An ultrasonic fingerprint recognition device and an electronic device

Abstract

An embodiment of the present application provides an ultrasonic fingerprint recognition device and an electronic device. The recognition device is disposed on the side middle frame of the electronic device to implement ultrasonic fingerprint recognition. The side middle frame has a mechanical button or a hidden button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, and a bonding wire. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to emit ultrasonic signals to the finger. The finger presses on the outer surface of the cover plate or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wire, and the ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the traces of the flexible circuit board.

Description

Technical Field

[0001] |The embodiments of the present application relate to the technical field of fingerprint recognition, and in particular, to an ultrasonic fingerprint recognition device and an electronic device. Background Art

[0002] |With the development of the consumer electronics industry, electronic devices with fingerprint recognition functions on the side are becoming more and more popular. Usually, a capacitive fingerprint recognition device is installed in the button of the side middle frame of the electronic device to achieve the fingerprint recognition function. Since the penetration of the capacitive fingerprint recognition chip in the capacitive fingerprint recognition device is poor, the mechanical reliability of the capacitive fingerprint recognition device is lacking, which in turn affects the button design of the side middle frame of the electronic device. Moreover, the capacitive fingerprint recognition chip also causes the button cover on the side of the electronic device to not be designed as a curved surface, which also affects the button design of the side middle frame of the electronic device..

[0003] Therefore, how to improve the mechanical reliability of the capacitive fingerprint recognition device and avoid the influence of the capacitive fingerprint recognition chip on the button design of the side middle frame of the electronic device has become an urgent technical problem to be solved. Summary of the Invention

[0004] In view of this, one of the technical problems solved by the embodiments of the present application is to provide an ultrasonic fingerprint recognition device and an electronic device, which improve the mechanical reliability of the capacitive fingerprint recognition device and avoid the influence of the capacitive fingerprint recognition chip on the button design of the side middle frame of the electronic device.

[0005] In a first aspect, an ultrasonic fingerprint recognition device is provided, which is disposed on the side middle frame of an electronic device to implement ultrasonic fingerprint recognition. The side middle frame has a mechanical button or a hidden button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, and a bonding wire. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover of the mechanical button or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to emit an ultrasonic signal to a finger, and the finger presses on the outer surface of the cover or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wire, and the ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the trace of the flexible circuit board.

[0006] In a second aspect, an electronic device is provided, including: a side middle frame and the ultrasonic fingerprint recognition device according to any one of claims 1-33. The ultrasonic fingerprint recognition device is disposed on the side middle frame to implement ultrasonic fingerprint recognition.

[0007] In the solution of the embodiment of the present application, the ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, and bonding wires. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button on the middle frame of the electronic device or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to emit ultrasonic signals to the finger. The finger presses on the outer surface of the cover plate or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wires, and the ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the traces of the flexible circuit board. Therefore, in the embodiment of the present application, by using the ultrasonic fingerprint sensor chip instead of the capacitive fingerprint sensor chip, it is avoided that the mechanical reliability of the capacitive fingerprint recognition device is lacking due to the poor penetrability of the capacitive fingerprint sensor chip, which in turn affects the button design of the side middle frame of the electronic device. Moreover, the button cover plate of the side button of the ultrasonic fingerprint sensor chip adopted in the embodiment of the present application can be designed as a curved surface, which has no impact on the button design of the side middle frame of the electronic device. Description of the Drawings

[0008] Some specific embodiments of the embodiments of the present application will be described in detail below with reference to the drawings in an exemplary but not restrictive manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0009] Figure 1 is a top view of a capacitive fingerprint recognition device installed on the side middle frame of an electronic device;

[0010] Figure 2 is a package schematic diagram of a capacitive fingerprint recognition device installed on the side middle frame of an electronic device;

[0011] Figure 3 is an assembly schematic diagram of a capacitive fingerprint recognition device installed on the side middle frame of an electronic device;

[0012] Figure 4 is a top view of the ultrasonic fingerprint recognition device provided by the embodiment of the present application;

[0013] Figure 5 is a package schematic diagram of the ultrasonic fingerprint recognition device provided by the embodiment of the present application;

[0014] Figure 6 is a side view of the ultrasonic fingerprint recognition device provided by the embodiment of the present application;

[0015] Figure 7 is a top view of the ultrasonic fingerprint recognition device provided by another embodiment of the present application;

[0016] Figure 8 Schematic diagram of the package of the ultrasonic fingerprint recognition device provided in another embodiment of the present application;

[0017] Figure 9 Side view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application;

[0018] Figure 10 Top view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0019] | Figure 11 Schematic diagram of the package of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0020] Figure 12 Side view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0021] Figure 13 Top view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0022] Figure 14 Schematic diagram of the package of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0023] | Figure 15 Side view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0024] Figure 16 Top view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0025] Figure 17 Schematic diagram of the package of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0026] Figure 18 Side view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0027] Figure 19 Top view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0028] Figure 20 Schematic diagram of the package of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0029] Figure 21 Side view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0030] Figure 22 Top view of the ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0031] Figure 23Schematic diagram of the package of the ultrasonic fingerprint recognition device provided by another embodiment of the present application;

[0032] | Figure 24 Top view of the ultrasonic fingerprint recognition device provided by another embodiment of the present application;

[0033] Figure 25 Schematic diagram of the package of the ultrasonic fingerprint recognition device provided by another embodiment of the present application;

[0034] | Figure 26 Schematic diagram of the electronic device provided by another embodiment of the present application. Detailed implementation manners

[0035] The following further illustrates the specific implementation of the embodiments of the present invention in conjunction with the accompanying drawings of the embodiments of the present invention.

[0036] The embodiments of the present application can be applied to any electronic device that can install an indication recognition device in the side middle frame, such as mobile phones, tablets, computers, wearable devices, etc.

[0037] Figure 1 Top view of the capacitive fingerprint recognition device installed on the side middle frame of the electronic device, Figure 2 Schematic diagram of the package of the capacitive fingerprint recognition device installed on the side middle frame of the electronic device, Figure 3 Assembly schematic diagram of the capacitive fingerprint recognition device installed on the side middle frame of the electronic device.

[0038] See Figure 1 and Figure 2 , the capacitive fingerprint recognition device includes a plastic encapsulation layer 11 provided on the inner surface of the button cover plate 2, and a capacitive fingerprint recognition chip 12 wrapped by the plastic encapsulation layer 11. Since the penetration performance of the capacitive fingerprint recognition chip 12 in the capacitive fingerprint recognition device is poor, the thickness of the plastic encapsulation layer 11 on the front surface of the capacitive fingerprint recognition chip 12 needs to be controlled within 150 um. Therefore, the mechanical reliability of the capacitive fingerprint recognition device is poor. See Figure 2 , in order to improve the mechanical reliability of the capacitive fingerprint recognition device, grooves are usually dug in the button area corresponding to the capacitive fingerprint recognition device on the side middle frame of the electronic device, so that the height of the button is lower than the plane where the middle frame is located, thereby using the middle frame to protect the capacitive fingerprint recognition device with poor mechanical reliability. Due to the limitation of the capacitive fingerprint recognition chip 12, the pressing surface of the capacitive fingerprint recognition button on the side middle frame of the electronic device can generally only be a plane. When the middle frame is designed with an arc surface, the morphological beauty of the capacitive fingerprint recognition button design is lacking at this time. Moreover, the surface process of the capacitive fingerprint recognition button is mostly a matte coating process, which also has certain limitations on the button design.

[0039] To overcome the above technical deficiencies, in the embodiments of the present application, an ultrasonic fingerprint sensor chip is used instead of a capacitive fingerprint sensor chip, avoiding the lack of mechanical reliability of the capacitive fingerprint recognition device due to poor penetrability of the capacitive fingerprint sensor chip, which in turn affects the button design of the side middle frame of the electronic device. Moreover, the button cover plate of the side button of the ultrasonic fingerprint sensor chip adopted in the embodiments of the present application can be designed as a curved surface, which has no impact on the button design of the side middle frame of the electronic device.

[0040] A specific implementation of an embodiment of the present application provides an ultrasonic fingerprint recognition device. The ultrasonic fingerprint recognition device in the embodiments of the present application is arranged on the side middle frame of the electronic device to achieve ultrasonic fingerprint recognition. The side middle frame of the electronic device has mechanical buttons or hidden buttons. A mechanical button refers to a component that has a button cover plate and is separately arranged from the side middle frame of the electronic device, and the corresponding operation can be realized by pressing the mechanical button with a user's finger; a hidden button refers to a component that is integrated with the side middle frame of the electronic device and the corresponding operation can also be realized by pressing the mechanical button with a user's finger.

[0041] The first embodiment

[0042] Figure 4 is a top view of the ultrasonic fingerprint recognition device provided by the embodiment of the present application, Figure 5 is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided by the embodiment of the present application, Figure 6 is a side view of the ultrasonic fingerprint recognition device provided by the embodiment of the present application.

[0043] |See Figure 4 and Figure 5 , the ultrasonic fingerprint recognition device 4 provided by the embodiment of the present application is applied to an electronic device with mechanical buttons on the side middle frame. The ultrasonic fingerprint recognition device 4 includes: an ultrasonic fingerprint sensor chip 41, a flexible circuit board 42, and a bonding wire 43. The back surface of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the cover plate 2 of the mechanical button. The front surface of the ultrasonic fingerprint sensor chip 41 reserves pads and is electrically connected to the first surface of the flexible circuit board 42 through the bonding wire 43. The ultrasonic fingerprint sensor chip 41 is used to emit ultrasonic signals to the finger. The finger presses on the outer surface of the cover plate, and the ultrasonic fingerprint sensor chip 41 receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip 41 is connected to the main board (not shown in the figure) of the electronic device through the traces of the flexible circuit board 42. The second surface of the flexible circuit board 43 is attached to the inner surface of the cover plate 2 of the mechanical button.

[0044] In a specific implementation of the embodiment of the present application, in order to ensure the bonding effect between the ultrasonic fingerprint sensor chip 41 and the cover plate 2 of the mechanical button, the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the cover plate 2 of the mechanical button through an adhesive 44.

[0045] Specifically, the adhesive 44 is glue or a film adhesive, which further improves the bonding effect and saves the process cost.

[0046] In a specific implementation of the first embodiment of the present application, the ultrasonic fingerprint recognition device 4 further includes a special-shaped reinforcement member 45. One end of the special-shaped reinforcement member 45 is connected to the inner surface of the cover plate 2, and the other end is attached to the first surface of the flexible circuit board 42. The special-shaped reinforcement member 45 surrounds the ultrasonic fingerprint sensor chip 41 to provide reinforcement protection, and a gap layer 46 is provided between the special-shaped reinforcement member 45 and the front surface of the ultrasonic fingerprint sensor chip 41.

[0047] Specifically, the gap layer 46 is a foam or air, so that the penetration of the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 in the direction of the gap layer 46 is interrupted, only the change in the ultrasonic signal of the finger pressing the cover plate is retained, reducing the interference of useless ultrasonic signals and improving the consistency of the signal volume.

[0048] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is coated with a bonding wire protective glue 431 to protect the bonding wire 43 and the corresponding pads of the bonding wire 43.

[0049] The special-shaped reinforcement member 45 in the embodiment of the present application is used to reinforce and protect the acoustic wave fingerprint sensor chip 41, thereby improving the mechanical reliability of the ultrasonic fingerprint recognition device 4.

[0050] See Figure 6 , the periphery of the ultrasonic fingerprint sensor chip 41 is sealed by dispensing 47, thereby improving the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0051] Specifically, the gap layer 46 is set as a foam, which can prevent the dispensing 47 from contaminating the ultrasonic fingerprint sensor chip 41.

[0052] In a specific implementation of the first embodiment of the present application, in order to enable the button cover plate 2 to provide a better pressing feel, the ultrasonic fingerprint recognition device 4 further includes a silica gel layer 48. The first surface of the silica gel layer 48 is attached to the second surface of the special-shaped reinforcement member 45, and the second surface of the silica gel layer 48 has a dome protrusion, so that when the outer surface of the cover plate 2 receives the force of the finger, the silica gel layer 48 presses the dome protrusion.

[0053] The button cover plate 2 of the side button of the ultrasonic fingerprint sensor chip 41 adopted in the embodiment of the present application can be designed as a curved surface, which has no influence on the button design of the side frame of the electronic device and can improve the aesthetic feeling of the button design.

[0054] The material of the cover plate 2 in the embodiments of the present application can be one of glass, hardware, and plastic. Specifically, the glass can contain ink, or sapphire glass containing ink can be used. The hardware can be aluminum alloy, stainless steel, etc., and processes such as vacuum plating are used. The plastic supports vacuum plating for gloss, matte, spraying, and material polishing. The cover plate in the embodiments of the present application supports the selection of various materials and processes, improving the morphological beauty of the button design.

[0055] In the embodiments of the present application, by using an ultrasonic fingerprint sensor chip instead of a capacitive fingerprint sensor chip, the lack of mechanical reliability of the capacitive fingerprint recognition device caused by the poor penetration of the capacitive fingerprint sensor chip is avoided. In the embodiments of the present application, the thickness of the cover plate 2 is greater than or equal to 2 mm. The ultrasonic fingerprint recognition device has strong mechanical reliability and does not require the design of a button to protect the ultrasonic fingerprint recognition device.

[0056] Specifically, the thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm, so as to ensure that the ultrasonic fingerprint recognition device has strong mechanical reliability and is convenient for the design and processing of the cover plate.

[0057] Second Embodiment

[0058] Figure 7 It is a top view of the ultrasonic fingerprint recognition device provided by another embodiment of the present application. Figure 8 It is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided by another embodiment of the present application. Figure 9 It is a side view of the ultrasonic fingerprint recognition device provided by another embodiment of the present application.

[0059] See Figure 7 And Figure 8 , the ultrasonic fingerprint recognition device 4 provided by another embodiment of the present application is applied to an electronic device with a mechanical button on the side middle frame. The difference from the first embodiment is that the ultrasonic fingerprint recognition device 4 further includes an annular component 49. One end of the annular component 49 is arranged around the cover plate 2, and the other end of the annular component 49 is respectively connected to the special-shaped reinforcement component 45 and the back surface of the flexible circuit board 42 to form a sealed environment, and the ultrasonic fingerprint sensor chip 41 is in the sealed environment.

[0060] Specifically, one end of the annular component 49 in the embodiments of the present application being arranged around the cover plate 2 includes one end of the annular component 49 being arranged around the inner surface or the outer surface of the cover plate 2 ( Figure 7 as shown).

[0061] See Figure 9, the periphery of the ultrasonic fingerprint sensor chip 41 is combined with the special-shaped reinforcement member 45 and the flexible circuit board 42 through the annular member 49 to form a sealed environment, thereby improving the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device according to the embodiment of the present application.

[0062] Specifically, in a specific implementation of the embodiment of the present application, the cover plate 2 is made of a plastic material, and the process adopts an injection molding process or a sheet CNC (Computer Numerical Control) process.

[0063] The annular member 49 can be made of metal or plastic. When a metal material is selected, it can be combined with the cover plate 2 by means of glue bonding, in-mold injection molding, etc. When a plastic material is selected, it can be integrally injection-molded with the cover plate 2.

[0064] |In a specific implementation of the embodiment of the present application, in order to further improve the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device, the special-shaped reinforcement member 45 and the annular member 49 and the special-shaped reinforcement member 45 and the cover plate 2 are connected by dispensing 47.

[0065] Specifically, the gap layer 46 is a foam or air, so that the penetration of the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 in the direction of the gap layer 46 is interrupted, and only the change of the ultrasonic signal when the finger presses the cover plate is retained, reducing the interference of useless ultrasonic signals and improving the consistency of the signal volume.

[0066] Specifically, the gap layer 46 is set as an air gap, which can provide better blocking of useless ultrasonic signals in the direction of the gap layer 46 and can further improve the consistency of the signal volume.

[0067] The third embodiment

[0068] Figure 10 This is a top view of the ultrasonic fingerprint recognition device provided by another embodiment of the present application. Figure 11 This is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided by another embodiment of the present application. Figure 12 This is a side view of the ultrasonic fingerprint recognition device provided by another embodiment of the present application.

[0069] See Figures 10 to 12, the ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device with a mechanical button on the side middle frame. The difference from the second embodiment is that the annular component 49 in the ultrasonic fingerprint recognition device 4 is made of metal material, and one end of the annular component 49 is arranged around the outer surface of the cover plate 2 so that when a finger presses the cover plate, it touches the annular component 49. The reserved pads of the flexible circuit board 42 include a ground terminal and pads for receiving a capacitive sensor. The annular component 49 is electrically connected to the ground terminal of the flexible circuit board 42 or the pads 51 of the receiving capacitive sensor through a conductive adhesive 50, thereby forming a ground terminal or a receiving capacitive sensor. If a receiving capacitive sensor is formed, the receiving capacitive sensor can be used to trigger the electronic device to enter the fingerprint recognition state from the sleep state.

[0070] | In the embodiment of the present application, an annular component made of metal material is adopted. The surface of the annular component made of metal material is conductive, so that a ground terminal or a receiving capacitive sensor can be further formed through electrical connection with the pads on the flexible circuit board. The embodiment of the present application can realize further circuit functions through the annular component made of metal material, and the annular component made of metal material also reduces the width space of the button cover plate and improves the aesthetic feeling of the button form.

[0071] Fourth Embodiment

[0072] Figure 13 is a top view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application, Figure 14 is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided in another embodiment of the present application, Figure 15 is a side view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application.

[0073] | See Figure 13 、 Figure 14 , the ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device with a mechanical button on the side middle frame. The difference from the first embodiment is that the ultrasonic fingerprint recognition device 4 further includes a reinforcing plate 52. The flexible circuit board 42 includes a first part 421, and the ultrasonic fingerprint sensor chip 41 includes a first part 411 and a second part 412. The front surface of the first part 411 of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the cover plate 2 of the mechanical button. The front surface of the second part 412 of the ultrasonic fingerprint sensor chip 41 reserves pads and is electrically connected to the first surface of the first part 421 of the flexible circuit board 42 through a bonding wire 43. The second surface of the first part 421 of the flexible circuit board 42 and the back surface of the ultrasonic fingerprint sensor chip 41 are both attached to the first surface of the reinforcing plate 52.

[0074] |In a specific implementation of the first embodiment of the present application, in order to ensure the fitting effect between the ultrasonic fingerprint sensor chip 41 and the cover plate 2 of the mechanical button, the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the cover plate 2 of the mechanical button through an adhesive 44.

[0075] Specifically, the adhesive 44 is glue or a film adhesive, which further improves the fitting effect and saves the process cost.

[0076] In a specific implementation of the first embodiment of the present application, the ultrasonic fingerprint recognition device 4 further includes a special-shaped reinforcement member 45. One end of the first surface of the special-shaped reinforcement member 45 is connected to the inner surface of the cover plate 2, and the other end is connected to an edge end of the second surface of the reinforcement plate 52. The special-shaped reinforcement member 45 surrounds the ultrasonic fingerprint sensor chip 41 to provide reinforcement protection, and a gap layer 46 is provided between the first surface of the special-shaped reinforcement member 45 and the second surface of the reinforcement plate 52.

[0077] Specifically, one end of the first surface of the special-shaped reinforcement member 45 is connected to the inner surface of the cover plate 2 through an adhesive, and the other end is connected to an edge end of the second surface of the reinforcement plate 52 through an adhesive.

[0078] |Specifically, the gap layer 46 is a foam or air, so that the penetration of the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 in the direction of the gap layer 46 is interrupted, only the change of the ultrasonic signal when the finger presses the cover plate is retained, the interference of the useless ultrasonic signal is reduced, and the consistency of the signal volume is improved.

[0079] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is coated with a bonding wire protective glue 431 to protect the bonding wire 43 and the corresponding pads of the bonding wire 43.

[0080] The special-shaped reinforcement member 45 in the embodiment of the present application is used to reinforce and protect the acoustic wave fingerprint sensor chip 41, thereby improving the mechanical reliability of the ultrasonic fingerprint recognition device 4.

[0081] See Figure 15 , the periphery of the ultrasonic fingerprint sensor chip 41 is sealed by dispensing 47, thereby improving the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0082] Specifically, the gap layer 46 is set as a foam, which can prevent the dispensing 47 from contaminating the ultrasonic fingerprint sensor chip 41.

[0083] |In a specific implementation of the first embodiment of the present application, in order to enable the button cover plate 2 to provide a better pressing feel, the ultrasonic fingerprint recognition device 4 further includes a silica gel layer 48. The first surface of the silica gel layer 48 is attached to the second surface of the special-shaped reinforcement member 45. The second surface of the silica gel layer 48 has a dome protrusion. When the outer surface of the cover plate 2 receives the force of a finger, the silica gel layer 48 presses the dome protrusion.

[0084] |The button cover plate 2 of the side button of the ultrasonic fingerprint sensor chip 41 adopted in the embodiment of the present application can be designed as an arc surface, which has no influence on the button design of the side middle frame of the electronic device and can improve the aesthetic feeling of the button design.

[0085] The material of the cover plate 2 in the embodiment of the present application can be one of glass, hardware, and plastic. Specifically, the glass can contain ink, or sapphire glass containing ink can be used. The hardware can be made of aluminum alloy, stainless steel, etc. The process adopts processes such as vacuum plating. The plastic supports vacuum plating, matte, spraying, and material polishing. The cover plate in the embodiment of the present application supports the selection of various materials and processes, which improves the aesthetic feeling of the button design.

[0086] In the embodiment of the present application, by using an ultrasonic fingerprint sensor chip instead of a capacitive fingerprint sensor chip, it is avoided that the mechanical reliability of the capacitive fingerprint recognition device is lacking due to the poor penetration of the capacitive fingerprint sensor chip. In the embodiment of the present application, the thickness of the cover plate 2 is greater than or equal to 2 mm, and the ultrasonic fingerprint recognition device has strong mechanical reliability, and there is no need to protect the ultrasonic fingerprint recognition device through the button design.

[0087] |Specifically, the thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm, so as to ensure that the ultrasonic fingerprint recognition device has strong mechanical reliability and is convenient for the design and processing of the cover plate.

[0088] Fifth Embodiment

[0089] Figure 16 It is a top view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application. Figure 17 It is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided in another embodiment of the present application. Figure 18 It is a side view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application.

[0090] |See Figure 16 and Figure 17, the ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device with a mechanical button on the side middle frame. The difference from the fourth embodiment is that the ultrasonic fingerprint recognition device 4 further includes an annular component 49. One end of the annular component 49 is arranged around the cover plate 2, and the other end of the annular component 49 is respectively connected to the special-shaped reinforcement component 45 and the back surface of the flexible circuit board 42 to form a sealed environment, and the ultrasonic fingerprint sensor chip 41 is in the sealed environment.

[0091] |See Figure 18 , the periphery of the ultrasonic fingerprint sensor chip 41 combines with the special-shaped reinforcement component 45 and the flexible circuit board 42 through the annular component 49 to form a sealed environment, thereby improving the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0092] Specifically, in a specific implementation of an embodiment of the present application, the cover plate 2 is made of a plastic material, and the process adopts an injection molding process or a sheet CNC (Computer Numerical Control) process.

[0093] The annular component 49 can be made of metal or plastic. When a metal material is selected, it can be combined with the cover plate 2 by means of glue bonding, in-mold injection molding, etc. When a plastic material is selected, it can be integrally injection-molded with the cover plate 2.

[0094] In a specific implementation of an embodiment of the present application, in order to further improve the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device, the special-shaped reinforcement component 45 and the annular component 49 and the special-shaped reinforcement component 45 and the cover plate 2 are connected by dispensing 47.

[0095] Specifically, the gap layer 46 is a foam or air, so that the penetration of the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 in the direction of the gap layer 46 is interrupted, only the change of the ultrasonic signal when the finger presses the cover plate is retained, the interference of useless ultrasonic signals is reduced, and the consistency of the signal volume is improved.

[0096] Specifically, the gap layer 46 is set as an air gap, which can provide better blocking of useless ultrasonic signals in the direction of the gap layer 46 and can further improve the consistency of the signal volume.

[0097] Sixth Embodiment

[0098] Figure 19 is a top view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application, Figure 20 is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided in another embodiment of the present application, Figure 21 is a side view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application.

[0099] See Figures 19 to 21 Figures 19 to 21 , the ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device with a mechanical button on the side middle frame. The difference from the second embodiment is that the periphery of the cover plate 2 of the ultrasonic fingerprint recognition device 4 has an annular raised edge 53 facing the inner surface of the cover plate 2. The back surface of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the cover plate 2 of the mechanical button. The ultrasonic fingerprint sensor chip 41 is accommodated within the annular raised edge 53. The front surface of the ultrasonic fingerprint sensor chip 41 reserves pads and is electrically connected to the first surface of the flexible circuit board 42 through bonding wires 43.

[0100] In the embodiment of the present application, by using the annular raised edge 53 facing the inner surface of the cover plate 2 around the cover plate 2 to replace the annular component 49 in the second embodiment, the annular raised edge 53 on the inner surface of the cover plate 2 improves the waterproof performance, mechanical reliability, and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0101] Specifically, the cover plate 2 in the embodiment of the present application uses a plastic material and an injection molding process, thereby making the manufacturing process of the cover plate simpler and saving manufacturing and assembly costs.

[0102] In a specific implementation of the embodiment of the present application, the ultrasonic fingerprint recognition device 4 further includes a reinforcing plate 52. The second surface of the flexible circuit board 42 is attached to the first surface of the reinforcing plate 52. A gap layer 46 is provided between the second surface of the reinforcing plate 52 and the front surface of the ultrasonic fingerprint sensor chip 41. The reinforcing plate in the embodiment of the present application improves the strength of the ultrasonic fingerprint recognition device 4.

[0103] In a specific implementation of the embodiment of the present application, the ultrasonic fingerprint recognition device 4 further includes a special-shaped reinforcing component 45. One end of the special-shaped reinforcing component 45 is attached to the first surface of the flexible circuit board 42, and the other end is connected to the annular raised edge 53.

[0104] The special-shaped reinforcing component 45 in the embodiment of the present application is used to reinforce and protect the acoustic wave fingerprint sensor chip 41, thereby improving the mechanical reliability of the ultrasonic fingerprint recognition device 4.

[0105] In the embodiment of the present application, the annular raised edge 53 combines with the special-shaped reinforcing component 45 and the reinforcing plate 52 to form a sealed environment, thereby further improving the waterproof performance, mechanical reliability, and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0106] In the embodiment of the present application, the annular raised edge 53 is respectively sealed with the special-shaped reinforcing component 45 and the reinforcing plate 52 through glue dots 47, thereby further improving the waterproof performance, mechanical reliability, and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0107] Specifically, the gap layer 46 is made of foam or air, so that the penetration of the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 in the direction of the gap layer 46 is interrupted, only the change in the ultrasonic signal when the finger presses the cover plate is retained, the interference of useless ultrasonic signals is reduced, and the consistency of the signal volume is improved.

[0108] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is coated with a bonding wire protective glue 431 to protect the bonding wire 43 and the corresponding pad of the bonding wire 43.

[0109] Specifically, a foam is provided at the position of the bonding wire protective glue 431 corresponding to the bonding wire 43 in the gap layer 46 to prevent the bonding wire protective glue 431 from overflowing into the area where the ultrasonic fingerprint sensor chip 41 is connected to the bonding wire 43.

[0110] The Seventh Embodiment

[0111] | Figure 22 is a top view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application. Figure 23 is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided in another embodiment of the present application.

[0112] See Figure 22 、 Figure 23, the ultrasonic fingerprint recognition device 4 provided by another embodiment of the present application is applied to an electronic device with a hidden button on the side middle frame. The ultrasonic fingerprint recognition device 4 provided by another embodiment of the present application includes: an ultrasonic fingerprint sensor chip 41, a flexible circuit board 42, a bonding wire 43, a reinforcing plate 52, and a reinforcing support member 54. The ultrasonic fingerprint sensor chip 41 includes a first part 411 and a second part 422. The flexible circuit board 42 includes a first part 421 and a second part 433, and the first part 421 and the second part 422 of the flexible circuit board 42 are formed into a U shape by folding. The reinforcing support member 54 includes two elastic arms 541 and a reinforcing part 542 with two ends respectively connected to the two elastic arms 541. The front surface of the first part 411 of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the middle frame 3 corresponding to the hidden button. Pads are reserved on the front surface of the second part 412 of the ultrasonic fingerprint sensor chip 41 and are electrically connected to the first surface of the first part 421 of the flexible circuit board 42 through the bonding wire 43. The second surface of the first part 421 of the flexible circuit board 42 and the back surface of the ultrasonic fingerprint sensor chip 41 are both attached to the first surface of the reinforcing plate 52. A gap layer 46 is provided between the reinforcing plate 52 and the second surface of the second part 422 of the flexible circuit board 42. Multiple sensors are provided on the second surface of the second part 422 of the flexible circuit board 42, and the multiple sensors are used to sense the pressing position of the finger pressing the hidden button 3. The first surface of the second part 422 of the flexible circuit board 42 is attached to the reinforcing part 542, and the two elastic arms 541 are connected to the middle frame reinforcing rib 3, so that the reinforcing part 542 is parallel to the middle frame reinforcing rib 6 and there is an air gap in the middle.

[0113] In the embodiment of the present application, when the finger presses the hidden button, the ultrasonic fingerprint sensor chip 41 is used to emit an ultrasonic signal to the finger. The finger presses on the outer surface of the hidden button, and the ultrasonic fingerprint sensor chip 41 receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip 41 is connected to the main board (not shown in the figure) of the electronic device through the traces of the flexible circuit board 42. In the embodiment of the present application, when the finger presses the hidden button, multiple sensors provided on the flexible circuit board 42 sense the position of the finger pressing the invisible button. Exemplarily, if the multiple sensors are pressure sensors, when the finger presses the invisible button, when the pressing positions are different, the magnitudes of the pressure values of each pressure sensor are different. For example, when pressing at position A, the signal amount generated by the deformation or displacement of the pressure sensor close to position A is greater than the signal amount at position B, and vice versa. In addition, the pressing position can also be determined by assisting in positioning through the position coordinates of the fingerprint when the finger presses, and thus the functions corresponding to the button can be realized.

[0114] Specifically, the hidden button is one of: a volume button, a brightness button, a navigation button, and a sliding button.

[0115] For example, when the hidden button is a volume button, position A is volume +, and position B is volume -, in the embodiment of the present application, the user can perform fingerprint recognition and volume adjustment by pressing the hidden button.

[0116] Specifically, the sensor is a capacitive sensor or a resistive sensor. If it is a capacitive sensor, the pressure value of each position is obtained through the capacitance change generated by pressing. If it is a resistive sensor, the pressure value of each position is obtained through the resistance change generated by resistance stretching. This is the prior art of capacitive sensors and resistive sensors, so it will not be elaborated here.

[0117] In a specific implementation of Embodiment 1 of the present application, when the sensor is a capacitive sensor, the reinforcing plate 52 adopts a steel sheet reinforcing plate and becomes a capacitance emitting sensor. The second surface of the first part 421 of the flexible circuit board 42 is attached to the first surface of the reinforcing plate 52 through a conductive adhesive, so that the reinforcing plate 52 is electrically connected to the capacitance emitting sensor pads reserved on the flexible circuit board 42. The second surface of the second part 422 of the flexible circuit board 42 is provided with a plurality of sensors as capacitance receiving sensors corresponding to the capacitance emitting sensor.

[0118] Specifically, a gap layer 46 is provided between the reinforcing plate 52 and the second surface of the second part 422 of the flexible circuit board 42, which is an air gap formed by foams respectively arranged at both ends of the reinforcing plate 52 and the second part 422 of the flexible circuit board 42. The foams respectively arranged at both ends of the reinforcing plate 52 and the second part 422 of the flexible circuit board 42 are used to absorb the tolerance between the capacitance emitting sensor and the capacitance receiving sensor, and the air gap serves as the reserved air gap between the capacitance emitting sensor and the capacitance receiving sensor.

[0119] The reinforcing support member 54 fixes the capacitance receiving sensors on the second part of the flexible circuit board 42, and two elastic arms 541 are connected to the middle frame reinforcing rib 6, so that the reinforcing part 542 is parallel to the middle frame reinforcing rib 3 and there is an air gap in the middle, so that the rebounding forces of the reinforcing part 542 and the middle frame reinforcing rib 6 pre-press the foams at both ends of the reinforcing plate 52 and the second part 422 of the flexible circuit board 42. The middle frame reinforcing rib 6 further provides reinforcement for the reinforcing support member 54.

[0120] In a specific implementation of Embodiment 1 of the present application, in order to ensure the fitting effect between the ultrasonic fingerprint sensor chip 41 and the inner surface of the middle frame corresponding to the hidden button 3, the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the middle frame corresponding to the hidden button 3 through an adhesive 44.

[0121] Specifically, the adhesive 44 is glue or a film adhesive, which further improves the fitting effect and saves the process cost.

[0122] |In a specific implementation of the first embodiment of the present application, the bonding wire 43 is coated with a bonding wire protective glue 431 to protect the bonding wire 43 and the corresponding pad of the bonding wire 43.

[0123] |In the embodiment of the present application, the frame is made of plastic or metal.

[0124] The middle frame corresponding to the hidden button 3 of the ultrasonic fingerprint sensor chip 41 adopted in the embodiment of the present application can be designed as a curved surface, which has no influence on the design of the side middle frame of the electronic device and can improve the aesthetic feeling of the middle frame design.

[0125] In the embodiment of the present application, by using an ultrasonic fingerprint sensor chip instead of a capacitive fingerprint sensor chip, the lack of mechanical reliability of the capacitive fingerprint recognition device caused by the poor penetration of the capacitive fingerprint sensor chip is avoided. The thickness of the middle frame in the embodiment of the present application is greater than or equal to 2 mm, and the ultrasonic fingerprint recognition device has strong mechanical reliability and does not need to be protected by design.

[0126] |Specifically, the thickness of the middle frame is one of 0.8 mm, 1.0 mm, and 1.3 mm, so as to ensure that the ultrasonic fingerprint recognition device has strong mechanical reliability and is convenient for the design and processing of the cover plate.

[0127] Eighth Embodiment

[0128] | Figure 24 It is a top view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application. Figure 25 It is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided in another embodiment of the present application.

[0129] |See Figure 24 、 Figure 25, the ultrasonic fingerprint recognition device 4 provided by another embodiment of the present application is applied to an electronic device with a hidden button on the side middle frame. The ultrasonic fingerprint recognition device 4 provided by another embodiment of the present application includes: an ultrasonic fingerprint sensor chip 41, a flexible circuit board 42, a bonding wire 43, a reinforcing plate 52, and a reinforcing support member 54. The ultrasonic fingerprint sensor chip 41 includes a first part 411 and a second part 422. The flexible circuit board 42 includes a first part 421 and a second part 433, and the first part 421 and the second part 422 of the flexible circuit board 42 are formed into a U shape by folding. The reinforcing support member 54 includes two elastic arms 541 and a reinforcing part 542 with both ends respectively connected to the two elastic arms 541. The front surface of the first part 411 of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the middle frame corresponding to the hidden button 3, pads are reserved on the front surface of the second part 412 of the ultrasonic fingerprint sensor chip 41 and are electrically connected to the first surface of the first part 421 of the flexible circuit board 42 through the bonding wire 43. The second surface of the first part 421 of the flexible circuit board 42 and the back surface of the ultrasonic fingerprint sensor chip 41 are both attached to the first surface of the reinforcing plate 52. A gap layer 46 is provided between the reinforcing plate 52 and the second surface of the second part 422 of the flexible circuit board 42. Multiple sensors are provided on the second surface of the second part 422 of the flexible circuit board 42. The multiple sensors are used to sense the pressing position of the finger pressing the hidden button 3. The first surface of the second part 422 of the flexible circuit board 42 is attached to the reinforcing part 542. The two elastic arms 541 are connected to the inner surface of the middle frame where the hidden button 3 is located, so that the reinforcing part 542 is parallel to the middle frame where the hidden button 3 is located, and the second surface of the reinforcing part 542 is attached to the middle frame reinforcing rib 6..

[0130] |In the embodiment of the present application, when the finger presses the hidden button, the ultrasonic fingerprint sensor chip 41 is used to emit ultrasonic signals to the finger. The finger presses on the outer surface of the cover plate. The ultrasonic fingerprint sensor chip 41 receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip 41 is connected to the main board (not shown in the figure) of the electronic device through the wiring of the flexible circuit board 42. In the embodiment of the present application, when the finger presses the hidden button, multiple sensors provided on the flexible circuit board 42 sense the position of the finger pressing the invisible button 3. Exemplarily, if the multiple sensors are pressure sensors, when the finger presses the invisible button 3, when the pressing positions are different, the magnitudes of the pressure values of each pressure sensor are different. For example, when pressing at position A, the signal amount generated by the deformation or displacement of the pressure sensor close to position A is greater than the signal amount at position B, and vice versa. In addition, the pressing position can also be determined by assisting in positioning through the position coordinates of the fingerprint when the finger presses, thereby realizing the functions corresponding to the buttons.

[0131] Specifically, the hidden button 3 is one of: a volume button, a brightness button, a navigation button, and a sliding button.

[0132] |For example, when the hidden button 3 is a volume button, position A is volume +, and position B is volume -, in the embodiment of the present application, the user can perform fingerprint recognition and volume adjustment by pressing the hidden button 3.

[0133] |Specifically, the sensor is a capacitive sensor or a resistive sensor. If it is a capacitive sensor, the pressure value of each position is obtained through the capacitance change generated by pressing. If it is a resistive sensor, the pressure value of each position is obtained through the resistance change generated by resistance stretching. This is the prior art of capacitive sensors and resistive sensors, so it will not be elaborated here.

[0134] |In a specific implementation of the first embodiment of the present application, when the sensor is a capacitive sensor, the reinforcement plate 52 is a steel sheet reinforcement plate and becomes a capacitance emission sensor. The second surface of the first part 421 of the flexible circuit board 42 is attached to the first surface of the reinforcement plate 52 through a conductive adhesive, so that the reinforcement plate 52 is electrically connected to the capacitance emission sensor pads reserved on the flexible circuit board 42. A plurality of sensors are provided on the second surface of the second part 422 of the flexible circuit board 42 as capacitance receiving sensors corresponding to the capacitance emission sensor.

[0135] |Specifically, a gap layer 46 is provided between the reinforcement plate 52 and the second surface of the second part 422 of the flexible circuit board 42, which is an air gap with foam provided at both ends of the reinforcement plate 52 and the second part 422 of the flexible circuit board 42. The foam provided at both ends of the reinforcement plate 52 and the second part 422 of the flexible circuit board 42 is used to absorb the tolerance between the capacitance emission sensor and the capacitance receiving sensor, and the air gap serves as the reserved air gap between the capacitance emission sensor and the capacitance receiving sensor.

[0136] The reinforcement support member 54 fixes the capacitance receiving sensors on the second part of the flexible circuit board 42, and two elastic arms 541 are connected to the middle frame reinforcing rib 3, so that the reinforcing part 542 is parallel to the middle frame reinforcing rib 3 and there is an air gap in the middle, so that the restoring forces of the reinforcing part 542 and the middle frame reinforcing rib 3 pre-press the foam at both ends of the reinforcement plate 52 and the second part 422 of the flexible circuit board 42. The middle frame reinforcing rib 3 further provides reinforcement to the reinforcement support member 54.

[0137] In a specific implementation of the first embodiment of the present application, in order to ensure the fitting effect between the ultrasonic fingerprint sensor chip 41 and the inner surface of the middle frame corresponding to the hidden button 3, the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the middle frame corresponding to the hidden button 3 through an adhesive 44.

[0138] |Specifically, the adhesive 44 is glue or a film, which further improves the fitting effect and saves the process cost.

[0139] In a specific implementation of Embodiment 1 of the present application, the bonding wire 43 is coated with a bonding wire protective glue 431 to protect the bonding wire 43 and the corresponding pad of the bonding wire 43.

[0140] | In the embodiments of the present application, the frame is made of plastic or metal.

[0141] The middle frame corresponding to the hidden button 3 of the ultrasonic fingerprint sensor chip 41 adopted in the embodiments of the present application can be designed as a curved surface, which has no influence on the design of the side middle frame of the electronic device and can improve the aesthetic feeling of the middle frame design.

[0142] | By adopting an ultrasonic fingerprint sensor chip instead of a capacitive fingerprint sensor chip in the embodiments of the present application, it is avoided that the mechanical reliability of the capacitive fingerprint recognition device is lacking due to the poor penetrability of the capacitive fingerprint sensor chip. The thickness of the middle frame in the embodiments of the present application is greater than or equal to 2 mm, and the ultrasonic fingerprint recognition device has strong mechanical reliability and does not need to be protected by design.

[0143] Specifically, the thickness of the middle frame is one of 0.8 mm, 1.0 mm, and 1.3 mm, so as to ensure that the ultrasonic fingerprint recognition device has strong mechanical reliability and is convenient for the design and processing of the cover plate.

[0144] | In a specific implementation of Embodiment 1 of the present application, the middle frame reinforcing rib 6 has a plurality of support protrusions, and the second surface of the reinforcing part 542 is attached to the support protrusions of the middle frame reinforcing rib 6, and the support protrusions are beneficial to deformation or displacement.

[0145] See Figure 26 , yet another embodiment of the present application further provides an electronic device, including: a side middle frame and the above-mentioned ultrasonic fingerprint recognition device 4, and the ultrasonic fingerprint recognition device is arranged on the side middle frame to realize ultrasonic fingerprint recognition.

[0146] The electronic device of the embodiments of the present application includes, but is not limited to:

[0147] (1) Mobile communication devices: These devices are characterized by having mobile communication functions and mainly aiming to provide voice and data communication. Such terminals include: smart phones (such as iPhone), multimedia phones, functional phones, and low-end phones, etc.

[0148] (2) Ultra-mobile personal computer devices: These devices belong to the category of personal computers, have computing and processing functions, and generally also have the characteristic of mobile Internet access. Such terminals include: PDA, MID, and UMPC devices, etc., such as iPad.

[0149] (3) Portable entertainment devices: Such devices can display and play multimedia content. This category of devices includes: audio and video players (such as iPods), handheld game consoles, e-books, as well as smart toys and portable in-vehicle navigation devices.

[0150] (4) Other electronic devices with data interaction functions.

[0151] |Thus far, specific embodiments of the subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the acts recited in the claims can be performed in a different order and still achieve the desired result. Additionally, the processes depicted in the figures do not necessarily require the particular order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing can be advantageous.

[0152] In the 1990s, it was obvious to distinguish whether an improvement to a technology was a hardware improvement (e.g., improvement to the circuit structures such as diodes, transistors, switches, etc.) or a software improvement (improvement to the method flow). However, with the development of technology, many method flow improvements today can be regarded as direct improvements to the hardware circuit structure. Almost all designers obtain the corresponding hardware circuit structure by programming the improved method flow into the hardware circuit. Therefore, it cannot be said that an improvement to a method flow cannot be implemented with a hardware entity module. For example, a programmable logic device (PLD) (such as a field programmable gate array (FPGA)) is such an integrated circuit whose logical function is determined by the user's programming of the device. The designer can program by himself to "integrate" a digital system on a piece of PLD, without having to ask the chip manufacturer to design and fabricate a dedicated integrated circuit chip. Moreover, today, instead of manually fabricating integrated circuit chips, this programming is mostly implemented using "logic compiler" software, which is similar to the software compiler used in program development and writing. The original code before compilation also has to be written in a specific programming language, which is called a hardware description language (HDL), and there is not only one kind of HDL, but many kinds, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. Currently, the most commonly used are VHDL (Very-High-Speed Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should also be aware that as long as the method flow is slightly logically programmed with the above-mentioned several hardware description languages and programmed into the integrated circuit, it is easy to obtain the hardware circuit that implements the logical method flow.

[0153] The controller can be implemented in any suitable manner. For example, the controller can take the form of, for example, a microprocessor or a processor and a computer-readable medium storing computer-readable program code (such as software or firmware) executable by the (micro)processor, logic gates, switches, an application specific integrated circuit (ASIC), a programmable logic controller, and an embedded microcontroller. Examples of the controller include, but are not limited to, the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320. The memory controller can also be implemented as part of the control logic of the memory. Those skilled in the art also know that, in addition to implementing the controller in the form of pure computer-readable program code, it is entirely possible to logically program the method steps to enable the controller to be implemented in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers, etc. to achieve the same functions. Therefore, such a controller can be considered a hardware component, and the devices included therein for implementing various functions can also be regarded as the structures within the hardware component. Or even, the devices for implementing various functions can be regarded as either software modules for implementing the method or structures within the hardware component.

[0154] The systems, devices, modules, or units illustrated in the above embodiments can be specifically implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer can be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or any combination of these devices.

[0155] For the convenience of description, when describing the above devices, they are described separately as various units according to their functions. Of course, when implementing the present application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0156] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system, or a computer program product. Therefore, the present application can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk memories, CD-ROMs, optical memories, etc.) containing computer-usable program code.

[0157] This application is described with reference to the flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, and combinations of flows and / or blocks in the flowcharts and / or block diagrams can be implemented by computer program instructions. These computer program instructions can be provided to the processors of general purpose computers, special purpose computers, embedded processors, or other programmable data processing devices to produce a machine, such that the instructions executed by the processors of the computer or other programmable data processing devices produce means for implementing the functions specified in the Figure 1 one or more flows and / or blocks Figure 1 one or more blocks.

[0158] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a particular manner, such that the instructions stored in the computer-readable memory produce a manufacture including instruction means that implement the functions specified in the Figure 1 one or more flows and / or blocks Figure 1 one or more blocks.

[0159] These computer program instructions can also be loaded onto a computer or other programmable data processing device, such that a series of operation steps are executed on the computer or other programmable device to produce a computer-implemented process, and thus the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in the Figure 1 one or more flows and / or blocks Figure 1 one or more blocks.

[0160] In a typical configuration, a computing device includes one or more processors (CPUs), an input / output interface, a network interface, and memory.

[0161] The memory may include non-permanent memory in the form of computer-readable media, random access memory (RAM), and / or non-volatile memory such as read-only memory (ROM) or flash memory (flash RAM). Memory is an example of computer-readable media.

[0162] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined in this article, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0163] |It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0164] |It should be understood by those skilled in the art that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware aspects. Moreover, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0165] |The present application may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific transactions or implement specific abstract data types. The present application may also be practiced in distributed computing environments where transactions are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0166] Each embodiment in this specification is described in a progressive manner. For the identical or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple. For the relevant parts, reference can be made to the partial description of the method embodiment.

[0167] The above description is only for the embodiments of the present application and is not intended to limit the present application. For those skilled in the art, various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

1. An ultrasonic fingerprint recognition device, characterized in that, It is disposed on the side middle frame of the electronic device to achieve ultrasonic fingerprint recognition. The side middle frame has a mechanical button or a hidden button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, and bonding wires. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to emit ultrasonic signals to the finger. The finger presses on the outer surface of the cover plate or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wires. The ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the traces of the flexible circuit board. The ultrasonic fingerprint recognition device further includes a reinforcing plate and a special-shaped reinforcing component. One end of the special-shaped reinforcing component is connected to the inner surface of the cover plate, and the other end is attached to the first surface of the flexible circuit board through the reinforcing plate. The special-shaped reinforcing component surrounds the ultrasonic fingerprint sensor chip to provide reinforcement and protection, and a gap layer is provided between the special-shaped reinforcing component and the front surface of the ultrasonic fingerprint sensor chip; The back surface of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button. The front surface of the ultrasonic fingerprint sensor chip reserves pads and is electrically connected to the first surface of the flexible circuit board through the bonding wires. The second surface of the flexible circuit board is attached to the inner surface of the cover plate of the mechanical button.

2. The ultrasonic fingerprint recognition device according to claim 1, wherein The outer surface of the cover plate or the outer surface of the middle frame where the hidden button is located is an arc surface.

3. The ultrasonic fingerprint recognition device according to claim 1, wherein The material of the cover plate is one of glass, metal, and plastic; the side middle frame is plastic or metal.

4. The ultrasonic fingerprint recognition device according to claim 1, characterized in that, The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button or the inner surface of the middle frame where the hidden button is located through an adhesive.

5. The ultrasonic fingerprint recognition device according to claim 4, wherein, The adhesive is glue or a film adhesive.

6. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that, The periphery of the ultrasonic fingerprint sensor chip is sealed by dispensing glue.

7. The ultrasonic fingerprint recognition device according to claim 6, characterized in that, The gap layer is a foam.

8. An ultrasonic fingerprint recognition device, characterized in that, It is disposed on the side middle frame of an electronic device to achieve ultrasonic fingerprint recognition. The side middle frame has a mechanical button or a hidden button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, and bonding wires. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to emit ultrasonic signals to a finger. The finger presses on the outer surface of the cover plate or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wires. The ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the traces of the flexible circuit board. The ultrasonic fingerprint recognition device further includes a reinforcing plate and a special-shaped reinforcing component. One end of the first surface of the special-shaped reinforcing component is connected to the inner surface of the cover plate, and the other end is connected to an edge end of the second surface of the reinforcing plate. The special-shaped reinforcing component surrounds the ultrasonic fingerprint sensor chip to provide reinforcing protection; The flexible circuit board includes a first part and a second part. A gap layer is provided between the reinforcing plate and the second surface of the second part of the flexible circuit board. The ultrasonic fingerprint sensor chip includes a first part and a second part. The front surface of the first part of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button or the inner surface of the middle frame where the hidden button is located. Pads are reserved on the front surface of the second part of the ultrasonic fingerprint sensor chip, and the first surface of the first part of the flexible circuit board is electrically connected through the bonding wires. The second surface of the first part of the flexible circuit board and the back surface of the ultrasonic fingerprint sensor chip are both attached to the first surface of the reinforcing plate.

9. The ultrasonic fingerprint recognition device according to claim 8, wherein, The front surface of the first part of the ultrasonic fingerprint sensor chip is attached to the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint recognition device further includes a reinforcing and supporting component. The reinforcing and supporting component includes two elastic arms and a reinforcing part with both ends respectively connected to the two elastic arms. The flexible circuit board further includes a second part. The first part and the second part of the flexible circuit board are formed into a U shape by folding. A plurality of sensors are provided on the second surface of the second part of the flexible circuit board. The first surface of the second part of the flexible circuit board is attached to the reinforcing part. A gap layer is provided between the first surface of the second part of the flexible circuit board and the second surface of the reinforcing plate. The two elastic arms are connected to the middle frame reinforcing rib, so that the reinforcing part is parallel to the middle frame reinforcing rib and there is an air gap in the middle.

10. The ultrasonic fingerprint recognition device according to claim 8, wherein The gap layer includes two foams at both ends of the first surface of the second part of the flexible circuit board and the second surface of the reinforcing plate and an air gap in the middle.

11. The ultrasonic fingerprint recognition device according to claim 8, wherein The front surface of the first part of the ultrasonic fingerprint sensor chip is attached to the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint recognition device further includes a reinforcement support component. The reinforcement support component includes two elastic arms and a reinforcement part with two ends respectively connected to the two elastic arms. The flexible circuit board further includes a second part. The first part and the second part of the flexible circuit board are formed into a U shape by folding. A plurality of sensors are arranged on the second surface of the second part of the flexible circuit board. The plurality of sensors are used to obtain the position where the finger presses the hidden button. A gap layer is arranged between the second surface of the second part of the flexible circuit board and the second surface of the reinforcement board. The first surface of the second part of the flexible circuit board is attached to the first surface of the reinforcement part. The two elastic arms are connected to the inner surface of the middle frame where the hidden button is located, making the reinforcement part parallel to the middle frame where the hidden button is located. The second surface of the reinforcement part is attached to the middle frame reinforcing rib.

12. The ultrasonic fingerprint recognition device according to claim 9 or 11, characterized in that The hidden button is one of a volume button, a brightness button, a navigation button, and a sliding button.

13. The ultrasonic fingerprint recognition device according to claim 9 or 11, characterized in that, The sensor is a capacitive sensor or a resistive sensor.

14. The ultrasonic fingerprint recognition device according to claim 9 or 11, wherein The sensor is a capacitive sensor, the reinforcement board is a steel sheet reinforcement board and serves as a capacitive emission sensor. The second surface of the first part of the flexible circuit board is attached to the first surface of the reinforcement board through a conductive adhesive. A plurality of sensors arranged on the second surface of the second part of the flexible circuit board are capacitive receiving sensors.

15. The ultrasonic fingerprint recognition device according to claim 9, characterized in that, The middle frame reinforcing rib has a plurality of support protrusions. The second surface of the reinforcement part is attached to the support protrusions of the middle frame reinforcing rib.

16. An ultrasonic fingerprint recognition device, characterized in that, It is arranged on the side middle frame of the electronic device to achieve ultrasonic fingerprint recognition. The side middle frame has a mechanical button or a hidden button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, and a bonding wire. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to emit ultrasonic signals to the finger. The finger presses on the outer surface of the cover plate or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wire. The ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the trace of the flexible circuit board. The ultrasonic fingerprint recognition device further includes a reinforcing plate and a special-shaped reinforcing component. One end of the special-shaped reinforcing component is connected to the inner surface of the cover plate, and the other end is attached to the first surface of the flexible circuit board through the reinforcing plate. The special-shaped reinforcing component surrounds the ultrasonic fingerprint sensor chip to provide reinforcement protection, and a gap layer is provided between the special-shaped reinforcing component and the front surface of the ultrasonic fingerprint sensor chip. The ultrasonic fingerprint recognition device further includes an annular component. One end of the annular component is arranged around the cover plate, and the other end of the annular component is respectively connected to the special-shaped reinforcing component and the back surface of the flexible circuit board to form a sealed environment. The ultrasonic fingerprint sensor chip is in the sealed environment.

17. The ultrasonic fingerprint recognition device according to claim 16, wherein The gap layer is an air gap.

18. The ultrasonic fingerprint recognition device according to claim 16, characterized in that, If the annular component is made of metal material, the cover plate and the annular component are connected by glue or in-mold injection. If the annular component is made of plastic material, the cover plate and the annular component are integrally injection-molded.

19. The ultrasonic fingerprint recognition device according to claim 16, characterized in that, The special-shaped reinforcing component is connected to the annular component and the cover plate by dispensing glue.

20. The ultrasonic fingerprint recognition device according to claim 16, wherein, If the annular component is made of metal material, one end of the annular component is arranged around the outer surface of the cover plate, so that when the finger presses the cover plate, it touches the annular component. The annular component is electrically connected to the pad of the flexible circuit board through a conductive adhesive to form a ground terminal or a receiving capacitance sensor. The receiving capacitance sensor triggers the electronic device to enter the fingerprint recognition state from the sleep state.

21. An ultrasonic fingerprint recognition device, characterized in that, It is disposed on the side middle frame of the electronic device to achieve ultrasonic fingerprint recognition. The side middle frame has a mechanical button or a hidden button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, and bonding wires. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to emit ultrasonic signals to the finger, and the finger presses on the outer surface of the cover plate or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wires, and the ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the traces of the flexible circuit board. The periphery of the cover plate has a circular raised edge facing the inner surface of the cover plate. The ultrasonic fingerprint recognition device further includes a special-shaped reinforcement component. One end of the special-shaped reinforcement component is attached to the first surface of the flexible circuit board, and the other end is connected to the other end of the circular raised edge; the back surface of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button, the ultrasonic fingerprint sensor chip is accommodated in the circular raised edge, and pads are reserved on the front surface of the ultrasonic fingerprint sensor chip and are electrically connected to the first surface of the flexible circuit board through the bonding wires; The ultrasonic fingerprint recognition device further includes a reinforcement plate. The second surface of the flexible circuit board is attached to the first surface of the reinforcement plate, and the second surface of the reinforcement plate is connected to one end of the circular raised edge. A gap layer is provided between the second surface of the reinforcement plate and the front surface of the ultrasonic fingerprint sensor chip.

22. The ultrasonic fingerprint recognition device according to claim 21, wherein, The gap layer is a foam or an air gap.

23. The ultrasonic fingerprint recognition device according to claim 22, wherein, One end of the circular raised edge is connected to the reinforcement plate by dispensing glue, and the other end of the circular raised edge is connected to the special-shaped reinforcement plate by dispensing glue.

24. The ultrasonic fingerprint recognition device according to claim 21, wherein, The cover plate is injection-molded from a plastic material.

25. The ultrasonic fingerprint recognition device according to any one of claims 1, 8, 16, and 21, characterized in that The ultrasonic fingerprint recognition device further includes a silicone layer. The first surface of the silicone layer is attached to the second surface of the special-shaped reinforcement component, and the second surface of the silicone layer has a dome-shaped protrusion. When the outer surface of the cover plate receives the force from the finger, the silicone layer presses the dome-shaped protrusion.

26. The ultrasonic fingerprint recognition device according to any one of claims 1, 8, 16, and 21, characterized in that, The bonding wires are coated with bonding wire protective glue.

27. The ultrasonic fingerprint recognition device according to any one of claims 1, 8, 16, and 21, wherein The thickness of the cover plate is greater than or equal to 2 mm.

28. The ultrasonic fingerprint recognition device according to any one of claims 1, 8, 16, and 21, characterized in that, The thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm.

29. An electronic device, characterized in that, Including: A side middle frame and the ultrasonic fingerprint recognition device according to any one of claims 1-28, wherein the ultrasonic fingerprint recognition device is disposed on the side middle frame to achieve ultrasonic fingerprint recognition.

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