Gas injection unit and substrate processing apparatus

Abstract

The present application provides a gas injection unit and a substrate processing apparatus. The gas injection unit of one embodiment of the present application includes: a housing including a gas flow inlet and a cavity connected to the gas flow inlet and formed with an opening on one face; and a gas injection portion disposed in the cavity, configured to be changeable to a plurality of disposition positions with respect to the cavity, and having an internal flow path connected to the gas flow inlet and a plurality of gas injection hole portions different from each other and connected to the internal flow path, the plurality of gas injection hole portions being disposed to inject gas toward the opening according to the disposition positions. According to this configuration, the flow rate and flow volume of gas can be adjusted by the gas injection portion having the plurality of gas injection hole portions.

Description

TECHNICAL FIELD

[0001] The present application relates to a gas injection unit and a substrate processing apparatus including the same. BACKGROUND

[0002] Generally, in a semiconductor manufacturing process, a substrate is manufactured through a photolithography process, an etching process, a deposition process, a metal process, an EDS (Electrical die sorting) process, a packaging process, etc. In such a process, as necessary, a cleaning process for removing foreign substances such as particles or organic substances attached to the substrate before and after the process, and a drying process for removing a liquid remaining on the substrate after such a cleaning process can be performed. For example, in a packaging process, a substrate which is singulated into a plurality of semiconductor packages through a cutting and sorting process is classified as a good product or a defective product through an inspection after the cleaning and drying processes.

[0003] In such a cleaning or drying process, a gas injection unit such as a gas knife for injecting a gas is provided to clean or dry the substrate.

[0004] Conventionally, a gas injection port of such a gas injection unit is formed in a slit shape, and in order to control the discharge amount of the gas, an adjusting means for adjusting the gap size of the slit shape of the gas injection port of the gas injection unit is provided. However, through such an adjusting means, although the gap size of the slit shape of the gas injection port can be adjusted, there is a difficulty in uniformly adjusting the gap size of the slit shape, and thus there is a problem in that the flow rate and the flow volume of each region are not uniform, and a flow rate and flow volume deviation, etc. can occur.

[0005] PRIOR ART DOCUMENT

[0006] PATENT DOCUMENT

[0007] (Patent Document 1) Korean Patent No. 10-0762371 (2007.09.20) SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] The present application has been made in an effort to provide a gas injection unit and a substrate processing apparatus capable of adjusting the flow rate and the flow volume of a gas.

[0010] MEANS FOR SOLVING THE PROBLEMS

[0011] In order to achieve the above-mentioned purpose, according to one embodiment of the present invention, a gas injection unit is provided, comprising: a shell, comprising a gas inlet and a cavity, the cavity being connected to the gas inlet and having an opening formed on one surface; and a gas injection portion being arranged in the cavity, configured to be changeable to a plurality of configuration positions relative to the cavity, and having an internal flow path and a plurality of gas injection hole portions different from each other, the internal flow path being connected to the gas inlet, the plurality of gas injection hole portions being connected to the internal flow path, and being configured to spray gas toward the opening according to the configuration position.

[0012] In one embodiment, the gas injection portion may be detachably mounted on the cavity.

[0013] In addition, the gas injection portion may include a plurality of gas injection walls, and a plurality of gas injection hole portions different from each other may be arranged on the plurality of gas injection walls.

[0014] Furthermore, the outer cross-sectional shape of the gas injection portion is formed into a polygonal shape, each of the gas injection walls is defined by each side wall of the gas injection portion, and the cavity can be formed into a shape corresponding to the outer cross-sectional shape of the gas injection portion.

[0015] Furthermore, a connecting flow path connecting the gas inlet and the internal flow path may be provided on each of the gas injection walls.

[0016] In one embodiment, the outer contour cross-sectional shape of the gas injection portion is formed into a square shape, and a connecting flow path connecting the gas inlet and the internal flow path is arranged on each of the gas injection walls. The cavity is formed into a rectangular shape having the opening formed on one surface and corresponding to the outer surface of at least three gas injection walls of the gas injection portion. In the configuration position, one of the gas injection walls is configured to face the opening, and the other three gas injection walls can be closely attached to the inner wall surface of the cavity.

[0017] For example, the gas inlet may be disposed in the upper center portion of the housing.

[0018] For another example, the gas inlet may be respectively disposed at both ends of the shell.

[0019] In addition, the gas injection unit of the present invention may include a cover coupled to the opening and formed with a discharge port exposing the gas injection hole portion.

[0020] Furthermore, the gas injection portion is formed with a plurality of connecting flow paths connecting the gas inlet and the internal flow path, and the cover may be provided with a sealing protrusion inserted into a connecting flow path facing the opening among the plurality of connecting flow paths for sealing.

[0021] In addition, each of the gas injection hole portions can include a plurality of gas injection holes respectively configured with the same hole diameter and at a prescribed interval.

[0022] Specifically, the plurality of gas injection hole portions can be configured such that at least one of the hole shape, the hole diameter, and the interval between the gas injection holes located in the same gas injection wall and adjacent to each other of the gas injection holes are different from each other.

[0023] On the other hand, according to another embodiment of the present invention, there is further provided a gas injection unit including: a housing including a gas flow inlet and a cavity connected to the gas flow inlet and formed with an opening on one face; a gas injection portion configured within the cavity, detachably configured in a plurality of configuration positions with respect to the cavity, and having an outer profile cross-sectional shape formed in a rectangular shape; and a cover covering the opening and formed with a discharge outlet exposing a gas injection hole portion of the gas injection portion, the gas injection portion including: an internal flow path connected to the gas flow inlet; four gas injection walls defined by each side wall of the gas injection portion; a plurality of gas injection hole portions different from each other, including a plurality of gas injection holes connected to the internal flow path and configured at a prescribed interval in each of the gas injection walls, thereby configured to be directed toward the opening to inject gas according to the configuration positions.

[0024] Still another aspect, according to still another embodiment of the present invention, there is further provided a substrate processing apparatus including: a process cavity in which a transport unit transporting a substrate is configured; and a gas injection unit configured within the process cavity and injecting gas toward the substrate, the gas injection unit including: a housing including a gas flow inlet and a cavity connected to the gas flow inlet and formed with an opening on one face; and a gas injection portion configured within the cavity, configured to be changeable in a plurality of configuration positions with respect to the cavity, and having an internal flow path connected to the gas flow inlet and a plurality of gas injection hole portions different from each other and configured to be directed toward the opening to inject gas according to the configuration positions.

[0025] Effects of the Invention

[0026] According to the gas injection unit and the substrate processing apparatus of the embodiment of the present application, the gas injection hole portion is configured in this way, so that the gas movement amount transmission effect can be increased, and when used for cleaning process, the cleaning area can be increased, and the overall flow deviation of the gas injection portion can be reduced, and further, since there are multiple types of gas injection hole portions, there is no need to provide a separate adjusting device for adjusting the gap interval for the injection structure of the slit shape used in the past, so that a simple structure can be made, and the desired gas injection hole portion can be selected as needed, so that the flow and flow rate of the gas can be adjusted. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1a and Figure 1b are example diagrams of substrate processing apparatuses according to different embodiments of the present application.

[0028] Figure 2 is an exploded view of a gas injection unit according to an embodiment of the present application.

[0029] Figure 3 is an exploded view of the gas injection unit from Figure 2 a side.

[0030] Figure 4 is a front view of a gas injection unit according to an embodiment of the present application.

[0031] Figure 5a and Figure 5b are cross-sectional views taken along lines A-A' and B-B' of Figure 4 respectively.

[0032] Figure 6a and Figure 6b are diagrams showing two adjacent gas injection walls in a gas injection portion of a gas injection unit according to an embodiment of the present application.

[0033] Figure 7 is a diagram showing the configuration of a gas injection portion of a gas injection unit according to an embodiment of the present application, in which all gas injection hole portions except for the gas injection hole portion facing the opening are omitted.

[0034] Figure 8a and Figure 8b are diagrams analyzing the gas flow rate during the process of injecting gas to a substrate by a gas injection unit having a slit-shaped gas injection port integrally configured in the prior art and a gas injection unit according to the present application respectively.

[0035] Figure 9a and Figure 9bFig. 2 is a graph showing the analysis of gas pressure during the process of gas injection to a substrate by a gas injection unit having a slit-shaped gas injection port of a conventional one-piece structure and a gas injection unit of the present application, respectively.

[0036] Figure 10 Fig. 3 is a front view of a gas injection unit according to another embodiment of the present application.

[0037] Explanation of Reference Numerals

[0038] 10 substrate processing apparatus 100 process chamber

[0039] 110 loading port 120 unloading port

[0040] 130 drain port 200 gas injection unit

[0041] 210 housing 211 cavity

[0042] 212, 212a gas flow inlet 213 opening

[0043] 220 gas injection portion 221 gas injection hole portion

[0044] 221a first gas injection hole portion 221b second gas injection hole portion

[0045] 221c third gas injection hole portion 221d fourth gas injection hole portion

[0046] 222 internal flow path 223 gas injection wall

[0047] 223a first gas injection wall 223b second gas injection wall

[0048] 223c third gas injection wall 223d fourth gas injection wall

[0049] 224 connection flow path 224a first connection flow path

[0050] 224b second connection flow path 224c third connection flow path

[0051] 224d fourth connection flow path 225 gas injection hole

[0052] 225a first gas injection hole 225b second gas injection hole

[0053] 225c third gas injection hole 225d fourth gas injection hole

[0054] 230 lid 231 discharge port

[0055] 232 sealing protrusion 300 conveyance unit

[0056] 310 rotating shaft 320 roller

[0057] S substrate P1 first arrangement position

[0058] P2 second configuration position DETAILED DESCRIPTION

[0059] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person skilled in the art to which the present invention belongs can easily implement the present invention. However, when describing the preferred embodiments of the present invention in detail, if it is considered that the specific description of the relevant known functions or structures will unnecessarily obscure the gist of the present invention, its detailed description will be omitted. In addition, for parts with similar functions and effects, the same symbols are used throughout the accompanying drawings. In this specification, the terms "upper part", "upper surface", "upper surface", "upper side", "lower part", "lower surface", "bottom", "lower surface", "lower side", "inside", "outside" and the like are based on the "upper part", "upper surface", "upper side", "lower part", "lower surface", "bottom", "lower surface", "lower side", "inside", "outside" and the like of the constituent elements, and in fact will be different depending on the direction in which the constituent elements are arranged.

[0060] In addition, throughout the specification, when a certain part is "connected" to another part, this includes not only the case of "direct connection" but also the case of "indirect connection" with other components interposed therebetween. Furthermore, unless otherwise described, "comprising" certain components means that other components may be included, rather than excluding other components.

[0061] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0062] Figure 1a and Figure 1b 1 and 2 are exemplary views showing substrate processing apparatuses according to different embodiments of the present invention.

[0063] Reference Figure 1a and Figure 1b The substrate processing apparatus of the present invention is an apparatus for processing substrates and can be various process processing apparatuses used to process substrates during substrate manufacturing, such as substrate cleaning apparatuses, substrate drying apparatuses, and the like. Furthermore, for example, the substrate processing apparatus of the present invention can also be used in cutting and inspection apparatuses. As a method for conveying substrates in such a substrate processing apparatus, the gas injection unit of the present invention can be used to inject gas not only during conveyance using rollers (described below) but also during conveyance by adsorption of the substrate by an adsorption plate.

[0064] The substrate processing apparatus 10 includes a process chamber 100 and a gas injection unit 200 .

[0065] A conveying unit 300 configured to convey the substrate S along a conveying direction from the loading port 110 to the unloading port 120 is provided in the process chamber 100. A liquid discharge port 130 for discharging the process liquid can also be provided in the lower portion of the process chamber 100.

[0066] The conveying unit 300 can include a plurality of rotating shafts 310 configured along the conveying direction, a plurality of rollers 320 provided on the rotating shafts 310, and a driving portion (not shown) connected to the rotating shafts 310 to drive the rotating shafts 310 to rotate.

[0067] The plurality of rotating shafts 310 can be provided at regular intervals in the horizontal direction within the process chamber 100. The length of the rotating shafts 310 is determined according to the size of the substrate S to be conveyed, and a long-axis rotating shaft 310 having a longer length can be used when a substrate S having a large size is to be conveyed.

[0068] A plurality of rollers 320 can be provided at regular intervals on each of the rotating shafts 310, and the plurality of rollers 320 support the substrate S and rotate in a predetermined direction to convey the substrate S.

[0069] As shown in FIG. 1, a gas injection unit 200 is provided on the upper portion of the substrate S located on the rollers 320 of the conveying unit 300 having such a configuration, and the gas injection unit 200 injects gas toward the upper surface of the conveyed substrate S. Figure 1a

[0070] In another embodiment, as shown in FIG. 2, two gas injection units 200 are provided on the upper and lower portions of the substrate S located on the rollers 320 of the conveying unit 300, and the two gas injection units 200 inject gas toward the upper and lower surfaces of the conveyed substrate S, respectively, and the two gas injection units 200 face each other. Figure 1b The gas injection unit 200 can be formed to have a sufficient length to supply sufficient gas to the conveyed substrate S.

[0071] Hereinafter, the gas injection unit 200 of the present application will be described in detail with reference to the accompanying drawings.

[0072]

[0073] is an exploded view of the gas injection unit according to an embodiment of the present application, Figure 2 is an exploded view of the gas injection unit as viewed from the side of Figure 3 is a front view of the gas injection unit according to an embodiment of the present application, Figure 2 and Figure 4 are cross-sectional views taken along the A-A' line and the B-B' line of Figure 5a , respectively, Figure 5b and Figure 4 are cross-sectional views taken along the A-A' line and the B-B' line of Figure 6a , respectively, Figure 6b ​FIG. 1 is a diagram showing two adjacent gas injection walls of a gas injection portion of a gas injection unit according to an embodiment of the present application.

[0074] Referring to Figure 2 , a gas injection unit 200 according to an embodiment of the present application is disposed in a process chamber 100 of a substrate processing apparatus 10 to inject gas toward a substrate S, and specifically includes a housing 210 and a gas injection portion 220 disposed in a cavity 211 of the housing 210.

[0075] The housing 210 includes the cavity 211.

[0076] A gas flow inlet 212 is formed in the cavity 211 of the housing 210, and the gas flow inlet 212 is connected to a supply line that supplies gas to flow into the cavity 211. Such a cavity 211 is connected to the gas flow inlet 212, and an opening 213 is formed in one face so that a gas injection hole portion 221 of the gas injection portion 220 described later can be exposed through the opening 213 of the cavity 211. Thus, gas supplied from the supply line can flow to the gas injection portion 220 through the gas flow inlet 212 formed in the cavity 211 of the housing 210, and thereby the gas can be injected through the gas injection hole portion 221.

[0077] Such a gas flow inlet 212 can be disposed at various positions of the housing 210.

[0078] For example, as Figure 2 shown, the gas flow inlet 212 can be disposed at the upper center portion of the housing 210. Thus, gas supplied from the supply line flows to both sides of the gas injection portion 220 disposed in the cavity 211 through the gas flow inlet 212 of the housing 210, and thereby the gas can be injected through the gas injection hole portion 221 provided in the gas injection portion 220, and thereby it is advantageous to reduce the overall flow deviation of the gas injection portion 220.

[0079] The gas injection portion 220 is disposed in the cavity 211 of the housing 210, and is configured to be changeable to a plurality of disposition positions with respect to the cavity 211. Such a gas injection portion 220 has an internal flow path 222 and the gas injection hole portion 221.

[0080] The internal flow path 222 of the gas injection portion 220 is connected to the gas flow inlet 212 of the housing 210, and is connected to the gas injection hole portion 221.

[0081] The gas injection hole portion 221 can be configured by a plurality of gas injection holes that are different from each other. In other words, the gas injection hole portion 221 can be configured by a plurality of gas injection holes that are different from each other and are disposed to be directed toward the opening 213 of the cavity 211 to inject gas, according to the disposition position of the gas injection portion 220 with respect to the cavity 211 of the housing 210.

[0082] Here, the gas injection portion being configured to be changeable to a plurality of arrangement positions with respect to the cavity of the housing means that the gas injection portion can be located at a plurality of arrangement positions with respect to the cavity of the housing, and at each arrangement position, the gas injection hole portion of the gas injection portion is arranged to face the opening of the cavity so as to be able to inject gas, and can also be configured to change the position within the cavity of the housing when the gas injection portion changes the position, or can also be configured to change the position outside the cavity of the housing and then be installed into the cavity after changing the position. The present application does not have a special limitation in this regard.

[0083] For example, as shown in the drawings, in the present application, the structure in which the gas injection portion 220 is detachably installed in the cavity 211 of the housing 210 is specifically described.

[0084] In this case, the coupling structure between the gas injection portion 220 and the housing is not specially limited, and various coupling structures such as bolt coupling, fitting coupling, etc. can be applied.

[0085] Further, the gas injection portion 220 can include a plurality of gas injection walls 223. A connection flow path 224 connecting the gas flow inlet 212 and the internal flow path 222 can be arranged in each gas injection wall 223. In this plurality of gas injection walls 223, a plurality of gas injection hole portions 221 different from each other can be arranged. Each gas injection hole portion 221 can include a plurality of gas injection holes 225 arranged at the same hole diameter and at a predetermined interval, respectively. Thus, during the injection of gas, a uniform flow rate and flow volume can be effectively ensured.

[0086] For example, the gas injection hole portion 221 includes four gas injection hole groups formed by a plurality of injection holes arranged at intervals along the extension direction of the gas injection portion.

[0087] Further, the plurality of gas injection hole portions 221 different from each other can be configured such that at least one of the hole shape, the hole diameter, and the interval between the gas injection holes 225 located in the same gas injection wall 223 and adjacent to each other of the plurality of gas injection hole portions 221 are different from each other. Here, the interval between the gas injection holes 225 adjacent to each other means the interval between the centers of the gas injection holes 225 adjacent to each other.

[0088] However, the present application is not limited thereto, and further, in addition to the hole shape, the hole diameter, and the interval between the gas injection holes located in the same gas injection wall and adjacent to each other, the plurality of injection hole portions different from each other can of course be variously configured as needed in terms of the linear shape, the curved shape, the shape of the hole, etc. of the hole in the injection angle or the injection direction of the gas injection hole arranged in the gas injection wall.

[0089] The outer profile cross-sectional shape of the gas injection portion 220 can be formed in a polygonal shape. In this case, each gas injection wall 223 is defined by each side wall of the gas injection portion 220. Correspondingly, the cavity 211 of the housing 210 can be formed in a shape corresponding to the outer profile cross-sectional shape of the gas injection portion 220. In other words, the cavity 211 of the housing 210 can be formed in a shape in which the opening 213 is formed on one face, and corresponding to the outer surfaces of the other gas injection walls 223 except for the gas injection wall corresponding to the opening 213 among the plurality of gas injection walls 223.

[0090] For example, referring to Figure 3 to Figure 6b , the gas injection portion 220 can be formed in a square shape. Specifically, the outer profile cross-sectional shape of the gas injection portion 220 is formed in a square shape, and a connection flow path 224 connecting the gas flow inlet 212 and the internal flow path 222 can be disposed at each of the gas injection walls 223. The cavity 211 of the housing 210 can be formed in a rectangular shape in which the opening 213 is formed on one face, and corresponding to the outer side surfaces of three gas injection walls 223 of the gas injection portion 220. Accordingly, in each disposition position with respect to the cavity 211 of the housing 210, one of the four gas injection walls 223 is disposed to face the opening 213 of the cavity 211, and the other three gas injection walls 223 can be in close contact with the inner wall surface of the cavity 211.

[0091] Specifically, the outer profile cross-sectional shape of the gas injection portion 220 is formed in a square shape, and can include four gas injection walls 223 defined by four respective side walls and connected to each other, the four gas injection walls 223 including a first gas injection wall 223a, a second gas injection wall 223b, a third gas injection wall 223c, and a fourth gas injection wall 223d. Here, for convenience of explanation, as shown in the drawings, the first gas injection wall 223a, the second gas injection wall 223b, the third gas injection wall 223c, and the fourth gas injection wall 223d can be defined as a front side wall, a bottom side wall, a rear side wall, and an upper side wall, respectively, but are not limited thereto.

[0092] The first injection wall 223a can be provided with a first gas injection hole portion 221a and a first connection flow path 224a connecting the gas flow inlet 212 of the housing 210 and the internal flow path 222 of the gas injection portion 220. The first gas injection hole portion 221a can include a plurality of first gas injection holes 225a having a first hole diameter and disposed at a first interval. Figure 6aA view showing the first injection wall 223a of the gas injection portion 220 when viewed from the front when the gas injection portion 220 is positioned in the cavity of the housing so that the first gas injection hole portion 221a of the first injection wall 223a faces the opening 213 of the cavity 211 of the housing 210 in the first arrangement position P1 is shown.

[0093] The second injection wall 223b connected to the first injection wall 223a can be provided with a second gas injection hole portion 221b and a second connection flow path 224b connecting the gas flow inlet 212 of the housing 210 and the internal flow path 222 of the gas injection portion 220. The second gas injection hole portion 221b can include a plurality of second gas injection holes 225b having a second hole diameter and being arranged at a first interval identical to the interval between adjacent first gas injection holes 225a. Here, the second hole diameter of the second gas injection holes 225b can be smaller than the first hole diameter of the first gas injection holes 225a. Figure 6b A view showing the second injection wall 223b of the gas injection portion 220 when viewed from the front when the gas injection portion 220 is positioned in the cavity 211 of the housing 210 so that the second gas injection hole portion 221b of the second injection wall 223b faces the opening 213 of the cavity 211 of the housing 210 in the second arrangement position P2 is shown.

[0094] The third injection wall 223c connected to the second injection wall 223b opposite the first injection wall 223a can be provided with a third gas injection hole portion 221c and a third connection flow path 224c connecting the gas flow inlet 212 of the housing 210 and the internal flow path 222 of the gas injection portion 220. The third gas injection hole portion 221c can include a plurality of third gas injection holes 225c having a first hole diameter identical to the hole diameter of the first gas injection holes 225a and being arranged at a second interval. Here, the second interval between the third gas injection holes 225c can be smaller than the first interval between the first gas injection holes 225a.

[0095] The fourth injection wall 223d connected between the first injection wall 223a and the third injection wall 223c opposite the second injection wall 223b can be provided with a fourth gas injection hole portion 221d and a fourth connection flow path 224d connecting the gas flow inlet 212 of the housing 210 and the internal flow path 222 of the gas injection portion 220. The fourth gas injection hole portion 221d can include a plurality of fourth gas injection holes 225d having a second hole diameter identical to the hole diameter of the second gas injection holes 225b and being arranged at a second interval identical to the interval between adjacent third gas injection holes 225c.

[0096] Here, specifically, reference is made to Figure 7 An operation process of the gas injection unit of the present application is explained. Figure 7is a diagram showing the configuration of a gas injection portion of a gas injection unit in which other gas injection hole portions than a gas injection hole portion of a first injection wall are omitted, which illustrates an embodiment of the present application.

[0097] As shown in Figure 7 when the first injection hole portion 221a of the first injection wall 223a provided in the gas injection portion 220 is to be used, the gas injection portion 220 is installed into and positioned in the cavity 211 of the housing 210 so that the first injection hole portion 221a of the first injection wall 223a provided in the gas injection portion 220 is directed toward the opening 213 of the cavity 211 of the housing 210. In this case, the fourth connection flow path 224d of the fourth injection wall 223d is connected to the gas flow inlet 212 of the housing 210, and the first to third connection flow paths can be sealed by the inner wall surface of the cavity 211. Also, here, the first connection flow path provided in the first injection wall 223a can also be sealed by other members, for example, can be sealed by a cap to be described later. According to this configuration, the gas supplied from the supply line flows to the inner flow path 222 of the gas injection portion 220 through the gas flow inlet 212 of the cavity 211 of the housing 210 and the fourth connection flow path 224d, and thus the gas can be injected through the plurality of first gas injection holes 225a of the first gas injection hole portion 221a.

[0098] Therefore, when the gas injection hole portions 221 of the gas injection portion 220 required for the substrate processing process are to be used, the gas injection portion 220 is detached from the cavity 211 of the housing 210, and then the desired gas injection hole portion is installed into and positioned in the cavity 211 of the housing 210 so as to be directed toward the opening 213 of the cavity 211 of the housing 210, from among the first gas injection hole portion 221a, the second gas injection hole portion 221b, the third gas injection hole portion 221c, and the fourth gas injection hole portion 221d, thereby enabling drying or cleaning of the substrate.

[0099] The configuration of the gas injection hole portions provided in the first to fourth gas injection walls is specifically described above, but this is only one embodiment provided for easy understanding of the present application, and the present application is not limited thereto, and the configuration of the gas injection hole portions can be implemented in various forms.

[0100] On the other hand, the gas injection unit 200 of the present application can further include a cap 230.

[0101] The cover 230 can be coupled to the opening 213 of the cavity 211 of the housing 210. The cover 230 can be coupled to the opening 213 of the cavity 211 of the housing 210 in a detachable or openable and closable manner so as to detach the gas injection part 220 from the cavity 211 of the housing 210. In addition, a discharge port 231 exposing the gas injection hole part 221 of the gas injection part 220 can be formed on the cover 230. When the gas inflow port 212 is disposed at the upper center portion of the housing 210, the discharge port 231 can be formed as two discharge ports 231 formed apart to the left and right with the connection flow path 224 of the gas injection part 220 connected to the gas inflow port 212 as a center, and respectively exposing the plurality of gas injection holes 225 disposed at the left and right sides.

[0102] Further, when the gas injection part 220 is formed with a plurality of connection flow paths 224 connecting the gas inflow port 212 and the inner flow path 222, a sealing protrusion 232 inserted into the connection flow path 224 of the cavity 211 of the housing 210 to perform sealing can be disposed on the cover 230. Accordingly, the gas injection part 220 can be firmly positioned between the housing 210 and the cover 230, and thus a gas injection operation can be stably performed by the gas injection part 220.

[0103] Here, the case in which the cover 230 is coupled to the opening 213 of the cavity 211 of the housing 210 is described, but the present application is not limited thereto, and as other embodiments, the cover can be coupled to the gas injection part.

[0104] Figure 8a and Figure 8b FIGS. 1 and 2 are graphs analyzing a gas flow rate in a process in which a gas is injected to a substrate by a gas injection unit having a slit-shaped gas injection port integrally configured as in the related art and a gas injection unit of the present application, respectively.

[0105] As shown in FIGS. 3 and 4, it can be seen that a gas is injected to a substrate S at the same flow rate in a state in which the gas is sucked by a dust free controller E using a gas injection unit 400 having a slit-shaped gas injection port as in the related art and a gas injection unit 200 having a gas injection hole part of the present application, respectively, as a result, compared to a movement amount transmission effect of a gas injected by the gas injection unit 400 having a slit-shaped gas injection port as in the related art shown in FIG. 3, a movement amount transmission effect of a gas injected by the gas injection unit 200 having a gas injection hole part of the present application shown in FIG. 4 is increased. Figure 8a and Figure 8b As shown in FIGS. 3 and 4, it can be seen that a gas is injected to a substrate S at the same flow rate in a state in which the gas is sucked by a dust free controller E using a gas injection unit 400 having a slit-shaped gas injection port as in the related art and a gas injection unit 200 having a gas injection hole part of the present application, respectively, as a result, compared to a movement amount transmission effect of a gas injected by the gas injection unit 400 having a slit-shaped gas injection port as in the related art shown in FIG. 3, a movement amount transmission effect of a gas injected by the gas injection unit 200 having a gas injection hole part of the present application shown in FIG. 4 is increased. Figure 8a Figure 8b As shown in FIGS. 3 and 4, it can be seen that a gas is injected to a substrate S at the same flow rate in a state in which the gas is sucked by a dust free controller E using a gas injection unit 400 having a slit-shaped gas injection port as in the related art and a gas injection unit 200 having a gas injection hole part of the present application, respectively, as a result, compared to a movement amount transmission effect of a gas injected by the gas injection unit 400 having a slit-shaped gas injection port as in the related art shown in FIG. 3, a movement amount transmission effect of a gas injected by the gas injection unit 200 having a gas injection hole part of the present application shown in FIG. 4 is increased.

[0106] In addition,​Figure 9a and Figure 9b Figures showing the analysis of gas pressure during the process of gas injection to the substrate by the gas injection unit having the existing slit-shaped gas injection port and the gas injection unit of the present application, respectively.

[0107] As shown in Figure 8a and Figure 8b , it can be seen that, in the state of gas injection to the substrate S at the same flow rate by the gas injection unit 400 having the existing slit-shaped gas injection port and the gas injection unit 200 having the gas injection hole portion of the present application, respectively, and by the dust-free controller E to suck in the gas, as a result, the gas injection by the gas injection unit 400 having the existing slit-shaped gas injection port shown in Figure 9a has a reduced gas motion transfer effect, thus being more affected by the surrounding air flow, so that the cleaning area is reduced when cleaning the substrate S, on the contrary, the gas injection by the gas injection unit 200 having the gas injection hole portion of the present application shown in Figure 9b has an increased gas motion transfer effect, thus being hardly affected by the surrounding air flow, so that the cleaning area is significantly increased.

[0108] As described above, the configuration of the gas injection unit of the present application, by the structure of the gas injection hole portion, can increase the gas motion transfer effect compared with the existing slit-shaped gas injection structure, and when used in the cleaning process, can increase the cleaning area, and further, is advantageous to reduce the overall flow deviation of the gas injection portion, further, since there are various types of gas injection hole portions, there is no need for a separate adjusting device for adjusting the gap interval suitable for the previously used slit-shaped injection structure, can be made into a simple structure, and the desired gas injection hole portion can be selected as needed, so that the adjustment of the flow and flow rate of the gas can be achieved.

[0109] The outer profile cross-sectional shape of the gas injection portion can be a polygonal shape such as a square shape, a triangular shape, a pentagonal shape, a hexagonal shape, etc., but is not limited thereto, and the gas injection portion can be formed in various shapes other than the polygonal shape, for example, the outer profile cross-sectional shape of the gas injection portion can be formed in a circular shape. In this case, the gas injection hole portions can be formed at regular intervals in the circumferential direction along the outer profile peripheral surface of the circular shape. According to this configuration, when a desired gas injection hole portion is to be selected, the gas injection portion can be changed in position and positioned by rotation within the cavity of the housing to face the opening of the cavity of the housing without disassembly. In addition, for example, the outer profile cross-sectional shape of the gas injection portion can be a shape symmetrical about the center, such as a curved shape, a spline shape, etc. In this case, in order to achieve easy disassembly of the gas injection portion with respect to the cavity of the housing, a disassembly port can be formed at one end of the cavity of the housing. Thus, when the arrangement position of the gas injection portion is to be changed, the gas injection portion can be disassembled from one end of the cavity of the housing, and then a desired gas injection hole portion can be selected and mounted within the cavity of the housing so that the gas injection hole portion faces the opening.

[0110] The above specifically describes a structure in which the gas inlet of the housing is arranged at the upper center portion of the housing, but the present application is not limited thereto, and can be arranged at an appropriate position of the housing as long as it is a structure that can cause the gas to flow into the internal flow path of the gas injection portion and minimize the flow rate deviation.

[0111] Here, the flow rate deviation of the gas can be minimized not only by changing the arrangement position of the gas inlet of the housing, but also by setting the sizes of the hole diameters of the plurality of gas injection holes provided in the gas injection hole portion of the gas injection portion to have a slight difference, or by finely adjusting the manner of spacing between adjacent gas injection holes formed in the same gas injection hole portion.

[0112] For example, another example in which the gas inlet of the housing is arranged at both end portions of the cavity of the housing will be described below.

[0113] Figure 10 is a front view of a gas injection unit according to another embodiment of the present application.

[0114] In the present embodiment, the configuration applied to the above embodiments can be equally applied to the present embodiment except for the parts in which the arrangement position of the gas inlet and the connection flow path differ from those of the above embodiments, and repeated description will be omitted here.

[0115] Referring to Figure 10 , the gas inlets 212a of the housing 210 can be arranged at both end portions of the housing 210, respectively.

[0116] In this case, the connection flow path 224 of the gas flow inlet 212 of the connection housing 210 and the internal flow path 222 of the gas injection portion 220 described in the above embodiment can be omitted. That is, the gas injection portion 220 is configured such that the internal flow path 222 penetrates both end portions of the gas injection portion 220, and can be directly connected to the gas flow inlets 212a provided at both end portions of the housing 210 without an additional connection flow path.

[0117] In the above, the gas injection portion 220 is described as an embodiment configured to be changeable to a plurality of arrangement positions within the cavity 211 of the housing 210, and is described as an example of a gas injection portion 220 having a polygonal outer profile cross-sectional shape arranged to be detachable. However, the present application is not limited to this, and can be configured in various forms as long as the gas injection portion 220 is configured to be changeable to a plurality of arrangement positions within the cavity 211 of the housing 210. For example, the outer profile cross-sectional shape of the gas injection portion can be formed in a circular shape, and the cavity of the housing accommodating the gas injection portion can have a cross-sectional shape in a circular shape corresponding to the outer profile cross-sectional shape of the gas injection portion. In this case, the gas injection portion is arranged to be rotatable within the cavity by a driving means such as a motor, and the arrangement position with respect to the cavity can be changed by the operation of rotation without being detached from the cavity of the housing, and thus the gas injection hole portion of the gas injection portion desired can be selected and positioned so as to face the opening of the housing.

[0118] Further, in the present application, the configuration in which one gas injection hole portion is arranged at each gas injection wall (side wall) of the gas injection portion 220 is specifically described, but the present application is not limited to this, and a plurality of rows of gas injection hole portions can be arranged at each gas injection wall (side wall) of the gas injection portion 220 as needed. In this case, the plurality of rows of gas injection hole portions arranged at each gas injection wall (side wall) can be formed in various forms, and further, the injection angles of the rows of gas injection hole portions can be set to be different as needed. Further, in the above description, the configuration of a conveyance unit including a rotation shaft and a roller arranged on the rotation shaft in the substrate processing apparatus is described as an example, but the conveyance unit of the present application is not limited to this configuration, and can be implemented in various forms as long as it has a function of conveying a substrate.

[0119] As described above, the present application is described through the defined embodiments and drawings, but the present application is not limited to this, and various modifications and changes can be made by those skilled in the art within the technical idea of the present application and the equivalent scope of the claims described below.

Claims

1. A gas injection unit, wherein: include: a housing including a gas inlet and a cavity connected to the gas inlet and having an opening formed on one surface; as well as a gas injection portion disposed in the cavity, configured to be changeable to a plurality of arrangement positions relative to the cavity, and comprising an internal flow path and a plurality of gas injection holes that are different from one another, the internal flow path being connected to the gas inlet, the plurality of gas injection holes being connected to the internal flow path and being arranged to eject gas toward the opening according to the arrangement positions; The gas injection portion includes a plurality of gas injection walls, and a plurality of gas injection hole portions different from each other are arranged on the plurality of gas injection walls.

2. The gas injection unit according to claim 1, wherein The gas injection portion is detachably mounted on the cavity.

3. The gas injection unit according to claim 2, wherein: The outer cross-sectional shape of the gas injection portion is formed into a polygonal shape, and each of the gas injection walls is defined by each side wall of the gas injection portion. The cavity is formed in a shape corresponding to an outer cross-sectional shape of the gas injection portion.

4. The gas injection unit according to claim 3, wherein: A connecting flow path connecting the gas inlet and the internal flow path is provided on each of the gas ejection walls.

5. The gas injection unit according to claim 3, wherein: The outer cross-sectional shape of the gas injection portion is formed into a square shape, and a connecting flow path connecting the gas inlet and the internal flow path is arranged on each of the gas injection walls. The cavity is formed in a rectangular shape with the opening formed on one surface thereof and corresponding to the outer side surfaces of at least three gas injection walls of the gas injection portion. In the configuration position, one of the gas injection walls is configured to face the opening, and the other three gas injection walls are closely attached to the inner wall surface of the cavity. The gas injection unit according to claim 1 , wherein: The gas inlet is arranged at the upper center portion of the housing.

7. The gas injection unit according to claim 1, wherein: The gas inlet ports are respectively arranged at both ends of the housing.

8. The gas injection unit according to claim 1, wherein include: A cover is coupled to the opening and is formed with a discharge port exposing the gas injection hole portion.

9. The gas injection unit according to claim 8, wherein The gas injection portion is formed with a plurality of connecting flow paths connecting the gas inlet and the internal flow path. The cover is provided with a sealing protrusion which is inserted into a connecting flow path facing the opening among the plurality of connecting flow paths to perform sealing.

10. The gas injection unit according to any one of claims 1 to 9, wherein: Each of the gas injection hole portions includes a plurality of gas injection holes that are arranged with the same hole diameter and at predetermined intervals.

11. The gas injection unit according to claim 10, wherein: The plurality of gas injection holes are configured such that at least one of a hole shape, a hole diameter, and an interval between adjacent gas injection holes located on the same gas injection wall is different from each other.

12. A gas injection unit, wherein: include: a housing including a gas inlet and a cavity connected to the gas inlet and having an opening formed on one surface; The gas injection portion is disposed in the cavity and is detachably disposed in a plurality of configuration positions relative to the cavity, and has an outer cross-sectional shape formed in a rectangular shape; as well as a cover covering the opening and having a discharge port exposing the gas injection hole portion of the gas injection portion, The gas injection portion includes: an internal flow path connected to the gas inlet; four gas injection walls defined by each side wall of the gas injection portion; and a plurality of gas injection hole portions different from each other, each including a plurality of gas injection holes connected to the internal flow path and arranged at predetermined intervals in each of the gas injection walls, so as to be arranged toward the opening according to the arrangement position to inject gas.

13. The gas injection unit according to claim 12, wherein: A connecting flow path connecting the gas inlet and the internal flow path is arranged on each of the gas injection walls. The cavity is formed in a rectangular shape with the opening formed on one surface thereof and corresponding to the outer side surfaces of at least three gas injection walls of the gas injection portion. In the configuration position, one of the gas injection walls is configured to face the opening, and the other three gas injection walls are closely attached to the inner wall surface of the cavity.

14. The gas injection unit according to claim 13, wherein The cover is provided with a sealing protrusion which is inserted into a connecting flow path facing the opening among the plurality of connecting flow paths to perform sealing.

15. The gas injection unit according to claim 12, wherein The gas inlet is formed in an upper center portion of the housing.

16. The gas injection unit according to claim 12, wherein The plurality of gas injection holes arranged on the plurality of gas injection walls are configured such that at least one of a hole shape, a hole diameter, and a spacing between adjacent gas injection holes located on the same gas injection wall differs from each other.

17. A substrate processing apparatus, wherein: include: A process chamber, wherein a conveying unit for conveying a substrate is configured; as well as A gas injection unit is disposed in the process chamber and injects gas toward the substrate. The gas injection unit comprises: a housing including a gas inlet and a cavity connected to the gas inlet and having an opening formed on one surface; as well as a gas injection portion disposed in the cavity, configured to be changeable to a plurality of arrangement positions relative to the cavity, and comprising an internal flow path and a plurality of gas injection holes that are different from one another, the internal flow path being connected to the gas inlet, the plurality of gas injection holes being connected to the internal flow path and being arranged to eject gas toward the opening according to the arrangement positions; The gas injection portion includes a plurality of gas injection walls, and a plurality of gas injection hole portions different from each other are arranged on the plurality of gas injection walls.

18. The substrate processing apparatus according to claim 17, wherein: The gas injection hole portion arranged on each of the gas injection walls includes a plurality of gas injection holes arranged with the same hole diameter and at predetermined intervals. The plurality of gas injection holes are configured such that at least one of a hole shape, a hole diameter, and an interval between adjacent gas injection holes located on the same gas injection wall is different from each other.

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