Driving circuit board, manufacturing method thereof, display panel and vehicle lamp

Abstract

The application discloses a driving circuit board and a manufacturing method thereof, a display panel and a vehicle lamp, and belongs to the technical field of display. The driving circuit board disclosed by the application has a wiring area and a first binding area located on one side of the wiring area. The driving circuit board comprises a first substrate layer, a green oil layer and a first connecting solder. The green oil layer is arranged on one side of the first substrate layer and has a first opening penetrating along the thickness direction of the green oil layer. The first opening is located in the first binding area. The first connecting solder is arranged on the first substrate layer and located in the first opening. The first opening has a first side wall and a second side wall arranged oppositely along the length direction of the first connecting pad. The green oil layer has a first groove part. The first groove part is located in the wiring area and arranged on the side, away from the second side wall, of the first side wall. In the process of coating the green oil layer with a protective material, the protective material is prevented from flowing into the first opening.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a driving circuit board and its manufacturing method, a display panel, and vehicle lights. Background Technology

[0002] With the development of technology, the application of OLED (Organic Light Emitting Display) devices is becoming increasingly widespread, for example, in automotive headlights. However, OLED headlights, as exterior components, still have many issues regarding weather resistance, such as waterproofing, dustproofing, and corrosion resistance. To address this, in the design of new products, a conformal coating scheme has been proposed to improve the corrosion resistance of OLED headlights by introducing a three-proof coating into the driver circuit board design. However, in current conformal coating schemes, due to the high fluidity of the conformal coating, it easily flows into the gold finger area of ​​the driver circuit board, thus affecting the bonding effect between the flexible circuit board and the driver circuit board, significantly reducing the yield rate of the bonding between the flexible circuit board and the driver circuit board. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a driving circuit board and its manufacturing method, a display panel and a vehicle light.

[0004] A first aspect of the present invention provides a driver circuit board. The driver circuit board has a wiring area and a first bonding area located on one side of the wiring area. Specifically, the driver circuit board includes:

[0005] First substrate layer;

[0006] A green oil layer is disposed on one side of the first substrate layer;

[0007] The green oil layer has a first opening extending through its thickness; the first opening is located in the first bonding area;

[0008] A first bonding pad is disposed on the first substrate layer and located within the first opening; wherein,

[0009] The first opening has a first sidewall and a second sidewall disposed opposite to each other along a second direction; the second direction is the length direction of the first connecting pad;

[0010] The green oil layer has a first groove; the first groove is located in the wiring area and is disposed on the side of the first sidewall away from the second sidewall.

[0011] In some embodiments, the length of the first groove along the first direction is not less than the length of the first opening along the first direction; the first direction is the length direction of the first substrate layer, and the first direction and the second direction intersect.

[0012] In some embodiments, the length of the first groove along the first direction is equal to the length of the first substrate layer, and the first groove includes a second opening and a third opening disposed opposite to each other along the first direction, the first groove communicating with the outside through the second opening and the third opening.

[0013] In some embodiments, the first groove includes: a plurality of sub-grooves spaced apart; a first gap is defined between every two adjacent first connection pads; wherein,

[0014] The sub-grooves are provided in a one-to-one correspondence with the first gap, and the length of the sub-grooves along the first direction is not less than the length of the first gap along the first direction.

[0015] In some implementations, the driver circuit board further includes:

[0016] The first protective layer is located in the wiring area and covers the portion of the green oil layer located in the wiring area.

[0017] In some implementations, the first protective layer includes conformal coating.

[0018] A second aspect of the present invention provides a display panel, comprising: a display substrate and a driving circuit board as described in any of the preceding embodiments; the display substrate and the driving circuit board are electrically connected.

[0019] In some embodiments, the display panel further includes:

[0020] A flexible circuit board, wherein the display substrate and the driving circuit board are electrically connected through the flexible circuit board.

[0021] In some embodiments, the flexible circuit board includes a first side and a second side disposed along its thickness direction, and has a second connection pad on the first side and a third connection pad on the second side; wherein the first side faces the display substrate and the second side faces the driving circuit board.

[0022] The flexible circuit board is electrically connected to the display substrate through the second connecting pad and electrically connected to the first connecting pad through the third connecting pad.

[0023] In some embodiments, the display panel further includes:

[0024] A second protective layer is disposed on the first side, and its orthographic projection on the first side at least covers the orthographic projection of the first opening on the first side.

[0025] In some embodiments, the second protective layer includes a waterproof adhesive.

[0026] In some embodiments, the display substrate includes a support layer, an encapsulation layer, and a display layer stacked together; the flexible circuit board is disposed on the same layer as the encapsulation layer and is spaced a certain distance from the encapsulation layer; the flexible circuit board is electrically connected to the display layer through the second connecting pad.

[0027] In some embodiments, the display panel further includes:

[0028] A third protective layer and a fourth protective layer are stacked on the side of the flexible circuit board opposite to the display layer;

[0029] The third protective layer at least covers the accommodating space defined by the flexible circuit board and the encapsulation layer; the fourth protective layer covers the third protective layer.

[0030] In some embodiments, the third protective layer comprises a UV-curable adhesive; the fourth protective layer comprises a waterproof adhesive.

[0031] A third aspect of the present invention provides a method for manufacturing a driver circuit board, the driver circuit board having a wiring area and a first bonding area located on one side of the wiring area, the method comprising:

[0032] Forming the first substrate layer;

[0033] A green oil layer is formed on one side of the first substrate layer; the green oil layer has a first opening extending through its thickness direction; the first opening is located in the first bonding area;

[0034] A first connection pad is formed on the first substrate layer, and the first connection pad is located within the first opening; wherein...

[0035] The first opening has a first sidewall and a second sidewall disposed opposite to each other along a second direction; the second direction is the length direction of the first connecting pad;

[0036] The green oil layer has a first groove; the first groove is located in the wiring area and is disposed on the side of the first sidewall away from the second sidewall.

[0037] A fourth aspect of the present invention provides a vehicle light, the vehicle light including: a display panel as described in any of the preceding embodiments. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of a drive circuit board after being coated with conformal coating.

[0040] Figure 2 This is a schematic diagram of the structure of a drive circuit board provided in an embodiment of the present disclosure;

[0041] Figure 3 for Figure 2 The diagram shows the structure of the drive circuit board along the AA direction.

[0042] Figure 4 This is a schematic diagram of the structure of a drive circuit board provided in an embodiment of the present disclosure;

[0043] Figure 5 This is a schematic diagram of the structure of a drive circuit board provided in an embodiment of the present disclosure;

[0044] Figure 6 This is a schematic diagram of the structure of a drive circuit board provided in an embodiment of the present disclosure;

[0045] Figure 7 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present disclosure;

[0046] Figure 8 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present disclosure;

[0047] Figure 9 This is a schematic diagram of the structure of a display substrate provided in an embodiment of the present disclosure;

[0048] Figure 10 This is a schematic diagram of the structure of a display substrate provided in an embodiment of the present disclosure;

[0049] Figure 11 This is a schematic diagram of the structure of a display substrate provided in an embodiment of the present disclosure;

[0050] Figure 12 This is a schematic diagram of the structure of a protective film for a display substrate provided in an embodiment of the present disclosure. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to specific examples and the accompanying drawings. However, it should be understood that the disclosed embodiments are merely examples, and other embodiments may take various alternative forms. The drawings are not necessarily drawn to scale; some functions may be exaggerated or minimized to show details of specific components. Therefore, the specific structural and functional details disclosed herein should not be construed as limiting, but merely as a representative basis for teaching those skilled in the art to use this application in various ways. As will be understood by those skilled in the art, various features shown and described with reference to any of the drawings may be combined with features shown in one or more other drawings to produce embodiments not explicitly shown or described. The combinations of features shown provide representative embodiments for typical applications. However, various combinations and modifications of features consistent with the teachings of this disclosure may be desirable for certain particular applications or implementations.

[0052] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising,” “including,” or “including,” and similar terms mean that the element or object preceding the word encompasses the element or object listed after the word and its equivalents, without excluding other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” etc., are used only to indicate relative positional relationships, which may change accordingly when the absolute position of the described objects changes. The term “and / or,” when used to list two or more items, means that it may include any one of the listed items, or any combination of two or more of the listed items.

[0053] Figure 1 This is a schematic diagram of a driver circuit board after being coated with conformal coating. Figure 1As shown, the driver circuit board has a gold finger area 001 and a wiring area 002. The driver circuit board has metal connection pads 003 in the gold finger area 001. In related technologies, to increase the weather resistance of the driver circuit board, such as water resistance, dust resistance, and corrosion resistance, the wiring area 002 of the driver circuit board is generally coated with conformal coating 004. However, in conformal coating schemes, due to the high fluidity of conformal coating 004, it easily flows into the gaps between the metal connection pads 003, thus affecting the bonding effect between the flexible circuit board and the driver circuit board, and greatly reducing the yield rate of the bonding between the flexible circuit board and the driver circuit board.

[0054] To address the above problems, a first aspect of the present invention provides a driving circuit board. Figure 2 This is a schematic diagram of the structure of a drive circuit board provided in an embodiment of the present disclosure; Figure 3 for Figure 2 The diagram shows the structure of the drive circuit board along the AA direction. Figure 4 This is a schematic diagram of the structure of a drive circuit board provided in an embodiment of the present disclosure; Figure 5 This is a schematic diagram of the structure of a drive circuit board provided in an embodiment of the present disclosure; Figure 6 This is a schematic diagram of a drive circuit board provided in an embodiment of this disclosure. (Refer to...) Figures 2 to 6 The driving circuit board has a wiring area 1 and a first bonding area 2 located on one side of the wiring area 1. The driving circuit board includes a first substrate layer 10, a solder mask layer 20 disposed on one side of the first substrate layer 10, and a first connection pad 30. The solder mask layer 20 has a first opening 21 extending through its thickness direction; the first opening 21 is located in the first bonding area, and the first connection pad 30 is located within the first opening 21. The first opening 21 has a first sidewall 210 and a second sidewall 220 disposed opposite each other along a second direction Y; the solder mask layer 20 has a first groove 22; the first groove 22 is located in the wiring area 1 and is disposed on the side of the first sidewall 210 away from the second sidewall 220. The length of the first groove 22 along the first direction X is not less than the length of the first opening 21 along the first direction X. The first direction X is the length direction of the first substrate layer, and the second direction Y is the length direction of the first connection pad; the first direction X and the second direction Y intersect. In this embodiment, the first direction X and the second direction Y are described as perpendicular, but the method is not limited thereto.

[0055] In the actual production process of the driver circuit board, depending on the application and operating conditions, in some possible implementations, a protective material, such as conformal coating, needs to be applied to the surface of the green solder mask 20 facing away from the first substrate layer 10 to improve the protective performance of the driver circuit board. In this embodiment, by making the length of the first groove 22 of the green solder mask 20 along the length direction of the first substrate layer greater than or equal to the length of the first opening 21 along the length direction of the first substrate layer, the protective material is prevented from flowing into the first opening 21 due to its fluidity during the coating process, thereby improving the bonding effect between the driver circuit board and other circuit boards or other devices with connecting pads.

[0056] In some examples, such as Figure 4 As shown, the first groove 22 includes: a plurality of sub-grooves 223 spaced apart; a first gap 301 is defined between every two adjacent first connection pads 30; wherein the sub-grooves 223 and the first gaps 301 are arranged in a one-to-one correspondence, and the length of the sub-grooves 223 along the first direction is not less than the length of the first gaps 301 along the first direction.

[0057] By using multiple sub-grooves 223 spaced apart, the protective material is prevented from flowing into the corresponding first gap 21 during the coating process, thus improving the bonding effect between the drive circuit board and other circuit boards or other devices with connecting pads.

[0058] In some examples, such as Figure 5 As shown, the length of the first groove 22 along the first direction X is equal to the length of the first substrate layer 10, and the first groove 22 includes a second opening 221 and a third opening 222 disposed opposite to each other along the first direction. The first groove communicates with the outside through the second opening 221 and the third opening 222.

[0059] By increasing the length of the first groove 22, the blocking effect of the first groove 22 on the protective material is further improved, preventing the protective material from flowing into the first opening 21.

[0060] In some examples, such as Figure 6 As shown, the drive circuit board also includes a first protective layer 40, located in the wiring area 1 and covering the portion of the green solder mask 20 located in the wiring area 1. Specifically, the first protective layer 40 includes conformal coating, but is not limited to this, and may also include other protective materials.

[0061] By applying conformal coating to the portion of the green oil layer 20 of the drive circuit board located in the wiring area 1, the waterproofness, dustproofness, and corrosion resistance of the drive circuit board are improved. Furthermore, since the length of the first groove 22 of the green oil layer 20 along the length direction of the first substrate layer is greater than or equal to the length of the first opening 21 along the length direction of the first substrate layer, the conformal coating process avoids the conformal coating from flowing into the first opening 21 over a large area due to its high fluidity, thus improving the bonding effect between the drive circuit board and other circuit boards or other devices with connecting pads.

[0062] In some embodiments, for such Figure 2 The fabrication method of the driver circuit board shown is explained below. The specific fabrication method of this driver circuit board is as follows:

[0063] S10, Forming the first substrate layer 10.

[0064] S20, a green oil layer 20 is formed on one side of the first substrate layer 10. The green oil layer 20 has a first opening 21 extending through its thickness direction; the first opening 21 is located in the first bonding area 2. The first opening 21 has a first sidewall 210 and a second sidewall 220 disposed opposite to each other along the second direction Y.

[0065] S30. A first groove 22 is formed on the side of the green oil layer 20 away from the first substrate layer 10. The first groove 22 is located in the wiring area 1 and is disposed on the side of the first sidewall 210 away from the second sidewall 220. Specifically, the first groove 22 can be fabricated by laser cutting or etching. The shape of the first groove 22 is not limited here; for example, the first groove 22 can be U-shaped, rectangular, arc-shaped, etc.

[0066] S40. A first connection pad 30 is formed on the first substrate layer 10, and the first connection pad 30 is located within the first opening 21. The first opening 21 has a first sidewall 210 and a second sidewall 220 disposed opposite to each other along the second direction Y.

[0067] S50, a first protective layer 40 is formed on the side of the varnish layer 20 facing away from the first substrate layer 10. The first protective layer 40 is located in the wiring area 1 and covers the portion of the varnish layer 20 located in the wiring area 1. The first protective layer 40 may include conformal coating, but is not limited thereto, and may also include other protective materials.

[0068] Specifically, conformal coating can be applied directly to the green oil layer 20, but it is not limited to this. Depending on the application scenario of the drive circuit board, conformal coating can also be applied to the green oil layer 20 after the components are processed onto the drive circuit board.

[0069] The drive circuit board manufactured by the above method avoids the conformal coating from flowing into the first opening 21 over a large area due to its high fluidity, thus improving the bonding effect between the drive circuit board and other circuit boards or other devices with connecting pads.

[0070] The driving circuit board described above can be applied to a display panel. Based on the same inventive concept, a second aspect of this invention provides a display panel.

[0071] Figure 7 This is a schematic diagram of the structure of a display panel provided in an embodiment of this disclosure. Figure 7 As shown, the display panel includes a display substrate 100 and a driving circuit board 200. The display substrate 100 and the driving circuit board 200 are electrically connected.

[0072] Figure 8 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present disclosure; Figure 9 This is a schematic diagram of the structure of a display substrate provided in an embodiment of the present disclosure; Figure 10 This is a schematic diagram of the structure of a display substrate provided in an embodiment of the present disclosure; Figure 11 This is a schematic diagram of the structure of a display substrate provided in an embodiment of the present disclosure; Figure 12 This is a schematic diagram of the structure of a protective film for a display substrate provided in an embodiment of this disclosure. Figure 8 As shown, the display substrate 100 includes a support layer 101, an encapsulation layer 102, and a display layer 103 stacked together. The encapsulation layer 102 protects the display layer 103, preventing external moisture and oxygen from entering the display layer. The support layer 101 provides support for the display layer 103. The support layer 101 can be made of metal, such as aluminum alloy, titanium alloy, or stainless steel (SUS). The display layer of this disclosure can be a bottom-emitting display layer. The light-emitting side of the display layer 103 is in the direction Z, away from the support layer 101.

[0073] In some examples, such as Figure 9 As shown, the display layer 103 of the display substrate 100 can be a rigid display layer, and the encapsulation layer 102 of the display substrate 100 can also be a rigid encapsulation layer. Specifically, along the direction away from the support layer 101 of the display substrate 100, the encapsulation layer 102 includes encapsulation glass, pressure-sensitive adhesive, and Frit adhesive, which are used to bond the encapsulation glass to the display layer 103. The display layer 103 includes a light-emitting layer, a driving circuit layer, and a glass substrate. The display substrate 100 with this structure has a wide range of applications and can be used for various planar sizes.

[0074] In some examples, such as Figure 10As shown, the display layer 103 of the display substrate 100 can also be a flexible display layer, and the encapsulation layer 102 of the display substrate 100 can also be a rigid encapsulation layer. Specifically, along the direction away from the support layer 101 of the display substrate 100, the encapsulation layer 102 includes encapsulation glass, pressure-sensitive adhesive, and frizz adhesive, which are used to bond the encapsulation glass to the display layer 103. The display layer 103 includes: a light-emitting layer, a driving circuit layer, and an organic polymer material substrate. The display substrate 100 with this structure is suitable for planar sizes of 55 inches or less.

[0075] In some examples, such as Figure 11 As shown, the display layer 103 of the display substrate 100 can also be a flexible display layer, and the encapsulation layer 102 of the display substrate 100 can also be a flexible encapsulation layer. Specifically, along the direction away from the support layer 101 of the display substrate 100, the encapsulation layer 102 includes a metal layer, pressure-sensitive adhesive, and frizz adhesive. The pressure-sensitive adhesive and frizz adhesive are used to bond the metal layer to the display layer 103. The metal layer can be a metal material such as aluminum foil or copper foil. The display layer 103 includes: a light-emitting layer, a driving circuit layer, and an organic polymer material substrate. The display substrate 100 with this structure is suitable for various form factors of 20 inches or smaller, or TFE (thin-film encapsulation).

[0076] In some examples, such as Figure 8 and Figure 12 As shown, in addition to the support layer 101, encapsulation layer 102, and display layer 103, the display panel also includes a protective film 104 disposed on the side of the display layer 103 facing away from the support layer 101. The protective film 104 provides protection for the display layer. The protective film 104 may include: a cover layer 1041, a filter film layer 1042, and an explosion-proof film layer 1043 stacked together. The cover layer 1041 is disposed on the side of the display layer 103 facing away from the support layer 101.

[0077] In some examples, such as Figure 8 As shown, the display panel may further include a flexible circuit board 300, through which the display substrate 100 and the driving circuit board 200 are electrically connected. Specifically, the flexible circuit board 300 is disposed on the same layer as the encapsulation layer 102 of the display substrate 100, and is spaced a certain distance from the encapsulation layer 102. The flexible circuit board 300 includes a first side 301 and a second side 302 disposed along its thickness direction, and has a second connecting pad 303 on the first side 301 and a third connecting pad 304 on the second side 302. The flexible circuit board 300 is electrically connected to the display layer 103 of the display substrate 100 through the second connecting pad 303, and electrically connected to the first connecting pad 304 through the third connecting pad 304. The first side 301 faces the display substrate, and the second side 302 faces the driving circuit board 200.

[0078] In some examples, such as Figure 8 As shown, the display panel may further include a second protective layer 400. The second protective layer 400 is disposed on a first side 301 of the flexible circuit board 300, and its orthographic projection on the first side 301 at least covers the orthographic projection of the first opening 21 of the green solder mask layer 20 of the drive circuit board 200 on the first side 301. The second protective layer 400 may include a waterproof adhesive to enhance the weather resistance of the display panel.

[0079] In some examples, such as Figure 8 As shown, the display panel may further include a third protective layer 500 and a fourth protective layer 600 stacked on the side of the flexible circuit board 300 facing away from the display layer 103 of the display substrate 100. The third protective layer 500 covers the accommodating space defined by the encapsulation layer 102 of the flexible circuit board 300 and the display substrate 100; the fourth protective layer 600 covers the third protective layer 500. Specifically, the third protective layer may be a UV-curable adhesive, and the fourth protective layer may be a waterproof adhesive.

[0080] In some examples, such as Figure 8 As shown, the third protective layer 500 also covers the side of the display layer 103 and the side of the connection between the display layer 103 and the flexible circuit board 300 along the thickness direction of the display layer 103 of the display substrate 100, and the fourth protective layer 600 covers the third protective layer 500.

[0081] This disclosure improves the yield rate of the display panel and its self-protection capabilities, avoiding the risk of electrostatic discharge (ESD) during transportation, post-processing, and assembly. It also enhances the safety level of the display panel, increasing product reliability and safety. For example, it improves the high-temperature resistance, high-pressure resistance, and corrosion resistance of the electrical connections between the flexible circuit board 300 and the display substrate 100, as well as the electrical connections between the flexible circuit board 300 and the drive circuit board 200. This improves the stability and lifespan of the display panel, reduces its failure rate, and enhances its flame retardancy, effectively reducing the risk of fire during use.

[0082] In some embodiments, for such Figure 8 The manufacturing method of the display panel shown is explained below. The specific manufacturing method of this display panel is as follows:

[0083] S1. Forming a display substrate 100, a flexible circuit board 300, and a driving circuit board 200.

[0084] Specifically, the display substrate 100 includes a support layer 101, an encapsulation layer 102, and a display layer 103 stacked together. The encapsulation layer 102 and the display layer 103 of the display substrate 100 are sintered with Frit sealant (glass adhesive). The flexible circuit board 300 includes a first side 301 and a second side 302 disposed along its thickness direction. The first side 301 has a second connecting pad 303, and the second side 302 has a third connecting pad 304. The first side 301 faces the display substrate, and the second side 302 faces the driving circuit board 200. The driving circuit board 200 has a wiring area 1 and a first bonding area 2. The driving circuit board 200 includes a first substrate layer 10, a solder mask layer 20 disposed on the first substrate layer 10, and a first connecting pad 30. The solder mask layer 20 has a first opening 21 extending through its thickness direction. The first opening 21 is located in the first bonding area 2, and the first connecting pad 30 is located within the first opening 21. The first opening 21 has a first sidewall 210 and a second sidewall 220 disposed opposite to each other along the second direction Y; the green oil layer 20 has a first groove 22; the first groove 22 is located in the wiring area 1 and is disposed on the side of the first sidewall 210 away from the second sidewall 220. The length of the first groove 22 along the first direction X is not less than the length of the first opening 21 along the first direction X.

[0085] S2. The display substrate 100 and the driving circuit board 200 are connected by the flexible circuit board 300 respectively.

[0086] Specifically, the flexible circuit board 300 and the encapsulation layer 102 of the display substrate 100 are disposed on the same layer. The second connection pad 303 of the flexible circuit board 300 is bonded to the connection pad of the display layer 103 of the display substrate 100 through anisotropic conductive adhesive, thereby realizing the electrical connection between the flexible circuit board 300 and the display layer 103 of the display substrate 100.

[0087] The gap between the flexible circuit board 300 and the encapsulation layer 102 of the display substrate 100 is filled and covered with ultraviolet-curable adhesive (UV adhesive). A waterproof adhesive is then applied to the outside of the UV adhesive for protection, thereby enhancing the waterproof performance of the electrical connection between the flexible circuit board 300 and the display substrate 100, and improving the reliability and weather resistance of the display panel.

[0088] The third connection pad 304 of the flexible circuit board 300 is bonded to the first connection pad 30 of the driving circuit board 200 via anisotropic conductive adhesive, thereby achieving an electrical connection between the flexible circuit board 300 and the driving circuit board 200. The gap exposed to the outside by the first opening is filled and covered with UV-curable adhesive to enhance the waterproof performance of the electrical connection between the flexible circuit board 300 and the driving circuit board 200, improving the reliability and weather resistance of the display panel.

[0089] In some embodiments, the display panel of this disclosure can be applied to vehicle lights, but is not limited thereto. It can also be applied to other display devices, such as mobile phones, tablets, televisions, monitors, laptops, digital photo frames, navigators, and any other products or components with display functions. The embodiments of this invention are not limited thereto.

[0090] The above are exemplary embodiments disclosed in this invention. However, it should be noted that various changes and modifications can be made without departing from the scope of the embodiments of this invention as defined by the claims. The functions, steps, and / or actions of the methods according to the disclosed embodiments described herein do not need to be performed in any particular order. The sequence numbers of the disclosed embodiments of this invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. Furthermore, although the elements disclosed in the embodiments of this invention may be described or claimed individually, they may be understood as multiple unless explicitly limited to a singular number.

[0091] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention (including the claims) is limited to these examples. Within the framework of the invention, technical features of the above embodiments or different embodiments can be combined, and many other variations of different aspects of the invention exist, which are not provided in the details for the sake of brevity. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the protection scope of the invention.

Claims

1. A drive circuit board having a wiring area and a first bonding area located on one side of the wiring area, characterized in that, The drive circuit board includes: First substrate layer; A green oil layer is disposed on one side of the first substrate layer; The green oil layer has a first opening extending through its thickness; the first opening is located in the first bonding area; A first bonding pad is disposed on the first substrate layer and located within the first opening; wherein, The first opening has a first sidewall and a second sidewall disposed opposite to each other along a second direction; the second direction is the length direction of the first connecting pad; a plurality of the first connecting pads are arranged along a first direction, and a first gap is defined between every two adjacent first connecting pads, the first direction and the second direction intersect; The green oil layer has a first groove; the first groove is located in the wiring area and is disposed on the side of the first sidewall away from the second sidewall; the length of the first groove along the first direction is greater than the length along the second direction; any of the first gaps corresponds to at least a portion of the first groove.

2. The drive circuit board according to claim 1, characterized in that, The length of the first groove along the first direction is not less than the length of the first opening along the first direction; the first direction is the length direction of the first substrate layer.

3. The drive circuit board according to claim 2, characterized in that, The length of the first groove along the first direction is equal to the length of the first substrate layer, and the first groove includes a second opening and a third opening disposed opposite to each other along the first direction, and the first groove communicates with the outside through the second opening and the third opening.

4. The drive circuit board according to claim 1, characterized in that, The first groove includes: a plurality of sub-grooves spaced apart; wherein, The sub-grooves are provided in a one-to-one correspondence with the first gap, and the length of the sub-grooves along the first direction is not less than the length of the first gap along the first direction.

5. The drive circuit board according to claim 1, characterized in that, Also includes: The first protective layer is located in the wiring area and covers the portion of the green oil layer located in the wiring area.

6. The drive circuit board according to claim 5, characterized in that, The first protective layer includes conformal coating.

7. A display panel, characterized in that, include: The display substrate and the driving circuit board as described in any one of claims 1-6; The display substrate and the driving circuit board are electrically connected.

8. The display panel according to claim 7, characterized in that, Also includes: A flexible circuit board, wherein the display substrate and the driving circuit board are electrically connected through the flexible circuit board.

9. The display panel according to claim 8, characterized in that, The flexible circuit board includes a first side and a second side disposed along its thickness direction, and has a second connecting pad on the first side and a third connecting pad on the second side; wherein the first side faces the display substrate and the second side faces the driving circuit board. The flexible circuit board is electrically connected to the display substrate through the second connecting pad and electrically connected to the first connecting pad through the third connecting pad.

10. The display panel according to claim 9, characterized in that, Also includes: A second protective layer is disposed on the first side, and its orthographic projection on the first side at least covers the orthographic projection of the first opening on the first side.

11. The display panel according to claim 10, characterized in that, The second protective layer includes: waterproof adhesive.

12. The display panel according to claim 9, characterized in that, The display substrate includes a support layer, an encapsulation layer, and a display layer stacked together; the flexible circuit board is disposed on the same layer as the encapsulation layer and is a certain distance away from the encapsulation layer; the flexible circuit board is electrically connected to the display layer through the second connecting pad.

13. The display panel according to claim 12, characterized in that, Also includes: A third protective layer and a fourth protective layer are stacked on the side of the flexible circuit board opposite to the display layer; The third protective layer at least covers the accommodating space defined by the flexible circuit board and the encapsulation layer; the fourth protective layer covers the third protective layer.

14. The display panel according to claim 13, characterized in that, The third protective layer includes a UV-curable adhesive; the fourth protective layer includes a waterproof adhesive.

15. A method for manufacturing a drive circuit board, the drive circuit board having a wiring area and a first bonding area located on one side of the wiring area, characterized in that, The method includes: Forming the first substrate layer; A green oil layer is formed on one side of the first substrate layer; the green oil layer has a first opening extending through its thickness direction; the first opening is located in the first bonding area; A first connection pad is formed on the first substrate layer, and the first connection pad is located within the first opening; wherein... The first opening has a first sidewall and a second sidewall disposed opposite to each other along a second direction; the second direction is the length direction of the first connecting pad; a plurality of the first connecting pads are arranged along a first direction, and a first gap is defined between every two adjacent first connecting pads, the first direction and the second direction intersect; The green oil layer has a first groove; the first groove is located in the wiring area and is disposed on the side of the first sidewall away from the second sidewall; the length of the first groove along the first direction is greater than the length along the second direction; any of the first gaps corresponds to at least a portion of the first groove.

16. A vehicle light, characterized in that, include: The display panel as described in any one of claims 7-14.

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