the cover member 206 parallel to the XZ plane, an opening 206a is provided in the upper part. Furthermore, if the substrate portion 202 and the flow path portion 204 are housed within the cover member 206, the electrical connection terminals 310 are exposed to the outside via the opening 206a (see [link]). Figure 2A and Figure 2B The wiring connected to the control unit of the printing device 10 is connected to the electrical connection terminal 310. Therefore, the jet drive signal output from the control unit and the power required for jetting are input from the electrical connection terminal 310 and provided to the printing element substrate 200 via the electrical wiring board 308, the flexible wiring board 306 and the drive circuit board 304.

[0045] Compared to the number of terminals in the print element substrate 200, the wiring is compacted by the circuitry on the electrical wiring substrate 308, which reduces the number of terminals in the electrical connection terminals 310. Therefore, the number of electrical connections that need to be removed when replacing the print head 22 in the printing device 10 can be reduced. Furthermore, the print element substrate 200 and a portion of the flexible wiring substrate 306 are supported by the print element substrate support member 406. If the substrate portion 202 and the flow path portion 204 are housed in the cover member 206, the print element substrate support member 406 is supported by the support member 205, thereby forming the lower surface of the print head 22. The print element substrate support member 406 is supported such that the print element substrate 200 is exposed from the bottom surface of the print head 22.

[0046] The flow path section 204 is equipped with a first flow path member 312, a second flow path member 314, and a third flow path member 316. The first flow path member 312 is connected to the second flow path member 314, allowing fluid to flow in the flow path formed therebetween, i.e., fluid connection. The second flow path member 314 is fluidly connected to the third flow path member 316. Note that if the substrate section 202 and the flow path section 204 are connected to each other, the first flow path member 312 is fluidly connected to the print element substrate 200.

[0047] Furthermore, the flow path section 204 is equipped with a fourth flow path component 318, a fifth flow path component 320, and a liquid supply unit 322. The third flow path component 316 and the fourth flow path component 318 are connected to each other as a flow path, and the fourth flow path component 318 and the fifth flow path component 320 are fluidly connected to each other. The fifth flow path component 320 is connected via a connecting portion 321 (see...). Figure 4 It is connected to the liquid supply unit 322.

[0048] In the liquid supply unit 322, a flow path connection 324 is provided on the upper surface. Furthermore, a filter (not shown) for removing foreign matter from the flowing ink is provided inside the liquid supply unit 322, communicating with each opening of the flow path connection 324. The flow path connection 324 is connected to the ink supply system of the printing device 10. Specifically, the ink supply system is connected to one of the two flow path connections 324 provided in the liquid supply unit 322 to supply ink to the liquid supply unit 322, and the ink supply system is also connected to the other one to recover ink from the liquid supply unit 322.

[0049] As described above, the flow path of the flow path section 204 is fluidly connected to the flow path of the print element substrate 200. Therefore, this embodiment is configured such that ink circulates in an ink flow path system including the flow path of the printing device 10 and the flow path of the print head 22. Liquid supplied to the liquid supply unit 322 flows through the fifth flow path member 320, the fourth flow path member 318, the third flow path member 316, the second flow path member 314, and the first flow path member 312 to supply to the print element substrate 200. Furthermore, ink supplied to the print element substrate 200 but not ejected flows through the first flow path member 312, the second flow path member 314, the third flow path member 316, the fourth flow path member 318, and the fifth flow path member 320 to be recovered from the print element substrate 200 back to the liquid supply unit 322.

[0050] In the printhead 22, the electrical wiring substrate support 402 is configured to surround the outer periphery of the liquid supply unit 322. If the substrate portion 202 and the flow path portion 204 are connected to each other, the electrical wiring substrate 308 is supported by the electrical wiring substrate support 402. In this embodiment, it is assumed that a portion of the substrate portion 202 and a portion of the flow path portion 204 form the jetting module 404 (see...). Figure 4The structure of the substrate portion 202 constituting the jetting module 404 includes a flexible wiring substrate 306, a drive circuit substrate 304, and a printing element substrate 200. Furthermore, the structure of the flow path portion 204 constituting the jetting module 404 includes a first flow path member 312, a second flow path member 314, and a third flow path member 316.

[0051] <Structure of the injection module>

[0052] Next, the structure of the injection module 404 will be described in detail. Figure 5A and Figure 5B This is a perspective view of the injection module. Figure 5A This is a view taken from the downstream side in the +Z direction. Figure 5B This is a view taken from the upstream side in the +Z direction. Figure 6 This is an exploded view of the injection module. Figure 7 It is along Figure 5A A cross-sectional view of line VII-VII in the middle. Figure 8 yes Figure 7 Enlarged view in box VIII.

[0053] In the jetting module 404, the printing element substrate 200 and the flexible wiring substrate 306 are joined to the printing element substrate support member 406 for support (see [link]). Figure 6 On the flexible wiring substrate 306, electrodes are provided for grounding the driving circuit substrate 304, and the driving circuit substrate 304 is fixed with conductive adhesive. In the printed element substrate support member 406, the printed element substrate 200 and the driving circuit substrate 304 are electrically connected by bonding wires 802, and the driving circuit substrate 304 and the flexible wiring substrate 306 are electrically connected by bonding wires 804 (see...). Figure 8 ).

[0054] The drive circuit board 304 is connected to the first flow path member 312 via a heat dissipation member 602 to suppress the temperature rise caused by the heat generated when driving the drive circuit board 304 (see...). Figure 6 Note that in the injection module 404, a coolant flow path 806 is formed directly above the drive circuit board 304 by a first flow path member 312 and a second flow path member 314. Coolant flows through this coolant flow path 806. Therefore, the heat generated in the drive circuit board 304 is dissipated to the first flow path member 312 via the heat dissipation member 602. Furthermore, the heat dissipated to the first flow path member 312 is subsequently absorbed by the coolant in the coolant flow path 806. Therefore, it is preferable to form the first flow path member 312 with a material having high thermal conductivity (e.g., alumina).

[0055] In the injection module 404, a liquid flow path section 702 is formed by a first flow path component 312, a second flow path component 314, and a third flow path component 316 (see...). Figure 7 The liquid flow path 702 includes a liquid flow path 702a for storing ink to be supplied to the print element substrate 200 and a liquid flow path 702b for storing ink recovered from the print element substrate 200. Ink is supplied from the liquid supply unit 322 to the liquid flow path 702a via a fourth flow path member 318 and a fifth flow path member 320. Ink stored in the liquid flow path 702b is recovered by the liquid supply unit 322 via the fourth flow path member 318 and the fifth flow path member 320.

[0056] In the ink jet module 404, the first flow path member 312, the second flow path member 314, and the third flow path member 316 constituting the ink flow path have approximately the same length in the Y direction. Furthermore, the second flow path member 314 and the third flow path member 316 have approximately the same length in the X direction. The first flow path member 312 is formed to be longer than the second flow path member 314 and the third flow path member 316 in the X direction (see...). Figure 10 The second flow path member 314 is bonded to the first flow path member 312 at approximately the center position in the X direction. Therefore, if the first flow path member 312 and the second flow path member 314 are bonded together, predetermined areas are formed at both ends of the first flow path member 312 in the X direction (predetermined direction) where the second flow path member 314 is not bonded. In the first flow path member 312, a protrusion 502 protruding in the Z direction is formed in the predetermined areas formed at both ends in the X direction. Note that the protrusion 502 extends in the Y direction at a position where it does not contact the second flow path member 314 bonded to the first flow path member 312. Furthermore, the protrusion 502 is formed so as not to contact the second flow path member 314 bonded to the first flow path member 312, for example, in the predetermined areas formed at both ends of the first flow path member 312 in the X direction.

[0057] <Ejection module engagement status>

[0058] Next, the engagement of the jetting module 404 in the printhead 22 will be described. In the printhead 22, when the substrate portion 202 and the flow path portion 204 are housed in the cover member 206 in a connected state, the jetting module 404 is supported by the support member 205. Note that the cover member 206 is bonded to the support member 205, for example, by an adhesive. Figure 9 It is along Figure 2A The image shown is indicated by the IX arrow. Figure 10 It is along Figure 9 A cross-sectional view of the XX line. Figure 11 It is along Figure 9 A cross-sectional view along line XI-XI.

[0059] In the spraying module 404, the flexible wiring substrate 306 is bent toward the sides parallel to the XZ plane of the first flow path member 312, the second flow path member 314, and the third flow path member 316, and is supported by the support member 205 (see...). Figure 4 and Figure 5A ).

[0060] The support member 205 supporting the injection module 404 is equipped with an opening 205a extending through the Z direction (see...). Figure 4 Opening 205a consists of an upper opening 205a-1 located downstream in the +Z direction and a lower opening 205a-2 located upstream in the +Z direction (see...). Figure 10 and Figure 11 The upper opening 205a-1 and the lower opening 205a-2 have a generally rectangular shape. The opening area of ​​the lower opening 205a-2 is designed to be larger than the opening area of ​​the upper opening 205a-1. More specifically, the opening area of ​​the upper opening 205a-1 is designed to be larger than the second flow path member 314 and smaller than the first flow path member 312. Furthermore, the lower opening 205a-2 is designed to be larger than the first flow path member 312 and smaller than the printed element substrate support member 406.

[0061] Therefore, in opening 205a, the inner wall bends at the boundary between the upper opening 205a-1 and the lower opening 205a-2, thereby forming a wall surface 1102 extending in the X direction (see...). Figure 11 ) and the wall 1002 extending along the Y direction and generally parallel to the XY plane (see Figure 10 That is, wall surface 1102 is formed at both ends of the opening 205a in the Y direction, and wall surface 1002 is formed at both ends of the opening 205a in the X direction. Wall surface 1002 has a predetermined length in the X direction, which is such that if the injection module 404 is supported by the support member 205, wall surface 1002 can adhere to the protrusions 502 formed at both ends of the first flow path member 312 in the X direction.

[0062] The injection module 404 is inserted from the upstream side in the +Z direction into the opening 205a of the support member 205 formed as described above. If the injection module 404 is inserted into the opening 205a, the second flow path member 314 and the third flow path member 316 pass through the lower opening 205a-2 and are inserted into the upper opening 205a-1. On the other hand, the first flow path member 312 is inserted into the lower opening 205a-2, but cannot be inserted into the upper opening 205a-1 because the protrusion 502 and the wall surface 1002 are in contact with each other.

[0063] Then, the injection module 404 and the support member 205 are aligned such that the second flow path member 314 does not contact the inner wall of the upper opening 205a-1 and the first flow path member 312 does not contact the inner wall of the lower opening 205a-2. Here, the first flow path member 312 and the second flow path member 314 are arranged facing the support member 205, with a space between them. Specifically, a space is formed between the second flow path member 314 and the upper opening 205a-1, and the second flow path member 314 and the upper opening 205a-1 are arranged to face each other. Furthermore, a space is formed between the first flow path member 312 and the lower opening 205a-2, and the first flow path member 312 and the lower opening 205a-2 are arranged to face each other. Note that components such as the opening 205a, the first flow path member 312, and the second flow path member 314 are designed such that these spaces are large enough to accommodate the thermal expansion of the first flow path member 312 and the second flow path member 314. In other words, the components are designed such that even if thermal expansion occurs in the first flow path component 312 and the second flow path component 314, these flow path components will not come into contact with the lower opening 205a-2 and the upper opening 205a-1, or even if they do come into contact, they will not deform the support component 205.

[0064] Furthermore, if the alignment of the spray module 404 and the support member 205 is performed, only the protrusion 502 and the wall surface 1002 abut against each other. Therefore, these components are bonded with adhesive so that the spray module 404 is fixed and supported by the support member 205. As described above, in this embodiment, the spray module 404 is supported by the support member 205 when the protrusion 502 of the first flow path member 312 and the wall surface 1002 of the support member 205 abut against each other in the insertion direction of the spray module 404. In this embodiment, the protrusion 502 serves as the abutting portion of the support member 205. Furthermore, the wall surface 1002 is the portion of the support member 205 that abuts against the protrusion 502 of the first flow path member 312.

[0065] Furthermore, if alignment of the jetting module 404 and the support member 205 is performed, the printing element substrate support member 406 is supported by the insertion surface (i.e., bottom surface 205b) of the support member 205 into which the jetting module 404 is inserted. That is, in this embodiment, the jetting module 404 is supported by the support member 205 by inserting it into the support member 205 for engagement. Here, the +Z direction is the insertion direction for inserting the jetting module 404 into the support member 205.

[0066] The fourth flow path component 318 is fluidly connected to the jet module 404, which is supported by the support component 205 as described above, via the sealing component 1004, etc. Furthermore, the fifth flow path component 320, the liquid supply unit 322, etc. are fluidly connected to the fourth flow path component 318, and the electrical wiring substrate support 402, etc. are attached, thereby assembling the printhead 22.

[0067] As described above, this embodiment is configured such that the injection module 404 is inserted into the support member 205 for engagement and thus supported. Here, the first flow path member 312 and the second flow path member 314 are arranged facing the support member 205 in a direction intersecting the insertion direction of the injection module 404, with a space between them. Note that the size of this space is sufficient to accommodate the thermal expansion of the first flow path member 312 and the second flow path member 314. Furthermore, in the insertion direction, the first flow path member 312 is configured to contact the wall surface 1002 of the support member 205 for support.

[0068] Therefore, even if the first flow path member 312 and the second flow path member 314 experience thermal expansion due to heat generated during the operation of the drive circuit substrate 304 or heat generated by a large current flowing into the flexible wiring substrate 306, the support member 205 is not easily deformed. Specifically, spaces are formed between the first flow path member 312 and the lower opening 205a-2, and between the second flow path member 314 and the upper opening 205a-1, to accommodate the thermal expansion of these flow path members. Therefore, even if thermal expansion occurs in the first and second flow path members, these flow path members are not easily pressed against the opening 205a, and thus the support member 205 is not easily deformed.

[0069] Furthermore, by suppressing the deformation of the support member 205, the deformation of the printing element substrate support member 406 supported by the bottom surface 205b of the support member 205 is suppressed. Therefore, the displacement of the arrangement position of the printing element substrate 200 supported by the printing element substrate support member 406 is suppressed.

[0070] (Second Embodiment)

[0071] Next, refer to Figures 12A to 17 The liquid injection head according to the second embodiment will be described below. Note that in the following description, the same or corresponding structures as the liquid injection head according to the first embodiment are given the same reference numerals as those used in the first embodiment, thereby omitting detailed descriptions.

[0072] The second embodiment differs from the first embodiment in that the four printing element substrates 200 capable of ejecting ink are arranged in an alternating pattern in the print head 22.

[0073] <Print head structure>

[0074] The printhead, which serves as the liquid jetting head in this embodiment, will be described below. Figure 12A and Figure 12B This is a perspective view of the printhead in this embodiment. Figure 12A This is a view taken from the downstream side in the +Z direction. Figure 12B This is a view taken from the upstream side in the +Z direction. Figure 13A and Figure 13B Is Figure 12A and Figure 12B A perspective view of the printing section and flow path section housed inside the printhead. Figure 13A It is the substrate section. Figure 13B It is the flow path section. Figure 14 This is an exploded view of the printhead.

[0075] Printhead 22 is equipped with: a substrate portion 1202, which includes a printing element substrate 200 capable of ejecting ink; and a flow path portion 1204, in which a flow path is formed for supplying ink to the printing element substrate 200 and recovering ink from the printing element substrate 200 (see...). Figure 13A and Figure 13B In this embodiment, the printhead 22 is equipped with four printing element substrates 200, and the printing element substrates 200 are arranged in a staggered manner. In the printhead 22, the substrate portion 1202 and the flow path portion 1204 are connected to each other and are housed in the cover member 1206 in a state supported by the support member 1205. Here, the flow path connection portion 324 for connecting to the external flow path is exposed from the upper side of the printhead 22 (see...). Figure 12A Furthermore, on the lower surface of the printhead 22, the print element substrate 200 is exposed while being supported by the print element substrate support member 406 (see...). Figure 12B ).

[0076] The substrate section 1202 is equipped with four substrate groups 1300, each including a printing element substrate 200, a drive circuit substrate 304, and a flexible wiring substrate 306. These four substrate groups 1300 are respectively connected to the electrical wiring substrate 1308. The printing element substrate 200 is electrically connected to the control unit that controls the entire printing device 10 via the drive circuit substrate 304, the flexible wiring substrate 306, and the electrical wiring substrate 1308.

[0077] One electrical wiring board 1308 is provided for every two substrate groups 1300. Therefore, the substrate section 1202 is equipped with two electrical wiring boards 1308. The electrical wiring boards 1308 are connected to the substrate groups 1300 via electrical connection portions 311 of flexible wiring boards 306 arranged adjacent to each other in the X direction. Each electrical wiring board 1308 is provided with an electrical connection terminal 1310 corresponding to the respective substrate group 1300 to which it is to be connected. Therefore, two electrical connection terminals 1310 are provided on the electrical wiring board 1308. Specifically, in the electrical wiring board 1308, the electrical connection terminal 1310a corresponding to one substrate group 1300 is provided along the Y direction, while the electrical connection terminal 1310b corresponding to the other substrate group 1300 is provided along the +Z direction.

[0078] Regarding the two sides of the cover member 1206 parallel to the XZ plane, an opening 1206a is provided on the upper part. Furthermore, two openings 1206b are provided on the upper surface of the cover member 1206. Additionally, if the substrate portion 1202 and the flow path portion 1204 are housed in the cover member 1206, the electrical connection terminal 1310a is exposed to the outside via the opening 1206a, and the electrical connection terminal 1310b is exposed to the outside via the opening 1206b (see...). Figure 12A and Figure 12B The wiring connected to the control unit of the printing device 10 is connected to the electrical connection terminal 1310. Therefore, the jet drive signal output from the control unit and the power required for jetting are input from the electrical connection terminal 1310 and supplied to the printing element substrate 200 of each substrate group 1300.

[0079] By streamlining the wiring through the circuitry on the electrical wiring substrate 1308, the number of terminals in the electrical connection terminals 1310 can be reduced compared to the number of terminals in the print element substrate 200. Therefore, the number of electrical connections that need to be removed when replacing the print head 22 in the printing device 10 can be reduced. Furthermore, in the substrate assembly 1300, a portion of the print element substrate 200 and the flexible wiring substrate 306 are supported by the print element substrate support member 406. If the substrate portion 1202 and the flow path portion 1204 are housed in the cover member 1206, the print element substrate support member 406 is supported by the support member 1205 and positioned on the lower surface of the print head 22. The print element substrate support member 406 is supported such that the print element substrate 200 is exposed from the bottom surface of the print head 22.

[0080] The flow path section 1204 is equipped with four flow path groups 1350, and the first flow path member 312, the second flow path member 314, and the third flow path member 316 are fluidly connected to these four flow path groups 1350. The flow path groups 1350 are respectively connected to the substrate group 1300, and the printing element substrate 200 is fluidly connected to the first flow path member 312. In addition, the flow path section 1204 is equipped with two sets of fourth flow path members 1318 and fifth flow path members 1320. The fourth flow path members 1318 and fifth flow path members 1320 are connected to each other as flow paths, and are connected to two flow path groups 1350 that are adjacent to each other in the X direction. Therefore, in the fourth flow path members 1318 and fifth flow path members 1320, a flow path for supplying ink to the two flow path groups 1350 and a flow path for recovering ink from the flow path groups 1350 are formed. Furthermore, the fourth flow path component 1318 is connected via a sealing component 1452 to the third flow path component 316 in the corresponding flow path group 1350 (see Figure 14 ).

[0081] In the flow path section 1204, the sixth flow path member 1352 and the seventh flow path member 1354 are fluidly connected to two fifth flow path members 1320 that are adjacent in the Y direction and fluidly connected to the fourth flow path member 1318. Specifically, the sixth flow path member 1352 is fluidly connected to the two fifth flow path members 1320 via the sealing member 1454, and the seventh flow path member 1354 is fluidly connected to the sixth flow path member 1352.

[0082] The flow path section 1204 is equipped with a liquid supply unit 1322. The liquid supply unit 1322 is fluidly connected to the seventh flow path member 1354. In the liquid supply unit 1322, two pairs of flow path connection portions 324 are provided on the upper surface. A filter (not shown) for removing foreign matter from the flowing ink is provided inside the liquid supply unit 1322 so as to communicate with each opening of the flow path connection portion 324. The flow path connection portion 324 is connected to the ink supply system of the printing device 10. Specifically, the flow path connection portion 324 provided in the liquid supply unit 1322 is equipped with a flow path connection portion 324a for supplying ink to the liquid supply unit 1322 and a flow path connection portion 324b for recovering ink from the liquid supply unit 1322. One pair of the two pairs of flow path connection portions 324 provided in the liquid supply unit 1322 supplies ink to and recovers ink from the two flow path groups 1350 located upstream in the +Y direction. In addition, ink is supplied to and recovered from two flow path groups 1350 located downstream in the +Y direction in the other pair of flow path connection parts 324.

[0083] As described above, the flow path of the flow path 1204 is fluidly connected to the flow paths of the four print element substrates 200. Therefore, this embodiment is configured such that ink circulates in an ink flow path system including the flow path of the printing device 10 and the flow path of the print head 22. Ink supplied to the liquid supply unit 1322 flows into the flow path assembly 1350 through the seventh flow path member 1354, the sixth flow path member 1352, the fifth flow path member 1320, and the fourth flow path member 1318, and is supplied to the print element substrates 200 via the flow path assembly 1350. Furthermore, ink supplied to the print element substrates 200 is recovered from the print element substrates 200 to the liquid supply unit 1322 through the flow path assembly 1350, the fourth flow path member 1318, the fifth flow path member 1320, the sixth flow path member 1352, and the seventh flow path member 1354.

[0084] In the printhead 22, the electrical wiring substrate support 1402 is configured to surround the outer periphery of the liquid supply unit 1322. If the substrate portion 1202 and the flow path portion 1204 are connected to each other, the electrical wiring substrate 1308 is supported by the electrical wiring substrate support 1402. In this embodiment, it is assumed that the substrate assembly 1300 and the flow path assembly 1350 form the jetting module 1404 (see...). Figure 14 That is, the printhead 22 is equipped with four jetting modules 1404. Note that since the construction of the jetting module 1404 is the same as that of the jetting module 404 described in the first embodiment above, a detailed description is omitted in this embodiment.

[0085] <Ejection module engagement status>

[0086] Next, the engagement of the jetting module 1404 in the printhead 22 will be described. In the printhead 22, when the substrate portion 1202 and the flow path portion 1204 are housed in the cover member 1206 in a connected state, the jetting module 1404 is supported by the support member 1205. Note that the cover member 1206 is bonded to the support member 1205, for example, by an adhesive. Figure 15 From Figure 12A The diagram viewed from the XV arrow direction. Figure 16 It is along Figure 15 A cross-sectional view along line XVI-XVI. Figure 17 It is along Figure 15 A cross-sectional view of line XVII-XVII in the middle.

[0087] In the spraying module 1404, the flexible wiring substrate 306 is bent toward the sides parallel to the XZ plane of the first flow path member 312, the second flow path member 314, and the third flow path member 316, and is supported by the support member 1205 (see...). Figure 14 The support member 1205 supporting the four injection modules 1404 is equipped with four openings 205a extending through the Z direction (see...). Figure 14Since the structure of opening 205a has been described in the first embodiment above, a detailed description is omitted here.

[0088] To support the injection module 1404 with the support member 1205, the injection module 1404 is inserted into each of the openings 205a of the support member 1205 from the upstream side in the +Z direction. If the injection module 1404 is inserted into the opening 205a, the second flow path member 314 and the third flow path member 316 pass through the lower opening 205a-2 and are inserted into the upper opening 205a-1. On the other hand, the first flow path member 312 is inserted into the lower opening 205a-2, but cannot be inserted into the upper opening 205a-1 because the protrusion 502 and the wall surface 1002 are in contact with each other.

[0089] Then, the alignment of each injection module 1404 and support member 1205 is performed such that the second flow path member 314 does not abut against the inner wall of the upper opening 205a-1 and the first flow path member 312 does not abut against the inner wall of the lower opening 205a-2. Here, the first flow path member 312 and the second flow path member 314 are arranged facing the support member 205, with a space between them. Specifically, a space is formed between the second flow path member 314 and the upper opening 205a-1, and the second flow path member 314 and the upper opening 205a-1 are arranged to face each other. In addition, a space is formed between the first flow path member 312 and the lower opening 205a-2, and the first flow path member 312 and the lower opening 205a-2 are arranged to face each other. Note that components such as the opening 205a, the first flow path member 312, and the second flow path member 314 are designed such that these spaces are large enough to accommodate the thermal expansion of the first flow path member 312 and the second flow path member 314. In other words, each component is designed so that even if thermal expansion occurs in the first flow path component 312 and the second flow path component 314, these flow path components will not come into contact with the lower opening 205a-2 and the upper opening 205a-1, or even if they do come into contact, they will not deform the support component 1205.

[0090] Furthermore, when alignment of each jetting module 1404 and support member 1205 is performed, the protrusion 502 and wall surface 1002 abut against each other, and these members are thus bonded with adhesive so that the jetting module 1404 is fixed and supported by the support member 1205. As described above, in this embodiment, with the protrusion 502 of the first flow path member 312 and the wall surface 1002 of the support member 1205 abutting against each other in the insertion direction of each jetting module 1404, the jetting module 1404 is supported by the support member 1205. Furthermore, when alignment of the jetting module 1404 and support member 1205 is performed, the printing element substrate support member 406 is supported by the bottom surface 1205b of the support member 1205.

[0091] The jetting module 1404, supported by the support member 1205, is fluidly connected to the fourth flow path member 1318 via the sealing member 1452. Furthermore, the fifth flow path member 1320 is fluidly connected to the fourth flow path member 1318, and the sixth flow path member 1352 is fluidly connected via the sealing member 1454. Additionally, the seventh flow path member 1354, the liquid supply unit 1322, and the like are fluidly connected. The printhead 22 is assembled by attaching the electrical wiring substrate support 1402 and the like.

[0092] As described above, this embodiment is configured such that four jetting modules 1404 are inserted into the support member 1205 for engagement and support. Here, the first flow path member 312 and the second flow path member 314 are arranged facing the support member 1205 in a direction intersecting the insertion direction of the jetting modules 1404, with a space between them. Note that the size of this space is sufficient to accommodate the thermal expansion of the first flow path member 312 and the second flow path member 314. Furthermore, in the insertion direction, the first flow path member 312 is configured to abut against the wall surface 1002 of the support member 1205 for support. Therefore, the printing device 10 according to this embodiment also has the same functional effects as the first embodiment.

[0093] (Other embodiments)

[0094] Note that the above embodiments can be modified as shown in (1) to (5) below.

[0095] (1) Although not specifically described in the above embodiments, the adhesive used to bond the protrusion 502 and the wall surface 1002 to each other is preferably an adhesive that is not a good conductor of heat (i.e., has low thermal conductivity). Therefore, heat transfer from the first flow path member 312 to the support member 205 via the protrusion 502 is suppressed, thereby suppressing deformation of the support member 205 caused by thermal expansion due to heat transferred to the support member 205. Furthermore, the adhesive used to bond the protrusion 502 and the wall surface 1002 may also have a lower thermal conductivity than the first flow path member 312.

[0096] Furthermore, the support member 205 is preferably made of a material with low thermal conductivity and low coefficient of linear expansion. Therefore, even if heat is transferred to the support member 205 via the protrusion 502 and the adhesive, deformation caused by the thermal expansion of the support member 205 is reduced.

[0097] (2) Although not specifically described in the above embodiments, the protrusion 502 may also be made of a material capable of absorbing thermal expansion occurring in the first flow path member 312, such as an elastic material. Alternatively, as an adhesive for bonding the protrusion 502 and the wall surface 1002, an adhesive having properties (e.g., elasticity or extensibility) capable of absorbing displacement of the protrusion 502 caused by thermal expansion of the first flow path member 312 may also be used. Furthermore, in the above embodiments, although the protrusion 502 is formed in predetermined regions at both ends of the first flow path member 312 in the X direction, it is not limited to this. That is, the protrusion 502 may also be formed to contact the second flow path member 314 bonded to the first flow path member 312 in the predetermined regions. In this case, it is preferable that the protrusion 502 is formed of a material having low thermal conductivity and low coefficient of linear expansion.

[0098] (3) In the above embodiments, although the protrusions 502 are provided at both ends of the first flow path member 312 in the X direction and are supported by the wall surfaces 1002 of the support members 205 and 1205 via the protrusions 502, it is not limited to this. That is, the two ends of the first flow path member 312 in the X direction can also be directly supported by the wall surfaces 1002. Alternatively, the abutment portion can be formed flat at both ends of the first flow path member 312 in the X direction without forming a step on the surface of the first flow path member 312 connected to the second flow path member 314. In this case, the abutment portion can be formed of the elastic material described in (2) above, or it can be formed of the material with low thermal conductivity and low linear expansion coefficient described in (3) above.

[0099] (4) In the above embodiments, although the size of the first flow path member 312 is set to be larger than the second flow path member 314 only in the X direction and almost the same in the Y direction because thermal expansion in the X direction (i.e., the longitudinal direction of the printing element substrate 200) is particularly concerning, it is not limited to this. For example, if thermal expansion in the Y direction is equally concerning as thermal expansion in the X direction, the size of the first flow path member 312 is set to be larger than the second flow path member 314 in both the X and Y directions. Furthermore, the protrusion 502 is provided at both ends in the X direction and both ends in the Y direction of the first flow path member 312 connected to the second flow path member 314, and the wall surface 1102 of the opening 205a is formed as a plane having a width in the Y direction. In addition, in order to align the jet module 404 relative to the support member 205, the protrusion 502 and the wall surface 1002 facing each other in the X direction are abutted and bonded to each other, and the protrusion 502 and the wall surface 1102 facing each other in the Y direction are abutted and bonded to each other.

[0100] (5) The above embodiments and the various forms shown in (1) to (4) can be appropriately combined.

[0101] While the invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be given the broadest interpretation to cover all variations and equivalent structures and functions.

Claims

1. A liquid injection head, comprising: The module is equipped with a substrate capable of spraying liquid by driving a jet energy generation element and a flow path section that is fluidly connected to the substrate. Supporting components are configured to support the base plate; and A frame configured to support the inserted and engaged modules, and to support the support members at the insertion surfaces of the modules; If the module is inserted and engaged with the frame, the frame and the flow path face each other in space in a direction intersecting the insertion direction of the module, and abut against each other in the insertion direction to be supported. Its features are, The flow path section is equipped with multiple components connected along the insertion direction, and The contact portion of the flow path that abuts against the frame is formed on the upstream component along the insertion direction.

2. The liquid injection head according to claim 1, in, The portion of the frame that abuts against the flow path is formed as a support member that is substantially parallel to the frame.

3. The liquid injection head according to claim 1 or 2, in, The flow path section is equipped with a first flow path component that is fluidly connected to the substrate and a second flow path component that is fluidly connected to the first flow path component, and Among them, the first flow path component: It is formed in a predetermined direction intersecting the insertion direction to be longer than the second flow path member, and In order to connect to the second flow path component, an abutment portion is provided in the region formed at both ends of the predetermined direction.

4. The liquid injection head according to claim 1 or 2, in, The adhesive used to bond the joint and the frame is a non-thermal conductive adhesive.

5. The liquid injection head according to claim 1 or 2, in, The adhesive used to bond the abutment and the frame has a lower thermal conductivity than the flow path.

6. The liquid injection head according to claim 1 or 2, in, The contact part is made of elastic material.

7. The liquid injection head according to claim 1 or 2, in, The adhesive used to bond the joint and the frame is elastic.

8. The liquid injection head according to claim 1 or 2, in, The contact part is made of a material with low thermal conductivity and low coefficient of linear expansion.

9. The liquid injection head according to claim 1 or 2, in, The abutting part is a protruding part that protrudes along the insertion direction.

10. The liquid injection head according to claim 1, in, The module is equipped with a flexible wiring substrate that transmits power and signals to the substrate.

11. The liquid injection head according to claim 10, in, In the module, the flexible wiring substrate is bent toward the side of the flow path and supported by a frame, the side being parallel to a plane formed by a predetermined direction intersecting the insertion direction and the insertion direction.

12. The liquid injection head according to claim 1, in, The frame is made of a material with low thermal conductivity and low coefficient of linear expansion.

13. A liquid jetting device, comprising: A liquid jet head includes: a module equipped with a substrate capable of jetting liquid by driving a jetting energy generating element and a flow path portion fluidly connected to the substrate; a support member configured to support the substrate; and a frame configured to support the inserted and engaged module, and supporting the support member at the insertion surface of the module; wherein, if the module is inserted and engaged with the frame, the frame and the flow path portion face each other spatially in a direction intersecting the insertion direction of the module, and abut against each other in the insertion direction to be supported; Its features are, The flow path section is equipped with multiple components connected along the insertion direction, and The contact portion of the flow path that abuts against the frame is formed on the upstream component along the insertion direction.

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