Packaging box for over-ear headphones

Abstract

This invention relates to the field of electronic device packaging technology, and discloses a packaging box for over-ear headphones. The over-ear headphones include two earcups and a headband connecting the two earcups. The packaging box for the over-ear headphones includes an inner box and an outer box. The inner box includes an inner box body and an inner box lid. The inner box lid can be fastened to at least a portion of the inner box body to form an internal cavity. The inner box body is used to house the over-ear headphones, and the earcups are placed within the internal cavity. The outer box includes an outer box body and an outer box lid. The outer box lid can be fastened to the outer box body to form an outer internal cavity. The outer internal cavity is used to house the inner box. A buffer step is provided on the inner side of the outer box body, and the inner box is placed on the buffer step, so that a buffer cavity is formed between the outer bottom of the inner box body and the inner bottom of the outer box body. This invention provides better shock absorption and increases the mystery of opening the box, enhancing the user's enjoyment of unpacking.

Description

Technical Field

[0001] This invention relates to the field of electronic device packaging technology, and more particularly to a packaging box for headphones. Background Technology

[0002] Over-ear headphones are headphones that are worn on the head and not inserted into the ear canal. They have a good soundstage, are comfortable, and can avoid chafing the ear canal. The sound quality is very good in the high, mid and low frequencies, and even when playing symphonies, the sound is good. The mid-range volume is relatively rich, and the vocals in pop songs are very engaging.

[0003] Currently, retail packaging for headphones typically uses boxes. However, existing packaging boxes offer limited shock absorption, posing a risk of damage to headphones. Furthermore, most boxes reveal the overall structure of the headphones immediately upon opening, reducing the user's enjoyment of unpacking and negatively impacting the overall experience.

[0004] Therefore, there is an urgent need for a packaging box for over-ear headphones to solve the above problems. Summary of the Invention

[0005] Based on the above, the purpose of this invention is to provide a packaging box for over-ear headphones that has better shock absorption and increases the mystery of opening the box, thereby enhancing the user's enjoyment of unboxing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] The packaging box for over-ear headphones, the over-ear headphones including two earcups and a headband connecting the two earcups, the packaging box for the over-ear headphones including:

[0008] The inner box includes an inner box body and an inner box lid. The inner box lid can be fastened to at least a portion of the receiving area of ​​the inner box body to form a content cavity. The inner box body is used to receive over-ear headphones, and the earcups are placed inside the content cavity.

[0009] The outer box includes an outer box body and an outer box lid. The outer box lid can be fastened to the outer box body to form an outer receiving cavity. The outer receiving cavity is used to receive the inner box. A buffer step is provided on the inner side of the outer box body. The inner box is placed on the buffer step so that a buffer cavity is formed between the outer bottom of the inner box body and the inner bottom of the outer box body.

[0010] As a preferred embodiment of the packaging box for headphones, an avoidance cavity is provided on the inner side of the inner box body, away from the content cavity, and the headband abuts against the side wall of the avoidance cavity.

[0011] As a preferred embodiment of the packaging box for headphones, the side wall of the clearance cavity is provided with a clearance groove recessed in the clearance cavity on the side near the content cavity, and at least a portion of the headband is placed in the clearance groove.

[0012] As a preferred embodiment of the packaging box for headphones, the bottom wall of the inner box body is provided with a placement through hole. When the inner box is placed in the outer cavity, the placement through hole connects the inner cavity and the buffer cavity. The earcups are at least partially protruding from the placement through hole to be placed in the buffer cavity.

[0013] As a preferred option for the packaging of headphones, the inner box lid is provided with an operating hole that communicates with the contents cavity.

[0014] As a preferred option for the packaging of headphones, the cushioning step is integrally formed with the outer box body.

[0015] As a preferred embodiment of the packaging box for headphones, the cushioning step can be fastened to the side wall of the outer box body.

[0016] As a preferred embodiment of the packaging box for headphones, when the inner box is placed on the buffer step, the bottom wall of the inner box and the side wall of the buffer step are both perpendicular to each other.

[0017] As a preferred embodiment of the packaging box for headphones, the outer box lid is provided with a first earpiece, the first earpiece is provided with a second slot, the outer box body is provided with a first slot and a second earpiece, the first earpiece can be inserted into the first slot, and when the first earpiece is inserted into the first slot, the second earpiece can be inserted into the second slot; and / or, the bottom wall of the inner box body is provided with a third slot, the inner box lid is provided with a third earpiece, and the third earpiece can be placed in the third slot.

[0018] As a preferred embodiment of the packaging box for headphones, the outer box body and the outer box lid are integrally formed and are made of corrugated paper folding; and / or, the inner box body and the inner box lid are integrally formed and are made of corrugated paper folding.

[0019] The beneficial effects of this invention are as follows:

[0020] This invention, by designing an outer box and an inner box placed within an outer cavity, allows the headphones to be housed within the inner box, further enhancing the protection of the headphones. The inner box includes an inner box body and an inner box lid, forming an inner cavity between the inner box lid and the inner box body. This inner cavity is used to house the earcups, so that when the user opens the outer box lid, only the ear straps are visible, and the entire headphone is not directly visible. This creates a semi-hidden design, increasing the mystery of the unboxing experience and making the interior of the outer box appear cleaner. A buffer step is provided on the inner side of the outer box body, allowing the inner box to be placed on it. A buffer cavity is formed between the outer bottom of the inner box body and the inner bottom of the outer box body, providing cushioning for the headphones and effectively reducing damage. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the packaging box for the headphones provided in a specific embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the inner box of the packaging box for the headphones provided in a specific embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the outer box of the packaging box for the headphones provided in a specific embodiment of the present invention;

[0025] Figure 4 This is an unfolded schematic diagram of the inner box of the packaging box of the headphones provided in a specific embodiment of the present invention;

[0026] Figure 5 This is an unfolded schematic diagram of the outer box of the packaging box for the headphones provided in a specific embodiment of the present invention.

[0027] In the picture:

[0028] 100. Inner box; 110. Inner box body; 111. Clearance cavity; 112. Clearance groove; 113. Placement through hole; 114. Third slot; 120. Inner box cover; 121. Operation hole; 122. Third insert ear;

[0029] 200. Outer box; 210. Outer box body; 211. Buffer step; 212. First slot; 213. Second ear; 220. Outer box cover; 221. First ear; 222. Second slot; 223. Clip. Detailed Implementation

[0030] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0031] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0032] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0035] like Figures 1-3 As shown, this embodiment provides a packaging box for a pair of headphones. The headphones include two earcups and a headband connecting the two earcups. The packaging box for the headphones includes an inner box 100 and an outer box 200. The inner box 100 includes an inner box body 110 and an inner box lid 120. The inner box lid 120 can be fastened to at least a portion of the inner box body 110 to form an inner cavity. The inner box body 110 is used to accommodate the headphones, and the earcups are placed in the inner cavity. The outer box 200 includes an outer box body 210 and an outer box lid 220. The outer box lid 220 can be fastened to the outer box body 210 to form an outer cavity. The outer cavity is used to accommodate the inner box 100. A buffer step 211 is provided on the inner side of the outer box body 210. The inner box 100 is placed on the buffer step 211 so that a buffer cavity is formed between the outer bottom of the inner box body 110 and the inner bottom of the outer box body 210.

[0036] By designing an outer box 200 and an inner box 100 placed within the outer receiving cavity, the headphones can be housed within the inner box 100, further enhancing the protection of the headphones. The inner box 100 includes an inner box body 110 and an inner box lid 120. An inner receiving cavity is formed between the inner box lid 120 and the inner box body 110, which is used to house the earcups. This allows users to see only the ear straps when opening the outer box lid 220, preventing them from directly seeing the full appearance of the headphones. This semi-hidden design increases the mystery of the unboxing experience and makes the interior of the outer box body 210 appear neater. A buffer step 211 is provided on the inner side of the outer box body 210, allowing the inner box 100 to be placed on it. A buffer cavity is formed between the outer bottom of the inner box body 110 and the inner bottom of the outer box body 210. This buffer cavity provides cushioning for the headphones, effectively reducing damage.

[0037] In this embodiment, the outer box body 210 and the outer box lid 220 are integrally formed, and the inner box body 110 and the inner box lid 120 are integrally formed. This arrangement facilitates the fastening of the inner box lid 120 and the outer box lid 220, reduces the number of parts in the packaging box, and facilitates the production and assembly of the packaging box.

[0038] Furthermore, both the outer box 200 and the inner box 100 are formed by folding corrugated paper. Before folding, the corrugated paper has a flat structure, facilitating production, processing, and transportation. Simultaneously, using corrugated paper reduces the need for the existing method of using cushioning trays in conjunction with outer packaging boxes. It is understood that cushioning trays are primarily made of blister packs and pulp trays, both of which have certain drawbacks: blister packs are typically made of PVT / PS / PET, and the use of plastic is not environmentally friendly; pulp trays usually have additives added during the molding process, most of which are biodegradable, but still not environmentally friendly; additionally, they require mold forming, which is expensive, resulting in higher overall costs. Therefore, using corrugated paper packaging boxes can effectively reduce cost input while avoiding environmental harm, making it more economical and environmentally friendly. For example, considering the finished appearance of the packaging box, both the inner box 100 and the outer box 200 are made of 2mm thick corrugated paper.

[0039] As an optional packaging option for over-ear headphones, such as Figure 2 As shown, an abutment cavity 111 is provided on the inner side of the inner box body 110, away from the content cavity. By providing the abutment cavity 111, after the earcups are fixed in the content cavity, the headband can abut against the side wall of the abutment cavity 111, thus effectively cushioning the headphones. It is understood that the abutment cavity 111 is formed by folding corrugated cardboard, and there are various folding methods, which are not specifically limited here.

[0040] Furthermore, a relief groove 112 is provided recessed in the relief cavity 111 on the side wall near the inner cavity, and at least a portion of the headband is placed within the relief groove 112. By providing the relief groove 112, the headphones can be cushioned while the ear straps are positioned, thereby effectively reducing the shaking of the headphones within the inner housing 110. For example, the relief groove 112 can be formed by bending corrugated paper towards the relief cavity 111.

[0041] In this embodiment, the bottom wall of the inner box body 110 is provided with a placement through hole 113. When the inner box 100 is placed in the outer accommodating cavity, the placement through hole 113 connects the inner accommodating cavity and the buffer cavity. By providing the placement through hole 113, when the inner box 100 is placed in the outer accommodating cavity, the earmuffs at least partially protrude from the placement through hole 113 and are placed in the buffer cavity. This arrangement can effectively reduce the thickness of the inner box 100, utilize part of the space in the buffer cavity to accommodate larger earmuffs, and thus make the overall size of the packaging box smaller. It is understood that the part of the earmuff placed in the buffer cavity will not abut against the bottom wall of the outer box body 210, thus not affecting the cushioning effect of the buffer cavity, and the earmuffs are also easily damaged.

[0042] Preferably, the inner box lid 120 is provided with an operating hole 121 communicating with the content cavity. The operating hole 121 makes it easier for the user to open and close the inner box lid 120. For example, the operating hole 121 can be a large-diameter circular hole, or a through hole of other shapes, or multiple through holes of smaller diameters. Those skilled in the art can set it according to actual needs, and no specific limitation is made here.

[0043] Optionally, the bottom wall of the inner box body 110 is provided with a third slot 114, and the inner box cover 120 is provided with a third lug 122. When the inner box cover 120 is fastened to the inner box body 110, the third lug 122 can be placed in the third slot 114, making the connection between the inner box cover 120 and the inner box body 110 more reliable.

[0044] For example, such as Figure 4 The unfolded view of the inner box 100 shown depicts a planar corrugated cardboard structure with an inner box cover 120, a through hole 113, a third slot 114, an operating hole 121, a third lug 122, an upper plate 1110 and a side plate 1111 for forming a clearance cavity 111, and a bent portion 1112 provided on the side plate 1111 for forming a clearance groove 112. It is understood that those skilled in the art can [determine the appropriate configuration based on the provided text]. Figure 4 The planar structure shown is bent to form, as Figure 2 The inner box 100 shown, or, for forming as Figure 2 The inner box 100 shown can also be configured differently by those skilled in the art. Figure 4 The unfolded diagram shown can be bent to form the inner box 100, and no specific limitation is made here.

[0045] As an optional packaging option for over-ear headphones, such as Figure 3 As shown, the buffer step 211 is integrally formed with the outer box body 210. That is, the buffer step 211 is formed by cutting the corresponding shape from corrugated paper and bending it, which simplifies the processing procedure and also helps to ensure the stability of the connection between the buffer step 211 and the outer box body 210.

[0046] Specifically, the buffer step 211 can be fastened to the side wall of the outer box body 210. When the buffer step 211 is fastened to the side wall of the outer box body 210, it can effectively increase the space of the outer cavity. When the outer box 200 does not carry the inner box 100, it can be used to carry other items, which improves the usage scenarios of the packaging box and helps to improve resource utilization.

[0047] Furthermore, when the inner box 100 is placed on the buffer step 211, the bottom wall of the inner box 100 and the side wall of the buffer step 211 are both perpendicular. This arrangement makes the side wall of the buffer step 211 provide more stable and reliable support for the inner box 100, effectively preventing deformation of the buffer cavity caused by deformation of the buffer step 211, thereby ensuring the buffering effect on the inner box 100 and the headphones.

[0048] For example, four buffer steps 211 are provided, which are respectively located at the four corners of the outer box body 210 and are used to support the four corners of the inner box 100. This will not interfere with the earmuffs protruding from the buffer cavity, and the support is more stable, resulting in better buffering effect.

[0049] Preferably, to improve the reliability of the fastening between the outer box lid 220 and the outer box body 210, the outer box lid 220 is provided with a first earpiece 221, and a second slot 222 is provided on the first earpiece 221. The outer box body 210 is provided with a first slot 212 and a second earpiece 213. The first earpiece 221 can be inserted into the first slot 212. When the first earpiece 221 is inserted into the first slot 212, the second earpiece 213 can be inserted into the second slot 222. Through the arrangement of the two sets of earpieces and slots that cooperate with each other, the sealing reliability of the outer box 200 can be guaranteed, thereby providing more reliable protection for the headphones in the inner box 100.

[0050] Optionally, the edge of the outer box lid 220 is also provided with a latch 223. When the outer box lid 220 is fastened to the outer box body 210, the latch 223 can be engaged in the gap between the inner box 100 and the outer box body 210, or in the gap between the side wall of the outer box body 210, so as to ensure the sealing and reliability of the fastening connection between the outer box lid 220 and the outer box body 210.

[0051] For example, such as Figure 5 The unfolded view of the outer box 200 shown shows that the corrugated cardboard with a planar structure includes an outer box lid 220, a first lug 221, a second slot 222, a first slot 212, a second lug 213, and a bending area 2110 for forming a buffer step 211 (as shown). Figure 5 The area within the dashed line is defined, and four bending areas 2110 are provided to form four buffer steps 211 respectively. It is understood that those skilled in the art can, based on the following... Figure 5 The planar structure shown is bent to form, as Figure 3 The outer box 200 shown, or, for forming as Figure 3 The outer box 200 shown can also be configured differently by those skilled in the art. Figure 5 The unfolded diagram shown can be bent to form an outer box 200; no specific limitation is made here.

[0052] The packaging process of the aforementioned headphones is as follows: First, place the headphones on the inner box body 110, with the ear straps engaging with the clearance groove 112 and the earcups placed inside the inner cavity; bend the inner box lid 120 so that the third earbud 122 is placed inside the third slot 114; place the inner box 100 containing the headphones into the outer cavity so that the bottom surface of the inner box 100 abuts against the buffer step 211; bend the outer box lid 220 so that the first earbud 221 is placed inside the first slot 212, and then place the second earbud 213 inside the second slot 222 to complete the packaging of the headphones.

[0053] The opening process of the above-mentioned headphone packaging box is as follows: First, disconnect the second earbud 213 from the second slot 222, then disconnect the first earbud 221 from the first slot 212, and bend the outer box cover 220 to expose the inner box 100 and part of the headphone (ear strap part); at this time, the inner box 100 can be taken out from the outer cavity, or the inner box 100 can be taken out from the outer cavity, and the inner box cover 120 can be bent directly through the operation hole 121 to expose the complete structure of the headphone, so as to take out the headphone from the inner box body 110.

[0054] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.

Claims

1. A packaging box for over-ear headphones, the over-ear headphones comprising two earcups and a headband connecting the two earcups, characterized in that, include: The inner box (100) includes an inner box body (110) and an inner box cover (120). The inner box cover (120) can be fastened to at least a portion of the receiving area of ​​the inner box body (110) to form a content cavity. The inner box body (110) is used to receive a headset, and the earcups are placed in the content cavity. An avoidance cavity (111) is provided on the inner side of the inner box body (110) and on the side away from the content cavity. The headband abuts against the side wall of the avoidance cavity (111). The outer box (200) includes an outer box body (210) and an outer box lid (220). The outer box lid (220) can be fastened to the outer box body (210) to form an outer receiving cavity. The outer receiving cavity is used to receive the inner box (100). A buffer step (211) is provided on the inner side of the outer box body (210). The inner box (100) is placed on the buffer step (211) so that a buffer cavity is formed between the outer bottom of the inner box body (110) and the inner bottom of the outer box body (210). The buffer step (211) is provided with two side walls.

2. The packaging box for the headphones according to claim 1, characterized in that, The sidewall of the clearance cavity (111) near the content cavity is provided with a clearance groove (112) recessed in the clearance cavity (111), and at least a portion of the headband is placed in the clearance groove (112).

3. The packaging box for the headphones according to claim 1, characterized in that, The bottom wall of the inner box body (110) is provided with a placement through hole (113). When the inner box (100) is placed in the outer cavity, the placement through hole (113) connects the inner cavity and the buffer cavity. The earmuffs are at least partially protruding from the placement through hole (113) and placed in the buffer cavity.

4. The packaging box for the headphones according to claim 1, characterized in that, The inner box cover (120) is provided with an operation hole (121) that communicates with the content cavity.

5. The packaging box for the headphones according to claim 1, characterized in that, The buffer step (211) is integrally formed with the outer box body (210).

6. The packaging box for the headphones according to claim 1, characterized in that, The buffer step (211) can be fastened to the side wall of the outer box body (210).

7. The packaging box for the headphones according to claim 1, characterized in that, When the inner box (100) is placed on the buffer step (211), the bottom wall of the inner box (100) and the side wall of the buffer step (211) are both perpendicular to each other.

8. The packaging box for the headphones according to any one of claims 1-7, characterized in that, The outer box cover (220) is provided with a first insert (221), and the first insert (221) is provided with a second slot (222). The outer box body (210) is provided with a first slot (212) and a second insert (213). The first insert (221) can be inserted into the first slot (212). When the first insert (221) is inserted into the first slot (212), the second insert (213) can be inserted into the second slot (222). And / or, the bottom wall of the inner box body (110) is provided with a third slot (114), and the inner box cover (120) is provided with a third insert (122). The third insert (122) can be placed in the third slot (114).

9. The packaging box for the headphones according to any one of claims 1-7, characterized in that, The outer box body (210) and the outer box lid (220) are integrally formed and are made of corrugated paper folding; and / or, the inner box body (110) and the inner box lid (120) are integrally formed and are made of corrugated paper folding.

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