An optical module

Abstract

The optical module provided by the present disclosure comprises: a circuit board, a light emitting chip and a light receiving chip are arranged on the surface of the circuit board; a lens assembly is arranged on the light emitting chip and the light receiving chip; the lens assembly comprises a lens assembly body, a first optical fiber adapter and a second optical fiber adapter; the first optical fiber adapter and the second optical fiber adapter are arranged at a first end of the lens assembly body, and the first optical fiber adapter and the second optical fiber adapter are used for transmitting optical signals; the center of the light emitting chip is located between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board; a first optical surface and a second optical surface are formed on the lens assembly body; the first optical surface faces the first optical fiber adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter. The present application provides an optical module of a new COB packaging structure.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, the optical module is the tool for converting between photoelectric signals and signals, and is one of the key components in optical communication equipment, occupying a core position in optical communication. Currently, optical modules are packaged in various forms, including coaxial (Transistor-Outline, TO) packages and chip-on-board (COB) packages.

[0003] In a COB-packaged optical module, the optical transmitter chip and the optical receiver chip are directly mounted on the circuit board. A lens assembly is placed above the optical transmitter chip and the optical receiver chip to change the transmission direction of the optical signal emitted by the optical transmitter chip and the transmission direction of the optical signal to be received by the optical receiver chip, thereby enabling the optical module to emit and receive optical signals. Summary of the Invention

[0004] This disclosure provides an optical module for providing a novel COB packaging structure.

[0005] In a first aspect, the present disclosure provides an optical module, comprising: a circuit board having an optical emitting chip and an optical receiving chip disposed on its surface;

[0006] The lens assembly is connected to the circuit board at its bottom and covers the light emitting chip and the light receiving chip; wherein:

[0007] The lens assembly includes a lens assembly body, a first optical fiber adapter, and a second optical fiber adapter; the first optical fiber adapter and the second optical fiber adapter are disposed at a first end of the lens assembly body, the first optical fiber adapter is used to transmit transmitted optical signals, and the second optical fiber adapter is used to transmit received optical signals.

[0008] The center of the optical emitting chip is located between the projection of the optical axis of the first optical fiber adapter onto the circuit board and the projection of the optical axis of the second optical fiber adapter onto the circuit board.

[0009] The lens assembly body has a first optical surface and a second optical surface formed thereon; the first optical surface faces the first optical fiber adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located above the light emitting chip and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.

[0010] In the optical module provided in this disclosure, the lens assembly includes a lens assembly body, a first fiber optic adapter, and a second fiber optic adapter. A light-emitting chip and a light-receiving chip are disposed on a circuit board, with the light-emitting chip located between the projection of the optical axis of the first fiber optic adapter onto the circuit board and the projection of the optical axis of the second fiber optic adapter onto the circuit board. The lens assembly body has a first optical surface and a second optical surface formed thereon. These first and second optical surfaces are used to deflect the emitted light signal generated by the light-emitting chip multiple times. Even if the center of the light-emitting chip is not located on the projection of the optical axis of the first fiber optic adapter onto the circuit board, the emitted light signal generated by the light-emitting chip can still be transmitted through the first fiber optic adapter.

[0011] Secondly, the optical module provided in this disclosure includes: a circuit board with an optical emitting chip and an optical receiving chip disposed on its surface;

[0012] The lens assembly is connected to the circuit board at its bottom and covers the light emitting chip and the light receiving chip; wherein:

[0013] The lens assembly includes a lens assembly body, a first optical fiber adapter, and a second optical fiber adapter; the first optical fiber adapter and the second optical fiber adapter are disposed at a first end of the lens assembly body, the first optical fiber adapter is used to transmit transmitted optical signals, and the second optical fiber adapter is used to transmit received optical signals.

[0014] The center of the optical receiving chip is located between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board.

[0015] The lens assembly body has a third optical surface and a fourth optical surface. The third optical surface faces the second fiber optic adapter, and the fourth optical surface faces the third optical surface and the light receiving chip. The light receiving chip is located below the fourth optical surface and between the optical axis of the first fiber optic adapter and the optical axis of the second fiber optic adapter.

[0016] The optical module provided in this disclosure includes a lens assembly body, a first fiber optic adapter, and a second fiber optic adapter. A light-emitting chip and a light-receiving chip are disposed on a circuit board, with the light-receiving chip located between the projection of the optical axis of the first fiber optic adapter onto the circuit board and the projection of the optical axis of the second fiber optic adapter onto the circuit board. A third optical surface and a fourth optical surface are formed on the lens assembly body. These surfaces are used to receive multiple deflections of the optical signal. Even if the center of the light-receiving chip is not located on the projection of the optical axis of the second fiber optic adapter onto the circuit board, the light-receiving chip can still receive the received optical signal input through the second fiber optic adapter. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0018] Figure 1 This is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0019] Figure 2 This is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0020] Figure 3 This is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0021] Figure 4 This is an exploded view of an optical module provided according to some embodiments of the present disclosure;

[0022] Figure 5 This is a schematic diagram of the assembly of a lens assembly and a circuit board according to some embodiments of the present disclosure;

[0023] Figure 6 This is a partial structural schematic diagram of a circuit board according to some embodiments of the present disclosure;

[0024] Figure 7 This is an exploded view of a lens assembly and circuit board according to some embodiments of the present disclosure;

[0025] Figure 8 This is a schematic diagram of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 1 ;

[0026] Figure 9 This is a schematic diagram of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 2 ;

[0027] Figure 10 This is a schematic diagram of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 3 ;

[0028] Figure 11 This is a schematic diagram of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 4 ;

[0029] Figure 12A cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure. Figure 1 ;

[0030] Figure 13 A cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure. Figure 2 ;

[0031] Figure 14 This is a partial structural schematic diagram of a lens assembly body provided according to some embodiments of the present disclosure;

[0032] Figure 15 A cross-sectional view of a lens assembly in use according to some embodiments of this disclosure. Figure 1 ;

[0033] Figure 16 A cross-sectional view of a lens assembly in use according to some embodiments of this disclosure. Figure 2 ;

[0034] Figure 17 A cross-sectional view of another lens assembly in use according to some embodiments of this disclosure. Figure 1 ;

[0035] Figure 18 A cross-sectional view of another lens assembly in use according to some embodiments of this disclosure. Figure 2 ;

[0036] Figure 19 This is a cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure;

[0037] Figure 20 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 1 ;

[0038] Figure 21 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 2 ;

[0039] Figure 22 For a three-dimensional representation of another lens assembly provided according to some embodiments of the present disclosure Figure 1 ;

[0040] Figure 23 For a three-dimensional representation of another lens assembly provided according to some embodiments of the present disclosure Figure 2 ;

[0041] Figure 24 A cross-sectional view of another lens assembly provided according to some examples of this disclosure. Figure 1 ;

[0042] Figure 25For a three-dimensional representation of another lens assembly provided according to some embodiments of the present disclosure Figure 3 ;

[0043] Figure 26 for Figure 25 A magnified view of a portion of point O in the middle;

[0044] Figure 27 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 2 ;

[0045] Figure 28 for Figure 27 A magnified view of a section at point P in the middle;

[0046] Figure 29 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 3 ;

[0047] Figure 30 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 4 ;

[0048] Figure 31 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 5 ;

[0049] Figure 32 A bottom view of another lens assembly usage state provided according to some embodiments of this disclosure. Figure 1 ;

[0050] Figure 33 A bottom view of another lens assembly usage state provided according to some embodiments of this disclosure. Figure 2 . Detailed Implementation

[0051] The technical solutions in some embodiments of this disclosure will be clearly and thoroughly described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0052] In optical communication technology, to establish information transmission between information processing devices, information needs to be loaded onto light, and the propagation of light is used to transmit the information. Here, the light carrying the information is called an optical signal. When optical signals are transmitted in information transmission equipment, optical power loss can be reduced, thus enabling high-speed, long-distance, and low-cost information transmission. Information processing devices can recognize and process electrical signals. Information processing devices typically include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while information transmission equipment typically includes optical fibers and optical waveguides.

[0053] An optical module enables the conversion between optical and electrical signals between information processing and transmission devices. For example, at least one of the optical signal input or output ports of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ports is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts it into a first electrical signal and transmits it to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts it into a second optical signal and transmits it back to the optical fiber. Since multiple information processing devices can transmit information via electrical signals, at least one of the devices needs to be directly connected to the optical module, rather than all devices. Here, the information processing device directly connected to the optical module is referred to as the host computer of the optical module. Furthermore, the optical signal input or output port of the optical module can be referred to as an optical port, and the electrical signal input or output port can be referred to as an electrical port.

[0054] Figure 1 This is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0055] One end of optical fiber 101 extends toward the remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. The optical signal can undergo total internal reflection in optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to optical module 200, or to transmit the optical signal from optical module 200 to remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0056] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0057] The host computer 100 includes a generally rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 can establish a one-way or two-way electrical signal connection.

[0058] The host computer 100 also includes an external power interface that can connect to an electrical signal network. For example, this external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, which is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, thereby establishing an electrical signal connection between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. This second electrical signal from the host computer 100 is transmitted to the optical module 200, which converts the second electrical signal into a second optical signal and transmits it to the optical fiber 101. The second optical signal is then transmitted in the optical fiber 101 to the remote information processing device 1000. Alternatively, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101 and is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal and transmits it to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that an optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information itself does not change, but the encoding and decoding methods can change.

[0059] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0060] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has fins and other protruding structures to increase the heat dissipation area.

[0061] The optical module 200 is inserted into the cage 106 of the host computer 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to the electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0062] Figure 3 This is a structural diagram of an optical module provided according to some embodiments of the present disclosure. Figure 4 This is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed within the shell, and a lens assembly 400.

[0063] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing having two openings 203 and 204; the outer contour of the housing is generally square.

[0064] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0065] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0066] The direction of the line connecting the two openings 203 and 204 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200. Figure 3 The opening 204 is also located at the end of the optical module 200 (left end). Figure 3 (The right end). Alternatively, opening 203 is located at the end of optical module 200, while opening 204 is located on the side of optical module 200. Opening 203 is an electrical port from which the gold fingers of circuit board 300 extend and are inserted into a host computer (e.g., optical network terminal 100); opening 204 is an optical port configured to access optical fiber 101 so that optical fiber 101 is connected to optical module 200.

[0067] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of components such as the circuit board 300 and the lens assembly 400 into the housing, with the upper housing 201 and lower housing 202 providing encapsulation and protection for these devices. Furthermore, the assembly of components such as the circuit board 300 and the lens assembly 400 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, which is beneficial for automated production.

[0068] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0069] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing, the unlocking component 600 being configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0070] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0071] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, lasers, photodetectors, microcontroller units (MCUs), laser driver chips, limiting amplifiers (LAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0072] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also bear loads. For example, the rigid circuit board can stably support the electronic components and chips mentioned above. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0073] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and is electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The upper surface shown can also be positioned on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications with high pin count requirements. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0074] In some embodiments, the lens assembly 500 is connected to the circuit board 300 and covers the light emitting chip and / or light receiving chip. The lens assembly 500 has a transmission surface and a reflection surface, which, in combination, adjust the transmission direction of the emitted light signal and / or received light signal, so that the emitted light signal generated by the light emitting chip can be output from the optical module, and the light signal input to the optical module can be transmitted to the light receiving chip. The light emitting chip is such as a laser, and the light receiving chip is such as a photodetector. The area below the lens assembly 500 is not limited to the light emitting chip and / or light receiving chip; photoelectric monitoring components, driver chips, etc., can also be disposed there.

[0075] In some embodiments, the optical module 200 includes a lens assembly 400 that covers the light emitting chip and the light receiving chip to adjust the transmission direction of the emitted and received light signals. Of course, in some embodiments, the number of lens assemblies 400 in the optical module 200 is not limited to one; it may include two lens assemblies 400, with a light emitting chip and / or a light receiving chip disposed below each lens assembly 400.

[0076] In some embodiments, the lens assembly 400 is disposed at the end of the circuit board 300, such as near the optical port; however, some embodiments of this disclosure are not limited to disposing the lens assembly 400 at the end of the circuit board 300, and the lens assembly 400 may also be disposed in the middle of the circuit board 300.

[0077] Figure 5 This is a schematic diagram illustrating the assembly of a lens assembly and a circuit board according to some embodiments of the present disclosure. In some embodiments, such as Figure 5 As shown, the lens assembly 400 includes a first fiber optic adapter 410, a second fiber optic adapter 420, and a lens assembly body 430. The first fiber optic adapter 410 is connected to one side of the first end of the lens assembly body 430, and the second fiber optic adapter 420 is connected to the other side of the first end of the lens assembly body 430, i.e., the first fiber optic adapter 410 and the second fiber optic adapter 420 are arranged side by side at the first end of the lens assembly body 430. The first fiber optic adapter 410 and the second fiber optic adapter 420 are respectively configured to connect to the optical fiber 101 to transmit transmitted optical signals to the optical fiber 101 or to transmit received optical signals to the lens assembly body 430. For example, the first fiber optic adapter 410 is configured to transmit transmitted optical signals to the optical fiber 101, and the second fiber optic adapter 420 is configured to transmit received optical signals to the optical fiber 101. Of course, in some embodiments, one fiber optic adapter is provided on the lens assembly 400, and two lens assemblies 400 are provided within the optical module 200.

[0078] In some embodiments, the distance between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420 is a preset value, such as L being 6.25 mm. Even if two lens assemblies 400 are provided within the optical module 200, the distance between the optical axes of the fiber optic adapters on the two lens assemblies 400 should also be a fixed value.

[0079] Figure 6 This is a partial structural schematic diagram of a circuit board according to some embodiments of the present disclosure. In some embodiments, such as Figure 6As shown, a light emitting chip 310 and a light receiving chip 320 are disposed on the top surface of the circuit board 300. The center of the light emitting chip 310 is located on the projection line of the optical axis of the first fiber optic adapter 410 onto the top surface of the circuit board 300, and the center of the light receiving chip 320 is located on the projection line of the optical axis of the second fiber optic adapter 420 onto the top surface of the circuit board 300, so that the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is a preset value. It should be noted that the center of the light emitting chip 310 mainly refers to the center of the effective light-emitting surface, and the center of the light receiving chip 320 mainly refers to the center of the effective detection surface.

[0080] In some embodiments, the light emitting chip 310 and the light receiving chip 320 need to share a driving chip, and the length of the driving chip is less than the spacing L. To ensure signal transmission performance, the wiring between the light emitting chip 310 and the driving chip, and between the light receiving chip 320 and the driving chip, cannot be too long, such as being controlled within 0.1 mm. Therefore, the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 needs to be less than the spacing L. In some embodiments, even if the light emitting chip 310 and the light receiving chip 320 do not share a driving chip, to facilitate the layout of other devices, the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 also needs to be reduced to less than the spacing L. To satisfy the requirement that the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is less than the spacing L, a lens assembly is provided in this embodiment.

[0081] Figure 7 This is an exploded view of a lens assembly and circuit board according to some embodiments of the present disclosure. Figure 7 As shown, a light emitting chip 310 and a light receiving chip 320 are disposed on a circuit board 300. The distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is less than the spacing L. A lens assembly 400 is disposed above the light emitting chip 310 and the light receiving chip 320. For example, the bottom of the lens assembly 400 is connected to the circuit board 300, and the bottom of the lens assembly 400 forms a receiving cavity with the surface of the circuit board 300, in which the light emitting chip 310 and the light receiving chip 320 are located. The lens assembly 400 can not only adjust the transmission direction of the light signal emitted by the light emitting chip 310 and the light signal received by the light receiving chip 320, but also protect the light emitting chip 310 and the light receiving chip 320. In some embodiments, the optical axis of the first optical fiber adapter 410 is projected onto the circuit board 300 as a straight line M, and the optical axis of the second optical fiber adapter 420 is projected onto the circuit board 300 as a straight line N. The distance between the straight lines M and N is L. The optical emitting chip 310 and the optical receiving chip 320 are located between the straight lines M and N. Of course, in some cases, the center of the optical emitting chip 310 is located on the straight line M or the center of the optical receiving chip 320 is located on the straight line N.

[0082] In some embodiments, a driver chip 330 is further disposed on the circuit board 300. The driver chip 330 is disposed in a receiving cavity formed by the bottom of the lens assembly 400 and the circuit board 300, and the driver chip 330 is located on the side of the light emitting chip 310 and the light receiving chip 320 away from the light port of the optical module 200. For example, the driver chip 330 is disposed on the side of the light emitting chip 310 and the light receiving chip 320 away from the light port; the driver chip 330 is electrically connected to the light emitting chip 310 and the light receiving chip 320 respectively, that is, the light emitting chip 310 and the light receiving chip 320 share the driver chip 330. Of course, in some embodiments, two driver chips are disposed on the circuit board, one driver chip is wire-connected to the light emitting chip 310, and the other driver chip is wire-connected to the light receiving chip 320.

[0083] Figure 8 This is a schematic diagram of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 1 , Figure 9 This is a schematic diagram of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 2 .like Figure 8 and Figure 9 As shown, in some embodiments, the lens assembly 400 includes a first fiber optic adapter 410, a second fiber optic adapter 420, and a lens assembly body 430. The lens assembly body 430 has multiple optical surfaces formed thereon, which are used for transmitting or reflecting light signals, etc. A first end of the lens assembly body 430 is close to the optical port of the optical module 200, and a second end of the lens assembly body 430 is close to the electrical port of the optical module 200.

[0084] In some embodiments, the lens assembly 400 is a transparent plastic part, which is integrally injection molded.

[0085] The first fiber optic adapter 410 is connected to one side of the first end of the lens assembly body 430, and the second fiber optic adapter 420 is connected to the other side of the first end of the lens assembly body 430. That is, the first fiber optic adapter 410 and the second fiber optic adapter 420 are arranged side by side at the first end of the lens assembly body 430. The first fiber optic adapter 410 and the second fiber optic adapter 420 have a hollow structure and are configured to connect to the optical fiber 101 to transmit optical signals.

[0086] In some embodiments, the first fiber optic adapter 410 and the second fiber optic adapter 420 are respectively provided with fiber optic ferrules, which are used to improve the coupling efficiency of optical signals between the fiber optic cable 101 and the lens assembly body 430.

[0087] In some embodiments, a first recess 440 is formed on the top of the lens assembly body 430, and a plurality of optical surfaces are formed on the bottom of the first recess 440. For example, the first recess 440 is formed by the top of the lens assembly body 430 recessed towards the bottom of the lens assembly body 430. The formation of the first recess 440 on the lens assembly body 430 and the formation of optical surfaces on the bottom of the first recess 440 facilitates adjustment of the thickness at the location where the optical surfaces are located on the lens assembly body 430, making the optical surfaces easier to process.

[0088] In some embodiments, a second recess 450 is formed at the bottom of the lens assembly body 430, and the second recess 450 forms a receiving cavity with the surface of the circuit board 300, so that the light emitting chip 310 and the light receiving chip 320 can be conveniently arranged below the lens assembly 400. For example, the second recess 450 is formed by the bottom of the lens assembly body 430 recessed towards the top of the lens assembly body 430. In some embodiments, an optical surface is also formed on the top surface of the second recess 450, which is mainly used for transmitting light signals, such as focusing light signals.

[0089] Figure 10 This is a schematic diagram of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 3 , Figure 11 This is a schematic diagram of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 4 .like Figure 10 and Figure 11 As shown, a first groove 431 is formed on the top of the lens assembly body 430, and a first optical surface 4311 is formed on the sidewall of the first groove 431. The first optical surface 4311 is located in the extending direction of the first fiber optic adapter 410. The first optical surface 4311 is used to reflect the emitted light signal and change the transmission direction of the emitted light signal. In some embodiments, the projection of the first optical surface 4311 in the extending direction of the first fiber optic adapter 410 covers the end face of the fiber optic ferrule in the first fiber optic adapter 410. For example, the first optical surface 4311 changes the transmission direction of the emitted light signal from the AB direction to the CD direction. In some embodiments, a reflective film is provided on the first optical surface 4311 to improve the reflection efficiency of the first optical surface 4311 for the emitted light signal.

[0090] In some embodiments, the AB direction of the lens assembly 400 is the width direction of the lens assembly 400, the CD direction of the lens assembly 400 is the length direction of the lens assembly 400, and the EF direction of the lens assembly 400 is the height direction of the lens assembly 400. For example, the width direction of the lens assembly 400 is parallel to the width direction of the circuit board 300, the length direction of the lens assembly 400 is parallel to the length direction of the circuit board 300, and the height direction of the lens assembly 400 is perpendicular to the top surface of the circuit board 300. Thus, the first optical surface 4311 changes the transmission direction of the emitted light signal in the width and length directions of the circuit board 300.

[0091] like Figure 10 and Figure 11 As shown, a second groove 432 is formed on the top of the lens assembly body 430, located between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420. A second optical surface 4321 is formed on the bottom of the second groove 432, which is used to reflect the emitted light signal to change the transmission direction of the emitted light signal. The second optical surface 4321 is located above the light emitting chip 310, and changes the direction in which the light emitting chip 310 generates the light signal. In some embodiments, the projection of the second optical surface 4321 in the direction of the circuit board 300 covers the light emitting chip 310. In some embodiments, a reflective film is provided on the second optical surface 4321 to improve the reflection efficiency of the second optical surface 4321.

[0092] In some embodiments of this disclosure, the first optical surface 4311 and the second optical surface 4321 are combined so that the light emitting chip 310 is positioned between the projection of the optical axis of the first fiber optic adapter 410 onto the circuit board 300 and the projection of the optical axis of the second fiber optic adapter 420 onto the circuit board 300. Thus, even if the center of the light emitting chip 310 is not on the straight line M, the emitted light signal generated by the light emitting chip 310 can still be transmitted through the first fiber optic adapter 410.

[0093] like Figure 10 and Figure 11As shown, a third groove 433 is formed on the top of the lens assembly body 430, and a third optical surface 4331 is formed on the sidewall of the third groove 433. The third optical surface 4331 is located in the extending direction of the second fiber optic adapter 420. The third optical surface 4331 is used to reflect the received optical signal and change the transmission direction of the received optical signal. In some embodiments, the projection of the third optical surface 4331 in the extending direction of the second fiber optic adapter 420 covers the end face of the fiber optic ferrule in the second fiber optic adapter 420. For example, the third optical surface 4331 changes the transmission direction of the received optical signal from the CD direction to the AB direction, that is, the third optical surface 4331 changes the transmission direction of the emitted optical signal in the length and width directions of the circuit board 300. In some embodiments, a reflective film is provided on the third optical surface 4331 to improve the reflection efficiency of the third optical surface 4331 on the received optical signal.

[0094] like Figure 10 and Figure 11 As shown, a fourth groove 434 is formed on the top of the lens assembly body 430, located between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420. A fourth optical surface 4341 is formed on the sidewall of the fourth groove 434, which reflects the received optical signal to change the transmission direction of the received optical signal. The fourth optical surface 4341 is located above the optical receiving chip 320, and reflects the received optical signal to the optical receiving chip 320. In some embodiments, the projection of the fourth optical surface 4341 in the direction of the circuit board 300 covers the optical receiving chip 320. In some embodiments, a reflective film is provided on the fourth optical surface 4341 to improve the reflection efficiency of the fourth optical surface 4341 for the received optical signal.

[0095] In some embodiments of this disclosure, the third optical surface 4331 and the fourth optical surface 4341 are combined so that the optical receiving chip 320 is positioned between the projection of the optical axis of the first optical fiber adapter 410 onto the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 onto the circuit board 300. Thus, even if the center of the optical receiving chip 320 is not on the straight line N, the received optical signal input through the second optical fiber adapter 420 can still be transmitted to the optical receiving chip 320.

[0096] In some embodiments, a fifth optical surface 4322 is further formed at the bottom of the second groove 432. The fifth optical surface 4322 can both transmit and reflect emitted light signals. The emitted light signal transmitted through the fifth optical surface 4322 is transmitted in the direction of the first optical surface 4311, and the light signal reflected by the fifth optical surface 4322 is used for monitoring the emitted light power of the optical module. In some embodiments, the second optical surface 4321 and the fifth optical surface 4322 intersect within the second groove 432. For example, a backlight detection chip is disposed on the circuit board 300, and the lens assembly 400 is located above the backlight detection chip. The backlight detection chip receives the light signal reflected by the fifth optical surface 4322 to monitor the emitted light power of the optical module.

[0097] In some embodiments, a sixth optical surface 4323 is also formed on the sidewall of the second groove 432. The sixth optical surface 4323 is used to transmit the emitted light signal transmitted through the fifth optical surface 4322 to the direction where the first optical surface 4311 is located.

[0098] In some embodiments of this disclosure, by forming a first groove 431, a second groove 432, a third groove 433 and a fourth groove 434 on the lens assembly body 430, it is convenient to control the thickness of each position of the lens assembly body 430, so as to facilitate the forming of the corresponding optical surface and make the optical surface easy to process.

[0099] Figure 12 A cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure. Figure 1 .like Figure 12 As shown, the first fiber optic adapter 410 is provided with a first through hole 411, and a first fiber optic ferrule 460 is disposed within the first through hole 411. The first fiber optic ferrule 460 is used to couple optical signals from the lens assembly body 430 into the optical fiber 101, thereby improving the coupling efficiency of the transmitted optical signal to the optical fiber 101.

[0100] In some embodiments, a first blind hole 435 is also provided on the lens assembly body 430. One end of the first blind hole 435 is connected to the first through hole 411, and the other end of the first blind hole 435 is provided with a first lens 4351. The first lens 4351 is used to converge the emitted light signal reflected by the first optical surface 4311 to the end face of the first optical fiber ferrule 460.

[0101] In some embodiments, the end face of the first fiber optic ferrule 460 is an inclined surface, and the inclination angle of the end face of the first fiber optic ferrule 460 is 4-7°, which reduces the return of the optical signal reflected by the end face of the first fiber optic ferrule 460 along the transmission optical path of the emitted optical signal.

[0102] Figure 13 A cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure. Figure 2 .like Figure 13As shown, the second fiber optic adapter 420 is provided with a second through hole 421, and a second fiber optic ferrule 470 is disposed within the second through hole 421. The second fiber optic ferrule 470 is used to couple optical signals from the fiber optic cable 101 into the lens assembly body 430, thereby improving the coupling efficiency of the received optical signal to the lens assembly body 430.

[0103] In some embodiments, a second blind hole 436 is also provided on the lens assembly body 430. One end of the second blind hole 436 is connected to the second through hole 421, and the other end of the second blind hole 436 is provided with a second lens 4361. The second lens 4361 is used to collimate the received optical signal output through the end face of the second optical fiber ferrule 470 to the third optical surface 4331.

[0104] In some embodiments, the end face of the second fiber optic ferrule 470 is an inclined surface, and the inclination angle of the end face of the second fiber optic ferrule 470 is 4-7°, which reduces the chance that the received optical signal reflected by the third optical surface 4331 will be reflected back into the transmission optical path of the received optical signal by the end face of the second fiber optic ferrule 470.

[0105] Figure 14 This is a partial structural schematic diagram of a lens assembly body provided according to some embodiments of the present disclosure. Figure 15 A cross-sectional view of a lens assembly in use according to some embodiments of this disclosure. Figure 1 The optical transmitting chip 310 and the optical receiving chip 320 are positioned between the projection of the optical axis of the first optical fiber adapter 410 onto the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 onto the circuit board 300.

[0106] like Figure 14 and Figure 15 As shown, a seventh optical surface 451 and an eighth optical surface 452 are provided on the top surface of the second recess 450. The seventh optical surface 451 is located above the light emitting chip 310 and is used to transmit the emitted light signal generated by the light emitting chip 310; the eighth optical surface 452 is located above the light receiving chip 320 and is used to transmit the received light signal, so that the received light signal is transmitted to the light receiving chip 320.

[0107] In some embodiments, a third lens 4511 is disposed on the seventh optical surface 451, and the third lens 4511 is used to collimate the emitted light signal generated by the collimating light emitting chip 310.

[0108] In some embodiments, a fourth lens 4521 is disposed on the eighth optical surface 452, and the fourth lens 4521 is used to converge the received optical signal to the light receiving chip 320.

[0109] In some embodiments, a fifth groove 453 is provided on the top surface of the second recess 450, and a seventh optical surface 451 and an eighth optical surface 452 are formed on the bottom surface of the fifth groove 453. The relative height of the seventh optical surface 451 and the eighth optical surface 452, i.e., the distance between the seventh optical surface 451 and the light emitting surface of the light emitting chip 310, and the distance between the eighth optical surface 452 and the light receiving surface of the light receiving chip 320, are adjusted by the fifth groove 453.

[0110] In some embodiments, the relative positions of the backlight detection chip, the light emitting chip 310, and the light receiving chip 320 can be adjusted by adjusting the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, etc. For example, the backlight detection chip can be positioned on the line connecting the light emitting chip 310 and the light receiving chip 320, the backlight detection chip can be positioned between the light emitting chip 310 and the light receiving chip 320, or the backlight detection chip can be positioned on the side of the light emitting chip 310 away from the light receiving chip 320.

[0111] In some embodiments, a first backlight detection chip 340 is further disposed below the lens assembly body 430, and a ninth optical surface 454 is formed in the fifth groove 453. The ninth optical surface 454 transmits light signals and transmits the light signals to the first backlight detection chip 340, which receives the light signals to detect the emitted light power of the light emitting chip 310. In some instances, the first backlight detection chip 340 is located between the light emitting chip 310 and the light receiving chip 320, and the ninth optical surface 454 is located between the seventh optical surface 451 and the eighth optical surface 452.

[0112] In some embodiments, a fifth lens 4541 is disposed on the ninth optical surface 454, and the fifth lens 4541 is used to converge the optical signal.

[0113] In some embodiments, the ninth optical surface 454 is an inclined surface, and a stepped surface 4324 is formed on the sidewall of the second groove 432. The stepped surface 4324 is located above the ninth optical surface 454 so as to adjust the thickness of the lens assembly body 430 above the ninth optical surface 454 through the stepped surface 4324, ensuring the formability of the ninth optical surface 454, and thus facilitating the processing of the ninth optical surface 454.

[0114] Figure 16 A cross-sectional view of a lens assembly in use according to some embodiments of this disclosure. Figure 2 , Figure 16 The transmission optical path of a lens assembly 400 is shown. For example... Figure 16As shown, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511, and transmitted to the second optical surface 4321. It is then reflected by the second optical surface 4321 and transmitted to the fifth optical surface 4322. Part of the emitted light signal transmitted to the fifth optical surface 4322 is transmitted through it, and part is reflected by it. The emitted light signal transmitted through the fifth optical surface 4322 is transmitted to the sixth optical surface 4323, passes through it, and is transmitted to the first optical surface 4311, finally being reflected by it. The emitted light signal reflected by the fifth optical surface 4322 is transmitted to the ninth optical surface 454, converged by the fifth lens 4541, and transmitted to the first backlight detection chip 340.

[0115] like Figure 16 As shown, the received optical signal is transmitted to the third optical surface 4331, reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341, reflected by the fourth optical surface 4341 and transmitted to the eighth optical surface 452, and then converged by the fourth lens 4521 and transmitted to the light receiving chip 320.

[0116] In some embodiments of this disclosure, with reference to the light-emitting surface perpendicular to the light-emitting chip 310, the tilt angle of the second optical surface 4321 is α1, the tilt angle of the fifth optical surface 4322 is α2, the tilt angle of the sixth optical surface 4323 is α3, and the tilt angle of the ninth optical surface 454 is α4. The tilt angles α1 of the second optical surface 4321, α2 of the fifth optical surface 4322, α3 of the sixth optical surface 4323, and α4 of the ninth optical surface 454 are coordinated with each other and require reference to the spacing L1 and L2 of the optical surfaces; the specific values ​​are selected through mutual coordination. The spacing between the first backlight detection chip 340 and the light-emitting chip 310 is combined with the tilt angles α1 of the second optical surface 4321, α2 of the fifth optical surface 4322, and α4 of the ninth optical surface 454. Accordingly, the selection of the tilt angle α1 of the second optical surface 4321, the tilt angle α2 of the fifth optical surface 4322, and the tilt angle α4 of the ninth optical surface 454 needs to take into account the distance between the first backlight detection chip 340 and the light emitting chip 310.

[0117] Figure 17 A cross-sectional view of another lens assembly in use according to some embodiments of this disclosure. Figure 1 .like Figure 17As shown, in some embodiments, a second backlight detection chip 350 is disposed on the side of the light emitting chip 310 away from the light receiving chip 320; a tenth optical surface 455 is formed on the top surface of the second recess 450, and the tenth optical surface 455 is located above the second backlight detection chip 350. The tenth optical surface 455 is used to transmit light signals and transmit the light signals to the second backlight detection chip 350; the second backlight detection chip 350 receives the light signals to detect the emitted light power of the light emitting chip 310. Exemplarily, the light signal transmitted to the tenth optical surface 455 is refracted at the tenth optical surface 455, and the light signal refracted by the tenth optical surface 455 is transmitted to the second backlight detection chip 350.

[0118] Figure 18 A cross-sectional view of another lens assembly in use according to some embodiments of this disclosure. Figure 2 , Figure 18 Another lens assembly 400 is shown with its transmission optical path. For example... Figure 18 As shown, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511, and transmitted to the second optical surface 4321. It is reflected by the second optical surface 4321 and transmitted to the fifth optical surface 4322, and then transmitted through the fifth optical surface 4322 to the sixth optical surface 4323. The light transmitted to the sixth optical surface 4323 is partially transmitted through the sixth optical surface 4323 and partially reflected by the sixth optical surface 4323. The emitted light signal transmitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311 and finally reflected by the first optical surface 4311. The light signal reflected by the sixth optical surface 4323 is transmitted to the fifth optical surface 4322 and transmitted through the fifth optical surface 4322 to the second optical surface 4321. It is reflected by the second optical surface 4321 and transmitted to the tenth optical surface 455, and then transmitted through the tenth optical surface 455 to the second backlight detection chip 350.

[0119] In some embodiments of this disclosure, with reference to the light-emitting surface perpendicular to the light-emitting chip 310, the tilt angle of the tenth optical surface 455 is α5. The tilt angle α5 of the tenth optical surface 455 needs to be selected in conjunction with the tilt angle α1 of the second optical surface 4321, the tilt angle α2 of the fifth optical surface 4322, and the tilt angle α3 of the sixth optical surface 4323. The distance between the second backlight detection chip 350 and the light-emitting chip 310 is determined by combining the tilt angle α1 of the second optical surface 4321, the tilt angle α2 of the fifth optical surface 4322, and the tilt angle α5 of the tenth optical surface 455. Accordingly, the selection of the tilt angle α1 of the second optical surface 4321, the tilt angle α2 of the fifth optical surface 4322, and the tilt angle α5 of the tenth optical surface 455 needs to take into account the distance between the second backlight detection chip 350 and the light-emitting chip 310.

[0120] Figure 19This is a cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure. Figure 19 The image shows a transmission optical path for a lens assembly 400. For example... Figure 19 As shown, the emitted optical signal is transmitted through the fifth optical surface 4322 to the first optical surface 4311, reflected by the first optical surface 4311 and transmitted to the first lens 4351, and then converged by the first lens 4351 and transmitted to the first fiber optic ferrule 460 and along the extension direction of the first fiber optic ferrule 460.

[0121] like Figure 19 As shown, the received optical signal is transmitted to the second lens 4361 through the second optical fiber ferrule 470, collimated by the second lens 4361 and transmitted to the third optical surface 4331, and reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341.

[0122] Figure 20 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 1 , Figure 21 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 2 In some embodiments, such as Figure 20 and Figure 21 As shown, the center of the optical receiver chip 320 is located on the projection of the optical axis of the second fiber optic adapter 420 onto the circuit board 300. A sixth groove 437 is provided above the optical receiver chip 320, and an eleventh optical surface 4371 is formed within the sixth groove 437. The eleventh optical surface 4371 is inclined towards the direction of the second fiber optic adapter 420. The received optical signal is transmitted to the eleventh optical surface 4371 through the second fiber optic adapter 420; the eleventh optical surface 4371 reflects the received optical signal, changing the transmission direction of the received optical signal from parallel to the circuit board 300 to perpendicular to the circuit board 300.

[0123] In some embodiments, the eleventh optical surface 4371 is located above the eighth optical surface 452, and the light receiving chip 320 is located below the fourth lens 4521. The received light signal reflected by the eleventh optical surface 4371 is transmitted to the fourth lens 4521, and then converged by the fourth lens 4521 and transmitted to the light receiving chip 320.

[0124] To accommodate the distance requirements between the optical emitting chip 310 and the optical receiving chip 320, the optical emitting chip 310 is moved closer to the position where the optical axis of the second optical fiber adapter 420 is projected on the circuit board 300. That is, compared to the projection of the optical axis of the first optical fiber adapter 410 and the optical receiving chip 320 on the circuit board 300, the optical emitting chip 310 moves towards the direction of the second optical fiber adapter 420, and consequently the second optical surface 4321 and the others move in the same direction.

[0125] Of course, in this embodiment, the center of the light emitting chip 310 can be made close to or located on the optical axis of the first fiber optic adapter 410 projected on the circuit board 300, and the position and combination of the optical surfaces on the lens assembly 400 can be adaptively adjusted.

[0126] In some embodiments, the distance between the center of the optical transmitting chip 310 and the optical axis of the first optical fiber adapter 410 projected on the circuit board 300 is equal to the distance between the center of the optical receiving chip 320 and the optical axis of the second optical fiber adapter 420 projected on the circuit board 300. This makes the optical path length of the transmitted optical signal inside the optical module 200 approximately the same as the process length of the received optical signal, so as to balance the optical path length of the transmitted optical signal and the process length of the received optical signal inside the optical module 200, thereby coordinating the tolerances of the transmitted optical signal transmission path and the received optical signal transmission path.

[0127] In some embodiments, by adjusting the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, etc., the backlight detection chip is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, which helps in the arrangement of the backlight detection chip, such as reducing the limitation of assembly space on the selection of the backlight detection chip.

[0128] Figure 22 For a three-dimensional representation of another lens assembly provided according to some embodiments of the present disclosure Figure 1 , Figure 23 For a three-dimensional representation of another lens assembly provided according to some embodiments of the present disclosure Figure 2 , Figure 24 A cross-sectional view of another lens assembly provided according to some examples of this disclosure. Figure 1 In some embodiments, such as Figure 22 and Figure 23 As shown, the bottom of the second groove 432 forms a second optical surface 4321, a fifth optical surface 4322 and a sixth optical surface 4323. The second optical surface 4321 and the fifth optical surface 4322 do not intersect within the second groove 432, that is, the intersection of the second optical surface 4321 and the fifth optical surface 4322 is not within the second groove 432.

[0129] For example, a first plane 4325 is formed in the second groove 432. The first plane 4325 is perpendicular to the optical axis of the light emitting chip 310. The second optical surface 4321 is located on one side of the first plane 4325, and the fifth optical surface 4322 is located on the other side of the first plane 4325. The second optical surface 4321 and the fifth optical surface 4322 are not symmetrical about the central axis of the first plane 4325.

[0130] Figure 25For a three-dimensional representation of another lens assembly provided according to some embodiments of the present disclosure Figure 3 , Figure 26 for Figure 25 A magnified view of a portion of point O in the middle. Figure 27 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 2 , Figure 28 for Figure 27 A magnified view of a portion of point P in the middle. (See image below.) Figures 25-28 As shown, a twelfth optical surface 456 is formed on the side of the seventh optical surface 451 near the front end of the lens assembly 400. The twelfth optical surface 456 is located below the second optical surface 4321 and is used to refract transmitted light signals. For example, the twelfth optical surface 456 refracts light signals used to monitor the emitted light power of the light emitting chip, and the optical axis of the light signal used to monitor the emitted light power of the light emitting chip deviates from the optical axis of the light emitting chip 310. In some embodiments, the twelfth optical surface 456 is formed on the bottom surface of the twelfth optical surface 456.

[0131] Figure 29 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 3 , Figure 30 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 4 , Figure 31 A cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figure 5 , Figures 29-31 The transmission optical path of another lens assembly 400 is shown. For example... Figure 29 and Figure 30 As shown, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511, and transmitted to the second optical surface 4321. It is then reflected by the second optical surface 4321 and transmitted to the fifth optical surface 4322. Part of the emitted light signal transmitted to the fifth optical surface 4322 is transmitted through it, and part is reflected by it. The emitted light signal transmitted through the fifth optical surface 4322 is transmitted to the sixth optical surface 4323, passes through it, and is transmitted to the first optical surface 4311, finally being reflected by it. The light signal reflected by the fifth optical surface 4322 is transmitted to the second optical surface 4321, reflected by it, and transmitted to the twelfth optical surface 456, and then transmitted to the backlight detection chip.

[0132] like Figure 29 and Figure 31As shown, the received optical signal is transmitted to the third optical surface 4331, reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341, reflected by the fourth optical surface 4341 and transmitted to the eighth optical surface 452, and then converged by the fourth lens 4521 and transmitted to the light receiving chip 320.

[0133] Figure 32 A bottom view of another lens assembly usage state provided according to some embodiments of this disclosure. Figure 1 .like Figure 32 As shown, a third backlight detection chip 360 is also disposed below the lens assembly 400. The third backlight detection chip 360 is located to the right of the light emitting chip 310 and below the twelfth optical surface 456. The third backlight detection chip 360 is closer to the optical port of the optical module 200 than the light emitting chip 310. The third backlight detection chip 360 is not located on the line connecting the light emitting chip 310 and the light receiving chip 320, keeping the third backlight detection chip 360 away from the driver chip 330. This effectively avoids interference between the third backlight detection chip 360 and the layout of the driver chip 330, or effectively avoids interference between the driver chip 330 and the layout of the third backlight detection chip 360. If the size of the third backlight detection chip 360 is relatively large, placing the third backlight detection chip 360 on the light emitting chip 310 can avoid assembly interference between the third backlight detection chip 360 and the driver chip 330.

[0134] Figure 33 A bottom view of another lens assembly usage state provided according to some embodiments of this disclosure. Figure 2 .like Figure 33 As shown, in some embodiments, a fourth backlight detection chip 370 is further disposed below the lens assembly 400. The fourth backlight detection chip 370 is located diagonally opposite the light emitting chip 310, away from the light receiving chip 320, and below the twelfth optical surface 456. The fourth backlight detection chip 370 is closer to the optical port of the optical module 200 than the light emitting chip 310. The fourth backlight detection chip 370 is not located on the line connecting the light emitting chip 310 and the light receiving chip 320, thus keeping the fourth backlight detection chip 370 away from the driver chip 330. This effectively avoids the fourth backlight detection chip 370 interfering with the layout of the driver chip 330, or effectively avoids the driver chip 330 interfering with the layout of the fourth backlight detection chip 370.

[0135] In some embodiments of the present disclosure, the optical module provides that the optical emitting chip 310 and the optical receiving chip 320 are positioned between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420 through the lens assembly 400, so that the optical emitting chip 310 and the optical receiving chip 320 can be close to each other, and the optical emitting chip 310 and the optical receiving chip 320 can share the driving chip 330.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module characterized by comprising: include: The circuit board has a light emitting chip, a light receiving chip, a driver chip, and a backlight detection chip on its surface; The light emitting chip, the light receiving chip, and the backlight detection chip are arranged side by side along the width of the circuit board and are all located on the side of the driver chip near the optical port of the optical module; the light emitting chip and the light receiving chip are both electrically connected to the driver chip; The lens assembly is connected to the circuit board at its bottom and covers the light emitting chip, the light receiving chip, the driving chip, and the backlight detection chip; wherein: The lens assembly includes a lens assembly body, a first optical fiber adapter, and a second optical fiber adapter; the first optical fiber adapter and the second optical fiber adapter are disposed at a first end of the lens assembly body, the first optical fiber adapter is used to transmit transmitted optical signals, and the second optical fiber adapter is used to transmit received optical signals. The center of the light emitting chip, the center of the light receiving chip, and the center of the backlight detection chip are all located between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board. Along the width direction of the circuit board, the lens assembly body has a first optical surface, a second optical surface, a third optical surface, a fourth optical surface, a fifth optical surface, and a sixth optical surface formed thereon; the first optical surface faces the first fiber optic adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located above the light emitting chip; the fifth optical surface and the sixth optical surface are located on the transmission optical path from the second optical surface to the first optical surface, and the emitted light signal generated by the light emitting chip is partially reflected by the fifth optical surface or the sixth optical surface and transmitted to the backlight detection chip; the third optical surface faces the second fiber optic adapter, the fourth optical surface faces the third optical surface and the light receiving chip, and the light receiving chip is located below the fourth optical surface; the second optical surface and the fourth optical surface are located between the optical axis of the first fiber optic adapter and the optical axis of the second fiber optic adapter, and the second optical surface and the fourth optical surface are located between the first optical surface and the third optical surface.

2. The optical module according to claim 1, characterized by A first recess is formed on the top of the lens assembly body, and a first groove and a second groove are formed at the bottom of the first recess. The first optical surface is formed on the sidewall of the first groove, and the second optical surface is formed at the bottom of the second groove.

3. The optical module according to claim 2, characterized by The bottom of the second groove forms the fifth optical surface, and the sidewall of the second groove forms the sixth optical surface; the emitted light signal transmitted through the fifth optical surface is transmitted to the sixth optical surface, and the light signal transmitted through the sixth optical surface is transmitted to the first optical surface.

4. The optical module according to claim 2, characterized by A second recess is formed at the bottom of the lens assembly body, and a seventh optical surface is formed on the top surface of the second recess. The seventh optical surface is located above the light emitting chip and below the second optical surface. A third lens is disposed on the seventh optical surface, and the third lens is used to collimate the emitted light signal generated by the light emitting chip.

5. The optical module according to claim 3, characterized by The backlight detection chip includes a first backlight detection chip, which is located between the light emitting chip and the light receiving chip. A ninth optical surface is formed at the bottom of the lens assembly body. The ninth optical surface is located above the first backlight detection chip. The fifth optical surface is also used to reflect part of the emitted light signal. The emitted light signal reflected by the fifth optical surface is transmitted to the ninth optical surface. A fifth lens is disposed on the ninth optical surface, and the fifth lens is used to converge and emit light signals toward the first backlight detection chip.

6. The optical module according to claim 3, characterized by The backlight detection chip includes a second backlight detection chip, which is located on the side of the light emitting chip away from the light receiving chip; A tenth optical surface is formed at the bottom of the lens assembly body, and the tenth optical surface is located above the second backlight detection chip; The sixth optical surface is also used to reflect part of the emitted light signal. The emitted light signal reflected by the sixth optical surface is transmitted to the fifth optical surface and passes through the fifth optical surface. The light signal passed through the fifth optical surface is transmitted to the second optical surface and reflected by the second optical surface to the tenth optical surface. It is then transmitted through the tenth optical surface to the second backlight detection chip.

7. The optical module according to claim 1, characterized in that, An eleventh optical surface is formed on the lens assembly body, and the eleventh optical surface faces the second fiber optic adapter and the optical receiving chip.

8. The optical module according to claim 1, characterized in that, A first recess is formed on the top of the lens assembly body, and a third groove and a fourth groove are formed at the bottom of the first recess. The third optical surface is formed on the sidewall of the third groove; the fourth optical surface is formed on the wall of the fourth groove.

9. The optical module according to claim 8, characterized in that, The bottom of the lens assembly body is provided with an eighth optical surface, which is located above the light receiving chip and below the fourth optical surface; A fourth lens is disposed on the eighth optical surface, and the fourth lens converges the light receiving chip to receive the light signal.

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