Omega type lead bending device

Abstract

The application relates to an omega-shaped lead bending device which comprises a lower die, an upper die, a mounting shaft, a module group, a die foot and a tungsten rod, the module group comprises an outer module and an inner module, through the above structure, die stamping is realized by the lower die and the upper die, the lead pin on the lead frame is pre-bent into a U shape by the tungsten rod, then pressure is applied to the pressure piston through the pressure module, the hydraulic transmission is applied to the thrust piston and the pull piston through the oil cylinder box, the outer module and the inner module are driven to laterally extrude the U-shaped lead pin, the U-shaped lead pin is extruded on the tungsten rod, the omega-shaped forming of the lead pin is realized, and the lead pin forming quality is effectively improved relative to the existing bending equipment.

Description

TECHNICAL FIELD

[0001] The application relates to a lead bending device, in particular to an omega-shaped lead bending device applied to the technical field of semiconductor lead processing. BACKGROUND

[0002] Integrated circuit packaging is a protective coating of one or more integrated circuit dies and metal lead frames in a plastic mold compound. In the process of packaging semiconductor chips, lead frames are used to electrically connect semiconductor chips to external circuits to provide external circuits with functions executed by semiconductor chips. Lead frames can also physically support semiconductor chips.

[0003] Chinese invention patent CN202121038221.X specification discloses a kind of production of sea gull type lead bending die, the patent is by first die and second die to lead frame is clamped and stamped, lead bearing table is equipped with with lead frame matching first bending groove and second bending groove, the pin inside the lead frame border is bent into sea gull wing shape and is constituted.

[0004] For the processing of lead frame internal pin, the bending mode of the above-mentioned patent is mostly adopted, and the company independently designs a kind of omega-shaped lead frame according to the demand of integrated circuit packaging product, as shown in Figure 3 The omega-shaped lead can better combine with the circuit, and has the limiting effect of closing the mouth, effectively improving the stability of the lead and the wire. For the processing of this kind of lead, the clamping and stamping mode in the prior art can only bend the lead pin into U shape, and cannot bend the lead pin into omega shape, so that the lead pin of the lead frame is not formed in place, affecting the use effect of the lead. SUMMARY

[0005] For the above-mentioned prior art, the technical problem to be solved by the application is that the lead pin of the lead frame is not formed in place, affecting the use effect of the lead.

[0006] In order to solve the above problems, the application provides a kind of Ω type lead bending device, including lower mould and corresponding upper mould, both ends in the lower mould are fixedly connected with installation shaft, both ends of installation shaft are respectively sleeved with module group, the bottom of upper mould is fixedly connected with mould foot in four corners, two mould feet of the same side are inserted with tungsten rod, the top of lower mould is placed with lead frame, both ends in the lead frame are fixedly connected with pin, tungsten rod, module group and pin vertical correspondence;Module group includes outer module and inner module, and outer module is in contact with the inner wall of lower mould, the bottom of lower mould is fixedly connected with hydraulic cylinder, both ends in the bottom of hydraulic cylinder are fixedly communicated with oil cylinder box, both ends of oil cylinder box are movably connected with tension piston, and the outer end of tension piston is fixedly connected with the bottom of outer module, the middle part of oil cylinder box is movably connected with thrust piston, and the outer end of thrust piston is fixedly connected with the bottom of inner module;The middle part of upper mould is movably connected with pressure module, the top of hydraulic cylinder is movably connected with pressure piston, and pressure module and pressure piston vertical correspondence.

[0007] In the Ω type lead bending device, the pin is first U-shapedly bent by the tungsten rod, and then the U-shaped pin is laterally extruded by the outer module and the inner module, so that the pin is Ω-shapedly formed, and the pin forming quality is effectively improved.

[0008] As a further improvement of the present application, the top end of the outer module and the inner module is outwardly convex, a buffer spring is arranged between the outer module and the inner module, and the buffer spring is sleeved with the installation shaft, the outwardly convex part of the outer module and the inner module is used for lateral extrusion forming of the pin, and the buffer spring facilitates position restoration of the outer module and the inner module.

[0009] As a further improvement of the present application, a positioning groove is formed in the top of the inner module, the pin corresponds to the positioning groove, and the depth of the positioning groove is greater than the thickness of the pin, so that the pin is accurately placed, and the accurate positioning of the pin bending position is effectively improved.

[0010] As a further improvement of the present application, a gasket is inserted into the bottom of the positioning groove, the both ends of the gasket are threadedly connected with limiting screws, and the outer end of the limiting screw horizontally corresponds to the outer module, so that the shortest distance between the outer module and the inner module is limited by the limiting screw, and the inserted gasket is convenient to disassemble.

[0011] As another improvement of the present application, the upper mould is annularly arranged, and a rotating disc is rotatably connected in the inner part of the upper mould, a window is formed in the middle part of the rotating disc, and the pressure module passes through the window, so that the rotating disc is conveniently adjusted.

[0012] As a further improvement of the present application, a pressure plate is fixedly connected to the top of the pressure module, the window and the pressure plate are rectangularly arranged, and the window and the pressure plate are crosswise and overlapped arranged, so that the transmission relationship between the pressure module and the upper mould is adjusted by the position state of the window and the pressure plate.

[0013] As a further improvement of the present application, the bottom of the pressure die set is provided with a pad, the bottom end surface of the pad is in contact with the top end surface of the inner module, the left and right ends of the pad and the front and rear ends of the turntable are embedded with magnet blocks, and the magnetic force of the two groups of magnet blocks is repulsive, the upper die is pushed up by the magnetic repulsion between the magnet blocks, and the tungsten rod is lifted to separate from the bent pin.

[0014] As a further improvement of the present application, the bottom of the pad is provided with a clamping groove at both ends, the clamping groove is correspondingly clamped with the tungsten rod, and the tungsten rod is clamped into the clamping groove to support the pad, effectively preventing the pad from falling off.

[0015] As described above, the present application is combined with the lower die and the upper die, the pins on the lead frame are pre-bent to U-shaped by the tungsten rod, and then the pressure piston is pressed by the pressure die set, the hydraulic transmission is applied to the thrust piston and the pull piston by the oil cylinder box, the outer module and the inner module are driven to laterally extrude the U-shaped pin, the U-shaped pin is extruded on the tungsten rod, and the Ω-shaped pin is formed, which effectively improves the pin forming quality compared with the existing bending equipment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a perspective view of the first embodiment of the present application;

[0017] Figure 2 It is a sectional view of the lower die and the upper die of the first embodiment of the present application;

[0018] Figure 3 It is a perspective view of the lead frame of the first embodiment of the present application;

[0019] Figure 4 It is a perspective view of the lower die of the first embodiment of the present application;

[0020] Figure 5 It is a perspective view of the upper die of the first embodiment of the present application;

[0021] Figure 6 It is a demonstration diagram of the Ω pin bending of the first embodiment of the present application;

[0022] Figure 7 It is a perspective view of the hydraulic cylinder of the first embodiment of the present application;

[0023] Figure 8 It is a top view of the hydraulic cylinder of the first embodiment of the present application;

[0024] Figure 9 It is a perspective view of the inner module of the second embodiment of the present application;

[0025] Figure 10A perspective view of the upper mold in a circular ring shape for the third embodiment of the present application is shown;

[0026] Figure 11 A sectional view of the upper mold in a circular ring shape for the third embodiment of the present application is shown;

[0027] Figure 12 A demonstration diagram of the Ω pin bending under the condition of the tungsten rod being lifted in advance for the third embodiment of the present application is shown;

[0028] Figure 13 A perspective view of the upper mold in a circular ring shape for the third embodiment of the present application is shown;

[0029] Figure 14 A perspective view of the pad for the third embodiment of the present application is shown.

[0030] Explanation of the reference numerals in the drawings:

[0031] 1, lower mold; 101, mounting shaft; 2, upper mold; 201, mold foot; 202, tungsten rod; 203, turntable; 204, window; 3, module group; 301, outer module; 302, inner module; 303, buffer spring; 4, lead frame; 401, pin; 5, hydraulic cylinder; 501, oil cylinder box; 502, tension piston; 503, thrust piston; 504, pressure piston; 6, pressure module; 601, pressure plate; 7, positioning groove; 701, gasket; 702, limiting screw; 8, pad; 801, magnet block; 802, clamping groove. DETAILED DESCRIPTION

[0032] The three embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0033] First embodiment:

[0034] Figures 1-3 An Ω type lead bending device is shown, which comprises a lower mold 1 and a corresponding upper mold 2. The lower mold 1 is fixedly connected at both ends inside with mounting shafts 101, and the mounting shafts 101 are respectively sleeved with module groups 3 at both ends. The module groups 3 are used for positioning the bending position of the pins of the lead, and the shape of the module groups 3 affects the bending shape of the pins 401. The bottom corners of the upper mold 2 are fixedly connected with mold feet 201, and the tungsten rods 202 are inserted between the two mold feet 201 on the same side. The top of the lower mold 1 is placed with a lead frame 4, and the lead frame 4 is fixedly connected at both ends inside with pins 401. The tungsten rods 202, the module groups 3 and the pins 401 are vertically corresponding, the tungsten rods 202 bend the pins 401 on the module groups 3, and the pins 401 are obtained in a U-shaped bending shape;

[0035] When the lead wire is pressed to be Ω-shaped, the lead wire frame 4 is placed on the lower mold 1, the pin 401 is placed on the top of the module group 3, the upper mold 2 is combined with the lower mold 1 by the pressure equipment, the pin 401 on the module group 3 is pressed to be U-shaped by the tungsten rod 202, and the subsequent pressing operation is prepared.

[0036] Figures 4-8 It is shown that the module group 3 includes an outer module 301 and an inner module 302, and the outer module 301 is in contact with the inner wall of the lower mold 1. The top of the outer module 301 and the inner module 302 protrudes outward at one end, and the outward protruding part of the outer module 301 and the inner module 302 is used for lateral extrusion forming of the pin 401, so as to realize pressing the U-shaped pin 401 to be Ω-shaped. The buffer spring 303 is arranged between the outer module 301 and the inner module 302, and the buffer spring 303 is sleeved with the mounting shaft 101. The buffer spring 303 facilitates the position restoration of the outer module 301 and the inner module 302. The bottom of the lower mold 1 is fixedly connected with the hydraulic cylinder 5. The bottom of the hydraulic cylinder 5 is fixedly connected with the oil cylinder box 501 at both ends. The oil cylinder box 501 is movably connected with the tension piston 502 at both ends. The tension piston 502 is inwardly contracted, and the outer end of the tension piston 502 is fixedly connected with the bottom of the outer module 301. The middle part of the oil cylinder box 501 is movably connected with the thrust piston 503. The thrust piston 503 is outwardly pushed, and the outer end of the thrust piston 503 is fixedly connected with the bottom of the inner module 302. The middle part of the upper mold 2 is movably connected with the pressure module 6. The top of the hydraulic cylinder 5 is movably connected with the pressure piston 504. The pressure module 6 and the pressure piston 504 are vertically corresponding;

[0037] When the pin 401 is pressed to be U-shaped, the staff applies pressure to the pressure piston 504 by using the pressure module 6 of the pressure equipment, applies hydraulic transmission to the thrust piston 503 and the tension piston 502 by using the oil cylinder box 501, applies tension to the outer module 301 by the tension piston 502, applies thrust to the inner module 302 by the thrust piston 503, realizes lateral extrusion of the U-shaped pin 401 by the outer module 301 and the inner module 302, extrudes the U-shaped pin 401 on the tungsten rod 202, realizes Ω-shaped forming of the pin 401, withdraws the tungsten rod 202 transversely, and then opens the upper mold 2 and the lower mold 1, so as to facilitate direct taking out of the lead wire frame 4, effectively improve the Ω-shaped forming amount of the pin 401, and effectively improve the use effect of the lead wire.

[0038] Second embodiment:

[0039] Compared with the first embodiment, the present embodiment mainly adds a positioning groove 7 and a gasket 701. The specific newly added structure is as follows, and the remaining structure is the same as that of the first embodiment.

[0040] Figure 9It is shown that the top of the inner module 302 is provided with a positioning groove 7, the pin 401 corresponds to the positioning groove 7, and the depth of the positioning groove 7 is greater than the thickness of the pin 401. The positioning groove 7 facilitates accurate placement of the pin 401, effectively improves the accurate positioning of the pin 401 compression bending position, the bottom of the positioning groove 7 is provided with a gasket 701, both ends of the gasket 701 are threadedly connected with a limiting screw 702, and the outer end of the limiting screw 702 corresponds to the outer module 301 horizontally, the limiting screw 702 is used to limit the shortest distance between the outer module 301 and the inner module 302, and the inserted gasket 701 is convenient to disassemble;

[0041] The pin 401 of the lead frame 4 is placed on the top of the module group 3, the pin 401 is placed in the corresponding positioning groove 7, the opening distance of the pin 401 is preset, and the distance corresponds to the extension length of the limiting screw 702. During the process of bending the U-shaped pin 401 by the outer module 301 and the inner module 302, compared with the first embodiment, the present embodiment provides a placing space for the pin 401 through the positioning groove 7, effectively avoids friction between the pin 401 and the mold, effectively avoids scratches on the pin 401, thereby improving the quality of the lead, and rotating the limiting screw 702 to adjust the extension length of the limiting screw 702. The extension length corresponds to the shortest distance between the outer module 301 and the inner module 302, facilitating the control of the Ω shape of the pin 401.

[0042] Third embodiment:

[0043] Compared with the first embodiment and the second embodiment, the present embodiment changes the original square upper die 2 to a ring shape, and installs a turntable 203. The specific additional structure is as follows, and the remaining structures are consistent with the first embodiment and the second embodiment.

[0044] Figures 10-12 It is shown that the upper die 2 is arranged in a ring shape, and the inner part of the upper die 2 is rotationally connected with a turntable 203. A window 204 is formed in the middle part of the turntable 203. The pressure module 6 passes through the window 204. The top of the pressure module 6 is fixedly connected with a pressure plate 601. The window 204 and the pressure plate 601 are both arranged in a rectangular shape, and the window 204 and the pressure plate 601 are arranged in a cross-shaped overlapping manner. The transmission relationship between the pressure module 6 and the upper die 2 is adjusted through the position state of the window 204 and the pressure plate 601.

[0045] When the upper die 2 and the lower die 1 are closed after the mold is closed, the pressure equipment directly applies pressure to the pressure plate 601 on the pressure module 6, driving the upper die 2 and the lower die 1 to close and bend the lead, and subsequently needs to apply pressure to the pressure module 6 alone. Rotate the turntable 203 to change the originally cross-over superimposed window 204 and the pressure plate 601 to an overlapping state, and the pressure plate 601 can directly pass through the window 204. Compared with the first embodiment, only one pressure equipment is needed to apply pressure to the pressure plate 601, which simplifies the closing process of the upper die 2 and the lower die 1, thereby improving the bending processing efficiency of the lead.

[0046] Figures 13-14 It is shown that the bottom of the pressure module 6 is sleeved with a pad 8, and the left and right ends of the pad 8 and the front and rear ends of the turntable 203 are embedded with magnet blocks 801, and the magnetic force of the two groups of magnet blocks 801 is repulsive. The magnetic force between the two groups of magnet blocks 801 repels and pushes the upper die 2 upwards, lifting the tungsten rod 202 to separate from the U-shaped pin 401. The bottom of the pad 8 is provided with a clamping groove 802, and the clamping groove 802 is clamped with the tungsten rod 202. The tungsten rod 202 is clamped into the clamping groove 802 to support the pad 8, effectively preventing the pad 8 from falling off.

[0047] During the process of bending the pin 401 into a U shape, the upper die 2 and the lower die 1 are closed, and then the turntable 203 is rotated. The magnet blocks 801 on the pad 8 vertically correspond to the magnet blocks 801 on the turntable 203, and the repulsive force between the magnet blocks 801 pushes the upper die 2 upwards, thereby driving the tungsten rod 202 to rise and separate from the U-shaped pin 401, facilitating the subsequent Ω-shaped bending of the U-shaped pin 401, without the need for horizontal extraction operation of the tungsten rod 202. At the same time, the repulsive force of the magnet blocks 801 presses the pad 8 on the inner module 302, closes the top of the positioning groove 7, and effectively prevents the pin 401 from being lifted from the positioning groove 7.

[0048] Compared with the first and second embodiments, the present embodiment realizes the switching of the window 204 and the pressure plate 601 between the cross-over superimposed state and the overlapping state by the rotatable turntable 203, realizes the switching of the transmission state between the upper die 2 and the pressure module 6, and only one pressure equipment is needed to apply pressure to the pressure plate 601, which simplifies the closing process of the upper die 2 and the lower die 1, thereby improving the bending processing efficiency of the lead. The pad 8 and the turntable 203 are embedded with magnet blocks 801, and the repulsive force between the magnet blocks 801 pushes the upper die 2 upwards, thereby driving the tungsten rod 202 to rise and separate from the U-shaped pin 401. After the subsequent Ω-shaped bending of the U-shaped pin 401, the horizontal extraction operation of the tungsten rod 202 is not necessary, further simplifying the bending step and further improving the bending processing efficiency of the lead.

[0049] The above-mentioned embodiments of the present application are combined with the current actual demand, the protection scope is not limited to this, various changes made within the knowledge range of the person skilled in the art without departing from the concept of the present application still fall within the protection scope of the present application.

Claims

1. An Ω-type lead wire bending device, characterized in that: The upper mold includes a lower mold (1) and a corresponding upper mold (2). The lower mold (1) has a mounting shaft (101) fixedly connected to both ends inside. The mounting shaft (101) has a module group (3) sleeved on both ends. The upper mold (2) has mold feet (201) fixedly connected to the four corners of the bottom. A tungsten rod (202) is inserted between two mold feet (201) on the same side. A lead frame (4) is placed on the top of the lower mold (1). The lead frame (4) has pins (401) fixedly connected to both ends inside. The tungsten rod (202), module group (3) and pin (401) are vertically aligned. The module group (3) includes an outer module (301) and an inner module (302). The outer module (301) is in contact with the inner wall of the lower mold (1). A hydraulic cylinder (5) is fixedly connected to the bottom of the lower mold (1). A cylinder box (501) is fixedly connected to both ends of the bottom of the hydraulic cylinder (5). A tension piston (502) is movably connected to both ends of the cylinder box (501). The outer end of the tension piston (502) is fixedly connected to the bottom of the outer module (301). A thrust piston (503) is movably connected to the middle of the cylinder box (501). The outer end of the thrust piston (503) is fixedly connected to the bottom of the inner module (302). The upper mold (2) is movably connected to a pressure module (6) in the middle, and the top of the hydraulic cylinder (5) is movably connected to a pressure piston (504). The pressure module (6) and the pressure piston (504) are vertically aligned.

2. The Ω-type lead wire bending device according to claim 1, characterized in that: The top ends of both the outer module (301) and the inner module (302) protrude outwards. A buffer spring (303) is provided between the outer module (301) and the inner module (302), and the buffer spring (303) is sleeved with the mounting shaft (101).

3. The Ω-type lead wire bending device according to claim 1, characterized in that: The top of the inner module (302) is provided with a positioning groove (7), the pin (401) corresponds to the positioning groove (7), and the depth of the positioning groove (7) is greater than the thickness of the pin (401).

4. The Ω-type lead wire bending device according to claim 3, characterized in that: A gasket (701) is inserted into the bottom of the positioning groove (7). Both ends of the gasket (701) are threaded with limiting screws (702), and the outer end of the limiting screws (702) corresponds horizontally to the outer module (301).

5. The Ω-type lead wire bending device according to claim 1, characterized in that: The upper mold (2) is arranged in a ring shape, and a turntable (203) is rotatably connected inside the upper mold (2). A window (204) is opened in the middle of the turntable (203), and the pressure module (6) passes through the window (204).

6. The Ω-type lead wire bending device according to claim 5, characterized in that: The pressure module (6) is fixedly connected to a pressure plate (601). The window (204) and the pressure plate (601) are both rectangular and are stacked in a cross shape.

7. The Ω-type lead wire bending device according to claim 6, characterized in that: The pressure module (6) is fitted with a pad (8) at the bottom. The bottom surface of the pad (8) is in contact with the top surface of the inner module (302). Magnet blocks (801) are embedded in the left and right ends of the pad (8) and the front and rear ends of the turntable (203). The magnetic forces of the two sets of magnet blocks (801) are set to repel each other.

8. The Ω-type lead wire bending device according to claim 7, characterized in that: The bottom of the pad (8) is provided with slots (802) at both ends, and the slots (802) are engaged with the tungsten rod (202).

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