SPC lock catch floor structure facilitating heat conduction of floor heating and mounting process thereof

Abstract

The application provides a kind of SPC lock catch floor structure that facilitates ground heating conduction, comprising: floor; setting groove is set in the middle of the bottom of floor, the top of the inner cavity of setting groove is fixedly installed with heat conduction device; two mounting blocks are respectively fixedly installed on the two sides of the bottom of heat conduction device. The application provides a kind of SPC lock catch floor structure that facilitates ground heating conduction, through the mutual splicing of clamping groove and clamping block, so that two floors are spliced together, when the floor is installed on the top of ground heating pipe, the elastic device pushes the limiting device to limit the ground heating pipe inside the placing groove, the heat released by the ground heating pipe is guided to the communication cavity and communication groove of the floor through the heat conduction block and communication hole, and the floor is heat-conducted, the device is simple in structure and high in practicability, can guide heat transfer to the floor, and improves the heat dissipation effect of the bottom plate bottom ground heating pipe.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of SPC lock floor, especially to a SPC lock floor structure facilitating heat conduction of floor heating and an installation process thereof. BACKGROUND

[0002] The SPC lock floor is composed of a thick wear-resistant layer, a UV layer, a color film texture layer and a base material layer, wherein the base material is a composite board made of stone powder and thermoplastic polymer material after stirring and high-temperature extrusion, and has the performance and characteristics of wood and plastic, thereby ensuring the strength and toughness of the floor.

[0003] The lock technology is to connect the floor blocks into a whole structure by the way of mutual engagement of the tenons around the floor, thereby realizing the "self-connection" without any external auxiliary components, which is a relatively advanced floor structure in the industry, especially after the rise of floor heating, through repeated tests, the industry gradually realizes that the lock floor can be directly laid on the floor heating to ensure the heat conduction effect of the floor heating, and the lock can ensure the stability of the floor.

[0004] However, the SPC lock floor is directly laid on the ground and the floor heating pipe, and the heat dissipation effect of the floor heating pipe is blocked by the SPC lock bottom plate, thereby reducing the heat conduction effect of the floor heating pipe.

[0005] Therefore, it is necessary to provide a SPC lock floor structure facilitating heat conduction of floor heating and an installation process thereof to solve the above technical problems. SUMMARY

[0006] The present application provides a SPC lock floor structure facilitating heat conduction of floor heating and an installation process thereof, which solves the problem that the SPC lock floor is directly laid on the ground and the floor heating pipe, and the heat dissipation effect of the floor heating pipe is blocked by the SPC lock bottom plate, thereby reducing the heat conduction effect of the floor heating pipe.

[0007] To solve the above technical problems, the present application provides a SPC lock floor structure facilitating heat conduction of floor heating, which comprises a floor.

[0008] A groove is arranged in the middle of the bottom of the floor, and a heat conduction device is fixedly installed at the top of the inner cavity of the groove;

[0009] Two installation blocks are fixedly installed on the two sides of the bottom of the heat conduction device, one side of the installation block is provided with a moving groove, one side of the inside of the moving groove is provided with an elastic device, and the outer surface of the elastic device is sleeved with a limiting device;

[0010] A communication cavity is arranged at the bottom of the floor, a communication groove is communicated at the top of the communication cavity, and a protruding block is fixedly installed at the top of the inner cavity of the communication groove.

[0011] Preferably, one side of the floor outer surface is provided with a clamping groove, and the other side of the floor outer surface is fixedly installed with a clamping block.

[0012] Preferably, the heat conduction device comprises a heat conduction block, a placing groove is formed in the bottom of the heat conduction block, and a communication hole is in communication with the top of the placing groove.

[0013] Preferably, the elastic device comprises a fixed rod, a first limiting block is fixedly installed at one end of the fixed rod, and a first spring is sleeved on the outer surface of the fixed rod.

[0014] Preferably, the limiting device comprises a second limiting block, a setting hole is formed in the middle of one side of the second limiting block, a limiting cavity is in communication with one side of the setting hole, a pressing surface is arranged on one side of the outer surface of the second limiting block, and a limiting surface is arranged on the other side of the outer surface of the second limiting block.

[0015] Preferably, four placing grooves are arranged, two mounting blocks are fixedly installed on the left and right sides of the bottom of the outer surface of the placing groove, respectively, and the mounting blocks are provided with four groups.

[0016] Preferably, a setting cavity is formed in the middle of one side of the floor, sliding grooves are formed on the two sides of the inner cavity of the setting cavity, a pushing device is arranged in the sliding grooves, and a limiting device is sleeved on the outer surface of the pushing device.

[0017] Preferably, the pushing device comprises a sliding rod, and a second spring is sleeved on the outer surface of the sliding rod.

[0018] Preferably, the limiting device comprises a mounting plate, a limiting block is fixedly installed on one side of the mounting plate, and pressing blocks are fixedly installed on the two sides of the outer surface of the mounting plate.

[0019] A SPC lock buckle floor structure installation process convenient for heat conduction of floor heating, S1: install a floor on the ground, and make the floor heating pipe press the pressing surfaces on the top and the left and right sides, as the floor is attached to the ground, the second limiting blocks on the left and right sides are pressed to the left and right sides, respectively, so that the second limiting blocks slide along the fixed rod and press the first spring, so that the floor heating pipe is attached to the placing groove and is limited by the limiting surface, and the floor heating pipe is attached to the heat conduction block.

[0020] S2: the user installs another floor on the side of the installed floor, so that the clamping groove of the to-be-installed floor wraps the clamping block of the already-installed floor, and so that the elastic device and the limiting device clamp the floor heating pipe.

[0021] Compared with the related art, the SPC lock buckle floor structure and the installation process thereof convenient for heat conduction of floor heating have the following beneficial effects:

[0022] The application provides an SPC lock buckle floor structure facilitating heat conduction of floor heating, which is formed by splicing a clamping groove and a clamping block, so that two floors are spliced together, when the floor is installed on the top of a floor heating pipe, an elastic device pushes a limiting device to limit the floor heating pipe in a placing groove, heat released by the floor heating pipe is guided into a communicating cavity and a communicating groove of the floor through a heat conducting block and a communicating hole, and the floor is conducted heat, the device has simple structure and high practicability, can guide heat to the floor, and improves heat dissipation effect of the floor heating pipe at the bottom of the floor. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 A structure diagram of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided.

[0024] Figure 2 A structure diagram of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided. Figure 1 A structure diagram of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided.

[0025] Figure 3 A structure diagram of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided. Figure 1 A structure diagram of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided.

[0026] Figure 4 A structure diagram of the second embodiment of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided.

[0027] Figure 5 A structure diagram of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided. Figure 4 A structure diagram of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided.

[0028] In the drawings, 1 is a floor, 2 is a setting groove, 3 is a heat conducting device, 31 is a heat conducting block, 32 is a communicating hole, 33 is a placing groove, 4 is an installation block, 5 is a moving groove, 6 is an elastic device, 61 is a fixed rod, 62 is a first spring, 63 is a first limiting block, 7 is a limiting device, 71 is a second limiting block, 72 is a setting hole, 73 is a limiting cavity, 74 is a pressing surface, 75 is a limiting surface, 8 is a clamping groove, 9 is a clamping block, 10 is a communicating cavity, 11 is a communicating groove, 12 is a protruding block, 13 is a setting cavity, 14 is a sliding groove, 15 is a pushing device, 151 is a sliding rod, 152 is a second spring, 16 is a limiting device, 161 is an installation plate, 162 is a limiting block, and 163 is a pressing block. DETAILED DESCRIPTION

[0029] The application will be further described below in combination with the drawings and embodiments.

[0030] Please refer to Figure 1 , Figure 2 and Figure 3 , wherein, Figure 1 A structure diagram of the SPC lock buckle floor structure facilitating heat conduction of floor heating is provided.Figure 2 As Figure 1 The schematic diagram of the heat conduction device structure is shown in the figure. Figure 3 As Figure 1 The schematic diagram of the heat conduction device structure is shown in the figure.

[0031] The setting groove 2 is arranged in the middle of the bottom of the floor 1, and the top of the inner cavity of the setting groove 2 is fixedly installed with a heat conduction device 3.

[0032] The installation block 4 is fixedly installed on both sides of the bottom of the heat conduction device 3, one side of the installation block 4 is provided with a moving groove 5, one side of the inside of the moving groove 5 is provided with an elastic device 6, and the outer surface of the elastic device 6 is sleeved with a limiting device 7.

[0033] The communication cavity 10 is arranged at the bottom of the floor 1, and the top of the communication cavity 10 is communicated with a communication groove 11, and the top of the inner cavity of the communication groove 11 is fixedly installed with a protruding block 12.

[0034] The four communication grooves 11 are respectively communicated with four placing grooves 33 and communication holes 32, heat is conveniently dissipated, the protruding block 12 is a heat conduction block, and the effect of absorbing heat by the communication groove 11 is increased, and heat is condensed.

[0035] One side of the outer surface of the floor 1 is provided with a clamping groove 8, and the other side of the outer surface of the floor 1 is fixedly installed with a clamping block 9.

[0036] The clamping groove 8 is arranged in the middle of the left side of the floor 1, and the clamping groove 8 and the clamping block 9 are matched.

[0037] The heat conduction device 3 comprises a heat conduction block 31, and the bottom of the heat conduction block 31 is provided with a placing groove 33, and the top of the placing groove 33 is communicated with a communication hole 32.

[0038] The placing groove 33 and the floor heating pipe are matched, and the communication hole 32 is provided with a plurality of communication holes, which is convenient for heat dissipation.

[0039] The elastic device 6 comprises a fixed rod 61, one end of the fixed rod 61 is fixedly installed with a first limiting block 63, and the outer surface of the fixed rod 61 is sleeved with a first spring 62.

[0040] One end of the first spring 62 is connected with a second limiting block 71, and the other end is connected with the inner cavity wall of the moving groove 5.

[0041] The limiting device 7 comprises a second limiting block 71, a setting hole 72 is arranged in the middle of one side of the second limiting block 71, a limiting cavity 73 is communicated with one side of the setting hole 72, an extrusion surface 74 is arranged on one side of the outer surface of the second limiting block 71, and a limiting surface 75 is arranged on the other side of the outer surface of the second limiting block 71.

[0042] When the extrusion surface 74 contacts the floor heating pipe, the floor heating pipe extrudes the second limiting block 71 into the moving groove 5 through the extrusion surface 74.

[0043] The limiting surface 75, the placing groove 33 and the surface of the floor heating pipe are matched.

[0044] The placing groove 33 is provided with four, the two mounting blocks 4 are respectively fixedly installed on the left and right sides of the bottom of the outer surface of the placing groove 33, and the mounting block 4 is provided with four groups.

[0045] A kind of SPC lock buckle floor structure installation process for facilitating floor heating, S1: one floor 1 is installed on ground, and floor heating pipe extrusion top left and right sides described extrusion surface 74, with described floor 1 is pasted on ground, left and right sides described second limiting block 71 is respectively extruded to left and right sides, so that second limiting block 71 slides along described fixed rod 61 and extrudes described first spring 62, so that floor heating pipe is pasted in placing groove 33 inside and is extruded by limiting surface 75, so that floor heating pipe is pasted along heat conducting block 31;

[0046] S2: user installs another described floor 1 on the side of installed described floor 1, and makes the clamping groove 8 of to-be-installed described floor 1 wrap around the clamping block 9 of already installed described floor 1, and makes described elastic device 6 and described limiting device 7 clamp floor heating pipe.

[0047] Compared with the related art, the SPC lock buckle floor structure for facilitating floor heating has the following beneficial effects:

[0048] The SPC lock buckle floor structure for facilitating floor heating is provided, the clamping groove 8 and the clamping block 9 are mutually spliced, so that two floors 1 are mutually spliced together, when the floor 1 is installed on the top of the floor heating pipe, the elastic device 6 pushes the limiting device 7 to limit the floor heating pipe in the inside of the placing groove 33, the heat released by the floor heating pipe is guided to the communicating cavity 10 and the communicating groove 11 of the floor 1 through the heat conducting block 31 and the communicating hole 32, and the floor 1 is heat-conducted, the device has simple structure and strong practicability, can guide heat to be transmitted to the floor 1, and improves the heat dissipation effect of the floor heating pipe at the bottom of the bottom plate.

[0049] Second embodiment

[0050] Please refer to Figure 4 and Figure 5, based on the first embodiment of the application provides a convenient SPC lock floor structure of heat conduction, the second embodiment of the application provides another convenient SPC lock floor structure of heat conduction. The second embodiment is only the preferred mode of the first embodiment, the implementation of the second embodiment does not affect the separate implementation of the first embodiment.

[0051] Specifically, the second embodiment of the application provides a convenient SPC lock floor structure of heat conduction, the difference between the floor 1 side of the middle is provided with a setting cavity 13, the setting cavity 13 inner cavity is provided with a chute 14 on both sides, the inner part of the chute 14 is provided with a pushing device 15, the outer surface of the pushing device 15 is sleeved with a limiting device 16.

[0052] The setting cavity 13 is arranged in the middle of the right side of the floor 1, and the two chutes 14 are arranged in the middle of the top and bottom of the inner cavity of the setting cavity 13.

[0053] The pushing device 15 comprises a sliding rod 151, and the outer surface of the sliding rod 151 is sleeved with a second spring 152.

[0054] The left and right ends of the sliding rod 151 are fixedly installed in the middle of the left and right sides of the inner cavity of the chute 14, and the left end of the second spring 152 is connected with the chute 14, and the right end is connected with the extrusion block 163.

[0055] The limiting device 16 comprises an installation plate 161, one side of the installation plate 161 is fixedly installed with a limiting block 162, and the outer surfaces of the installation plate 161 are fixedly installed with extrusion blocks 163 on both sides.

[0056] The extrusion block 163 is sleeved on the outer surface of the sliding rod 151, and the restoring force of the second spring 152 pushes the limiting block 162 out of the setting cavity 13.

[0057] The working principle of the SPC lock floor structure for facilitating heat conduction of the application is as follows:

[0058] In work, first, the user presses the to-be-installed floor 1 against the installed floor 1 on the ground, so that the limiting block 162 is extruded into the inside of the setting cavity 13, and the extrusion block 163 slides along the sliding rod 151 extruding the second spring 152.

[0059] When the floor 1 is installed on the ground, the chute 8 and the setting cavity 13 are communicated, the restoring force of the second spring 152 pushes the limiting device 16 to the side of the to-be-installed floor 1, so that the limiting block 162 is embedded into the inside of the chute 8, and the two floors 1 are connected together.

[0060] Compared with the related art, the SPC lock buckle floor structure facilitating heat conduction of floor heating has the following beneficial effects:

[0061] The application provides an SPC lock buckle floor structure installation process facilitating heat conduction of floor heating. The limiting device 16 is embedded into the clamping groove 8 of the floor 1 by pushing the limiting device 16 through the pushing device 15. The device has simple structure and high practicability. The user can directly embed the floor 1 into the side edge of another floor 1. When disassembling, the floor 1 can be disassembled by only lifting it upwards. The device has simple structure and high practicability. The floor 1 can be disassembled individually without using the embedding and splicing mode. The installation box is convenient to disassemble.

[0062] The above description is only an embodiment of the application, and does not limit the patent range of the application. Any equivalent structure or equivalent process transformation obtained by using the content of the specification and the drawings, or direct or indirect application in other related technical fields is also included in the patent protection range of the application.

Claims

1. An SPC interlocking floor structure that facilitates heat conduction in underfloor heating, characterized in that, include: floor; A groove is provided, which is located in the middle of the bottom of the floor, and a heat-conducting device is fixedly installed on the top of the inner cavity of the groove. Mounting blocks, two mounting blocks are respectively fixedly installed on both sides of the bottom of the heat conduction device. A moving groove is opened on one side of the mounting block, and an elastic device is provided on one side inside the moving groove. A limiting device is sleeved on the outer surface of the elastic device. A connecting cavity is provided at the bottom of the floor, and a connecting groove is connected to the top of the connecting cavity. A protrusion is fixedly installed on the top of the inner cavity of the connecting groove. A slot is provided on one side of the outer surface of the floor, and a block is fixedly installed on the other side of the outer surface of the floor; The heat-conducting device includes a heat-conducting block, the bottom of which has a placement groove, and the top of which has a connecting hole. The elastic device includes a fixed rod, one end of which is fixedly fitted with a first limiting block, and the outer surface of the fixed rod is fitted with a first spring; The limiting device includes a second limiting block, a setting hole is provided in the middle of one side of the second limiting block, one side of the setting hole is connected to a limiting cavity, a pressing surface is provided on one side of the outer surface of the second limiting block, and a limiting surface is provided on the other side of the outer surface of the second limiting block. There are four placement slots, and the two mounting blocks are respectively fixedly installed on the left and right sides of the bottom of the outer surface of the placement slot. There are four sets of mounting blocks.

2. The SPC interlocking floor structure for facilitating heat conduction in underfloor heating as described in claim 1, characterized in that, A cavity is provided in the middle of one side of the floor. A sliding groove is provided on both sides of the cavity. A pushing device is provided inside the sliding groove. A limiting device is fitted on the outer surface of the pushing device.

3. The SPC interlocking floor structure for facilitating underfloor heating as described in claim 2, characterized in that, The pushing device includes a slide bar, and a second spring is sleeved on the outer surface of the slide bar.

4. The SPC interlocking floor structure for facilitating heat conduction in underfloor heating as described in claim 2, characterized in that, The limiting device includes a mounting plate, a limiting block is fixedly mounted on one side of the mounting plate, and pressing blocks are fixedly mounted on both sides of the outer surface of the mounting plate.

5. An installation process for an SPC interlocking floor structure that facilitates heat conduction in underfloor heating, as described in any one of claims 1-4, characterized in that, S1: Install a piece of the flooring on the ground, and make the underfloor heating pipe press against the pressing surfaces on the top left and right sides. As the flooring is pressed down onto the ground, the second limiting blocks on the left and right sides are pressed to the left and right sides respectively, so that the second limiting blocks slide along the fixing rod and press against the first spring, so that the underfloor heating pipe is pressed against the inside of the placement groove and limited by the limiting surface, so that the underfloor heating pipe is pressed against the heat-conducting block; S2: The user installs another piece of the floorboard on the side of the installed floorboard, and the slot of the floorboard to be installed wraps around the card block of the already installed floorboard, and the elastic device and the limiting device lock the underfloor heating pipe.

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