Test device

By designing the relative motion between the support platform and the test components, regional heating and testing of the semiconductor testing device were achieved, solving the problems of long heating time and difficult temperature control in the prior art, improving testing efficiency and accuracy, and reducing equipment costs.

CN117054844BActive Publication Date: 2026-02-24SIDEA SEMICON EQUIP (SHENZHEN) CO LTD
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Patent Information

Application Number
CN202311048371.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-08-17
Publication Date
2026-02-24
Estimated Expiration
2043-08-17

AI Technical Summary

Technical Problem

In existing technologies, semiconductor testing devices struggle to achieve rapid heating and cooling under different temperature conditions, and are also difficult to perform heating time-limited and extreme temperature tests, resulting in low testing efficiency.

Method used

The design employs a support platform and testing components. The first driving component drives the detection component and the heating component to move relative to each other in a direction perpendicular to the support surface, thereby achieving regional heating and detection, reducing heating and cooling time, and improving testing efficiency.

Benefits of technology

It enables regional heating and testing of the unit under test, reduces temperature control requirements, simplifies heating time limitations and extreme temperature testing, improves testing efficiency and accuracy, and reduces equipment costs and test failure rates.

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Abstract

The application discloses a kind of test devices.Test device includes bearing platform, test component and first drive component, bearing platform is provided with bearing surface and through-hole, bearing surface is used to carry the unit to be measured, through-hole is communicated bearing surface to leak out the unit to be measured.Test component includes detection piece and heating piece, detection piece and heating piece are located at the opposite sides of bearing surface respectively, detection piece and heating piece are oppositely arranged in the direction perpendicular to bearing surface.First drive component is connected with test component, first drive component can drive detection piece and heating piece to be close to each other, so that heating piece is resisted on one side of the unit to be measured to carry out regional heating, so that detection piece is resisted on the other side of the unit to be measured to carry out detection, realize the regional heating of the unit to be measured and the test of corresponding area, reduce heating and cooling time, improve test efficiency.And reduce the control requirement to temperature, it is easy to realize the test with the limitation of heating time, effectively reduce test difficulty.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and in particular to a testing device. Background Technology

[0002] In some semiconductor testing processes, the cell under test (DUT) needs to be tested under different temperature environments. Related techniques involve using a stage to support the DUT and heating the entire stage to bring it to the required testing temperature. However, heating the entire stage requires a considerable amount of time for both heating and cooling, and demands high uniformity of the stage surface temperature. Furthermore, because the DUT is heated as a whole along with the stage, the heating process cannot end until all areas of the DUT have been tested, making it difficult to test DUTs with heating time limitations and to perform extreme temperature tests. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a testing device capable of heating a region of the unit under test, thereby reducing testing difficulty and improving testing efficiency.

[0004] A testing apparatus according to an embodiment of the present invention includes a support platform, a testing component, and a first driving component. The support platform has a support surface and a through hole. The support surface supports a unit under test (DUT). The through hole extends in a direction perpendicular to the support surface and communicates with the support surface, allowing the DUT to pass through. The testing component includes a detection element and a heating element, which are located on opposite sides of the support surface and are disposed opposite to each other in a direction perpendicular to the support surface. The first driving component is connected to the testing component and drives the detection element and the heating element to move relative to each other in a direction perpendicular to the support surface, so that the detection element and the heating element abut against the DUT.

[0005] The testing apparatus according to embodiments of the present invention has at least the following beneficial effects: the first driving component can drive the detection element and the heating element to move relatively close, so that the heating element abuts against one side of the unit under test for regional heating, and the detection element abuts against the other side of the unit under test for detection, thereby realizing regional heating of the unit under test and testing of the corresponding region, reducing heating and cooling time, and improving testing efficiency. It also reduces the requirements for temperature control, making it easier to test units under test with heating time limitations and to test the extreme temperatures of the unit under test, effectively reducing testing difficulty.

[0006] According to some embodiments of the present invention, the heating element includes a heating layer, an insulating layer and a contact layer that are interconnected, the heating layer, the insulating layer and the contact layer are arranged sequentially along a direction close to the bearing surface, and the contact layer is used to contact the unit under test.

[0007] According to some embodiments of the present invention, the heating element includes a heating layer, an insulating layer, and a connecting arm that are interconnected, wherein the connecting arm, the insulating layer, and the heating layer are arranged sequentially along a direction close to the bearing surface.

[0008] According to some embodiments of the present invention, the testing apparatus further includes a second driving component, which is connected to the support platform and / or the testing component, and is used to drive the support platform and the testing component to move relative to each other in a direction parallel to the support surface.

[0009] According to some embodiments of the present invention, the testing device further includes a fixed frame, a second drive assembly mounted on the fixed frame, a first drive assembly mounted on the fixed frame, and a support platform connected to the second drive assembly. The second drive assembly is used to drive the support platform to move relative to the testing assembly in a direction parallel to the support surface.

[0010] According to some embodiments of the present invention, the test assembly further includes a pressure sensor connected to the detection element, the pressure sensor being used to test the force exerted by the detection element against the unit under test.

[0011] According to some embodiments of the present invention, the test component further includes a camera located on the same side of the carrier platform as the test piece, the camera being used to capture images of the test piece and the unit under test.

[0012] According to some embodiments of the present invention, the first driving assembly includes a first driver and a connecting rod. The first driver is connected to the connecting rod and is used to drive the connecting rod to rotate. The connecting rod is provided with a first connecting portion and a second connecting portion. The first connecting portion is provided with a first thread, and the second connecting portion is provided with a second thread. The helical direction of the first thread is opposite to the helical direction of the second thread. The detection element is threadedly connected to the first connecting portion, and the heating element is threadedly connected to the second connecting portion.

[0013] According to some embodiments of the present invention, the through hole has a set area W1 in a direction parallel to the bearing surface, and the end face of the heating element facing the bearing surface has a set area W2, satisfying: W2 < 0.5W1.

[0014] According to some embodiments of the present invention, the testing apparatus further includes a third driving component connected to the support platform, the third driving component being used to drive the support platform to rotate in a direction perpendicular to the support surface.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0017] Figure 1 This is a schematic diagram of the testing apparatus according to an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A front view of the test apparatus in the image;

[0019] Figure 3 This is a schematic diagram of the testing device in the in-place state according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the testing device in the detection state according to an embodiment of the present invention;

[0021] Figure 5 for Figure 2 A partially enlarged schematic diagram;

[0022] Figure 6 This is a schematic diagram of a test apparatus according to another embodiment of the present invention.

[0023] Figure label:

[0024] Supporting platform 100, supporting surface 110, through hole 120, positioning groove 130;

[0025] Test component 200, detection component 210, heating component 220, contact layer 221, insulation layer 222, heating layer 223, insulation and heat insulation layer 224, connecting arm 225, pressure sensor 230, camera 240;

[0026] The components include: a first drive assembly 300, a first driver 310, a connecting rod 320, a first connecting part 321, a second connecting part 322, and an adjusting member 330.

[0027] Second drive assembly 400; mounting bracket 500; third drive assembly 600; unit under test 700. Detailed Implementation

[0028] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0029] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0030] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0031] In the description of this invention, unless otherwise explicitly defined, terms such as "setting," "installing," and "connecting" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0032] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0033] The test apparatus of this application according to the embodiments is described below with reference to the accompanying drawings. It should be noted that, referring to... Figure 3 The bearing surface 110 and the through hole 120 are shown by dashed lines.

[0034] Reference Figures 1 to 4According to an embodiment of the present invention, the testing apparatus includes a support platform 100, a testing component 200, and a first driving component 300. The support platform 100 is provided with a support surface 110 and a through hole 120. The support surface 110 is used to support a unit under test 700. The through hole 120 extends in a direction perpendicular to the support surface 110 and communicates with the support surface 110 to allow the unit under test 700 to pass through. The testing component 200 includes a detection element 210 and a heating element 220. The detection element 210 and the heating element 220 are respectively located on opposite sides of the support surface 110 and are arranged opposite to each other in a direction perpendicular to the support surface 110. The first driving component 300 is connected to the testing component 200 and is used to drive the detection element 210 and the heating element 220 to move relative to each other in a direction perpendicular to the support surface 110, so that the detection element 210 and the heating element 220 abut against the unit under test 700.

[0035] The first driving component 300 can drive the detection element 210 and the heating element 220 to move relatively close, so that the heating element 220 abuts against one side of the unit under test 700 for regional heating, and the detection element 210 abuts against the other side of the unit under test 700 for detection. This realizes regional heating of the unit under test 700 and testing of the corresponding region, reducing heating and cooling time and improving testing efficiency. It also reduces the requirements for temperature control, making it easier to test the unit under test 700 with heating time limitations and to test the extreme temperature of the unit under test 700, effectively reducing the difficulty of testing.

[0036] Understandably, due to the small contact area between the heating element 220 and the unit under test 700, using a small-plane test improves accuracy, meets higher testing precision requirements, solves the problem of testing large planes, and reduces the cost of materials and processes for the heating element 220, effectively lowering equipment costs. Furthermore, a small plane makes it easier to achieve close contact with the unit under test 700, resulting in a lower test failure rate and shorter heating and cooling times within a small area. On the other hand, after testing a single area, the heating element 220 can be removed for cooling, ensuring the safety of the unit under test 700. Moreover, because the heating area of ​​the heating element 220 is small, heat conduction is limited, minimizing the impact on the temperature of the tested area, further ensuring the safety of the unit under test 700.

[0037] Specifically, the unit under test 700 is a semiconductor sample or other product under test. The support platform 100 is provided with a positioning groove 130, and a support surface 110 is disposed at the bottom of the positioning groove 130. The unit under test 700 is placed in the positioning groove 130 and abuts against the support surface 110, thereby achieving positioning and limiting of the unit under test 700. A through hole 120 communicates with the positioning groove 130, allowing the detection element 210 to enter the through hole 120 and abut against one side of the unit under test 700. The contact area between the detection element 210 and the unit under test 700 is smaller than the area of ​​the end face of the unit under test 700 in contact with the detection element 210. The first driving assembly 300 may include multiple drivers (not shown in the figure). The detection element 210 and the heating element 220 are each connected to one driver to achieve movement of the detection element 210 and the heating element 220 in a direction perpendicular to the support surface 110, enabling the detection element 210 and the heating element 220 to move closer to and further away from each other.

[0038] Or, refer to Figure 5 In some embodiments, the first driving assembly 300 includes a first driver 310 and a connecting rod 320. The first driver 310 is connected to the connecting rod 320 and is used to drive the connecting rod 320 to rotate. The connecting rod 320 is provided with a first connecting portion 321 and a second connecting portion 322. The first connecting portion 321 is provided with a first thread, and the second connecting portion 322 is provided with a second thread. The helical direction of the first thread is opposite to that of the second thread. The detection element 210 is threadedly connected to the first connecting portion 321, and the heating element 220 is threadedly connected to the second connecting portion 322. Since the helical direction of the first thread is opposite to that of the second thread, when the first driver 310 drives the connecting rod 320 to rotate, the detection element 210 and the heating element 220 will move closer to each other or further away from each other under the influence of the rotation of the connecting rod 320. The relative movement of the heating element 220 and the detection element 210 can be achieved by a single first driver 310.

[0039] The first drive assembly 300 may also be provided with an adjusting member 330, and an adjusting member 330 may be provided between the second connecting part 322 and the heating element 220.

[0040] The adjusting member 330 can adjust the relative position of the heating member 220 and the first connecting part 321 in the direction perpendicular to the bearing surface 110, so as to ensure that the heating member 220 and the detection member 210 can be correctly held against both sides of the unit under test 700 through fine adjustment. An adjusting member 330 can also be provided between the first connecting part 321 and the detection member 210 to adjust the relative position of the detection member 210 and the first connecting part 321 in the direction perpendicular to the bearing surface 110, so as to further improve the positioning accuracy and ensure that the heating member 220 and the detection member 210 can be correctly held against both sides of the unit under test 700.

[0041] Specifically, the detection element 210 can be selected as a conventional detection device such as a detection probe that achieves detection through contact. The heating element 220 can be selected as a heating device such as a heating wire or a semiconductor heating plate, which are conventional in the art. In some embodiments, reference is made to... Figure 2 and Figure 3 The heating element 220 includes an interconnected heating layer 223, an insulating layer 222, and a contact layer 221, arranged sequentially along the direction close to the bearing surface 110. The contact layer 221 is used to contact the unit under test 700. The heating layer 223 is a conventional heating device such as a heating wire or a semiconductor wafer, used to realize the heating function of the heating element 220. The insulating layer 222 provides insulation protection to reduce the probability of the heating layer 223 damaging the unit under test 700. The contact layer 221 is in direct contact with the unit under test 700, providing buffer protection to reduce the probability of the unit under test 700 being scratched or damaged by impact. The insulating layer 222 can be a conventional insulating layer in the art, such as insulating tape, insulating adhesive layer, plastic insulating layer, rubber insulating layer, or polyethylene insulating layer. The contact layer 221 can be a conventional thermally conductive material with a certain degree of elasticity, such as a thermally conductive pad, thermally conductive silicone grease, thermally conductive adhesive, or thermally conductive tape.

[0042] Furthermore, the heating element 220 includes an interconnected heating layer 223, an insulating layer 224, and a connecting arm 225, which are arranged sequentially along the direction close to the bearing surface 110. Connecting the heating element 220 via the connecting arm 225 optimizes the structural design and facilitates the connection between the heating element 220 and the first drive assembly 300. The insulating layer 224 separates the heating element 220 from the connection, improving safety performance, reducing the occurrence of accidents, and ensuring test safety. The insulating layer 224 can be selected from conventional insulating materials in the art, such as mica gaskets, aluminum silicate fiber gaskets, epoxy resin insulating gaskets, and ceramic gaskets. It is understood that the detection element 210 can be provided with another connecting arm for connection and installation.

[0043] Specifically, after the test component 200 completes the testing of one area of ​​the unit under test 700, the relative positions of the test component 200 and the unit under test 700 can be manually adjusted to proceed with the testing of the next area. Alternatively, refer to... Figure 1In some embodiments, the testing apparatus further includes a second driving component 400, which is connected to the support platform 100. The second driving component 400 drives the support platform 100 to move relative to the testing component 200 in a direction parallel to the support surface 110, thereby changing the relative position of the support platform 100 and the testing component 200 in the direction parallel to the support surface 110. This allows the testing component 200 to complete testing of a certain area and then test the next area. Alternatively, the second driving component 400 can also be connected to the testing component 200 to drive the testing component 200 to move relative to the support platform 100 in a direction parallel to the support surface 110. The second driving component 400 can also be connected to both the testing component 200 and the support platform 100 separately to achieve relative movement between them.

[0044] Specifically, the second drive component 400 can be selected from commonly used drivers in the field, such as linear motors, linear modules, XY-axis motion platforms, and XYZ-axis motion platforms.

[0045] Reference Figure 6 In some embodiments, the testing apparatus further includes a mounting frame 500, a second drive assembly 400 mounted on the mounting frame 500, a testing assembly 200 mounted on the mounting frame 500, and a support platform 100 connected to the second drive assembly 400. The second drive assembly 400 drives the support platform 100 to move relative to the testing assembly 200 in a direction parallel to the support surface 110. The mounting frame 500 provides a mounting base for the first drive assembly 300 and the testing assembly 200. The first drive assembly 300 is connected to the testing assembly 200 to enable the installation and movement of the testing assembly 200. Since the first drive assembly 300 needs to drive the detection element 210 and the heating element 220 to move relative to each other, it has many electrical components and high wiring requirements. Mounting the first drive assembly 300 on the mounting frame 500 facilitates wiring during connection and reduces installation difficulty.

[0046] Reference Figure 3 and Figure 4 In some embodiments, the test assembly 200 further includes a pressure sensor 230 connected to the detection element 210. The pressure sensor 230 is used to test the force exerted by the detection element 210 against the unit under test 700. By detecting the pressure when the detection element 210 and the unit under test 700 are pressed together by the pressure sensor 230, it can be ensured that the detection element 210 meets the testing requirements and the test results are guaranteed.

[0047] Reference Figure 1 and Figure 2In some embodiments, the test assembly 200 further includes a camera 240, which is located on the same side of the support platform 100 as the detection element 210. The camera 240 is used to capture images of the detection element 210 and the unit under test 700. The camera 240 assists the test assembly 200 in testing the unit under test 700, ensuring the test results. The camera 240 can be a standard image camera, transmitting images to the operator for convenient operation. Alternatively, the camera 240 can be a vision camera, using visual recognition to determine the state of the detection element 210, for example, whether it is in a certain state. Figure 3 The in-place state, or in the process of being in position Figure 4 The camera monitors the detection status and uses visual recognition to determine the relative position of the unit under test (DUT) 700 and the test component 200, facilitating adjustments to the relative positions of the DUT 700 or the test component 200 to ensure correct processing. The vision camera can also perform further visual inspection of the DUT 700 through images to detect whether the DUT 700 has defects.

[0048] Reference Figure 1 and Figure 2 In some embodiments, the through hole 120 has a set area W1 in a direction parallel to the bearing surface 110, and the end face of the heating element 220 facing the bearing surface 110 has a set area W2, satisfying: W2 < 0.5W1. By setting the area W2 to be less than 0.5W1, it can be ensured that the heating element 220 can extend into the through hole 120 from one side and move within the through hole 120 to achieve contact with the unit under test 700, and ensure that the heating element 220 heats a portion of the unit under test 700, thus ensuring the regional heating effect of the heating zone.

[0049] Reference Figure 1 and Figure 2 In some embodiments, the testing apparatus further includes a third drive component 600, which is connected to the support platform 100 and drives the support platform 100 to rotate in a direction perpendicular to the support surface 110. The third drive component 600 further increases the degrees of freedom of the support platform 100, allowing it to adjust the relative position of the support surface 110 and the testing component 200 in the circumferential direction. This enables the testing component 200 to be positioned relative to the unit under test 700 in the circumferential direction, further improving positioning accuracy and ensuring the testing positioning of the apparatus. Specifically, the third drive component 600 can be selected as a conventional rotating mechanism in the art, such as a motor turntable.

[0050] In some embodiments, the testing apparatus further includes a transfer component (not shown) for picking up the unit under test 700 to place or remove the unit under test 700 onto the support platform 100. The transfer component can be selected as a single-axis or multi-axis robot, mechanical suction cup, or other conventional transfer components in the art.

[0051] Reference Figures 1 to 6 The following describes the testing process of the testing apparatus in some embodiments. First, the unit under test (DUT) 700 is conveyed to the carrier platform 100 by the transfer component and placed on the carrier surface 110, completing the loading operation. Subsequently, the camera 240 identifies the relative positional relationship between the DUT 700 and the test component 200, and the third drive component 600 drives the carrier platform 100 to rotate to align the DUT 700, ensuring that the processing coordinate system of the DUT 700 is aligned with the processing coordinate system driven by the second drive component 400. Subsequently, the second drive component 400 drives the test component 200 to the first processing position, so that the test component 200 is in the positioned state. Then, the first drive component 300 drives the detection element 210 and the heating element 220 to approach the DUT 700 to enter the testing state for testing the DUT 700. After the test in the current area is completed, the first drive assembly 300 drives the heating element 220 and the detection element 210 away from each other. Then, the second drive assembly 400 drives the test assembly 200 to the next processing position. After that, the operation is repeated until all the tests on the unit under test are completed.

[0052] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A testing apparatus, characterized in that, include: A support platform is provided with a support surface and a through hole. The support surface is used to support the unit under test, and the through hole extends in a direction perpendicular to the support surface. The through hole connects to the support surface and is used to allow the unit under test to be exposed. The test assembly includes a detection element and a heating element, which are located on opposite sides of the bearing surface and are arranged opposite each other in a direction perpendicular to the bearing surface. A first driving component, connected to the test component, is used to drive the detection element and the heating element to move relative to each other in a direction perpendicular to the bearing surface, so that the detection element and the heating element abut against the unit under test; The through hole has a set area W1 in the direction parallel to the bearing surface, and the end face of the heating element facing the bearing surface has a set area W2, satisfying: W2 < 0.5W1.

2. The testing apparatus according to claim 1, characterized in that, The heating element includes a heating layer, an insulating layer, and a contact layer that are interconnected. The heating layer, the insulating layer, and the contact layer are arranged sequentially along the direction close to the bearing surface. The contact layer is used to contact the unit under test.

3. The testing apparatus according to claim 1 or 2, characterized in that, The heating element includes a heating layer, an insulating layer, and a connecting arm that are connected to each other. The connecting arm, the insulating layer, and the heating layer are arranged sequentially along the direction close to the bearing surface.

4. The testing apparatus according to claim 1, characterized in that, It also includes a second drive component, which is connected to the support platform and / or the test component, and is used to drive the support platform and the test component to move relative to each other in a direction parallel to the support surface.

5. The testing apparatus according to claim 4, characterized in that, It also includes a mounting frame, on which the second drive assembly is mounted, and on which the first drive assembly is mounted. The support platform is connected to the second drive assembly, and the second drive assembly is used to drive the support platform to move relative to the test assembly in a direction parallel to the support surface.

6. The testing apparatus according to claim 1, characterized in that, The test assembly also includes a pressure sensor connected to the detection element, which is used to test the force exerted by the detection element against the unit under test.

7. The testing apparatus according to claim 1, characterized in that, The test component also includes a camera, which is located on the same side of the support platform as the test piece, and the camera is used to capture images of the test piece and the unit under test.

8. The testing apparatus according to claim 1, characterized in that, The first driving assembly includes a first driver and a connecting rod. The first driver is connected to the connecting rod and is used to drive the connecting rod to rotate. The connecting rod is provided with a first connecting part and a second connecting part. The first connecting part is provided with a first thread, and the second connecting part is provided with a second thread. The helical direction of the first thread is opposite to that of the second thread. The detection element is threadedly connected to the first connecting part, and the heating element is threadedly connected to the second connecting part.

9. The testing apparatus according to claim 1, characterized in that, It also includes a third drive component, which is connected to the support platform and is used to drive the support platform to rotate in a direction perpendicular to the support surface.

Citation Information

Patent Citations

  • Semiconductor device testing device

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  • Silicon wafer detection system

    CN218939596U

  • Testing device

    CN220820159U