Protective plate structure for vehicle-mounted circuit board and manufacturing method thereof

Abstract

The application provides a manufacturing method of a protection plate structure for a vehicle-mounted circuit board, comprising the following steps: providing a substrate, wherein the substrate comprises a first elastic layer and a copper foil layer arranged on the first elastic layer; etching the copper foil layer to form a conductive circuit layer, thereby obtaining a protection substrate; punching the protection substrate to form a through hole in the protection substrate and a first micro-connection structure in the first elastic layer; and forming a nickel sheet on a surface of the circuit board away from the first elastic layer, and electrically connecting the nickel sheet and the conductive circuit layer, thereby obtaining the protection plate structure. The protection plate structure has a long service life and high reliability. The application also provides a protection plate structure for a vehicle-mounted circuit board manufactured by the method.

Description

Technical Field

[0001] This application relates to the field of circuit boards, and more particularly to a protective board structure for automotive circuit boards and a method for manufacturing the same. Background Technology

[0002] In today's context of advocating global environmental protection and the global trend towards carbon neutrality, the new energy vehicle industry has become the development direction and goal of the future automotive industry. To ensure the proper functioning of battery modules in new energy vehicles, the vehicle management system needs to monitor the battery modules in real time and collect signals such as voltage and temperature of each cell to evaluate their performance. Flexible printed circuit boards (FPCs), due to their high energy, high power, and high energy density characteristics, are gradually replacing traditional wiring harness designs.

[0003] However, due to the complex operating conditions of vehicles, the FPC protection board used in battery modules often bulges due to wear and tear after long-term use, which pulls on the FPC protection board. Alternatively, the battery module may pull on the FPC protection board due to long-term harsh operating conditions (such as vibration), which reduces the service life and reliability of the FPC protection board. Summary of the Invention

[0004] In view of this, this application provides a method for manufacturing a protective board structure for automotive circuit boards that has both high service life and high reliability.

[0005] Additionally, it is necessary to provide a protective board structure for automotive circuit boards manufactured using the above method.

[0006] One embodiment of this application provides a method for manufacturing a protective board structure for an automotive circuit board, comprising:

[0007] A substrate, the substrate comprising a first elastic layer and a copper foil layer disposed on the first elastic layer;

[0008] The copper foil layer is etched to form a conductive circuit layer, thereby obtaining a protective substrate;

[0009] The protective substrate is punched to form through-holes and a first micro-connection structure in the first elastic layer; and

[0010] A nickel sheet is formed on the surface of the circuit board away from the first elastic layer, and the nickel sheet is electrically connected to the conductive circuit layer to obtain the protection board structure.

[0011] One embodiment of this application also provides a protective board structure for automotive circuit boards, comprising:

[0012] The circuit board includes a conductive circuit layer;

[0013] A first elastic layer, located on one side of the circuit board, wherein a first micro-connection structure is provided in the first elastic layer; and

[0014] A nickel sheet is located on the surface of the circuit board away from the first elastic layer, and the nickel sheet is electrically connected to the conductive circuit layer;

[0015] The protective plate structure includes through holes.

[0016] This application forms a first elastic layer on the circuit board. Because the first elastic layer has a certain degree of elasticity, it can deform under external force and return to its original shape after the external force is removed. This reduces the tension between the protection board structure and the battery module under harsh operating conditions, thereby improving the service life and reliability of the protection board structure. Furthermore, this application also provides a first micro-connection structure in the first elastic layer. Since the first micro-connection structure can deform in six directions (i.e., up, down, left, right, front, and back), and can also deform in any direction in three-dimensional space, it helps to improve the stability and reliability of the protection board structure. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view of the copper foil layer provided in the first embodiment of this application.

[0018] Figure 2 Is Figure 1 The cross-sectional view shown is taken after the first elastic layer is formed on the copper foil layer.

[0019] Figure 3 It is Figure 2 The cross-sectional view shown is of the copper foil layer after etching.

[0020] Figure 4 Is Figure 3 The diagram shows a cross-sectional view of a circuit board with a second elastic layer formed therein and receiving holes made therein.

[0021] Figure 5 yes Figure 4 The top view of the protective substrate shown.

[0022] Figure 6 It is Figure 4 The diagram shows a cross-sectional view of the protective plate structure obtained after punching the protective substrate, placing nickel sheets in the receiving holes, and mounting a reinforcing plate on the first elastic layer.

[0023] Figure 7 yes Figure 6 The top view of the protective plate structure shown.

[0024] Figure 8 This is a cross-sectional view of the copper foil layer provided in the second embodiment of this application.

[0025] Figure 9 Is Figure 8 The cross-sectional view shown is taken after the first elastic layer is formed on the copper foil layer.

[0026] Figure 10 It is Figure 9 The cross-sectional view shown is of the copper foil layer after etching.

[0027] Figure 11 Is Figure 10 The diagram shows a protective layer formed on the circuit board, with receiving holes and slots made in the protective layer.

[0028] Figure 12 yes Figure 11 The top view of the protective substrate shown.

[0029] Figure 13 It is Figure 12 The diagram shows a cross-sectional view of the protective plate structure obtained after punching the protective substrate, placing nickel sheets in the receiving holes, and mounting a reinforcing plate on the first elastic layer.

[0030] Figure 14 yes Figure 13 The top view of the protective plate structure shown.

[0031] Figure 15 This is a cross-sectional view of the circuit board, the second adhesive layer, and the insulating layer provided in the third embodiment of this application.

[0032] Figure 16 Is Figure 15 The diagram shows a cross-sectional view of a circuit board with a protective layer formed and receiving holes made in the protective layer.

[0033] Figure 17 Is Figure 16 The cross-sectional view shown is obtained after an opening has been made in the protective layer.

[0034] Figure 18 Is Figure 17 The diagram shows a cross-sectional view after a first elastic layer is formed on an insulating layer and a second elastic layer is formed on a protective layer.

[0035] Figure 19 It is Figure 18 The diagram shows a cross-sectional view of the protective plate structure obtained after punching the protective substrate, placing nickel sheets in the receiving holes, and mounting reinforcing plates onto the insulating layer.

[0036] Figure 20 yes Figure 19 The top view of the protective plate structure shown.

[0037] Figure 21This is a top view of the protective plate structure provided in the fourth embodiment of this application.

[0038] Explanation of main component symbols

[0039] Protective plate structures 100, 200, 300, 400

[0040] Copper foil layers 10 and 11

[0041] First elastic layer 20, 21

[0042] Substrate 23, 24

[0043] First micro-connection structure 211

[0044] Conductive circuit layers 30, 32, 35

[0045] Solder pads 301, 321, 351

[0046] Circuit boards 31, 33, 34

[0047] Second elastic layer 40, 45, 46

[0048] Reception ports 401, 411, 441

[0049] Second micro-connection structures 402, 451, 461

[0050] Protective layers 41, 44

[0051] 412 slotting

[0052] Adhesive layers 413, 443

[0053] Protective film 414, 444

[0054] Second adhesive layer 42

[0055] Insulation layer 43

[0056] Opening 442

[0057] Protective substrates 50, 51, 52

[0058] Through holes 501, 511, 521

[0059] Nickel sheets 60, 61, 62

[0060] Conductive paste 70, 71, 72

[0061] Reinforcing plates 80, 81, 82

[0062] First adhesive layer 90, 91, 92

[0063] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0064] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0065] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0066] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0067] The first embodiment of this application provides a method for manufacturing a protective board structure for an automotive circuit board, comprising the following steps:

[0068] Step S11, please refer to Figure 1 Provides a copper foil layer of 10.

[0069] Step S12, please refer to Figure 2 A first elastic layer 20 is formed on the copper foil layer 10 to obtain a substrate 23.

[0070] In this embodiment, the first elastic layer 20 is made of polymethyl methacrylate (PMMA), polyurethane (PU), or thermoplastic polyolefin (TPO).

[0071] Step S13, please refer to Figure 3 The copper foil layer 10 is etched to form a conductive circuit layer 30, resulting in a circuit board 31.

[0072] It is understood that in this embodiment, the circuit board 31 is a single-layer circuit board. That is, the circuit board 31 only includes the conductive line layer 30.

[0073] In this embodiment, the conductive line layer 30 can be formed by exposure and development.

[0074] Step S14, please refer to Figure 4 and Figure 5 A second elastic layer 40 is formed on the other side of the circuit board 31.

[0075] The second elastic layer 40 and the first elastic layer 20 are connected through the gaps (not shown) in the conductive circuit layer 30.

[0076] In this embodiment, the material of the second elastic layer 40 is the same as that of the first elastic layer 20. For details, please refer to the material of the first elastic layer 20, which will not be described in detail here.

[0077] Step S15: A receiving hole 401 is formed in the second elastic layer 40 to form a protective substrate 50.

[0078] In this process, a portion of the conductive line layer 30 is exposed to the receiving hole 401 to form a solder pad 301.

[0079] Step S16, please refer to Figure 7 and Figure 6 The protective substrate 50 is punched to form a through hole 501 in the protective substrate 50, and a second micro-connection structure 402 and a first micro-connection structure (not shown) are formed in the second elastic layer 40 and the first elastic layer 20, respectively.

[0080] The through hole 501 sequentially penetrates the second elastic layer 40, the circuit board 31, and the first elastic layer 20.

[0081] Step S17: The nickel sheet 60 is placed in the receiving hole 401 using conductive paste 70.

[0082] The nickel sheet 60 is electrically connected to the solder pad 301 via the conductive paste 70, thereby electrically connecting the nickel sheet 60 to the conductive circuit layer 30. In this embodiment, the conductive paste 70 may be solder paste.

[0083] In step S18, the reinforcing plate 80 is installed on the first elastic layer 20 through the first adhesive layer 90, thereby obtaining the protective plate structure 100.

[0084] The reinforcing plate 80 and the nickel sheet 60 are positioned opposite each other to improve the stability of the nickel sheet 60, thereby improving the stability of the protective plate structure 100. In this embodiment, the reinforcing plate 80 may be a steel sheet.

[0085] The second embodiment of this application provides a method for manufacturing a protective board structure for an automotive circuit board, comprising the following steps:

[0086] Step S21, please refer to Figure 8 Provides copper foil layer 11.

[0087] Step S22, please refer to Figure 9 A first elastic layer 21 is formed on the copper foil layer 11 to obtain a substrate 24.

[0088] In this embodiment, the first elastic layer 21 is made of polymethyl methacrylate (PMMA), polyurethane (PU), or thermoplastic polyolefin (TPO).

[0089] Step S23, please refer to Figure 10 The copper foil layer 11 is etched to form a conductive circuit layer 32, resulting in a circuit board 33.

[0090] It is understood that in this embodiment, the circuit board 33 is a single-layer circuit board. That is, the circuit board 33 only includes the conductive line layer 32.

[0091] In this embodiment, the conductive line layer 32 can be formed by exposure and development.

[0092] Step S24, please refer to Figure 11 and Figure 12 A protective layer 41 is formed on the circuit board 33.

[0093] In this embodiment, the protective layer 41 is a cover film (CVL). The protective layer 41 includes an adhesive layer 413 and a protective film 414 sequentially disposed on the conductive circuit layer 32.

[0094] Step S25: A receiving hole 411 and a slot 412 are formed in the protective layer 41 to form a protective substrate 51.

[0095] In this configuration, a portion of the conductive circuit layer 32 is exposed through the receiving hole 411 to form a solder pad 321. The slot 412 penetrates sequentially through the protective layer 41 and the conductive circuit layer 32, and a portion of the first elastic layer 21 is exposed through the slot 412.

[0096] In this embodiment, both the receiving hole 411 and the slot 412 can be formed by laser drilling.

[0097] Step S26, please refer to Figure 13 and Figure 14 The protective substrate 51 is punched to form a through hole 511 in the protective substrate 51 and a first micro-connection structure 211 in the first elastic layer 21.

[0098] Step S27: The nickel sheet 61 is placed in the receiving hole 411 using conductive paste 71.

[0099] The nickel sheet 61 is electrically connected to the solder pad 321 via the conductive paste 71, thereby electrically connecting the nickel sheet 61 to the conductive circuit layer 32. In this embodiment, the conductive paste 71 can be solder paste.

[0100] In step S28, the reinforcing plate 81 is installed on the first elastic layer 21 through the first adhesive layer 91, thereby obtaining the protective plate structure 200.

[0101] The reinforcing plate 81 and the nickel sheet 61 are positioned opposite each other to improve the stability of the nickel sheet 61, thereby improving the stability of the protective plate structure 200. In this embodiment, the reinforcing plate 81 may be a steel sheet.

[0102] The third embodiment of this application provides a method for manufacturing a protective board structure for an automotive circuit board, comprising the following steps:

[0103] Step S31, please refer to Figure 15 , and provide circuit board 34.

[0104] In this embodiment, the circuit board 34 includes a conductive circuit layer 35. That is, the circuit board 34 is a single-layer circuit board.

[0105] In step S32, a second adhesive layer 42 and an insulating layer 43 are sequentially formed on one side of the circuit board 34.

[0106] The insulating layer 43 can be made of one of the following resins: epoxy resin, polypropylene (PP), BT resin, polyphenylene oxyether (PPO), polyimide (PI), polyethylene terephthalate (PET), butadiene styrene copolymer (BS), and polyethylene naphthalate (PEN). In this embodiment, the insulating layer 43 is made of polypropylene.

[0107] Step S33, please refer to Figure 16 A protective layer 44 is formed on the other side of the circuit board 34.

[0108] In this embodiment, the protective layer 44 is a cover film (CVL). The protective layer 44 includes an adhesive layer 443 and a protective film 444 sequentially disposed on the conductive circuit layer 35.

[0109] Step S34: A receiving hole 441 is opened in the protective layer 44.

[0110] In this embodiment, a portion of the conductive circuit layer 35 is exposed through the receiving hole 441 to form a solder pad 351. The receiving hole 441 can be formed by laser drilling.

[0111] Step S35, please refer to Figure 17 An opening 442 is made in the protective layer 44.

[0112] The opening 442 sequentially penetrates the protective layer 44, the circuit board 34, the second adhesive layer 42, and the insulating layer 43.

[0113] In this embodiment, the opening 442 can be formed by laser drilling.

[0114] Step S36, please refer to Figure 18 A first elastic layer 22 is formed on the insulating layer 43 and covers one end of the opening 442, and a second elastic layer 45 is formed on the protective layer 44 and covers the other end of the opening 442, thereby obtaining a protective substrate 52.

[0115] In this embodiment, the materials of the first elastic layer 22 and the second elastic layer 45 can both be polymethyl methacrylate (PMMA), polyurethane (PU), or thermoplastic polyolefin (TPO).

[0116] Step S37, please refer to Figure 19 and Figure 20 The protective substrate 52 is punched to form a through hole 521 in the protective substrate 52, and a second micro-connection structure 451 and a first micro-connection structure (not shown) are formed in the second elastic layer 45 and the first elastic layer 22, respectively.

[0117] Step S38: The nickel sheet 62 is placed in the receiving hole 441 using conductive paste 72.

[0118] The nickel sheet 62 is electrically connected to the solder pad 351 via the conductive paste 72, thereby electrically connecting the nickel sheet 62 to the conductive circuit layer 35. In this embodiment, the conductive paste 72 can be solder paste.

[0119] In step S39, the reinforcing plate 82 is installed on the insulating layer 43 through the first adhesive layer 92, thereby obtaining the protective plate structure 300.

[0120] The reinforcing plate 82 and the nickel sheet 62 are positioned opposite each other to improve the stability of the nickel sheet 62, thereby improving the stability of the protective plate structure 300. In this embodiment, the reinforcing plate 82 may be a steel sheet.

[0121] Please see Figure 21The fourth embodiment of this application provides a method for manufacturing a protective board structure for an automotive circuit board. The difference between the manufacturing method provided in the fourth embodiment and the manufacturing method provided in the third embodiment is that in step S37, the protective substrate 52 is punched to form a second micro-connection structure 461 in the second elastic layer 46, and finally the protective board structure 400 is obtained.

[0122] Please see Figure 6 and Figure 7 The first embodiment of this application also provides a protective board structure 100 for vehicle circuit boards, including a circuit board 31, a first elastic layer 20, a second elastic layer 40, a nickel sheet 60, and a reinforcing plate 80.

[0123] In this embodiment, the circuit board 31 is a single-layer circuit board. That is, the circuit board 31 only includes a conductive line layer 30.

[0124] The first elastic layer 20 is located on one side of the circuit board 31. In this embodiment, the first elastic layer 20 is made of polymethyl methacrylate (PMMA), polyurethane (PU), or thermoplastic polyolefin (TPO). The first elastic layer 20 contains a first micro-connection structure (not shown).

[0125] The second elastic layer 40 is located on the other side of the circuit board 31. The second elastic layer 40 and the first elastic layer 20 are connected through a gap (not shown) in the conductive circuit layer 30. In this embodiment, the material of the second elastic layer 40 is the same as that of the first elastic layer 20; details can be found by referring to the material of the first elastic layer 20, and will not be described further here. The second elastic layer 40 contains a second micro-connection structure 402.

[0126] The second elastic layer 40 has a receiving hole 401. A portion of the conductive line layer 30 is exposed in the receiving hole 401 to form a solder pad 301.

[0127] The protective board structure 100 is provided with a through hole 501. The through hole 501 passes through the second elastic layer 40, the circuit board 31 and the first elastic layer 20 in sequence.

[0128] The nickel sheet 60 is disposed on the receiving hole 401 via conductive paste 70. The nickel sheet 60 is electrically connected to the solder pad 301 via the conductive paste 70, thereby electrically connecting the nickel sheet 60 to the conductive circuit layer 30. In this embodiment, the conductive paste 70 may be solder paste.

[0129] The reinforcing plate 80 is mounted on the first elastic layer 20 via a first adhesive layer 90. The reinforcing plate 80 and the nickel sheet 60 are positioned opposite each other to improve the stability of the nickel sheet 60, thereby enhancing the stability of the protective plate structure 100. In this embodiment, the reinforcing plate 80 may be a steel sheet.

[0130] Please see Figure 13 and Figure 14 The second embodiment of this application also provides a protective board structure 200 for vehicle circuit boards, including a circuit board 33, a first elastic layer 21, a protective layer 41, a nickel sheet 61, and a reinforcing plate 81.

[0131] In this embodiment, the circuit board 33 is a single-layer circuit board. That is, the circuit board 33 only includes the conductive line layer 32.

[0132] The first elastic layer 21 is located on one side of the circuit board 33. In this embodiment, the first elastic layer 21 is made of polymethyl methacrylate (PMMA), polyurethane (PU), or thermoplastic polyolefin (TPO). The first elastic layer 21 contains a first micro-connection structure 211.

[0133] The protective layer 41 is located on the other side of the circuit board 33. In this embodiment, the protective layer 41 is a cover film (CVL). The protective layer 41 includes an adhesive layer (not shown) and a protective film (not shown) sequentially disposed on the conductive circuit layer 32.

[0134] The protective layer 41 has a receiving hole 411 and a slot 412. A portion of the conductive circuit layer 32 is exposed through the receiving hole 411 to form a solder pad 321. The slot 412 passes through the protective layer 41 and the conductive circuit layer 32 in sequence, and a portion of the first elastic layer 21 is exposed through the slot 412.

[0135] The protective plate structure 200 is provided with a through hole 511. The through hole 511 passes through the protective layer 41, the circuit board 33 and the first elastic layer 21 in sequence.

[0136] The nickel sheet 61 is disposed on the receiving hole 411 via conductive paste 71. The nickel sheet 61 is electrically connected to the solder pad 321 via the conductive paste 71, thereby electrically connecting the nickel sheet 61 to the conductive circuit layer 32. In this embodiment, the conductive paste 71 may be solder paste.

[0137] The reinforcing plate 81 is mounted on the first elastic layer 21 via a first adhesive layer 91. The reinforcing plate 81 and the nickel sheet 61 are positioned opposite each other to improve the stability of the nickel sheet 61, thereby enhancing the stability of the protective plate structure 200. In this embodiment, the reinforcing plate 81 may be a steel sheet.

[0138] Please see Figure 19 and Figure 20 The third embodiment of this application also provides a protective board structure 300 for vehicle circuit boards, including a circuit board 34, an insulating layer 43, a protective layer 44, a first elastic layer 22, a second elastic layer 45, a nickel sheet 62, and a reinforcing plate 82.

[0139] In this embodiment, the circuit board 34 includes a conductive circuit layer 35. That is, the circuit board 34 is a single-layer circuit board.

[0140] The insulating layer 43 is disposed on one side of the circuit board 34 via the second adhesive layer 42. The insulating layer 43 can be made of one of the following resins: epoxy resin, polypropylene (PP), BT resin, polyphenylene oxyether (PPO), polyimide (PI), polyethylene terephthalate (PET), butadiene styrene copolymer (BS), and polyethylene naphthalate (PEN). In this embodiment, the insulating layer 43 is made of polypropylene.

[0141] The protective layer 44 is located on the other side of the circuit board 34. In this embodiment, the protective layer 44 is a cover film (CVL). The protective layer 44 includes an adhesive layer (not shown) and a protective film (not shown) sequentially disposed on the conductive circuit layer 35. The protective layer 44 has a receiving hole 441 and an opening 442. A portion of the conductive circuit layer 35 is exposed through the receiving hole 441 to form a solder pad 351. The opening 442 sequentially penetrates the protective layer 44, the circuit board 34, the second adhesive layer 42, and the insulating layer 43.

[0142] The first elastic layer 22 is located on the insulating layer 43. The first elastic layer 22 covers one end of the opening 442. In this embodiment, the first elastic layer 22 may be made of polymethyl methacrylate (PMMA), polyurethane (PU), or thermoplastic polyolefin (TPO). The first elastic layer 22 contains a first micro-connection structure (not shown).

[0143] The second elastic layer 45 is located on the protective layer 44. The second elastic layer 45 covers the other end of the opening 442. In this embodiment, the material of the second elastic layer 45 is the same as that of the first elastic layer 22; for details, please refer to the material of the first elastic layer 22, which will not be described further here. The second elastic layer 45 contains a second micro-connection structure 451.

[0144] The protective board structure 300 has a through hole 521. The through hole 521 passes through the protective layer 44, the circuit board 34 and the first elastic layer 22 in sequence.

[0145] The nickel sheet 62 is disposed on the receiving hole 441 via conductive paste 72. The nickel sheet 62 is electrically connected to the solder pad 351 via the conductive paste 72, thereby electrically connecting the nickel sheet 62 to the conductive circuit layer 35. In this embodiment, the conductive paste 72 may be solder paste.

[0146] The reinforcing plate 82 is mounted on the insulating layer 43 via a first adhesive layer 92. The reinforcing plate 82 and the nickel sheet 62 are positioned opposite each other to improve the stability of the nickel sheet 62, thereby enhancing the stability of the protective plate structure 300. In this embodiment, the reinforcing plate 82 may be a steel sheet.

[0147] Please see Figure 21 The fourth embodiment of this application also provides a protection board structure 400 for vehicle circuit boards. The difference between the protection board structure 400 provided in the fourth embodiment and the protection board structure 300 provided in the third embodiment is that the second elastic layer 46 is provided with two second micro-connection structures 461, and the two second micro-connection structures are spaced apart.

[0148] This application forms a first elastic layer 20 on the circuit board 31. Because the first elastic layer 20 has a certain degree of elasticity, it can deform under external force and return to its original shape after the external force is removed. This reduces the tension between the protection board structure 100 and the battery module under harsh operating conditions, thereby improving the service life and reliability of the protection board structure 100. Furthermore, this application also provides a first micro-connection structure and a second micro-connection structure 402 in the first elastic layer 20 and the second elastic layer 40, respectively. Since both the first micro-connection structure and the second micro-connection structure 402 can deform in six directions (i.e., up, down, left, right, front, and back), and can also deform in any direction in three-dimensional space, this helps to improve the stability and reliability of the protection board structure 100.

[0149] The above description is merely an optimized implementation of this application, but in actual applications, it should not be limited to this implementation.

Claims

1. A method for manufacturing a protective board structure for automotive circuit boards, characterized in that, include: A substrate is provided, the substrate comprising a first elastic layer and a copper foil layer disposed on the first elastic layer; The copper foil layer is etched to form a conductive circuit layer, resulting in a circuit board; A second elastic layer is formed on the other side of the circuit board; A receiving hole is formed in the second elastic layer to obtain a protective substrate, wherein a portion of the conductive line layer is exposed in the receiving hole to form a solder pad; The protective substrate is punched to form through holes in the protective substrate, and to form a first micro-connection structure in the first elastic layer and a second micro-connection structure in the second elastic layer; as well as A nickel sheet is formed on the surface of the circuit board away from the first elastic layer, and the nickel sheet is disposed in the receiving hole and electrically connected to the solder pad, so that the nickel sheet and the conductive circuit layer are electrically connected, thereby obtaining the protection board structure.

2. A method for manufacturing a protective board structure for automotive circuit boards, characterized in that, include: A circuit board is provided, the circuit board including a conductive circuit layer; An insulating layer is formed on one side of the circuit board; A protective layer is formed on the other side of the circuit board, and a receiving hole is formed in the protective layer, with a portion of the conductive circuit layer exposed to the receiving hole to form a solder pad; An opening is made in the protective layer, and the opening sequentially penetrates the protective layer, the circuit board, and the insulating layer; A first elastic layer is formed on the insulating layer, and the first elastic layer covers one end of the opening; A second elastic layer is formed on the protective layer, and the second elastic layer covers the other end of the opening to obtain a protective substrate; The protective substrate is punched to form through holes in the protective substrate, and to form a first micro-connection structure in the first elastic layer and a second micro-connection structure in the second elastic layer; as well as A nickel sheet is formed on the surface of the circuit board away from the first elastic layer, and the nickel sheet is disposed in the receiving hole and electrically connected to the solder pad, so that the nickel sheet and the conductive circuit layer are electrically connected, thereby obtaining the protection board structure.

3. The method for manufacturing the protective plate structure as described in claim 1 or 2, characterized in that, After forming the nickel sheet, the manufacturing method further includes: A reinforcing plate is formed on the side of the circuit board away from the nickel sheet, and the reinforcing plate and the nickel sheet are positioned opposite each other.

4. A protective board structure for automotive circuit boards, characterized in that, include: The circuit board includes a conductive circuit layer; A first elastic layer is located on one side of the circuit board, and a first micro-connection structure is provided in the first elastic layer; A second elastic layer, located on the other side of the circuit board, is provided with receiving holes and a second micro-connection structure, wherein a portion of the conductive circuit layer is exposed through the receiving holes to form solder pads; and A nickel sheet is located on the surface of the circuit board away from the first elastic layer. The nickel sheet is disposed in the receiving hole and electrically connected to the solder pad, so that the nickel sheet and the conductive circuit layer are electrically connected. The protective plate structure includes through holes.

5. A protective board structure for automotive circuit boards, characterized in that, include: The circuit board includes a conductive circuit layer; An insulating layer is located on one side of the circuit board; A protective layer is located on the other side of the circuit board. The protective layer has a receiving hole and an opening. A portion of the conductive circuit layer is exposed through the receiving hole to form a solder pad. The opening sequentially penetrates the protective layer, the circuit board, and the insulating layer. A first elastic layer is located on the insulating layer and covers one end of the opening, and a first micro-connection structure is provided in the first elastic layer; A second elastic layer is located on the protective layer and covers the other end of the opening, and a second micro-connection structure is provided in the second elastic layer; as well as A nickel sheet is located on the surface of the circuit board away from the first elastic layer. The nickel sheet is disposed in the receiving hole and electrically connected to the solder pad, so that the nickel sheet and the conductive circuit layer are electrically connected. The protective plate structure includes through holes.

6. The protective plate structure as described in claim 4 or 5, characterized in that, Also includes: A reinforcing plate is located on the side of the circuit board away from the nickel sheet, and the reinforcing plate and the nickel sheet are opposite each other.

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