A new energy-saving and environment-friendly power supply with strong heat dissipation

Abstract

The application relates to the technical field of power supplies, in particular to a novel energy-saving and environment-friendly power supply with high heat dissipation. The novel energy-saving and environment-friendly power supply with high heat dissipation solves the technical problem of poor stability of the power supply caused by the unreasonable heat dissipation structure of the power supply in the prior art. The novel energy-saving and environment-friendly power supply with high heat dissipation comprises a power supply main body, an outer shell is arranged outside the power supply main body, a sealed liquid cooling channel is arranged in the outer shell, the liquid cooling channel is arranged around the outer shell, a partition plate is arranged in the liquid cooling channel, heat dissipation fins are arranged in the liquid cooling channel, air cooling channels which are not communicated with the liquid cooling channel are arranged in the heat dissipation fins, and a fan and a cooling pump can work simultaneously to jointly cool the outer shell through air cooling and liquid cooling, so that the heat dissipation efficiency of the outer shell is improved, and the power supply has higher stability.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power supply, in particular to a novel energy-saving and environment-friendly power supply with strong heat dissipation. BACKGROUND

[0002] With the development of power supply technology, the power density of power supply modules has been greatly improved. The traditional heat dissipation adopts a structure of parallel and spaced heat dissipation fins. This structure is relatively simple. In order to ensure the heat dissipation area, a considerable volume needs to be ensured. However, the internal temperature of the power supply module is still relatively high, which reduces the reliability of the whole machine.

[0003] In order to improve the heat dissipation performance of the power supply, the existing technology usually adopts the way of adding a fan to improve the heat dissipation efficiency of the power supply. The fan blows cold air to the heat dissipation fins, and then increases the heat exchange efficiency between the air and the heat dissipation fins, so as to improve the heat dissipation performance. However, the passive heat dissipation structure with the added fan still cannot meet the heat dissipation demand of the power supply with large power, which reduces the reliability of the power supply. SUMMARY

[0004] The present application provides a novel energy-saving and environment-friendly power supply with strong heat dissipation, which solves the technical problem of poor stability of the power supply caused by the unreasonable power supply heat dissipation structure in the prior art.

[0005] Some embodiments for solving the above technical problems include:

[0006] A novel energy-saving and environment-friendly power supply with strong heat dissipation, comprising a power supply body, wherein an outer shell is arranged outside the power supply body;

[0007] The outer shell is provided with a cooling tank, the cooling tank is filled with cooling liquid, a sealed liquid cooling channel is arranged in the outer shell, the liquid cooling channel is arranged around the outer shell, a partition plate is arranged in the liquid cooling channel, the cooling liquid enters the liquid cooling channel from the first side of the partition plate, and the cooling liquid in the liquid cooling channel flows back to the cooling tank from the other side of the partition plate, and a cooling pump for supplying cooling liquid into the liquid cooling channel is arranged in the cooling tank;

[0008] A heat dissipation fin is arranged in the liquid cooling channel, the heat dissipation fin is provided with an air cooling channel which is not communicated with the liquid cooling channel, the air cooling channel penetrates through both ends of the outer shell, a fan for supplying air into the air cooling channel is arranged at one end of the outer shell, and the heat dissipation fin is arranged along the length direction of the outer shell.

[0009] Preferably, the outer shell comprises an inner layer and an outer layer, the liquid cooling channel is formed between the inner layer and the outer layer, the outer shell further comprises end covers for sealing the liquid cooling channel, and the end covers are two, and the two end covers are respectively welded to both ends of the outer shell.

[0010] As preferred, the end cover is provided with air holes communicating with the air cooling channel, the fan is fixed to the shell through the end cover at one end of the shell, and the fan cover is provided with a dust cover.

[0011] As preferred, the air cooling channel has a long strip shape in cross section, and the cooling liquid accumulated in the liquid cooling channel exchanges heat with the gas in the air cooling channel through the heat dissipation fins.

[0012] As preferred, the cooling box is further provided with a refrigeration fin for reducing the temperature of the cooling liquid in the cooling box.

[0013] As preferred, the shell is further provided with a controller, the power supply body is provided with a temperature sensor, the temperature sensor communicates with the controller, and the fan, the refrigeration fin and the cooling pump are controlled to work by the controller.

[0014] As preferred, the cooling box is provided with a partition plate, the partition plate divides the cooling box into a storage cavity and an assembly cavity, the cooling liquid is stored in the storage cavity, the cooling pump is arranged in the assembly cavity, the assembly cavity and the storage cavity are independent of each other, the cooling pump extracts the cooling liquid in the storage cavity through a liquid extraction pipeline, and the cooling pump supplies the cooling liquid into the liquid cooling channel through a liquid supply pipeline.

[0015] As preferred, the cooling box comprises a box body and a box cover, the box body is in an integrated structure with the shell, the box cover is fixed to the box body by screws, and a sealing gasket is arranged between the box body and the box cover and bonded to the box cover.

[0016] As preferred, the outer layer and the inner layer are both provided with heat dissipation fins, the heat dissipation fins on the outer layer are in an integrated structure with the outer layer, and the heat dissipation fins on the inner layer are in an integrated structure with the inner layer.

[0017] As preferred, the heat dissipation fins on the outer layer are not in contact with the inner layer, and the heat dissipation fins on the inner layer are not in contact with the outer layer.

[0018] Compared with the prior art, the present application has the following advantages:

[0019] 1. By arranging the liquid cooling channel in the shell, the cooling box is arranged in the shell, the cooling liquid in the cooling box enters the liquid cooling channel, that is, the cooling liquid in the liquid cooling channel is communicated with the cooling liquid in the cooling box, the cooling liquid in the liquid cooling channel exchanges heat with the shell, and then the cooling liquid in the liquid cooling channel exchanges heat with the cooling liquid in the cooling box due to the communication between the cooling liquid in the liquid cooling channel and the cooling liquid in the cooling box, so that the cooling efficiency of the shell is improved.

[0020] 2. By installing a cooling pump, when the natural heat exchange between the coolant in the liquid cooling channel and the coolant in the cooling tank cannot meet the heat dissipation requirements, the cooling pump can be used to circulate the coolant in the cooling tank and the liquid cooling channel for cooling, thereby making the coolant and the heat dissipation fins have higher heat dissipation efficiency.

[0021] 3. By installing a fan, the fan blows air into the air-cooling channel. The air in the air-cooling channel exchanges heat with the heat dissipation fins and is then discharged, thereby improving the heat dissipation efficiency of the casing.

[0022] The fan and cooling pump can work simultaneously to allow both air cooling and liquid cooling to work together to cool the casing, thereby improving the heat dissipation efficiency of the casing and making the power supply more stable. Attached Figure Description

[0023] For illustrative purposes, several embodiments of the invention are illustrated in the following figures. These figures are incorporated herein by reference and form part of the detailed description. In some instances, well-known structures and components are shown in block diagram form to avoid obscuring the concept of the subject matter of the invention.

[0024] Figure 1 This is a schematic diagram of the internal structure of the present invention.

[0025] Figure 2 This is an isometric view of the first angle of the present invention.

[0026] Figure 3 This is an isometric view of the second angle of the present invention.

[0027] Figure 4 This is an exploded view of the outer casing from a first angle. For clarity, the cooling element is not shown.

[0028] Figure 5 This is an exploded view of the outer shell from the second angle.

[0029] Figure 6 This is an isometric view of the inner layer.

[0030] Figure 7 This is an isometric view of the end cap.

[0031] In the picture:

[0032] 1. Power supply unit.

[0033] 2. Outer shell, 21. Liquid cooling channel, 22. Partition, 23. Heat dissipation fins, 231. Air cooling channel, 24. Inner layer, 25. Outer layer, 26. End cap, 261. Air vent.

[0034] 3. Cooling box; 31. Cooling pump; 32. Isolation plate; 33. Storage cavity; 34. Assembly cavity; 35. Box body; 36. Box cover.

[0035] 4. A dust cover.

[0036] 5. A cooling fin. DETAILED DESCRIPTION

[0037] The detailed embodiments shown below are intended to be a description of various configurations of the subject technology and are not intended to represent the only configurations in which the subject technology can be practiced. The detailed embodiments include specific details for the purpose of providing a thorough understanding of the subject technology. However, it will be apparent to those skilled in the art that the subject technology can be practiced without

[0038] Reference Figures 1 to 7 As shown in the figure, a new energy-saving and environment-friendly power supply with strong heat dissipation, comprising a power supply body 1, the power supply body 1 is provided with an outer shell 2;

[0039] The outer shell 2 is provided with a cooling box 3, the cooling box 3 is filled with cooling liquid, the outer shell 2 is provided with a sealed liquid cooling channel 21, the liquid cooling channel 21 is arranged around the outer shell 2, the liquid cooling channel 21 is provided with a partition plate 22, the cooling liquid enters the liquid cooling channel 21 from the first side of the partition plate 22, the cooling liquid in the liquid cooling channel 21 flows back to the cooling box 3 from the other side of the partition plate 22, the cooling box 3 is provided with a cooling pump 31 for supplying cooling liquid to the liquid cooling channel 21;

[0040] The liquid cooling channel 21 is provided with a heat dissipation fin 23, the heat dissipation fin 23 is provided with an air cooling channel 231 which is not communicated with the liquid cooling channel 21, the air cooling channel 231 penetrates through both ends of the outer shell 2, a fan is arranged at one end of the outer shell 2 to supply air to the air cooling channel 231, and the heat dissipation fin 23 is arranged along the length direction of the outer shell 2.

[0041] Compared with the air cooling method in the prior art, by arranging the liquid cooling channel 21 and the heat dissipation fin 23, the cooling liquid has a larger contact area with the heat dissipation channel and the outer shell 2, and the heat dissipation fin 23 is immersed in the cooling liquid, so that the cooling liquid has a larger heat exchange area with the heat dissipation fin 23, thereby improving the heat dissipation efficiency of the outer shell 2.

[0042] The air flow and the heat dissipation fin 23 are not uniform in contact due to the shape and machining precision of the heat dissipation fin 23 in the prior art, therefore, the air cooling method cannot effectively meet the heat dissipation demand of the power supply.

[0043] The power supply is cooled by air cooling and liquid cooling, the power supply has high cooling efficiency, and the power supply is uniformly cooled and is not prone to local overheating, thereby improving the stability of the power supply during operation.

[0044] In some embodiments, the shell 2 comprises an inner layer 24 and an outer layer 25, the liquid cooling channel 21 is formed between the inner layer 24 and the outer layer 25, the shell 2 further comprises end covers 26 sealing the liquid cooling channel 21, and the two end covers 26 are respectively welded to two ends of the shell 2.

[0045] The end cover 26 is fixed to the shell 2 by welding, which can effectively ensure the sealing of the liquid cooling channel 21, and the cooling liquid in the liquid cooling channel 21 is not prone to leakage.

[0046] The end cover can also be bonded to the shell 2.

[0047] In some embodiments, the end cover 26 is provided with air holes 261 communicating with the air cooling channel 231, the fan is fixed to the shell 2 through the end cover 26 located at one end of the shell 2, and the fan cover is provided with a dust cover 4.

[0048] The cross-sectional shape of the air cooling channel 231 is long strip-shaped, and the cooling liquid accumulated in the liquid cooling channel 21 exchanges heat with the gas in the air cooling channel 231 through the heat dissipation fins 23.

[0049] The air holes 261 have a larger cross-sectional area, so that the heat dissipation fins 23 and the airflow in the air cooling channel 231 have a larger heat exchange area, thereby improving the air cooling efficiency.

[0050] The cooling liquid in the liquid cooling channel 21 can make the temperature of the liquid cooling channel 21 uniform, so that the power supply is not prone to local overheating. At the same time, the heat dissipation fins 23 are immersed in the cooling liquid, and the temperature of each part of the heat dissipation fins 23 is uniform, so that the heat dissipation fins 23 can better dissipate heat and prevent the power supply from being too high in temperature.

[0051] In some embodiments, the cooling box 3 is further provided with a refrigeration sheet 5 for reducing the temperature of the cooling liquid in the cooling box 3.

[0052] The shell 2 is further provided with a controller, the power supply body 1 is provided with a temperature sensor, the temperature sensor communicates with the controller, and the fan, the refrigeration sheet and the cooling pump 31 are all controlled by the controller.

[0053] The refrigeration sheet 5 can be a semiconductor refrigeration sheet 5 in the prior art, by setting the controller and the refrigeration sheet 5, the application comprises the following cooling modes:

[0054] Mode one: cooling pump 31, fan and refrigeration piece 5 are not working, at this time, the air flow is naturally entered into the air cooling channel 231 and exchanges heat with the heat dissipation fin 23, at the same time, the cooling liquid in the liquid cooling channel 21 exchanges heat with the cooling liquid in the cooling box 3, so as to realize natural heat dissipation.

[0055] Mode two: refrigeration piece 5 works, cooling pump 31 and fan do not work, at this time, the air flow is naturally entered into the air channel and exchanges heat with the heat dissipation fin 23, at the same time, the temperature of the cooling liquid in the cooling box 3 is reduced, so that the cooling liquid in the cooling box 3 exchanges heat with the cooling liquid in the liquid cooling channel 21, so as to dissipate heat for the power supply.

[0056] Mode three: fan works, refrigeration piece 5 and cooling pump 31 do not work, the fan performs air cooling through the air cooling channel 231, at the same time, the cooling liquid in the liquid cooling channel 21 exchanges heat with the cooling liquid in the cooling liquid.

[0057] Mode four: fan and refrigeration piece 5 work at the same time, cooling pump 31 does not work, the fan performs air cooling at the same time, the cooling liquid in the cooling box 3 has a lower temperature, the heat exchange efficiency between the cooling liquid in the cooling box 3 and the cooling liquid in the liquid cooling channel 21 is improved, and the heat dissipation efficiency is improved.

[0058] Mode five: fan, refrigeration piece 5 and cooling pump 31 work at the same time, air cooling and liquid cooling are used to dissipate heat at the same time.

[0059] Mode six: fan and cooling pump 31 work, refrigeration piece 5 does not work.

[0060] Mode seven: refrigeration piece 5 and cooling pump 31 work, fan does not work.

[0061] More heat dissipation modes can be obtained in practice, different heat dissipation modes have different heat dissipation efficiencies, and the controller forms different modes according to the temperature parameters detected by the temperature sensor.

[0062] The switching between different modes is only to control the working or stopping of the fan, cooling pump 31 and refrigeration piece 5, and the controller for realizing the function is a common control unit in the prior art. The higher the heat dissipation efficiency requirement is, the more devices participate in heat dissipation. The devices participating in heat dissipation refer to one or more of the cooling pump 31, the fan and the refrigeration piece 5.

[0063] Reference Figures 1 to 5As shown, in some embodiments, the cooling box 3 is provided with a partition plate 32, which separates the cooling box 3 into a storage cavity 33 and an assembly cavity 34, the cooling liquid is stored in the storage cavity 33, and the cooling pump 31 is arranged in the assembly cavity 34, the assembly cavity 34 is independent of the storage cavity 33, the cooling pump 31 extracts the cooling liquid in the storage cavity 33 through a liquid extraction pipeline, and the cooling pump 31 supplies the cooling liquid into the liquid cooling channel 21 through a liquid supply pipeline.

[0064] The cooling box 3 comprises a box body 35 and a box cover 36, the box body 35 is in an integrated structure with the shell 2, the box cover 36 is fixed on the box body 35 through screws, and a sealing gasket is arranged between the box body 35 and the box cover 36 and bonded to the box cover 36.

[0065] The partition plate 32 and the shell 2 can also be in an integrated structure. The box body 35 and the shell 2 are in an integrated structure, and heat exchange can also be performed between the box body 35 and the shell 2 to further improve the heat dissipation efficiency of the power supply.

[0066] In some embodiments, the outer layer 25 and the inner layer 24 are both provided with heat dissipation fins 23, the heat dissipation fins 23 located on the outer layer 25 are in an integrated structure with the outer layer 25, and the heat dissipation fins 23 located on the inner layer 24 are in an integrated structure with the inner layer 24.

[0067] The heat dissipation fins 23 located on the outer layer 25 are not in contact with the inner layer 24, and the heat dissipation fins 23 located on the inner layer 24 are not in contact with the outer layer 25.

[0068] The heat dissipation fins 23 can also be in contact with the outer layer 25 and the inner layer 24 respectively, at this time, through holes not communicated with the air cooling channel 231 need to be arranged on the heat dissipation fins, so that the cooling liquid can flow in the liquid cooling channel 21.

[0069] The above introduces the subject technical solution of the present application and corresponding details, and it can be understood that the above introduction is only some embodiments of the subject technical solution of the present application, and some details can be omitted in specific implementation.

[0070] In addition, in some embodiments of the above application, multiple embodiments can be combined for implementation, and various combination solutions are not listed one by one due to the length. Those skilled in the art can freely combine the above embodiments according to the needs in specific implementation to obtain better application experience.

[0071] Other details and configurations can be obtained by those skilled in the art in implementing the subject technical solutions of the present application, and the drawings, and it is obvious that these details still belong to the scope covered by the subject technical solutions of the present application without departing from the subject technical solutions of the present application.

Claims

1. A novel energy-saving and environmentally friendly power supply with strong heat dissipation, characterized in that: Including power main body (1), the outer surface of power main body (1) is provided with shell (2); The shell (2) is provided with a cooling tank (3), the cooling tank (3) is filled with cooling liquid, the shell (2) is provided with a sealed liquid cooling channel (21), the liquid cooling channel (21) is arranged around the shell (2), the liquid cooling channel (21) is provided with a partition (22), the cooling liquid is entered into the liquid cooling channel (21) by the first side of the partition (22), the cooling liquid in the liquid cooling channel (21) is returned to the cooling tank (3) by the other side of the partition (22), the cooling tank (3) is provided with a cooling pump (31) for supplying cooling liquid into the liquid cooling channel (21); The liquid cooling channel (21) is provided with a heat dissipation fin (23), the heat dissipation fin (23) is provided with an air cooling channel (231) not communicated with the liquid cooling channel (21), the air cooling channel (231) penetrates through both ends of the shell (2), a fan is arranged at one end of the shell (2) to supply air into the air cooling channel (231), and the heat dissipation fin (23) is arranged along the length direction of the shell (2).

2. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 1, characterized in that: The shell (2) comprises an inner layer (24) and an outer layer (25), the liquid cooling channel (21) is formed between the inner layer (24) and the outer layer (25), and the shell (2) further comprises end covers (26) sealing the liquid cooling channel (21), the end covers (26) are two, and the two end covers (26) are respectively welded to both ends of the shell (2).

3. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 2, characterized in that: The end cover (26) is provided with an air hole (261) communicated with the air cooling channel (231), the fan is fixed to the shell (2) through the end cover (26) at one end of the shell (2), and a dust cover (4) is arranged on the fan cover.

4. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 3, characterized in that: The air cooling channel (231) is in the shape of a long strip in cross section, and the cooling liquid accumulated in the liquid cooling channel (21) exchanges heat with the gas in the air cooling channel (231) through the heat dissipation fin (23).

5. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 4, characterized in that: The cooling tank (3) is further provided with a refrigeration sheet (5) for reducing the temperature of the cooling liquid in the cooling tank (3).

6. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 5, characterized in that: The shell (2) is further provided with a controller, the power main body (1) is provided with a temperature sensor, the temperature sensor is in communication with the controller, and the fan, the refrigeration sheet and the cooling pump (31) are controlled to work by the controller.

7. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 1, characterized in that: The cooling tank (3) is provided with a partition plate (32), the partition plate (32) divides the cooling tank (3) into a storage cavity (33) and an assembly cavity (34), the cooling liquid is stored in the storage cavity (33), and the cooling pump (31) is arranged in the assembly cavity (34); the assembly cavity (34) and the storage cavity (33) are independent of each other, the cooling pump (31) extracts the cooling liquid in the storage cavity (33) through a liquid extraction pipeline, and the cooling pump (31) supplies the cooling liquid into the liquid cooling channel (21) through a liquid supply pipeline.

8. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 7, characterized in that: The cooling box (3) comprises a box body (35) and a box cover (36), the box body (35) is in an integral structure with the shell (2), the box cover (36) is fixed on the box body (35) through screws, and a sealing gasket is arranged between the box body (35) and the box cover (36) and is bonded to the box cover (36).

9. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 2, characterized in that: The outer layer (25) and the inner layer (24) are both provided with heat dissipation fins (23), the heat dissipation fin (23) located on the outer layer (25) is in an integral structure with the outer layer (25), and the heat dissipation fin (23) located on the inner layer (24) is in an integral structure with the inner layer (24).

10. The novel energy-saving and environment-friendly power supply with strong heat dissipation according to claim 9, characterized in that: The heat dissipation fin (23) located on the outer layer (25) is not in contact with the inner layer (24), and the heat dissipation fin (23) located on the inner layer (24) is not in contact with the outer layer (25).

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