Light and thin heat dissipation back clasp

Abstract

The application relates to the heat dissipation technical field and discloses a light and thin heat dissipation back clamp, which comprises a shell, a heat dissipation fan and a heat dissipation assembly, a heat conduction pad, a side wall air outlet and a frame heat dissipation air outlet. The shell extends along the length direction by a preset length and is used for being connected to the back of a mobile terminal. The heat dissipation fan and the heat dissipation assembly are arranged in the shell and are distributed side by side along the length direction of the shell, and the heat dissipation assembly is located on the air outlet side of the heat dissipation fan. The heat conduction pad is arranged on the side of the shell facing the mobile terminal and is connected to the heat dissipation assembly. The side wall air outlet is arranged on the side wall of one side of the shell in the length direction and is located on the air outlet side of the heat dissipation assembly. The frame heat dissipation air outlet is arranged on the side walls of the two sides of the shell in the width direction and is connected with the air outlet of the heat dissipation fan. The problem that the mobile phone heat dissipation back clamp in the prior art does not dissipate heat for the mobile phone frame and thus the frame is prone to overheating, thereby affecting the performance of the mobile phone is solved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a thin and light heat dissipation back clip. Background Technology

[0002] Mobile devices (such as smartphones, tablets, and portable game consoles) have become essential tools for entertainment. As living standards improve, so do people's demands for entertainment experiences. The constant updates to high-definition videos and high-quality games place increasing demands on phone performance and also increase heat generation and power consumption. Built-in cooling systems in smartphones are insufficient to handle the extra heat generated by running high-performance, high-quality games. Therefore, many smartphone cooling back clips have emerged on the market to assist in heat dissipation.

[0003] In actual gameplay, the temperature of the phone's frame significantly impacts the gaming experience. This is especially true when running high-performance, high-quality games, which greatly increases heat dissipation. Not only does the back of the phone get hotter, but the frame also heats up. Current phone cooling clips typically only cool the back of the phone, lacking features to cool the frame. This leads to the frame easily overheating, thus affecting phone performance.

[0004] Therefore, the current situation and technology still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a thin and light heat dissipation back clip to solve the problem that the existing mobile phone heat dissipation back clips do not dissipate heat from the mobile phone frame, which causes the frame to overheat and thus affects the performance of the mobile phone.

[0006] The technical solution of this application is as follows:

[0007] This application proposes a thin and light heat dissipation back clip, including: a housing, which extends a predetermined length along the length direction and is used to connect to the back of a mobile terminal;

[0008] Cooling fan and heat dissipation component are arranged inside the housing and side by side along the length of the housing, with the heat dissipation component located on the exhaust side of the cooling fan.

[0009] A thermal pad is placed on the side of the housing facing the mobile terminal and is connected to a heat dissipation component;

[0010] A side wall vent is provided on one side wall along the length of the housing, and the side wall vent is located on the air outlet side of the heat dissipation component.

[0011] The side walls on both sides of the casing in the width direction are provided with frame heat dissipation vents, which are connected to the air outlet of the cooling fan.

[0012] Optionally, lateral airflow guides are provided on both sides of the housing in the width direction. The lateral airflow guides have lateral airflow channels, which are connected to the heat dissipation vents of the frame. The inlet of the lateral airflow channel faces the outlet of the cooling fan.

[0013] Along the width direction of the casing, the outer height of the frame heat dissipation vent is less than the inner height of the frame heat dissipation vent.

[0014] Optionally, the inner wall of the lateral airflow guide extends to the frame heat dissipation vent and connects with the inner wall of the housing;

[0015] The height of the side airflow channel is 1-3mm, the length of the frame heat dissipation vent is L, and the width of the side airflow channel inlet is W, where L = 2.5~5W.

[0016] Optionally, the width of the side guide channel gradually decreases along the direction from the inlet to the frame heat dissipation vent;

[0017] The height of the side guide channel gradually decreases along the direction from the inlet to the frame heat dissipation vent.

[0018] Optionally, the heat dissipation component includes: a first thermal conductive sheet, which is disposed on a thermal pad;

[0019] Multiple first heat dissipation fins are arranged at intervals along the width direction and disposed on a first heat-conducting plate;

[0020] A first heat dissipation duct is formed between adjacent first heat dissipation fins, and the two ends of the first heat dissipation duct along its length face the air outlet of the cooling fan and the air outlet of the side wall, respectively.

[0021] Optionally, the first heat dissipation fin extends along the thickness direction and is connected to the upper inner wall of the housing.

[0022] Optionally, the heat dissipation assembly further includes: a second heat-conducting plate, which is arranged parallel to the first heat-conducting plate and connected to one end of the plurality of first heat dissipation fins away from the first heat-conducting plate.

[0023] Optionally, there is a gap between the second heat-conducting plate and the upper inner wall of the housing, and the gap is connected to the side wall vent.

[0024] or,

[0025] Multiple second heat dissipation fins are provided on the surface of the second heat conduction plate that is away from the first heat dissipation fins, and the multiple second heat dissipation fins are arranged at intervals along the width direction.

[0026] A second heat dissipation duct is formed between adjacent second heat dissipation fins. The two ends of the second heat dissipation duct along its length face the air outlet of the cooling fan and the air outlet of the side wall, respectively.

[0027] or,

[0028] The second heat-conducting plate abuts against the upper inner wall of the casing.

[0029] Optionally, the housing includes: a fan housing, with a cooling fan disposed inside the fan housing;

[0030] The upper shell is connected to the fan housing and extends a predetermined length along the length direction, and the inner cavity enclosed by the upper shell is connected to the inner cavity of the fan housing.

[0031] The bottom shell support is located at the bottom edge of the upper shell;

[0032] The heat dissipation components are attached to the bottom case bracket and extend to the edge of the fan housing;

[0033] The thermal pad is placed at the bottom of the heat dissipation component;

[0034] or,

[0035] The housing includes: an upper shell, which encloses an inner cavity, and a cooling fan is disposed within the inner cavity.

[0036] The bottom case bracket is located at the bottom of the heat dissipation assembly and covers the area directly opposite the cooling fan.

[0037] The bottom of the heat dissipation component extends along the length direction and abuts against the two side walls of the upper shell along the length direction;

[0038] The bottom shell support has a window, which is staggered from the cooling fan. A thermal pad is placed inside the window and connected to the bottom of the heat dissipation component.

[0039] Optionally, a magnetic connector is provided at the bottom of the housing, and the housing is magnetically connected to the back of the mobile terminal via the magnetic connector;

[0040] The casing also houses a rechargeable battery, which is electrically connected to the cooling fan.

[0041] Beneficial Effects: Compared with the prior art, the thin and light heat dissipation back clip proposed in this application is attached to the back of a mobile terminal for heat dissipation. A thermal pad is tightly attached to the back shell of the mobile terminal. Since the thermal pad is connected to a heat dissipation component, which extends a predetermined distance in the length direction, when the thermal pad covers the heat-generating area and conducts heat from the back, the heat from the back of the mobile terminal is transferred to the heat dissipation component through the thermal pad and diffused through the heat dissipation component. The heat dissipation component is set along the length direction, allowing for sufficient heat dissipation length. When the cooling fan located on one side of the length direction is activated, the generated airflow is split into two paths. One path of cold air blows towards the heat dissipation component to remove the heat conducted on the component and exits from the side wall vents, thus achieving air cooling of the back of the mobile terminal. The second path of cold air blows towards the frame heat dissipation vents, which are located on the side of the shell in the width direction. This allows the cold air blown from the frame heat dissipation vents to reach the side edge of the mobile terminal, and even beyond the side edge to reach the screen side, achieving heat dissipation of the side frame of the mobile terminal. Because the heat dissipation components and cooling fan are arranged along the length, the overall thickness of the slim heat dissipation back clip is reduced, increasing the heat dissipation area. Furthermore, combined with cool air blowing from the side frame vents, heat from the mobile device's frame is dissipated. This achieves a cooling effect on the back and frame of the mobile device, greatly improving heat dissipation and preventing the screen and frame from overheating. It can meet the heat dissipation requirements of mobile devices running high-performance, high-quality games. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the structure of a heat sink according to an embodiment of this application;

[0043] Figure 2 This is an exploded view of a heat sink according to an embodiment of this application;

[0044] Figure 3 This is a cross-sectional view of a heat sink according to an embodiment of this application;

[0045] Figure 4 This is a cross-sectional view of a heat sink using a second type of shell according to an embodiment of this application;

[0046] Figure 5 Figure a is a cross-sectional view of a heat sink using a first type of heat dissipation component according to an embodiment of this application, wherein Figure a is a cross-sectional view of a first structure of the first type of heat dissipation component, and Figure b is a cross-sectional view of a second structure of the first type of heat dissipation component;

[0047] Figure 6Figure c is a cross-sectional view of a heat sink using a second type of heat dissipation component according to an embodiment of this application, wherein figure c is a cross-sectional view of a first structure of the second type of heat dissipation component, figure d is a cross-sectional view of a second structure of the second type of heat dissipation component, and figure e is a cross-sectional view of a third structure of the second type of heat dissipation component.

[0048] Figure 7 This is a cross-sectional view of a heat sink using a first type of shell, according to an embodiment of this application.

[0049] The following are the labels in the diagram: 100, Housing; 110, Fan Housing; 111, Fan Inlet; 120, Upper Housing; 121, Side Wall Vent; 122, Frame Heat Dissipation Vent; 130, Bottom Housing Bracket; 131, Window; 140, Side Airflow Guide; 141, Side Airflow Guide Channel; 142, Inlet; 200, Cooling Fan; 300, Heat Dissipation Component; 310, First Heat Conducting Fin; 311, Mounting Slot; 320, First Heat Dissipation Fin; 321, First Heat Dissipation Channel; 330, Second Heat Conducting Fin; 340, Second Heat Dissipation Fin; 341, Second Heat Dissipation Channel; 400, Thermal Pad; 500, Magnetic Attachment; 510, Fixing Plate. Detailed Implementation

[0050] This application provides a thin and light heat dissipation back clip. To make the purpose, technical solution, and effects of this application clearer and more explicit, the following describes optional aspects of this application in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for explaining this application and are not intended to limit this application.

[0051] Example 1

[0052] like Figure 1 , Figure 2As shown, this embodiment proposes a thin and light heat dissipation back clip for connecting to a mobile terminal and attaching it to the back of the mobile terminal to dissipate heat. This embodiment uses a mobile phone as an example for structural description, with the direction of the phone's long side as the length direction, the direction of the short side as the width direction, and the direction of the phone's thickness as the thickness direction. The components in this embodiment are described structurally according to these directions. This thin and light heat dissipation back clip mainly includes: a housing 100, a cooling fan 200, a heat dissipation assembly 300, and a thermal pad 400. The housing 100 extends a predetermined length along the length direction, for example, the length can be 80-150mm (here, the length refers to the length from one vertex to the other). The housing 100 is used to connect to the back of the mobile terminal, and the connection method can be magnetic, adhesive, etc. A cooling fan 200 is disposed within the housing 100, with its air outlet facing the length of the housing 100. Specifically, the cooling fan 200 can be located at one end of the length of the housing 100, with its air outlet facing the other end of the length direction, and it exhausts air towards that end. A heat dissipation component 300 is disposed within the housing 100 and located on the air outlet side of the cooling fan 200. The heat dissipation component 300 and the cooling fan 200 are arranged side-by-side along the length of the housing 100, thus avoiding the problem of excessive thickness in a thin and light heat dissipation back clip caused by stacking along the thickness direction. The centrifugal fan used in this thin and light heat dissipation back clip is at the same horizontal level as the heat dissipation component 300, therefore the overall thickness of the thin and light heat dissipation back clip can be kept within 10mm. The heat dissipation component 300 is arranged along the length direction, and the length of the mobile phone is relatively long, providing sufficient space for structural design. This allows the heat dissipation component 300, which is arranged along the length direction, to extend a predetermined length, thereby improving the heat dissipation area and efficiency. A thermal pad 400 is disposed on the side of the housing 100 facing the mobile terminal and connected to the heat dissipation component 300. The thermal pad 400 has strong thermal conductivity and extends along its length. When attached to the back of the phone, it also has a large thermal conductivity area, improving thermal conductivity efficiency and allowing more heat to be transferred to the heat dissipation component 300 for cooling. A side wall vent 121 is provided on one side wall of the housing 100 along its length, located on the air outlet side of the heat dissipation component 300. When the cooling fan 200 is started, the air generated blows along its length toward the heat dissipation component 300, carrying away the heat conducted onto the heat dissipation component 300 as it passes through it, and finally exits from the side wall vent 121, thus achieving the air cooling process.The side walls on both sides of the housing 100 in the width direction are provided with frame heat dissipation vents 122. The frame heat dissipation vents 122 are connected to the air outlet of the cooling fan 200. The frame heat dissipation vents 122 face the frame of the phone, so that the blown cold air is tilted downwards and blown onto the frame, and may even blow onto the front of the screen. In this way, the cold air generated by the cooling fan 200 can be blown out tilted downwards from the frame heat dissipation vents 122, so that it can blow cold air toward the frame of the phone to dissipate heat from the frame of the phone.

[0053] like Figure 2 , Figure 3 As shown in this embodiment, when the thin and light heat dissipation back clip is in operation, it is attached to the back of the mobile terminal for heat dissipation. The heat conduction pad 400 is in close contact with the back shell of the mobile terminal. Since the heat conduction pad 400 is connected to the heat dissipation component 300, and the heat dissipation component 300 extends a predetermined distance in the length direction, when the heat conduction pad 400 covers the heat-generating area and conducts heat to the back, the heat on the back of the mobile terminal is transferred to the heat dissipation component 300 through the heat conduction pad 400 and diffused through the heat dissipation component 300. The heat dissipation component 300 is set along the length direction, and a sufficient heat dissipation length can be set for heat dissipation. When the cooling fan 200 located on one side of the length direction is activated, the airflow is split into two paths. One path of cold air blows towards the heat dissipation component 300 to remove the heat conducted on the heat dissipation component 300 and is then blown out from the side wall vent 121, thus achieving air cooling of the back of the mobile terminal. The second path of cold air blows towards the frame heat dissipation vent 122, which is located on the side of the housing 100 in the width direction. This allows the cold air blown from the frame heat dissipation vent 122 to reach the side edge of the mobile terminal. Under strong airflow, it may even reach the screen side of the mobile terminal, achieving air cooling of the side frame and screen side of the mobile terminal. Because the heat dissipation component 300 and the cooling fan 200 are arranged along the length direction, the thickness of the entire thin and light heat dissipation back clip is reduced, and the heat dissipation area is increased. In addition, combined with the cold air blown from the frame heat dissipation vents 122 on both sides, heat is removed from the frame and even the screen of the mobile terminal. This achieves a cooling effect on the back and frame of the mobile terminal, greatly improving heat dissipation and preventing the frame from overheating. It can meet the heat dissipation requirements of the mobile terminal when running high-performance, high-quality games.

[0054] like Figure 2 , Figure 3As shown, furthermore, lateral airflow guides 140 are provided on both sides of the housing 100 in the width direction. The airflow guides on both sides are symmetrically arranged and have the same structure. Taking one side of the lateral airflow guide 140 as an example, the lateral airflow guide 140 has a lateral airflow channel 141. The lateral airflow channel 141 can extend along the length direction. One end of the lateral airflow channel 141 is connected to the heat dissipation vent 122 of the frame, and the other end forms the inlet 142 of the lateral airflow channel 141. The inlet 142 of the lateral airflow channel 141 faces the air outlet of the cooling fan 200. Thus, the cold air generated after the cooling fan 200 is turned on enters from the inlet 142 of the lateral airflow channel 141, and is blown out from the heat dissipation vent 122 of the frame through the airflow guide of the lateral airflow channel 141, thereby cooling the frame on both sides in the width direction.

[0055] like Figure 5 As shown, along the width direction of the housing 100, the outer height of the frame heat dissipation vent 122 is less than the inner height of the frame heat dissipation vent 122. The inner side of the frame heat dissipation vent 122 refers to the side near the midpoint of the width of the housing 100; the outer side of the frame heat dissipation vent 122 refers to the side facing outward from the housing 100. This design of the frame heat dissipation vent 122 as wider on the inside and narrower on the outside, with the upper inner wall and / or lower inner wall of the frame heat dissipation vent 122 inclined, causes the airflow to flow downward at an angle when moving outward, thereby increasing the amount of cool air blown towards the frame and improving the downward flow of cool air.

[0056] like Figure 3 As shown, the inner wall of the lateral airflow guide 140 extends to the frame heat dissipation vent 122 and connects with the inner sidewall of the housing 100. The height of the lateral airflow guide 141 is 1-3mm, the length of the frame heat dissipation vent 122 is L, and the width of the inlet 142 of the lateral airflow guide 141 is W, where L = 2.5~5W. Since it is necessary to control the amount of cold air blown towards the frame, if the length of the frame heat dissipation vent 122 is too large or the width of the inlet 142 is too narrow, the airflow will be insufficient, resulting in less airflow reaching the frame, or even failing to reach the front of the screen. Therefore, through simulation and experimental results, when the height of the lateral airflow guide 141 is 1-3mm, the length L of the frame heat dissipation vent 122 and the width W of the inlet 142 of the lateral airflow guide 141 need to satisfy the relationship L = 2.5~5W, thus achieving air cooling for the phone frame. Otherwise, using a wider W would reduce the amount of airflow into the heat sink, thus affecting the heat dissipation performance of the back of the phone. A narrower W would not be able to blow cool air to the frame, failing to achieve a good cooling effect on the frame or even the screen. Therefore, the parameters that achieve the best heat dissipation performance in this embodiment are: W: 3-10mm, L: 15-25mm.

[0057] like Figure 3 As shown, further, the width of the lateral guide channel 141 gradually decreases along the direction from the inlet 142 to the frame cooling vent 122; and / or the height of the lateral guide channel 141 gradually decreases along the direction from the inlet 142 to the frame cooling vent 122. Adopting a gradually narrowing lateral guide channel 141 helps guide the airflow to the side and downwards, making the airflow increasingly concentrated, thus giving the outflowing cold air a stronger impact and directing it towards the frame.

[0058] like Figure 2 , Figure 4 As shown, in this embodiment, the thermal pad 400 can be a copper-based composite thermal pad or an aluminum-based composite thermal pad. Copper-based composite thermal pads or aluminum-based composite thermal pads have high thermal conductivity, which can further improve heat dissipation performance.

[0059] like Figure 5 As shown, further, the substrate structure of the heat dissipation assembly 300 in this embodiment specifically includes: a first heat-conducting sheet 310 and a plurality of first heat dissipation fins 320. The first heat-conducting sheet 310 can be mounted on the housing 100, and the heat-conducting pad 400 can be bonded and fixed to the bottom of the first heat-conducting sheet 310. The plurality of first heat dissipation fins 320 are arranged at intervals along the width direction and welded onto the first heat-conducting sheet 310. The plurality of first heat dissipation fins 320 can be parallel to each other, and a first heat dissipation air channel 321 is formed between adjacent first heat dissipation fins 320, thus forming a plurality of first heat dissipation air channels 321. The two ends of the first heat dissipation air channels 321 along the length direction are respectively open towards the air outlet of the cooling fan 200 and the side wall air outlet 121. When the air generated by the cooling fan 200 blows towards the heat dissipation assembly 300, the cold air passes through the first heat dissipation air channel 321 and carries away the heat on the first heat dissipation fins 320 and the first heat-conducting sheet 310, thereby achieving heat dissipation. The first heat-conducting plate 310 not only serves as a heat-conducting part that can connect with the heat-conducting pad 400 for heat conduction, but also serves as a mounting position connected to the housing 100. The first heat dissipation fins 320 and the first heat-conducting plate 310 come into contact with the cold air to increase the contact area of ​​the cold air and improve the heat dissipation performance.

[0060] In this embodiment, the first heat-conducting plate 310 can be a heat spreader, copper sheet, aluminum sheet, or other high thermal conductivity metals. The first heat dissipation fins 320 are made of copper or aluminum sheet or other high thermal conductivity metals, with a thickness of 0.2-0.5 mm and a spacing of 1.0-2.0 mm (the width of the first heat dissipation channel 321). Verification shows that using the above-mentioned dimensions and structure provides good heat dissipation performance while ensuring strong structural stability of the heat dissipation component 300.

[0061] Based on the above basic structure, the structure of the heat dissipation component 300 in this embodiment can be configured in various forms, as follows:

[0062] The first form, based on the above basic structure, forms the following two structures:

[0063] like Figure 5 As shown in Figure a, the first form and first structure: the first heat dissipation fin 320 extends a certain length along the thickness direction and is not connected to the upper inner wall of the housing 100. The upper inner wall of the housing 100 is the inner wall of the inner cavity of the housing 100 away from the mobile phone, which is the inner wall away from the mobile phone in the thickness direction. The heat dissipation panel with this structure is relatively small, and the load-bearing capacity of the entire heat dissipation assembly 300 is not strong, but the structure is simple and can still achieve the heat dissipation function.

[0064] like Figure 5 As shown in Figure b, in the first form and second structure, the first heat dissipation fin 320 extends along the thickness direction and is connected to the upper inner wall of the housing 100. The upper end of the first heat dissipation fin 320 can be welded and fixed to the upper inner wall of the housing 100. Since the first heat dissipation fin 320 extends a relatively long distance in the thickness direction, the contact area with the cold air during heat dissipation is increased, thereby improving the heat dissipation efficiency. Moreover, fixing the first heat dissipation fin 320 to the upper inner wall of the housing 100 increases the structural strength of the entire heat dissipation assembly 300 and optimizes the structural design.

[0065] like Figure 6 As shown, the second form improves upon the basic structure. Specifically, the heat dissipation component 300 further includes a second heat-conducting plate 330, which is arranged parallel to the first heat-conducting plate 310 and connected to one end of the plurality of first heat dissipation fins 320 away from the first heat-conducting plate 310. By setting the second heat-conducting plate 330, the heat dissipation area at the top can be increased, and the connection at the upper end of the first heat dissipation fins 320 can be made, facilitating assembly on the production line after the module is formed.

[0066] Based on the second form, the following three structures can be formed:

[0067] like Figure 6 As shown in Figure C, in the first structure of the second form: there is a gap between the second heat-conducting plate 330 and the upper inner wall of the housing 100, and the gap is connected to the side wall vent 121. The lower surface of the second heat-conducting plate 330 is welded and fixed to the upper end of each of the first heat dissipation fins 320. The first heat dissipation fins 320 can disperse heat. At the same time, the cooperation between the second heat-conducting plate 330 and the first heat-conducting plate 310 makes the entire heat dissipation assembly 300 strong in load-bearing capacity, not easy to deform and be damaged, and has good integrity, making it easier to assemble.

[0068] like Figure 6As shown in Figure d, the second structure of the second form involves welding multiple second heat dissipation fins 340 onto the surface of the second heat-conducting plate 330 facing away from the first heat dissipation fin 320. These multiple second heat dissipation fins 340 are spaced apart along their width and can be arranged either orally or obliquely along their length. Adjacent second heat dissipation fins 340 form a second heat dissipation duct 341, with its two ends opening towards the air outlet of the cooling fan 200 and the side wall air outlet 121, respectively. Building upon the advantages of the above structure, the second heat dissipation fins 340 allow for the creation of more air ducts, further enhancing heat dissipation performance and effectively utilizing the internal space of the housing 100.

[0069] The first heat-conducting plate 310, the first heat dissipation fin 320, the second heat-conducting plate 330, and the second heat dissipation fin 340 are all welded together, which enhances structural stability. The thickness of the second heat dissipation fin 340 is 0.2-0.5 mm, and the spacing of the second heat dissipation fin 340 is 1.0-2.0 mm. Verification has shown that the above-mentioned dimensional structure provides excellent heat dissipation performance while also enhancing the structural stability of the heat dissipation assembly 300.

[0070] It is easy to imagine that, in order to increase the contact area, the first heat dissipation fin 320 and the second heat dissipation fin 340 can also be set to a wavy shape or a bent shape.

[0071] like Figure 6 As shown in Figure e, in the third structure of the second form, the second heat-conducting plate 330 abuts against the upper inner wall of the housing 100. The lower surface of the second heat-conducting plate 330 is used for heat conduction and dissipation, while the upper surface of the second heat-conducting plate 330 is in contact with the housing 100, making assembly easier. If the housing 100 is made of metal, the thermal conductivity of the housing 100 can be utilized, and through the conduction of the second heat-conducting plate 330, the housing 100 can also dissipate heat, enhancing the practicality of the housing 100 and further improving its heat dissipation performance.

[0072] Furthermore, based on the above structure, the housing 100 in this embodiment can also include various forms, as detailed below:

[0073] like Figure 7As shown, the first type of housing specifically includes: a fan housing 110, an upper housing 120, and a bottom housing support 130. The cooling fan 200 is disposed inside the fan housing 110, allowing the cooling fan 200 and fan housing 110 to be manufactured as a single module and subsequently assembled with the upper housing 120. The upper housing 120 connects to the fan housing 110 and extends a predetermined length along its length. The inner cavity enclosed by the upper housing 120 communicates with the inner cavity of the fan housing 110. The upper housing 120 is located on one side of the length direction of the fan housing 110 and can be assembled with it, thereby connecting the inner cavity of the housing with the inner cavity of the fan housing 110, thus forming the internal space of the housing 100. A fan inlet 111 is provided on the upper surface of the fan housing 110. After the cooling fan 200 is started, cool air enters the interior of the housing 100 through the fan inlet 111 and cools the heat dissipation component 300. A bottom shell bracket 130 is located at the bottom edge of the upper shell 120. The bottom shell bracket 130 acts as a frame connected to the upper shell 120, and the bottom shell bracket 130, upper shell 120, and fan housing 110 together form the internal space of the housing 100. A heat dissipation assembly 300 is connected to the bottom shell bracket 130 and extends to the edge of the fan housing 110. The edge of the first heat-conducting fin 310 of the heat dissipation assembly 300 can be fixed to the bottom shell bracket 130 with screws, extending the first heat-conducting fin 310 along its length and abutting against the bottom edge of the fan housing 110, thus sealing the internal space of the housing 100 and ensuring structural integrity. Furthermore, the first heat-conducting fin 310 of the heat dissipation assembly 300 can extend a sufficiently long distance to accelerate heat dissipation efficiency. A thermal pad 400 is located at the bottom of the heat dissipation assembly 300 and is designed to match the heat dissipation assembly 300. It can cover the entire bottom of the first heat-conducting fin 310 of the heat dissipation assembly 300, thereby increasing the heat conduction area and improving heat conduction efficiency.

[0074] like Figure 2 , Figure 4As shown, the second type of housing specifically includes an upper shell 120 and a bottom shell support 130. The upper shell 120 forms an inner cavity, in which the cooling fan 200 is disposed. The bottom shell support 130 is fixed to the bottom of the upper shell 120 by screws or adhesive and is located at the bottom of the heat dissipation assembly 300. The bottom shell support 130 is arranged around the bottom of the upper shell 120, and a sealing shell and a window 131 are provided at the bottom. The bottom shell support 130 covers the area directly opposite the cooling fan 200 through the bottom sealing shell. The window 131 is offset from the cooling fan 200 and can be arranged side by side with the sealing shell along the length direction. Because the window 131 is offset from the cooling fan 200, it is connected to the inner cavity of the housing 100. The first heat-conducting plate 310 at the bottom of the heat dissipation assembly 300 extends along the length direction and abuts against the two side walls of the upper shell 120 along the length direction, so that the coverage area of ​​the first heat-conducting plate 310 almost reaches the entire lower surface of the shell 100. The heat-conducting pad 400 is disposed in the opening 131 and connected to the first heat-conducting plate 310 at the bottom of the heat dissipation assembly 300.

[0075] The air duct of the cooling fan 200 is designed as part of the upper shell 120, so that the entire shell 100 is integrated into one piece. This can reduce the overall product thickness and expand the area of ​​the first heat conduction plate 310, thereby improving the heat dissipation effect.

[0076] In this embodiment, the upper shell 120 can be made of plastic or metal; if metal is used, the heat dissipation and structural performance will be better. The bottom shell support 130 can be made of plastic or metal.

[0077] like Figure 2 As shown, in this embodiment, a magnetic suction member 500 is provided at the bottom of the housing 100, and is magnetically connected to the back of the mobile terminal via the magnetic suction member 500. The magnetic connection method makes it easier to detach and connect this thin and light heat dissipation back clip to the back of the mobile phone, making it more convenient to use. Specifically, the magnetic suction member 500 can be connected to the first heat-conducting sheet 310 via a fixing plate 510, and the magnetic suction member 500 is located on the back of the housing 100. This makes the connection with the mobile phone more stable when connected via the magnetic suction member 500. Several mounting slots 311 are formed on the first heat-conducting sheet 310, and the magnetic suction member 500 is embedded into the mounting slots 311 and fixed to the first heat-conducting sheet 310 via the fixing plate 510, thus realizing the installation of the magnetic suction member 500.

[0078] Furthermore, a rechargeable battery is also installed inside the casing 100, which is electrically connected to the cooling fan 200. This eliminates concerns about the lack of power supply when outdoors, allowing for convenient high-quality gaming anytime, anywhere.

[0079] It is easy to imagine that an external power supply can also be used, which connects to a mobile phone or external plug after connecting the cable through the connection interface.

[0080] In summary, the thin and light cooling back clip proposed in this application reduces the overall thickness of the cooling back clip and increases the heat dissipation area, thereby significantly improving the heat dissipation effect and meeting the heat dissipation requirements of mobile terminals running high-performance, high-quality games. Furthermore, it achieves simultaneous cooling of the back of the phone, the frame, and even the screen, alleviating the burning sensation on the player's fingers caused by high screen temperature and improving the user experience. This application's solution overcomes the shortcomings of existing products, such as being thick, having high power consumption, small heat dissipation area, and insufficient heat dissipation performance. The overall thickness of this thin and light cooling back clip is less than 10mm, the weight is less than 80g, and the heat dissipation area is greater than 3000mm². 2 It has the advantages of simple and thin structure and good heat dissipation.

[0081] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A thin and light heat dissipation back clip, characterized in that, Includes: a housing that extends a predetermined length along its length and is used to connect to the back of a mobile terminal; A cooling fan and a heat dissipation component are disposed inside the housing and arranged side by side along the length of the housing, with the heat dissipation component located on the air outlet side of the cooling fan. A thermal pad is disposed on the side of the housing facing the mobile terminal and is connected to the heat dissipation assembly; A side wall vent is provided on one side wall along the length of the housing, and the side wall vent is located on the air outlet side of the heat dissipation assembly. The side walls on both sides of the housing in the width direction are provided with frame heat dissipation vents, which are connected to the air outlet of the cooling fan. Lateral airflow guides are provided on both sides of the housing in the width direction. The lateral airflow guides have lateral airflow channels, which are connected to the heat dissipation vents of the frame. The inlet of the lateral airflow channel faces the air outlet of the cooling fan. Along the width direction of the housing, the outer height of the frame heat dissipation vent is less than the inner height of the frame heat dissipation vent.

2. The thin and light heat dissipation back clip according to claim 1, characterized in that, The inner wall of the lateral airflow guide extends to the heat dissipation vent of the frame and connects with the inner side wall of the housing. The height of the side airflow channel is 1-3mm, the length of the frame heat dissipation vent is L, and the width of the inlet of the side airflow channel is W, where L=2.5~5W.

3. The thin and light heat dissipation back clip according to claim 2, characterized in that, The width of the side guide channel gradually decreases along the direction from the inlet to the heat dissipation vent of the frame; The height of the lateral airflow channel gradually decreases along the direction from the inlet to the frame heat dissipation vent.

4. The thin and light heat dissipation back clip according to claim 1, characterized in that, The heat dissipation component includes: a first heat-conducting sheet, which is disposed on the heat-conducting pad; Multiple first heat dissipation fins are arranged at intervals along the width direction and disposed on the first heat-conducting plate; A first heat dissipation duct is formed between adjacent first heat dissipation fins, and the two ends of the first heat dissipation duct along its length face the air outlet of the cooling fan and the side wall air outlet, respectively.

5. The thin and light heat dissipation back clip according to claim 4, characterized in that, The first heat dissipation fin extends along the thickness direction and is connected to the upper inner wall of the housing.

6. The thin and light heat dissipation back clip according to claim 4, characterized in that, The heat dissipation assembly further includes a second heat-conducting sheet, which is arranged parallel to the first heat-conducting sheet and connected to one end of the plurality of first heat dissipation fins away from the first heat-conducting sheet.

7. The thin and light heat dissipation back clip according to claim 6, characterized in that, There is a gap between the second heat-conducting plate and the upper inner wall of the housing, and the gap is connected to the side wall vent. or, The second heat-conducting sheet has a plurality of second heat-dissipating fins on its surface away from the first heat-dissipating fins, and the plurality of second heat-dissipating fins are arranged at intervals along the width direction. A second heat dissipation duct is formed between adjacent second heat dissipation fins, and the two ends of the second heat dissipation duct along its length face the air outlet of the cooling fan and the side wall air outlet, respectively. or, The second heat-conducting sheet abuts against the upper inner wall of the housing.

8. The thin and light heat dissipation back clip according to any one of claims 1-6, characterized in that, The housing includes: a fan housing, wherein the cooling fan is disposed within the fan housing; The upper shell is connected to the fan housing and extends a predetermined length along the length direction, and the inner cavity enclosed by the upper shell is connected to the inner cavity of the fan housing; A bottom shell support is provided at the bottom edge of the upper shell; The heat dissipation assembly is connected to the bottom housing bracket and extends to the edge of the fan housing; The thermal pad is disposed at the bottom of the heat dissipation assembly; or, The housing includes: an upper shell, the upper shell forming an inner cavity, and a cooling fan disposed within the inner cavity. A bottom housing bracket is disposed at the bottom of the heat dissipation assembly and covers the area directly opposite the cooling fan; The bottom of the heat dissipation component extends along the length direction and abuts against the two side walls of the upper shell along the length direction. The bottom shell support has a window, which is offset from the cooling fan. The thermal pad is disposed inside the window and connected to the bottom of the heat dissipation assembly.

9. The thin and light heat dissipation back clip according to claim 8, characterized in that, The bottom of the housing is provided with a magnetic attachment, and the magnetic attachment is used to magnetically connect the housing to the back of the mobile terminal. The housing also contains a rechargeable battery, which is electrically connected to the cooling fan.

Images