Bonding jig and manufacturing method of array waveguide

Abstract

The application relates to a fitting jig and a manufacturing method of an array waveguide. The fitting jig is used for fitting a plurality of waveguide preforms. The waveguide preforms have two fitting surfaces arranged oppositely along a first direction. The fitting jig comprises a bearing part, an abutting part, a limiting part and an operating part. The bearing part has a bearing surface for bearing the plurality of waveguide preforms, and the plurality of waveguide preforms are arranged in sequence along the first direction. The abutting part is arranged on the bearing side of the bearing part. The abutting part has an abutting surface arranged along the first direction. The limiting part is arranged on the bearing part. The limiting part has two limiting surfaces arranged oppositely along a second direction. The two limiting surfaces, the abutting surface and the bearing surface jointly define a fixing space for fixing the plurality of waveguide preforms. The operating part is configured to move along the first direction towards or away from the abutting surface in response to an external force, so that each adjacent fitting surface of the plurality of waveguide preforms is fitted to each other. The application helps to improve the cutting precision and manufacture high-quality array waveguides.

Description

Technical Field

[0001] This application relates to the field of optical waveguide technology, and in particular to a bonding fixture and a method for fabricating an arrayed waveguide. Background Technology

[0002] Currently, optical waveguides can be broadly classified into three categories: geometric waveguides, diffraction waveguides, and volume holographic waveguides. Geometric waveguides, also known as arrayed waveguides, are represented by optical elements such as semi-transmissive mirror arrays. Semi-transmissive mirror arrays follow the law of reflection, where the angle of incidence equals the angle of reflection, thus exhibiting no chromatic dispersion of the incident light of the three primary colors required for full-color displays. Therefore, compared to diffraction waveguides and volume holographic waveguides, images achieved using arrayed waveguides have higher quality and are free from chromatic dispersion issues. Arrayed waveguides show promising application prospects in certain specialized optical fields.

[0003] The manufacturing process of arrayed waveguides typically involves five steps: coating, bonding, cutting, polishing, and grinding. The manufacturing process is quite complex, and in actual manufacturing, the geometric parameters and optical performance of arrayed waveguides cannot meet the standard requirements of some special optical fields. Summary of the Invention

[0004] Based on this, a method for fabricating a bonding fixture and an array waveguide is provided, which improves the fabrication process of the array waveguide, helps to improve the fabrication accuracy of the array waveguide, and achieves high-quality array waveguides.

[0005] According to a first aspect of this application, a bonding fixture is provided for bonding multiple waveguide preforms, wherein the waveguide preforms have two bonding surfaces disposed opposite to each other along a first direction, and the bonding fixture includes:

[0006] The carrier has a bearing surface for bearing multiple waveguide preforms, which are arranged sequentially along a first direction.

[0007] The abutment is located on the bearing side of the bearing member; the abutment has an abutment surface disposed along a first direction;

[0008] A limiting member is provided on the bearing member; the limiting member has two limiting surfaces arranged opposite each other along a second direction, and the two limiting surfaces, the abutment surface, and the bearing surface together define a fixing space for fixing multiple waveguide prefabricated components; and

[0009] The operating element is configured to move toward or away from the abutment surface in a first direction in response to an external force, so as to form a clamping space with the abutment element for clamping multiple waveguide preforms, thereby making the adjacent mating surfaces of the multiple waveguide preforms fit together.

[0010] The first direction and the second direction are perpendicular to each other.

[0011] In one embodiment, the waveguide preform has a first end and a second end disposed opposite to each other along a second direction;

[0012] The fitting fixture also includes multiple barrier components;

[0013] Each barrier element is disposed between the first ends of two adjacent waveguide preforms along the first direction; and / or

[0014] Each barrier is located between the second ends of two adjacent waveguide preforms along the first direction.

[0015] In one embodiment, the barrier has a barrier surface;

[0016] The barrier surface is constructed to be parallel to the bonding surface.

[0017] In one embodiment, both the barrier surface and the bonding surface are configured to be set at a first preset angle to the first direction.

[0018] In one embodiment, the barrier is configured to abut against the corresponding end of a waveguide preform adjacent to the barrier when multiple waveguide preforms are attached to each other.

[0019] In one embodiment, the limiting member includes a first sub-limiting member and a second sub-limiting member, both disposed on the bearing member, the first sub-limiting member and the second sub-limiting member being disposed opposite to each other along a second direction;

[0020] The surfaces of the first and second sub-limiting members that are opposite to each other are the limiting surfaces.

[0021] In one embodiment, the first sub-limiting member includes a plurality of first limiting structures disposed on the bearing member and independent of each other, the plurality of first limiting structures being arranged along a first direction;

[0022] The second sub-limiting member includes a plurality of second limiting structures disposed on the bearing member and independent of each other, the plurality of second limiting structures being arranged along the first direction;

[0023] Each first limiting structure corresponds to a second limiting structure.

[0024] In one embodiment, both the first limiting structure and the second limiting structure are slidably connected to the carrier along a first direction.

[0025] In one embodiment, each of the first limiting structures and each of the second limiting structures is provided with a blocking member.

[0026] In one embodiment, the first limiting structure and the barrier connected to the first limiting structure are an integral structure; and / or

[0027] The second limiting structure and the barrier connected to the second limiting structure are an integral structure.

[0028] In one embodiment, the fitting fixture further includes a support member; the support member is connected to the carrier member and is used to set the carrier surface at a second preset angle with the horizontal direction;

[0029] The first preset angle is equal to the second preset angle.

[0030] In one embodiment, the fitting fixture further includes a cover for covering the carrier;

[0031] The cover has a cover surface. In the covered state, the cover surface and the bearing surface define a limiting space. The limiting space is used to limit the position of multiple waveguide preforms.

[0032] In one embodiment, the fitting fixture further includes an illumination element disposed on the cover, the illumination element being used to illuminate multiple waveguide preforms within the limiting space.

[0033] According to a second aspect of this application, a method for fabricating an arrayed waveguide is provided. The method utilizes a bonding fixture as described in any of the preceding embodiments. The method includes:

[0034] Multiple waveguide preforms are stacked sequentially on a bearing surface along a first direction by means of a limiting member, so that at least a portion of the multiple waveguide preforms are accommodated in a fixed space;

[0035] The manipulator is moved along the first direction to form a clamping space, thereby bringing the adjacent mating surfaces of the multiple waveguide preforms together to form an assembly.

[0036] In one embodiment, the bonding fixture further includes a plurality of barrier elements; the waveguide preform has a first end and a second end disposed opposite to each other along a second direction;

[0037] Multiple waveguide preforms are stacked sequentially on a bearing surface along a first direction using limiting members, including:

[0038] After each waveguide preform is placed on the bearing surface, at least one barrier is placed at the first and / or second ends of the corresponding waveguide preform, such that the barrier is located between two adjacent waveguide preforms.

[0039] In one embodiment, the limiting member includes a plurality of first limiting structures and a plurality of second limiting structures that are slidably connected to the bearing member along a first direction. Each first limiting structure can correspond to a second limiting structure along a second direction. Each first limiting structure and each second limiting structure are respectively provided with a blocking member.

[0040] After each waveguide preform is placed on the bearing surface, at least one barrier is placed at the first and / or second ends of the corresponding waveguide preform, including:

[0041] After the current waveguide preform is placed on the bearing surface, a first limiting structure and a corresponding second limiting structure are moved along a first direction to form at least a partial fixing space for fixing the current waveguide preform, and the barrier on the current first limiting structure is located at the first end of the current waveguide preform, and the barrier on the current second limiting structure is located at the second end of the current waveguide preform.

[0042] In one embodiment, after obtaining the assembly, it includes:

[0043] The assembly is cut along a preset path on a preset surface to obtain an array waveguide;

[0044] The first direction and the second direction are both parallel to the preset surface.

[0045] In one embodiment, the method for fabricating the arrayed waveguide further includes, before stacking multiple waveguide preforms sequentially along a first direction on the bearing surface:

[0046] Provide waveguide substrates;

[0047] A coating is applied to the target surface of the waveguide substrate to obtain a waveguide preform; the target surface is one of the two bonding surfaces of the waveguide substrate.

[0048] In one embodiment, the method for fabricating the arrayed waveguide further includes, before stacking multiple waveguide preforms sequentially along a first direction on the bearing surface:

[0049] Adhesive is applied to at least one mating surface of the waveguide preform.

[0050] In one embodiment, the waveguide substrate includes a first substrate and a second substrate, wherein the dimension of the first substrate along a first direction is greater than the dimension of the second substrate along the first direction.

[0051] In one embodiment, the first substrate has a dimension of 2 to 3 centimeters along the first direction, and the second substrate has a dimension of 0.8 to 2 centimeters along the first direction.

[0052] In one embodiment, there are two first substrates and multiple second substrates; the two first substrates are located on opposite sides of the assembly along a first direction, and the multiple second substrates are located between the two oppositely disposed first substrates.

[0053] In the aforementioned bonding fixture and waveguide array fabrication method, waveguide sheets are first fabricated as waveguide preforms, eliminating the need for grinding and polishing operations in the later stages of traditional manufacturing processes. Then, a bonding fixture is used to bond multiple waveguide preforms together, with each preform having two opposing bonding surfaces along a first direction. The bonding fixture includes at least a carrier, an abutment, a limiting member, and an operating member. The two limiting surfaces provided by the limiting member, the abutment surface provided by the abutment, and the carrier surface provided by the carrier collectively define a fixing space for securing multiple waveguide preforms. The operating member is moved along the first direction, creating a clamping space between it and the abutment. This clamping action causes adjacent bonding surfaces of the multiple waveguide preforms to bond together. By stacking and bonding the waveguide preforms together along the first direction, the cutting thickness is reduced, cutting accuracy is improved, and high-quality waveguide arrays are achieved. Attached Figure Description

[0054] Figure 1(a) is a side view of a waveguide substrate bonding process in one embodiment of the related technology.

[0055] Figure 1(b) is a side view of the waveguide substrate in Figure 1(a) after bonding, and Figure 1(c) is a side view of the array waveguide obtained after cutting in Figure 1(b).

[0056] Figure 1(d) is a top view of the arrayed waveguide in Figure 1(c).

[0057] Figure 2 This is a schematic diagram of the waveguide preform structure in one embodiment of this application.

[0058] Figure 3 This is a schematic diagram of the fitting fixture in one embodiment of this application.

[0059] Figure 4 To leverage Figure 3 A schematic diagram of the process of bonding waveguide preforms with bonding fixtures.

[0060] Figure 5 To leverage Figure 3 A schematic diagram of another process for bonding waveguide preforms using bonding fixtures.

[0061] Figure 6 To leverage Figure 4 A schematic diagram of another process in which the bonding fixture is used to bond the waveguide preform.

[0062] Figure 7 for Figure 5 A magnified schematic diagram of a local area M.

[0063] Figure 8 for Figure 6 A side view of the bonding fixture bonding the waveguide preform.

[0064] Figure 9 This is a schematic diagram illustrating the process of bonding a waveguide preform using a bonding fixture in another embodiment of this application.

[0065] Figure 10 for Figure 9 A side view of the bonding fixture bonding the waveguide preform.

[0066] Figure 11 This is a schematic diagram of the structure of an assembly according to an embodiment of this application.

[0067] Figure 12 for Figure 11 A schematic diagram of the array waveguide obtained after cutting the components in the diagram.

[0068] Figure 13 This is a schematic flowchart illustrating the fabrication method of an array waveguide in one embodiment of this application.

[0069] Figure 14 for Figure 13 A schematic flowchart of an embodiment of the fabrication method of the array waveguide.

[0070] Figure 15 for Figure 14 A schematic flowchart of an embodiment of the fabrication method of the array waveguide.

[0071] Figure 16 This is a flowchart illustrating a method for fabricating an array waveguide according to another embodiment of this application.

[0072] Figure 17 This is a flowchart illustrating a method for fabricating an array waveguide in another embodiment of this application.

[0073] Explanation of reference numerals in the attached figures:

[0074] Waveguide substrate 10, cut surface 10a;

[0075] Arrayed waveguide 20;

[0076] First dimension L1, second dimension L2;

[0077] First tilt angle θ1, second tilt angle θ2, third tilt angle θ3, fourth tilt angle θ4, fifth tilt angle θ5, sixth tilt angle θ6;

[0078] First test position A1, second test position A2;

[0079] Fitting jig 100;

[0080] Bearing component 110, bearing surface 110a;

[0081] Abutting part 120, abutting surface 120a;

[0082] Limiting component 130, limiting surface 130a, first sub-limiting component 131, first limiting structure 131a, second sub-limiting component 132, second limiting structure 132a;

[0083] Operating component 140;

[0084] Barrier element 150, barrier surface 150a;

[0085] Support component 160;

[0086] Cover part 170, cover surface 170a;

[0087] Fixed space Q1, clamping space Q2, limiting space Q3;

[0088] Waveguide preform 200, bonding surface 200a, first end 200b, second end 200c;

[0089] Assembly 300, preset surface S1;

[0090] Arrayed waveguide 400;

[0091] First direction F1, second direction F2, third direction F3;

[0092] First preset angle w1, second preset angle w2. Detailed Implementation

[0093] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0094] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0095] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0096] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0097] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0098] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0099] In related technologies, the manufacturing process of arrayed waveguides, as shown in Figure 1(a), involves first stacking multiple monolithic waveguide substrates 10 together vertically. Each waveguide substrate 10 has two bonding surfaces along the vertical direction, one of which has undergone a coating process. Next, as shown in Figure 1(b), the bonded waveguide substrates 10 are obliquely cut from their top to obtain the arrayed waveguide 20, as shown in Figures 1(c) and 1(d). Because the multiple waveguide substrates 10 are stacked vertically, the overall thickness is relatively large. During the cutting process, the waveguide substrates 10 are prone to slight displacement, affecting the cutting accuracy of the machine and the geometric parameters of the arrayed waveguide 20. After cutting, the cut surfaces 10a (i.e., the light-incident and light-exit surfaces) of the arrayed waveguide 20 need to be ground and polished, resulting in uneven flatness of the light-incident and light-exit surfaces.

[0100] As shown in Tables 1 and 2, Table 1 contains the geometric dimensions of the array waveguide 20 in Figure 1(c), and Table 2 contains the optical characteristics of the array waveguide 20 in Figure 1(c). As can be seen from Tables 1 and 2, the geometric dimensions and optical characteristics of the array waveguide 20 mostly fail to meet the required specifications, especially in the fields of Augmented Reality (AR) and Mixed Reality (MR). The array waveguide 20 is a primary technical means for AR / MR devices to achieve enhanced visualization effects; therefore, the specifications for the geometric dimensions and optical characteristics of the array waveguide 20 are highly demanding.

[0101] Table 1

[0102] Category Measurement data Specification First dimension L1 (mm) 85.50 85.0±0.1 Second dimension L2 (mm) 1.39 1.5±0.1 First tilt angle θ1 (degrees) 22.8 22±0.5 Second tilt angle θ2 (degrees) 21.9 22±0.5 The third tilt angle θ3 (degrees) 22.2 22±0.5 The fourth tilt angle θ4 (degrees) 21.5 22±0.5 The fifth tilt angle θ5 (degrees) 21.1 22±0.5 The sixth tilt angle θ6 (degrees) 21.4 22±0.5

[0103] Table 2

[0104]

[0105] Based on this, the embodiments of this application provide a method for fabricating a bonding fixture and an array waveguide, which improves the fabrication process of the array waveguide, helps to improve the fabrication accuracy of the array waveguide, and achieves a high-quality array waveguide.

[0106] See Figures 2 to 6 . Figure 2 A schematic diagram of the waveguide preform in one embodiment of this application is shown. Figure 3 A schematic diagram of the fitting fixture in one embodiment of this application is shown. Figure 4 It shows the use of Figure 3 A schematic diagram of the process of bonding waveguide preforms with bonding fixtures. Figure 5 It shows the use of Figure 3 A schematic diagram of another process for bonding waveguide preforms using bonding fixtures. Figure 6 It shows the use of Figure 3 This is another schematic diagram of the bonding process of the bonding fixture for bonding the waveguide preform. In the figure, the first direction F1 and the second direction F2 are perpendicular to each other, and the first direction F1 is set at a first preset angle w1 with the third direction F3.

[0107] An embodiment of this application provides a bonding fixture 100 for bonding multiple waveguide preforms 200. Each waveguide preform 200 has two opposing bonding surfaces 200a along a first direction F1. The bonding fixture 100 includes a carrier 110, an abutment 120, a limiting member 130, and an operating member 140. The carrier 110 has a carrier surface 110a for supporting multiple waveguide preforms 200, which are arranged sequentially along the first direction F1. The abutment 120 is located on the carrier side of the carrier 110. The abutment 120 has an abutment surface 120a along the first direction F1. The limiting member 130 is located on the carrier 110. The limiting member 130 has two limiting surfaces 130a disposed opposite each other along the second direction F2. The two limiting surfaces 130a, the abutment surface 120a, and the bearing surface 110a together define a fixing space Q1 for fixing a plurality of waveguide preforms 200. The operating member 140 is configured to move toward or away from the abutment surface 120a along the first direction F1 in response to an external force, so as to form a clamping space Q2 with the abutment member 120 for clamping the plurality of waveguide preforms 200, thereby causing adjacent mating surfaces 200a of the plurality of waveguide preforms 200 to abut each other.

[0108] The waveguide preform 200 refers to a waveguide sheet made using a waveguide substrate. Specifically, in some embodiments, the waveguide substrate can be made of materials such as transparent glass or plastic. Glass waveguide substrates can be manufactured using a casting process, while plastic waveguide substrates can be manufactured using a hot-pressing or injection molding process. The waveguide preform 200 has two mating surfaces 200a, meaning the waveguide substrate has two mating surfaces 200a. One of these mating surfaces 200a is coated to achieve a semi-transparent, semi-reflective effect. The specific surface to be coated can be selected according to actual conditions; this embodiment does not impose specific limitations on this.

[0109] Furthermore, before or after the waveguide preform 200 is placed on the bearing surface 110a, an adhesive needs to be applied to the bonding surface 200a of the waveguide preform 200. The refractive index of this adhesive must be the same as that of the waveguide substrate. This adhesive can be a solid optically clear adhesive (OCA) or a liquid optically clear adhesive (LOCA), and the choice can be made according to actual needs. This embodiment does not impose specific limitations on this. It should be noted that, as... Figure 2 As shown, the dimensions of each waveguide preform 200 along the first direction F1 can be the same or different, and can be set according to actual needs. This embodiment does not impose specific restrictions on this. The transmission-reflection ratio of each waveguide preform 200 is the same. The mating surface 200a of each waveguide preform 200 is set at a first preset angle w1 with the first direction F1. The size of the first preset angle w1 is related to the product shell and overall design of the product to which the array waveguide 400 is applied. The first preset angle w1 can usually be set between 20 degrees and 30 degrees. Its angle cannot be too large, otherwise total internal reflection cannot be generated.

[0110] The support member 110 refers to a platform or stage that provides a supporting function. The support member 110 has a supporting surface 110a, which facilitates the bonding operation of the waveguide preform 200. The waveguide preform 200 can be placed flat on the supporting surface 110a. The size and shape of the support member 110 can be configured according to actual needs; this embodiment does not impose specific limitations on this.

[0111] The abutment member 120 refers to a component that abuts against the waveguide preform 200. The abutment member 120 is located at one end of the support member 110 along the first direction F1, i.e., the support side. The abutment member 120 can be an integral structure with the support member 110, or it can be an integral structure with the limiting member 130, as long as the abutment member 120 has an abutment surface 120a along the first direction F1. This abutment surface 120a is parallel to the mating surface 200a of the waveguide preform 200 placed on the support surface 110a. Thus, the closest mating surface 200a of the first placed waveguide preform 200 can abut against this abutment surface 120a, facilitating subsequent bonding operations.

[0112] The limiting member 130 refers to a component that limits the movement of multiple waveguide preforms 200. The two limiting surfaces 130a of the limiting member 130 are parallel to the first direction F1 and perpendicular to the second direction F2, respectively. The dimensions of the two limiting surfaces 130a along the second direction F2 are the same as the dimensions of the waveguide preforms 200 along the second direction F2, so that the two limiting surfaces 130a, the abutment surface 120a, and the bearing surface 110a together define a fixed space Q1. This fixed space Q1 can accommodate at least a portion of the multiple waveguide preforms 200, limiting the front ends of the multiple waveguide preforms 200 along the first direction F1 through the abutment surface 120a, and limiting the two ends of the multiple waveguide preforms 200 along the second direction F2 through the two limiting surfaces 130a. It should be noted that the limiting member 130 may be fixed to the bearing surface 110a of the bearing member 110, or the limiting member 130 may be movably connected to the bearing member 110. It can be set according to actual needs, and this embodiment does not impose specific restrictions on it.

[0113] The operating component 140 is a member that presses together multiple waveguide preforms 200. The operating component 140 has a contact surface (not shown) that can abut against the surfaces of the multiple waveguide preforms 200. Under the action of an external force, the operating component 140 can move towards the abutment surface 120a, forming a clamping space Q2 between the contact surface and the abutment surface 120a. This clamping space Q2 clamps the multiple waveguide preforms 200, thus, under the action of the external force and the clamping space Q2, adjacent mating surfaces 200a of the multiple waveguide preforms 200 are bonded together by adhesive.

[0114] Specifically, multiple waveguide preforms 200 are placed one by one on the bearing surface 110a along the first direction F1, and at least a portion of the multiple waveguide preforms 200 are accommodated between two limiting surfaces 130a. Then, the contact surface of the operating member 140 is attached to a mating surface 200a of the waveguide preform 200 located at the end of the multiple waveguide preforms 200. Under external force, the multiple waveguide preforms 200 are moved toward the abutment surface 120a by means of the operating member 140, so that the adjacent mating surfaces 200a of the multiple waveguide preforms 200 are mated together.

[0115] In this embodiment, by first fabricating a waveguide sheet as a waveguide preform 200, the grinding and polishing operation in the later stage of the traditional manufacturing process can be eliminated. Then, the bonding fixture 100 is used to bond multiple waveguide preforms 200, and the waveguide preform 200 has two bonding surfaces 200a arranged opposite to each other along the first direction F1. The bonding fixture 100 includes at least a carrier 110, an abutment 120, a limiting member 130, and an operating member 140. The two limiting surfaces 130a provided by the limiting member 130, the abutment surface 120a provided by the abutment 120, and the carrier surface 110a provided by the carrier 110 collectively define a fixing space Q1 for fixing multiple waveguide preforms 200. By acting on the operating member 140 to move it along a first direction F1, a clamping space Q2 is formed between the operating member 140 and the abutment 120. The clamping action of the clamping space Q2 causes two adjacent bonding surfaces 200a of each of the multiple waveguide preforms 200 to bond together. In this way, the waveguide preforms 200 are stacked and bonded together along the first direction F1, reducing the cutting thickness, improving cutting accuracy, and contributing to the realization of a high-quality array waveguide 400.

[0116] Continue reading Figure 2 and Figure 5 and combined Figure 7 In some embodiments, the waveguide preform 200 has a first end 200b and a second end 200c disposed opposite each other along a second direction F2. The bonding fixture 100 also includes a plurality of barrier members 150. Each barrier member 150 is disposed between the first ends 200b of two adjacent waveguide preforms 200 along the first direction F1. And / or, each barrier member 150 is disposed between the second ends 200c of two adjacent waveguide preforms 200 along the first direction F1.

[0117] It should be noted that the barrier 150 refers to a component used to space between two adjacent waveguide preforms 200. To control the thickness of the adhesive after the adjacent bonding surfaces 200a of the multiple waveguide preforms 200 are bonded together, a barrier 150 can be spaced between each adjacent first end 200b of the multiple waveguide preforms 200, or between each adjacent second end 200c of the multiple waveguide preforms 200, or simultaneously between each adjacent first end 200b of the multiple waveguide preforms 200 and between each adjacent second end 200c of the multiple waveguide preforms 200. Furthermore, no adhesive is provided between adjacent first ends 200b and adjacent second ends 200c of the multiple waveguide preforms 200. That is, a surface is reserved on the bonding surface 200a of the multiple waveguide preforms 200 near the first ends 200b and the second ends 200c. This reserved surface does not need to be covered with adhesive. This reserved surface facilitates the placement of a barrier 150 between two adjacent waveguide preforms 200. The thickness of the adhesive between two adjacent waveguide preforms 200 is controlled by the barrier 150.

[0118] For example, the multiple barrier members 150 can be individual components that are independent of each other. After each waveguide preform 200 is placed on the bearing surface 110a, a barrier member 150 is placed on a predetermined surface of the mating surface 200a on the side of the waveguide preform 200 away from the abutment surface 120a. In this way, a barrier member 150 is spaced between each two adjacent waveguide preforms 200. The thickness of the adhesive between each two adjacent waveguide preforms 200 is controlled by the barrier member 150, and the damage to the waveguide preforms 200 during the pressing process can be reduced.

[0119] In some embodiments, the barrier 150 is configured to abut against the corresponding end of the waveguide preform 200 adjacent to it when multiple waveguide preforms 200 are bonded together. Specifically, under the action of an external force and the clamping space Q2, each adjacent first end 200b of the multiple waveguide preforms 200 abuts against a barrier 150, and / or each adjacent second end 200c of the multiple waveguide preforms 200 abuts against another barrier 150. This improves the tightness of the bonding between the waveguide preforms 200 and reduces the possibility of damage to the waveguide preforms 200.

[0120] Continue reading Figure 7In some embodiments, the barrier 150 has a barrier surface 150a. The barrier surface 150a is configured to be parallel to the mating surface 200a. Specifically, the barrier 150 can be a plane. When the barrier 150 is placed between two adjacent waveguide preforms 200, the barrier surface 150a is parallel to the mating surface 200a, and the barrier surface 150a is set at a first preset angle w1 with the first direction F1. In this way, the mating effect between the waveguide preforms 200 is improved by the surface-to-surface contact between the barrier surface 150a and the mating surface 200a.

[0121] Continue reading Figure 3 In some embodiments, the limiting member 130 includes a first sub-limiting member 131 and a second sub-limiting member 132, both disposed on the bearing member 110, and the first sub-limiting member 131 and the second sub-limiting member 132 are disposed opposite to each other along the second direction F2. The surfaces of the first sub-limiting member 131 and the second sub-limiting member 132 that are opposite to each other are the limiting surfaces 130a.

[0122] Specifically, the first sub-limiting member 131 refers to an integral member or multiple sub-members used to provide one of the two limiting surfaces 130a. The second sub-limiting member 132 refers to an integral member or multiple sub-members used to provide the other of the two limiting surfaces 130a.

[0123] For example, the first sub-limiting member 131 and the second sub-limiting member 132 can both be constructed as an integral component and disposed on the bearing surface 110a of the bearing member 110. Further, the first sub-limiting member 131, the second sub-limiting member 132, and the bearing member 110 can be an integral structure. The first sub-limiting member 131 and the second sub-limiting member 132 are disposed opposite to each other along the second direction F2. The surfaces of the first sub-limiting member 131 and the second sub-limiting member 132 that are opposite to each other are the limiting surfaces 130a. In this way, the limiting surfaces 130a of the first sub-limiting member 131 and the second sub-limiting member 132 are used to limit the multiple waveguide preforms 200 placed on the bearing surface 110a, that is, to limit the multiple waveguide preforms 200 in the second direction F2, reducing the displacement of the waveguide preforms 200 in the second direction F2, which helps the waveguide preforms 200 to complete the bonding operation and improves the bonding effect.

[0124] Continue reading Figure 3 and Figure 5Furthermore, the first sub-limiting member 131 includes a plurality of independent first limiting structures 131a disposed on the bearing member 110, and the plurality of first limiting structures 131a are arranged along the first direction F1. The second sub-limiting member 132 includes a plurality of independent second limiting structures 132a disposed on the bearing member 110, and the plurality of second limiting structures 132a are arranged along the first direction F1. Each first limiting structure 131a corresponds to one second limiting structure 132a.

[0125] It should be noted that the first limiting structure 131a refers to a sub-component used to provide at least a portion of the surface of one of the two limiting surfaces 130a. The second limiting structure 132a refers to a sub-component used to provide at least a portion of the surface of the other of the two limiting surfaces 130a.

[0126] Furthermore, both the first limiting structure 131a and the second limiting structure 132a are slidably connected to the support member 110 along the first direction F1. It should be noted that two sliding grooves are formed on the support surface 110a along the first direction F1, and both the first limiting structure 131a and the second limiting structure 132a have sliders, so that both the first limiting structure 131a and the second limiting structure 132a are slidably connected to the support surface 110a of the support member 110 along the first direction F1. In addition, the operating member 140 may also be provided with a slider, so that the operating member 140 is slidably connected to the support surface 110a of the support member 110, facilitating the sliding of the operating member 140 along the first direction.

[0127] For example, the dimension of the chute along the first direction F1 can be set to be the same as the dimension of the bearing surface 110a along the first direction F1, that is, the first limiting structure 131a and the second limiting structure 132a can slide off the bearing surface 110a, which facilitates adjusting the number of sets of the first limiting structure 131a and the second limiting structure 132a on the bearing surface 110a according to the number of waveguide preforms 200. Alternatively, the dimension of the chute along the first direction F1 can be set to be smaller than the dimension of the bearing surface 110a along the first direction F1, that is, the first limiting structure 131a and the second limiting structure 132a always remain connected to the bearing 110, which can reduce the possibility of the first limiting structure 131a and the second limiting structure 132a slipping off.

[0128] Specifically, after each waveguide preform 200 is placed on the bearing surface 110a, a set of first limiting structures 131a and second limiting structures 132a are moved so that they are located at the first end 200b and the second end 200c of the waveguide preform 200, thereby limiting the waveguide preform 200 in the second direction F2 and reducing the possibility of displacement of the waveguide preform 200 in the second direction F2.

[0129] In some embodiments, each first limiting structure 131a and each second limiting structure 132a is provided with a blocking member 150. Further, the first limiting structure 131a and the blocking member 150 connected to the first limiting structure 131a are an integral structure. And / or the second limiting structure 132a and the blocking member 150 connected to the second limiting structure 132a are an integral structure.

[0130] Specifically, each first limiting structure 131a is connected to a blocking element 150, and each second limiting structure 132a is connected to a blocking element 150. The blocking surface 150a of the blocking element 150 is parallel to the third direction F3, and the third direction F3 is parallel to the mating surface 200a of the waveguide preform 200. Further, after each waveguide preform 200 is placed on the bearing surface 110a, a set of first limiting structures 131a and second limiting structures 132a are moved, allowing the blocking surface 150a of the blocking element 150 to mat against the mating surface 200a. This allows the limiting and blocking operations of a waveguide preform 200 to be completed in one operation, thereby improving operational convenience and efficiency.

[0131] Considering that the waveguide preforms 200 can be bonded together using liquid optically transparent adhesive, the liquid optically transparent adhesive needs to be applied to the bonding surface 200a of the waveguide preform 200 after the waveguide preform 200 is placed on the bearing surface 110a. If the bonding fixture 100 of this embodiment is placed horizontally, that is, the bearing surface 110a is horizontally set, and the liquid optically transparent adhesive is applied to the bonding surface 200a of the waveguide preform 200 in an inclined state, the liquid optically transparent adhesive is fluid and easily overflows onto the bearing surface 110a, resulting in insufficient amount of liquid optically transparent adhesive remaining on the bonding surface 200a, which affects the bonding effect of the waveguide preform 200. The waveguide preforms 200 are bonded together using solid optical transparent adhesive. Solid optical transparent adhesive can be applied to the bonding surface 200a of the waveguide preforms 200 in advance. The bonding fixture 100 of this embodiment is placed horizontally, that is, the bearing surface 110a is set horizontally. Since the solid optical transparent adhesive does not have fluidity, the bonding operation of the waveguide preforms 200 placed on the horizontal bearing surface 110a can be completed normally, and the bonding effect is not affected.

[0132] In some embodiments, the fitting fixture 100 further includes a support member 160. The support member 160 is connected to the carrier member 110 and is configured to set the carrier surface 110a at a second preset angle w2 with the horizontal direction. The first preset angle w1 is equal to the second preset angle w2.

[0133] It should be noted that the support member 160 refers to the component used to support the carrier member 110. The support member 160 can be a support platform or a support frame, depending on the actual situation, and this embodiment does not impose specific limitations on it. Specifically, after the carrier member 110 is placed on the support member 160, the bearing surface 110a of the carrier member 110 is tilted, and the bearing surface 110a is set at a second preset angle w2 with the horizontal direction, while the bonding surface 200a of the waveguide preform 200 is set at a first preset angle w1 with the first direction F1. The first preset angle w1 and the second preset angle w2 can be set to be equal. In this way, the bonding surface 200a of the waveguide preform 200 can be parallel to the horizontal plane, which improves the situation where the liquid optical transparent adhesive overflows onto the bearing surface 110a and there is insufficient amount of liquid optical transparent adhesive on the bonding surface 200a, thereby improving the bonding effect of the waveguide preform 200.

[0134] In some embodiments, the fitting fixture 100 further includes a cover member 170 for covering the carrier member 110. The cover member 170 has a cover surface 170a, and in the covered state, a limiting space Q3 is defined between the cover surface 170a and the carrier surface 110a, the limiting space Q3 being used to limit the positioning of the plurality of waveguide preforms 200.

[0135] It should be noted that the cover member 170 refers to a component that covers and fixes multiple waveguide preforms 200. The cover member 170 has a cover surface 170a, which can be constructed as a plane. The limiting space Q3 refers to the space used to limit and fix the top surfaces of the multiple waveguide preforms 200 in a direction perpendicular to the bearing surface 110a.

[0136] Specifically, after multiple waveguide preforms 200 are sequentially placed on the bearing surface 110a and fixed by the fixing space Q1, the cover member 170 is placed on the bearing member 110, so that the cover surface 170a contacts the top surface of the multiple waveguide preforms 200, and a limiting space Q3 is defined between the cover surface 170a and the bearing surface 110a. In this way, during the pressing process, the waveguide preforms 200 are less likely to shift to the side away from the bearing surface 110a, and all waveguide preforms 200 are pressed within the limiting space Q3, which can improve the pressing accuracy of the waveguide preforms 200.

[0137] Considering that the liquid optically transparent adhesive is not easy to cure after the waveguide preforms 200 are bonded together, in some embodiments, the bonding fixture 100 further includes a light-illuminating element (not shown in the figure) disposed on the cover 170, which is used to illuminate the plurality of waveguide preforms 200 within the limiting space Q3.

[0138] Specifically, the light-illuminating component refers to a component used to perform photocuring on the liquid optically transparent adhesive. This light-illuminating component can be an ultraviolet (UV) lamp, and the type and location of the UV lamp can be specifically set according to actual needs; this embodiment does not impose specific limitations on this. Thus, by setting up the light-illuminating component, the curing speed of the liquid optically transparent adhesive can be improved, thereby increasing the bonding efficiency of the waveguide preform 200.

[0139] Based on the same inventive concept, this application also provides a method for fabricating an array waveguide 400, which is fabricated using a bonding fixture 100 as described in any previous embodiment. The method for fabricating the array waveguide 400 includes:

[0140] S11. Multiple waveguide preforms 200 are stacked sequentially on the bearing surface 110a along the first direction F1 by means of the limiting member 130, so that at least a portion of the multiple waveguide preforms 200 are accommodated in the fixed space Q1.

[0141] S12. Move the operating member 140 along the first direction F1 to form a clamping space Q2, thereby making the adjacent mating surfaces 200a of the multiple waveguide preforms 200 fit together to obtain the assembly 300.

[0142] Specifically, multiple waveguide preforms 200 are placed one by one on the bearing surface 110a along the first direction F1, with at least a portion of each waveguide preform 200 accommodated between two limiting surfaces 130a of the limiting member 130. Then, the contact surface of the operating member 140 is attached to a contact surface 200a of the waveguide preform 200 located at the end of the multiple waveguide preforms 200. Under the action of external force and clamping space Q2, the multiple waveguide preforms 200 are moved towards the abutment surface 120a by means of the operating member 140, so that adjacent contact surfaces 200a of the multiple waveguide preforms 200 are attached to each other, resulting in the assembly 300. Furthermore, the specific arrangement of the components of the bonding fixture 100 has been described in detail in the aforementioned embodiments and will not be repeated here.

[0143] In some embodiments, the bonding fixture 100 further includes a plurality of barrier members 150. The waveguide preform 200 has a first end 200b and a second end 200c disposed opposite each other along a second direction F2. In step S11, the plurality of waveguide preforms 200 are sequentially stacked on the bearing surface 110a along the first direction F1 by means of the limiting member 130, including:

[0144] S110. After each waveguide preform 200 is arranged on the bearing surface 110a, at least one barrier 150 is arranged at the first end 200b and / or the second end 200c of the corresponding waveguide preform 200, such that the barrier 150 is located between two adjacent waveguide preforms 200.

[0145] Specifically, to control the thickness of the adhesive after adjacent bonding surfaces 200a of multiple waveguide preforms 200 are bonded together, a barrier 150 can be spaced between adjacent first ends 200b of the multiple waveguide preforms 200, or between adjacent second ends 200c of the multiple waveguide preforms 200, or both adjacent first ends 200b and adjacent second ends 200c of the multiple waveguide preforms 200 can be spaced together. In this way, a barrier 150 is spaced between each adjacent pair of waveguide preforms 200, controlling the thickness of the adhesive between adjacent pairs of waveguide preforms 200 and reducing the possibility of damage to the waveguide preforms 200. Furthermore, the specific arrangement of the components of the bonding fixture 100 has been described in detail in the aforementioned embodiments and will not be repeated here.

[0146] In some embodiments, the limiting member 130 includes a plurality of first limiting structures 131a and a plurality of second limiting structures 132a, all of which are slidably connected to the bearing member 110 along a first direction F1. Each first limiting structure 131a can correspond to a second limiting structure 132a along a second direction F2. Each first limiting structure 131a and each second limiting structure 132a are respectively provided with a blocking member 150. In step S110, after each waveguide preform 200 is arranged on the bearing surface 110a, at least one blocking member 150 is arranged at the first end 200b and / or the second end 200c of the corresponding waveguide preform 200, including:

[0147] S1101 After the current waveguide preform 200 is arranged on the bearing surface 110a, a first limiting structure 131a and a corresponding second limiting structure 132a are moved along the first direction F1 to form at least a partial fixing space Q1 for fixing the current waveguide preform 200, and the blocking member 150 on the current first limiting structure 131a is located at the first end 200b of the current waveguide preform 200, and the blocking member 150 on the current second limiting structure 132a is located at the second end 200c of the current waveguide preform 200.

[0148] Specifically, each first limiting structure 131a and each second limiting structure 132a are connected to a blocking element 150. Further, after the current waveguide preform 200 is placed on the bearing surface 110a, a set of first limiting structures 131a and corresponding second limiting structures 132a are moved to limit the first end 200b and the second end 200c of the current waveguide preform 200. The blocking element 150 of the first limiting structure 131a is placed at the first end 200b of the current waveguide preform 200, and the blocking element 150 of the second limiting structure 132a is placed at the second end 200c of the current waveguide preform 200, ensuring that each subsequent adjacent waveguide preform 200 is spaced apart by a blocking element 150. In this way, the limiting and blocking operations for a waveguide preform 200 can be completed in one operation, thereby improving the convenience and efficiency of the operation. Furthermore, the specific configuration of each component of the fitting fixture 100 has been described in detail in the foregoing embodiments, and will not be repeated here.

[0149] In some embodiments, after obtaining the assembly 300 in step S12, the method for fabricating the array waveguide 400 further includes:

[0150] S13. The assembly 300 is cut along a preset path on the preset surface S1 to obtain the array waveguide 400. The first direction F1 and the second direction F2 are both parallel to the preset surface S1.

[0151] Specifically, the preset surface S1 refers to one of the two surfaces of the assembly 300 that are positioned opposite each other along the third direction F3. The preset surface S1 is parallel to both the first direction F1 and the second direction F2. The preset path refers to the cutting path when the assembly 300 is cut to obtain a single array waveguide 400. The extension direction of the preset path can be parallel to the first direction F1, or it can intersect the first direction F1. Furthermore, the size of the array waveguide 400 along the second direction F2 can be determined based on the product casing and overall design to which the array waveguide 400 is applied, and can be set according to actual conditions. This embodiment does not impose specific limitations on this.

[0152] Compared to related technologies, where waveguide substrate 10 is stacked and bonded in the vertical direction and then obliquely cut from the top, resulting in wasted material on both sides of the waveguide substrate 10 and low utilization rate, in this embodiment, multiple waveguide preforms 200 are stacked and bonded together along the first direction F1 to obtain assembly 300. During subsequent cutting, the structure of assembly 300 can be fully utilized, thereby improving the utilization rate of waveguide substrate.

[0153] In some embodiments, before stacking multiple waveguide preforms 200 sequentially along the first direction F1 on the bearing surface 110a in step S11, the method for fabricating the array waveguide 400 further includes:

[0154] S101, Provide waveguide substrate.

[0155] S102. A film is deposited on the target surface of the waveguide substrate to obtain the waveguide preform 200. The target surface is one of the two bonding surfaces 200a corresponding to the waveguide substrate.

[0156] Specifically, the waveguide substrate can be made of materials such as transparent glass or plastic. Glass waveguide substrates can be manufactured using a casting process, while plastic waveguide substrates can be manufactured using a hot-pressing or injection molding process. The waveguide preform 200 has two mating surfaces 200a, meaning the waveguide substrate has two mating surfaces 200a. One of the two mating surfaces 200a of the waveguide substrate is coated. The specific surface to be coated can be selected according to actual conditions; this embodiment does not impose specific limitations on this.

[0157] Compared to related technologies that provide multiple monolithic waveguide substrates and stack them together in the vertical direction, this method results in a larger thickness after cutting. Furthermore, the cut surfaces of the array waveguide 400 need to be ground and polished after cutting, which leads to low flatness of the light-incident and light-out surfaces of the array waveguide 400. In this embodiment, the waveguide substrate can be manufactured using casting, hot pressing, or injection molding processes, which improves the manufacturing precision of the waveguide substrate. Furthermore, while manufacturing the waveguide substrate, the incident and exit surfaces of the subsequent array waveguide 400 are determined, i.e., the two surfaces of the waveguide preform 200 arranged opposite each other along the third direction F3. Therefore, multiple waveguide preforms 200 only need to be sequentially bonded together along the first direction F1, resulting in a smaller cutting thickness and higher cutting precision. Moreover, the resulting array waveguide 400 does not require grinding or polishing of the incident and exit surfaces. Therefore, the geometric dimensions and optical performance data of the array waveguide 400 manufactured through this embodiment are more accurate and closer to standard requirements, contributing to the achievement of a high-quality array waveguide 400.

[0158] In some embodiments, before stacking the plurality of waveguide preforms 200 sequentially along the first direction F1 on the bearing surface 110a, the fabrication method of the array waveguide 400 further includes:

[0159] S103. Apply adhesive to at least one mating surface 200a of the waveguide preform 200.

[0160] It should be noted that before or after the waveguide preform 200 is placed on the bearing surface 110a, adhesive needs to be applied to the bonding surface 200a of the waveguide preform 200. This adhesive can be a solid optically transparent adhesive or a liquid optically transparent adhesive, and the choice can be made according to actual needs. This embodiment does not impose specific limitations on this. It should also be noted that the state of the bearing 110 can be adjusted according to the type of adhesive used to improve the bonding effect of the waveguide preform 200. Specifically, one of the two mating surfaces 200a of the first waveguide preform 200 is covered with adhesive, while the other mating surface 200a is used to contact the abutment surface 120a. Similarly, one of the two mating surfaces 200a of the last waveguide preform 200 is covered with adhesive, while the other mating surface 200a is used to contact the contact surface of the operating member 140. Both mating surfaces 200a of each waveguide preform 200 placed in the middle can be covered with adhesive to improve the bonding strength between the waveguide preforms 200.

[0161] In some embodiments, the waveguide substrate includes a first substrate and a second substrate, wherein the dimension of the first substrate along the first direction F1 is larger than the dimension of the second substrate along the first direction F1. Specifically, in some embodiments, the array waveguide 400 can be applied to wearable devices. Since there is a distance between the wearable device and the eye, the array waveguide 400 is required to have a larger dimension along the first direction F1 for the waveguide substrates located on both sides (i.e., the first substrate) and a smaller dimension along the first direction F1 for the waveguide substrate located in the middle (i.e., the second substrate).

[0162] Further, the dimension of the first substrate along the first direction F1 is 2 cm to 3 cm, and the dimension of the second substrate along the first direction F1 is 0.8 cm to 2 cm. Specifically, the dimension of the first substrate along the first direction F1 can be 2 cm, 2.1 cm, 2.2 cm, 2.3 cm, 2.4 cm, 2.5 cm, 2.6 cm, 2.7 cm, 2.8 cm, 2.9 cm, or 3 cm. The dimension of the second substrate along the first direction F1 can be 0.8 cm, 0.9 cm, 1 cm, 1.1 cm, 1.2 cm, 1.3 cm, 1.4 cm, 1.5 cm, 1.6 cm, 1.7 cm, 1.8 cm, 1.9 cm, or 2 cm. These dimensions can be set according to actual needs, and this embodiment does not impose specific limitations on them.

[0163] In some embodiments, two first substrates are provided, and multiple second substrates are provided. Two first substrates are located on opposite sides of the assembly 300 along a first direction F1, and multiple second substrates are located between the two oppositely positioned first substrates. Specifically, in some embodiments, the array waveguide 400 can be applied to wearable devices. The second substrates in the array waveguide 400 are located in front of the eyes. The multi-layered second substrates, combined with their coating layers, enable AR / MR images to have a pupil-expanding effect. Therefore, the smaller the size of the multiple second substrates along the first direction F1, the more second substrates can be provided to improve the pupil-expanding effect of the array waveguide 400 on AR / MR images.

[0164] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0165] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A bonding fixture for bonding multiple waveguide preforms, wherein the waveguide preforms have two opposing bonding surfaces along a first direction, characterized in that, The fitting fixture includes: The carrier has a bearing surface for bearing the plurality of waveguide preforms, which are arranged sequentially along the first direction; An abutment member is located on the bearing side of the bearing member; the abutment member has an abutment surface disposed along the first direction; A limiting member is provided on the carrier member; the limiting member has two limiting surfaces arranged opposite each other along a second direction, and the two limiting surfaces, the abutment surface, and the carrier surface together define a fixing space for fixing the plurality of waveguide preforms; and An operating element is configured to move toward or away from the abutting surface in response to an external force along the first direction to form a clamping space with the abutting element for clamping the plurality of waveguide preforms, thereby causing adjacent mating surfaces of the plurality of waveguide preforms to abut each other. Wherein, the first direction and the second direction are perpendicular to each other.

2. The fitting fixture according to claim 1, characterized in that, The waveguide preform has a first end and a second end disposed opposite to each other along the second direction; The fitting fixture also includes multiple barrier components; Wherein, each of the aforementioned blocking elements is disposed between the first ends of two adjacent waveguide preforms along the first direction; and / or Each of the aforementioned barrier elements is disposed between the second ends of two adjacent waveguide preforms along the first direction.

3. The fitting fixture according to claim 2, characterized in that, The barrier element has a barrier surface; The barrier surface is configured to be parallel to the bonding surface.

4. The fitting fixture according to claim 3, characterized in that, Both the barrier surface and the bonding surface are configured to be set at a first preset angle to the first direction.

5. The fitting fixture according to claim 4, characterized in that, The fitting fixture further includes a support member; the support member is connected to the carrier member and is used to set the carrier surface at a second preset angle with the horizontal direction; The first preset angle is equal to the second preset angle.

6. The fitting fixture according to claim 2, characterized in that, The barrier is configured such that, when the plurality of waveguide preforms are attached to each other, it can abut against the corresponding end of the waveguide preform adjacent to the barrier.

7. The fitting fixture according to any one of claims 2-6, characterized in that, The limiting member includes a first sub-limiting member and a second sub-limiting member, both disposed on the bearing member, wherein the first sub-limiting member and the second sub-limiting member are disposed opposite to each other along the second direction; The surfaces of the first sub-limiting member and the second sub-limiting member that are opposite to each other are the limiting surfaces.

8. The fitting fixture according to claim 7, characterized in that, The first sub-limiting member includes a plurality of first limiting structures disposed on the bearing member and independent of each other, and the plurality of first limiting structures are arranged along the first direction; The second sub-limiting member includes a plurality of second limiting structures disposed on the bearing member and independent of each other, the plurality of second limiting structures being arranged along the first direction; Each of the first limiting structures corresponds to one of the second limiting structures.

9. The fitting fixture according to claim 8, characterized in that, Both the first limiting structure and the second limiting structure are slidably connected to the carrier along the first direction.

10. The fitting fixture according to claim 9, characterized in that, Each of the first limiting structures and each of the second limiting structures is provided with one of the aforementioned blocking elements.

11. The fitting fixture according to claim 10, characterized in that, The first limiting structure and the barrier connected to the first limiting structure are an integral structure; and / or The second limiting structure and the barrier connected to the second limiting structure are an integral structure.

12. The fitting fixture according to any one of claims 1-6, characterized in that, The fitting fixture further includes a cover element for covering the carrier element; The cover has a cover surface. In the covered state, a limiting space is defined between the cover surface and the bearing surface. The limiting space is used to limit the position of the plurality of waveguide preforms.

13. The fitting fixture according to claim 12, characterized in that, The bonding fixture also includes a light source disposed on the cover, the light source being used to illuminate the plurality of waveguide preforms within the limiting space.

14. A method for fabricating an arrayed waveguide, characterized in that, The method for fabricating the arrayed waveguide uses the bonding fixture as described in any one of claims 1-13; the method for fabricating the arrayed waveguide includes: Multiple waveguide preforms are stacked sequentially on the bearing surface along the first direction by means of the limiting member, so that at least a portion of the multiple waveguide preforms are accommodated in the fixed space; The operating member is moved along the first direction to form the clamping space, thereby causing adjacent mating surfaces of the plurality of waveguide preforms to fit together to obtain an assembly.

15. The method for fabricating an arrayed waveguide according to claim 14, characterized in that, The bonding fixture also includes a plurality of barrier elements; the waveguide preform has a first end and a second end disposed opposite to each other along the second direction; The step of stacking multiple waveguide preforms sequentially on the bearing surface along the first direction using the limiting member includes: After each waveguide preform is arranged on the bearing surface, at least one of the blocking elements is arranged at the first end and / or the second end of the corresponding waveguide preform, such that the blocking element is located between two adjacent waveguide preforms.

16. The method for fabricating an arrayed waveguide according to claim 15, characterized in that, The limiting member includes a plurality of first limiting structures and a plurality of second limiting structures that are slidably connected to the bearing member along the first direction. Each first limiting structure can correspond to a second limiting structure along the second direction. Each first limiting structure and each second limiting structure are respectively provided with a barrier member. The step of arranging at least one of the blocking elements at the first end and / or the second end of the corresponding waveguide preform after each waveguide preform is arranged on the bearing surface includes: After the current waveguide preform is arranged on the bearing surface, a first limiting structure and a corresponding second limiting structure are moved along the first direction to form at least a portion of the fixing space for fixing the current waveguide preform, and the barrier on the current first limiting structure is located at the first end of the current waveguide preform, and the barrier on the current second limiting structure is located at the second end of the current waveguide preform.

17. The method for fabricating an arrayed waveguide according to any one of claims 14-16, characterized in that, After obtaining the assembly, it includes: The assembly is cut along a predetermined path on a predetermined surface to obtain the array waveguide; Wherein, both the first direction and the second direction are parallel to the preset surface.

18. The method for fabricating an arrayed waveguide according to any one of claims 14-16, characterized in that, Before sequentially stacking multiple waveguide preforms along the first direction on the bearing surface, the method for fabricating the arrayed waveguide further includes: Provide waveguide substrates; A coating is applied to the target surface of the waveguide substrate to obtain the waveguide preform; the target surface is one of the two bonding surfaces corresponding to the waveguide substrate.

19. The method for fabricating an arrayed waveguide according to claim 18, characterized in that, The waveguide substrate includes a first substrate and a second substrate, wherein the dimension of the first substrate along the first direction is greater than the dimension of the second substrate along the first direction.

20. The method for fabricating an arrayed waveguide according to claim 19, characterized in that, The first substrate has a dimension of 2 cm to 3 cm along the first direction, and the second substrate has a dimension of 0.8 cm to 2 cm along the first direction.

21. The method for fabricating an arrayed waveguide according to claim 19, characterized in that, The number of first substrates is two, and the number of second substrates is multiple; the two first substrates are located on opposite sides of the assembly along a first direction, and the multiple second substrates are located between the two oppositely arranged first substrates.

22. The method for fabricating an arrayed waveguide according to any one of claims 14-16, characterized in that, Before sequentially stacking multiple waveguide preforms along the first direction on the bearing surface, the method for fabricating the arrayed waveguide further includes: An adhesive is applied to at least one of the bonding surfaces of the waveguide preform.

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