Electronic component assembly with foam adhesive assembly

Abstract

The application discloses a kind of electronic components and parts assembly foam glue components, its foam single product is located between the upper surface of protective film and micro-adhesive film, the non-release surface of a release film is connected with the upper surface of micro-adhesive film by a double-sided adhesive layer, and the double-sided adhesive unit is located between the release surface of release film and protective film;Bearing film is bonded with the lower surface of micro-adhesive film, the viscosity value of the upper surface of micro-adhesive film and foam single product and double-sided adhesive layer is greater than the viscosity value of the lower surface of micro-adhesive film and bearing film;Bearing film is provided with a plurality of main positioning holes and first positioning holes, the micro-adhesive film is provided with a plurality of second positioning holes, the first positioning hole of bearing film and the second positioning hole of micro-adhesive film are consistent;The thickness of double-sided adhesive unit 4 is 0.2T, the thickness of the above release film 6 is 0.05T, and the micro-adhesive film and bearing film are PC film.The application improves the adhesion of release film and micro-adhesive film, effectively prevents the release film from remaining on the product after peeling off the micro-adhesive film, and avoids the damage to the product caused by secondary peeling.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of film, especially to a foam glue assembly for electronic component assembly. BACKGROUND

[0002] In the prior art, when assembling electronic components in a computer, mobile phone or tablet, a layer of double-sided adhesive tape is attached to the back of the electronic component. In order to achieve the effects of insulation, shockproof, sealing and dustproof, a layer of foam is also attached to the back of some electronic components. In the prior art, there are only single double-sided adhesive tape products and single foam products, so multiple attachments are required for the back of the electronic component. Multiple attachments will produce certain errors and introduce dust, causing product contamination, affecting overall performance, and reducing production efficiency. How to overcome the above technical problems has become the direction of efforts for technical personnel in this field. SUMMARY

[0003] The purpose of the present application is to provide a foam glue assembly for electronic component assembly, which realizes precise attachment of foam monomers and double-sided adhesive tape units to the product, avoids the complexity of secondary attachment, avoids the introduction of dust during multiple attachments, greatly improves production efficiency and product yield, and reduces the difficulty of operation and labor costs.

[0004] To achieve the above purpose, the technical solution adopted by the present application is: a foam glue assembly for electronic component assembly, comprising a protective film, a micro-adhesive film, a bearing film, a double-sided adhesive tape unit and a foam product, the foam product is located between the upper surfaces of the protective film and the micro-adhesive film, the non-release surface of a release film is connected to the upper surface of the micro-adhesive film through a double-sided adhesive layer, and the double-sided adhesive tape unit is located between the release surface of the release film and the protective film.

[0005] The surface of the foam product in contact with the protective film has an adhesive layer, the bearing film is bonded to the lower surface of the micro-adhesive film, and the viscosity value of the micro-adhesive film upper surface and the foam product and double-sided adhesive layer is greater than the viscosity value of the micro-adhesive film lower surface and the bearing film.

[0006] The bearing film has a plurality of main positioning holes and first positioning holes, the micro-adhesive film has a plurality of second positioning holes, and the first positioning holes of the bearing film and the second positioning holes of the micro-adhesive film are matched.

[0007] The thickness of the double-sided adhesive tape unit 4 is 0.2T, the thickness of the release film 6 is 0.05T, and the micro-adhesive film and the bearing film are PC films.

[0008] The further improved solution in the above technical solution is as follows:

[0009] 1. In the above scheme, the upper and lower surfaces of the micro-adhesive membrane have a first micro-adhesive layer and a second micro-adhesive layer, respectively.

[0010] 2. In the above scheme, the viscosity value of the first micro-adhesive layer is greater than the viscosity value of the second micro-adhesive layer.

[0011] 3. In the above scheme, the release film is a blue release film.

[0012] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0013] 1. The foam adhesive assembly for electronic component assembly of the present invention achieves precise simultaneous application of foam monomers and double-sided adhesive units to the product, avoiding the tediousness of secondary application and preventing dust contamination caused by multiple application processes, greatly improving production efficiency and product yield, and reducing operational difficulty and labor costs. Furthermore, it fully considers the differences between foam monomers and double-sided adhesive units. The non-release surface of the release film is connected to the upper surface of the micro-adhesive film through a double-sided adhesive layer, and the double-sided adhesive units are located on the release surface of the release film. When the micro-adhesive film is peeled off, the micro-adhesive film carries away the release film along with the double-sided adhesive layer, thereby applying the foam monomers and double-sided adhesive units to the product. This improves the adhesion between the release film and the micro-adhesive film, effectively preventing the release film from remaining on the product after peeling off the micro-adhesive film, and avoiding damage to the product from secondary peeling.

[0014] 2. The foam adhesive assembly for assembling electronic components of the present invention has a carrier film with a plurality of main positioning holes and a first positioning hole, and a micro adhesive film with a plurality of second positioning holes. The first positioning holes of the carrier film and the second positioning holes of the micro adhesive film are matched. The overall main positioning holes are combined with the local first positioning holes and second positioning holes for positioning, thereby achieving the requirement of accurate and precise bonding of foam monomers and double-sided adhesive units to the product, and further improving the product yield. Attached Figure Description

[0015] Appendix Figure 1 This is a schematic diagram of the structure of the foam adhesive assembly for assembling electronic components according to the present invention;

[0016] Appendix Figure 2 For the appendix Figure 1 A magnified schematic diagram of the local structure at point A;

[0017] Appendix Figure 3 This is a cross-sectional structural diagram of the foam adhesive assembly for assembling electronic components according to the present invention;

[0018] Appendix Figure 4 For the appendix Figure 3 A partial structural diagram.

[0019] In the attached diagrams: 1. Protective film; 2. Micro-adhesive film; 3. Carrier film; 4. Double-sided adhesive unit; 5. Foam unit; 6. Release film; 61. Non-release surface; 62. Release surface; 7. Double-sided adhesive layer; 8. Adhesive layer; 91. First micro-adhesive layer; 92. Second micro-adhesive layer; 10. Main positioning hole; 11. First positioning hole; 12. Second positioning hole. Implementation

[0020] Example 1: A foam adhesive assembly for assembling electronic components includes a protective film 1, a micro-adhesive film 2, a carrier film 3, a double-sided adhesive unit 4, and a foam element 5. The foam element 5 is located between the upper surfaces of the protective film 1 and the micro-adhesive film 2. The non-release surface 61 of a release film 6 is connected to the upper surface of the micro-adhesive film 2 through a double-sided adhesive layer 7. The double-sided adhesive unit 4 is located between the release surface 62 of the release film 6 and the protective film 1.

[0021] The surface of the foam unit 5 that contacts the protective film 1 has an adhesive layer 8. The carrier film 3 is bonded to the lower surface of the micro-adhesive film 2. The viscosity value between the upper surface of the micro-adhesive film 2 and the foam unit 5 and the double-sided adhesive layer 7 is greater than the viscosity value between the lower surface of the micro-adhesive film 2 and the carrier film 3.

[0022] The carrier membrane 3 has a plurality of main positioning holes 10 and a first positioning hole 11, and the micro-adhesive membrane 2 has a plurality of second positioning holes 12. The first positioning holes 11 of the carrier membrane 3 and the second positioning holes 12 of the micro-adhesive membrane 2 are matched.

[0023] The upper and lower surfaces of the aforementioned micro-adhesive membrane 2 are respectively provided with a first micro-adhesive layer 91 and a second micro-adhesive layer 92, wherein the viscosity value of the first micro-adhesive layer 91 is greater than the viscosity value of the second micro-adhesive layer 92.

[0024] The thickness of the double-sided adhesive unit 4 is 0.2T.

[0025] The thickness of the release film 6 is 0.05T.

[0026] The aforementioned micro-adhesive membrane 2 and carrier membrane 3 are PC membranes.

[0027] Example 2: A foam adhesive assembly for assembling electronic components includes a protective film 1, 8 micro-adhesive films 2, a carrier film 3, 16 double-sided adhesive units 4, and 24 foam units 5. The foam units 5 are located between the upper surfaces of the protective film 1 and the micro-adhesive films 2. The non-release surface 61 of a release film 6 is connected to the upper surface of the micro-adhesive films 2 through a double-sided adhesive layer 7. The double-sided adhesive units 4 are located between the release surface 62 of the release film 6 and the protective film 1.

[0028] The surface of the foam unit 5 that contacts the protective film 1 has an adhesive layer 8. The carrier film 3 is bonded to the lower surface of the micro-adhesive film 2. The viscosity value between the upper surface of the micro-adhesive film 2 and the foam unit 5 and the double-sided adhesive layer 7 is greater than the viscosity value between the lower surface of the micro-adhesive film 2 and the carrier film 3.

[0029] The carrier membrane 3 has a plurality of main positioning holes 10 and a first positioning hole 11, and the micro-adhesive membrane 2 has a plurality of second positioning holes 12. The first positioning holes 11 of the carrier membrane 3 and the second positioning holes 12 of the micro-adhesive membrane 2 are matched.

[0030] The upper and lower surfaces of the aforementioned micro-adhesive membrane 2 have a first micro-adhesive layer 91 and a second micro-adhesive layer 92, respectively.

[0031] The viscosity value of the first micro-adhesive layer 91 is greater than the viscosity value of the second micro-adhesive layer 92.

[0032] The release film 6 mentioned above is a blue release film.

[0033] This embodiment of the foam adhesive assembly for electronic component assembly achieves precise simultaneous application of foam monomers and double-sided adhesive units to the product. This avoids the tediousness of secondary application and prevents dust contamination during multiple application processes, significantly improving production efficiency and product yield while reducing operational difficulty and labor costs. Furthermore, it fully considers the differences between foam monomers and double-sided adhesive units. The non-release surface of the release film is connected to the upper surface of the micro-adhesive film via a double-sided adhesive layer. The double-sided adhesive units are located on the release surface of the release film. When the micro-adhesive film is peeled off, it carries the release film along with it through the double-sided adhesive layer, thus applying both the foam monomers and double-sided adhesive units to the product. This improves the adhesion between the release film and the micro-adhesive film and effectively prevents the release film from remaining on the product after peeling off the micro-adhesive film, avoiding damage to the product from secondary peeling. Additionally, it uses a combination of an overall main positioning hole and locally positioned first and second positioning holes for positioning, achieving accurate and precise adhesion of the foam monomers and double-sided adhesive units to the product, further improving product yield.

[0034] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A foam adhesive assembly for assembling electronic components, characterized in that: It includes a protective film (1), at least two micro-adhesive films (2), a carrier film (3), at least two double-sided adhesive units (4), and at least two foam units (5). The foam units (5) are located between the upper surfaces of the protective film (1) and the micro-adhesive films (2). The non-release surface (61) of a release film (6) is connected to the upper surface of the micro-adhesive films (2) through a double-sided adhesive layer (7). The double-sided adhesive units (4) are located between the release surface (62) of the release film (6) and the protective film (1). The surface of the foam unit (5) in contact with the protective film (1) has an adhesive layer (8), the carrier film (3) is bonded to the lower surface of the micro-adhesive film (2), and the viscosity value of the upper surface of the micro-adhesive film (2) to the foam unit (5) and the double-sided adhesive layer (7) is greater than the viscosity value of the lower surface of the micro-adhesive film (2) to the carrier film (3). The carrier membrane (3) has a plurality of main positioning holes (10) and a first positioning hole (11), and the micro-adhesive membrane (2) has a plurality of second positioning holes (12). The first positioning holes (11) of the carrier membrane (3) and the second positioning holes (12) of the micro-adhesive membrane (2) are aligned. The thickness of the double-sided adhesive unit 4 is 0.2T, the thickness of the release film 6 is 0.05T, and the micro-adhesive film (2) and the carrier film (3) are PC films.

2. The foam adhesive assembly for assembling electronic components according to claim 1, characterized in that: The upper and lower surfaces of the micro-adhesive membrane (2) have a first micro-adhesive layer (91) and a second micro-adhesive layer (92), respectively.

3. The foam adhesive assembly for assembling electronic components according to claim 2, characterized in that: The viscosity value of the first micro-adhesive layer (91) is greater than that of the second micro-adhesive layer (92).

4. The foam adhesive assembly for assembling electronic components according to claim 1, characterized in that: The release film (6) is a blue release film.

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