A centering and cushioning structure for cushioning the shaping die of a cushioning device and a cushioning method

Abstract

The application discloses a centering buffer structure and a buffer method for forming a buffer device, wherein a groove is arranged on a bending lower die structure, so that the buffer device is installed in the groove and sliding of the buffer device is avoided; a through hole is arranged on the groove, so that a lower support structure is installed in the through hole; under the action of an external bending upper die structure, the buffer device moves downward, so as to drive a disc to move downward and compress a spring; a rotating buffer sliding block is installed in the bending lower die cover; the rotating buffer sliding block cooperates with the disc to slide; a stress release path is provided through the rotating buffer sliding block; additional damage to a lead wire caused by a strong plastic forming process in a two-stage extrusion process is absorbed; mechanical performance of the lead wire material is ensured; and overpressure of the lead wire is avoided. Therefore, the buffer structure can solve the problem that a two-stage extrusion die tooling cannot provide a sufficient lead wire deformation stress release path due to the strong plastic forming process in the prior art, and overpressure of the lead wire is caused.

Description

Technical Field

[0001] This invention belongs to the field of electronic component safety and reliability technology, and relates to a centering buffer structure and buffering method for the forming mold of a buffer device. Background Technology

[0002] With the widespread adoption of two-stage extrusion die-casting, problems with the fixtures have become increasingly apparent, primarily in the following two aspects: Firstly, the tolerances for device shapes are wider, resulting in poorer dimensional consistency. If the fixture's dimensions are designed to accommodate the components within the lower limit of their shape tolerances, some components may not fit within the fixture. Secondly, if the fixture's dimensions are designed to accommodate the components within the upper limit of their shape tolerances, some components may become eccentric within the fixture, leading to inconsistent lead lengths on both sides after forming, thus preventing the formation of acceptable solder joints. Thirdly, the elastic modulus of the device lead materials is generally low. Due to the strong plastic forming process of two-stage extrusion die-casting, it cannot provide sufficient stress relief pathways for lead deformation, leading to over-pressure on the leads and ultimately, the formed dimensions failing to meet process requirements. Summary of the Invention

[0003] The purpose of this invention is to solve the problem that the existing two-stage extrusion die tooling cannot provide sufficient stress relief pathways for lead wire deformation due to its strong plastic forming process, which leads to lead wire overpressure. The invention provides a centering buffer structure and buffering method for the forming die of a buffer component.

[0004] To achieve the above objectives, the present invention employs the following technical solution:

[0005] This invention proposes a centering buffer structure for a fixed mold forming a buffer component, comprising a bending lower mold structure, a lower support structure, and a bending lower mold cover. The upper part of the bending lower mold structure is a U-shaped groove, and a through hole is formed in the center of the U-shaped groove. A buffer component is arranged inside the U-shaped groove. One end of the lower support structure passes through the through hole and is flush with the U-shaped groove, while the other end of the lower support structure is located on the lower bottom surface of the bending lower mold structure. A disk is provided below the support structure, and a spring is installed on the lower end face of the disk. The bending lower mold cover is located outside the bending lower mold structure and the lower support structure, and a rotating buffer slider that slides in cooperation with the disk is installed inside the bending lower mold cover.

[0006] Preferably, a buffer clamping structure is installed on the side wall of the U-shaped groove.

[0007] Preferably, the buffer clamping structure includes a toothed clamping structure, a primary rotating tooth, and a secondary rotating tooth;

[0008] The toothed clamping structure and the primary rotating tooth are positioned and connected by a primary connecting rod, and the toothed clamping structure and the secondary rotating tooth are positioned and connected by a secondary connecting rod; a primary ball bearing is installed between the toothed clamping structure and the primary rotating tooth, and a secondary ball bearing is installed between the toothed clamping structure and the secondary rotating tooth.

[0009] Preferably, the buffer clamping structure comprises several components.

[0010] Preferably, the rotating buffer slider and the bending lower mold cover are rotatably coaxially positioned and installed.

[0011] Preferably, there are two rotating buffer sliders, which are symmetrically installed on both sides of the disk.

[0012] Preferably, the rotary buffer slider is a cylindrical structure with a notch for locking the disc on the axial direction of the cylindrical structure.

[0013] Preferably, a damping pad is provided at the notch.

[0014] Preferably, a fixing member for securing the spring is installed below the bent lower mold cover.

[0015] The present invention proposes a centering and buffering method for a fixed mold in the forming of a buffer component, comprising the following steps:

[0016] When the upper bending die structure moves downward to contact the lead wire, it works together with the lower bending die structure to act on the lead wire of the buffer component, and enters the forming process;

[0017] As the upper bending die structure continues to move downward, the lower bending die structure and the lower support structure also descend together, causing the disc to compress the spring.

[0018] The disc drives the rotating buffer slider to rotate until the lower support structure reaches its lower limit position, completing the lead wire forming of the buffer component;

[0019] When the spring is compressed to its limit, it begins to rebound. The lead wire of the damper rises with the bending of the upper die structure, the bending of the lower die structure, and the lower support structure until the spring returns to its original length, thus achieving centering and buffering of the damper.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] This invention proposes a centering buffer structure for a fixed die in the forming of a buffer component. A groove is provided on the bent lower die structure to house the buffer component and prevent slippage. A through hole is provided in the groove to house the lower support structure. When the upper die structure is bent externally, the lower support structure moves downward, which in turn moves the disc downward, compressing the spring. A rotating buffer slider is installed inside the bent lower die cover. This slider slides in conjunction with the disc, providing a stress release path and absorbing the additional damage to the lead wire caused by the two-stage extrusion process, ensuring the mechanical properties of the lead wire material and preventing overpressure. Therefore, the buffer structure proposed in this invention solves the problem in existing two-stage extrusion fixed die tooling, where the strong plastic forming process cannot provide sufficient stress release pathways for lead wire deformation, leading to overpressure.

[0022] Furthermore, a buffer clamping structure is installed on the side wall of the U-shaped groove, which can clamp the buffer component.

[0023] Furthermore, stable centering and clamping of buffer components with a wide external tolerance band is achieved. Specifically, through the design of primary and secondary rotating teeth on the toothed clamping structure, the device clamping structure can adaptively fit into the shape of the buffer component in the bending lower mold. By adjusting the rotation of the primary and secondary rotating teeth, the secondary rotating tooth can stably center and clamp the buffer component to be formed, avoiding quality risks such as device eccentricity and inconsistent lead lengths on both sides after forming.

[0024] Furthermore, the rotating buffer slider and the bending lower mold cover are rotatably coaxially positioned and installed to enable multi-angle rotation.

[0025] Furthermore, the rotating buffer sliders are symmetrically installed on both sides of the disk to prevent it from tilting when it moves downwards or upwards, thus improving the stability of the disk.

[0026] Furthermore, the rotary buffer slider has a cylindrical structure to facilitate its rolling; a notch is provided on the axial side of the cylindrical structure to hold the disc in place.

[0027] Furthermore, the blocking sensation of the rotating buffer slider can be adjusted by setting damping pads.

[0028] Furthermore, a fastener is installed below the bent lower mold cover to prevent it from detaching from the axis when the spring is compressed or rebounds.

[0029] The present invention proposes a centering and buffering method for the fixed mold of the buffer component. The method uses a disc to drive the rotating buffer slider to rotate, releasing excess lead wire deformation stress within a limited space and absorbing the additional damage to the lead wire caused by the two-stage extrusion strong plastic forming process, thereby achieving centering and buffering of the buffer component. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a partial cross-sectional view of the forming mold involved in the structure of this invention.

[0032] Figure 2 This is a half-section view of the zero-position forming state of the structure of the present invention.

[0033] Figure 3 This is a half-section view of the structure forming in dynamic position according to the present invention.

[0034] Figure 4 This is a diagram showing the dynamic state of the toothed clamping structure of the present invention during its forming.

[0035] Figure 5 This is a detailed drawing of the toothed clamping structure of the present invention.

[0036] Figure 6 This is a detailed diagram of the rotating buffer slider structure of the present invention.

[0037] Figure 7 This is a flowchart of the centering and buffering method for the forming mold of the buffer component according to the present invention.

[0038] Wherein: 0-Forming fixed mold tooling; 1-Bending upper mold structure; 2-Bending lower mold structure; 3-Lower support structure; 4-Buffer component; 5-Rotating buffer slider; 5-1-Damping pad; 6-Spring; 7-Toothed clamping structure; 7-1-Primary rotating tooth; 7-2-Secondary rotating tooth; 7-3-Primary connecting rod; 7-4-Secondary connecting rod; 7-5-Primary ball bearing; 7-6-Secondary ball bearing; 8-Bending lower mold cover. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0041] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0042] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0043] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0044] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0045] The present invention will now be described in further detail with reference to the accompanying drawings:

[0046] This invention proposes a centering buffer structure for a fixed mold in the forming of a buffer component, such as... Figure 1-6As shown, the device includes a bending lower die structure 2, a lower support structure 3, and a bending lower die cover 8. The upper part of the bending lower die structure 2 is a U-shaped groove with a through hole in the center. A buffer component 4 is installed inside the U-shaped groove. One end of the lower support structure 3 passes through the through hole and is flush with the U-shaped groove, while the other end of the lower support structure 3 is located on the lower bottom surface of the bending lower die structure 2. A disc is provided below the support structure 3, and a spring 6 is installed on the lower end face of the disc. The bending lower die cover 8 is located outside the bending lower die structure 2 and the lower support structure 3. A rotating buffer slider 5 that slides in cooperation with the disc is installed inside the bending lower die cover 8.

[0047] The groove on the bending lower die structure 2 is designed to house the buffer component 4 and prevent it from sliding. The through hole in the groove is for housing the lower support structure 3. Under the external bending action of the upper die structure 1, the buffer component 4 causes the lower support structure 3 to move downwards, which in turn moves the disc downwards, compressing the spring 6. A rotating buffer slider 5 is installed inside the bending lower die cover 8. The rotating buffer slider 5 slides in conjunction with the disc, providing a stress release path and absorbing the additional damage to the lead wire caused by the two-stage extrusion strong plastic forming process, ensuring the mechanical properties of the lead wire material and preventing overpressure on the lead wire.

[0048] Furthermore, a buffer clamping structure is installed on the side wall of the U-shaped groove to clamp the buffer component. The buffer clamping structure includes a toothed clamping structure 7, a primary rotating tooth 7-1, and a secondary rotating tooth 7-2. The toothed clamping structure 7 and the primary rotating tooth 7-1 are positioned and connected by a primary connecting rod 7-3, and the toothed clamping structure 7 and the secondary rotating tooth 7-2 are positioned and connected by a secondary connecting rod 7-4. A primary ball bearing 7-5 is installed between the toothed clamping structure 7 and the primary rotating tooth 7-1, and a secondary ball bearing 7-6 is installed between the toothed clamping structure 7 and the secondary rotating tooth 7-2. By designing the primary rotating tooth 7-1 and the secondary rotating tooth 7-2 on the toothed clamping structure 7, the buffer clamping structure can adaptively fit into the shape of the buffer in the bending lower mold structure 2. Through the rotation adjustment of the primary rotating tooth 7-1 and the secondary rotating tooth 7-2, the secondary rotating tooth 7-2 can stably center and clamp the buffer 4 to be formed, avoiding the quality risks of device eccentricity and inconsistent lead lengths on both sides after forming.

[0049] Several buffer clamping structures are provided, and the rotating buffer slider 5 and the bending lower mold cover 8 are rotatably coaxially positioned and installed to achieve multi-angle rotation. There are two rotating buffer sliders 5, symmetrically installed on both sides of the disc, to prevent the disc from tilting during downward or upward movement and improve its stability. The rotating buffer slider 5 is designed as a cylindrical structure with a notch on its axial direction to hold the disc in place. A damping pad 5-1 is provided at the notch to adjust the obstruction of the rotating buffer slider. A fixing component is installed below the bending lower mold cover 8 to prevent it from detaching from the axis when the spring is compressed or rebounds.

[0050] The specific description is as follows: (e.g.) Figure 1 As shown, 0 is a half-sectional view of the forming mold fixture, the bending upper mold structure 1 is a general design, and the bending lower mold structure 2 is the main part of the structure involved in this invention; as Figure 2 , Figure 4 As shown, on the contact end face between the bent lower mold structure 2 and the buffer component 4, a buffer component clamping structure is bonded; as Figure 2 , Figure 3 , Figure 4 As shown, a lower support structure 3 is installed along the axial direction of the bending lower die structure 2; a disc is installed below the lower support structure 3, which can contact the 90° notch end face of the rotating buffer slider 5 when the lower support structure 3 moves up and down, and drive the rotating buffer slider 5 to rotate; as shown Figure 6 As shown, the rotary buffer slider 5 and the bending lower mold cover 8 are rotatably coaxially positioned and installed. The blocking sensation of the rotary buffer slider 5 can be adjusted by adding damping pads 5-1 of different thicknesses, thereby controlling the stress release capability. Figure 4 As shown, when the lower support structure 3 descends to its extreme position, the bending and lifting spring 6 acts to lift the lower support structure 3. Figure 5 As shown, the toothed clamping structure 7, the primary rotating tooth 7-1, and the secondary rotating tooth 7-2 are positioned and connected by the primary connecting rod 7-3 and the secondary connecting rod 7-4; between the toothed clamping structure 7 and the primary rotating tooth 7-1, and between the primary rotating tooth 7-1 and the secondary rotating tooth 7-2, the primary ball bearing 7-5 and the secondary ball bearing 7-6 are installed to realize multi-degree-of-freedom adjustment of the clamping direction.

[0051] This invention proposes a centering and buffering method for a fixed mold in the forming of a buffer component, such as... Figure 7 As shown, it includes the following steps:

[0052] Step 1: When the upper bending die structure 1 moves downward to contact the lead wire, it works together with the lower bending die structure 2 to act on the lead wire of the buffer component 4, and enters the forming process.

[0053] Step 2: As the upper bending die structure 1 continues to move downward, the lower bending die structure 2 and the lower support structure 3 also descend together, driving the disc to compress the spring 6.

[0054] Step 3: The disc drives the rotating buffer slider 5 to rotate until the lower support structure 3 reaches its lower limit position, completing the lead wire forming of the buffer component 4;

[0055] Step 4: Spring 6 is compressed to its limit and begins to rebound. The lead wire of the buffer component 4 rises with the bending upper die structure 1, bending lower die structure 2 and lower support structure 3 until spring 6 returns to its original length, thus achieving centering and buffering of the buffer component.

[0056] The working principle of the centering buffer structure for the forming mold of the buffer component proposed in this invention is as follows:

[0057] The buffer component 4 is placed on the bending lower die structure 2 of the forming fixed die 0. By slightly shaking the buffer component 4, the primary rotating tooth 7-1 and the secondary rotating tooth 7-2 on the toothed clamping structure 7 rotate until the toothed end face of the secondary rotating tooth 7-2 is stably aligned with the side of the buffer component 4. At the same time, the upper end face of the lower support structure 3 is in close contact with the lower end face of the buffer component 4. At this point, the toothed clamping structure 7 and the lower support structure 3 form a clamping control on the body of the buffer component 4. The bending upper die structure 1 moves downward until it contacts the lead wire, and then works together with the bending lower die structure 2 to act on the lead wire of the buffer component 4, entering the forming process. As the bending upper die structure 1 continues to move downward, the bending lower die structure 2 and the lower support structure 3 also descend together, and the bending lifting spring 6 is compressed. When the lower support structure 3 descends, the upper and lower end faces of its left and right stepped structures contact the 90° notch end face of the rotating buffer slider 5, respectively, causing the rotating buffer slider 5 to move accordingly. Rotation; due to the presence of the damping pad 5-1 between the rotating buffer slider 5 and the bending lower die cover 8, the additional stress on the lead wire of the buffer component 4 during the two-stage extrusion strong plastic forming process is absorbed. At the same time, the speed at which the lead wire is clamped and descended by the bending upper die structure 1 and the bending lower die structure 2 slows down until the descent limit position is reached, completing the lead wire forming of the buffer component 4. At this time, the bending lifting spring 6 is compressed to its limit and begins to rebound. The damping pad 5-1 between the rotating buffer slider 5 and the bending lower die cover 8 acts in the opposite direction, consuming the potential energy brought by the bending lifting spring 6, reducing the speed at which the lead wire of the buffer component 4 rises with the bending upper die structure 1, the bending lower die structure 2 and the lower support structure 3, thereby providing a pressure holding time for the lead wire of the buffer component 4 after forming. Afterwards, the lead wire of the buffer component 4 continues to rise with the bending upper die structure 1, the bending lower die structure 2 and the lower support structure 3, and the paper bending lifting spring 6 returns to its original length, completing the lead wire forming of the buffer component 4.

[0058] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A centering buffer structure for a fixed mold in the forming of a buffer component, characterized in that, The device includes a bending lower die structure (2), a lower support structure (3), and a bending lower die cover (8). The upper part of the bending lower die structure (2) is a U-shaped groove, and a through hole is provided in the center of the U-shaped groove. A buffer component (4) is provided inside the U-shaped groove. One end of the lower support structure (3) passes through the through hole and is flush with the U-shaped groove. The other end of the lower support structure (3) is located on the lower bottom surface of the bending lower die structure (2). A disc is provided below the support structure (3), and a spring (6) is installed on the lower end face of the disc. The bending lower die cover (8) is located outside the bending lower die structure (2) and the lower support structure (3). A rotating buffer slider (5) that slides with the disc is installed inside the bending lower die cover (8). A buffer component is installed on the side wall of the U-shaped groove. The clamping structure includes a toothed clamping structure (7), a primary rotating tooth (7-1), and a secondary rotating tooth (7-2). The toothed clamping structure (7) and the primary rotating tooth (7-1) are positioned and connected by a primary connecting rod (7-3), and the toothed clamping structure (7) and the secondary rotating tooth (7-2) are positioned and connected by a secondary connecting rod (7-4). A primary ball bearing (7-5) is installed between the toothed clamping structure (7) and the primary rotating tooth (7-1), and a secondary ball bearing (7-6) is installed between the toothed clamping structure (7) and the secondary rotating tooth (7-2). The rotating buffer slider (5) is a cylindrical structure with a notch for clamping the disc on the axial direction of the cylindrical structure.

2. The centering buffer structure for the forming mold of a buffer component according to claim 1, characterized in that, The buffer clamping structure has several components.

3. The centering buffer structure for the forming mold of a buffer component according to claim 1, characterized in that, The rotating buffer slider (5) and the bending lower mold cover (8) are rotatably coaxially positioned and installed.

4. The centering buffer structure for the forming mold of a buffer component according to claim 1, characterized in that, There are two rotating buffer sliders (5), which are symmetrically installed on both sides of the disk.

5. The centering buffer structure for the forming mold of a buffer component according to claim 1, characterized in that, A damping pad (5-1) is provided at the gap.

6. The centering buffer structure for the forming mold of a buffer component according to claim 1, characterized in that, A fastener for fixing the spring (6) is installed below the bent lower mold cover (8).

7. A centering and buffering method for a fixed mold in the forming of a buffer component, characterized in that, The structure described in any one of claims 1 to 6 includes the following steps: The upper part of the bending lower die structure (2) is a U-shaped groove. A buffer clamping structure is installed on the side wall of the U-shaped groove to clamp the buffer. When the bending upper die structure (1) moves downward to contact the lead wire, it works together with the bending lower die structure (2) on the lead wire of the buffer (4) to enter the forming process. As the upper bending die structure (1) continues to move downward, the lower bending die structure (2) and the lower support structure (3) also descend together, driving the disc compression spring (6). The disc drives the rotating buffer slider (5) to rotate until the lower support structure (3) reaches its lower limit position, thus completing the lead wire forming of the buffer component (4); When the spring (6) is compressed to its limit, it begins to rebound. The lead wire of the buffer component (4) rises with the bending of the upper die structure (1), the bending of the lower die structure (2), and the lower support structure (3) until the spring (6) returns to its original length, thus achieving the centering and buffering of the buffer component.

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