A refrigeration system and method

Abstract

The embodiment of the application discloses a refrigeration system, characterized in that the refrigeration system comprises a refrigeration assembly, a cold guide grid assembly and a heat dissipation assembly, a first surface of the refrigeration assembly is connected with the cold guide grid assembly through a heat conducting medium; a second surface of the refrigeration assembly is connected with the heat dissipation assembly through a heat conducting medium; the cold guide grid assembly is arranged at an air inlet of a server and is used for exchanging heat with air at the air inlet of the server to obtain cold air after heat exchange; the cold air is input into the server; the heat dissipation assembly is arranged around the server and is used for conducting heat of the second surface, exchanging heat of the heat with air around the server to obtain hot air after heat exchange; and the hot air is input into an air outlet of the server.

Description

Technical Field

[0001] This invention relates to the field of refrigeration technology, and more particularly to a refrigeration system and refrigeration method. Background Technology

[0002] Among related technologies, the heat pipe technology used for cooling data center environments is not suitable for addressing the micro-environmental hotspots that cause localized overheating within data centers. Currently, there is no effective solution to this problem. Summary of the Invention

[0003] To address the existing technical problems, embodiments of the present invention provide a cooling system and a cooling method.

[0004] To achieve the above objectives, the technical solution of this invention is implemented as follows:

[0005] This invention provides a cooling system, which includes a refrigeration component, a cooling grid component, and a heat dissipation component. A first side of the refrigeration component is connected to the cooling grid component via a heat-conducting medium; a second side of the refrigeration component is connected to the heat dissipation component via a heat-conducting medium.

[0006] The cooling grid assembly is installed at the air inlet of the server to exchange heat with the air at the air inlet of the server to obtain cooled air after heat exchange; the cooled air is then input into the server.

[0007] The heat dissipation component is disposed around the server to conduct heat from the second side, exchange the heat with the air around the server to obtain hot air after heat exchange, and input the hot air to the air outlet of the server.

[0008] In the above scheme, the system further includes a first power component and a second power component; the first power component is disposed in front of the cooling grid assembly; the second power component is disposed behind the heat dissipation assembly;

[0009] The first power component is used to control the input of the cold air to the server;

[0010] The second power component is used to control the input of the hot air to the air outlet of the server.

[0011] In the above scheme, the refrigeration system further includes a controller; a first temperature sensor, a second temperature sensor, a third temperature sensor, and a humidity sensor are arranged around the cooling grid assembly; the controller is connected to the first temperature sensor, the second temperature sensor, the third temperature sensor, and the humidity sensor respectively;

[0012] The first temperature sensor is used to detect the first temperature of the air at the air inlet of the server;

[0013] The second temperature sensor is used to detect the second temperature of the air after passing through the cooling grid assembly;

[0014] The third temperature sensor is used to detect the third temperature corresponding to the surface of the cooling grid assembly;

[0015] The humidity sensor is used to detect the humidity of the air surrounding the third temperature sensor to obtain the fourth temperature.

[0016] The controller is configured to control the power of the cooling component and the wind speed of the second power component based on the first temperature, and / or, the second temperature, and / or, the third temperature, and / or, the third temperature and the fourth temperature.

[0017] In the above solution, a heat insulation component is provided around the heat dissipation component;

[0018] The heat insulation component is used to separate the heat dissipation component from the server, preventing heat from entering the server.

[0019] In the above scheme, the heat dissipation component includes a copper plate, a U-shaped component, and a finned component; one side of the copper plate is connected to the second side of the cooling component through a heat-conducting medium, and the other side is connected to one end of the U-shaped component; the finned component is connected to the other end of the U-shaped component.

[0020] The copper plate is used to absorb heat from the second side of the cooling component and transfer the heat to the U-shaped component;

[0021] The U-shaped component is used to convert the heat into gas and transfer the gas to the fin assembly;

[0022] The fin assembly is used to exchange heat between the gas and the air around the server to obtain hot air after heat exchange; the hot air is then input into the air outlet of the server.

[0023] In the above scheme, the U-shaped component includes a first component in a first region, a second component in a second region, coolant, and corresponding structures for the U-shaped component and the fin assembly; the first component in the first region is connected to the copper plate; the second component in the first region is connected to the fin assembly.

[0024] A first component in the first region is used to receive the heat transferred by the copper plate and convert the heat into gas through the coolant;

[0025] The second component in the first region is used to exchange heat between the rising gas and the fin assembly through the coolant, and to convert the heat-exchanged gas into a liquid, and to return the liquid to the first component in the first region through the structure.

[0026] In the above scheme, the fin direction of the fin assembly is parallel to the air supply or exhaust direction of the second power assembly.

[0027] In the above scheme, the refrigeration component, the cooling grid component, the heat dissipation component, the first power component, and the second power component are assembled.

[0028] This invention also provides a refrigeration method, applied to the refrigeration system provided in this invention, the method comprising:

[0029] The first temperature parameter of the air entering the refrigeration system is detected by the first temperature sensor.

[0030] A second temperature parameter of the air surrounding the cooling grid assembly in the refrigeration system is detected by a second temperature sensor.

[0031] A third temperature parameter of the surface of the cooling grid assembly is obtained by a third temperature sensor;

[0032] The humidity parameter of the air surrounding the location of the third temperature sensor is obtained by the humidity sensor; the fourth temperature parameter is determined based on the humidity parameter.

[0033] The power of the refrigeration component and the wind speed corresponding to the second power component in the refrigeration system are controlled according to the first temperature parameter, and / or the second temperature parameter, and / or the third temperature parameter, and / or the fourth temperature parameter.

[0034] In the above scheme, controlling the power of the refrigeration component and the wind speed corresponding to the second power component in the refrigeration system according to the first temperature parameter, and / or the second temperature parameter, and / or the third temperature parameter, and / or the fourth temperature parameter includes:

[0035] When the first temperature parameter is greater than the first preset threshold, the power of the cooling component is adjusted to reach the power threshold, and the wind speed of the second power component is adjusted to reach the wind speed threshold.

[0036] When the difference between the second temperature parameter and the first temperature parameter meets the first preset range, and the second temperature parameter is less than or equal to the first preset threshold, the power of the cooling component and the wind speed of the second power component are adjusted; the second temperature parameter is less than the first temperature parameter.

[0037] If the difference between the third temperature parameter and the fourth temperature parameter meets the second preset threshold, the power of the cooling component and the wind speed of the second power component are adjusted; the third temperature parameter is greater than the fourth temperature parameter.

[0038] When the value of the third temperature parameter is a third preset threshold, the power of the cooling component and the wind speed of the second power component are adjusted.

[0039] This invention also provides a storage medium storing a computer program; when the computer program is executed by a processor, it implements the steps of any of the methods described above.

[0040] The refrigeration system and method provided in this invention include a refrigeration component, a cold-conducting grille component, and a heat dissipation component. A first side of the refrigeration component is connected to the cold-conducting grille component via a heat-conducting medium; a second side of the refrigeration component is connected to the heat dissipation component via a heat-conducting medium. The cold-conducting grille component is disposed at the air inlet of the server to exchange heat with the air at the server's air inlet, obtaining cooled air after heat exchange; the cooled air is then input into the server. The heat dissipation component is disposed around the server to conduct heat from the second side, exchanging the heat with the air around the server to obtain hot air after heat exchange; the hot air is then input into the air outlet of the server. By using the technical solution of this invention, the cold-conducting grille component is disposed at the air inlet of the server to reduce the temperature of the incoming air at a specific point, thereby eliminating hot spots; the heat dissipation component is disposed around the server to utilize the cooling capacity of the air between the servers to dissipate heat from the heat dissipation component, improving the efficiency of cooling capacity utilization. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the composition structure of a refrigeration system provided in an embodiment of the present invention;

[0042] Figure 2 This is a schematic diagram of the composition structure of another cooling system provided in an embodiment of the present invention;

[0043] Figure 3 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present invention;

[0044] Figure 4 A schematic diagram of the back of a heat pipe cooling module provided in an embodiment of the present invention;

[0045] Figure 5 This is a front view of a heat pipe cooling module provided in an embodiment of the present invention;

[0046] Figure 6This is a schematic diagram illustrating the adaptation of a cooling system and a server according to an embodiment of the present invention. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the specific technical solutions of the invention will be further described in detail below with reference to the accompanying drawings of the embodiments of the present invention. The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0048] This invention provides a cooling system. Figure 1 This is a schematic diagram of the composition structure of a refrigeration system provided in an embodiment of the present invention, as shown below. Figure 1 As shown; Figure 2 This is a schematic diagram of the composition structure of another cooling system provided in an embodiment of the present invention, as shown below. Figure 2 As shown below, in conjunction with Figure 1 and Figure 2 The cooling system 10 includes a cooling component 101, a heat-conducting grille assembly 102, and a heat dissipation assembly 103. A first surface of the cooling component 101 is connected to the heat-conducting grille assembly 102 via a heat-conducting medium; a second surface of the cooling component 101 is connected to the heat dissipation assembly 103 via a heat-conducting medium. The heat-conducting grille assembly 102 is positioned at the server's air inlet to exchange heat with the air at the server's air inlet, resulting in cooled air; this cooled air is then introduced into the server. The heat dissipation assembly 103 is positioned around the server to conduct heat from the second surface, exchanging this heat with the air surrounding the server to obtain heated air; this heated air is then introduced into the server's air outlet.

[0049] It should be noted that the cooling system in this embodiment of the invention is applied to a server to eliminate data center hotspots.

[0050] In this embodiment, the cooling component 101 can be any component capable of cooling, and is not limited herein. As an example, the cooling component 101 can be a semiconductor refrigeration chip. One side of the refrigeration chip cools (the cooling surface), and the other side heats (the heating surface). The semiconductor refrigeration chip contains an array of multiple PN junctions, the size of which is selected according to requirements.

[0051] The cooling grid assembly 102 can be a cooling grid plate, the size of which is similar to the size of the server's air intake surface, and its shape is hexahedral. As an example, the length of the hexahedron of the cooling grid plate is 420-450 mm, and the height is selected according to the height of the server generating the hotspot; the height can be 1U or 2U, suitable for 1U-4U servers. The width of the cooling grid plate is 1-2 cm, and it is placed on the server's air intake surface, i.e., at the front door of the rack. The space between the rack front door and the server's air intake is 3-7 cm, and the distance between the cooling grid plate and the server's air intake surface is 5-10 mm. The material used for the cooling grid plate can be aluminum 6061. It should be noted that the cooling grid assembly 102 can be understood as a finned device.

[0052] It should be noted that the cooling surface of the semiconductor refrigeration chip is bonded to one side of the six-sided heat-conducting grid plate along its width direction via a heat-conducting medium. The grid distribution direction of the heat-conducting grid plate is along the height direction of the heat-conducting plate, the grid thickness is 1-2 mm, and the grid spacing is 1-2 mm. The semiconductor refrigeration chip is a hexahedron, the length of which is 1 / 4 of the length of the heat-conducting grid plate, and the width of which is the same as that of the heat-conducting grid plate, which is 1-2 cm. The thickness of the semiconductor refrigeration chip is 2-4 mm, and this thickness is selected according to the PN junction of different sizes based on the cooling requirements. The semiconductor refrigeration chip and the heat-conducting grid plate together form a semiconductor refrigeration unit.

[0053] The first surface of the cooling component 101 is connected to the cooling grid assembly 102 via a heat-conducting medium; the second surface of the cooling component 101 is connected to the heat dissipation assembly 103 via a heat-conducting medium. This can be understood as follows: the cooling surface of the cooling component 101 is bonded to the cooling grid assembly 102 via a heat-conducting medium, and the heating surface of the cooling component 101 is bonded to the heat dissipation assembly 103 via a heat-conducting medium. For example, the cooling surface of the semiconductor cooling chip is bonded to the cooling grid plate via a heat-conducting medium, and the heating surface of the semiconductor cooling chip is bonded to the heat dissipation assembly 103 via a heat-conducting medium.

[0054] The cooling grid assembly 102 is disposed at the air inlet of the server and is used to exchange heat with the air at the air inlet of the server to obtain cold air after heat exchange; the cold air is then input into the server; it can be understood that the cooling surface of the semiconductor cooling chip transfers the cooling energy to the cooling grid plate, the temperature of the cooling grid plate decreases, and the cooled cooling grid plate exchanges heat with the air entering the server, the air is cooled by the cooling grid plate, and the colder air enters the server, which can be used to eliminate hot spots.

[0055] It should be noted that the heat dissipation component 103 is disposed around the server; as an example, the heat dissipation component 103 is preferably disposed above the server. The heat dissipation component 103 can be a heat pipe radiator.

[0056] The heat dissipation component 103 is disposed around the server to conduct heat from the second surface and exchange the heat with the air around the server to obtain hot air after heat exchange. The hot air is then input to the air outlet of the server, whereby the heating surface of the semiconductor cooling chip transfers the heat generated during the cooling process to the heat pipe radiator. The cooling capacity of the cold air above the server carries away the heat absorbed by the heat pipe radiator, and the air temperature rises after the heat is carried away (i.e., hot air). The hot air is then pumped to the air outlet of the server.

[0057] The technical solution of this invention involves placing the cooling grid assembly at the air inlet of the server to reduce the temperature of the incoming air at a specific point, thereby eliminating hot spots; placing the heat dissipation assembly around the server to utilize the cooling capacity of the air between the servers to dissipate heat from the heat dissipation assembly, thereby improving the efficiency of cooling capacity utilization; and using semiconductor cooling chip technology to cool the server by reducing the incoming air temperature of the hot spot server, which is suitable for various hot spot situations and offers high flexibility.

[0058] In an optional embodiment of the present invention, the system 10 further includes a first power component and a second power component 104; the first power component is disposed in front of the cooling grid assembly 102; the second power component 104 is disposed behind the heat dissipation assembly 103; the first power component is used to control the input of cold air to the server; the second power component 104 is used to control the input of hot air to the air outlet of the server.

[0059] In this embodiment, the first power component and the second power component 104 can be any power-providing component, and no limitation is made here. As an example, the first power component and the second power component 104 can be fans. It should be noted that the first power component is not shown in the figure.

[0060] The first power component is used to control the input of cold air to the server; the second power component 104 is used to control the input of hot air to the air outlet of the server. It can be understood that a fan is provided in front of the cooling grid plate to input cold air to the server, and a fan is provided behind the heat pipe radiator to draw the hot air obtained after the heat pipe radiator exchanges heat with the air above the server to the server air outlet.

[0061] By employing the technical solution of this invention, hot air can be directly drawn to the server's air outlet, preventing heat from entering the server and creating new hotspots.

[0062] In an optional embodiment of the present invention, the cooling system 10 further includes a controller; a first temperature sensor, a second temperature sensor, a third temperature sensor, and a humidity sensor are disposed around the cooling grid assembly 102; the controller is connected to the first temperature sensor, the second temperature sensor, the third temperature sensor, and the humidity sensor respectively; the first temperature sensor is used to detect a first temperature corresponding to the air at the server air inlet; the second temperature sensor is used to detect a second temperature corresponding to the air after passing through the cooling grid assembly 102; the third temperature sensor is used to detect a third temperature corresponding to the surface of the cooling grid assembly 102; the humidity sensor is used to detect the humidity corresponding to the air around the third temperature sensor; and a fourth temperature is obtained; the controller is used to control the power of the cooling assembly 101 and the wind speed of the second power assembly 104 based on the first temperature, and / or, the second temperature, and / or, the third temperature, and / or, the third temperature and the fourth temperature.

[0063] In this embodiment, a first temperature sensor, a second temperature sensor, a third temperature sensor, and a humidity sensor are arranged around the cooling grid assembly 102. This can be understood as the first temperature sensor, the second temperature sensor, the third temperature sensor, and the humidity sensor being arranged on the surface of the cooling grid plate.

[0064] It should be noted that the positions of the first temperature sensor, the second temperature sensor, the third temperature sensor, the humidity sensor, and the controller are not shown in the figure.

[0065] The controller is connected to the first temperature sensor, the second temperature sensor, the third temperature sensor, and the humidity sensor respectively. The connection method is not limited here. As an example, the controller is wirelessly connected to the first temperature sensor, the second temperature sensor, the third temperature sensor, and the humidity sensor respectively.

[0066] The first temperature sensor is used to detect the first temperature of the air at the air inlet of the server. This can be understood as the first temperature sensor detecting the air temperature at the server inlet, or as the temperature before heat exchange through the cooling grid plate.

[0067] The second temperature sensor is used to detect the second temperature of the air after passing through the cooling grid assembly 102. This can be understood as the second temperature sensor detecting the air temperature after passing through the cooling grid plate.

[0068] The third temperature sensor is used to detect a third temperature corresponding to the surface of the cooling grid assembly 102. This can be understood as the third temperature sensor detecting the surface temperature of the cooling grid plate. It should be noted that the third temperature sensor is positioned on the surface of the cooling grid plate at a distance of 2 mm from the thermoelectric cooler adhered thereto.

[0069] The humidity sensor is used to detect the humidity of the air around the third temperature sensor; obtaining the fourth temperature can be understood as the humidity sensor detecting the air humidity near the location of the third temperature sensor, calculating the wet-bulb temperature based on the air humidity, and the wet-bulb humidity is the fourth temperature.

[0070] The controller is configured to control the power of the cooling component 101 and the airflow of the second power component 104 based on the first temperature, and / or, the second temperature, and / or, the third temperature, and / or, the third temperature and the fourth temperature. It can be understood that the controller is configured to control the power of the cooling component 101 and the airflow of the second power component 104 based on the first temperature; or, the controller is configured to control the power of the cooling component 101 and the airflow of the second power component 104 based on the first temperature and the second temperature; or, the controller is configured to control the power of the cooling component 101 and the airflow of the second power component 104 based on the first temperature and the third temperature; or, the controller is configured to control the power of the cooling component 101 and the airflow of the second power component 104 based on the first temperature, the third temperature and the fourth temperature.

[0071] It should be noted that the cooling system 10 also includes a current regulator, which is connected to the cooling component 101, although its specific location is not shown in the figure. The current regulator controls the current of the semiconductor cooling chip, thereby controlling the cooling power, and the speed of the small fan, thereby controlling the airflow.

[0072] In an optional embodiment of the present invention, a heat insulation component 105 is provided around the heat dissipation component 103; the heat insulation component 105 is used to separate the heat dissipation component 103 from the server and prevent the heat from entering the server.

[0073] In this embodiment, the heat insulation component 105 can be any component that achieves heat insulation, and there is no limitation. As an example, the heat insulation component 105 can be a plastic partition.

[0074] A heat insulation component 105 is provided around the heat dissipation component 103. The heat insulation component 105 is used to separate the heat dissipation component 103 from the server. For example, the bottom of the heat pipe heat sink should have a plastic partition structure to isolate the heat pipe heat sink from the server and prevent the heat of the heat pipe heat sink from being transferred to the server cover plate, causing additional heat to enter the server. The top and both ends of the heat pipe heat sink are also provided with plastic partition structures to isolate the heat pipe heat sink from the server and prevent the heat of the heat pipe heat sink from being transferred to the server cover plate, causing additional heat to enter the server.

[0075] It should be noted that the second power component 104 is embedded in the heat insulation component 105. For example, the fan can be embedded in the plastic partition, or the fan can be inserted into a plastic plate made of polyphenylene sulfide (PPS) material through a snap-fit ​​device.

[0076] The technical solution adopted in this embodiment of the invention can prevent additional heat from entering the server.

[0077] In an optional embodiment of the present invention, the heat dissipation assembly 103 includes a copper plate 1031, a U-shaped assembly 1032, and a fin assembly 1033; one side of the copper plate 1031 is connected to the second side of the cooling assembly 101 via a heat-conducting medium, and the other side is connected to one end of the U-shaped assembly 1032; the fin assembly 1033 is connected to the other end of the U-shaped assembly 1032; the copper plate 1031 is used to absorb heat from the second side of the cooling assembly 101 and transfer the heat to the U-shaped assembly 1032; the U-shaped assembly 1032 is used to convert the heat into gas and transfer the gas to the fin assembly 1033; the fin assembly 1033 is used to exchange heat between the gas and the air around the server to obtain hot air after heat exchange; and the hot air is input to the air outlet of the server.

[0078] Figure 3 This is a schematic diagram of a heat dissipation component provided in an embodiment of the present invention, such as... Figure 3 As shown, the heat dissipation assembly 103 includes a copper plate 1031, a U-shaped assembly 1032, and a fin assembly 1033. In this embodiment, the U-shaped assembly 1032 can be a U-shaped heat pipe; the fin assembly 1033 can be straight fins.

[0079] One side of the copper plate 1031 is connected to the second side of the cooling component 101 through a heat-conducting medium, and the other side is connected to one end of the U-shaped component 1032; the fin assembly 1033 is connected to the other end of the U-shaped component 1032. It can be understood that one side of the copper plate 1031 is bonded to the heating surface of the cooling component 101 through a heat-conducting medium, the other side of the copper plate 1031 is welded to one end of the U-shaped component 1032, and the other end of the U-shaped component 1032 is connected to the fin assembly 1033.

[0080] The copper plate 1031 is used to absorb heat from the second side of the cooling component 101 and transfer the heat to the U-shaped component 1032. For example, the copper plate 1031 absorbs heat from the cooling surface of the semiconductor cooling chip and transfers the heat to the U-shaped heat pipe.

[0081] The U-shaped component 1032 is used to convert the heat into gas and transfer the gas to the fin assembly 1033. For example, the U-shaped heat pipe vaporizes the heat into high-temperature gas, and the high-temperature gas exchanges heat with the straight fins.

[0082] The fin assembly 1033 is used to exchange heat between the gas and the air around the server to obtain hot air after heat exchange; the hot air is input to the air outlet of the server, which can be understood as the straight fins exchanging heat with the air above the server to obtain hot air and reduce the temperature of the straight fins, and the hot air is drawn to the air outlet of the server by the fan.

[0083] The technical solution of this invention uses a heat pipe radiator to remove heat from the semiconductor cooling chip, making flexible use of the cooling space above the server and improving the efficiency of data center cooling utilization.

[0084] In an optional embodiment of the present invention, the U-shaped component 1032 includes a first component in a first region, a second component in a second region, a coolant, and structures corresponding to the U-shaped component 1032 and the fin assembly 1033; the first component in the first region is connected to the copper plate 1031; the second component in the first region is connected to the fin assembly 1033; the first component in the first region is used to receive the heat transferred by the copper plate 1031 and convert the heat into gas through the coolant; the second component in the first region is used to exchange the rising gas with the fin assembly 1033 through the coolant, convert the heat-exchanged gas into liquid, and return the liquid to the first component in the first region through the structure.

[0085] In this embodiment, the first component in the first region can be understood as the evaporation section of the U-shaped component 1032, i.e., the evaporation section of the U-shaped heat pipe; the second component in the second region can be understood as the condensation section of the U-shaped component 1032, i.e., the condensation section of the U-shaped heat pipe; the coolant is used to absorb heat and can be understood as a heat exchange medium. Different types of heat exchange medium can be selected according to different usage scenarios, and there is no limitation here. As an example, the heat exchange medium can be acetone, ethanol, or water; the structure corresponding to the U-shaped component 1032 and the finned component 1033 can be understood as a sintered liquid wick, which is a capillary structure formed by sintering aluminum powder and copper tube wall, and the thickness can be 0.7-2mm.

[0086] It should be noted that the U-shaped heat pipe is a copper round tube, including an evaporation section, a condensation section, an insulation section, a heat exchange medium, and a sintered wick; the outer diameter of the U-shaped heat pipe is 6-10mm, the inner diameter is 5-9mm, and the total length is 100-120mm. The size and quantity are customized according to the available space above the server.

[0087] The first component in the first region is connected to the copper plate 1031; the second component in the first region is connected to the fin assembly 1033. It can be understood that the copper plate 1031 is welded to the evaporation section of the U-shaped heat pipe; the flat fin substrate has holes with the same diameter and number as the outer diameter of the U-shaped heat pipe, and the condensation section of the U-shaped heat pipe is embedded in the holes of the flat fin substrate.

[0088] The first component in the first region is used to receive the heat transferred by the copper plate 1031 and convert the heat into gas through the coolant. For example, the copper plate 1031 absorbs the heat from the heating surface of the semiconductor cooling chip and transfers the heat to the evaporation section of the U-shaped heat pipe. The heat exchange medium in the evaporation section of the U-shaped heat pipe absorbs the heat and vaporizes into high-temperature gas. The gas rises and enters the condensation section of the U-shaped heat pipe.

[0089] The second component in the first region is used to exchange heat between the rising gas and the fin assembly 1033 via the coolant, and to convert the heat-exchanged gas into a liquid. The liquid is then returned to the first component in the first region via the structure. For example, the high-temperature gas in the condensation section of the U-shaped heat pipe exchanges heat with the flat finned substrate through the copper pipe wall. The flat finned substrate transfers heat to the finned surface of the flat fins. The heat from the finned surface exchanges heat with the air above the server. The heat exchange medium in the condensation section liquefies into a low-temperature liquid after heat exchange and is returned to the evaporation section of the U-shaped heat pipe through capillary action of the sintered liquid core. It should be noted that the heat exchange medium enters the heat exchange cycle inside the U-shaped heat pipe.

[0090] For ease of understanding, an example is provided here. After the heat pipe radiator is placed in the space above the server, the heating surface of the semiconductor cooling chip transfers heat to the copper plate 1031; the copper plate 1031 transfers heat to the heat exchange medium inside the evaporation section of the U-shaped heat pipe; the heat exchange medium inside the evaporation section of the U-shaped heat pipe boils into a high-temperature gas and enters the condensation section of the U-shaped heat pipe; the heat exchange medium in the condensation section of the U-shaped heat pipe transfers heat to the flat fins; the heat exchange medium in the condensation section of the U-shaped heat pipe condenses into a low-temperature liquid and returns to the evaporation section of the U-shaped heat pipe through the sintered capillary structure inside the U-shaped heat pipe. Therefore, the heat from the heating surface of the semiconductor cooling chip is carried to the flat fins; the small fan and the semiconductor cooling chip are turned on simultaneously, forming an airflow from the front to the back of the server. This airflow has the same temperature as the ambient temperature and is relatively low, carrying away the heat from the flat fins; the air temperature rises after the heat is carried away and is drawn by the small fan to the back of the server, entering the data center hot aisle environment and returning to the data center precision air conditioning.

[0091] In an optional embodiment of the present invention, the fin direction of the fin assembly 1033 is parallel to the air supply or exhaust direction of the second power assembly 104.

[0092] In this embodiment, the fin direction of the fin assembly 1033 is parallel to the air supply or exhaust direction of the second power assembly 104. For example, the fin direction of the straight fins is parallel to the air supply or exhaust direction of the fan placed behind the heat pipe radiator.

[0093] In an optional embodiment of the present invention, the cooling component 101, the cooling grid component 102, the heat dissipation component 103, the first power component and the second power component 104 are assembled together.

[0094] In this embodiment, the cooling component 101, the cooling grid component 102, the heat dissipation component 103, the first power component, and the second power component 104 are modular assembly structures. This can be understood as the semiconductor cooling chip, the cooling grid plate, the heat pipe radiator, and the two fans being assembled structures, with their capacity customized based on the server height, the hotspot server inlet air temperature, and the hotspot server inlet air speed.

[0095] Because the timing of data center hotspots and the amount of heat generated are highly random, the technical solution of this invention allows for module assembly according to different situations.

[0096] Figure 4 This is a rear view of a heat pipe cooling module provided in an embodiment of the present invention. Figure 5This is a front view of a heat pipe cooling module provided in an embodiment of the present invention. The following will be combined with... Figure 4 and Figure 5 For clarity, the cooling system 10 also includes wires 106, a power interface 107, a boost converter 108, and a power module; it should be noted that the power module is not shown in the figure. Both the cooling component 101 and the second power component 104 have their own power supply wires 106, and these wires 106 are connected to the boost converter 108. The boost converter 108 can be a USB interface and is connected to the DC power module via a power cord. The power module is a 12V DC power supply.

[0097] Figure 6 This is a schematic diagram illustrating the adaptation of a cooling system and a server according to an embodiment of the present invention, as shown below. Figure 6 As shown, the cooling system can be assembled into modules according to the server.

[0098] It should be noted that four semiconductor cooling chips are adhered to the top of the cooling grid plate, and each semiconductor cooling chip is attached to a heat pipe radiator. Behind the four heat pipe radiators is a PPS plastic plate with eight small fans embedded in it. The cooling grid plate 1 should be surrounded by the plastic partition 7; the plastic partition 7 has a snap-fit ​​device on both sides, which can be snapped into the mounting holes on both sides of the rack without interfering with the server mounting holes.

[0099] The technical solution of this invention can solve the hotspot problem of data center servers point-to-point, minimizing the on-site construction and renovation costs of old data centers; it only needs to be placed in front of the hotspot server in the data center and is not used on a large scale. At the same time, with the intelligent control system, the device can be turned off when it is not needed, saving its own energy consumption.

[0100] This invention also provides a refrigeration method applied to the refrigeration system provided in this invention. The method includes: detecting a first temperature parameter of the air entering the refrigeration system 10 at the air inlet using a first temperature sensor; detecting a second temperature parameter of the air surrounding the cooling grid assembly 102 in the refrigeration system 10 using a second temperature sensor; obtaining a third temperature parameter of the surface of the cooling grid assembly 102 using a third temperature sensor; obtaining a humidity parameter of the air surrounding the location of the third temperature sensor using a humidity sensor; determining a fourth temperature parameter based on the humidity parameter; and controlling the power of the refrigeration component 101 and the wind speed corresponding to the second power component 104 in the refrigeration system 10 according to the first temperature parameter, and / or the second temperature parameter, and / or the third temperature parameter, and / or the fourth temperature parameter.

[0101] In this embodiment, the first temperature parameter of the air entering the cooling system 10 through the first temperature sensor can be understood as obtaining the temperature at the server air inlet through the first temperature sensor. The first temperature parameter can be the temperature value at the server air inlet or the temperature value before passing through the cooling grid assembly 102.

[0102] The second temperature parameter of the air around the cooling grid assembly 102 in the refrigeration system 10 is detected by the second temperature sensor. This can be understood as obtaining the air temperature parameter after passing through the cooling grid assembly 102 by the second temperature sensor. The second temperature parameter can be the air temperature value after passing through the cooling grid assembly 102.

[0103] The phrase "obtaining the third temperature parameter of the surface of the cooling grid assembly 102 through the third temperature sensor" can be understood as obtaining the temperature parameter of the surface of the cooling grid assembly 102 through the third temperature sensor. The third temperature parameter can be the temperature value of the surface of the cooling grid assembly 102.

[0104] The humidity parameter of the air surrounding the location of the third temperature sensor is obtained by the humidity sensor; the fourth temperature parameter is determined based on the humidity parameter. This can be understood as obtaining the humidity parameter around the third temperature sensor by the humidity sensor, calculating the wet-bulb temperature based on the humidity parameter, and the fourth temperature parameter can be the wet-bulb temperature value.

[0105] In an optional embodiment of the present invention, controlling the power of the cooling component 101 and the wind speed corresponding to the second power component 104 in the cooling system 10 according to the first temperature parameter, and / or the second temperature parameter, and / or the third temperature parameter, and / or the fourth temperature parameter includes: adjusting the power of the cooling component 101 to a power threshold and adjusting the wind speed of the second power component 104 to a wind speed threshold when the first temperature parameter is greater than a first preset threshold; adjusting the power of the cooling component 101 and the wind speed of the second power component 104 when the difference between the second temperature parameter and the first temperature parameter meets a first preset range and the second temperature parameter is less than or equal to the first preset threshold; the second temperature parameter is less than the first temperature parameter; adjusting the power of the cooling component 101 and the wind speed of the second power component 104 when the difference between the third temperature parameter and the fourth temperature parameter meets a second preset threshold; the third temperature parameter is greater than the fourth temperature parameter; adjusting the power of the cooling component 101 and the wind speed of the second power component 104 when the value of the third temperature parameter is a third preset threshold.

[0106] In this embodiment, it should be noted that the first preset threshold can be determined according to actual conditions and is not limited here. As an example, the first preset threshold can be 27 degrees Celsius (°C). The power threshold can be understood as the maximum power; the wind speed threshold can be understood as the maximum wind speed. When the first temperature parameter is greater than the first preset threshold, adjusting the power of the cooling component 101 to reach the power threshold and adjusting the wind speed of the second power component 104 to reach the wind speed threshold can be understood as controlling the power of the cooling component 101 to reach the maximum and controlling the wind speed of the second power component 104 to reach the maximum when the first temperature parameter is greater than the first preset threshold. For example, when the first temperature value identified by the first temperature sensor is greater than 27°C, the current regulator is automatically adjusted to control the semiconductor cooling chip to reach the maximum cooling power and the fan to reach the maximum speed.

[0107] The first preset range can be determined according to the actual situation and is not limited here. As an example, the first preset range can be 3-4℃. Adjusting the power of the cooling component 101 and the fan speed of the second power component 104 can be understood as adjusting the trend to reduce the power of the cooling component 101 and the fan speed of the second power component 104. When the difference between the second temperature parameter and the first temperature parameter meets the first preset range, and the second temperature parameter is less than or equal to the first preset threshold, the power of the cooling component 101 and the fan speed of the second power component 104 are adjusted. For example, when the second temperature value is 3-4℃ lower than the first temperature value and lower than 27℃, the automatic current regulator controls the cooling power of the semiconductor cooling chip to decrease, and simultaneously controls the fan speed to decrease.

[0108] The second preset threshold can be determined according to the actual situation and is not limited here. As an example, the second preset threshold can be 2℃. Adjusting the power of the cooling component 101 and the fan speed of the second power component 104 can be understood as adjusting the trend to reduce the power of the cooling component 101 and the fan speed of the second power component 104. When the difference between the third temperature parameter and the fourth temperature parameter meets the second preset threshold, adjusting the power of the cooling component 101 and the fan speed of the second power component 104, where the third temperature parameter is greater than the fourth temperature parameter, can be illustrated as follows: when the third temperature value is 2℃ higher than the fourth temperature value, the automatic current regulator controls the cooling power of the semiconductor refrigeration chip to decrease, and simultaneously controls the fan speed to decrease.

[0109] The third preset threshold can be determined according to actual conditions and is not limited here. As an example, the third preset threshold can be 15℃. Adjusting the power of the cooling component 101 and the fan speed of the second power component 104 can be understood as adjusting the trend to increase the power of the cooling component 101 and the fan speed of the second power component 104. When the value of the third temperature parameter is the third preset threshold, adjusting the power of the cooling component 101 and the fan speed of the second power component 104 can be illustrated as follows: when the third temperature value (the surface temperature of the cooling grid plate) is 15℃, the automatic current regulator controls the cooling power of the thermoelectric cooler to increase, and simultaneously controls the fan speed to increase. It should be noted that after controlling the cooling power of the thermoelectric cooler and the fan speed to increase, the surface temperature of the cooling grid plate fluctuates around 16℃ to prevent condensation on the surface of the cooling grid plate from causing safety issues for the server.

[0110] To make it easier to understand, here is an example of the specific operation process of a refrigeration system:

[0111] (1) Place the cooling system 5-10mm away from the server;

[0112] (2) Turn on the power module and start the semiconductor cooling chip and fan;

[0113] (3) The cooling surface of the semiconductor cooling chip transfers the cooling energy to the cooling grid plate, and the heating surface of the semiconductor cooling chip transfers the heat to the heat pipe radiator.

[0114] (4) The temperature of the cooling grid plate decreases, and it exchanges heat with the intake air caused by the suction of the internal fan of the server. The temperature of the intake air decreases, and the surface temperature of the cooling grid plate and the temperature of the intake air maintain a heat exchange balance.

[0115] (5) In the heat pipe radiator, the copper plate absorbs the heat transferred by the heating surface of the semiconductor cooling chip and transfers the heat to the evaporation section of the U-shaped heat pipe. The heat exchange medium in the evaporation section of the U-shaped heat pipe absorbs the heat and vaporizes into high-temperature gas. The gas rises and enters the condensation section of the U-shaped heat pipe.

[0116] (6) The high-temperature gas heat exchange medium in the condensation section of the U-shaped heat pipe exchanges heat with the flat fin substrate through the copper pipe wall, and the flat fin substrate transfers heat to the finned surface of the flat fin.

[0117] (7) Due to the negative pressure at the server exhaust, the front door of the cabinet above the server generates a certain airflow that is the same as the airflow entering the server. The straight fins transfer heat to the finned surface and exchange heat with this part of the airflow to achieve heat exchange balance.

[0118] (8) After the high-temperature gas heat exchange medium in the condensing section of the U-shaped heat pipe dissipates heat, it liquefies into a low-temperature liquid and is sent back to the evaporating section of the U-shaped heat pipe through the capillary action of the sintered liquid core. The heat exchange medium enters the heat exchange cycle inside the U-shaped heat pipe.

[0119] For ease of understanding, the operation of a cooling method is illustrated here. A first temperature sensor identifies the air intake temperature in front of the hotspot server; a second temperature sensor identifies the air temperature after passing through the cooling grid; a third temperature sensor identifies the surface temperature of the cooling grid; a humidity sensor identifies the air humidity near the location of the third temperature sensor and calculates the wet-bulb temperature; a current regulator controls the current to the semiconductor cooling chip, thereby controlling the cooling power, and the speed of a small fan, thereby controlling the airflow. The specific steps are as follows:

[0120] (1) After the DC power module is turned on to start the equipment, the first temperature sensor identifies the air intake temperature;

[0121] (2) When the air inlet temperature detected by the first temperature sensor is higher than 27°C, the automatic current regulator controls the semiconductor cooling chip to reach the maximum cooling power and the small fan to reach the maximum speed.

[0122] (3) The second temperature sensor identifies the air temperature after passing through the grid plate. When the temperature is 3-4°C lower than the temperature identified by the first temperature sensor and is lower than 27°C, the current regulator automatically adjusts the semiconductor cooling chip to reduce the cooling power and the speed of the small fan to reduce.

[0123] (4) A third temperature sensor is placed on the surface of the cooling grid plate at a distance of 2 mm from the semiconductor cooling chip attached thereto, to monitor the surface temperature of the cooling grid plate.

[0124] (5) When the surface temperature of the cooling grid plate detected by the third temperature sensor is 2°C higher than the wet-bulb temperature calculated by the humidity sensor, the cooling power of the semiconductor cooling chip is automatically reduced, and the speed of the small fan is reduced at the same time.

[0125] (6) When the third temperature sensor detects that the surface temperature of the cooling grid is 15°C, the cooling power of the semiconductor refrigeration chip is automatically increased, and the speed of the small fan is increased at the same time, so that the surface temperature of the cooling grid fluctuates around 16°C, preventing condensation on the surface of the cooling grid from posing a security threat to the server.

[0126] For ease of understanding, an example of the effect achieved by using the above-mentioned cooling system to eliminate hotspots is given here. A high-density server in a data center generates 500W of heat and requires 10℃ of cooling capacity. Based on formula (1), the server's required cooling capacity is calculated to be 130m³.3 / h; Formula (1) is as follows:

[0127] Q = cmΔt (1)

[0128] In formula (1), Q is the heat output of the server, in W; c is the specific heat capacity, in kJ / (kg·K); and m is the required air volume of the server, in m³ / s. 3 / h; △t is the inlet and outlet air temperature, in °C.

[0129] Currently, the intake air temperature range of older data centers is 20-24℃, and the exhaust air temperature range is 35-45℃. The specified wet-bulb temperature range for data centers is 5-15℃. During the HVAC design process for data centers, the heat output of the server rack is calculated based on 80% of the rack's capacitance as the most unfavorable scenario. According to this calculation, under full load, the airflow for a 2U server is 80m³ / h. 3 / h, therefore, the actual cooling capacity a server receives under the worst-case scenario is 342W. Therefore, we take 130W as the cooling capacity required by a server.

[0130] A server intake air temperature above 27°C is considered to be a hot spot. According to experimental test results and simulation results from Fluent, a numerical simulation software for airflow organization in Computational Fluid Dynamics (CFD), when the surface temperature of the cooling grid does not exceed 16°C, the temperature difference between the air that has undergone heat exchange with the air that has not passed through the grid is 3-4°C, which meets the cooling requirements.

[0131] The cooling efficiency of the semiconductor refrigeration chip is 0.5 to 0.7; the relationship between the cooling efficiency, cooling capacity, heating capacity and power consumption of the semiconductor refrigeration chip is shown in formulas (2) and (3). The calculated heating power of the semiconductor refrigeration chip 2 is 344W; formulas (2) and (3) are as follows:

[0132]

[0133] Q h =W+Q c (3)

[0134] In formulas (2) and (3), COP is the refrigeration efficiency; Q c Cooling capacity, unit: W; Q h Heat output is expressed in W; power consumption is expressed in W.

[0135] According to formula (1), when the air intake volume of the space above the server is 40% of the air intake volume of the server and the air outlet temperature is 45°C, the cooling capacity that the space above the server can provide is 355W, which can cover the heat of the semiconductor cooling chip and the air outlet temperature of this part of the space is within the specified range.

[0136] This invention also provides a storage medium storing a computer program thereon. When the computer program is executed by a processor, it implements the steps of the above-described method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0137] The methods involved in the systems disclosed in the above embodiments of the present invention can be applied to a processor or implemented by a processor. The processor may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above methods can be completed by integrated logic circuits in the processor's hardware or by instructions in software form. The processor may be a general-purpose processor, a digital signal processor (DSP), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The processor can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. A general-purpose processor may be a microprocessor or any conventional processor, etc. The steps of the methods disclosed in the embodiments of the present invention can be directly manifested as execution by a hardware decoding processor, or execution by a combination of hardware and software modules in the decoding processor. The software modules may be located in a storage medium, which is located in a memory. The processor reads information from the memory and, in conjunction with its hardware, completes the steps of the aforementioned methods.

[0138] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be electrical, mechanical, or other forms.

[0139] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of this embodiment according to actual needs.

[0140] In addition, in the various embodiments of the present invention, each functional unit can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; the integrated unit can be implemented in hardware or in the form of hardware plus software functional units.

[0141] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0142] Alternatively, if the integrated units of this invention are implemented as software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this invention, or the parts that contribute to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, ROM, RAM, magnetic disks, or optical disks.

[0143] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A refrigeration system, characterized in that, The refrigeration system includes a refrigeration component, a cooling grid component, and a heat dissipation component. A first side of the refrigeration component is connected to the cooling grid component via a heat-conducting medium; a second side of the refrigeration component is connected to the heat dissipation component via a heat-conducting medium. The cooling grid assembly is installed at the air inlet of the server to exchange heat with the air at the air inlet of the server, and to obtain cold air after heat exchange. The cold air is supplied to the server; The heat dissipation component is disposed around the server to conduct heat from the second side, exchange the heat with the air around the server to obtain hot air after heat exchange, and input the hot air to the air outlet of the server. The system further includes a second power component; the second power component is disposed behind the heat dissipation component; the refrigeration system further includes a controller; a first temperature sensor, a second temperature sensor, a third temperature sensor and a humidity sensor are disposed around the cooling grid component; the controller is connected to the first temperature sensor, the second temperature sensor, the third temperature sensor and the humidity sensor respectively; The first temperature sensor is used to detect the first temperature of the air at the air inlet of the server; The second temperature sensor is used to detect the second temperature of the air after passing through the cooling grid assembly; The third temperature sensor is used to detect the third temperature corresponding to the surface of the cooling grid assembly; The humidity sensor is used to detect the humidity of the air surrounding the third temperature sensor. The fourth temperature was obtained; The controller is configured to control the power of the cooling component and the wind speed of the second power component based on the first temperature, and / or, the second temperature, and / or, the third temperature, and / or, the third temperature and the fourth temperature.

2. The system according to claim 1, characterized in that, The system also includes a first power assembly; the first power assembly is disposed in front of the cooling grid assembly; The first power component is used to control the input of the cold air to the server; The second power component is used to control the input of the hot air to the air outlet of the server.

3. The system according to claim 1, characterized in that, A heat insulation component is provided around the heat dissipation component; The heat insulation component is used to separate the heat dissipation component from the server, preventing heat from entering the server.

4. The system according to claim 2, characterized in that, The heat dissipation assembly includes a copper plate, a U-shaped assembly, and a fin assembly; one side of the copper plate is connected to a second side of the cooling assembly via a heat-conducting medium, and the other side is connected to one end of the U-shaped assembly; the fin assembly is connected to the other end of the U-shaped assembly. The copper plate is used to absorb heat from the second side of the cooling component and transfer the heat to the U-shaped component; The U-shaped component is used to convert the heat into gas and transfer the gas to the fin assembly; The fin assembly is used to exchange heat between the gas and the air around the server to obtain hot air after heat exchange; The hot air is introduced into the air outlet of the server.

5. The system according to claim 4, characterized in that, The U-shaped assembly includes a first component in a first region, a second component in a second region, coolant, and corresponding structures for the U-shaped assembly and the fin assembly; the first component in the first region is connected to the copper plate; the second component in the first region is connected to the fin assembly. A first component in the first region is used to receive the heat transferred by the copper plate and convert the heat into gas through the coolant; The second component in the first region is used to exchange heat between the rising gas and the fin assembly through the coolant, and to convert the heat-exchanged gas into a liquid, and to return the liquid to the first component in the first region through the structure.

6. The system according to claim 4, characterized in that, The fins of the fin assembly are parallel to the direction of air supply or exhaust of the second power assembly.

7. The system according to claim 2, characterized in that, The refrigeration component, the cooling grid component, the heat dissipation component, the first power component, and the second power component are assembled together.

8. A refrigeration method, characterized in that, Applied to the refrigeration system provided in any one of claims 1-7, the method comprises: The first temperature parameter of the air entering the refrigeration system is detected by the first temperature sensor. A second temperature parameter of the air surrounding the cooling grid assembly in the refrigeration system is detected by a second temperature sensor. A third temperature parameter of the surface of the cooling grid assembly is obtained by a third temperature sensor; The humidity parameter of the air surrounding the location of the third temperature sensor is obtained by the humidity sensor; the fourth temperature parameter is determined based on the humidity parameter. The power of the refrigeration component and the wind speed corresponding to the second power component in the refrigeration system are controlled according to the first temperature parameter, and / or the second temperature parameter, and / or the third temperature parameter, and / or the fourth temperature parameter.

9. The method according to claim 8, characterized in that, The step of controlling the power of the refrigeration component and the fan speed corresponding to the second power component in the refrigeration system according to the first temperature parameter, and / or the second temperature parameter, and / or the third temperature parameter, and / or the fourth temperature parameter includes: When the first temperature parameter is greater than the first preset threshold, the power of the cooling component is adjusted to reach the power threshold, and the wind speed of the second power component is adjusted to reach the wind speed threshold. When the difference between the second temperature parameter and the first temperature parameter meets the first preset range, and the second temperature parameter is less than or equal to the first preset threshold, the power of the cooling component and the wind speed of the second power component are adjusted; the second temperature parameter is less than the first temperature parameter. If the difference between the third temperature parameter and the fourth temperature parameter meets the second preset threshold, the power of the cooling component and the wind speed of the second power component are adjusted; the third temperature parameter is greater than the fourth temperature parameter. When the value of the third temperature parameter is a third preset threshold, the power of the cooling component and the wind speed of the second power component are adjusted.

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