Leveling device and leveling method for wafer tray

Abstract

The present invention discloses a leveling device and leveling method for a wafer tray. The leveling device includes: a base, which is arranged outside the bottom plate of a reaction chamber and is detachably connected to the bottom plate through a plurality of leveling screw assemblies; a leveling screw assembly, which includes a differential screw, wherein the upper end of the differential screw is provided with a first thread for threaded connection with the bottom plate, the lower end of the differential screw is provided with a second thread and is sleeved in an adjusting screw sleeve, the adjusting screw sleeve surrounds the second thread, and the pitch of the first thread is greater than the pitch of the second thread, wherein the first end of the adjusting screw sleeve is provided with a first locking structure for locking the differential screw and the adjusting screw sleeve so that the base is adjusted to a first level according to the pitch of the first thread, and the second end of the adjusting screw sleeve is provided with a second locking structure for locking the base and the adjusting screw sleeve so that the base is adjusted to a second level according to the difference between the pitches of the first thread and the second thread; and a wafer tray, which is arranged in the reaction chamber and connected to the base through a support rod to support the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor process equipment, and in particular to a wafer tray leveling device, a wafer tray leveling method and a computer-readable storage medium. Background Art

[0002] Semiconductor processing equipment can form semiconductor devices through steps such as deposition, etching, patterning, and modification of electrical properties. Deposition is any process that grows, coats, or otherwise transfers material onto a wafer. Common techniques include physical vapor deposition (PVD), chemical vapor deposition (CVD), and atomic layer deposition (ALD).

[0003] To ensure reliable deposition processes, it's often necessary to adjust the relative position of the wafer tray within the reaction chamber of semiconductor processing equipment and the showerhead above it. In particular, the surface of the wafer tray must be adjusted to a horizontal angle to ensure optimal process performance for the wafers supported on the tray and improve the uniformity of the deposited thin films. However, existing technologies for leveling wafer trays are relatively simple, typically with only one adjustment mode. Achieving high horizontal accuracy requires a significant amount of time to adjust, making it difficult to quickly adjust the wafer tray to the ideal horizontal angle.

[0004] In order to solve the above-mentioned problems existing in the prior art, the art urgently needs a wafer pallet leveling technology that can take into account both the leveling efficiency and leveling accuracy of the wafer pallet, adjust the horizontal angle of the wafer pallet to the ideal horizontal angle in a short time, and does not require the aid of additional adjustment equipment, thus avoiding increased costs. Summary of the Invention

[0005] The following is a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceivable aspects and is neither intended to identify key or critical elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that will be provided later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer pallet leveling device, a wafer pallet leveling method, and a computer-readable storage medium, which can take into account the leveling efficiency and leveling accuracy of the wafer pallet at the same time, and adjust the horizontal angle of the wafer pallet to the ideal horizontal angle in a short time without the need for additional adjustment equipment, thereby avoiding increased costs.

[0007] Specifically, the leveling device of the above-mentioned wafer tray provided according to the first aspect of the present invention includes: a base, which is arranged outside the bottom plate of the reaction chamber and is detachably connected to the bottom plate through a plurality of leveling screw assemblies; the leveling screw assembly includes a differential screw, the upper end of the differential screw is provided with a first thread to be threadedly connected to the bottom plate, the lower end of the differential screw is provided with a second thread and is sleeved in an adjusting screw sleeve, the adjusting screw sleeve surrounds the second thread, and the pitch of the first thread is greater than the pitch of the second thread, wherein the first end of the adjusting screw sleeve is provided with a first locking structure for locking the differential screw and the adjusting screw sleeve, so that the base is adjusted to a first level according to the pitch of the first thread, and the second end of the adjusting screw sleeve is provided with a second locking structure for locking the base and the adjusting screw sleeve, so that the base is adjusted to a second level according to the difference between the pitches of the first thread and the second thread; and a wafer tray, which is arranged in the reaction chamber and connected to the base through a support rod to support the wafer.

[0008] Furthermore, in some embodiments of the present invention, the leveling screw assembly also includes a bearing cover plate, which is arranged above the base around the differential screw and covers the outside of the adjusting screw sleeve. The second locking structure indirectly locks the base and the adjusting screw sleeve by locking the bearing cover plate and the adjusting screw sleeve.

[0009] Furthermore, in some embodiments of the present invention, the first locking structure includes a first locking top screw arranged on the outside of the differential screw and the adjusting screw sleeve, and the second locking structure includes a second locking top screw arranged on the outside of the adjusting screw sleeve and passing through one side of the bearing cover plate.

[0010] Furthermore, in some embodiments of the present invention, a first bearing is provided between the bearing cover plate and the adjusting screw sleeve, and a second bearing is provided between the base and the adjusting screw sleeve.

[0011] Furthermore, in some embodiments of the present invention, the base includes at least three leveling base assemblies, and the at least three leveling base assemblies are dispersedly arranged on the outer peripheral edge of the base.

[0012] Furthermore, in some embodiments of the present invention, the three leveling base assemblies are arranged at an angle of 120° to each other.

[0013] In addition, the above-mentioned wafer tray leveling method provided in accordance with the second aspect of the present invention includes the following steps: adjusting the overall position of the wafer tray to near the target height, wherein the wafer tray is arranged in the reaction chamber and connected to a base arranged outside the bottom plate of the reaction chamber via a support rod to support the wafer, and the base is detachably connected to the bottom plate via a plurality of leveling screw assemblies; obtaining each initial distance difference between each end of the surface of the wafer tray and the horizontal plane of the target height; performing a first-level lifting adjustment on each end of the surface according to the each initial distance difference to obtain the each first distance difference between each end of the surface and the horizontal plane, wherein the adjustment amplitude of the first-level lifting adjustment is based on the pitch of the first thread of the differential screw in the leveling screw assembly; and based on the first distance differences, performing a second-level lifting adjustment on each end of the surface to reduce the first distance differences so that each end of the surface of the wafer tray coincides with the horizontal plane of the target height, wherein the adjustment amplitude of the second-level lifting adjustment is based on the difference between the pitches of the first thread and the second thread of the differential screw, and the pitch of the first thread is greater than the pitch of the second thread.

[0014] Furthermore, in some embodiments of the present invention, the positions of the multiple leveling screw assemblies correspond to the bottom of each end of the surface of the wafer tray, wherein the upper end of the differential screw is provided with a first thread to be threadedly connected to the base plate, the lower end of the differential screw is provided with a second thread and is sleeved in the adjusting screw sleeve, and the adjusting screw sleeve surrounds the second thread, and the steps of performing a first-level lifting and lowering adjustment on each end of the surface according to the initial distance differences and obtaining each first distance difference between each end of the surface and the horizontal plane include: locking the first locking structure provided at the first end of the adjusting screw sleeve, and loosening the second locking structure provided at the second end of the adjusting screw sleeve to lock the differential screw and the adjusting screw sleeve; rotating the differential screw to make each end of the surface move according to a multiple of the pitch of the first thread to perform the first-level lifting and lowering adjustment; and obtaining each first distance difference between each end of the surface and the horizontal plane.

[0015] Furthermore, in some embodiments of the present invention, the step of performing secondary lifting and lowering adjustments on each end of the surface according to each first distance difference to reduce each first distance difference so that each end of the surface of the wafer tray coincides with the horizontal plane of the target height includes: loosening the first locking structure and locking the second locking structure to lock the base and the adjusting screw sleeve; rotating the differential screw to generate relative rotation between the differential screw and the adjusting screw sleeve so that each end of the surface of the wafer tray moves according to a multiple of the difference between the pitch of the first thread and the second thread to perform the secondary lifting and lowering adjustment; and continuing the secondary lifting and lowering adjustment until each end of the surface completely coincides with the horizontal plane.

[0016] Furthermore, according to a third aspect of the present invention, a computer-readable storage medium is provided, on which computer instructions are stored, wherein when the computer instructions are executed by a processor, the wafer tray leveling method provided in the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention will be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.

[0018] Figure 1 A schematic structural diagram of a wafer tray leveling device provided in some embodiments of the present invention is shown;

[0019] Figure 2 A bottom view of a wafer tray leveling device according to some embodiments of the present invention is shown;

[0020] Figure 3 A schematic structural diagram of a leveling screw assembly provided according to some embodiments of the present invention is shown;

[0021] Figure 4 for Figure 3 a cross-sectional view of the leveling screw assembly shown; and

[0022] Figure 5 A flow chart of a wafer tray leveling method provided according to some embodiments of the present invention is shown.

[0023] Reference numerals:

[0024] 100 Wafer tray leveling device;

[0025] 110 base;

[0026] 120 leveling screw assembly;

[0027] 121 differential screw;

[0028] 1211 first thread;

[0029] 1212 second thread;

[0030] 122 adjusting screw sleeve;

[0031] 123 first locking structure;

[0032] 124 second locking structure;

[0033] 125 bearing cover plate;

[0034] 126 first bearing;

[0035] 127 second bearing;

[0036] 130 wafer trays;

[0037] 140 support rod;

[0038] 200 base plate;

[0039] Steps S510 to S540. DETAILED DESCRIPTION

[0040] The following specific embodiments illustrate the embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0041] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0042] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood to refer to the orientations depicted in that section and the accompanying drawings. These relative terms are used solely for convenience of description and do not necessarily imply that the devices described herein must be manufactured or operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0043] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various components, regions, layers, and / or portions, these components, regions, layers, and / or portions should not be limited by these terms, and these terms are merely used to distinguish different components, regions, layers, and / or portions. Thus, a first component, region, layer, and / or portion discussed below may be referred to as a second component, region, layer, and / or portion without departing from some embodiments of the present invention.

[0044] As mentioned above, to ensure the reliability of the deposition process, it is often necessary to adjust the relative position of the wafer tray within the reaction chamber of semiconductor processing equipment and the shower plate above it. In particular, the surface of the wafer tray must be adjusted to a horizontal angle to achieve optimal process performance for the wafers supported on the wafer tray and improve the uniformity of the deposited thin films. However, existing technologies for leveling wafer trays are relatively simple, typically with only one adjustment mode. Achieving high horizontal accuracy requires a significant amount of time to adjust, making it difficult to quickly adjust the wafer tray to the ideal horizontal angle.

[0045] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a wafer pallet leveling device, a wafer pallet leveling method, and a computer-readable storage medium, which can take into account the leveling efficiency and leveling accuracy of the wafer pallet at the same time, and adjust the horizontal angle of the wafer pallet to the ideal horizontal angle in a short time, and do not require the aid of additional adjustment equipment, thereby avoiding increased costs.

[0046] In some non-limiting embodiments, the wafer tray leveling method provided in the second aspect of the present invention can be implemented by the circular tray leveling device provided in the first aspect of the present invention. In some non-limiting embodiments, the wafer tray leveling method provided in the second aspect of the present invention can be stored in the computer-readable storage medium provided in the third aspect of the present invention in the form of a software program, which stores computer instructions. When executed by a processor, the computer instructions can implement the wafer tray leveling method provided in the second aspect of the present invention.

[0047] The following describes the operating principles of the wafer tray leveling device described above, using examples of wafer tray leveling methods. Those skilled in the art will understand that these examples of wafer tray leveling methods are merely non-limiting implementations of the present invention, intended to clearly demonstrate the main concepts of the present invention and provide specific solutions that facilitate implementation by the public. They are not intended to limit the full operating methods or functions of the wafer tray leveling device. Similarly, the wafer tray leveling device is merely a non-limiting implementation of the present invention and does not constitute a limitation on the implementation of the various steps in these wafer tray leveling methods.

[0048] Please refer to Figure 1 and Figure 2 , Figure 1 A schematic structural diagram of a wafer tray leveling device according to some embodiments of the present invention is shown. Figure 2 A bottom view of a wafer tray leveling device provided according to some embodiments of the present invention is shown.

[0049] like Figure 1 and Figure 2 As shown, in some embodiments of the present invention, a wafer tray leveling device 100 may include a base 110, a leveling screw assembly 120, and a wafer tray 130. The base 110 may be disposed outside a bottom plate 200 of a reaction chamber (not shown in its entirety in the figures) and may be detachably connected to the bottom plate 200 via a plurality of leveling screw assemblies 120. The wafer tray 130 may be disposed within the reaction chamber and connected to the base 110 via support rods 140 to support wafers.

[0050] For a clearer introduction to the leveling screw assembly 120, see Figure 3 and Figure 4 , Figure 3 shows a schematic structural diagram of a leveling screw assembly provided in some embodiments of the present invention, Figure 4 for Figure 3 A cross-sectional view of the leveling screw assembly is shown.

[0051] Please Figure 4 For the Lord, Figure 3For auxiliary reference, in some embodiments of the present invention, the leveling screw assembly 120 may mainly include a differential screw 121, the upper end of the differential screw 121 is provided with a first thread 1211 for threaded connection with the bottom plate 200 of the reaction chamber above, and the lower end of the differential screw 121 is provided with a second thread 1212, which is sleeved in the adjustment screw sleeve 122, and the adjustment screw sleeve 122 surrounds the second thread 1212, and the pitch of the first thread 1211 is greater than the pitch of the second thread 1212. For example, in some embodiments, the pitch of the first thread 1211 may range from 1 mm to 2.5 mm, and the pitch of the second thread 1212 may range from 0.5 mm to 2 mm.

[0052] Furthermore, the first end of the adjusting screw sleeve 122 may be provided with a first locking structure 123. Figure 4 In the embodiment shown, the first end of the adjusting screw sleeve 122 is its lower end, and the first locking structure 123 can be used to lock the differential screw 121 and the adjusting screw sleeve 122 sleeved thereon, so that the base 110 can be adjusted in one level according to the pitch of the first thread 1211. The second end of the adjusting screw sleeve 122 can be provided with a second locking structure 124. Figure 4 In the illustrated embodiment, the second end of the adjusting screw sleeve 122 is its upper end, and the second locking structure 124 can be used to lock the base 110 and the adjusting screw sleeve 122 disposed therein, so that the base 110 can be adjusted in a two-stage manner based on the difference in pitch between the first thread 1211 and the second thread 1212. In this embodiment, the first-stage adjustment can be a coarse adjustment mode, and the second-stage adjustment can be a fine adjustment mode.

[0053] like Figure 4 As shown, in some preferred embodiments, the leveling screw assembly 120 may further include a bearing cover plate 125. The bearing cover plate 125 may be disposed above the base surrounding the differential screw 121 and cover the exterior of the adjusting screw sleeve 122, thereby preventing dust accumulation on the differential screw 121, adjusting screw sleeve 122, and other parts disposed therein. In the leveling screw assembly 120, the bearing cover plate 125 and the adjusting screw sleeve 122 disposed therein may be locked by a second locking structure 124, thereby indirectly locking the base 110 and the adjusting screw sleeve 122, thereby fixing the base 110 and the adjusting screw sleeve 122 as one.

[0054] Optionally, the above-mentioned first locking structure 123 can be specifically selected as a first locking top screw arranged on the outside of the differential screw 121 and the adjusting screw sleeve 122, and the second locking structure 124 can also be specifically selected as a second locking top screw arranged on the outside of the adjusting screw sleeve 122 and passing through one side of the bearing cover plate 125.

[0055] like Figure 4As shown, in some preferred embodiments, a first bearing 126 may be provided between the bearing cover plate 125 and the adjusting screw sleeve 122 disposed therein. Similarly, a second bearing 127 may be provided between the base 110 located below the bearing cover plate 125 and the adjusting screw sleeve 122 disposed therein. The first bearing 126 and the second bearing 127 support and secure the adjusting screw sleeve 122, preventing the adjusting screw sleeve 122 from loosening or shifting internally.

[0056] Please continue back Figure 1 or Figure 2 In some optional embodiments, the base 110 may include at least three leveling screw assemblies 120, and these leveling screw assemblies 120 are preferably dispersedly arranged on the outer edge of the base 110 to stably support the base 110 and jointly achieve the leveling operation of the wafer tray 130. Figure 2 As shown, the angle α between the three leveling screw assemblies 120 can be 120°.

[0057] Next, the wafer tray leveling device 100 will be further introduced in conjunction with a wafer tray leveling method. Figure 5 , Figure 5 FIG. 1 is a flow chart showing a method for leveling a wafer tray according to some embodiments of the present invention. Figure 5 As shown, the wafer tray leveling method can mainly include the following steps:

[0058] S510: Adjust the overall position of the wafer tray to near the target height.

[0059] Specifically, in some embodiments, wafer tray 130 is disposed within the reaction chamber and connected to base 110, which is disposed outside the reaction chamber's floor 200, via support rods 140 to support the wafers. Base 110 can be detachably connected to floor 200 via a plurality of leveling screw assemblies 120. Initially, wafer tray 130 can be initially adjusted to bring its overall height close to the target height.

[0060] S510: Acquire initial distance differences between each end of the surface of the wafer tray and a horizontal plane at a target height.

[0061] Specifically, in some embodiments, it is preferred to use intelligent ranging equipment such as sensors to collect the initial distance differences between various positions on the surface of the wafer tray 130, especially between each end of the outer edge of the surface of the wafer tray 130 and each end of the horizontal plane at the target height.

[0062] S530: performing a first-level lifting and lowering adjustment on each end of the surface according to each initial distance difference, to obtain each first distance difference between each end of the surface and the horizontal plane.

[0063] In some embodiments, based on the initial distance difference between each end of the outer edge of the surface of the wafer tray 130 and each end of the horizontal plane at the target height, the position of each end of the surface of the wafer tray 130 can be preferentially raised and lowered, i.e., coarsely adjusted, wherein the adjustment amplitude of the coarse adjustment can be based on the pitch of the first thread 1211 of the differential screw 121 in the leveling screw assembly 120.

[0064] Specifically, the first locking structure 123 disposed on the first end of the adjusting screw sleeve 122 is locked (i.e., the locking screw located at the lower center of the leveling screw assembly 120 is locked), and the second locking structure 124 disposed on the second end of the adjusting screw sleeve 122 is loosened (i.e., the locking screw located at the upper center of the leveling screw assembly 120 is loosened) to lock the differential screw 121 and the adjusting screw sleeve 122, so that the differential screw 121 and the adjusting screw sleeve 122 are fixed as a whole and do not rotate relative to each other. Afterwards, the differential screw 121 is rotated, and the lifting speed of the wafer tray leveling device 100 is determined by the pitch of the first thread 1211 with a larger pitch at the upper end of the differential screw 121. That is, each end of the surface of the wafer tray 130 can be moved according to a multiple of the pitch of the first thread 1211, performing a first-level lifting adjustment, i.e., a coarse adjustment. Specifically, when the differential screw 121 rotates one revolution, the wafer tray leveling device 100 moves upward or downward by a distance equal to the pitch of the first thread 1211. Then, first distance differences between each end of the surface of the roughly adjusted wafer tray 130, particularly each end of the outer peripheral edge of the surface of the wafer tray 130, and the horizontal plane at the target height are again collected.

[0065] S540: performing secondary lifting and lowering adjustments on each end of the surface according to each first distance difference to reduce each first distance difference so that each end of the surface of the wafer tray coincides with a horizontal plane at a target height.

[0066] In some embodiments, based on the first distance difference between each end of the outer peripheral edge of the surface of the wafer tray 130 and each end of the horizontal plane at the target height, a secondary lifting adjustment, i.e., fine adjustment, can be performed on each end of the surface of the wafer tray 130. The adjustment range of the fine adjustment can be based on the difference in pitch between the first thread 1211 and the second thread 1212 of the differential screw 121, and the pitch of the first thread 1211 is greater than the pitch of the second thread 1212. For example, in some embodiments, the pitch of the first thread 1211 can range from 1 mm to 2.5 mm, and the pitch of the second thread 1212 can range from 0.5 mm to 2 mm.

[0067] Specifically, the first locking structure 123 disposed on the first end of the adjusting screw sleeve 122 is loosened (i.e., the locking screw located at the lower center of the leveling screw assembly 120 is loosened), and the second locking structure 124 disposed on the second end of the adjusting screw sleeve 122 is locked (i.e., the locking screw located at the upper center of the leveling screw assembly 120 is locked), thereby locking the bearing cover plate 125 and the adjusting screw sleeve 122, thereby indirectly locking the base 110 and the adjusting screw sleeve 122, so that the base 110 and the adjusting screw sleeve 122 are fixed as one. Thereafter, the differential screw 121 is rotated, and relative rotation occurs between the differential screw 121 and the adjusting screw sleeve 122. The lifting speed of the wafer tray leveling device 100 is determined by the difference in pitch between the first thread 1211 and the second thread 1212. That is, each end of the surface of the wafer tray 130 can be moved according to a multiple of the difference in pitch between the first thread 1211 and the second thread 1212, thereby performing a secondary lifting adjustment, i.e., fine adjustment. Specifically, each rotation of differential screw 121 causes wafer tray leveling device 100 to move upward or downward by a distance equal to the pitch of first thread 1211 minus the pitch of second thread 1212. The secondary lifting and lowering adjustment is then continued until each end of the surface of wafer tray 130, particularly the ends of the outer edge of the surface of wafer tray 130, completely coincides with the horizontal plane at the target height.

[0068] Although the above methods are illustrated and described as a series of acts for simplicity of explanation, it is to be understood and appreciated that these methods are not limited by the order of the acts, as some acts may occur in a different order and / or concurrently with other acts from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art according to one or more embodiments.

[0069] In summary, the present invention provides a wafer pallet leveling device, a wafer pallet leveling method, and a computer-readable storage medium. By adjusting the leveling angle of the wafer pallet in two modes, namely, coarse adjustment and fine adjustment, the leveling efficiency and leveling accuracy of the wafer pallet can be taken into account at the same time, and the horizontal angle of the wafer pallet can be adjusted to the ideal horizontal angle in a short time without the need for additional adjustment equipment, thereby avoiding increased costs.

[0070] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer tray leveling device, characterized in that: include: A base is arranged outside the bottom plate of the reaction chamber and is detachably connected to the bottom plate through a plurality of leveling screw assemblies; The leveling screw assembly includes a differential screw, wherein the upper end of the differential screw is provided with a first thread for threaded connection with the base plate, the lower end of the differential screw is provided with a second thread and is sleeved in an adjusting screw sleeve, the adjusting screw sleeve surrounds the second thread, and the pitch of the first thread is greater than the pitch of the second thread, wherein the first end of the adjusting screw sleeve is provided with a first locking structure for locking the differential screw and the adjusting screw sleeve so that the base performs a first-level lifting adjustment according to the pitch of the first thread, and the second end of the adjusting screw sleeve is provided with a second locking structure for locking the base and the adjusting screw sleeve so that the base performs a second-level lifting adjustment according to the difference between the pitches of the first thread and the second thread; as well as The wafer tray is arranged in the reaction chamber and connected to the base through a support rod to support the wafer.

2. The leveling device according to claim 1, characterized in that: The leveling screw assembly also includes a bearing cover plate, which is arranged above the base around the differential screw and covers the outside of the adjusting screw sleeve. The second locking structure indirectly locks the base and the adjusting screw sleeve by locking the bearing cover plate and the adjusting screw sleeve.

3. The leveling device according to claim 2, characterized in that: The first locking structure includes a first locking screw arranged on the outside of the differential screw and the adjusting screw sleeve, and the second locking structure includes a second locking screw arranged on the outside of the adjusting screw sleeve and passing through one side of the bearing cover plate.

4. The leveling device according to claim 2, characterized in that: A first bearing is provided between the bearing cover plate and the adjusting screw sleeve, and a second bearing is provided between the base and the adjusting screw sleeve.

5. The leveling device according to claim 1, wherein: The base includes at least three leveling screw assemblies, and the at least three leveling screw assemblies are dispersedly arranged on the outer peripheral edge of the base.

6. The leveling device according to claim 5, characterized in that: The base includes three leveling screw assemblies, and the angle between the three leveling screw assemblies is 120°.

7. A wafer tray leveling method, implemented using the wafer tray leveling device according to any one of claims 1 to 6, characterized in that: The following steps are involved: Adjusting the overall position of a wafer tray to near a target height, wherein the wafer tray is disposed in a reaction chamber and connected to a base disposed outside a bottom plate of the reaction chamber via support rods for supporting wafers, the base being detachably connected to the bottom plate via a plurality of leveling screw assemblies; Obtaining initial distance differences between each end of the surface of the wafer tray and the horizontal plane at the target height; performing a first-stage lifting adjustment on each end of the surface based on the initial distance differences to obtain first distance differences between each end of the surface and the horizontal plane, wherein the adjustment amplitude of the first-stage lifting adjustment is based on the pitch of the first thread of the differential screw in the leveling screw assembly; and According to the first distance differences, two-level lifting and lowering adjustments are performed on each end of the surface to reduce the first distance differences so that each end of the surface of the wafer tray coincides with the horizontal plane of the target height, wherein the adjustment amplitude of the two-level lifting and lowering adjustments is based on the difference between the pitches of the first thread and the second thread of the differential screw, and the pitch of the first thread is greater than the pitch of the second thread.

8. The leveling method according to claim 7, wherein: The positions of the plurality of leveling screw assemblies correspond to the lower sides of the respective ends of the surface of the wafer tray, wherein the upper ends of the differential screws are provided with a first thread for threaded connection with the bottom plate, and the lower ends of the differential screws are provided with a second thread and are sleeved in an adjusting screw sleeve, and the adjusting screw sleeve surrounds the second thread. The step of performing a first-level lifting adjustment on each end of the surface according to the initial distance differences to obtain each first distance difference between each end of the surface and the horizontal plane comprises: Locking a first locking structure disposed on a first end of the adjusting screw sleeve and loosening a second locking structure disposed on a second end of the adjusting screw sleeve to lock the differential screw and the adjusting screw sleeve; Rotating the differential screw to move each end of the surface according to a multiple of the pitch of the first thread to perform the first-level lifting adjustment; and The first distance differences between each end of the surface and the horizontal plane are obtained.

9. The leveling method according to claim 8, wherein: The step of performing a secondary lifting adjustment on each end of the surface according to each first distance difference to reduce each first distance difference so that each end of the surface of the wafer tray coincides with the horizontal plane of the target height includes: Loosening the first locking structure and locking the second locking structure to lock the base and the adjusting screw sleeve; Rotating the differential screw to generate relative rotation between the differential screw and the adjusting screw sleeve so that each end of the surface of the wafer tray moves according to a multiple of the difference between the pitches of the first thread and the second thread, thereby performing the secondary lifting adjustment; and The secondary lifting adjustment is continued until each end of the surface completely coincides with the horizontal plane.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the wafer tray leveling method according to any one of claims 7 to 9 is implemented.

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