Resistive random access memory with planar cross-point array structure

Abstract

The application relates to the field of resistive random access memory (RRAM) technology, in particular to a planar cross array structure RRAM, which comprises a packaging shell and a memory body arranged in the packaging shell, a limiting groove is symmetrically arranged on the inner wall of the packaging shell, a buffer groove is symmetrically arranged on the inner wall of the packaging shell, a first magnetic block is slidably connected in the limiting groove, and the outer wall of the memory body is fixedly connected with a magnetic plate. The memory body is suspended in the packaging shell by repulsive magnetic force between the first magnetic block and the magnetic plate, so that when the packaging shell vibrates, the packaging shell cannot effectively transmit the vibration to the memory body, thereby completing the shock absorption protection of the memory body, and reducing the probability of the problem that the electronic elements and electrode lines in the memory body are damaged due to over-stress caused by vibration.

Description

Technical Field

[0001] This invention relates to the field of resistive random access memory (RRAM) technology, specifically a resistive random access memory with a planar cross-shaped array structure. Background Technology

[0002] In the 21st century, with the advent of the big data era, technological advancements and applications have generated unimaginable amounts of data in human society. Simultaneously, the ever-increasing volume of data in human society creates a contradiction between the surging demand for data storage and the limited capacity of current storage devices. Therefore, scientists have begun seeking new materials, mechanisms, and structures for storage technologies to resolve this contradiction. Against this backdrop, semiconductor memory devices such as ferroelectric random access memory (FRAM), phase-change random access memory (PCM), magnetoresistive random access memory (MRAM), and resistive random access memory (RRAM) have emerged.

[0003] Resistive Random Access Memory (RRAM) utilizes pulse voltages to write to and erase memory cells, causing a change in the resistance of the memory cells. This is known as the pulse-induced resistive switching effect. The principle involves the conversion of the resistance of thin film materials between different resistance states (high resistance state (HR) and low resistance state (LRS)) under electrical excitation to achieve data storage. Depending on the polarity of the applied voltage required for resistance switching, the resistance switching characteristics of RRAM devices can be divided into two switching modes: unipolar switching and bipolar switching. As a strong competitor to next-generation memory, RRAM offers lower power consumption and miniaturization potential compared to other memories. Using a cross-array integration method, the memory cell area can be reduced to 4F (where F is the feature size), significantly improving the integration density and reducing cost. Furthermore, the cross-array structure can further enable three-dimensional multi-layer stacking integration, reducing the area of ​​each memory cell to 4F (where NC is the number of layers in the cross-array).

[0004] However, when subjected to impacts or during transportation, the encapsulation shell can only support the internal electronic components without providing protection. This makes it easy for the internal electronic components or electrode lines to break or be damaged due to stress when subjected to impacts or vibrations during transportation, resulting in a decrease in the performance or failure of the resistive random access memory. Summary of the Invention

[0005] To address the above problems, the present invention provides the following technical solution: a planar cross-array resistive random access memory (RRAM), comprising a package shell and a memory body disposed therein. The inner wall of the package shell has symmetrically formed limiting grooves and buffer grooves. A first magnetic block is slidably connected within the limiting groove. Magnetic plates are fixedly connected to the outer walls of the memory body, and the magnetic forces at opposite ends of the first magnetic block and magnetic plates are repulsive. A counterweight ring is slidably connected to the inner wall of the buffer groove, and a connecting pipe is fixedly connected to the inner wall of the buffer groove. The buffer groove is connected to the interior of the limiting groove via the connecting pipe. Symmetrically arranged support springs are fixedly connected to the bottom inner wall of the buffer groove, and the top of the support spring is fixedly connected to the bottom of the counterweight ring.

[0006] Preferably, a sealing plate is fixedly connected to the top of the inner ring wall of the buffer groove, and a first air hole is opened on the top of the sealing plate, through which the sealing plate passes. A first air cushion is fixedly connected to the top of the sealing plate, and the first air cushion covers the first air hole. One side of the first air cushion can be lifted upwards. A second air hole is opened on the outer wall of the encapsulation shell, communicating with the upper inner side of the buffer groove. A second air cushion is provided on the inner wall of the buffer groove, and the second air cushion covers the second air hole. One side of the second air cushion can be lifted into the buffer groove.

[0007] Preferably, the buffer groove and the limiting groove are filled with hydraulic oil.

[0008] Preferably, the interior of the connecting pipe is hollow, and the end of the connecting pipe near the buffer groove is connected to the interior of the buffer groove. The inner wall of the connecting pipe is symmetrically provided with connecting holes that are respectively connected to the limiting groove and the buffer groove. A sealing column is slidably connected to the inner wall of the connecting pipe, and a compression groove is provided at the end of the sealing column near the buffer groove. A compression plate is slidably connected to the inner wall of the compression groove.

[0009] Preferably, a resistance spring is fixedly connected to the inner end wall of the connecting pipe, and the other end of the resistance spring is fixedly connected to one end of the sealing column.

[0010] Preferably, a magnetic shielding sheet is fixedly connected to the end of the magnetic plate closest to the memory body.

[0011] Preferably, a buffer pad is fixedly connected to the end of the first magnetic block near the memory body.

[0012] Preferably, meltblown fabric is fixedly connected to the inner ring wall of the second air hole.

[0013] Preferably, the inner wall of the encapsulation shell is fixedly connected with symmetrically arranged second magnetic blocks, and the magnetic forces of the opposite ends of the second magnetic blocks and the magnetic plate are mutually repulsive.

[0014] The technical effects and advantages of this invention are as follows:

[0015] 1. The present invention suspends the memory body inside the package shell by means of the repulsive magnetic force between the first magnetic block and the magnetic plate. Therefore, when the package shell vibrates, the package shell cannot effectively transmit the vibration to the memory body, thereby completing the shock absorption and protection of the memory body and reducing the probability of damage to the internal electronic components and electrode lines caused by vibration.

[0016] 2. The present invention enables the first magnetic block to automatically move up and down in the opposite direction to the force of the vibration of the package shell, thereby ensuring that the magnetic force supporting the magnetic plate by the first magnetic block remains constant. This reduces the probability of the magnetic plate sliding up and down inside the package shell due to the change in the magnetic force of the first magnetic block, which would cause the memory body to shake up and down inside the package shell, thus reducing the protective effect of the first magnetic block on the memory body.

[0017] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description and the drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a perspective view of the present invention;

[0020] Figure 2 This is an internal sectional view of the present invention;

[0021] Figure 3 yes Figure 2 Enlarged view of section A in the image;

[0022] Figure 4 This is a structural diagram of the magnetic plate in this invention;

[0023] Figure 5 This is a diagram of the internal structure of the connecting pipe in this invention;

[0024] Figure 6 This is a cross-sectional view of the sealing plate in this invention.

[0025] In the diagram: 1. Encapsulation shell; 2. Memory body; 3. Limiting groove; 4. Buffer groove; 5. First magnetic block; 6. Magnetic plate; 7. Counterweight ring; 8. Connecting pipe; 9. Support spring; 10. Sealing plate; 11. First air hole; 12. First air cushion; 13. Second air hole; 14. Second air cushion; 15. Connecting hole; 16. Sealing post; 17. Compression groove; 18. Compression plate; 19. Resistance spring; 20. Magnetic shielding sheet; 21. Buffer pad; 22. Meltblown cloth; 23. Second magnetic block. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] In the description of this invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, in the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] like Figures 1 to 5 As shown; a planar cross-shaped array structure resistive random access memory includes a package shell 1 and a memory body 2 disposed inside it. The inner wall of the package shell 1 is symmetrically provided with limiting grooves 3 and buffer grooves 4. A first magnetic block 5 is slidably connected in the limiting groove 3. Magnetic plates 6 are fixedly connected to the outer wall of the memory body 2. The magnetic forces of the opposite ends of the first magnetic block 5 and the magnetic plates 6 are repulsive to each other. A counterweight ring 7 is slidably connected to the inner wall of the buffer groove 4. A connecting pipe 8 is fixedly connected to the inner wall of the buffer groove 4. The buffer groove 4 is connected to the interior of the limiting groove 3 through the connecting pipe 8. Symmetrically arranged support springs 9 are fixedly connected to the bottom inner wall of the buffer groove 4. The top of the support springs 9 is fixedly connected to the bottom of the counterweight ring 7.

[0029] In use, the first magnetic block 5 is formed by the magnetic force repelling the magnetic plate 6, thus suspending the magnetic plate 6. The magnetic plate 6 is fixedly connected to the outer wall of the memory body 2, so the magnetic plate 6, along with the memory body 2, suspends inside the packaging shell 1. A limiting groove 3 is formed at the bottom of the packaging shell 1, and the first magnetic block 5 is slidably connected to the inner wall of the limiting groove 3, allowing the magnetic block to move up and down within the limiting groove 3. Furthermore, a buffer groove 4 is formed on the inner wall of the packaging shell 1, and a counterweight ring 7 is slidably connected to the inner wall of the buffer groove 4. The counterweight ring 7 slides downwards on the inner wall of the buffer groove 4 due to its own weight, thus providing support to the bottom of the buffer groove 4. The air in the buffer groove 4 is compressed by the counterweight block, and the buffer groove 4 is connected to the inside of the limiting groove 3 through the connecting pipe 8. This means that when the air at the bottom of the buffer groove 4 is compressed by the counterweight block, the air in the buffer groove 4 will enter the inside of the limiting groove 3. As more and more air enters the limiting groove 3, the air pressure inside the limiting groove 3 gradually increases, which causes the air in the limiting groove 3 to push the bottom of the first magnetic block 5, so that the first magnetic block 5 slides upward on the inner wall of the limiting groove 3, thereby making the first magnetic block 5 suspend in the middle of the limiting groove 3. The support spring 9 will support the counterweight ring 7 after the counterweight ring 7 moves downward, thereby helping the counterweight ring 7 to reset and move.

[0030] When the package shell 1 vibrates due to transportation or impact, the memory body 2 is suspended inside the package shell 1 by the repulsive magnetic force between the first magnetic block 5 and the magnetic plate 6. Therefore, when the package shell 1 vibrates, it cannot effectively transmit the vibration to the memory body 2 to achieve shock absorption and protection. Instead, the vibration of the package shell 1 transmits the vibration force to the first magnetic block 5, causing it to move up and down on the inner wall of the limiting groove 3 under the action of its own weight and the force generated by the vibration. This causes the first magnetic block 5 to move up and down during its movement. The magnetic support effect of the magnetic plate 6 is altered, causing it to slide up and down inside the packaging shell 1 due to the change in the magnetic force exerted on it by the first magnetic block 5. This causes the memory body 2 to shake up and down inside the packaging shell 1, reducing the protective effect of the first magnetic block 5 on the memory body 2. Therefore, when the packaging shell 1 vibrates, it transmits the force to the counterweight, causing the counterweight ring 7 to move up and down inside the buffer groove 4. As the counterweight ring 7 moves up and down in the buffer groove 4, it compresses the gas inside the buffer groove 4. When the packaging shell 1 vibrates, causing the first magnetic block 5 to move downwards, the counterweight ring 7 also moves downwards. The downward movement of the counterweight ring 7 compresses the air in the buffer groove 4 and transports it through the connecting pipe 8 to the inside of the limiting groove 3, thereby increasing the air pressure in the limiting groove 3 and causing the first magnetic block 5 to move upwards. Conversely, when the packaging shell 1 vibrates, causing the counterweight ring 7 to move upwards, the counterweight ring 7 draws the gas in the limiting groove 3 back into the buffer groove 4, causing the first magnetic block 5 to move downwards inside the limiting groove 3. This ensures that when the packaging shell 1 vibrates, the first magnetic block 5 automatically moves up and down in the opposite direction according to the force of the vibration, thus maintaining a constant magnetic force supporting the magnetic plate 6. This reduces the probability of the magnetic plate 6 sliding up and down inside the packaging shell 1 due to changes in the magnetic force exerted by the first magnetic block 5, which could cause the memory body 2 to shake up and down inside the packaging shell 1, reducing the protective effect of the first magnetic block 5 on the memory body 2. It also reduces the probability of damage to the internal electronic components and electrode lines of the memory body 2 due to vibration causing overstress.

[0031] like Figure 2 , Figure 3 and Figure 6As shown; a sealing plate 10 is fixedly connected to the top of the inner ring wall of the buffer groove 4, and a first air hole 11 is opened on the top of the sealing plate 10, through which it passes. A first air cushion 12 is fixedly connected to the top of the sealing plate 10, and the first air cushion 12 covers the first air hole 11. One side of the first air cushion 12 can be lifted upwards. A second air hole 13 is opened on the outer wall of the encapsulation shell 1, which communicates with the upper inner side of the buffer groove 4. A second air cushion 14 is provided on the inner wall of the buffer groove 4, and the second air cushion 14 covers the second air hole 13. One side of the second air cushion 14 can be lifted into the buffer groove 4.

[0032] In use, a sealing plate 10 is fixedly connected to the top of the inner ring wall of the buffer groove 4, which forms a cavity between the bottom of the sealing plate 10 and the top of the counterweight ring 7. When the counterweight ring 7 moves upward, the top of the counterweight ring 7 pushes the gas in the cavity, changing the air pressure in the cavity. The gas then pushes the first air cushion 12 through the first air hole 11, thus lifting the first air cushion 12. This allows the gas in the cavity to be discharged into the interior of the encapsulation shell 1 through the first air hole 11. When the counterweight ring 7 moves downward, it draws the air in the cavity, changing the air pressure inside the cavity. At this time, outside air enters the second air hole 13 and pushes the second air cushion 14, lifting it, before entering the cavity. This cycle continues, delivering outside air to the interior of the encapsulation shell 1, thereby achieving the purpose of heat dissipation and cooling.

[0033] like Figure 2 As shown; the buffer groove 4 and the limiting groove 3 are filled with hydraulic oil;

[0034] In use, air can be compressed. To prevent the first magnetic block 5 from squeezing the air in the limiting groove 3 when the encapsulation shell 1 vibrates, causing it to move up and down inside the limiting groove 3 and reducing its magnetic protection effect on the memory body 2, hydraulic oil is filled inside the limiting groove 3 and the buffer groove 4. Hydraulic oil cannot be compressed, or its compressibility is negligible. This ensures that the first magnetic block 5 moves as much as the counterweight ring 7 squeezes the hydraulic oil in the buffer groove 4 into the limiting groove 3, and the first magnetic block 5 cannot squeeze the hydraulic oil to move, thus further ensuring the protection of the memory body 2.

[0035] like Figure 2 and Figure 5As shown; the interior of the connecting pipe 8 is hollow, and one end of the connecting pipe 8 near the buffer groove 4 is connected to the interior of the buffer groove 4. The inner wall of the connecting pipe 8 is symmetrically provided with connecting holes 15 that are respectively connected to the limiting groove 3 and the buffer groove 4. The inner wall of the connecting pipe 8 is slidably connected with a sealing column 16, and one end of the sealing column 16 near the buffer groove 4 is provided with a compression groove 17. The inner wall of the compression groove 17 is slidably connected with a compression plate 18.

[0036] During use, when the encapsulation shell 1 generates low-frequency vibration, it will cause the first magnetic block 5 to vibrate at a low frequency. The low-frequency vibration of the first magnetic block 5 has a very small effect on the magnetic force of the magnetic plate 6, so it will not affect the memory body 2. However, the low-frequency vibration of the encapsulation shell 1 will also cause the counterweight ring 7 to move up and down. This will cause the counterweight ring 7 to move up and down frequently, pushing and pulling the hydraulic oil back and forth in the limiting groove 3, thereby increasing the movement amplitude of the first magnetic block 5 and reducing the protection effect on the memory body 2. Therefore, the end of the connecting pipe 8 near the buffer groove 4 is connected to the inside of the buffer groove 4, and the connecting holes 15 are symmetrically opened on the outer wall of the connecting pipe 8 to connect the oil to the buffer groove 4 and the limiting groove 3 respectively. The oil sealing column 16 is slidably connected inside the connecting pipe 8. Only when the sealing column 16 moves inside the connecting pipe 8 to the point where its two ends are no longer connected... When the through hole 15 is sealed, hydraulic oil can flow in the connecting pipe 8. When the hydraulic oil in the buffer groove 4 enters the interior of the connecting pipe 8, it pushes the compression plate 18, which is slidably connected to the inner wall of the compression groove 17 on the sealing column 16. This causes the compression plate 18 to compress the air in the compression groove 17 and move it towards the inner wall of the compression groove 17. This prevents the hydraulic oil from pushing the sealing column 16 to move after entering the interior of the connecting pipe 8. Only when the hydraulic oil continuously enters and exits the connecting pipe 8 and the compression plate 18 can no longer move in the compression groove 17 can the hydraulic oil push or pull the sealing column 16 to move and stop sealing the through hole 15. At this time, the hydraulic oil can flow through the through hole 15 in the interior of the connecting pipe 8. This prevents the hydraulic oil in the buffer groove 4 from frequently entering and exiting the limiting groove 3 due to low-frequency vibration, which would cause the first magnetic block 5 in the limiting groove 3 to become unstable.

[0037] like Figure 2 and Figure 5 As shown; a resistance spring 19 is fixedly connected to the inner end wall of the connecting pipe 8, and the other end of the resistance spring 19 is fixedly connected to one end of the sealing column 16.

[0038] In order to prevent the sealing column 16 from moving due to friction when the compression plate 18 moves, or to prevent the sealing column 16 from being pulled back by the hydraulic oil in the buffer groove 4, a resistance spring 19 is fixedly connected to the inner end wall of the connecting pipe 8. The resistance spring 19 pushes the sealing column 16, so that the sealing column 16 needs to squeeze the resistance spring 19 to move when it moves. When the hydraulic oil in the buffer groove 4 pulls the sealing column 16, the elastic force of the damping spring itself will also push the sealing column 16 to reset and move.

[0039] like Figure 4 As shown; each of the magnetic plates 6 has a magnetic shielding sheet 20 fixedly connected to one end near the memory body 2;

[0040] In use, a magnetic shielding sheet 20 is fixedly connected to one end of the magnetic plate 6 near the memory body 2. The magnetic shielding sheet 20 can isolate the magnetic force, thereby preventing the magnetic force from affecting the memory body 2.

[0041] like Figure 2 As shown; a buffer pad 21 is fixedly connected to one end of the first magnetic block 5 near the memory body 2.

[0042] In order to prevent large vibrations during use, which would cause the swaying force to be much greater than the magnetic force of the first magnetic block 5, resulting in the magnetic plate 6 hitting the top of the first magnetic block 5 and causing the memory body 2 to be indirectly impacted and generate large vibrations, a buffer pad 21 is fixedly connected to one end of the first magnetic block 5 near the magnetic plate 6. The buffer pad 21 will buffer the impact of the magnetic plate 6 on the first magnetic block 5.

[0043] like Figure 2 and Figure 3 As shown; the inner ring wall of the second air hole 13 is fixedly connected with meltblown cloth 22;

[0044] When in use, the meltblown fabric 22 is a water-proof but not air-proof material. The meltblown fabric 22 is fixedly connected to the inner ring wall of the second air hole 13, which prevents moisture in the outside air from entering the interior of the packaging shell 1 and affecting the memory body 2 inside.

[0045] like Figure 2 As shown; the inner wall of the encapsulation shell 1 is fixedly connected with symmetrically arranged second magnetic blocks 23, and the magnetic forces of the opposite end of the second magnetic block 23 and the magnetic plate 6 are mutually repulsive to the opposite end of the magnetic plate 6 and the second magnetic block 23.

[0046] In use, the magnetic force of the second magnetic block 23 is used to magnetically push the magnetic plate 6 on the side wall of the memory body 2, thereby increasing the stability of the memory body 2 inside the packaging shell 1.

[0047] Working principle of this invention:

[0048] Refer to the instruction manual appendix Figure 1-5 As shown, the first magnetic block 5 is formed by the magnetic force repelling the magnetic plate 6, thereby suspending the magnetic plate 6. The magnetic plate 6 is fixedly connected to the outer wall of the memory body 2, so the magnetic plate 6 will suspend together with the memory body 2 inside the packaging shell 1. A limiting groove 3 is formed at the bottom of the packaging shell 1, and the first magnetic block 5 is slidably connected to the inner wall of the limiting groove 3, which allows the magnetic block to move up and down inside the limiting groove 3. A buffer groove 4 is also formed on the inner wall of the packaging shell 1, and a counterweight ring 7 is slidably connected to the inner wall of the buffer groove 4. The counterweight ring 7 will move due to its own weight. The inner wall of the buffer groove 4 slides downward, thereby compressing the air at the bottom of the buffer groove 4. The buffer groove 4 is connected to the inside of the limiting groove 3 through the connecting pipe 8. This means that when the air at the bottom of the buffer groove 4 is compressed by the counterweight, the air in the buffer groove 4 will enter the inside of the limiting groove 3. As more and more air enters the limiting groove 3, the air pressure inside the limiting groove 3 gradually increases, thereby pushing the bottom of the first magnetic block 5, causing the first magnetic block 5 to slide upward on the inner wall of the limiting groove 3, thus making the first magnetic block 5 suspend in the middle of the limiting groove 3.

[0049] When the package shell 1 vibrates due to transportation or impact, the memory body 2 is suspended inside the package shell 1 by the repulsive magnetic force between the first magnetic block 5 and the magnetic plate 6. Therefore, when the package shell 1 vibrates, it cannot effectively transmit the vibration to the memory body 2 to achieve shock absorption and protection. Instead, the vibration of the package shell 1 transmits the vibration force to the first magnetic block 5, causing it to move up and down on the inner wall of the limiting groove 3 under the action of its own weight and the force generated by the vibration. This causes the first magnetic block 5 to move up and down during its movement. The magnetic support effect of the magnetic plate 6 is altered, causing it to slide up and down inside the packaging shell 1 due to the change in the magnetic force exerted on it by the first magnetic block 5. This causes the memory body 2 to shake up and down inside the packaging shell 1, reducing the protective effect of the first magnetic block 5 on the memory body 2. Therefore, when the packaging shell 1 vibrates, it transmits the force to the counterweight, causing the counterweight ring 7 to move up and down inside the buffer groove 4. As the counterweight ring 7 moves up and down in the buffer groove 4, it compresses the gas inside the buffer groove 4. When the packaging shell 1 vibrates, causing the first magnetic block 5 to move downwards, the counterweight ring 7 also moves downwards. The downward movement of the counterweight ring 7 compresses the air in the buffer groove 4 and transports it through the connecting pipe 8 to the inside of the limiting groove 3, thereby increasing the air pressure in the limiting groove 3 and causing the first magnetic block 5 to move upwards. Conversely, when the packaging shell 1 vibrates, causing the counterweight ring 7 to move upwards, the counterweight ring 7 draws the gas in the limiting groove 3 back into the buffer groove 4, causing the first magnetic block 5 to move downwards inside the limiting groove 3. This ensures that when the packaging shell 1 vibrates, the first magnetic block 5 automatically moves up and down in the opposite direction according to the force of the vibration, thus maintaining a constant magnetic force supporting the magnetic plate 6. This reduces the probability of the magnetic plate 6 sliding up and down inside the packaging shell 1 due to changes in the magnetic force exerted by the first magnetic block 5, which could cause the memory body 2 to shake up and down inside the packaging shell 1, reducing the protective effect of the first magnetic block 5 on the memory body 2. It also reduces the probability of damage to the internal electronic components and electrode lines of the memory body 2 due to vibration causing overstress.

[0050] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A planar cross-shaped array structure resistive random access memory, comprising a package shell (1) and a memory body (2) disposed therein, characterized in that: The inner wall of the encapsulation shell (1) is symmetrically provided with limiting grooves (3), and the inner wall of the encapsulation shell (1) is symmetrically provided with buffer grooves (4). A first magnetic block (5) is slidably connected in the limiting groove (3). A magnetic plate (6) is fixedly connected to the outer wall of the memory body (2). The magnetic forces of the opposite end of the first magnetic block (5) and the magnetic plate (6) and the opposite end of the magnetic plate (6) and the first magnetic block (5) are set to repel each other. This is used to form a non-contact support for the memory body (2) and reduce vibration transmission. A counterweight ring (7) is slidably connected to the inner wall of the buffer groove (4). The counterweight ring (7) is used to move up and down along the buffer groove (4) when the encapsulation shell (1) vibrates, and responds to the vibration through its own inertia. A symmetrically arranged support spring (9) is fixedly connected to the bottom inner wall of the buffer groove (4). The top of the support spring (9) is fixedly connected to the bottom of the counterweight ring (7) for elastic support and reset of the counterweight ring (7). A sealing plate (10) is fixedly connected to the top of the inner ring wall of the buffer groove (4), and a first air hole (11) is opened on the top of the sealing plate (10) through which it passes. A first air cushion (12) is fixedly connected to the top of the sealing plate (10), and the first air cushion (12) covers the first air hole (11). One side of the first air cushion (12) can be lifted upward to form a one-way exhaust structure. A second air hole (13) is opened on the outer wall of the encapsulation shell (1) and communicates with the upper inner side of the buffer groove (4). A second air cushion (14) is provided on the inner wall of the buffer groove (4). The second air cushion (14) covers the second air hole (13), and one side of the second air cushion (14) can be lifted into the buffer groove (4) to form a one-way air intake structure.

2. The resistive random access memory with a planar cross-shaped array structure according to claim 1, characterized in that: Each magnetic plate (6) has a magnetic shielding sheet (20) fixedly connected to one end near the memory body (2).

3. The resistive random access memory with a planar cross-shaped array structure according to claim 1, characterized in that: Each of the first magnetic blocks (5) has a buffer pad (21) fixedly connected to one end near the memory body (2).

4. The resistive random access memory with a planar cross-shaped array structure according to claim 1, characterized in that: The inner ring wall of the second air hole (13) is fixedly connected with meltblown cloth (22).

5. The resistive random access memory with a planar cross-shaped array structure according to claim 1, characterized in that: The inner wall of the encapsulation shell (1) is fixedly connected with a symmetrically arranged second magnetic block (23), and the magnetic forces of the opposite end of the second magnetic block (23) and the magnetic plate (6) and the opposite end of the magnetic plate (6) and the second magnetic block (23) are mutually repulsive.

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