A method and apparatus for testing an optoelectronic encoder chip

Abstract

The application provides a kind of test method and device for photoelectric encoder chip, method includes the following steps: obtaining the code disc information matched with chip on TFT display module;Adjust the backlight brightness, simulate different brightness LED;When calling the code disc information matched with the chip is static picture, chip static test is carried out;When calling the code disc information matched with the chip is dynamic video, chip dynamic test is carried out.The test method and device for photoelectric encoder chip provided by the application carry out chip static test and chip dynamic test by setting TFT display module, thereby improving the efficiency of chip test.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic testing technology, and in particular to a testing method and apparatus for optoelectronic encoder chips. Background Technology

[0002] In typical chip testing, the probes are positioned at the bottom of the test socket, the light source is directly above the chip, and the shape and location of the photosensitive area vary, as does the diameter of the code disk. After testing, the code disk must be fabricated according to the different shapes and positions of the chip PDs. Because a motor is needed to control the speed of the code disk during chip testing, a motor must be installed in the test clamp, resulting in an excessively large testing device. Furthermore, different code disks need to be changed for testing different chips, which is inconvenient and time-consuming each time. Additionally, aligning the code disk with the photosensitive area is difficult, requiring a microscope for alignment, which affects testing efficiency.

[0003] Therefore, it is necessary to provide a testing method and apparatus for photoelectric encoder chips to effectively solve the above problems. Summary of the Invention

[0004] This invention provides a testing method and apparatus for photoelectric encoder chips, which improves the efficiency of chip testing by setting up a TFT display module to perform static and dynamic chip testing.

[0005] This invention provides a testing method for an optical encoder chip, comprising the following steps:

[0006] A testing method for photoelectric encoder chips includes the following steps:

[0007] Obtain the code disk information that matches the chip on the TFT display module;

[0008] Adjust the backlight brightness to simulate LEDs of different brightness levels;

[0009] When the code disk information matching the chip is a static image, a static chip test is performed.

[0010] When the code disk information matching the chip is dynamic video, a dynamic chip test is performed.

[0011] Preferably, the TFT display module is electrically connected to the control module, and the control module simulates different code disks according to the position and shape of the photosensitive area.

[0012] Preferably, the control module is an MCU or a computer, the control module automatically dynamically adjusts the light transmission position, a first alignment mark is arranged on the light sensing PD, a picture of a code disc of the TFT display module is provided with a second alignment mark, when a current / voltage signal output by the light sensing PD reaches a maximum value, the second alignment mark and the first alignment mark completely overlap.

[0013] Preferably, when the chip is replaced, the control module updates code disc information of the TFT display module.

[0014] Preferably, the TFT display module is further used for simulating a state of rotation of the code disc.

[0015] Preferably, the code disc information includes a static picture of the code disc, the static picture is a black-and-white picture format, and a size of the static picture on the TFT display module is same as an actual code disc size.

[0016] Preferably, the code disc information includes a dynamic video of the code disc, and different rotating speeds of the code disc are simulated by changing a playing speed of the dynamic video.

[0017] Preferably, the code disc information is stored in a database according to code disc numbers, and the chip and the code disc information one-to-one correspond.

[0018] Preferably, the TFT display module is arranged between a light source and a light sensing area.

[0019] Based on the same concept, the embodiment of the present application further provides a testing device for an optoelectronic encoder chip, comprising:

[0020] a code disc information acquisition module, which is used for acquiring code disc information matched with the chip on a TFT display module;

[0021] a brightness adjustment module, which is used for adjusting brightness of backlight and simulating LEDs with different brightness;

[0022] a static test module, which is used for performing static test of the chip when the code disc information matched with the chip is a static picture;

[0023] a dynamic test module, which is used for performing dynamic test of the chip when the code disc information matched with the chip is a dynamic video.

[0024] Compared with the prior art, the technical scheme of the embodiment of the present application has the following beneficial effects:

[0025] The embodiment of the present application provides a test method and device for an optical encoder chip, the method comprises the following steps: acquiring code disc information matched with the chip on a TFT display module; adjusting backlight brightness to simulate different brightness of LEDs; when the code disc information matched with the chip is a static picture, performing static test on the chip; when the code disc information matched with the chip is a dynamic video, performing dynamic test on the chip, thereby improving the efficiency of chip test. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, not all embodiments. For those skilled in the art, other drawings can also be obtained without creative labor.

[0027] Figure 1 The flowchart of the test method for the optical encoder chip is provided for an embodiment of the present application.

[0028] Figure 2 The structural schematic diagram of the test device for the optical encoder chip is provided for an embodiment of the present application.

[0029] Figure 3 The structural schematic diagram of the test device for the optical encoder chip is provided for another embodiment of the present application.

[0030] In the drawings:

[0031] 11, test chip; 111, PAD disc; 112, photosensitive area; 12, TFT display module; 13, probe; 14, light source. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0033] The technical solutions of the present application will be described in detail in the following specific embodiments. The following several specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in some embodiments.

[0034] Based on the problems existing in the prior art, the embodiment of the present application provides a test method and device for an optoelectronic encoder chip, chip static testing and chip dynamic testing are performed through the TFT display module, so that the efficiency of chip testing is improved.

[0035] Figure 1 A flowchart of a test method for an optoelectronic encoder chip is provided for an embodiment of the present application. Now referring to Figure 1 The embodiment of the present application provides a test method for an optoelectronic encoder chip, comprising the following steps:

[0036] Step S101: Obtain code disc information matched with the chip on the TFT display module;

[0037] Step S102: Adjust the backlight brightness to simulate different brightness of the LED;

[0038] Step S103: When the code disc information matched with the chip is a static picture, perform chip static testing;

[0039] Step S104: When the code disc information matched with the chip is a dynamic video, perform chip dynamic testing.

[0040] In a specific implementation, the TFT display module is electrically connected with the control module, and the control module simulates different code discs according to the position and shape of the light sensing area.

[0041] In a specific implementation, the control module is an MCU or a computer, the control module automatically dynamically adjusts the light transmission position, the first alignment mark is arranged on the light sensing PD, the picture of the code disc of the TFT display module is provided with a second alignment mark, when the current / voltage signal output by the light sensing PD reaches the maximum value, the second alignment mark and the first alignment mark completely overlap.

[0042] In a specific implementation, when the chip is replaced, the control module updates the code disc information of the TFT display module.

[0043] In a specific implementation, the TFT display module is also used to simulate the state of code disc rotation.

[0044] In a specific implementation, the code disc information includes a static picture of the code disc, the static picture is in a black and white picture format, and the size of the static picture on the TFT display module is the same as the actual code disc size.

[0045] In a specific implementation, the code disc information includes a dynamic video of the code disc, and different rotating speeds of the code disc are simulated by changing the playing speed of the dynamic video.

[0046] In specific implementation, the code disc information is stored in the database according to the code disc number, and the chip corresponds to the code disc information.

[0047] In specific implementation, the TFT display module is arranged between the light source and the light sensing area.

[0048] Figure 2 A structural schematic diagram of a testing device for an optoelectronic encoder chip is provided for an embodiment of the present application, Figure 3 A structural schematic diagram of a testing device for an optoelectronic encoder chip is provided for another embodiment of the present application. Now referring to Figure 2 and Figure 3 An embodiment of the present application further provides a testing device for an optoelectronic encoder chip, comprising:

[0049] A code disc information acquisition module 21 is configured to acquire code disc information on a TFT display module matched with the chip;

[0050] A brightness adjustment module 22 is configured to adjust the brightness of backlight and simulate LEDs with different brightness.

[0051] A static test module 23 is configured to perform static test of the chip when the code disc information matched with the chip is a static picture.

[0052] A dynamic test module 24 is configured to perform dynamic test of the chip when the code disc information matched with the chip is a dynamic video.

[0053] In specific implementation, the probe 13 is arranged in the test seat and connected to the PAD disc 111 of the test chip 11 to acquire photoelectric current, and the light source 14 is arranged directly above the light sensing area 112 of the test chip 11. During testing, the current of the light source 14 is adjusted to change the light intensity of the light irradiated to the light sensing area 112, and the photoelectric current of the light sensing area 112 under different light intensities is acquired, and the TFT display module 12 is arranged between the light source 14 and the light sensing area 112.

[0054] In summary, the testing method and device for an optoelectronic encoder chip provided by the embodiments of the present application, the method comprising: acquiring code disc information on a TFT display module matched with the chip; adjusting the brightness of backlight and simulating LEDs with different brightness; performing static test of the chip when the code disc information matched with the chip is a static picture; and performing dynamic test of the chip when the code disc information matched with the chip is a dynamic video. The TFT display module is arranged to perform static test and dynamic test of the chip, thereby improving the efficiency of chip testing.

[0055] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A testing method for photoelectric encoder chips, characterized in that, Includes the following steps: A light source is positioned directly above the photosensitive area of ​​the chip under test. A TFT display module is positioned between the light source and the photosensitive area. The TFT display module is electrically connected to a control module. The control module controls the TFT display module to simulate different code disks based on the position and shape of the photosensitive area. The control module acquires the code disk information on the TFT display module that matches the chip under test. Adjust the backlight brightness of the light source to simulate LEDs of different brightness; When the code disk information matching the chip under test is a static image, a static chip test is performed. When the code disk information matching the chip under test is dynamic video, dynamic chip testing is performed. The control module automatically and dynamically adjusts the light transmission position of the TFT display module. The chip under test is provided with a first alignment mark, and the image on the code disk of the TFT display module is provided with a second alignment mark. When the current / voltage signal output by the chip under test reaches its maximum value, the second alignment mark and the first alignment mark completely coincide.

2. The testing method for photoelectric encoder chips according to claim 1, characterized in that, The control module is an MCU or a computer.

3. The testing method for photoelectric encoder chips according to claim 1, characterized in that, When the chip under test is replaced, the control module updates the code disk information of the TFT display module.

4. The testing method for photoelectric encoder chips according to claim 1, characterized in that, The TFT display module is also used to simulate the rotation of the code disk.

5. The testing method for photoelectric encoder chips according to claim 1, characterized in that, The code disk information includes a static image of the code disk, which is in black and white format, and the size of the static image on the TFT display module is the same as the actual code disk size.

6. The testing method for photoelectric encoder chips according to claim 1, characterized in that, The encoder information includes a dynamic video of the encoder, and different rotation speeds of the encoder are simulated by changing the playback speed of the dynamic video.

7. The testing method for photoelectric encoder chips according to claim 1, characterized in that, The code disk information is stored in the database according to the code disk number, and the chip under test corresponds one-to-one with the code disk information.

8. A testing device for photoelectric encoder chips, characterized in that, include: The light source is positioned directly above the photosensitive area of ​​the chip under test, and the TFT display module is positioned between the light source and the photosensitive area. The TFT display module is electrically connected to the control module, and the control module controls the TFT display module to simulate different code disks according to the position and shape of the photosensitive area. The code disk information acquisition module is used to acquire the code disk information on the TFT display module that matches the chip under test; A brightness adjustment module is used to adjust the backlight brightness of the light source to simulate LEDs of different brightness. The static testing module is used to perform static testing on the chip when the code disk information matching the chip under test is a static image. The dynamic testing module is used to perform dynamic testing of the chip when the code disk information matching the chip under test is dynamic video. The control module automatically and dynamically adjusts the light transmission position of the TFT display module. The chip under test is provided with a first alignment mark, and the image on the code disk of the TFT display module is provided with a second alignment mark. When the current / voltage signal output by the chip under test reaches its maximum value, the second alignment mark and the first alignment mark completely coincide.

Images