An array substrate driving circuit, an array substrate and a display device

Abstract

The application provides an array substrate driving circuit, an array substrate and a display device, and belongs to the technical field of display devices.The array substrate driving circuit comprises a plurality of connection wires which are arranged at intervals from each other and are used for driving a display area of the array substrate to emit light; at least one side edge of the connection wire is provided with an insulating shielding protection wire which extends along the direction of the connection wire to a signal connection end of the connection wire, and the shielding protection wire is configured to absorb cations as a cathode of an electrolytic cell when electrochemical corrosion occurs.The array substrate driving circuit provided by the application uses the shielding protection wire which is arranged at intervals from the side edge of the connection wire, and the shielding protection wire extends along the direction of the connection wire to the signal connection end of the connection wire, so that the shielding protection wire can weaken the mutual influence between the connection wires, reduce the electric field strength, and prevent cations from being precipitated and gathered to the functional lines to cause line structure failure.

Description

Technical Field

[0001] This invention relates to the field of display device technology, and in particular to an array substrate driving circuit, an array substrate, and a display device. Background Technology

[0002] With the rapid development of display technology, Mini LED (Mini Light Emitting Diode) and Micro LED (Micro Light Emitting Diode) display products have attracted widespread attention.

[0003] However, under long-term working conditions, the interconnecting traces of Mini LEDs or Micro LEDs are prone to electrochemical reactions due to the influence of magnetic fields, which can lead to corrosion problems and reduce the reliability of Mini LED or Micro LED display products. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide an array substrate driving circuit, an array substrate, and a display device to solve the problem of electrochemical corrosion that easily occurs in the connection traces in the prior art.

[0005] To achieve the above objectives, the present invention provides an array substrate driving circuit, comprising:

[0006] Multiple connecting wires spaced apart from each other are used to drive the display area of ​​the array substrate to emit light;

[0007] At least one of the connecting wires is provided with an insulated shielding wire at intervals along its side. The shielding wire extends along the direction of the connecting wire to the signal connection end of the connecting wire. The shielding wire is configured to act as a cathode of the electrolytic cell to absorb cations when electrochemical corrosion occurs.

[0008] Furthermore, the shielding protection wire is an open-circuit conductor;

[0009] The orthographic projection of the shielding protection line on the array substrate does not coincide with the orthographic projection of the connecting wire on the array substrate.

[0010] Furthermore, the shielding protection line is disposed between two spaced connecting wires, and there is a voltage difference between the two spaced connecting wires.

[0011] Furthermore, the shielding protection line and the connecting wire are made of the same material, and the connecting wire and the shielding protection line are fabricated on the array substrate using the same processing technology.

[0012] Furthermore, the connecting wire and the shielding protection wire are located on the same wiring layer.

[0013] Furthermore, the line width of the shielding protection line is 20-200μm; the distance between the shielding protection line and the adjacent connecting wire is not less than 20μm.

[0014] Furthermore, the distance between the shielding protection line and any adjacent connecting wire is the same everywhere.

[0015] Furthermore, the shielding protection wire has a protective bend that bends toward the width direction of the connecting wire, and the extension length of the protective bend is greater than the width of the connecting wire.

[0016] Based on the same inventive concept, this application also provides an array substrate, including the array substrate driving circuit as described in any of the preceding claims; the array substrate further includes:

[0017] A light-emitting device and a driving control device, wherein the light-emitting device is connected to the driving control device via the connecting wire, and the driving control device is configured to control at least one of the light-emitting devices to be turned on or off;

[0018] The orthographic projection of the shielding protection line on the array substrate does not coincide with the orthographic projection of the light-emitting device and the driving control device on the array substrate.

[0019] Based on the same inventive concept, this application also provides a display device, including the array substrate described above.

[0020] As can be seen from the above, the array substrate driving circuit provided by the present invention has insulating shielding lines spaced apart on the sides of the connecting wires. Since the shielding lines extend along the direction of the connecting wires, when the electromagnetic field generated by the connection wires causes cations to migrate, the shielding lines act as the cathode of the electrolytic cell to absorb cations during electrochemical corrosion, so that the electrochemical corrosion is concentrated on the shielding lines, weakening the mutual influence between the connecting wires, reducing the electric field strength, preventing the precipitated cations from accumulating in the functional circuit where the connecting wires are located and causing circuit structure failure, and improving the product reliability of the array substrate driving circuit. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1This is a schematic diagram of part of the wiring structure of the array substrate in an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of a portion of the wiring structure of the array substrate in another embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of a portion of the wiring structure of the array substrate in another embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of a portion of the wiring structure of the array substrate in another embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of a portion of the trace structure of the array substrate in another embodiment of the present invention.

[0027] Explanation of reference numerals in the attached figures

[0028] 1. Light-emitting device; 2. Driver control device; 3. VLED line; 4. LED line; 5. ADDR line; 6. VCC line; 7. GND line; 8. Shielding protection line;

[0029] 81. Protect against bending. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0031] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this invention should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0032] Currently, Mini LED products mainly include PCB (Printed Circuit Board) substrates, FPC (Flexible Printed Circuit) substrates, and glass substrates. Among them, Mini LEDs with glass substrates have advantages such as high precision and strong size compatibility, making them a major research direction for panel manufacturers.

[0033] When using glass as the substrate for Mini LEDs, chemical substances containing metallic elements such as Na, Ca, Ba, Mg, and Al must be added during production to meet the requirements for glass substrate manufacturing and material properties. The traces of Mini LED products are located on the glass substrate. When the product is powered on, current is generated on the traces, creating a voltage difference between different lines. This results in a complex electromagnetic field around the traces. Under the influence of this electric field, metallic elements such as Na, Ca, Ba, Mg, and Al within the glass substrate are released as cations and accumulate around the traces, causing damage to the film structure of the traces. In severe cases, this can lead to circuit breaks, short circuits, and electrochemical corrosion of the traces.

[0034] Due to factors such as design scheme and layout space, some connecting wires are inherently narrow and are more prone to functional failure after being subjected to electrochemical corrosion, which seriously affects the service life of the product.

[0035] Based on the above technical description, one or more embodiments of this application provide an array substrate driving circuit.

[0036] like Figure 1 As shown, the array substrate driving circuit described in this application includes:

[0037] Multiple connecting wires spaced apart from each other are used to drive the display area of ​​the array substrate to emit light;

[0038] At least one of the connecting wires is provided with an insulated shielding line 8 at intervals on its side. The shielding line 8 extends along the direction of the connecting wire to the signal connection end of the connecting wire. The shielding line 8 is configured to act as the cathode of the electrolytic cell to absorb cations when electrochemical corrosion occurs.

[0039] As can be seen from the above description, the array substrate driving circuit described in this application has insulating shielding lines 8 spaced apart on the side of the connecting wires. Since the shielding lines 8 extend along the direction of the connecting wires, they ensure that the shielding lines 8 act as the cathode of the electrolytic cell to absorb cations during electrochemical corrosion. This concentrates the electrochemical corrosion on the shielding lines 8, weakens the mutual influence between the connecting wires, reduces the electric field strength, and prevents the precipitated cations from accumulating in the functional circuit where the connecting wires are located, thus preventing circuit structure failure and improving the product reliability of the array substrate driving circuit.

[0040] It should be noted that the array substrate described in this application is a glass substrate for Mini LEDs in related technologies. Because glass substrates offer higher precision for patterning thin films, they can produce interconnecting wires with more accurate linewidths. Here, the "patterning process" mentioned in the embodiments of this application includes processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping for metallic, inorganic, or transparent conductive materials; and for organic materials, it includes processes such as organic material coating, mask exposure, and development. Deposition can be performed using any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more of spraying, spin coating, and inkjet printing; and etching can be performed using any one or more of dry and wet etching. No specific limitations are made in the embodiments of this application.

[0041] like Figure 1 As shown, in the array substrate driving circuit described in this application, the connecting wires include driving signal lines and power lines. The driving signal lines are connecting wires used to transmit control signals. They are usually output by the control chip (i.e., the driving controller 2) and are used to send control signals such as brightness, color, and flashing frequency to the Mini LED (i.e., the light-emitting device 1). Through appropriate control signals, the driving signal lines can make the Mini LED lamp core flash or change brightness according to predetermined requirements.

[0042] In this example, the drive signal lines generally include ADDR wires, DATA wires, etc. The two ends of the ADDR wire are connected to the output terminal of the control chip and the input terminal of the next adjacent control chip, respectively, for signal transmission between the control chips. The ADDR wire is also connected to the last light-emitting device 1 in the same light-emitting area, which plays a role in controlling the current.

[0043] A power cord is a wire used to transmit power, typically a DC power supply connected to the MiniLED chip to provide the required current and voltage. In MiniLEDs, the power cord can be a direct wire connection or a connection via a plug, connector, or other means. For example, a power cord generally includes a V conductor providing voltage to light-emitting device 1, an LED conductor connecting two light-emitting devices 1 to each other, a VCC conductor providing voltage and current to the driver chip, and a GND conductor for grounding.

[0044] like Figure 1 and Figure 2 As shown, the shielding protection line 8 described in this application is an open-circuit conductor, and the orthographic projection of the shielding protection line 8 on the array substrate does not coincide with the orthographic projection of the connecting conductor on the array substrate. Specifically, the open-circuit conductor, i.e., the shielding protection line 8, is an isolated conductor with both ends disconnected. The shielding protection line 8 itself does not transmit voltage or current. On the one hand, the shielding protection line 8 can interfere with the interaction between the connecting conductors, weaken the electromagnetic field strength, and reduce the seam where metal cations are deposited in the glass substrate. At the same time, when electrochemical corrosion occurs, since the metal cations deposited in the glass substrate gather in the direction of low voltage, the shielding protection line 8 can also act as a carrier to absorb the deposited metal cations, preventing the metal cations from moving to other connecting conductors and causing functional circuit failure.

[0045] Furthermore, when the orthographic projection of the shielding protection line 8 on the array substrate does not coincide with the orthographic projection of the connecting wire on the array substrate, there is no overlapping part between the shielding protection line 8 and the connecting wire. This is to avoid a weak short circuit between the shielding protection line 8 and the connecting wire, which could cause circuit abnormalities.

[0046] It should be noted that, in some preferred embodiments, the shielding protection line 8 and the connecting wire are made of the same material, and the connecting wire and the shielding protection line 8 are fabricated on the array substrate using the same processing technology. In this exemplary case, both the shielding protection line 8 and the connecting wire are made of copper wire, and the shielding protection line 8 and the connecting wire are processed simultaneously, eliminating the need for additional production processes. This makes the installation of the shielding protection line 8 more convenient and compact, effectively reducing production and labor costs.

[0047] Here, an exemplary fabrication process for the connecting wire and shielding protection wire 8 is as follows:

[0048] First, draw the circuit diagram of the connecting wires and shielding protection lines 8 according to the design requirements, and determine the relevant parameters such as the path, width and spacing of the lines. Then, design and prepare the mask according to the circuit diagram. Then, paste the prepared mask onto the glass substrate and expose the area covered by the mask to the etchant. The etchant will erode the exposed area of ​​the glass substrate. The choice of etchant is determined according to the substrate material and the etching depth requirements. During the etching process, the circuit pattern on the mask will be protected, while the area exposed outside the mask will be etched away. After etching, the substrate is removed from the etchant and cleaned to remove the residual etchant and mask. Finally, the preset connecting wires and shielding protection lines 8 are formed on the glass substrate.

[0049] In the above embodiments, the shielding protection line 8 and the connecting wire are both located on the same wiring layer. The manufacturing process of the shielding protection line 8 on the same wiring layer is the same as that of the connecting wire, except that the shielding protection line 8 is an open-circuit wire.

[0050] In some embodiments, the principle for setting the shielding protection line 8 is as follows: a shielding protection line 8 is set between connecting wires with different voltages, different currents, and different waveforms. The shielding protection line 8 is used to eliminate signal interference between the two connecting wires.

[0051] like Figure 3 As shown, in some embodiments, the shielding protection line 8 is disposed between two spaced connecting wires with a voltage difference. Here, an electromagnetic field is more easily generated between the two connecting wires with a voltage difference. Metal cations deposited on the glass substrate are more likely to migrate towards the connecting wires under the influence of the electromagnetic field, causing electrochemical corrosion. Distributing the shielding protection line 8 between the two connecting wires with a voltage difference effectively ensures the shielding effect between the two connecting wires, preventing metal cations from accumulating on the lower potential connecting wire and avoiding electrochemical corrosion due to the voltage difference.

[0052] like Figure 3 As shown, in some embodiments, VLED line 3 is connected to light-emitting device 1, and light-emitting device 1 is connected in series to light-emitting device 1 via LED line 4. After multiple light-emitting devices 1 are connected in series, the last light-emitting device 1 in the light-emitting area is connected to drive control device 2 via ADDR line 5. ADDR line 5 is also used to connect to adjacent drive control device 2. Two adjacent drive control devices 2 are connected via VCC line 6. At the same time, each drive control device 2 is also connected to GND line 7.

[0053] In some embodiments, a shielding protection line 8 is selected to be set at a location with high corrosion incidence. The location with high corrosion incidence can be determined by the product reliability testing process. For example, after the product reliability test, microscopic inspection reveals that the electrochemical corrosion phenomenon is relatively concentrated between the LED line 4 and the adjacent VLED line 3. Therefore, a shielding protection line 8 can be set between the LED line 4 and the VLED line 3. The extension length of the shielding protection line 8 is greater than that of the LED line 4.

[0054] Furthermore, in some embodiments, according to the equivalent model of uneven linewidth series connection, the voltage difference is inversely proportional to the linewidth of the connecting wire in the corresponding region; the wider the linewidth, the lower the voltage difference in the corresponding region. According to the principle of electrochemical corrosion, the existence of potential difference accelerates ion movement, thereby accelerating the electrochemical corrosion rate. In addition, in the driving circuit of the series-connected light-emitting device 1, with the same current, the wider the linewidth, the lower the current density, and the slower the ion movement speed, thus slowing down the electrochemical corrosion rate. Therefore, it can be determined that the narrower the linewidth of the connecting wire, the easier it is for electrochemical corrosion to occur. Therefore, setting a shielding protection line 8 next to the connecting wire with a narrower linewidth can effectively slow down the electrochemical corrosion efficiency of the connecting wire and improve product reliability.

[0055] In the above embodiments, due to spatial constraints and layout design, the actual LED line 4 has a bent portion for avoidance. Here, it is determined by... Figure 2 As can be seen from the figure, the dashed box A represents the part of the circuit where the shielding protection line 8 is not completely isolated. When the shielding protection line 8 is only linearly set between the LED line 4 and the VLED line 3, the shielding protection line 8 does not completely separate the bent part of the LED line 4 from the VLED line 3, and the LED line 4 and the VLED line 3 still have the risk of mutual interference.

[0056] Therefore, preferably, the shielding protection line 8 is arranged parallel to the connecting wire. The design principle of this parallel arrangement is that it is parallel to the connecting wire with the bend, and the distance between the shielding protection line 8 and any bend in the connecting wire is the same everywhere, so as to ensure that the shielding protection line 8 completely shields and separates two adjacent connecting wires.

[0057] like Figure 4 As shown, Figure 4 The intermediate shielding protection line 8 is set parallel to the direction of LED line 4, thereby completely separating and shielding LED line 4 and VLED line 3, ensuring the separation effect between the two.

[0058] As an alternative implementation method, such as Figure 3 As shown, Figure 3The shielding protection line 8 located on the left is set parallel to the direction of the VLED line 3. Since the bent part of the VLED line 3 also has a corresponding shielding protection line 8, the shielding protection line 8 completely separates and shields the LED line 4 and the VLED line 3, ensuring the separation effect between the two.

[0059] Depend on Figure 3 As can be seen, the upper end of the shielding protection line 8 extends beyond the signal connection end of the LED line 4, and the lower end extends beyond the signal connection end of the VLED line 3 in the horizontal direction. This setting can effectively ensure the shielding and isolation effect of the shielding protection line 8 on the VLED line 3 and the LED line 4.

[0060] Of course, the routing of the shielding protection line 8 is only an example for illustration. Its design principle is to ensure that two adjacent connecting wires are completely separated and shielded. In some embodiments, due to factors such as spatial arrangement and design avoidance principles, the shielding protection line 8 may not be parallel to any connecting wire, but may be arranged at an angle relative to the connecting wire, or the shielding protection line 8 may have a bend to avoid other related functional components.

[0061] In the above embodiments, the distance between the shielding protection line 8 and the LED line 4 is the same as the distance between the shielding protection line 8 and the VLED line 3. That is, the shielding protection line 8 is located on the midline between the LED line 4 and the VLED line 3. In some embodiments, the shielding protection line 8 can also be set close to the LED line 4 or close to the VLED line 3. The distance between the shielding protection line 8 and the adjacent connecting wires should not be less than 20μm.

[0062] like Figure 5 As shown, in some embodiments, the shielding protection line 8 has a protective bend 81 that bends towards the width direction of the connecting wire, and the extension length of the protective bend 81 is greater than the width of the connecting wire. Here, the protective bend 81 of the shielding protection line 8 is used to separate the linewidth of the shielded connecting wire, preventing metal cations precipitated from the glass substrate from accumulating in the linewidth area of ​​the connecting wire. Here, by example, the extension length of the protective bend 81 of the shielding protection line 8 is positively correlated with the linewidth of the connecting wire; the wider the linewidth of the connecting wire, the longer the protective bend 81 of the shielding protection line 8, ensuring that the protective bend 81 of the shielding protection line 8 completely covers and shields the linewidth of the connecting wire.

[0063] In some embodiments, when the light-emitting devices 1 are densely arranged, the spacing between adjacent LED lines 4 is small, and electrochemical corrosion can easily occur between adjacent LED lines 4 due to their interaction. To reduce the risk of electrochemical corrosion between adjacent LED lines 4, shielding protection lines 8 can be provided on both sides of the LED lines 4. Figure 5In the diagram, the shielding line 8 located to the left of LED line 4 is used to shield the interaction between LED line 4 and VLED line 3, while the shielding line 8 located to the right of LED line 4 is used to shield the interaction between two adjacent LED lines 4. Of course, when the spacing between LED lines 4 containing the light-emitting device 1 is large, the shielding line 8 on the side of LED line 4 can be omitted.

[0064] Similarly, in some embodiments, shielding protection lines 8 are provided between other related connecting wires within the same light-emitting area to further reduce the risk of product failure. Here, for connecting wires with different orientations, the shielding protection lines 8 are arranged parallel to the orientation of the connecting wires. Since the line widths and spacings of different connecting wires in the driving circuit are different, the shielding protection lines 8 can also be flexibly adjusted according to the actual placement, as long as the isolation effect between adjacent connecting wires is guaranteed.

[0065] In the above embodiments, exemplary examples are as follows: Figure 5 As shown, a shielded protection line 8 is provided between GND line 7 and VCC line 6; a shielded protection line 8 is provided between VCC line 6 and ADDR line 5; a shielded protection line 8 is provided between ADDR line 5 and LED line 4; and a shielded protection line 8 is provided between LED line 4 and VLED line 3. The routing of each shielded protection line 8 follows the direction of the adjacent connecting wire and extends to the signal connection end of the connecting wire. It should be noted that the signal connection end of the connecting wire refers to the end where the connecting wire connects to other related connecting wires; the signal connection end is generally connected to other components by soldering. Here, the shielded protection lines 8 between each connecting wire are all open-circuit wires, that is, disconnected islanded traces.

[0066] Furthermore, in Figure 5 As can be seen from the figure, after the VLED line 3 is connected to the light-emitting device 1, there is an LED line 4 connecting the light-emitting devices 1. The LED line 4, which extends horizontally in the figure, is not adjacent to other connecting wires. In order to ensure the normal function of the LED line 4, shielding protection lines 8 can be set on the adjacent sides of the LED line 4.

[0067] In some embodiments, the line width of the shielding protection line 8 is 20-200 μm; the distance between the shielding protection line 8 and the adjacent connecting wire is not less than 20 μm. Here, the distance between the shielding protection line 8 and the adjacent connecting wire cannot be too small to avoid weak short circuits, but there is no upper limit to the distance between the shielding protection line 8 and the adjacent connecting wire, as long as it can effectively isolate and separate the connecting wire, thus ensuring the separating function of the shielding protection line 8 while meeting design requirements. Furthermore, a shielding protection line 8 with a line width greater than 20 μm can sufficiently absorb metal cations, preventing metal cations from overflowing into adjacent connecting wires.

[0068] Based on the same inventive concept, this application also provides an array substrate, which is provided with the array substrate driving circuit as described in any of the above embodiments, and the array substrate further includes:

[0069] The light-emitting device 1 and the driving control device 2 are provided. The light-emitting device 1 is connected to the driving control device 2 via the connecting wire. The driving control device 2 is configured to control at least one of the light-emitting devices 1 to turn on or off.

[0070] The orthographic projection of the shielding protection line 8 on the array substrate does not coincide with the orthographic projections of the light-emitting device 1 and the driving control device 2 on the array substrate.

[0071] Here, the array substrate described in this application includes multiple light-emitting devices 1 and multiple driving control devices 2. As exemplarily shown in the figure, in the Mini LED array substrate, one light-emitting area includes four Mini LED light-emitting devices 1. These four Mini LED light-emitting devices 1 are simultaneously controlled to turn on or off by a single driving control device 2 (IC, Integrated Circuit Chip). The positive terminal of the Mini LED light-emitting device 1 is electrically connected to the VLED line 3, and the negative terminal of the Mini LED light-emitting device 1 is electrically connected to the GND line 7 through the driving control device 2. The VCC line 6 is configured to provide power to the driving control device 2.

[0072] Specifically, as shown in the figure, the positive (P) terminal of the first Mini LED light-emitting device 1 is directly electrically connected to the VLED line 3. The negative (N) terminal of the first Mini LED light-emitting device 1 and the positive terminal of the second Mini LED light-emitting device 1 are electrically connected through the LED line 4. The negative terminal of the second Mini LED light-emitting device 1 and the positive terminal of the third Mini LED light-emitting device 1 are electrically connected through the LED line 4. The negative terminal of the third Mini LED light-emitting device 1 and the positive terminal of the fourth Mini LED light-emitting device 1 are electrically connected through the LED line 4. The negative terminal of the fourth Mini LED light-emitting device 1 is electrically connected through the driver control device 2 and the GND line 7.

[0073] In the embodiments of this application, since the light-emitting devices 1 located in a light-emitting area are all electrically connected to the GND line 7 through a driving control device 2, in practical applications, the voltage difference between the driving control device 2 and the nearby GND line 7 is very small, and the probability of electrochemical reaction is low. Even if an electrochemical reaction occurs, the corrosion effect on the connecting wires around the driving control device 2 is very small and will hardly affect the array substrate. Therefore, there is no need to set a shielding protection line 8 for the driving control device 2.

[0074] In the aforementioned array substrate, the extended end of the shielding protection line 8 is spaced apart from the light-emitting device 1, and the extended end of the shielding protection line 8 is spaced apart from the driving control device 2. The shielding protection line 8 does not pass through the light-emitting device 1 and the driving control device 2, thereby preventing short circuits between the pads. Furthermore, the distance from the extended end of the shielding protection line 8 to the pads where the light-emitting device 1 and the driving control device 2 are located is not less than 20 μm.

[0075] It should be noted that the above embodiment describes the placement of the shielding protection line 8 in a single-channel IC. The driving circuit on the array substrate is divided into multiple matrices or arrays, each typically consisting of multiple light-emitting devices 1. A single-channel IC can only control the brightness and grayscale of the light-emitting device 1 within one channel or one light-emitting area. Using a single-channel IC design means that the brightness adjustment of the lamp group within each light-emitting area is uniform, making precise control of individual LEDs impossible. This setup reduces cost and complexity.

[0076] In some embodiments, for applications requiring higher levels of brightness adjustment and color accuracy, multi-channel ICs are typically used. Multi-channel ICs have multiple independent control channels, enabling more precise brightness and color control. When using a multi-channel IC, the shielding protection line 8 can be configured in the same way as in a single-channel IC.

[0077] It is understood that the light-emitting device 1 is not limited to mini LED or micro LED. In some other embodiments, the light-emitting device 1 may also be an OLED.

[0078] Based on the same inventive concept, this application also provides a display device, including the array substrate described above.

[0079] Since the display device includes the aforementioned array substrate, it has the same beneficial effects, which will not be repeated here.

[0080] In some embodiments, the display device may be a liquid crystal display device, which includes a liquid crystal panel and a backlight disposed on the non-display side of the liquid crystal panel, the backlight including an array substrate described in any of the preceding embodiments. This liquid crystal display device can have more uniform backlight brightness and better display contrast.

[0081] In another embodiment, the array substrate in the display device is used as a display substrate. When the array substrate is used as a display substrate, each inorganic light-emitting diode serves as a sub-pixel.

[0082] This application does not impose specific limitations on the application of display devices, which can be any product or component with display function, such as televisions, laptops, tablets, wearable display devices, mobile phones, in-vehicle displays, navigation systems, e-books, digital photo frames, and advertising light boxes.

[0083] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this disclosure (including the claims) is limited to these examples; within the framework of this invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in the details for the sake of brevity.

[0084] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0085] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0086] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. An array substrate driving circuit, characterized in that, include: Multiple connecting wires spaced apart from each other are used to drive the display area of ​​the array substrate to emit light; Among them, at least one of the connecting wires is provided with an insulating shielding line at intervals on its side. The shielding line extends along the direction of the connecting wire to the signal connection end of the connecting wire. The shielding line and the connecting wire are located on the same wiring layer, and the connecting wire and the shielding line on the same wiring layer are simultaneously prepared on the array substrate by the same processing technology. The shielding protection line is an open-circuit conductor, and there is a voltage difference between the two spaced connecting conductors. The shielding protection line is disposed between the two spaced connecting conductors and can form an electrolytic cell with the connecting conductors during electrochemical corrosion. The connecting conductors are the anode of the electrolytic cell during electrochemical corrosion, and the shielding protection line is the cathode of the electrolytic cell during electrochemical corrosion. The metal cations deposited on the glass substrate of the array substrate migrate due to the voltage difference, and the shielding protection line can absorb the metal cations deposited on the glass substrate, thereby protecting the connecting conductors.

2. The array substrate driving circuit according to claim 1, characterized in that, The orthographic projection of the shielding protection line on the array substrate does not coincide with the orthographic projection of the connecting wire on the array substrate.

3. The array substrate driving circuit according to claim 1, characterized in that, The shielding protection wire is made of the same material as the connecting wire.

4. The array substrate driving circuit according to claim 1, characterized in that, The line width of the shielding protection line is 20-200μm; the distance between the shielding protection line and the adjacent connecting wire is not less than 20μm.

5. The array substrate driving circuit according to claim 1, characterized in that, The distance between the shielding protection line and any adjacent connecting wire is always the same.

6. The array substrate driving circuit according to claim 1, characterized in that, The shielding protection wire has a protective bend that bends toward the width direction of the connecting wire, and the extension length of the protective bend is greater than the width of the connecting wire.

7. An array substrate, characterized in that, Includes the array substrate driving circuit as described in any one of claims 1-6; The array substrate further includes: A light-emitting device and a driving control device, wherein the light-emitting device is connected to the driving control device via the connecting wire, and the driving control device is configured to control at least one of the light-emitting devices to be turned on or off; The orthographic projection of the shielding protection line on the array substrate does not coincide with the orthographic projection of the light-emitting device and the driving control device on the array substrate.

8. A display device, characterized in that, Includes the array substrate as described in claim 7.

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