A method of processing a ring target

Abstract

The application relates to the technical field of target material processing, and particularly discloses a ring-shaped target material processing method, which comprises the following steps: processing a solid target blank to form a ring-shaped target blank with steps on the inner and outer sides; welding one end of the ring-shaped target blank with steps on a back plate to form a target material assembly; clamping the target material assembly by multiple flat tongs to process one side of the back plate welded with the ring-shaped target blank to form a step surface; and clamping the target material assembly by multiple flat tongs to finish machining the side of the back plate away from the ring-shaped target blank. The solid target blank is first processed, and then welded on the back plate, so that the target material assembly can be prevented from deforming during processing and from being detached from the back plate; and the target material assembly is clamped by multiple flat tongs, so that the clamping force of a single flat tong can be dispersed and reduced, the deformation caused by clamping can be minimized, and the ring-shaped target blank can be prevented from being detached from the back plate during the flattening process caused by external force.

Description

Technical Field

[0001] This invention relates to the field of target processing technology, and in particular to a method for processing ring-shaped targets. Background Technology

[0002] A target material is used to fabricate thin films. Specifically, it involves bombarding the surface of a target with high-energy particles, causing atoms or molecules on the target surface to gain sufficient energy to escape and deposit onto the substrate surface to form a thin film. A target material consists of a target blank and a backplate. The target blank is made of high-purity metal and is the target of high-speed ion beam bombardment. The backplate is connected to the target blank through a welding process, serving to fix the target blank, and the backplate needs to be thermally and electrically conductive.

[0003] The annular nickel target material consists of an annular nickel target blank and a copper back plate. In the prior art, a solid nickel target blank and a thick copper back plate are first welded together to form the component to be processed. Then, the component to be processed is milled after welding to form the finished annular nickel target material. However, in the finished annular nickel target material, the center of the annular nickel target blank is hollowed out, and the thickness of the copper back plate is relatively thin. The method of direct welding and milling is prone to deformation of the annular nickel target material, and it is also easy to cause the annular nickel target blank and the copper back plate to desolder. Summary of the Invention

[0004] The purpose of this invention is to provide a method for processing annular targets, in order to solve the problem that the existing method of direct welding and milling can easily cause deformation of the annular nickel target and also easily lead to desoldering between the annular nickel target blank and the copper back plate.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] This invention provides a method for processing annular targets, comprising the following steps:

[0007] S1. The solid target blank is processed to form an annular target blank with steps on the inner and outer sides;

[0008] S2. Weld one step end of the annular target blank to the back plate to form a target assembly;

[0009] S3. The target assembly is clamped by multiple flat-jaw pliers so that one side of the annular target blank of the target assembly faces upward, so as to process the side of the annular target blank that is welded to the back plate to form a stepped surface.

[0010] S4. The target assembly is clamped by multiple flat-jaw pliers so that the back plate side of the target assembly faces upward, so as to perform finishing on the side of the back plate that is away from the annular target blank.

[0011] As an alternative to the above-mentioned ring-shaped target processing method, step S1 further includes:

[0012] The solid target blank is ground to reduce its thickness.

[0013] The solid target blank is subjected to slow wire cutting to form the annular target blank with steps on the inner and outer sides.

[0014] As an alternative to the above-mentioned ring target processing method, after grinding the solid target blank, the flatness range of the solid target blank is less than or equal to 0.1 mm.

[0015] As an alternative to the above-mentioned annular target material processing method, after step S1 and before step S2, the method further includes: milling the steps of the annular target blank to make the steps of the annular target blank precisely shaped.

[0016] As an alternative to the above-mentioned ring target processing method, in step S2, the flatness range of the formed target assembly is controlled to be less than or equal to 0.1 mm.

[0017] As an optional solution to the above-mentioned annular target material processing method, after step S2 and before step S3, the method further includes: milling the side of the back plate away from the annular target blank to form a reference surface, and the flatness range of the reference surface is less than or equal to 0.1 mm.

[0018] As an alternative to the above-mentioned annular target processing method, steps S3 and S4 further include: installing pads inside the above-mentioned flat-jaw pliers to support the target assembly by using multiple of the above-mentioned pads.

[0019] As an alternative to the above-mentioned ring target processing method, after installing the pad in the above-mentioned flat-jaw pliers, the flatness of the pad is measured by dial gauge to control the flatness range of the pad to be less than or equal to 0.05mm.

[0020] As an alternative to the above-mentioned ring-shaped target processing method, after installing the target assembly in the above-mentioned flat-jaw pliers, the flatness of the target assembly is measured by dial gauge to control the flatness range of the target assembly to be less than or equal to 0.1 mm.

[0021] As an alternative to the above-mentioned ring target processing method, steps S3 and S4 further include: milling the back plate using a milling cutter with a diameter of 8mm.

[0022] The beneficial effects of this invention are as follows:

[0023] In this invention, a solid target blank is first processed to form an annular target blank with steps on the inner and outer sides. Then, the stepped end of the annular target blank is welded to a back plate to form a target assembly. This avoids the processing difficulties caused by welding the solid target blank to the back plate before processing, thereby preventing the target assembly from deforming during processing and causing the annular target blank to detach from the back plate. At the same time, by using multiple flat-jaw pliers to clamp the target assembly, the clamping force of a single flat-jaw plier can be dispersed and reduced, minimizing the deformation caused by clamping and preventing the annular target blank from detaching from the back plate during the leveling process. Attached Figure Description

[0024] Figure 1 This is a schematic flowchart of the ring target processing method provided in an embodiment of the present invention. Detailed Implementation

[0025] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Furthermore, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] This embodiment provides a method for processing annular targets, used to manufacture annular targets.

[0029] like Figure 1 As shown, the method for processing the annular target includes the following steps:

[0030] S1. The solid target blank is processed to form an annular target blank with steps on the inner and outer sides;

[0031] S2. Weld one step end of the annular target blank to the back plate to form a target assembly;

[0032] S3. The target assembly is clamped by multiple flat-jaw pliers so that one side of the annular target blank of the target assembly faces upward, so as to process one side of the annular target blank for back plate welding to form a stepped surface.

[0033] S4. The target assembly is clamped by multiple flat-jaw pliers so that the back plate of the target assembly faces upward, so as to perform precision machining on the side of the back plate that is away from the annular target blank.

[0034] In this embodiment, the solid target blank is first processed to form an annular target blank with steps on both the inner and outer sides. Then, the stepped end of the annular target blank is welded to a back plate to form a target assembly. This avoids the processing difficulties caused by welding the solid target blank to the back plate before processing, thereby preventing deformation of the target assembly during processing and preventing the annular target blank from detaching from the back plate. Simultaneously, by using multiple flat-jaw pliers to clamp the target assembly, the clamping force of a single plier can be dispersed and reduced, minimizing deformation caused by clamping and preventing the annular target blank from detaching from the back plate during leveling by external force. Optionally, the annular target blank is a racetrack-shaped nickel target blank, and the back plate is a copper plate. Of course, the annular target blank can also be other target blanks, and the back plate can also be other substrates; this embodiment does not impose specific limitations.

[0035] Further, step S1 includes grinding the solid target blank to reduce its thickness, thereby adjusting its shape. Then, the solid target blank is subjected to slow wire cutting to form a ring-shaped target blank with steps on both the inner and outer sides, thus essentially shaping the ring-shaped target blank. Optionally, after grinding, the thickness tolerance of the solid target blank is within ±0.05mm. Further optionally, after grinding, the flatness of the solid target blank is less than or equal to 0.1mm, thereby improving its flatness and increasing the machining accuracy for subsequent processing into a ring-shaped target blank.

[0036] Furthermore, after step S1 and before step S2, the steps of the annular target blank are milled to achieve a precision-formed step. This allows for effective control of the positional accuracy of the annular target blank relative to the back plate after the stepped end of the annular target blank is welded to the back plate, thereby improving the forming accuracy of the target assembly. Optionally, when milling the steps of the annular target blank, a D6mm milling cutter should be used, with the roughing depth of cut controlled to be less than or equal to 0.2mm and the finishing depth of cut controlled to be less than or equal to 0.05mm.

[0037] Furthermore, in step S2, the flatness range of the formed target assembly is controlled to be less than or equal to 0.1 mm, so as to avoid the target assembly having a high flatness during welding and forming, which would affect the subsequent processing of the target assembly.

[0038] Furthermore, after step S2 and before step S3, the side of the back plate facing away from the annular target blank is milled to form a reference surface. The flatness of the reference surface is less than or equal to 0.1 mm, making the side of the back plate facing away from the annular target blank relatively flat, thereby improving the machining accuracy of the subsequent target assembly. Optionally, when milling the side of the back plate facing away from the annular target blank, a D8mm milling cutter should be used, and the roughing depth of cut should be controlled to be less than or equal to 0.2 mm, the finishing depth of cut should be controlled to be less than or equal to 0.1 mm, and a machining allowance should be left on the side of the back plate facing away from the annular target blank.

[0039] Furthermore, steps S3 and S4 further include installing pads inside the vise to support the target assembly using multiple pads, thereby increasing the supporting force on the target assembly and reducing deformation of the target assembly during processing. Specifically, after installing the pads inside the vise, the flatness of the pads is measured using a dial indicator, controlling the flatness range of the pads to be less than or equal to 0.05 mm. This control of the pad flatness prevents the pads from affecting the processing of the target assembly. Simultaneously, after installing the target assembly inside the vise, the flatness of the target assembly is measured using a dial indicator, controlling the flatness range of the target assembly to be less than or equal to 0.1 mm. This ensures that the flatness range of the final target assembly meets the processing accuracy requirements during processing, thereby improving the final forming quality of the target assembly.

[0040] Furthermore, steps S3 and S4 also include milling the back plate with an 8mm diameter milling cutter to reduce the depth of cut, thereby reducing the force exerted on the target assembly by the milling cutter during machining and effectively solving the problems of deformation and weld failure of the target assembly during machining. Optionally, when machining the side of the back plate that is welded to the annular target blank to form a stepped surface, and when finishing the side of the back plate that is away from the annular target blank, the roughing depth of cut should be controlled to be less than or equal to 0.1mm, and the finishing depth of cut should be controlled to be less than or equal to 0.05mm.

[0041] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for processing a ring-shaped target, characterized in that, Includes the following steps: S1. The solid target blank is processed to form an annular target blank with steps on the inner and outer sides; S2. Weld one step end of the annular target blank to the back plate to form a target assembly; S3. The target assembly is clamped by multiple flat-jaw pliers so that one side of the annular target blank of the target assembly faces upward, so as to process the side of the annular target blank that is welded to the back plate to form a stepped surface. S4. The target assembly is clamped by multiple flat-jaw pliers so that the back plate side of the target assembly faces upward, so as to perform precision machining on the side of the back plate that is away from the annular target blank. Step S1 also includes: The solid target blank is ground to reduce its thickness; The solid target blank is subjected to slow wire cutting to form the annular target blank with steps on the inner and outer sides.

2. The method for processing annular target material according to claim 1, characterized in that, After the solid target blank is ground, the flatness of the solid target blank is less than or equal to 0.1 mm.

3. The method for processing annular target material according to claim 1, characterized in that, After step S1 and before step S2, the process further includes: milling the steps of the annular target blank to precisely shape the steps of the annular target blank.

4. The method for processing annular target material according to claim 1, characterized in that, In step S2, the flatness of the formed target assembly is controlled to be less than or equal to 0.1 mm.

5. The method for processing annular target material according to claim 1, characterized in that, After step S2 and before step S3, the method further includes: milling the side of the back plate away from the annular target blank to form a reference surface, wherein the flatness of the reference surface is less than or equal to 0.1 mm.

6. The method for processing annular target material according to claim 1, characterized in that, Steps S3 and S4 further include: installing pads inside the flat-jaw pliers to support the target assembly by using a plurality of the pads.

7. The method for processing annular target material according to claim 6, characterized in that, After installing the pad block inside the flat-nose pliers, the flatness of the pad block is measured using a dial indicator, and the flatness range of the pad block is controlled to be less than or equal to 0.05 mm.

8. The method for processing annular target material according to claim 7, characterized in that, After installing the target assembly in the flat-jaw pliers, the flatness of the target assembly is measured using a dial indicator to control the flatness range of the target assembly to be less than or equal to 0.1 mm.

9. The method for processing annular target material according to claim 1, characterized in that, Steps S3 and S4 also include: milling the back plate using a milling cutter with a diameter of 8 mm.

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