A printing method with semiconductor labels

Abstract

The application provides a printing method of a semiconductor label, the semiconductor label and a product. When printing the semiconductor label, transfer ink is printed on a base layer, conductive ink is printed on the transfer ink, a semiconductor is bound in a binding area provided in the conductive ink, and the semiconductor and the conductive ink are wrapped in the transfer ink by transfer adhesive. After drying, the semiconductor label is obtained, and the transfer ink is transferred to a designated product by a transfer printing technology after being separated from the base layer. It can be seen that the semiconductor label printed by the application is not pasted on the designated product by adhesive, but is transferred to the designated product by the transfer printing technology, and the semiconductor label can be firmly transferred to the designated product for a long time.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a printing method of a semiconductor label, a semiconductor label and a product. BACKGROUND

[0002] In order to adapt to different requirements of different application scenarios on semiconductor radio frequency performance parameters, various semiconductor antenna manufacturing processes, such as RFID antenna manufacturing processes, have appeared. At present, all semiconductor labels manufactured by the radio frequency antenna manufacturing process need to be bonded to the required product by using an adhesive, and in actual application, a material (such as a plastic film or paper) carrying the radio frequency antenna must be used. Specifically, the manufactured radio frequency antenna plastic film, that is, the semiconductor label, needs to be bonded to the corresponding carrier by using an adhesive. However, with the passage of time and the influence of the environment, the adhesive is prone to dry out and fall off, thereby making it difficult for the semiconductor label manufactured by the radio frequency antenna to be firmly bonded to the specified product for a long time. SUMMARY

[0003] Therefore, the present application provides a printing method of a semiconductor label, a semiconductor label and a product, so as to be able to transfer the semiconductor label to the specified product for a long time and firmly, and realize integration with the specified product.

[0004] Specifically, the present application is realized by the following technical solutions:

[0005] In a first aspect, the present application embodiment provides a printing method of a semiconductor label, and the transfer printing method comprises the following steps.

[0006] In a first step, transfer ink is printed on a flattened set base layer.

[0007] In a second step, after the transfer ink is dried, conductive ink is printed on the transfer ink layer in a set label antenna manner.

[0008] In a third step, after the conductive ink is dried, a semiconductor to be packaged is bound in a set binding area on the conductive ink layer by using a special semiconductor flip-chip packaging device. The number of the binding areas is greater than or equal to 1, and the number of the semiconductors bound in each binding area is greater than or equal to 1.

[0009] In a fourth step, after the semiconductor binding is completed, transfer adhesive is printed on the transfer ink layer in a manner of covering the semiconductor and the conductive ink. After the transfer adhesive is dried, a printed semiconductor label is finally obtained, which is transferred to a specified product by transfer printing technology.

[0010] In a second aspect, the present application embodiment provides a semiconductor label with a semiconductor, and the semiconductor label comprises:

[0011] base layer,

[0012] transfer ink layer, which is adhesively laid on the base layer;

[0013] conductive ink layer, which is adhesively laid on the transfer ink layer;

[0014] semiconductor, which is bound in a binding area of the conductive ink layer;

[0015] transfer glue, which is adhesively wrapped on the transfer ink layer in a form covering the semiconductor and the conductive ink layer.

[0016] In a third aspect, the embodiments of the present application provide a product with a semiconductor label, wherein the semiconductor label is any of the semiconductor labels described in the above embodiments, and the semiconductor label is transferred to a target medium surface of the product, and the target medium surface is a medium surface to which a label can be attached.

[0017] Therefore, the embodiments of the present application provide a printing method for a semiconductor label, a semiconductor label and a product. In the printing method, a transfer ink is printed on a base layer, a conductive ink is printed on the transfer ink, a semiconductor is bound in a binding area of the conductive ink, and the semiconductor and the conductive ink are wrapped by a transfer glue on the transfer ink. After drying, a printed semiconductor label is obtained. The transfer ink is transferred to a specified product by a transfer technology. It can be seen that, in the printing method, the semiconductor label is not attached to the specified product by an adhesive, but is transferred to the specified product by the transfer technology. The semiconductor label can be firmly transferred to the specified product for a long time, and is integrated with the specified product. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a flowchart of a first printing method for a semiconductor label according to an example embodiment of the present application;

[0019] Figure 2 is a flowchart of a transfer method for a semiconductor label according to an example embodiment of the present application;

[0020] Figure 3 is a flowchart of a second printing method for a semiconductor label according to an example embodiment of the present application;

[0021] Figure 4 is a flowchart of a third printing method for a semiconductor label according to an example embodiment of the present application;

[0022] Figure 5 is a flow chart of a fourth printing method for a semiconductor tag according to an example embodiment of the present application;

[0023] Figure 6 is a flow chart of a fifth printing method for a semiconductor tag according to an example embodiment of the present application;

[0024] Figure 7 is a flow chart of a sixth printing method for a semiconductor tag according to an example embodiment of the present application;

[0025] Figure 8 is a structural diagram of a semiconductor tag with a semiconductor according to an example embodiment of the present application;

[0026] Figure 9 is a structural diagram of a semiconductor tag with a semiconductor according to an example embodiment of the present application;

[0027] Figure 10 is a structural diagram of a semiconductor tag with a semiconductor according to an example embodiment of the present application;

[0028] Figure 11 is a structural diagram of a semiconductor tag with a semiconductor according to an example embodiment of the present application;

[0029] Figure 12 is a structural diagram of a semiconductor tag with a semiconductor according to an example embodiment of the present application. Embodiments

[0030] The example embodiments will now be described in detail with reference to the drawings. When the description is made with reference to the drawings, the same or similar components are designated by the same or similar reference numerals, and the repeated description of which will be omitted. The embodiments described in the following example embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0031] The terminology used in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used in the description of the application and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It also will be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0032] It should be understood that, although the terms first, second, third, etc. can be employed in this application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another type of information. For example, without departing from the scope of the application, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information. Depending on the context, the word "if" as used herein can be interpreted as "when" or "upon" or "in response to determining".

[0033] To adapt to different requirements of semiconductor radio frequency performance parameters in different application scenarios, various semiconductor antenna manufacturing processes, such as RFID antenna manufacturing processes, have appeared. At present, all semiconductor tags manufactured by the radio frequency antenna manufacturing process need to use the method of using adhesive to bond the radio frequency tag to the required product, and in actual application, the material (such as plastic film or paper) carrying the radio frequency antenna must be used. Specifically, the manufactured radio frequency antenna plastic film, i.e. semiconductor tag, needs to be bonded to the corresponding carrier by using adhesive, but with the passage of time and the influence of the environment, the adhesive is easy to dry and fall off, thereby making the semiconductor tag manufactured by the radio frequency antenna difficult to be firmly bonded to the specified product for a long time.

[0034] To solve the above technical problems, the embodiment of the present application provides a printing method for a semiconductor tag, which comprises the following steps: first, printing transfer ink on a flattened set base layer; second, after the transfer ink is dried, printing conductive ink on the transfer ink layer in a set tag antenna manner; third, after the conductive ink is dried, using a special semiconductor flip-chip packaging device to bind the semiconductor to be packaged in the set binding area on the conductive ink layer; wherein the number of binding areas is greater than or equal to 1, and the number of semiconductors bound in each binding area is greater than or equal to 1; fourth, after the semiconductor binding is completed, printing transfer adhesive on the transfer ink layer in a manner of covering the semiconductor and conductive ink, and after the transfer adhesive is dried, finally obtaining a printed semiconductor tag, which is transferred to a specified product by transfer printing technology. It can be seen that the semiconductor tag printed by the technical solution provided in the embodiment is no longer pasted on the specified product by using adhesive when being transferred to the specified product, but is transferred to the specified product by transfer printing technology, which can transfer the semiconductor tag to the specified product for a long time and firmly, and realize the integration with the specified product.

[0035] The following will be described in the form of embodiments:

[0036] Referring to Figure 1 , Figure 1is a flowchart of a first printing method for a semiconductor label according to an embodiment of the present application. As an example, the semiconductor label can be a chip label. As another example, the semiconductor label can be a radio frequency label, such as an RFID antenna label. As another example, the semiconductor label can be a radio frequency chip label, that is, a chip label with radio frequency function.

[0037] The printing method of the present application comprises the following steps: Figure 1 The printing method of the present application comprises the following steps:

[0038] First, printing transfer ink on the flattened base layer.

[0039] The base layer in the present embodiment is the base material, which can be a high polymer film layer. As an example, the high polymer film layer can be made of PET (Polyethylene terephthalate).

[0040] The transfer ink can be an ink with waterproof, stretchable and transferable properties. Under the transfer printing technology, the transfer ink can be separated from the base layer, such as the high polymer film layer, so that the semiconductor label separated from the high polymer film layer is waterproof, thereby protecting the semiconductor. In addition, the transfer ink can also have a protective effect, which can protect the semiconductor and conductive ink.

[0041] As an example, the transfer ink can be or contain protective ink, UV (ultraviolet) ink, TPU (Thermoplastic Urethane) ink, nylon ink, and ink treated according to the set requirements.

[0042] Second, after the transfer ink is dried, conductive ink is printed on the transfer ink layer in a manner of forming a set label antenna.

[0043] The conductive ink forms a conductive circuit on the transfer ink in a set antenna shape. The circuit in the conductive ink is set at a recognizable distance to form a microwave.

[0044] In addition, the matching degree of the transfer ink and the conductive ink is better, which can make the conductive circuit formed by the conductive ink on it conduct better and its performance better. Under such a premise, the conductive ink can be directly set on the transfer ink.

[0045] It should be noted that the transfer layer formed by printing transfer ink on the base layer can be directly obtained, such as purchased, so that the conductive ink can be directly printed on the transfer ink layer in the purchased transfer layer in a manner of forming a set label antenna.

[0046] Thirdly, after the conductive ink is dried, a semiconductor to be packaged is bonded in the designated bonding area on the conductive ink layer by using a special semiconductor flip-chip packaging equipment.

[0047] In this embodiment, the number of bonding areas is greater than or equal to 1, and the number of semiconductors bonded in each bonding area is greater than or equal to 1.

[0048] The conductive ink layer can be provided with a plurality of bonding areas, and the number of semiconductors bonded in each bonding area is greater than or equal to 1.

[0049] For example, the conductive ink can be provided with bonding area A, bonding area B and bonding area C, wherein semiconductor A1, semiconductor A2 and semiconductor A3 are bonded in bonding area A, semiconductor B1 is bonded in bonding area B, and semiconductor C1, semiconductor C2 and semiconductor C3 are bonded in bonding area C.

[0050] The conductive ink layer and the semiconductor are connected to form the core part of the semiconductor.

[0051] Fourthly, after the semiconductor is bonded, transfer adhesive is printed on the transfer ink layer to cover the semiconductor and the conductive ink, and after the transfer adhesive is dried, a printed semiconductor label is obtained, which is transferred to a designated product by transfer printing technology.

[0052] The transfer adhesive in this embodiment can be made of materials with insulation and waterproof functions, such as water-based adhesive or oil-based adhesive. The transfer adhesive in this embodiment can protect the semiconductor and the conductive ink from short circuit and corrosion caused by external environment, and can also be bonded to the target medium surface of the designated product under the heat transfer printing technology.

[0053] It should be noted that the semiconductor label obtained in this embodiment can be slitted into semiconductor labels with desired shape and size, or can not be slitted and directly transferred to the target medium surface of the designated product. Whether to be slitted or not depends on the actual application requirements.

[0054] The transfer printing technology in this embodiment can be heat transfer printing technology, cold transfer printing technology or water transfer printing technology, which is not limited in this embodiment.

[0055] Thus, the process described above is completed. Figure 1

[0056] ​Therefore, this application provides a printing method, a semiconductor label, and a product with a semiconductor label. In this method, transfer ink is printed on a substrate, and conductive ink is printed on the transfer ink. A semiconductor is bonded within a pre-defined bonding area of ​​the conductive ink. The semiconductor and conductive ink are then encapsulated in the transfer ink using transfer adhesive. After drying, a printed semiconductor label is obtained. This label is then transferred to a designated product using transfer printing technology, allowing the transfer ink to detach from the substrate. Thus, the semiconductor label printed using this method is no longer attached to the product with adhesive; instead, it is transferred using transfer printing technology. This allows the semiconductor label to be firmly and permanently transferred to the product, achieving a seamless integration with the product.

[0057] After completion Figure 1 Following the described process, such as Figure 2 As shown, as an example, after the fourth step, the method further includes:

[0058] The fifth step is to cut the printed semiconductor labels according to the set semiconductor label shape requirements after the transfer adhesive dries, so that each semiconductor label after cutting contains at least one binding area, and finally obtain the printed semiconductor labels, which can be transferred to the designated products by transfer technology.

[0059] In this embodiment, the printed semiconductor label may contain multiple binding areas. Each binding area belongs to a different semiconductor label shape and can be cut according to the specified semiconductor label shape requirements. For example, it can be cut into heart-shaped semiconductor labels or peach-shaped semiconductor labels. Regardless of the shape of the semiconductor label, each cut semiconductor label contains at least one binding area. In other words, each cut semiconductor label can have multiple binding areas, and at least one semiconductor can be set in the binding area of ​​each semiconductor label according to actual needs.

[0060] It should be noted that this step involves cutting the printed semiconductor labels to obtain individual semiconductor labels, rolls of semiconductor labels, or entire sheets of semiconductor labels.

[0061] After the semiconductor labels are cut, they can be transferred to the target medium surface of the specified product using transfer technology.

[0062] As an example, such as Figure 3 As shown, when it is necessary to transfer pre-printed semiconductor labels, the printing method also includes the following steps:

[0063] The sixth step is to paste the transfer adhesive layer of the semiconductor label to the target medium surface of the product to be transferred, press the base layer of the semiconductor label by using a preset transfer device, and then melt and fix the transfer adhesive on the target medium surface. After that, the base layer is peeled off, and the transfer of the semiconductor label on the target medium surface is completed.

[0064] In this embodiment, the base layer is peeled off from the surface of the transfer ink.

[0065] In this embodiment, after the transfer adhesive is melted on the target medium surface, the semiconductor chip can be printed on the required product, such as a garment, as firmly as printing. When the dry adhesive is used to bond the semiconductor label, it is difficult to bond the dry adhesive to the garment cloth, so the existing semiconductor label is difficult to be fixed on the garment. However, the semiconductor label printed by using the technical solution provided in this embodiment can be firmly printed on the target medium surface by using the transfer technology without limiting the material of the carrier. At the same time, the design of the transfer ink can enable the base layer to be peeled off from the transfer ink after the transfer is completed.

[0066] In addition, the semiconductor label printed by using the technical solution provided in this embodiment can play a role in anti-counterfeiting when it is transferred to the specified product. If the semiconductor label bonded by using the dry adhesive, such as the adhesive or the glue, can play a role in identifying the genuine product, then after the dry adhesive is separated, some people who take advantage of the situation will collect the separated semiconductor labels and bond them to other non-genuine products by using the dry adhesive. In other words, the semiconductor label bonded by using the dry adhesive can be removed, but the semiconductor label transferred to the target medium surface of the product by using the technical solution provided in this embodiment can exist on the product as printing, and will not fall off, thereby playing a role in anti-counterfeiting.

[0067] As another embodiment, when it is required to transfer the printed semiconductor label, the printing method further includes the following steps:

[0068] The sixth step is to paste the transfer adhesive layer of the semiconductor label to the target medium surface of the product to be transferred, press the base layer of the semiconductor label by using a preset transfer device, and then melt and fix the transfer adhesive on the target medium surface. After that, the base layer is peeled off, and the transfer of the semiconductor label on the target medium surface is completed.

[0069] In this embodiment, the base layer and the transfer ink layer can be peeled off as a whole. Especially when the conductive ink and the semiconductor protective ink layer are cared for, the base layer and the transfer ink layer can be peeled off at the same time according to the actual requirement. At this time, the protective ink layer also has the same function as the transfer ink.

[0070] As an embodiment, as shown in FIG. 6, the semiconductor label printed by using the technical solution provided in this embodiment includes a base layer 61, a transfer ink layer 62, and a semiconductor chip 63. Figure 4As shown, Figure 4 The flowchart of the third printing method for semiconductor labels provided in this embodiment is shown, and specifically includes the following steps:

[0071] The first step is to print transfer ink onto the prepared substrate.

[0072] The second step is to print conductive ink on the transfer ink layer after the transfer ink has dried, in order to form a set tag antenna.

[0073] The third step is to use a dedicated semiconductor flip-chip packaging device to bond the semiconductor to be packaged within a designated bonding area on the conductive ink layer after the conductive ink has dried. The number of bonding areas is greater than or equal to 1, and the number of semiconductors bonded in each bonding area is greater than or equal to 1.

[0074] Fourth step: After the semiconductor bonding is completed, the first semiconductor protective ink is printed on the transfer ink layer in a manner that covers the semiconductor and conductive ink. After the first semiconductor protective ink layer dries, the transfer adhesive is printed on the first semiconductor protective ink layer.

[0075] In this embodiment, the term "first semiconductor protective ink" is used only for the purpose of distinguishing it from the semiconductor protective inks mentioned later, and is not intended to limit a particular semiconductor protective ink.

[0076] The first semiconductor protective ink further protects the semiconductor and conductive ink. After the first semiconductor protective ink is applied, the transfer adhesive is printed onto the first semiconductor protective ink layer. The first semiconductor protective ink layer encapsulates the semiconductor and conductive ink layers onto the transfer ink layer; in other words, the first semiconductor protective ink layer and the transfer ink layer together encapsulate the semiconductor and conductive ink layers. As an example, the first semiconductor protective ink can be an ink or silicone oil.

[0077] The fifth step is to cut the printed semiconductor label according to the set semiconductor label shape requirements after the transfer adhesive dries, so that each semiconductor label after cutting contains at least one binding area, and finally obtain the printed semiconductor label, which can be transferred to the designated product by transfer technology.

[0078] As another embodiment, such as Figure 5 As shown, Figure 5 The flowchart of the fourth printing method for semiconductor labels provided in this embodiment is shown, and specifically includes the following steps:

[0079] The first step is to print transfer ink onto the prepared substrate.

[0080] Secondly, after the transfer ink is dried, a second semiconductor protective ink is printed on the transfer ink layer; and after the second semiconductor protective ink is dried, a conductive ink is printed on the second semiconductor protective ink layer in a form of a set label antenna.

[0081] In this embodiment, the second semiconductor protective ink is named for the convenience of description, and is not used to limit a certain semiconductor protective ink. Correspondingly, the second semiconductor protective ink is named for the convenience of description, and is not used to limit a certain semiconductor protective ink.

[0082] The first semiconductor protective ink in this embodiment can be of the same material as the second semiconductor protective ink, or can be different, and this embodiment does not limit this.

[0083] Thirdly, after the conductive ink is dried, a semiconductor to be packaged is bound in a set binding area on the conductive ink layer by using a special semiconductor flip-chip packaging device; wherein the number of the binding areas is greater than or equal to 1, and the number of the semiconductors bound in each binding area is greater than or equal to 1.

[0084] Fourthly, after the semiconductor binding is completed, a first semiconductor protective ink is printed on the second semiconductor protective ink layer in a manner of covering the semiconductor and the conductive ink; and after the first semiconductor protective ink layer is dried, a transfer adhesive is printed on the first semiconductor protective ink layer.

[0085] In this embodiment, the first semiconductor protective ink and the second semiconductor protective ink can further protect the semiconductor and the conductive ink together. After the first semiconductor protective ink is set, the transfer adhesive is printed on the first semiconductor protective ink layer, and the first semiconductor protective ink layer wraps the semiconductor and the conductive ink layer on the second semiconductor protective ink layer. In other words, the first semiconductor protective ink layer and the second semiconductor protective ink layer wrap the semiconductor and the conductive ink layer together.

[0086] Fifthly, after the transfer adhesive is dried, the printed semiconductor label is slitting according to a set semiconductor label shape requirement, so that each semiconductor label after slitting contains at least one binding area, and finally a printed semiconductor label is obtained to be transferred to a designated product by transfer printing technology.

[0087] As another embodiment, as shown in Figure 6 , the fifth printing method for the semiconductor label provided in this embodiment includes the following steps: Figure 6 The fifth printing method for the semiconductor label provided in this embodiment includes the following steps:

[0088] Firstly, a transfer ink is printed on a set base layer which has been flattened.

[0089] Secondly, after the transfer ink is dried, print the pattern ink of a set pattern on the transfer ink layer; after the pattern ink is dried, print the conductive ink to form a set label antenna pattern on the pattern ink layer.

[0090] In this embodiment, the pattern ink layer can be one layer or multiple layers. When the pattern ink is multiple layers, different pattern ink layers can be printed on any structure layer of the semiconductor label, or different pattern ink layers can be printed on different structure layers of the semiconductor label respectively. This embodiment is not limited in this regard.

[0091] The pattern ink layer can be personalized, such as the LOGO of a unit, or a pattern with a meaning. In order to identify the product, the pattern ink layer can be personalized to distinguish different series of products.

[0092] Thirdly, after the conductive ink is dried, use a special semiconductor flip-chip packaging device to bind the semiconductor to be packaged in the set binding area on the conductive ink layer; wherein the number of the binding area is greater than or equal to 1, and the number of the semiconductor bound in each binding area is greater than or equal to 1.

[0093] Fourthly, after the semiconductor binding is completed, print the first semiconductor protective ink on the transfer ink layer in a manner of sequentially covering the semiconductor, the conductive ink and the pattern ink.

[0094] In this embodiment, the first semiconductor protective ink layer wraps the semiconductor, the conductive ink and the pattern ink on the transfer ink layer. In other words, the first semiconductor protective ink layer and the transfer ink layer together wrap the semiconductor, the conductive ink and the pattern ink.

[0095] In this embodiment, the pattern ink is printed first, and then the first semiconductor protective ink layer is printed. However, when the first semiconductor protective ink layer is made of transparent material, the first semiconductor protective ink layer can be printed first, and then the pattern ink is printed, so that the pattern information of the pattern ink layer can be displayed through the transparent first semiconductor protective ink layer, and the pattern ink layer can also be protected.

[0096] Fifthly, after the transfer adhesive is dried, the printed semiconductor label is cut according to the set shape requirement of the semiconductor label, so that each semiconductor label after cutting contains at least one binding area, and finally the printed semiconductor label is obtained, which is transferred to the specified product by transfer printing technology.

[0097] As another embodiment, as shown in Figure 7 As another embodiment, as shown in Figure 7 The sixth flowchart of the printing method for the semiconductor label provided in this embodiment specifically includes the following steps:

[0098] Firstly, printing transfer ink on the flattened setting base.

[0099] Secondly, printing second semiconductor protective ink on the transfer ink layer after the transfer ink is dried; printing pattern ink in a setting pattern on the second semiconductor protective ink layer after the second semiconductor protective ink is dried; printing conductive ink in a setting label antenna form on the pattern ink layer after the pattern ink is dried.

[0100] In this embodiment, the pattern ink layer is arranged between the second semiconductor protective ink and the conductive ink layer.

[0101] Thirdly, using a special semiconductor flip-chip packaging device to bind the semiconductor to be packaged in the setting binding area on the conductive ink layer after the conductive ink is dried; wherein the number of the binding area is greater than or equal to 1, and the number of the semiconductor bound in each binding area is greater than or equal to 1.

[0102] Fourthly, printing the first semiconductor protective ink on the second semiconductor protective ink layer in a manner of sequentially covering the semiconductor, the conductive ink and the pattern ink after the semiconductor binding is completed.

[0103] In the case of printing the second semiconductor protective ink layer, the pattern ink layer can be printed first, and then the second semiconductor protective ink layer is printed, or the second semiconductor protective ink layer is printed first, and then the pattern ink layer 8 is printed. Whether the pattern ink layer 8 is printed first or the second semiconductor protective ink layer is printed first is related to whether the second semiconductor protective ink layer is transparent. If the second semiconductor protective ink layer is made of transparent material, the second semiconductor protective ink layer is printed first, and then the pattern ink is printed, and vice versa.

[0104] Fifthly, cutting the printed semiconductor label according to the setting semiconductor label shape requirement after the transfer adhesive is dried, so that each semiconductor label after cutting contains at least one binding area, and finally obtaining the printed semiconductor label to be transferred to the designated product by transfer printing technology.

[0105] As another embodiment, the step of using a special semiconductor flip-chip packaging device to bind the semiconductor to be packaged in the setting packaging area on the conductive ink layer in the third step includes the following steps A~B:

[0106] Step A, using a special semiconductor flip-chip packaging device to lock the binding area for binding the semiconductor on the conductive ink layer 3, and using the semiconductor flip-chip packaging device to point the conductive adhesive in the binding area.

[0107] The binding area in the embodiment can be artificially determined in advance or automatically determined by the semiconductor flip-chip packaging equipment, and the embodiment is not limited in this regard.

[0108] Step B: immediately after the conductive glue is applied, the semiconductor is placed on the conductive glue by using the semiconductor flip-chip packaging equipment, and the semiconductor is simultaneously heat-pressed by using the heat-pressing head of the semiconductor flip-chip packaging equipment to dry the conductive glue, thereby completing the binding of the semiconductor.

[0109] In the embodiment, immediately after the conductive glue is applied, the semiconductor is placed on the conductive glue by using the semiconductor flip-chip packaging equipment, so as to bond the semiconductor to the conductive glue, and the heat-pressing head can fix the semiconductor to the conductive glue.

[0110] In a second aspect, as shown in Figure 10 Figure 10 A structural schematic diagram of a semiconductor label with a semiconductor provided by the embodiment is shown, and the semiconductor label comprises a base layer 1, a transfer ink layer 2, a conductive ink layer 3, a semiconductor 4, and a transfer adhesive 5.

[0111] The transfer ink layer 2 is flatly bonded on the base layer 1; the conductive ink layer is flatly bonded on the transfer ink layer 2; the semiconductor 4 is bound in a binding area 31 of the conductive ink layer; as shown in Figure 7 The transfer adhesive 5 is wrapped and bonded on the transfer ink layer 2 in a form of covering the semiconductor 4 and the conductive ink layer 3.

[0112] In the embodiment, the transfer adhesive 5 and the transfer ink layer 2 wrap the semiconductor 4 and the conductive ink layer 3 inside, so as to protect and fix the semiconductor 4 and the conductive ink layer 3.

[0113] As an embodiment, as shown in Figure 11 The semiconductor label further comprises a first semiconductor protective ink layer 6, the first semiconductor protective ink layer 6 is wrapped on the transfer ink layer 2 in a form of covering the semiconductor 4 and the conductive ink layer 3; and the transfer adhesive 5 is bonded on the first semiconductor protective ink layer 6.

[0114] In order to further protect the semiconductor 4 and the conductive ink layer 3 from the influence of the external environment, the semiconductor label provided by the embodiment further comprises a first semiconductor protective ink layer 6, the first semiconductor protective ink layer 6 is arranged between the conductive ink layer 3 and the transfer adhesive 5, and the transfer ink layer 2 wraps the semiconductor 4 and the conductive ink layer 3 inside, thereby playing a protective role.

[0115] As another embodiment, as shown in Figure 10 ​As shown, the semiconductor label further comprises a second semiconductor protective ink layer 7; the second semiconductor protective ink layer 7 is adhered to the transfer ink layer 2, and together with the first semiconductor protective ink layer 6, the semiconductor 4 and the conductive ink layer 3 are wrapped inside.

[0116] In order to further protect the other side of the semiconductor 4 and the conductive ink layer 3, the second semiconductor protective ink layer 7 is further added in the embodiment of the present application, so as to wrap the semiconductor 4 and the conductive ink layer 3 inside together with the first semiconductor protective ink layer 6.

[0117] As another embodiment, as shown, Figure 11 The semiconductor label further comprises a pattern ink layer 8; the pattern ink layer 8 is adhered to the transfer ink layer 2, and the first semiconductor protective ink layer 6 is adhered to the transfer ink layer 2 in a form of covering the semiconductor 4, the conductive ink layer 3 and the pattern ink layer 8.

[0118] The first semiconductor protective ink layer 6 together with the transfer ink layer 2 wraps the semiconductor 4, the conductive ink layer 3 and the pattern ink layer 8 inside, and plays a protective role. In some embodiments, the pattern ink layer 8 can also be placed between the transfer adhesive 5 and the first semiconductor protective ink layer 6. The present embodiment is not limited in this regard.

[0119] In other embodiments, in the case where the pattern information of the pattern ink layer 8 needs to be displayed, if the first semiconductor protective ink layer 6 is made of transparent material, the first semiconductor protective ink layer 6 is printed first, and then the pattern ink layer 8 is printed, that is, the printed semiconductor label, the pattern ink layer 8 is closer to the transfer adhesive layer than the first semiconductor protective ink layer 6, so as to display the pattern information of the pattern ink layer 8 through the transparent first semiconductor protective ink layer 6, and also play a protective role for the pattern ink layer 8.

[0120] If the first semiconductor protective ink layer 6 is made of non-transparent material, such as white, the pattern ink layer 8 is printed first, and then the first semiconductor protective ink layer 6 is printed, that is, the printed semiconductor label, the first semiconductor protective ink layer 6 is closer to the transfer adhesive layer than the pattern ink layer 8, so as to display the pattern information of the pattern ink layer 8.

[0121] In the case of printing the second semiconductor protective ink layer 7, the pattern ink layer 8 can be printed first, and then the second semiconductor protective ink layer 7 is printed, or the second semiconductor protective ink layer 7 can be printed first, and then the pattern ink layer 8 is printed. Whether the pattern ink layer 8 is printed first or the second semiconductor protective ink layer 7 is printed first is related to whether the second semiconductor protective ink layer 7 is made of transparent material. If the second semiconductor protective ink layer 7 is made of transparent material, as another embodiment, as shown,Figure 12 As shown, the semiconductor label further comprises a pattern ink layer 8; the pattern ink layer 8 is wrapped and bonded on the second semiconductor protection ink layer 7, and the second semiconductor protection ink layer 7 and the first semiconductor protection ink layer 6 wrap the semiconductor 4, the conductive ink layer 3 and the pattern ink layer 8. In this embodiment, the second semiconductor protection ink layer 7 is closer to the base layer 1 than the pattern ink layer 8, and the pattern ink layer 8 can be displayed through the second semiconductor protection ink layer 7.

[0122] If the second semiconductor protection ink layer 7 is made of non-transparent material, as another embodiment, the semiconductor label further comprises a pattern ink layer; the pattern ink layer 8 is wrapped and bonded on the transfer ink layer 2, the second semiconductor protection ink layer 7 is flatly bonded on the pattern ink layer 8, and the second semiconductor protection ink layer 7 and the first semiconductor protection ink layer 6 wrap the semiconductor 4 and the conductive ink layer 3. In this embodiment, the pattern ink layer 8 is closer to the base layer 1 than the second semiconductor protection ink layer 7, and the pattern ink layer 8 can be displayed through the transfer ink layer 2.

[0123] As an embodiment, the semiconductor label is a chip label.

[0124] As another embodiment, the semiconductor label is a radio frequency label.

[0125] As another embodiment, the semiconductor label is a chip label with radio frequency function, also known as a radio frequency label.

[0126] The implementation process of the functions and roles of each unit in the above device is specifically described in the implementation process of the corresponding steps in the above method, which will not be repeated here.

[0127] As can be seen, the semiconductor label provided by the embodiment of the present application is provided with a transfer ink layer 2 flatly bonded on the base layer 1; a conductive ink layer flatly bonded on the transfer ink layer 2; a semiconductor 4 bound in the binding area 31 of the conductive ink layer; and a transfer adhesive 5 wrapped and bonded on the transfer ink layer 2 in the form of covering the semiconductor 4 and the conductive ink layer 3. The transfer ink can be transferred to a designated product by transfer technology after being separated from the base layer 1. As can be seen, the semiconductor label printed by the printing method provided by the embodiment of the present application is no longer pasted on the designated product by adhesive when being transferred to the designated product, but is transferred to the designated product by transfer technology, and at the same time, the base layer 1 can be peeled off from the transfer ink layer 2, so that the semiconductor label can be firmly transferred to the designated product for a long time like printing, and the technical effect of being integrated with the designated product is achieved.

[0128] In a third aspect, the embodiments of the present application further provide a product with a semiconductor tag, the semiconductor tag being any of the semiconductor tags described above, and the semiconductor tag being transferred to a target medium surface of the product, the target medium surface being a medium surface to which a tag can be attached.

[0129] The product with the semiconductor tag in the embodiments can be a woven product, a home textile product, or a fabric product, such as a garment, a shoe, a hat, a bag, a woven bag, and the like. In order to ensure the safety of the product, a corresponding semiconductor tag can be transferred to a target medium surface of the product. If the home textile product is a garment, a semiconductor tag can be transferred to a designated area of the garment by using a transfer technology, so as to realize intelligent checkout. In addition, the semiconductor tag can also be used to realize automatic tracking. In the industry, an alarm is generally triggered by recognizing a hanging tag. However, if the hanging tag is removed and placed in a store, the alarm will not be triggered when the garment is stolen and passes through the alarm door, which makes the garment easy to be stolen out of the store. However, if the semiconductor tag provided in the embodiments is transferred to the garment, the semiconductor tag will not be easily removed because it is transferred to the garment. At this time, the specific position of the stolen garment can be known at any time by using the semiconductor tag transferred to the garment, and the occurrence of a theft event can be reduced.

[0130] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts are described in the part of the method embodiments. The device embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separated, and the components displayed as units can or can not be physical units, that is, they can be located in one place, or can be distributed on multiple network units. According to actual needs, part or all of the modules can be selected to achieve the purpose of the present application. Those skilled in the art can understand and implement it without creative labor.

[0131] The above only describes the preferred embodiments of the present application and does not limit the present application. Any modification, equivalent replacement, improvement, and the like made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A printing method for a semiconductor label, characterized by, The printing method comprises: First, print transfer ink on the flattened base layer; wherein the transfer ink is waterproof, stretchable, transferable and compatible with the conductive ink; the transfer ink comprises protective ink, UV ink, thermoplastic polyurethane elastomer TPU ink, nylon ink and ink treated according to the requirements; Second, print conductive ink on the transfer ink layer in the form of a set of label antennas after the transfer ink is dry; the antenna circuit formed by the conductive ink has a recognizable distance to generate microwaves; Third, bind the semiconductor to be packaged in the set binding area on the conductive ink layer using a special semiconductor flip-chip device after the conductive ink is dry; wherein the number of binding areas is greater than 1, and the number of semiconductors bound in each binding area is greater than or equal to 1; the binding process of the semiconductor flip-chip device is as follows: first, use the semiconductor flip-chip device to point conductive glue in the binding area, immediately use the semiconductor flip-chip device to place the semiconductor on the conductive glue, and simultaneously use the hot press head of the semiconductor flip-chip device to heat and press the semiconductor to dry the conductive glue; Fourth, print transfer glue on the transfer ink layer in a way that covers the semiconductor and conductive ink after the semiconductor binding is completed; the transfer glue is water-based or oil-based glue with insulation and waterproof functions; Fifth, according to the set shape requirements of the semiconductor label, cut the printed semiconductor label to make each semiconductor label after cutting contain at least one binding area, and finally obtain the printed semiconductor label to be transferred to the specified product by transfer printing technology, so that the semiconductor label is integrated with the specified product; When the printed semiconductor label needs to be transferred, the transfer glue layer of the semiconductor label is attached to the target medium surface of the product to be transferred, the base layer of the semiconductor label is pressed by the preset transfer equipment, the transfer glue is melted and fixed on the target medium surface, and then the base layer or the base layer and the transfer ink layer are peeled off to complete the transfer of the semiconductor label on the target medium surface.

2. The printing method according to claim 1, characterized by, The transfer glue is printed on the transfer ink layer in a way that covers the semiconductor and conductive ink, which comprises: The first semiconductor protective ink is printed on the transfer ink layer in a way that covers the semiconductor and conductive ink, and the transfer glue is printed on the first semiconductor protective ink layer after the first semiconductor protective ink layer is dry.

3. The printing method according to claim 2, characterized in that, The conductive ink is printed on the transfer ink layer in the form of a set of label antennas, which comprises: The second semiconductor protective ink is printed on the transfer ink layer; and the conductive ink is printed on the second semiconductor protective ink layer in the form of a set of label antennas after the second semiconductor protective ink is dry; The first semiconductor protective ink is printed on the transfer ink layer in a way that covers the semiconductor and conductive ink, which comprises: The first semiconductor protective ink is printed on the second semiconductor protective ink layer in a way that covers the semiconductor and conductive ink.

4. The printing method according to claim 2, characterized by, The printing of the conductive ink in the form of a set label antenna on the transfer ink layer comprises: printing a pattern ink of a set pattern on the transfer ink layer; and printing the conductive ink in the form of a set label antenna on the pattern ink layer after the pattern ink is dried; The printing of the first semiconductor protective ink on the transfer ink layer to cover the semiconductor and the conductive ink comprises: printing the first semiconductor protective ink on the transfer ink layer to sequentially cover the semiconductor, the conductive ink and the pattern ink.

5. The printing method according to claim 3, characterized by, The printing of the conductive ink in the form of a set label antenna on the second semiconductor protective ink layer comprises: printing a pattern ink of a set pattern on the second semiconductor protective ink layer; and printing the conductive ink in the form of a set label antenna on the pattern ink layer after the pattern ink is dried; The printing of the first semiconductor protective ink on the transfer ink layer to cover the semiconductor and the conductive ink comprises: printing the first semiconductor protective ink on the second semiconductor protective ink layer to sequentially cover the semiconductor, the conductive ink and the pattern ink.

6. The printing method according to any one of claims 1 to 5, characterized in that, The semiconductor label is a chip label or / and a radio frequency label.

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